Leica EM TXP User Manual

Leica EM TXP

Target Surfacing System

Leica EM TXP – Target Surfacing

The Leica EM TXP is a unique target preparation device especially developed for cutting and polishing samples prior to examination by SEM, TEM and LM techniques. It excels with challenging specimens where pinpointing and preparing barely visible targets becomes easy. Before the Leica EM TXP, sawing, milling, grinding and polishing exactly to the target was often a very time-consuming and difficult procedure as points of interest were easily missed and specimens often difficult to handle due to their small size. With the Leica EM TXP such samples can easily be prepared. Furthermore, due to its versatility, the EM TXP is a very efficient tool for sample pre-preparation prior to ion beam milling and ultramicrotomy.

90° rotation view

Processing observation

Front face observation

Leica Design by W. Hölbl

2

System

Integrated Viewing System

Stereomicroscopic target observation during the working process

With the specimen pivot arm the sample can be observed during preparation at an angle between 0° and 60°, directly onto the front face, or 90° to the front face for distance determination with an eyepiece graticule. The Leica EM TXP features brilliant ring LED top light and optimized backlight illumination for excellent viewing.

■Accurate location and preparation of microtargets

■In-situ observation with a stereomicroscope

■Multifunctional machine processing

■Automatic process control

■to produce a mirror-like surface quality

■Brightness control and segment selection

■of LED-ring illumination

Cross section of watch assembly (processed without embedding)

Cross section of a tooth (processed without embedding)

Viewing with full ring illumination

Viewing with quarter ring illumination

3