LG 24LB451B Schematic

Internal Use Only

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Asia/Oceania http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS :

MODEL :

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LU40A

24LB451B 24LB451B-PU

MFL68127247 (1405-REV00)

Printed in KoreaP/NO :

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS

SERVICING PRECAUTIONS

SPECIFICATION

....................................................................................... 6

ADJUSTMENT INSTRUCTION

TROUBLE SHOOTING

BLOCK DIAGRAM

EXPLODED VIEW

.................................................................................. 17

.................................................................................. 18

......................................................................... 3

.................................................................... 4

................................................................ 9

........................................................................... 13

SCHEMATIC CIRCUIT DIAGRAM

..............................................................

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LG Electronics. Inc. All right reserved.

- 2 -

LGE Internal Use Only

AC Volt-meter

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Good Earth Ground
such as WATER PIPE,

To Instrument's
exposed
METALLIC PARTS

When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

0.15µF

1.5 Kohm/10W

CONDUIT etc.

Copyright ©
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LG Electronics. Inc. All right reserved.

- 3 -

LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an
explosion hazard.

2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this
service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of compon ent
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an el ectrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot fro m a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the

range or 500 ˚F to 600 ˚F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.

(500 ˚F to 600 ˚F)

b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 ˚F to 600 ˚F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

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Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 4 -

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as
possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as
possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.

Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 5 -

LGE Internal Use Only

SPECIFICATION

NOTE : Specications and others are subject to change without notice for improvement.

1. Application Range

This spec sheet is applied all of the TV used LU40A chassis.

2. Specication

Each part is tested as below without special appointment

1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F),
CST : 40 ˚C ± 5 ˚C

2) Relative Humidity : 65 % ± 10 %

3) Power Voltage : Standard input voltage

(100 V - 240 V ~, 50 / 60 Hz)

· Standard Voltage of each products is marked by mod­els

4) Specication and performance of each parts are followed

each drawing and specication by part number in accord-

ance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3.Test method

1) Performance : LGE TV test method followed

2) Demanded other specication

- Safety : CE,IEC specication

- EMC : CE,IEC specication

4. General specication

4.1. TV

No Item Specication Remarks

1 Market AMERICA, CANADA, MEXICO

2 Available Channel 1)Digital : ATSC

2)Analog : NTSC

3 Receiving system ATSC / NTSC-M

4 Interface RF / Composite(CVBS) / Component / HDMI(1EA)

/ USB / RS-232 (SVC only)

4.2. Feature and Function

No Item Specication Remarks

1 RF Input Analog NTSC

DTV ATSC

2 HDMI Input (Rear) HDMI version 1.4/ support PC

Support HDCP

3 Component Input

(Rear, 1EA)

4 CVBS Input ATSC/NTSC-M common port with Component.

5 USB (Side, 1EA) For My Media(Photo/Music List) Picture + Music

6 RS-232C(Side, 1EA) SVC only

Y/Pb/Pr

Rear : 1EA

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 6 -

LGE Internal Use Only

4.3. HDMI(PC) Specication

No Item Specication Remarks

1 Supported Sync. Type Separate Sync., Digital

2 Operating Frequency Analog Horizontal 30 ~ 83 kHz

Vertical 60 Hz

Digital Horizontal 30 ~ 83 kHz

Vertical 56 ~ 75 Hz

3 Resolution Analog Max. 1920 x 1080 @ 60 Hz

Recommend 1920 x 1080 @ 60 Hz

Digital Max. 1920 x 1080 @ 60 Hz

Recommend 1920 x 1080 @ 60 Hz

5. External Input Support Format

- HDMI (PC)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720*400 31.468 70.080 28.321

2 640*480 31.469 59.940 25.175

3 640*480 37.500 75.000 31.500

4 800*600 37.879 60.317 40.000

5 800*600 46.875 75.000 49.500

6 1024*768 48.363 60.004 65.000

7 1024*768 60.023 75.029 78.750

8 1280*800 49.702 59.810 83.500

9 1366*768 47.717 59.79 85.5

- HDMI (DTV)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P

2 720*576 31.25 50.00 27.864 SDTV 576P

3 1280*720 37.50 50.00 74.250 HDTV 720P

4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P

5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I

6 1920* 1080 28.125 50.00 74.25 HDTV 1080I

7 1920* 1080 27.00 24 74.25 HDTV 1080P

8 1920* 1080 33.75 30.00 74.25 HDTV 1080P

9 1920* 1080 56.250 50 148.5 HDTV 1080P

10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 7 -

LGE Internal Use Only

- Component

No

1 720x480 15.73 59.94 720x480i

2 15.73 60

3 720x480 31.47 59.94 720x480p

4 31.5 60

5 1280x720 44.96 59.94 1280x720p

6 45 60

7 1920x1080 33.72 59.94 1920x1080i

8 33.75 60

9 26.97 23.976 1920x1080p

10 27 24

11 33.71 29.97

12 33.75 30

13 67.432 59.94

14 67.5 60

Resolution H-freq(kHz) V-freq(Hz)

Specication

Remark

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Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 8 -

LGE Internal Use Only

ADJUSTMENT INSTRUCTION

(6)

(2)

1. Application Range

This document is applied to LU40A chassis TV which is manu­factured in TV (or Monitor) Factory or is produced on the basis
of this data.

2. Designation

1) The adjustment is according to the order which is designat-

ed and which must be followed, according to the plan which
can be changed only on agreeing.

2) Power adjustment : Free Voltage.

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specication Standard.

5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz

6) Adjustment equipments : Color Analyzer (CA-210 or CA-

110), DDC Adjustment Jig equipment, SVC remote control­ler.

7) Push The "IN STOP KEY" – For memory initialization

Case1 : Software version up

1) After downloading S/W by USB , Multi-vision set will
reboot automatically

2) Push "In-stop" key

3) Push "Power on" key

4) Function inspection

5) After function inspection, Push "In-stop" key.

Case2 : Function check at the assembly line

1) When TV set is entering on the assembly line, Push "In-

stop" ke y at rst.

2) Push "Power on" key for turning it on.

→ If you push "Power on" key, TV set will recover channel

information by itself.

3) After function inspection, Push "In-stop" key.

4) Click “Read” tab, and then load download le(XXXX.bin) by

clicking “Read”

(4)

filexxx.bin

5) Click “Auto” tab and set as below

6) Click “Run”.

7) After downloading, check “OK” message.

(5)

(5)

(7) ……….OK

* USB DOWNLOAD

1) Make New folder named “LG_DTV” and USB download le

in the folder.

2) Put the USB storage to the USB socket.

3) Automatically detecting update le in USB Stick

- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is
High, USB data is automatically detecting.

4) TV Software Upgrade feature will be displayed.

3. Main PCB check process

* APC - After Manual-Insult, executing APC
* Connect DFT jig during Main PCB check process.

* Boot le Download

1) Execute ISP program “Mstar ISP Utility” and then click

“Cong” tab.

2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.

3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.

(1) (3)

Please Check the Speed :

Use the speed under

OK

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

200KHz.

5) Updating is starting.

6) Updating Completed, The TV will restart automatically.

7) If your TV is turned on, check your updated version and
Tool option. (refer to next page tool option section)

* If downloading version is higher than your TV have, TV

can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.

* After downloading, have to adjust TOOL OPTION again.

- 9 -

LGE Internal Use Only

3.1. EDID Process

3.1.1. EDID download

1) Press “Power only” key of service remote controller.

2) Press the “ADJ” Key of service remote controller.

3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.

4) Select “Start” menu to download EDID data.

5) Check the “OK” message.

6) Press EXIT key on R/C.

→ Caution: Do not connect HDMI Cable when download

EDID

* Edid data and Model option download (RS232)

NO Item CMD 1CMD 2Data 0

3.2. Function Check

3.2.1. Check display and sound

*Check Input and Signal items. (cf. work instructions)

1) TV

2) AV (CVBS)

3) COMPONENT (480i)

4) HDMI

* Display and Sound check is executed by Remote controller.

