Lantronix xPico 900-619 Integration Manual

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xPico

Embedded Device Server

Integration Guide

Part Number 900-619

Revision L September 2017

Intellectual Property

Lantronix, xPico and DSTni are registered trademarks of Lantronix, Inc. in the United States and other countries. DeviceInstaller is a trademark of Lantronix, Inc.

Patented: http://patents.lantronix.com; additional patents pending.

Wi-Fi is a registered trademark of Wi-Fi Alliance Corporation. Ethertronics is a trademark of Ethertronics, Inc. Wanshih is a trademark of Wanshih Electronic Co., Ltd. Exar is a trademark of Exar Corporation. SEMTECH is a trademark of Semtech Corporation. All other trademarks and trade names are the property of their respective holders.

Contacts

Lantronix, Inc.

7535 Irvine Center Drive Suite 100 Irvine, CA 92618, USA Toll Free: 800-526-8766 Phone: 949-453-3990 Fax: 949-453-3995

Technical Support

Online: www.lantronix.com/support

Sales Offices

For a current list of our domestic and international sales offices, go to the Lantronix web site at www.lantronix.com/about/contact

Disclaimer

All information contained herein is provided “AS IS.” Lantronix undertakes no obligation to update the information in this publication. Lantronix does not make, and specifically disclaims, all warranties of any kind (express, implied or otherwise) regarding title, noninfringement, fitness, quality, accuracy, completeness, usefulness, suitability or performance of the information provided herein. Lantronix shall have no liability whatsoever to any user for any damages, losses and causes of action (whether in contract or in tort or otherwise) in connection with the user’s access or usage of any of the information or content contained herein. The information and specifications contained in this document are subject to change without notice.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

xPico® Embedded Device Server Integration Guide 2

1. Reorient or relocate the receiving antenna.

2. Increase the separation between the equipment and receiver.

3. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

4. Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This device is intended only for OEM Integrators. The OEM integrator should be aware of the following important issues.

Labeling of the End Product (xPico Wi-Fi units only)

The label on the end product incorporating the xPico Wi-Fi module must clearly state that it contains an FCC-approved RF module. Canada and Japan also require a similar statement.

For example, “This product contains RF transmitter ID # (put FCC, IC, and/or Japan module grant numbers here).” The label must include the ID numbers for the regions where the end product is installed. The grant numbers are below.

 xPico Wi-Fi FCC ID number: R68XPICOW

 xPico Wi-Fi IC ID number: 3867A-XPICOW

 xPico Wi-Fi Japan ID numbers: 201-135275

RSS-GEN Sections 7.1.4 and 7.1.5 Statement for Devices with Detachable Antennas (xPico Wi-Fi units only)

This device has been designed to operate with the antennas listed in the Certificate, and having a maximum gain of 2.88 dBi. Antennas not included in this list or having a gain greater than 2.88 dBi are strictly prohibited for use with this device, unless system level FCC approval is gained. The required antenna impedance is 50 ohms.

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that required for successful communication.

Integration Notes (xPico Wi-Fi embedded device server):

 This module is authorized under limited module approval specified to mobile host

equipment. So, the antenna must be installed such that 20cm is maintained between the antenna and users.

 The transmitter module may not be co-located with any other transmitter or antenna.  As long as the two conditions above are met, further transmitter testing will not be

required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed (for example, digital device emission, PC peripheral requirements, etc.)

 In the event that these conditions cannot be met (for example certain laptop

configurations, general purpose PCMCIA or similar cards, or co-location with another transmitter) and obtaining a separate FCC authorization will be required, then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product (including the transmitter).

 Changes or modifications to this device not explicitly approved by Lantronix will void

the user's authority to operate this device.

xPico® Embedded Device Server Integration Guide 3

Note: With the purchase of any xPico family product, the OEM agrees to an OEM

Date

Rev.

Comments

April 2012

Initial release.

September 2012

Updated the reference schematic, mounting instructions and compliance information.

January 2013

Updated xPico pin-out diagram.

July 2013

Updated to include xPico Wi-Fi part information.

August 2013

Updated to include Japanese certification number.

January 2014

Updated reference schematic information.

February 2014

Updated for firmware version 1.1.0.2R10.

