Leica EM TXP User Manual

Leica EM TXP

Target Surfacing System

Leica EM TXP – Target Surfacing

The Leica EM TXP is a unique target preparation device especially
developed for cutting and polishing samples prior to examina­ tion by SEM, TEM and LM techniques. It excels with challenging
speci mens where pinpointing and preparing barely visible targets
becomes easy. Before the Leica EM TXP, sawing, milling grinding
and polishing exactly to the target was often a very time-consum­ing and difficult procedure as points of interest were easily
missed and specimens often difficult to handle due to their small
size. With the Leica EM TXP such samples can easily be prepared.

Leica Design by W. Hölbl

90° rotation view

Processing observation

Front face observation

2

System

Integrated Viewing System

Stereo microscopic target observation

during the working process

With the specimen pivot arm the sample can be observed during
preparation at an angle between 0° and 60°, directly onto the front
face, or 90° to the front face for distance determination with an
eyepiece graticule. The Leica EM TXP features brilliant ring LED
top light and optimized backlight illumination for excellent viewing.

■ Accurate location and preparation of microtargets

Front side decapsuled integrated circuit

■ Observation with a stereo microscope

■ Multifunctional machine processing

■ Automatic process control

■ to produce a mirror-like surface quality

SM LED gold wire bond

PCB cross section with soldered pin

PCB cross section

3

Process Possibilities

Once the sample is clamped into the specimen holder and in­serted in the pivot arm, the specimen can be:
– milled
– sawed
– ground
– and polished

without removing the sample from the Leica EM TXP and simply
changing the tools while observing the process directly through
the steromicroscope. The tool and sample are enclosed within a
protective chamber with a transparent cover for safety. This pre­vents access to moving parts and avoids particulate matter
escaping. During milling a low-noise extraction and filtration unit
with a Hepa filter (optional) provides a safe, dust-free environment.

Diamond and tungsten carbide millers

Diamond disc cutter

Lapping inserts 15, 9, 6, 3, 1, 0.5 μm

4

Integrated Automatic Process Control

Let the Leica EM TXP do the job

The Leica EM TXP automatic process control mechanism saves
you from time-consuming routine sample preparation:
– with the automatic E-W guiding mechanism
– with the force-regulated feed control
– with the countdown function
and level sensor for the integrated lubricant cooling system

– Pivot arm lever
– Hand wheel for manual feed in steps of

0.5, 1, 10 and 100 μm

– Control panel for manual operation and setting

of all parameters for automatic preparation

Peristaltic

cooling system

Peristaltic cooling system

E-W guiding mechanism

5

Application Examples

Target preparation on surfaced sample for incident light LM and SEM

All processing steps are carried out consecutively on the Leica EM TXP without removing the sample for pinpointing the area of
interest via another microscope or for making any adjustments. Preparing specimens observed during operation with the inte-

grated stereo microscope avoids the time consuming interruption of locating the target with a stand alone microscope and then
re-aligning the sample in the polishing instrument.

➔

Sawing

Observation via stereo micro­scope of the Leica EM TXP

Sample Thinning for transmitted light LM or prior to ion thinning for TEM

Specimen thinning with the Leica EM TXP offers the advantage of observing the complete process during treatment and distance
monitoring at each process step without the need to remove the sample for checking in another instrument.

➔

1st side preparation as described
above.

Mill a supporting stub with
the disc cutter so it is parallel to
the prepared face in step 1.
Set the advance counter to zero.

Fix the prepared 1st side with
wax onto the prepared stub with­out removing it from the holder.

Or directly in the Leica EM TXP
with glue.

6

➔

Grinding/polishing

The saw is set to the desired
value (e.g. 100 μm) and the second
side preparation begins (here
sawing).

The second side is then polished.
The thickness of the sample can
be observed on the advance
counter display.

The area of interest via the stereo microscope of the Leica EM TXP

➔

Front face observation with the
Leica EM TXP. Here the sample
thickness is 25 μm.

7

IC: Silicon soldered on copper paddle

Result: Target-prepared integrated circuit. Gold wire bonding on Si (LM image)

Incident light Incident and transmitted light Transmitted light

Result: Target prepared integrated circuit. Gold wire bonding on Si .... 25 μm section (LM image)

8

View the Details

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Leica EM TXP - E - 6/07 Order No. 16214002 - Printed on chlorine-free bleached paper.