→ Caution : Not to push the INSTOP KEY after completion if

the function inspection.

Enter

download

MODE

EDID data and

Model option

download

Download

‘Mode In’

Download A E 00 10 Automatically download

A A 0 0 When transfer the

→ Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

3.1.2. EDID Data

- HDMI : Checksum : 98 FO

‘Mode In’,

Carry the command.

(The use of a internal

Data)

Copyright ©

LG Electronics. Inc. All right reserved.

Only for training and service purposes

- 10 -

LGE Internal Use Only

4. Total Assembly line process

Color Analyzer

Computer

Pattern Generator

※

※If TV internal pattern is used, not needed

Signal So urce

Probe

RS-232C

RS-232C

RS-232C

DFT JIG

RGB Cable

*Connection

4.1. Tool option & ADC Check

1) Press "Power on" key of service remote control.

2) Connect audio signal cable to phone jack for RS232.

3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)

4) Check the ‘ADC’ is ok.

4.2. Model name & Serial number Down­load

4.2.1. Model name & Serial number D/L

1) Press "Power on" key of service remote control.

2) Connect RS232 Signal Cable to RS-232 Jack.

3) Write Serial number by use RS-232.

4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).

4.2.2. Method & notice

1) Model Name & Serial Number D/L is using of scan equip­ment.

2) Setting of scan equipment operated by Manufacturing
Technology Group.

3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0

4) Check the model name Instart menu → Factory name

displayed (ex 24LN4500)

5) Check the Diagnostics (DTV country only) → Buyer model

displayed (ex 24LN4500)

4.4. White balance adjustment

-Equipment

1) Color Analyzer: CA-210 (LED Module : CH 14)

2) Adj. Computer(During auto adj., RS-232C protocol is
needed)

3) Adjust Remocon

RGB_Gains are xed data for each model.

Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color

coordinate(x,y) data refer to below table were meet or not.
Color coordinate is differ from panel’s characteristics of color
temperature. Please check panel characteristics about color
temperature.

-Cool Panel

Color
Temperature

Luminance
(cd/m²)

*Note : x,y coordinates are drifted about 0.007 after 30 mins

Cool 13,000 °K X=0.276 (±0.04)

Medium 9,300k °K X=0.290 (±0.04)

Warm 6,500k °K X=0.318 (±0.04)

Cool Min : 80 Typ : 110 <Test Signal>

Medium Min : 80 Typ : 110

Warm Min : 70 Typ : 110

Y=0.275 (±0.04)

Y=0.298 (±0.04)

Y=0.334 (±0.04)

<Test Signal>
Inner pattern
(204gray,80IRE)

Inner pattern
(204gray,80IRE)

heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.

4.3. Function Check

4.3.1. Check display and sound

*Check Input and Signal items. (cf. work instructions)

1) TV

2) AV (CVBS)

3) COMPONENT (480i)

4) HDMI
* Display and Sound check is executed by Remote controller.

→ Caution : Not to push the INSTOP KEY after completion if

the function inspection.

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Only for training and service purposes

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- 11 -

LGE Internal Use Only

*Auto-control interface and directions

1) Adjust in the place where the inux of light like oodlight

around is blocked. (Illumination is less than 10ux).

2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).

3) Aging time

- After aging start, keep the power on (no suspension of

power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others,

check the back light on.

* Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN CENTER

(DEFAULT)

4.5. Model Name & SW Version & Adjust
check.

* Press the ‘Instart’ key of ADJ remote controller

4.5.1. Model Name& SW Version Check

1) Check ‘Model Name’.

2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)

4.5.2. Adjust Check

1) Check ‘Country Group’

2) Check ‘Area Option’

3) Check ‘Tool Option’ (Refer to the BOM Comments)

4) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller

to go out SVC menu.

MAX

** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)

*Note : Manual W/B process using adjusts Remote control.

1) After enter Service Mode by pushing "ADJ" key,

2) Enter "White Balance" by pushing "►" key at "White Bal-

ance".

* When doing Adjustment, Please make circumstance as

below.

4.6. Outgoing condition Conguration

* After all function test., press IN-STOP Key by SVC Remote

controller. And make Outgoing Condition

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 12 -

LGE Internal Use Only

1. No Power

Replace X300

N

Check C500

Voltage Level (19V)

Check Power connector

OK ?

Replace Adapter

Y

N Y

Check IC501 Output

Voltage Level (3.3V)

Replace IC501 &

Recheck

Y

N

Check X300 Clock

24MHz

Replace IC405 Flash

Memory

Y

Check IC503 Output

Voltage Level (5V)

Replace IC503 &

Recheck

Y

N

Check IC502 Output

Voltage Level (1.15V)

Replace IC502 &

Recheck

N

Y

TROUBLE SHOOTING

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 13 -

LGE Internal Use Only

2. No Picture

Replace Cable

N

Module Back Light On?

Check IC700 & Q700

Replace LED Driver IC or FET

Y

N

N

Check Panel Power 12V (P401

#30)

Check IC500 Output 12V

Replace IC500 &

Recheck

Y

N

Check Panel input Clock

P401 (#9, #10 )

Check IC300

Repair Main B/D

Y

N

Check FFC Cable for Damage or

Open Conductors

Check LED Driver Output

(C706)

Replace T-Con Board or Module

Y

Check IC300

Replace Main SOC

N

Check WLED_ENABLE High?

Y

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 14 -

LGE Internal Use Only

3. No Video - Digital TV

Check RF Cable

Y

1. Check RF IC(L200) Power (3.3V)

2. Check IC501 Output voltage(3.3V)

Replace IC501 &

Recheck

Y

N

Check SCL/SDA Line(TU200 #3, #4)

Replace TU200 or

IC300(=> Main Scaler)

N

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 15 -

LGE Internal Use Only

4. No Video - HDMI

Replace Main Scaler

(IC300)

Check input signal format

Is it supported?

Check JK100 for proper

connection or Damage

Replace Connector

Y

N

Check I2C Signal

(JK100)

Re Download EDID Data

Y

N

Y

Check HDMI Cable for Damage or

Open Connector

Y

Copyright ©

LG Electronics. Inc. All right reserved.

Only for training and service purposes

- 16 -

LGE Internal Use Only

BLOCK DIAGRAM

Copyright ©
Only for training and service purposes

LG Electronics. Inc. All right reserved.

- 17 -

LGE Internal Use Only

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

910

400

900

535

LV1

A2

200

300

540

510

120

820

800

810

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 18 -

LGE Internal Use Only

<HDMI 2>

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

SHIELD

20

19

18

17

16

15

14

13

12

11

CK+

10

EAG61491201

D0-

9

D0_GND

8

D0+

7

D1-

6

D1_GND

5

D1+

4

D2-

3

D2_GND

2

D2+

1

JK100

COMPONENT

6A

[GN/YL]E-LUG

5A

[GN/YL]O-SPRING

4A

[GN/YL]CONTACT

5B

[BL]O-SPRING

7C

[RD1]E-LUG-S

5C

[RD1]O-SPRING

4C

[RD1]CONTACT

5D

[WH]O-SPRING

4E

[RD2]CONTACT

5E

[RD2]O-SPRING

6E

PPJ245N2-01

[RD2]E-LUG

JK101

5V_HDMI_1

R100

1K

120825
ESD component addition

OPT
VA100

20V

+3.3V_ST

R101

OPT
VA101

5.6V

OPT

VA102

20V

47K

VA103

20V

R103

47K

C
R102
10K

B

Q100
MMBT3904(NXP)

E

OPT

MMBT3904(NXP)

CEC_REMOTE

(OPT)ESD_HDMI_SEMTECH(DEV)