June 2014

Updated Lantronix part number information.

December 2014

Updated for firmware version 1.3.0.1.

May 2015

Updated diagram dimensions and RX sensitivity information. Added ISO/IEC Compliance information.

December 2015

Updated part number and module dimension information.

September 2017

Updated compliance information.

firmware license agreement that grants the OEM a non-exclusive, royalty-free firmware license to use and distribute the binary firmware image provided, only to the extent necessary to use the xPico hardware. For further details, please see the xPico OEM firmware license agreement.

Warranty

For details on the Lantronix warranty policy, please go to our Web site at

www.lantronix.com/support/warranty

Revision History

For the latest revision of this product document, please check our online documentation at www.lantronix.com/support/documentation

xPico® Embedded Device Server Integration Guide 4

Table of Contents

Intellectual Property __________________________________________________ 2 Contacts ___________________________________________________________ 2 Disclaimer __________________________________________________________ 2 Warranty ___________________________________________________________ 4 Revision History _____________________________________________________ 4 List of Figures _______________________________________________________ 6 List of Tables ________________________________________________________ 7

1. Introduction 8

About the Integration Guide ____________________________________________ 8 Additional Documentation ______________________________________________ 9

2. Functional Description 10

xPico Features _____________________________________________________ 11 xPico Wi-Fi Features _________________________________________________ 11 xPico Block Diagram _________________________________________________ 13 xPico Wi-Fi Block Diagram ____________________________________________ 14 PCB Interface ______________________________________________________ 15 Mating Connector ___________________________________________________ 19 Antenna Interface (xPico Wi-Fi Units Only) _______________________________ 19 Antenna Placement (xPico Wi-Fi Units Only) ______________________________ 21 Ethernet Interface (xPico Wired Units Only) _______________________________ 21 Serial Interface _____________________________________________________ 23 USB Device Port (xPico Wi-Fi Units Only) ________________________________ 25 LEDs _____________________________________________________________ 26 General Purpose I/O Pins _____________________________________________ 26 Reset Pins _________________________________________________________ 27 Evaluation Board Schematics __________________________________________ 28

3. Mounting Instructions and PCB Footprint 33

To Access CAD Files ________________________________________________ 33 To Install the xPico or xPico Wi-Fi Module ________________________________ 33 Product Information Label _____________________________________________ 38

4. Specifications 39

Electrical Specifications ______________________________________________ 39 Technical Specifications ______________________________________________ 41

A: Compliance (xPico Embedded Device Server) 44

B: Compliance (xPico Wi-Fi Embedded Device Server) 46

xPico® Embedded Device Server Integration Guide 5

List of Figures

Figure 2-1 xPico and xPico Wi-Fi Dimensions and Views ____________________ 12 Figure 2-2 xPico Block Diagram _______________________________________ 13 Figure 2-3 xPico Wi-Fi Block Diagram ___________________________________ 14 Figure 2-4 Reverse-SMA to U.FL(long) (Lantronix Part Number 500-180-R) _____ 20 Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R) ____________ 20 Figure 2-6 Reverse-SMA to U.FL(short) (Lantronix Part Number 500-182-R) ____ 21 Figure 2-7 Ethernet Connection Example (xPico wired unit only) ______________ 23 Figure 2-8 Serial Port Example ________________________________________ 24 Figure 2-9 USB Device Interface Example (xPico Wi-Fi unit only) _____________ 25 Figure 2-10 Evaluation Board Schematic, Part 1 of 5 _______________________ 28 Figure 2-11 Evaluation Board Schematic, Part 2 of 5 _______________________ 29 Figure 2-12 Evaluation Board Schematic, Part 3 of 5 _______________________ 30 Figure 2-13 Evaluation Board Schematic, Part 4 of 5 _______________________ 31 Figure 2-14 Evaluation Board Schematic, Part 5 of 5 _______________________ 32 Figure 3-1 White Mounting Quick Clip Dimensions _________________________ 33 Figure 3-2 Aligning Mounting Clip Legs to Standoff Holes ___________________ 35 Figure 3-3 Mounting Instructions for PEM Standoff _________________________ 36 Figure 3-4 Hirose Connector Layout ____________________________________ 37 Figure 3-5 xPico Product Label ________________________________________ 38 Figure 3-6 xPico Wi-Fi Product Label ____________________________________ 38 Figure A-1 Certificate of Compliance for Halogen Free ______________________ 45

