Leica EM TXP User Manual

Leica EM TXP

Target Surfacing System

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Leica EM TXP – Target Surfacing

90° rotation view

Processing observation

Front face observation

The Leica EM TXP is a unique target preparation device especially
developed for cutting and polishing samples prior to examina tion by
SEM, TEM and LM techniques. It excels with challenging speci ­mens where pinpointing and preparing barely visible targets
becomes easy. Before the Leica EM TXP, sawing, milling, grinding
and polishing exactly to the target was often a very time-consuming
and difficult procedure as points of interest were easily missed and
specimens often difficult to handle due to their small size. With the
Leica EM TXP such samples can easily be prepared. Furthermore,
due to its versatility, the EM TXP is a very efficient tool for sample
pre-preparation prior to ion beam milling and ultramicrotomy.

Leica Design by W. Hölbl

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System

Stereomicroscopic target observation during the working process

With the specimen pivot arm the sample can be observed during
preparation at an angle between 0° and 60°, directly onto the front
face, or 90° to the front face for distance determination with an
eyepiece graticule. The Leica EM TXP features brilliant ring LED
top light and optimized backlight illumination for excellent viewing.

I Accurate location and preparation of microtargets

I

In-situ

observation with a stereomicroscope

I Multifunctional machine processing

I Automatic process control

I to produce a mirror-like surface quality

I Brightness control and segment selection

I of LED-ring illumination

Integrated Viewing System

Cross section of watch assembly
(processed without embedding)

Viewing with quarter ring illumination

Cross section of a tooth
(processed without embedding)

Viewing with full ring illumination

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Once the sample is clamped into the specimen holder and in­serted in the pivot arm, the specimen can be:
– milled
– sawn
– drilled
– ground
– and polished

without removing the sample from the Leica EM TXP and simply
changing the tools while observing the process directly through
the stereomicroscope. The tool and sample are enclosed within a
protective chamber with a transparent cover for safety. This pre­vents access to moving parts and avoids particulate matter
escaping. During milling a low-noise extraction and filtration unit
with a Hepa filter (optional) provides a safe, dust-free environment.

Process Possibilities

Diamond and tungsten carbide millers

Diamond disc cutter

Lapping inserts 15, 9, 6, 3, 1, 0.5 µm

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Let the Leica EM TXP do the job

The Leica EM TXP automatic process control mechanism saves
you from time-consuming routine sample preparation:
– with the automatic E-W guiding mechanism
– with the force-regulated feed control
– with the distance or time countdown function
– with force-controlled auto-advance for core-drilling
and level sensor for the integrated lubricant cooling system

Integrated Automatic Process Control

– Pivot arm lever
– Hand wheel for manual feed in steps of

0.5, 1, 10 and 100 µm

– Control panel for manual operation and setting

of all parameters for automatic preparation

E-W guiding mechanism

(manual or automatic)

Peristaltic

cooling system

SM LED gold wire bond

PCB cross section with soldered pin

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Observation via stereo microscope of the Leica EM TXPSawing

After the sample is fixed onto the stub a 3 mm disc is cut out using the
core-drill in conjunction with the force-regulated auto-advance.
The first side is then finished using the grinding and polishing foils.

The surface of the stub is milled with the tungsten carbide miller
so it is parallel to the grinding and the polishing plane for processing
the second side of the sample.

Target preparation on surfaced sample for incident light LM and SEM

All processing steps are carried out consecutively on the Leica EM TXP without removing the sample for pinpointing the area of
interest via another microscope or for making any adjustments. Preparing specimens observed during operation with the integrat­ed stereomicroscope avoids the time consuming interruption of locating the target with a stand alone microscope and then
re-aligning the sample in the polishing instrument.

Sample thinning for transmitted light LM or prior to ion thinning for TEM

Specimen thinning with the Leica EM TXP offers the advantage of observing the complete process during treatment and distance
monitoring at each process step without the need to remove the sample for checking in another instrument.

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The Leica EM TXP is a unique target surfacing system developed for cutting and polishing samples. Alignment of sample details
can be rapidly performed using the alignment accessory. Thus, the EM TXP is the instrument of choice for pre-preparation of the
sample prior to ion beam slope cutting with e.g. the Leica EM TIC020.

Sample holder attached on the alignment accessory.
The micro-targets can be aligned during the process
while observing with the stereo microscope.

Within a few minutes all sample details are aligned. LM-image of gold
wire bondings processed with the cut-off wheel and ground with 6 µm
diamond foil during alignment. The surface finish is good enough for
subsequent finishing with the ion beam slope cutter, EM TIC020.

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The area of interest via the stereomicroscope of the Leica EM TXP

The prepared first side is fixed onto the surface of the stub.
The second side is then cut, ground and polished. The thickness of
the sample can be determined with the advance counter display.

In such a manner, even hard and brittle materials can be thinned to be
subsequently prepared for TEM investigation e.g. for ion thinning with
the Leica EM RES101.

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Grinding/polishing

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The Leica EM TIC020 features three ion guns in one assembly
enabling > 4 mm cutting width and > 1 mm cutting depth.

Gold-wire bondings of IC-package during processing with the
Leica EM TIC020. The dark area above the gold wires has already been
polished by the ion beam.

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Gold-wire bonding of IC-package prepared
with the Leica EM TXP (LM image).

Leica EM RES101 for ion beam processing
of TEM and SEM samples.

Same gold wire bonding subsequently processed for
half an hour with the Leica EM RES101 (SEM image).

High surface quality within a few hours. The user interaction time of the complete process is around
20 minutes using the Leica EM TXP prior to EM TIC020.

View the Details

“With the user, for the user”
Leica Microsystems

Order no.: English 16214002

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IX/10

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