D100
RCLAMP0524PA

1

10
9
8
7
6

10
9
8
7
6

CK-_HDMI1
CK+_HDMI1

D0-_HDMI1
D0+_HDMI1

D1-_HDMI1
D1+_HDMI1

D2-_HDMI1
D2+_HDMI1

ZD104-*1

(OPT)ESD_COMP_ZENER_KEC

ZD105-*1
(OPT)ESD_COMP_ZENER_KEC

2
3
4
5

(OPT)ESD_HDMI_SEMTECH(DEV)

D101
RCLAMP0524PA

1
2
3
4
5

ESD_COMP_ZENER_KEC

ZD105

ESD_COMP_ZENER_KEC

OPT

VA105

5.6V

ZD101

ZD103

VA107

5.6V
OPT

VA122

5.6V
OPT

47K

R104

5.6B
ZD104

5.6B

5.6B

ZD100

5.6B

5.6B

ZD102

5.6B

5V_DET_HDMI_1

C

Q101

E

120715
Added for ESD prevention
120825
OPT->APPLY

R10 6
75

1%

R10 7

C100
1000pF
50V

C101
1000pF
50V

Headphone block

+3.3V

+INR

-INR

OUTR

GND_1

MUTE

HP OUT
IC101

TPA6138A2

C113
1uF

10V

+INL

14

-INL

13

OUTL

12

UVP

11

GND_2

10

VDD

9

CP

8

C114
10pF
50V

HP OUT

R135
43K

HP OUT

C115

1uF
10V

1%

HP OUT

1

2

3

4

5

VSS

6

CN

7

+3.3V

L102
120-ohm
BLM18PG121SN1D

C116
180pF
50V

R136

33K

HP OUT

HP OUT

HP OUT

C117

0.1uF
16V

R137
10K

HP OUT

HP_LOUT

HP OUT

1uF
10V

C118

HP OUT

HP_LOUT_PWM

HP OUT

VA124

R140

20V

100

MNT_USE
R189 0

R126 100

R190

MNT_USE

P100

1

2

3

4

5

0

JackShield(for NonCKD)

M1

MGJ63348201

+3.3V_ST

VA125

VCC

OPT_Event debug

16

GND

15

DOU T1

14

RIN 1

13

ROU T1

12

DIN 1

11

DIN2

10

ROUT2

9

IC102

MAX3232CDR

20V

PM_TXD

PM_RXD

1

2

3

4

5

6

7

8

JackShield(for CKD)

M1-*1

MGJ63348202

OPT_RS232C_VA
OPT_RS232C_VA

VA126

20V

+3.3V_ST

C1+

C123

0.1uF

V+

16V

C120

0.1uF

C1-

16V

OPT_Event debug

C2+

OPT_Event debug

C121

0.1uF

C2-

16V

V-

DOUT2

RIN2

OPT_Event debug
C122

0.1uF
16V

OPT_Event debug

C124

0.1uF
16V

OPT_Event debug

+5V

5V_HDMI_1

A2CA1
MMBD6100
D104

HP OUT

R121

2.7K

120915
47K->2.7K

R120

2.7K

DDC_SDA_1

OPT

R110

10K

B

HPD1

DDC_SDA_1

R119
0

CEC

DDC_SCL_1

CEC_REMOTE

KJA-PH-1-0177-2

6 M6

1 M1

3 M3_DETECT

4 M4

5 M5_GND

JK102

DDC_SCL_1

VA109

VA108

20V

20V

TMDS_CH1-

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

IP4283CZ10-TBA

1

2

GND_1

3

4

5

ESD_HDMI_NXP

D100-*1

10

D101-*1

IP4283CZ10-TBA

GND_1

1

2

3

4

5

ESD_HDMI_NXP

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

<DSUB_RGB>

121128
ESD improve

2:E18

2:E18

OPT->APPLY

DSUB_VSYNC

DSUB_HSYNC

NC_4

TMDS_CH1-

NC_3

TMDS_CH1+

9

GND_2

8

NC_2

TMDS_CH2-

7

TMDS_CH2+

NC_1

6

DSUB_B+

DSUB_G+

DSUB_R+

11.10.31
To Improve EMI

AV_DET

COMP_Y+

<USB_SIDE>

R105
75
1%

R116

+3.3V

10K

R118

1K

OPT

C102

0.1uF
16V

COMP_Pb+

+3.3V

C104

R115

10K

R117

1K

VA106

5.6V

OPT

75
1%

R111

R108
470K
OPT

R109

470K
OPT

10K

R112
10K

R114
12K

R113
12K

COMP_DET

COMP_Pr+

COMP_L_IN

COMP_R_IN

3AU04S-305-ZC-(LG)

JK103

1234

USB DOWN STR EAM

5

0.1uF

JP113

JP112

JP111

16V

OPT

C107
22uF

6.3V

VA110

121128
ESD improve
OPT->APPLY

75

20V

R144

JP116

D_SUB

D_SUB

R145
75

HP OUT

R122

47K

JP107

JP109

JP108

R146 0

121128
ESD improve
OPT->APPLY

VA104

JP110

HP OUT
HP OUT

VA114
20V

D_SUB
R147
0

D_SUB

D_SUB

R148
75

D_SUB

To Improve Ringing issue
LOW capacitance Part apply

IC100

AP2191DSG

NC

8

1

OUT_2

2

7

OUT_1

3

6

FLG

4

5

VA111

20V

JP128

HP OUT

R123
1K

VA112

20V

HP OUT

20V

D_SUB

VA115
20V

D_SUB
R149
0

VA116

11.10.27

D_SUB
D_SUB
D_SUB

GND

IN_1

IN_2

EN

SIDE_USB_DM

SIDE_USB_DP

111026
ESD diode deletion
EAH39491601 2EA

120103
ESD diode addition
EAF61530301 2EA

JP129 JP130

BLM18AG151SN1D

VA113
20V

HP OUT

121128
ESD improve
OPT->APPLY

5.5V
VA117

USB1_CTL

HP_DET

HP OUT
L100

C103

0.22uF
16V

5.5V
VA118

JP119

JP120

R131

10K

5.5V

R132
47

HP_ROUT

L101

BLM18AG151SN1D

HP OUT

SB_MUTE

C106

0.22uF
HP_MUTE

16V

HP OUT

MNT_USE

R150

10K

VA119

D_SUB

121128
ESD improve
OPT->APPLY

JP123

JP121

JP122

+5V

C105

0.1uF
16V

USB1_OCD

HP_LOUT

HP OUT

MMBD6100
A2

A1

MNT_USE

D103

MMBD6100

A2

C

A1

MNT_USE
R151
10K

20V

JP124

H_SYN C

DDC_D ATA

GND_2

BLUE_ GND

RED2GREEN3BLUE4GND_15DDC_G ND

GREEN _GND

RED_G ND

12

11

8

7

6

1

JK105

SPG09-DB-010

D_SUB

D102

NC

13

9

HP_ROUT_PWM

R124

C

10K

HP OUT

121128
ESD improve
OPT->APPLY

JP125

DDC_C LOCK

V_SYN C

SYNC_ GND

15

14

10

HP OUT

C108

1uF
10V

HP OUT

HP_ROUT

+3.3V

HP OUT

R127

10K

C

Q102

B

MMBT3904(NXP)

E

HP OUT

+5V

D_SUB

+3.3V_ST

VA120

20V

VA121
20V

D_SUB

121128
ESD improve
OPT->APPLY

JP126

SHILE D

16

<RS232C>

R129
10K

HP OUT

HP OUT

R152

47K

R130

R128
33K

D_SUB

D_SUB

R153

10K

JK104

C109

180pF

R133

HP OUT

50V

33K

100

R154

47K

B

6 M6

1 M1

3 M3_DETECT

4 M4

5 M5_GND

HP OUT

HP OUT
R134
43K

C112

1%

10pF
50V

HP OUT

C110

C111

1000pF

1uF

50V

10V

HP OUT
HP OUT

PM_RXD

PM_TXD

D_SUB

DSUB_DET

C

Q103

MMBT3904(NXP)

D_SUB

E

Jack Shield (HDMI1, HDMI2, RGB)

VA123

20V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.