xPico® Embedded Device Server Integration Guide 6

List of Tables

Table 1-1 xPico and xPico Wi-Fi Features _________________________________ 8 Table 2-1 xPico Part Numbers _________________________________________ 10 Table 2-2 xPico and xPico Wi-Fi Pin Connections _________________________ 15 Table 2-3 xPico (wired) PCB Interface Signals ____________________________ 16 Table 2-4 xPico Wi-Fi PCB Interface Signals _____________________________ 17 Table 2-5 xPico Wi-Fi External Antenna Options __________________________ 19 Table 2-6 Ethernet Interface Signals ____________________________________ 21 Table 2-7 Recommended Magnetic Modules

and Combo RJ45/Magnetic Module Connectors ___________________ 22 Table 2-8 xPico and xPico Wi-Fi Serial Port Signals ________________________ 23 Table 2-9 RS232 Connections (Serial Transceiver Required) ________________ 24 Table 2-10 RS422/485 Connections (Serial Transceiver Required) ____________ 24 Table 2-11 USB Host Port Signals ______________________________________ 25 Table 2-12 xPico Wi-Fi Status LED Output Signals _________________________ 26 Table 2-13 xPico Status LED Output Signals _____________________________ 26 Table 2-14 Ethernet Interface xPico Serial Port Signals _____________________ 26 Table 2-15 xPico Reset Signals ________________________________________ 27 Table 4-1 Absolute Maximum Ratings ___________________________________ 39 Table 4-2 xPico Wired Recommended Operating Conditions _________________ 39 Table 4-3 xPico Wi-Fi Recommended Operating Conditions _________________ 40 Table 4-4 xPico Wired Technical Specification ____________________________ 41 Table 4-5 xPico Wi-Fi Technical Specification _____________________________ 42 Table A-1 Electromagnetic Emissions ___________________________________ 44 Table A-2 Electromagnetic Immunity ____________________________________ 44

xPico® Embedded Device Server Integration Guide 7

1. Introduction

Chapter 2 Section

xPico (wired)

xPico Wi-Fi

PCB Interface

Mating Connector

Antenna Interface

Antenna Placement

Ethernet Inteface

Serial Inteface

USB Device Port

LEDs X X

General Purpose IO Pins

Reset Pins X X

Reference Schematic

About the Integration Guide

This user guide provides the information needed to integrate the Lantronix® xPico® embedded device servers into customer-printed circuit boards. This manual is intended for engineers responsible for integrating the xPico embedded device server into their product.

Note: This document includes support for xPico embedded device server

versions XPC100100B-01, XPC100100S-01, XPC100100K-02, XPC10010MB-01 and XPC10010MS-01, and xPico Wi-Fi embedded device server versions XPW100100B-01, XPW100100S-01 and XPW100100K-02. For integration information for the Lantronix xPico Wi-Fi SMT embedded device server modules, XPCW1002 and XPC@10003, please reference document 900-714 xPico Wi-Fi SMT Embedded Device Server Integration Guide.

The sections in chapter 2 provide board schematic and layout recommendations for both xPico (wired) and xPico Wi-Fi® products. Some of the sections apply to xPico (wired) only or xPico Wi-Fi units only. Signals that are unused for a particular product can be left floating. If the application has the potential to use both components as a stuff option it is recommended to follow the design guide for all of the sections. The table below lists which sections are applicable to the xPico (wired) and xPico Wi-Fi products.

Note: “xPico” (wired) refers to the Ethernet-only versions of xPico embedded

device server.

Table 1-1 xPico and xPico Wi-Fi Features

xPico® Embedded Device Server Integration Guide 8

Additional Documentation

Document

Description

Visit the Lantronix web site at www.lantronix.com/support/documentation for the latest documentation and the following additional documentation.

1: Introduction

xPico Wi-Fi SMT Embedded Device Server User Guide

xPico Embedded Device Server User Guide

xPico Wi-Fi Embedded Device Server User Guide

xPico Embedded Device Server Development Kit Quick Start

xPico Embedded Device Server Development Kit User Guide

APS: Modbus Protocol User Guide

DeviceInstaller™ User Guide

Com Port Redirector User Guide

Datasheet for the xPico Wi-Fi W1002 and W1003 SMT modules.

