LG 29LN450B, 29LN450U, 29LN457B, 29LN457U, 29LN4503 Service manual

...
Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LA31R / LD31S
MODEL : 29LN45** 29LN45**-Z*
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL67862501 (1304-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
TROUBLE SHOOTING .......................................................................... 15
BLOCK DIAGRAM ................................................................................. 19
EXPLODED VIEW .................................................................................. 20
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol­der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when­ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LA31R / LD31S chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
DTV & Analog (Total 37 countries) DTV (MPEG2/4, DVB-T) :37 countries
UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/Austria/Hungary /Swiss/Croatia/Turkey/Norway/Slovenia/Poland/Ukraine/Portu­gal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/Bulgaria/ Russia/SlovakiaBosnia/Serbia/Albania/Kazakhstan/Belarus
*4 Country, Nordic option(EU model only)
- Denmark , Finland, Norway, Sweden
1 Market EU/CIS(PAL Market-37 Countries)
DTV (MPEG2/4, DVB-T2): 8 countries
UK/Denmark/Sweden/Finland/Norway/Ireland/Ukraine/Kaza­khstan
DTV (MPEG2/4, DVB-C): 37 countries
UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/ Belgium/Luxemburg/ Greece/Denmark/Czech/Austria /Hun­gary/Swiss/Croatia/Turkey/Norway/Slovenia/Poland/Ukraine/ Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/ Bulgaria/Russia/Slovakia/Bosnia/Serbia/Albania/Kazakhstan/ Belarus
DTV (MPEG2/4,DVB-S): 29 countries
Italy/Germany/France/Spain/Netherlands/ Belgium/Luxemburg/ Greece/ Czech/Austria /Hungary/Swiss/Croatia/Turkey/Slov­enia/Poland/Portugal/ Morocco/Latvia/Estonia/Lithuania/Ruma­nia/Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/ Belarus
Supported satellite : 22 satellites
HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102, ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EUTEL­SAT-W3A, EUROBIRD 9A, EUTELSAT-W2A, HOTBIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA 3A/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT-W7, HELLASSAT 2, EXPRESS AM1, TURKSAT 2A/3A, INTERSAT10
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No. Item Specication Remarks
Analogue TV
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM-BG
5) SECAM-DK
2 Broadcasting system
3 Receiving system
4 Scart Jack (1EA) PAL, SECAM Scart 1 Jack is Full scart and support RF-OUT(analog). 5 Component Input (1EA) Y/Pb/Pr
6 CVBS Input (1EA) PAL, SECAM, NTSC
7 RGB Input RGB-PC Analog(D-SUB 15PIN)
8 HDMI Input (1EA) HDMI
9 Audio Input (3EA)
10 Headphone out (1EA) Antenna, AV, Component, RGB, HDMI Side 1EA 11 USB (1EA) Picture, Music, Movie, SVC Software Update + Picture + Music + Movie
12 DVB
13 Local Key (Touch) 14 LAN JACK Modular Only UK model
6) SECAM L/L’
Digital TV
1) DVB-T/C/T2
Satellite Digital TV
1) DVB-T/C/S/S2
Analog : Upper Heterodyne Digital : COFDM, QAM
RGB/DVI Audio Component & CVBS SCART
DVB-T
DVB-C
Analogue TV : (RF) VHF: E2 to E12, UHF : E21 to E69 (CATV) S1 to S20, HYPER: S21 to S47
Digital TV : VHF, UHF
Satellite TV : VHF, UHF, C-Band, Ku-Band
* DVB-T2 ( T2 model only support ) * DVB-S/S2 (Satellite model only support )
► DVB-T
- Guard Interval(Bitrate_Mbit/s)B : 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 ► DVB-T2
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 ► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM ► DVB-S/S2
- symbolrate DVB-S2 (8PSK / QPSK) : 2 ~ 45 Msymbol/s DVB-S (QPSK) : 2 ~ 45 Msymbol/s
- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
4 System(Rear) : PAL, SECAM, NTSC, PAL60 CVBS Video input is used by common port with Component.
Rear1EA / HDMI version 1.4/ support PC Support HDCP/HDMI : MHL Support
L/R Input CVBS Audio input is used by common port with Component.
CI : UK, Finland, Denmark, Norway, Sweden, Russia, Spain,
Ireland, Luxemburg, Belgium, Netherland
CI+ : France(Canal+), Italy(DGTVi) CI : Switzerland, Austria, Slovenia, Hungary, Bulgaria
CI+: Switzerland(UPC,Cablecom), Netherland(Ziggo),
Germany(KDG,CWB), Finland(labwise)
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Timing
5.1. RGB/HDMI (PC)
No.
1. 720*400 31.468 70.080 28.321
2. 640*480 31.469 59.940 25.175
3. 640*480 37.500 75.000 31.500
4. 800*600 37.879 60.317 40.000
5. 800*600 46.875 75.000 49.500
6. 1024*768 48.363 60.004 65.000
7. 1024*768 60.023 75.029 78.750
8. 1280*800 49.702 59.810 83.500
9. 1366*768 47.717 59.79 85.5
Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
5.2. HDMI (DTV)
Specication
Remark
No.