M1L

JACK INTERFACE

2013-07-13

1

7

TUNER

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

KR/US(WO AD)

TU200

TDSS-H701F

1

2

3

4

5

6

7

8

9

10

11

NC_1

NC_2

SCL

SDA

+B1[3.3V]

NC_3

NC_4

NC_5

IF_AGC

DIF[P]

DIF[N]

R202

R203 33

+3.3V_TU

R207

1.8K

R204 33

R205 33

C204
18pF
50V

33

C206
18pF
50V

130118
option DEL

close to the tuner pin, add,09029

OPT
C208
20pF
50V

121118
SS BEAD->SUNLORD BEAD

C211
100pF
50V

L200

OPT

C209
20pF
50V

120OHM

R208

1.8K

C212

0.1uF
16V

TU_SCL

TU_SDA

+3.3V_TU

C214
100uF
16V
105C
OPT

B1

B1

12

SHIELD

A1

A1

Close to the tuner

C207

0.1uF

16V

R206 1K

should be guarded by ground

DIF_P

DIF_N

1. should be guarded by ground

2. No via on both of them

3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils

IF_AGC

+3.3V_TU

60mA

OPT

C255

47uF

6.3V
85C

C210
22uF

6.3V

L203

UBW2012-121F

C213

0.1uF
16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER

+3.3V

C215
22uF

6.3V

C217

0.1uF

16V





M1L

Tuner block

2013-07-13

2

7

+3.3V

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

TOUCH KEY

TOUCH KEY

R334

4.7K

R335

4.7K

R302

4.7K

R306

4.7K

<SOC_RESET>

+3.3V_ST

C300
10uF
10V

D400

MMBD6100

OPT

SB_MUTE

A2CA1

R303

100K

<HW_OPT>

+3.3V_ST

R348

1K

Not 19.5"

1K

R349

19.5"_1600*900

PIN NAME

MODEL_OPT_2

+3.3V_ST

R304

1K

FHD

HD

1K

R305

PIN NAME

MODEL_OPT_1

<VDDC 1.15V>

+1.15V_VDDC

10uF

C302

+3.3V_ST

R308

R309

4.7K

4.7K

R307

22

C305

0.1uF
16V

MODEL_OPT_2

MODEL OPTION

LOW

19.5"

MODEL_OPT

MODEL OPTION

LOW

FHD

10V

10V

C304 1uF

SOC_RESET

HIGH

Not used

HIGH

HD

0.1uF

16V

C306

0.1uF

C307

I2C_SDA
I2C_SCL

P_AMP_SDA
P_AMP_SCL

KEY_SDA

KEY_SCL

0.1uF

16V

16V

C308

0.1uF

C310

16V

DISP_EN

AVDD_MOD

KEY1

KEY2

5V_DET_HDMI_2

+1.15V_VDDC

DDR_DATA

MODEL_OPT

KEY_SCL

KEY_SDA

DDC_SCL_1

DDC_SDA_1

AV_DET

DDC_SDA_2

DDC_SCL_2

HPD2

TP302

+1.15V_VDDC

R300

10K

MMBT3904(NXP)

MHL_DET/GPIO86

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

+5V

R311

10K

Q300

C

B

E

R301

4.7K

AVDD_MOD_4
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73

VDDIO_DATA

DDCDD_CL
DDCDD_DA
DDCDA_CL
DDCDA_DA

DDCDB_DA
DDCDB_CL

HOTPLUG_B

AVDD_5V_MHL

GND_EFUSE

WLED_ENABLE

R347

20K

1/16W

1%

DM_P1
DP_P1

VDDC_3

GPIO54

VDDC_4
RXCN_D
RXCP_D
RX0N_D
RX0P_D
RX1N_D
RX1P_D
RX2N_D
RX2P_D
RXCN_B
RXCP_B
RX0N_B
RX0P_B

E-PAD

125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156

SIDE_USB_DM

SIDE_USB_DP

DM_P0

DP_P0

123

124

1

IR

SOC_RESET

RESET

122

MODEL_OPT_2

LED_AMBER

CEC

IRIN

INT/GPIO64/I2S_OUT_MCK

119

120

121

DDCA_CK

TEST

117

118

PM_TXD

PM_RXD

Don’t use arc/gpio87 as GPIO

ARC/GPIO87

DDCA_DA

116

157

THERMAL

5

6

TP301

33

R317

SPI_CK

114

115

SPI_SCK

/SPI_CS

R318 33

SPI_CZ

113

SPI_SDI

SPI_SDO

R319 33

R320 33

PWM0/GPIO15

SPI_DO

SPI_DI

111

112

HPD1

AMP_MUTE

PWM1

PWM0

HOTPLUG_D

HOTPLUG_A

PWM1/GPIO14

107

108

109

110

AMP_RESET_N

I2C_SCL

GPIO0/TCON0

106

LED_RED

I2C_SDA

GPIO4/TCON4

GPIO3/TCON3

GPIO2/TCON2

GPIO1/TCON1

103

104

105

POWER_ON/OFF1

DISP_EN

R324

R326

22

100

GPIO5/TCON5

101

102

MULTI_ON

/FLASH_WP

PANEL_CTL

GPIO6/TCON6

100

TU_SCL

GPIO9/TCON9

GPIO8/TCON8

GPIO7/TCON7

97

98

99

IC300

LGE8220(MSD8220LBM)

[M1L]