Provides information needed to configure, use, and update the xPico firmware.

Provides information needed to configure, use, and update the xPico Wi-Fi firmware.

Provides the steps for getting the xPico device server up and running.

Provides a detailed description of the xPico evaluation kit hardware

Provides detailed information for installing and operating the IAP device server using our Modbus firmware.

Provides instructions for using the Windows® based utility to configure the xPico and other Lantronix device servers.

Provides information on using the Windows based utility to create a virtual com port.

xPico® Embedded Device Server Integration Guide 9

Part Number

Description

XPC100100B-01

xPico Device Server Module, Extended Temp, AES Encryption, Bulk, RoHS

XPC100100S-01

xPico Device Server Module, Extended Temp, AES Encryption, Sample, RoHS

XPC100100K-02

xPico Device Server Module Development Kit w/ Module, RoHS

XPW100100B-01

xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Module, Extended Temp, Bulk, RoHS

XPW100100S-01

xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Module, Extended Temp, Sample, RoHS

XPW100100K-01

xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Development Kit w/ Module, RoHS

XPC10010MB-01

xPico IAP Device Server Module, Extended Temperature, Modbus, RoHS, Bulk

XPC10010MS-01

xPico IAP Device Server Module, Extended Temperature, Modbus, RoHS, Sample

2. Functional Description

Designed for quick integration with minimal engineering effort, the chip-sized xPico embedded device server provides simplicity and flexibility making it the easiest and fastest networking-enabling module on the market.

xPico and xPico Wi-Fi device servers are extremely compact networking solution that enables Ethernet or Wireless connectivity on virtually any device with a serial interface. The included industry-proven Lantronix device server application and full IP stack allow seamless remote access to device data simplifying design integration while providing robust connectivity.

As one of the smallest embedded device servers in the world, xPico and xPico Wi-Fi embedded device servers can be utilized in designs typically intended for chip solutions. A key difference with the xPico device server is that there is virtually no need to write a single line of code, translating to a much lower development cost and faster time-tomarket.

Table 2-1 xPico Part Numbers

xPico® Embedded Device Server Integration Guide 10

xPico Features

The xPico device server contains Lantronix’s own DSTni® EX controller, with 256 KBytes of SRAM, 16 KBytes of boot ROM, and integrated 10/100 PHY.

The xPico embedded device server also contains the following:

 3.3-volt serial interface  8 Configurable I/O pins  All logic level I/O pins are 5V input tolerant  4-Mbit flash memory  Power supply filters  Reset circuit  +1.8V regulator

Note: The xPico embedded device server does not contain integrated Ethernet

magnetics. An external Ethernet magnetic module and RJ45 Jack is required to interface to a standard 10/100Mbps Ethernet network.

The xPico unit requires +3.3-volt power and is designed to operate in an extended temperature range (see technical data).

2: Functional Description

xPico Wi-Fi Features

The xPico Wi-Fi device server contains Cortex M3 ARM processor with 128KByte of SRAM and 1MByte of embedded Flash memory. The unit also includes an 802.11 b/g/n WLAN radio with a U.FL port for connection to an external antenna.

The xPico Wi-Fi embedded device server also contains the following:

 3.3-volt serial interface  8 Configurable I/O pins  All logic level I/O pins are 5V input tolerant  8-Mbit flash memory (in addition to the 1MByte CPU embedded Flash)  Power supply filters  Reset circuit

Note: xPico Wi-Fi units do not contain an integrated antenna. An external

antenna is required for connection to a WLAN network.

The xPico Wi-Fi embedded device server requires +3.3-volt power and is designed to operate in an extended temperature range (see technical data).

xPico® Embedded Device Server Integration Guide 11

2: Functional Description

xPico Unit

xPico Wi-Fi Unit

Figure 2-1 xPico and xPico Wi-Fi Dimensions and Views

xPico® Embedded Device Server Integration Guide 12

xPico Block Diagram

The following drawing is a block diagram of the xPico embedded device server showing the relationships of the components.