1. 720*480
2. 720*576 31.250 50.000 27.864 SDTV 576P
3. 1280*720 37.500 50.000 74.250 HDTV 720P
4. 1280*720
5. 1920*1080
6. 1920*1080 28.125 50.000 74.250 HDTV 1080I
7. 1920*1080 27.000 24.000 74.250 HDTV 1080P
8. 1920*1080 33.750 30.000 74.250 HDTV 1080P
9. 1920*1080 56.250 50.000 148.500 HDTV 1080P
10. 1920*1080
Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
31.469
31.5000
44.960
45.000
33.720
33.750
67.430
67.500
Specication
59.940
60.000
59.940
60.000
59.940
60.000
59.940
60.000
27.000
27.030
74.170
74.250
74.170
74.250
148.350
148.500
Remark
SDTV 480P
HDTV 720P
HDTV 1080I
HDTV 1080P
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3. Component
No.
1. 720*480 15.730 59.940 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.750 60.000 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.000 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.470 59.940 27.000 SDTV 480P
5. 720*480 31.500 60.000 27.027 SDTV 480P
6. 720*576 31.250 50.000 27.000 SDTV 576P 50Hz
7. 1280*720 44.960 59.940 74.176 HDTV 720P
8. 1280*720 45.000 60.000 74.250 HDTV 720P
9. 1280*720 37.500 50.000 74.250 HDTV 720P 50Hz
10. 1920*1080 33.720 59.940 74.176 HDTV 1080I
11. 1920*1080 33.750 60.000 74.250 HDTV 1080I
12. 1920*1080 28.125 50.000 74.250 HDTV 1080I 50Hz,
13. 1920*1080 56.250 50.000 148.500 HDTV 1080P
14. 1920*1080 67.432 59.940 148.350 HDTV 1080P
15. 1920*1080 67.500 60.000 148.500 HDTV 1080P
Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
Specication
Remark
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
(2)
(6)
1. Application Range
This document is applied to LA31R / LD31S chassis LED TV which is manufactu red in TV( or Mo nit or) Factory or is produced on the basis of this data.
2. Designation
(1) Th e ad justm ent is accord ing to the order whic h is
designated and which must be followed, according to the
plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C Relative humidity : 65 % ± 10 % Input voltage : 110-240 V, 50/60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control. (7) Push The "IN STOP KEY" – For memory initialization
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(4) Click “Read” tab, and then load download file(XXXX.bin)
by clicking “Read”.
(4)
filexxx.bin
(5) Click “Auto” tab and set as below (6) Click “Run”. (7) After downloading, check “OK” message.
(5)
(5)
(7) ……….OK
* USB DOWNLOAD(*.epk file download)
(1) Make New folder named “LG_DTV” and put ISP file(*.epk)
in the folder. (2) Put the USB Stick to the USB socket. (3) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it didn’t work.
- Bu t your downloaded version is High, USB data is
automatically detecting (4) Show the message "Copying files from memory" (5) Updating is starting.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig, and set.
(3) Click “Connect” tab. If display “Can’t”, Check connect
computer, jig, and set.
(1) (3)
Please Check the Speed :
Use the speed under
OK
Only for training and service purposes
200KHz.
- 10 -
(6) Updating C om pl et ed , T he Multi-vi si on will r es ta rt
automatically.
(7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
(1) Push "ADJ" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number.) (4) Completed selecting Tool option.
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
3.1. EDID Process
3.1.1. EDID download
(1) Press "Power only" key of service remote control. (2) Press the ADJ KEY on R/C and enter EZ ADJUST (3) Enter EDID D/L mode by pushing "►" key at "11. EDID D/L". (4) EDID download is executed automatically. (5) Press EXIT key on service remote control.
<Caution>
- Never connect HDMI & D-sub Cable when download EDID.
- Download HDMI
* Edid data and Model option download (USB)
NO Item CMD 1 CMD 2 Data 0
Enter download
MODE
EDID data and
Model option
download
3.1.2. RGB EDID Data
(1) All models without 29MN33D(Product ID: 22984/HEXA: 59C8)
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
14. Touch Sensitivity Setting
15. Ext. Input Adjust
16. SPK Lipsync Adjust
17.SPDIF Lipsync Adjust
Download
‘Mode In’
Download A E 00 10 Automatically download
A A 0 0 When transfer the ‘Mode
EDID D/L
HDMI OK
RGB OK
Reset
Start
In’, Carry the command.
(The use of a internal Data)
3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions) (1) TV (2) AV (SCART/CVBS) (3) COMPONENT (480i) (4) RGB(PC : 1366 x 768 @ 60Hz) (5) HDMI(PC : 1366 x 768 @ 60Hz) (6) PC Audio In * Display and Sound check is executed by Remote control
<Caution> Not to push the INSTOP key after completion if the
function inspection.
3.3. CI+ key writing process. (Device CN)
3.3.1. Communication Port Connection
Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port) * Caution: LD31Q/LD31 A chassis sup port only UC-23 2A
driver. (only use this one)
3.3.2. CI+ Key Download
(1) Set CI+ Key path Directory at Start Mac & CI+ Download
Programme. (2) Set COM 1,2,3,4 / 115200(Baudrate) (1)/(2) (3) Click port connection button(1) (4) Start CI+ Key Download, Push the button(4) (5) Check OK or NG
*(week), **(year), ***(Check sum) : Adjustable Data
: Screen size, : Color Characteristics
3.1.3. HDMI EDID Data
(1) All models(Product ID: 22986/HEXA:59CA)
*(week), **(year), ***(Check sum) : Adjustable Data **** (physical address): (HDMI : 10), ****(Check sum): (HDMI : CE)
: Screen size, : Color Characteristics
Only for training and service purposes
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(6) After completing download, CI + key values are increase
by one automatically. To write CI+ key next SET, click CI+
key writing button(5) directly. (7) Check whether the key was downloaded or not at ‘In Start’
menu. (Refer to below).
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
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