15

16

17

20

21

22

23

24

27

28

USB1_OCD

TU_SDA

GPIO10/TCON10

96

USB1_CTL

P_AMP_SDA

P_AMP_SCL

LDE/GPIO18/RLV1-/GPIO18

LHSYNC/GPIO17/RLV0+/GPIO17

LVSYNC/GPIO16/RLV0-/GPIO16

93

94

95

30

31

32

RXB0+

RXB1+

RXB0-

R_ODD[6]/LVB0+/RLV2+/EPI7+

R_ODD[7]/LVB0-/RLV2-/EPI7-

LCK/GPIO19/RLV1+/GPIO19

90

91

92

33

34

AVDD_MOD

RXB1-

AVDD_MOD_3

R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+

R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6-

87

88

89

RXB3+

RXB2+

RXB2-

R_ODD[2]/LVB2+/RLV4+/EPI5+

R_ODD[3]/LVB2-/RLV4-/EPI5-

85

86

RXB3-

RXBCK-

RXBCK+

+3.3V_ST

+3.3V_ST

G_ODD[4]/LVB4+/LLV0+/EPI2+

G_ODD[5]/LVB4-/LLV0-/EPI2-

G_ODD[6]/LVB3+/RLV6+/EPI3+

G_ODD[7]/LVB3-/RLV6-/EPI3-

R_ODD[0]/LVBCLK+/RLV5+/EPI4+

R_ODD[1]/LVBCLK-/RLV5-/EPI4-

79

80

81

82

83

84

42

44

45

G_ODD[3]/LVA0-/LLV1-/EPI1-

78

G_ODD[2]/LVA0+/LLV1+/EPI1+

77

G_ODD[1]/LVA1-/LLV2-/EPI0-

76

G_ODD[0]/LVA1+/LLV2+/EPI0+

75

B_ODD[7]/LVA2-/LLV3(CLK)-

74

B_ODD[6]/LVA2+/LLV3(CLK)+

73

B_ODD[5]/LVACLK-/LLV4-

72

B_ODD[4]/LVACLK+/LLV4+

71

B_ODD[3]/LVA3-/LLV5-

70

B_ODD[2]/LVA3+/LLV5+

69

B_ODD[1]/LVA4-/LLV6-

68

B_ODD[0]/LVA4+/LLV6+

67

GPIO53/I2S_OUT_SD

66

GPIO52/I2S_OUT_BCK

65

GPIO51/I2S_OUT_MCK

64

GPIO50/I2S_OUT_WS

63

GPIO49/SPDIF_OUT

62

GPIO47

61

GPIO46/MHL_VBUS

60

GPIO45/I2C_SCLM/UART_RX1

59

GPIO44/I2C_SDAM/UART_TX1

58

VDDC_2

57

VDDIO_CMD

56

AVDD_MOD_2

55

XOUT

54

XIN

53

AVDD3P3_DMPLL

52

AVDD3P3_DADC

51

VIFM

50

VIFP

49

IFAGC

48

LINEOUTR0

47

46

AVDD_DADC

L304

AVDD_VIDEO

L308

+3.3V_ST

C329

0.1uF

16V

C338

0.1uF

16V

16V

C324

C323

Close to MSTAR

<SY-BY Power 3.3V>

L306

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

AUD_LRCH

AUD_SCK

PC_AUDIO_DET

AUD_LRCK

COMP_DET

5V_DET_HDMI_1

DSUB_DET

HP_DET

HP_MUTE

DIF_N

DIF_P

OPT

AVDD_MOD

R310

3.9K

1/16W

R339

+3.3V_ST

C341

2.2uF

5%

1%

1M

10uF

C331

10V

16V

0.1uF

0.1uF

AVDD_AU33

L305

+1.15V_VDDC

DDR_CMD

AVDD_MOD

AVDD_DMPLL

AVDD_DADC

OPT

C326

50V
100pF

+3.3V_ST

C330

0.1uF

16V

DIMMING

BLU_CURRENT_CTL

WLED_DIM_ADJ

DTV_IF

OPT
C327
100pF
50V

10V

X300
24MHz

1uF

C332

R313

R314

10V

C335 0.1uF

AVDD_DMPLL

L307

C334 27pF

C333 27pF

16V

16V

C336 0.1uF

10K

100

R312

4.7K

50V

50V

C337

0.1uF

16V

R315

16V

C339 0.1uF

4.7K

12.08.03
22->27pF

16V

C340 0.1uF

PWM0

PWM1

<DDR 1.8V>

+1.8V_DDR

120-ohm

L300

DDR_CMD

C303

C301

10uF

10V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

0.1uF

+1.8V_DDR

16V

120-ohm

L301

DDR_DATA

C311

16V

C309

10uF

10V

0.1uF

RX1N_B2RX1P_B3RX2N_B4RX2P_B

AVDD_MOD_1

D2+_HDMI2

D2-_HDMI2

AVDD_MOD

D1+_HDMI2

D1-_HDMI2

D2+_HDMI1

D2-_HDMI1

R331 33

D_SUB

D_SUB

2.4K

R340

DSUB_HSYNC

BIN0P

25V

D_SUB

D_SUB

C346 0.047uF

33

R336

RXCN_A7RXCP_A8RX0N_A9RX0P_A10RX1N_A11RX1P_A12RX2N_A13RX2P_A14HSYNC0

D1+_HDMI1

D1-_HDMI1

CK+_HDMI1

D0-_HDMI1

D0+_HDMI1

CK-_HDMI1

GIN0P18GIN0M19RIN0P

SOGIN0

25V

50V

25V

D_SUB

C348 0.047uF

C347 1000pF

D_SUB

C349 0.047uF

R341 33

R342 33

R343 68

DSUB_B+

DSUB_G+

D_SUB
D_SUB
D_SUB
D_SUB

0.047uF25V

D_SUB

C350

R344 33

DSUB_R+

VSYNC0

D_SUB

R345 33

D_SUB

R346

DSUB_VSYNC

BIN1P

GIN1P25GIN1M26RIN1P

SOGIN1

50V

1000pF

0.047uF

0.047uF

25V

AVDD3P3_ADC

C312

C314

C313

33

D_SUB

R323

R327 33

R325 33

AVDD_VIDEO

10K

COMP_Pb+

25V

0.047uF

C315

R329 68

COMP_Y+

25V

VSYNC1

25V

0.047uF

C316

R330 33

COMP_Pr+

VCOM

CVBS129CVBS0

25V

0.047uF

C317 0.047uF

C318

R333 180

R332 150

COMP_Y+

VDDC_1

CVBS_OUT1

AVDD_AU33

25V

AVDD_AU33

+1.15V_VDDC

AUR035AUL036AUR137AUL138AUR239AUL240AUR341AUL3

C3192.2uF

C320

C3512.2uF

C352

10V

2.2uF

10V

10V

10V

AUDIO_IN

AUDIO_IN

2.2uF

PC_R_IN

COMP_L_IN

PC_L_IN

COMP_R_IN

VAG43VRM

16V

C321

0.1uF

6.3V

C322

10uF

HP OUT

HP OUT

LINEOUTL3

LINEOUTR3

LINEOUTL0

HP OUT

HP OUT

R316 1.2K

R322 1.2K

50V

C343

1200pF

L302

50V

C345

BLM18PG121SN1D

1200pF

R328 1.2K

R321 1.2K

50V

C342

1200pF

50V

C344

1200pF

H/P OUT

HP_ROUT_PWM

HP_LOUT_PWM

HP OUT

HP OUT

HP OUT

HP OUT

M1L_USA

MAIN

0.1uF

C325
16V

+3.3V

L303

R337
10K

NON_A_DEMODE
AGC 1.25V
100 OHM SERIAL

BLM18PG121SN1D

A_DEMODE 0ohm

100

R338

Close to MSTAR

C328

0.047uF
25V

IF_AGC

2013-09-14

3

9

IR/LED and Control

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

KEY2
KEY1

+3.3V_ST

R403 330

+3.3V_ST

R401 270

Amber LED(Non M73):5.9mA

R400

LED_RED

10K

OPT

LED_AMBER

R402

1/10W
1%

10K

1/10W
1%

B

KEY_SCL

KEY_SDA

C

Q400
MMBT3904(NXP)

E

R404

10K

R405

4.7K

B

C

Q401
MMBT3904(NXP)

E

IR

+3.3V_ST

R406
200

R407
100

R408
100

+3.3V_ST

3.3K
R410

R411

3.3K

50V

C400

1000pF

TOUCH KEY

VA400 20V

TOUCH KEY

R444
22

R445
22

D410

CDS3C30GTH

30V

D411

CDS3C30GTH

Module(HD)

P400

12507WR-12L

JP400

JP401

JP402

30V

JP405

JP404

JP403

JP407

JP406

JP408

JP409

JP410

JP411

1

2

3

4

5

6

7

8

9

10

11

12

13

PIN22

0~0.7V

2.7~3.3V

PIN22(29"CMI)

0~0.7V

JEDIA

JEDIA

2.7~3.3V

PIN22,23(VESA)

All panel

GND

NC

+12V_PANEL_POWER

111116
100uF Ecap
Deletion
EAE38362801

VESA

VESA

CMI 29"

C403

0.1uF
16V

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

4.7K/10W*4ea 5.6/10W*2ea

5.6 K
R41 4

Non CMI 29"

R417

R416

0

0

Non CMI 29"

5.6 K
R41 5

HD_Panel

P401

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Module(FHD)

+5V_PANEL_POWER

C404

0.1uF
16V

For Interlace Mode
High : Interlace Mode
Low : Normal Mode

2013.07.15

RXACK+

RXACK-

RXA2+

RXA2-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXA3+

RXA3-

RXA1+

RXA1-

RXA0+

RXA0-

RXB3+

RXB3-

RXB1+

RXB1-

RXB0+

RXB0-

R418

4.7K

+3.3V

OPT

5.6 K

OPT
R420
100

FHD_Panel

P402

10031HR-30

JP414

5.6 K

R41 9

R42 1

R422

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

<SERIAL FLASH>

/SPI_CS

SPI_SDO

/FLASH_WP

Winbond

IC405-*1

W25Q64FVSSIG

VCC

CS

8

1

DO[IO1]