2: Functional Description

Figure 2-2 xPico Block Diagram

xPico® Embedded Device Server Integration Guide 13

xPico Wi-Fi Block Diagram

DC Power

3.3V

8 Mb Serial

Flash

Cortex M3

Processor

To external

USB Device

3.3V

Serial 1

GPIO/SPI

40 Pin Connector

Interface

USB

To external

processor/

logic

To external

LED

SYSTEM LED

RESET/DEFAULTS

WAKE

802.11 b/g/n Chipset

U.FL to external antenna

The following drawing is a block diagram of the xPico Wi-Fi embedded device server showing the relationships of the components.

Figure 2-3 xPico Wi-Fi Block Diagram

2: Functional Description

xPico® Embedded Device Server Integration Guide 14

PCB Interface

Pin#

xPico Wired

xPico Wi-Fi

Pin#

xPico Wired

xPico Wi-Fi

GND

GND 2

GND

CP8

CP8/SPI_CS

4 LED1/LINK

LED1/WLAN_LED

RTS1

RTS1 6

LED0/SPEED

RXD1

RXD1 8

LED2/ACTIVITY

GND

GND 10

TXD1

ETX-

NC 12

ETCT

ETX+

NC 14

LED3/DUPLEX(OUT)

WKUP (IN)

GND

GND 16

CTS1

ERX-

NC 18

ERCT

ERX+

NC 20

SYS_LED

GND

GND 22

Reserved

DDP

RXD2

RXD2 24

Reserved

DDM

TXD2

TXD2 26

CP2/INT

CP2/SPI_INT

CP7

CP7/SPI_SCK

CP3

CP3/MISO

+3.3V

+3.3V 30

CP4

CP4/MOSI

+3.3V

+3.3V 32

CP5

+3.3V

+3.3V 34

CP6

CP1

CP1 36

DEFAULT#(IN)

GND

GND 38

EXT_RESET#(IN)

GND

GND 40

GND

The xPico embedded device servers has a serial interface compatible with data rates up to 921,600 bps (in high-performance mode). The serial signals (RX, TX, RTS, CTS, and all CPs) are 3.3V CMOS logic level and 5V tolerant. The serial interface pins include +3.3V, ground, and reset. The serial signals usually connect to an internal device, such as a UART. For applications requiring an external cable running with RS-232 or RS422/485 voltage levels, the xPico device must interface to a serial transceiver chip. All configurable I/O pins are 3.3V CMOS logic level and 5V input tolerant. The xPico unit requires a mating connector. Customers should layout their PCB for Hirose part number DF40C(2.0)-40DS-0.4V(51).

An external Ethernet magnetic module and RJ45 is required to interface the xPico embedded device server to a standard 10/100Mbps Ethernet network.

An external antenna attached to the xPico Wi-Fi U.FL connector is required to connect to an 802.11b/g/n wireless network.

Shown below is the xPico pin connection diagram highlighting the differences between the xPico and xPico Wi-Fi embedded device server.

2: Functional Description

Table 2-2 xPico and xPico Wi-Fi Pin Connections

xPico® Embedded Device Server Integration Guide 15

2: Functional Description

Signal Name

xPico Pin #

Primary Function

Reset State

Internal Pull-up

Driver Strength

GND

Signal Ground

GND

Signal Ground

CP8

Configurable I/O

Input

Active 56K to 122K

4mA LED1/LINK

Ethernet Link LED, active low

Output

8mA

RTS1

Serial ready to send/ serial transmit enable

Output

2mA

LED0/SPEED

Ethernet speed LED, active low

Output

8mA

RXD1

Serial receive data input 1

Input

Active 56K to 122K

LED2/ACTIVITY

Ethernet Activity LED, active low

Output

8mA GND

Signal Ground

TXD1

Serial transmit data output 1

Output

2mA

TX-

Ethernet transmit differential (neg)

Output TCT

Ethernet transmit center tap

TX+

Ethernet transmit differential (pos)

Output

LED3/DUPLEX

Ethernet Duplex LED, active low

Output

8mA GND

Signal Ground

CTS1

Serial Clear to Send

Input

Active 56K to 122K

RX-

Ethernet receive differential (neg)

Input RCT

Ethernet receive center tap

RX+

Ethernet receive differential (pos)

Input

SYSTEM_LED

System status LED, active high

Input

Active 56K to 122K

4mA GND

Signal Ground

Reserved

Reserved for future use. Do not connect.

