LG 29LN460R, 29LN460U, 29LN4607 Service manual

Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LD33*
MODEL : 29LN46** 29LN46**-Z*
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL67782202 (1305-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING GUIDE ............................................................... 15
BLOCK DIAGRAM .................................................................................. 18
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol­der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when­ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
- This specification is applied to the LED TV used LD33P chassis.
- NetCast4.0 MTK, Model List(apply this Product Specification)
T/C/S2 T2/C/S2
Pan EU CIS(except UR/AK) Pan EU CIS(except UR/AK)
26LN460R/7-ZJ 29LN460R/7-ZJ
26LN460R/7-ZJ 29LN460R/7-ZJ
26LN460U-ZJ 29LN460U-ZJ
26LN460U-ZJ 29LN460U-ZJ
3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
DTV & Analog (Total 37 countries) DTV (MPEG2/4, DVB-T) : 30 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire­land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus
1 Market EU(PAL Market-36Countries)
DTV (MPEG2/4, DVB-T2) : 7 countries
UK, Sweden, Denmark, Finland, Norway, Ukraine, Kaza­khstan, Ireland
DTV (MPEG2/4, DVB-C) : 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire­land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus, UK, Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan
DTV (MPEG2/4,DVB-S) : 30 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire­land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus
Supported satellite : 22 satellites
HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102, ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EU­TELSAT-W3A, EUROBIRD 9°, EUTELSAT-W2A, HOTBIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA 3°/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT­W7, HELLASSAT 2, EXPRESS AM1, TURKSAT 2°/3°, INTERSAT10
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No. Item Specication Remarks
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
2 Broadcasting system
3 Receiving system
4) SECAM L/L’, DK, BG, I
5) DVB-T
6) DVB-C
7) DVB-T2
8) DVB-S DVB-S: Satellite
► DVB-T
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
Analog : Upper Heterodyne Digital : COFDM, QAM
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
4 Scart (1EA) PAL, SECAM
5 Video Input (1EA) PAL, SECAM, NTSC4.43
6 Head phone out
7 Component Input (1EA)
8 HDMI Input (2EA)
9 Audio Input (3EA)
10 USB (3EA)
11 Ethernet Connect(1EA) Ethernet Connect
Antenna, AV1, AV2, Component, HDMI1, HDMI2, USB1, USB2, USB3
Y/Cb/Cr Y/Pb/Pr
HDMI1-DTV HDMI2-DTV
PC Audio Component/AV2 AV1
EMF, DivX HD, For SVC (download), HDD, HUB
► DVB-S/S2
- symbolrate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
Scart jack is Full scart and support ATV/DTV-OUT (not support DTV Auto AV)
4 System : PAL, SECAM, NTSC, PAL60 Phone jack type
Phone jack type
Support HDMI-PC mode (HDMI1/2) - INPUT LABEL : PC HDMI1 : MHL / HDMI2 : ARC
JPEG, MP3, DivX HD
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Component Video Input (Y, Cb/Pb, Cr/Pr)
No. Resolution H-freq(kHz) V-freq(Hz) Porposed
1 720×480 15.73 60.00 SDTV, DVD 480i
2 720×480 15.63 59.94 SDTV, DVD 480i
3 720×480 31.47 59.94 480p
4 720×480 31.50 60.00 480p
5 720×576 15.625 50.00 SDTV, DVD 625 Line
6 720×576 31.25 50.00 HDTV 576p
7 1280×720 45.00 50.00 HDTV 720p
8 1280×720 44.96 59.94 HDTV 720p
9 1280×720 45.00 60.00 HDTV 720p
10 1920×1080 31.25 50.00 HDTV 1080i
11 1920×1080 33.75 60.00 HDTV 1080i
12 1920×1080 33.72 59.94 HDTV 1080i
13 1920×1080 56.250 50 HDTV 1080p
14 1920×1080 67.5 60 HDTV 1080p
6. HDMI Input
6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(kHz) Proposed
1. 640*480 31.469 / 31.5 59.94/60 SDTV 480P
2. 720*480 31.469 / 31.5 59.94 / 60 SDTV 480P
3. 720*576 31.25 50 SDTV 576P
4. 720*576 15.625 50 SDTV 576I
5. 1280*720 37.500 50 HDTV 720P
6. 1280*720 44.96 / 45 59.94 / 60 HDTV 720P
7. 1920*1080 33.72 / 33.75 59.94 / 60 HDTV 1080I
8. 1920*1080 28.125 50.00 HDTV 1080I
9. 1920*1080 26.97 / 27 23.97 / 24 HDTV 1080P
10. 1920*1080 25 HDTV 1080P
11. 1920*1080 33.716 / 33.75 29.976 / 30.00 HDTV 1080P
12. 1920*1080 56.250 50 HDTV 1080P
13. 1920*1080 67.43 / 67.5 59.94 / 60 HDTV 1080P
6.2. PC mode
No. Resolution H-freq(kHz) V-freq.(Hz) Proposed
1 640 x 350 @70Hz 31.468 70.09 EGA
2 720 x 400 @70Hz 31.469 70.08 DOS
3 640 x 480 @60Hz 31.469 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.879 60.317 VESA(SVGA)
5 1024 x 768 @60Hz 48.363 60.004 VESA(XGA)
6 1152 x 864 @60Hz 54.348 60.053 VESA
7 1360 x 768 @60Hz 47.712 60.015 VESA(WXGA)
- 8 -
Only for training and service purposes
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with LD33* chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz. (5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.
3.2. LAN Inspection
3.2.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
3.2.2. LAN inspection solution
▪ LAN Port connection with PCB ▪ Setting automatic IP
▪ If you want manual connection, enter Network connection at
MENU Mode of TV. Press Start connection key, then Network will be connected.
3. Automatic Adjustment
3.1. MAC address D/L, CI+ key D/L, Widevine key D/L, ESN D/L
Connect: USB port Communication Prot connection ▪ Com 1,2,3,4 and 115200(Baudrate) Mode check: Online Only ▪ Check the test process: DETECT -> MAC -> CI -> Widevine
-> ESN -> HDCP14 -> HDCP20 ▪ Play: Press Enter key ▪ Result: Ready, Test, OK or NG ▪ Printer Out (MAC Address Label)
▪ Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC Address at ‘in start’ menu mode.
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Loading...
+ 19 hidden pages