WP[IO2]

%HOLD[IO3]

7

2

CLK

6

3

GND

DI[IO0]

4

5

+3.3V_ST

R564
10K

+3.3V_ST

MX25L6406EM2I-12G

R569

4.7K
OPT

SO/SIO1

GND

JP412

JP413

<NVRAM>

8

7

6

5

VCC

HOLD

SCLK

SI/SIO0

+3.3V_ST

C556

0.1uF

16V

SPI_SCK

SPI_SDI

ATMEL

IC403-*1

AT24C512C-SSHD-T

A0

1

A1

2

A2

3

GND

4

IC403-*2

BR24G512FJ-3

Rohm

A0

1

A1

2

A2

3

GND

4

+3.3V_ST

C552

ST

VCC

8

WP

7

SCL

6

SDA

5

VCC

8

WP

7

SCL

6

SDA

5

IC403

M24512-RMN6TP

E0

1

E1

2

E2

3

VSS

4

0.1uF
16V

VCC

8

WC

7

SCL

6

SDA

5

R573
22

R574
22

I2C_SCL

I2C_SDA

MX

IC405

CS

1

2

WP

3

4

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M1L

Memory.LVDS,IR

2013-07-13

4

7

19V to 12V (For HD Panel)

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

JK500

KJA-DC-1-0032

11.11.07
6604->6601

8

7

6

5

8

7

6

5

FB

VCC

EN/SYNC

BST

FB

VCC

EN/SYNC

BST

8

7

6

5

MULTI_ON_1

HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"

C515

0.1uF

FB

VCC

EN/SYNC

BST

16V

HD(12V Panel)_No use at 18.5"
R508
10K

OPT

R509

2K

R505
68

C512

0.1uF
50V

R510

100K

R511
20K

R506
68

C513

0.1uF
50V

+3.3V_ST

R513
10K

OPT
R512

2K
R507
68

C514

0.1uF
50V

C517

0.1uF
16V

C518

0.1uF
16V

R515
75K

1%

C519

0.1uF
16V

HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"
R517

33K

L502
10uH

C524

C522

10uF

10uF

16V

16V

HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"

R518
33K

L501
10uH

C523

C525

22uF

10uF

6.3V
10V

OPT

L500

4.7uH

C526

C521

10uF

22uF

6.3V

10V

OPT

C528

0.1uF

C529

0.1uF

16V

16V

C530

0.1uF

+12V_Normal

HD(12V Panel)_No use at 18.5"

OPT

R52 0

3K

4
1%

R52 1
100 K
1%

R52 2
10K
1%

R52 6

5.1 K
1%

R52 7

27K

1%

R52 8

10K

1%

R52 3

4.7 K
1%

16V

R52 4

R52 5

0

10K

1%

R52 0-*1

39K

1%

OPT

HD(12V Panel)_No use at 18.5"

R52 1-*1

15K

1%

HD(12V Panel)_No use at 18.5"

OPT

R52 2-*1

10K

1%

+3.3V_ST

5V

ZD302

+1.15V_VDDC

ZD301

2.5V

POWER_ON/OFF1

+3.3V_ST

+3.3V

C533
10uF

10V

R537

10K

R538
100K

AZ1117EH-ADJTRG1

1.3A

B

IC504

ADJ/GND

R544

22K

R542

100

C

Q500
MMBT3904(NXP)

E

OUTIN

+3.3V_ST

R500

330
1/10W
1%

R516
150
1/16W
1%

R1

R2

C534

4.7uF
10V

R532

C537
10uF

10V

PMV48XP

Q502

C536

1uF

10V

OPT

0

G

+1.8V_DDR

S

D

ZD300

5V

+3.3V

C540

0.1uF
16V

HD(12V Panel)_No use at 18.5"

IC500

AAM

GND

AAM

GND

IN

SW

IN

SW

MP2315GJ

1

2

NEW

3

3A

4

IC501

MP2315GJ

1

2

NEW

3

3A

4

C506

0.1uF
50V

C507

0.1uF
50V

R501
47K

OPT

R502
47K

JP500

4

2

1

JP501

C500

47uF
25V
105C

+19V

OPT

OPT

C502

C501

10uF

10uF

25V

25V

Check the Ripple

C504

2.2uF
25V

HD(12V Panel)_No use at 18.5"
HD(12V Panel)_No use at 18.5"

C505

2.2uF
25V

19V to 1.15V (M1 Core)

IC502

MP2315GJ

R503
47K

AAM

1

IN

2

NEW

SW

C503

2.2uF
25V

C508

0.1uF
50V

3

3A

GND

4

Vout=1.25*(1+R2/R1)+Iadj*R2

19V TO 5V DCDC CONVERTER

MULTI_ON

R559
1K

C510

0.47uF

OPT

IC503

16V

C509

2.2uF
25V

C511

0.1uF
50V

R504
47K

AAM

GND

IN

SW

MP2315GJ

1

2

NEW

3

3A

4

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

8

7

6

5

FB

VCC

EN/SYNC

BST

R514
68

C516

0.1uF
50V

R549

PANEL POWER CONTROL

HD_Panel_No use 18.5"

+5V

R519
33K

L503
10uH

R52 9

39K

C520

0.1uF

10K

16V

C527
10uF

10V

C531
10uF

C532

0.1uF

10V

16V

R53 0

R53 1

1%

15K

1%

10K

1%

+5V

FHD_Panel_Use 18.5"

R555
0

MULTI_ON_1

R588

1K

FHD_Panel_Use 18.5"

PANEL_CTL

+12V_Normal

R539
0

C

FHD_Panel_Use 18.5"

Q504

B

MMBT3904(NXP)

E

0

R567

FHD_Panel_Use 18.5"

R540

4.7K

R541
0

R543

10K

13.06.28
For Module Power Sequence
R441 : 22k --> 100k
R442 : 1k --> 10k _ 2.7K??

R545

100K

FHD_Panel_Use 18.5"

R546
10K

C

Q501

B

MMBT3904(NXP)

E

FHD_Panel_Use 18.5"

AO3407B

C535

4.7uF
16V

C538

1uF

16V
HD_Panel_No use 18.5"

R546-*1

4.7K
HD_Panel_No use 18.5"

+12V_PANEL_POWER

Q503

S

G

D

L13

Power

HD_Panel_Use 18.5"
R550
0

+5V_PANEL_POWER

FHD_Panel_No use 18.5"
R551
0

2012-06-01

6

7

AUDIO AMP

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

SB_MUTE

AMP_MUTE

P_AMP_SDA

P_AMP_SCL

AUD_SCK

AUD_LRCK

AUD_LRCH

D600

MMBD6100

A2

A1

+3.3V

C600
2700pF
50V

C

R600

10K

R601

10K

R602

10K

B

1.5K
R603

C601

0.027uF
50V

+3.3V_ST

R604

10K

C

Q600
MMBT3904(NXP)

E

C602
33pF
50V

OPT

3.3K

R605

JP600

10V
1uF

C603

R606 100

C604
33pF
50V

OPT

ADDR

BCLK

LRCK

SDATA

TEST1

REG15

DGND

JP601

PLL

C605

1uF

10V

[EP]