RXD2

Serial receive data input 2

Input

Active 56K to 122K

Reserved

Reserved for future use. Do not connect.

TXD2

Serial transmit data output 2

Output

2mA

CP2/INT

Configurable I/O-External interrupt input

Input

Active 56K to 122K

4mA

Table 2-3 xPico (wired) PCB Interface Signals

xPico® Embedded Device Server Integration Guide 16

2: Functional Description

Signal Name

xPico Pin #

Primary Function

Reset State

Internal Pull-up

Driver Strength

CP7

Configurable I/O

Input

Active 56K to 122K

4mA

CP3

Configurable I/O

Input

Active 56K to 122K

4mA 3V3

3.3V Input Power

CP4

Configurable I/O

Input

Active 56K to 122K

4mA 3V3

3.3V Input Power

CP5

Configurable I/O

Input

10K

4mA

3V3

3.3V Input Power

CP6

Configurable I/O

Input

10K

4mA

CP1

Configurable I/O

Input

Active 56K to 122K

4mA

DEFAULT#

Unit reset to default, active

default settings.

Input

Active 56K

GND

Signal Ground

EXT_RESET#

Unit hardware reset, active low. Drive low to reboot unit.

Input

10K GND

Signal Ground

GND

Signal Ground

Signal Name

xPico

Primary Function

Reset

Internal

down

Driver

GND

Signal Ground

GND

Signal Ground

CP8/SPI_CS

Configurable I/O/ SPI Chip Select

Input, floating

30K to 50K

8mA

LED1/WLAN_LED

WLAN Link, active low

Input, floating

30K to 50K

8mA

RTS17

Serial ready to send/ serial transmit enable

Input, floating

30K to 50K

8mA NC 6 No Connect

RXD1

Serial receive data input 1

Input, floating

30K to 50K NC 8 No Connect

GND

Signal Ground

TXD1

Serial transmit data output 1

Input,

30K to 50K

8mA

low. Drive low to reset unit to

to 122K

Table 2-4 xPico Wi-Fi PCB Interface Signals

Pin #

State

Pull-up

Strength

/Pull-

xPico® Embedded Device Server Integration Guide 17

2: Functional Description

Signal Name

xPico

Primary Function

Reset

Internal

down

Driver

floating

No Connect

WKUP4 14

System Wake Up on Rising Edge

Input, floating

30K to 50K GND

Signal Ground

CTS17

Serial Clear to Send

Input, floating

30K to 50K NC

No Connect

SYSTEM_LED

System status LED, active high

Input, floating

30K to 50K

8mA GND

Signal Ground

DDP2 22

USB (positive)

RXD2

Serial receive data input 2

Input, floating

30K to 50K DDM2 24

USB Negative

TXD2

Serial transmit data output 2

Input, floating

30K to 50K

8mA

CP2/INT

Configurable I/O-External interrupt input

Input, floating

30K to 50K

8mA

CP7/SPI_SCK

Configurable I/O/ SPI Clock

Input, floating

30K to 50K

8mA

CP3/MISO

Configurable I/O/SPI Master In-Slave Out

Input, floating

30K to 50K

8mA 3V3

3.3V Input Power

CP4/MOSI

Configurable I/O/ SPI Master Out-Slave In

Input, floating

30K to 50K

8mA 3V3

3.3V Input Power

CP5

Configurable I/O

Input, floating

30K to 50K

8mA 3V3

3.3V Input Power

CP6

Configurable I/O

Input, floating

30K to 50K

8mA

CP1

Configurable I/O

Input, floating

30K to 50K

8mA

DEFAULT#

Unit reset to default, active

Drive low to reset unit to

Input,

30K to 50K

Pin #

State

Pull-up /Pull-

Strength

xPico® Embedded Device Server Integration Guide 18

low.

floating

2: Functional Description

Signal Name

xPico

Primary Function

Reset

Internal

down

Driver

default settings.

GND

Signal Ground

EXT_RESET#

Unit hardware reset, active low. Drive low to reboot unit.