1

2

3

4

5

6

7

8

C606
1000pF
50V

OPT

SCL

SDA

32

THERMAL

33

9

DVDD

TEST2

+3.3V

31

10

AMP_RESET_N

OPT

1000pF

50V

C607

NC_2

RSTX

MUTEX

28

29

30

IC600

BM28720MUV

11

12

13

TEST3

ERROR

STADAO

JP602

JP603

10V

C608 10uF

REG_G

27

14

NC_1

10V

4.7uF

C610

OUT1P

BSP1P

25

26

24

23

22

21

20

19

18

17

15

BSP2N16OUT2N

10V

C609 4.7uF

VCCP1

GNDP1

BSP1N

OUT1N

OUT2P

BSP2P

GNDP2

VCCP2

+19V

+19V

C611
10uF
25V

C612
10uF
25V

C613
100uF
25V
105C

C614
100uF
25V
105C

C616

C615

4.7uF

10V

10V

4.7uF

C617
680pF
50V

R608

5.6

R609

5.6
C618

680pF
50V

R611

5.6

C619
680pF
50V

R610

5.6

C620
680pF
50V

L602

10uH

LPH6045T-100M

L603

10uH

Audio_Coil_ABCO

LPH6045T-100M

L600

Audio_Coil_ABCO

10uH

LPH6045T-100M

L601

10uH

LPH6045T-100M

Audio_Coil_ABCO

Audio_Coil_ABCO

L600-*1

10.0uH

NRS6045T100MMGK

NRS6045T100MMGK

NRS6045T100MMGK

L603-*1

NRS6045T100MMGK

(OPT)Audio_Coil_TAIYO

L601-*1

10.0uH
(OPT)Audio_Coil_TAIYO

L602-*1

10.0uH
(OPT)Audio_Coil_TAIYO

10.0uH
(OPT)Audio_Coil_TAIYO

C623

0.33uF
50V

C624

0.33uF
50V

C621

0.33uF
50V

C622

0.33uF

50V

OPT
C626

0.47uF
50V

OPT
C625

0.47uF

50V

JP604

JP606

JP605

SMAW250-H04R

JP607

WAFER-ANGLE

4

3

2

SPK_R+

1

P600

SPK_L+

SPK_L-

SPK_R-

100K

R607

+3.3V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

19V DIP DETECTION_Delete this circuit at MP.

+19V

DIP DETECTION
KDS226

AC

D601

R612

47K

DIP DETECTION

OPT

C666

4.7uF

50V

A

DIP DETECTION
C627
10uF
25V

C

DIP DETECTION
R613

470

E

MMBT3906(NXP)

B

Q601

DIP DETECTION

C

R614
12K
OPT

R615
12K

DIP DETECTION

DIP DETECTION

C628

47uF
25V

105C

SB_MUTE

121118
R737 3K for SCART MUTE DEL

3K:
With SCART MUTE BLOCK

12K:
Without SCART MUTE BLOCK

L13

AMP

2012-06-01

76

CMI 24"Panel OVP

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

CMI_24"_OVP

R706-*4

30K

CMI 29"Panel OVP

CMI_29"

R788-*1

120K

1/8W

1%

CMI_29"

R702-*1

270K

1/8W

1%

CMI_29"

R706-*1

LGD_19.5"_OVP

R702-*2
560K

1%

LGD_19.5"_OVP

5.6K

R706-*2

LGD 19.5"Panel OVP

18.5"_OVP
R702-*3
510K

1%

R706-*3

18.5"_OVP

LGD 18.5"Panel OVP

1%

1%

27K

39K

First_output

WLED_ENABLE

LGD FHD/CMI 24"

LGD FHD/CMI

WLED_DIM_ADJ

1%

1%

BLU_CURRENT_CTL

LGD_19.5"_BLU Current

R703-*3

2.7K
1%

LGD_19.5"_BLU Current

18K

R704-*2

1%

REDUCE INDUCTOR TEMP ISSUE

VOUT#1=53.2V

L700
33uH

LGD FHD/CMI

LGD FHD/CMI

LGD FHD/CMI 24"

R702

R788
0

510K

1/8W

1/8W

5%

1%

R706
22K
1%

LGD FHD

R705
100

LGD FHD/CMI

R700
100K

LGD FHD/CMI/NON_BOE_LGD 19.5" Not used

BOE

R704-*1
18K
1%

1%

CMI_29"/BOE

R703-*1

LGD FHD/CMI

CH2

R701 75K

1%

3K
1%

CH1

NOT23.6"

R1006

NEW 23.6"
R1003

R707

100K

1%

LGD FHD/CMI
C700

100pF

50V

LGD FHD/CMI
R703

1.5K
1%

R704
22K
1%

0

0

LGD FHD/CMI

C702
100pF
50V

LGD FHD/CMI
C701

1000pF
50V

NEW 23.6"

CMI_29"

L701
33uH

LGD FHD/CMI 24"

R723
0

1/8W

DT1641AS

EN

1

OVP

2

NC_1

3

PGND_1

4

PGND_2

5

PDIM

6

RISET

7

LS8

0

R708

0

0

R1007

R709

LGD FHD/NEW 23.6"/Use 18.5"

8

LS7

9

LS6

10

LGD FHD/NEW 23.6"/Use 18.5"

LS5

11

NC_2

12

LED_CH3

R724

LED_CH3

R725

LGD FHD/CMI

IC700

THERMAL

0

0

LGD FHD/CMI 24"/NON_BOE

D701

100V

BR210

D700

UF3D(SUZHOU GRANDE)

CMI_29"/BOE

UF3D(SUZHOU GRANDE) 200V 1V 300UA 3A 50NSEC SMC TR 2P 1 SUZHOU GRANDE ELECTRONICS CO.,LTD

+19V

LGD FHD/CMI

R717

0

[EP]GND

BOE

LGD FHD/CMI

R715

30K

1%

C707

50V

LGD FHD/CMI

LGD FHD/CMI 24"
C708

0.047uF
25V

CMI_29"

C708-*1

0.1uF
25V

CH4

CH3

Vout

R717-*1

10

VIN

24

25

23

22

21

20

19

18

17

16

15

14

13

LGD FHD/CMI

VREF

CS

NDRV

RSS

COMP

RT

LS1

LS2

LS3

LS4

LGND

C705

1uF
25V

0

R712

0

LGD FHD/NEW 23.6"/Use 18.5"

0

R710

LGD FHD/NEW 23.6"/Use 18.5"

R1002

NEW 23.6"

LGD FHD/CMI

C704
1uF
25V

LGD FHD/CMI

LGD FHD/CMI

R711

39K
1%

R714

1.5K
1%

LGD FHD/CMI

R713

1%

220K

4700pF

LGD FHD/CMI

R716

1.5K 1%

D

CMI_29"
Q700
SMK630D

G

S

0.1

1%

R718

LGD FHD/CMI

D

G

S

LGD FHD/CMI 24"
Q700-*1

AOD478

CH1

CH2

CH3

CH4

REDUCE RIPPLE CURRENT

LED DRIVER

7

6

5

4

3

2

1

12507WR-06L

P702

LGD FHD_TN

Vout

NEW 23.6"

R1010
0

NOT23.6"

R1001

M704

M705

M706

0

M707

M708

7

6

5

4

3

2

1

12507WR-06L

P700

LGD FHD_IPS

13

12

11

10

9

8

7

6

5

4

3

2

1

05002HR-H12J05

P701

CMI_23.6" Connector

Vout

JP700

JP701

JP702

JP703

JP704

M700

M701

M702

M703

R7190

CMI_29"

CMI_29"

R7210

CMI_29"

R7200

CMI_29"

R7220

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

0

LED_CH2

R726

0

LED_CH2

R727

0

LED_CH1

R728

0

LED_CH1

R729

C706
33uF
100V

-55TO+105C
R1000
0

CMI_29"

CMI_29"

R777

1M

1/8W

1%

CMI_29"

R730

1M

1/8W

1%

C789

33uF
100V

-55TO+105C

LGD FHD/CMI 24"

R730-*1

0

LGD FHD/CMI 24"

R777-*1

0

CMI_29"

R731

10K

CMI_29"

ZD700

33V

OPT_CMI_29"

C709

0.1uF

250V

Vout

JP705

JP706

OPT_CMI_29"

C710

0.1uF
250V

C709-*1
1uF
100V

OPT_LGD FHD/CMI 24"

CMI_29"

P703

SMAW200-03

3

2

1

OPT_LGD FHD/CMI 24"