Input

30K to 50K GND

Signal Ground

GND

Signal Ground

Antenna Type

Peak Gain

Lantronix Part

Vendor

Number

PCB Strip Antenna

With tape backing

1.5 to 2.5dBi, 2.39

XPW100A003-01-B

Ethertronics®

1001077

Pin #

State

Pull-up

Strength

/Pull-

Note 1: The xPico Wi-Fi SPI interface supports master only. Slave mode operation will be supported in a future firmware release.

Note 2: The xPico Wi-Fi USB interface is USB 2.0 full speed device. The device interface connector and power interface must be designed into the mating board.

Note 3: xPico and xPico Wi-Fi embedded device servers may be designed into the same socket. Signals listed as no connect on xPico Wi-Fi embedded device server may be connected on an xPico base design board. For example, xPico Wi-Fi pins 11, 12, 13, 17, 18, and 19 may connect to an Ethernet magnetic module as designed for xPico (wired), however, Ethernet will not be available on those pins for xPico Wi-Fi.

Note 4: Pin 14 is the Ethernet duplex LED output on xPico (wired) and the system wakeup input on xPico Wi-Fi. For board designs supporting both xPico (wired) and xPico Wi-Fi, a zero ohm resistor or removable jumper stuff option should be used to disconnect any on-board logic driving pin 14 when xPico (wired) unit is installed.

Note 5: The CP pins can be configured as pull-up or pull-down. T he WKUP pi n is not configurable and is always pull-down.

Note 6: The IO pins on xPico Wi-Fi embedded device server are configured as floating-input on reset until configured by firmware. For applications requiring a high signal on power up, an external pull-up may be required or removeable jumper.

Note 7: It is highly recommended to connect RTS and CTS for serial port 1.

Note: For integration information for Lantronix xPico Wi-Fi SMT embedded

device server modules, XPC W1002 and XPC W1003 please reference the 900714 xPico Wi-Fi SMT Integration Guide.

Mating Connector

The mating connector for the xPico and xPico Wi-Fi module is Hirose part number DF40C (2.0)-40DS-0.4V (51). Special care must be taken when mating and unmating the module to the mating connector. Refer to the Hirose DF40 data sheet below for proper connector mating and unmating, along with the proper connector footprint.

Mating connector data sheet: http://www.hirose.co.jp/cataloge_hp/e68440018.pdf

Antenna Interface (xPico Wi-Fi Units Only)

The xPico Wi-Fi module has been certified using the external antennas listed below. Per FCC guidelines, the xPico Wi-Fi certification remains valid if using an antenna of similar type to the antennas below. If using an antenna of similar type to one of the antennas below, but from a different manufacturer part number the antenna gain must be equal to or less than specified in the table. Consult with your certification lab for more details.

Table 2-5 xPico Wi-Fi External Antenna Options

with 50mm cable to U.FL connector

Typical

Ghz to 2.49 Ghz

Number

(50 piece bulk pack)

Part

xPico® Embedded Device Server Integration Guide 19

2: Functional Description

Antenna Type

Peak Gain

Lantronix Part

Vendor

Number

PCB Strip Antenna

Without tape backing

1.5 to 2.5dBi, 2.39

Ethertronics

1000668

Swivel type antenna,

2 dBi, 2.4 Ghz to

Ghz

930-033-R-ACC

Wanshih

WSS002

with 50mm cable to U.FL connector

with RP-SMA(M) connector

Typical

Ghz to 2.49 Ghz

2.5 Ghz, 2 dBi,

5.15 Ghz to 5.85

Number

(50 piece bulk pack)

Part

Note: The PCB strip antenna is available from Ethertronics, Inc. with or without

adhesive tape backing for mounting to a plastic case. For the component without tape backing a non-conductive double sided adhesive tape can be used to fix the antenna in place. The Ethertronics part numbers listed above come with a 50mm U.FL cable attached to the PCB strip antenna. The 50mm cable length is the minimum allowed cable length for use with the xPico Wi-Fi embedded device server. For similar PCB strip antennas with longer cables consult with Ethertronics, Inc. (www.ethertronics.com).