C710-*1

1uF
100V

LED Driver Setting

21.5 inch LGD Panel : LED_CH2, LED_CH3 SET

23 inch LGD Panel : LED_CH2, LED_CH3 SET
27 inch LGD Panel : LED_CH2 SET
29 inch CMI Panel : LED_CH1, LED_CH2 SET

+19V

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

21.6/26/27.5/29 Panel

21.6/26/27.5/29 Panel

MULTI_ON

21.6/26/27.5/29 Panel

R800

4.7K

R812

OPT

10K

FIRST BOOST UP

21.6/26/27.5/29 Panel

C801

C800
10uF
25V

+3.3V_ST

21.6/26/27.5/29 Panel

10K

R801

1/16W

21.6/26/27.5/29 Panel

C

Q800

B

MMBT3904(NXP)

E

121118
Change 2012 -> 1608
for cost down

5%

24V_Panel

CSOT(27.5")

LGD(21.6/26")

CMI(23.6")

10uF
25V

24V_Panel

C802
2200pF
50V

1/16W

0

R814

24V_Panel

R815
470K

1/16W
5%

CMI_29"
R815-*1
1K

1/16W
1%

PANEL

LGD(FHD)

CMI(29")

C815

0.1uF
50V

21.6/26/27.5/29 Panel

OPT

CMI_29"

C802-*1

0.033uF
50V

CMI_29"

C803
100pF

R803
10K

1/16W

21.6/26/27.5/29 Panel

1%

1/16W

18K

R814-*1

Input
Voltage

53.2V set

50V

RC

C805

0.22uF

16V

24V_Panel
C804

47pF
50V

24V_Panel

R888

1.5K

DIS/EN

SS

COMP

FB

1/16W

Option
(21.6/26
/27.5
/29 Panel)

24V

19V

19V Set

Not Set

Not Set

21.6/26/27.5/29 Panel

21.6/26/27.5/29 Panel

TPS40210DGQR

1

2

3

4

5

CMI_29"

C804-*1

470pF
50V

IC800

THERMAL

R805
220K

1/16W

10

11

9

8

7

6

21.6/26/27.5/29 Panel

Option
(24V Panel)

set

Not set

Not set

Not Set

21.6/26/27.5/29 Panel
R807

30K

1/16W

[EP]

VDD

BP

GDRV

ISNS

GND

C806
1uF
25V

121118
Change 10V -> 25V
for derating

Option
(LGD FHD
/CMI)

set

Not set24V set

Not set

21.6/26_24V_Panel
L801

10uH

27.5/CMI_29"
L800

33uH

21.6/26/27.5/29 Panel

CMI_29"

C807

0.1uF
50V

C813

0.1uF
25V

24V_Panel

121212
1k->3.9K
220pF->330pF

CMI_29"

C808-*1
330pF
50V

21.6/26/27.5/29 Panel

D800
BR210

100V

CMI_29"

-55TO+105C

R810

3.3

1/16W

C808
100pF
50V

24V_Panel

24V_Panel
R808
1K
1%

VOUT = VREF*(1+51K/680)
= 0.7 *(1+51K/680)
= 53.2V

Option
(LGD FHD
/CMI 24")

Not set

Not setset

Set

Set

Set

Set

Not Set

CMI_29"

C824
33uF
100V

-55TO+105C

CMI_29"

R809-*1

3.9K

1%

24V_Panel

R809

1K
1%

CMI_29"
R808-*1

3.9K
1%

Option
(CMI 29")

Not set

Not set

Not Set

Not Set

Set

24V_Panel

C825

C814
68uF

33uF

35V

100V

105C

D

21.6/26/27.5/29 Panel
Q801

AOD478

G

S

R811

0.11W1%

21.6/26/27.5/29 Panel

24V_Panel

C816
1uF
50V

24V_Panel

C817
1uF
50V

CMI_29"
C811
1uF
50V

CMI_29"

C810
1uF
50V

R829

100K

CMI_29"

R828

100K

CMI_29"

R806

+24V_BLU

24V_Panel

R832
0

51K

1/8W

1%

21.6/26/27.5/29 Panel

CMI_29"
R804

680
1/8W
1%

WLED_DIM_ADJ

LGD FHD/CMI 24"

+19V

R833
0

CMI_29"

R834
0

+24V_BLU

CSOT 27.5" Connector

JP800

WLED_ENABLE

JP801

First_output

JP802

C888
1uF
50V

C809
1uF
10V

OPT

CSOT 27.5" Connector

20022WR-14A00

24V

1

24V

2

24V

3

24V

4

24V

5

GND

6

GND

7

GND

8

GND

9

GND

10

ERROR_OUT

INV_ON

PWN_DIM

11

12

NC

13

14

P801

15

GND

+19V

+24V_BLU

0

OPT

R802

LGD 21.6"/26" Connector

WLED_ENABLE

WLED_DIM_ADJ

0

R813

JP804

JP805

C889
1uF
50V

C812
1uF
10V

OPT

JP806

LGD 21.6"/26" Connector

ERROR_OUT

INV_ON

PWN_DIM

P800

SM14B-SRSS-TB

24V

1

24V

2

24V

3

24V

4

24V

5

GND

6

GND

7

GND

8

GND

9

GND

10

11

12

NC

13

14

15

GND

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

JP803

JP807

<HDMI 1_MT55>

Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

SHIELD

20

19

18

17

16

15

14

13

12

11

CK+

10

EAG61491201

MT55_HDMI1

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_2

MT55_HDMI1
R908

1K

+3.3V_ST

R909

MT55_HDMI1

OPT

VA904

5.6V

OPT
VA903

120825
ESD component addition

20V

VA906

OPT
VA905

20V

MT55_HDMI1

R911

B

47K

C

Q900
MMBT3904(NXP)

MT55_HDMI1

E

MMBT3904(NXP)

47K

MT55_HDMI1

OPT

R910
10K

20V

(OPT)ESD_HDMI_SEMTECH(DEV)

D900
RCLAMP0524PA

1

10

2

9
8

3

7

4

6

5

(OPT)ESD_HDMI_SEMTECH(DEV)

D901
RCLAMP0524PA

1

10

2

9
8

3

7

4

6

5

MT55_HDMI1

47K

R912

MT55_HDMI1

Q901

CEC_REMOTE

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2
D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2
D2+_HDMI2

5V_DET_HDMI_2

C

MT55_HDMI1

B

R913

10K

E

MT55_HDMI1

VA907

20V

120715
Added for ESD prevention
120825
OPT->APPLY

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

VA908

20V

MT55_HDMI1

D900-*1

IP4283CZ10-TBA

1

2

3

4

5

ESD_HDMI_NXP

HPD2

DDC_SDA_2

DDC_SCL_2

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

MT55_HDMI1

D901-*1

IP4283CZ10-TBA

1

2

3

4

5

ESD_HDMI_NXP

5V_HDMI_2

R914

2.7K

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

+5V

A2CA1
MMBD6100
D904

MT55_HDMI1

MT55_HDMI1

R915

2.7K

120915
47K->2.7K

DDC_SDA_2

DDC_SCL_2

PC AUDIO(SIDE)

AUDIO_IN

6 M6

1 M1

3 M3_DETECT

4 M4

KJA-PH-1-0177

5 M5_GND

JK900

JP900

JP903

JP902

JP901

VA902

20V

OPT

VA900

20V

AUDIO_IN

VA901

20V

AUDIO_IN

C901

220pF

50V

C900

220pF

50V

AUDIO_IN

AUDIO_IN

AUDIO_IN

12.08.10
47K->470K

OPT

R901
470K

OPT

R900
470K

+3.3V

R904

470K

AUDIO_IN

R902
15K

AUDIO_IN

R903
15K

R907
1K

R905
10K

AUDIO_IN

R906
10K

AUDIO_IN

JK901

AUDIO_IN

PC_AUDIO_DET

PC_R_IN

PC_L_IN

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M1L_USA

Input_MT55

2013-09-14

9

9