Lantronix provides a U.FL to Reverse SMA antenna cable in with the evaluation board and sample kits for development work. These cables can be purchased from Lantronix for production or supplied by an RF cable manufacturer. External antennas can be purchased from the antenna vendor. Components for cable design should be selected for low loss over the entire 2.4Ghz to 5.9Ghz signal range. The cable target impedence should be 50 ohms.

Figure 2-4 Reverse-SMA to U.FL(long) (Lantronix Part Number 500-180-R)

Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R)

xPico® Embedded Device Server Integration Guide 20

Figure 2-6 Reverse-SMA to U.FL(short) (Lantronix Part Number 500-182-R)

Signal Name

DIR

Contact

Primary Function

Signal Requirement

TX+

Out

Differential Ethernet transmit data +

100 ohm differential with TX-

TX-

Out

Differential Ethernet transmit data -

100 ohm differential with TX+

RX+

Differential Ethernet receive data +

100 ohm differential with RX-

RX-

Differential Ethernet receive data -

100 ohm differential with RX+

TCT

Ethernet transmit center tap connection

Route > 20 mil width

RCT

Ethernet receive center tap connection

Route > 20 mil width

Antenna Placement (xPico Wi-Fi Units Only)

When designing the xPico Wi-Fi module to a mating board, it is important to consider the final installation of the unit and its location with respect to connecting access points. The antenna should be placed so that it has as clear as possible path to the connecting access point for maximum range. Avoid placing the antenna such that it is blocked by metal walls or ground planes of adjacent circuit boards.

2: Functional Description

Ethernet Interface (xPico Wired Units Only)

The xPico embedded device server integrates an internal 10/100Mbps Ethernet MAC and PHY. An external magnetic module and RJ45 is required in order to connect to a standard 10/100Mbps Ethernet network.

Table 2-6 Ethernet Interface Signals

The xPico embedded device server provides a 10/100 Mbps Ethernet interface for connection to an external network through external magnetics and an external RJ45. The table below lists several magnetic modules and combination RJ45/magnetic jacks that can be used with the xPico unit.

xPico® Embedded Device Server Integration Guide 21

2: Functional Description

Type

Manufacturer

Part Number

Magnetic only (requires RJ45)

BI-Tech

HS91-011-80LFTR

Magnetic only (requires RJ45)

Mingtek

HN0013SG

Combination RJ45/Magnetic

Belfuse

08B0-1D1T-06-F

Combination RJ45/Magnetic

Midcom

MIC2411D-0117T-LF3

Magnetic for POE

PULSE

HX2019

Table 2-7 Recommended Magnetic Modules

and Combo RJ45/Magnetic Module Connectors

The Ethernet differential pair signals, ERX-/ERX+ and ETX-/ETX+ should be routed as 100-ohm differential pairs on a layer next to the signal ground plane. The use of vias on these signals should be minimized. The center tap signal connections between the magnetic and xPico (wired) module are required. Center tap signals RCT and TCT should be routed with at least 20 mil trace thickness. The area between the magnetic module and RJ45 jack, including the area under both, should be voided of all signals and planes, except for the signals connecting to both. The signals connecting between the RJ45 and magnetic are required to be isolated by 1500Vrms from all other signals and planes, including chassis and signal ground. The connector shield should be connected to chassis. It is recommended that 1206 resistor pads from chassis ground to signal ground be placed next to each of the shield tabs. The resistor pads allow for 0 ohm jumper, ferrite beads, or decoupling caps to be installed as needed for EMI/EMC improvement.

The Ethernet LED signals should be routed to discrete LEDs or to the LED pins on the RJ45 through 220 ohm or larger resistors. The LED signals are active low. The Ethernet LED signals should be isolated from the signals that connect between the RJ45 and magnetic module.

Also shown in the reference schematic is a recommended TVS array that can be used to improve ESD and EFT in harsh environments. The device shown is Semtec RCIamp0502A. This device features route through pin assignments allowing for the Ethernet differential signal pairs to be routed without altering the trace impedance or adding vias. Due to this routing, the device could be installed or depopulated as needed.

See the Lantronix app note, How to Connect a Lantronix Embedded Module to a Wired Ethernet Port for more details on Ethernet connection and routing,

http://www.lantronix.com/pdf/appnotes/Connect-LTRX-Embed-Module-to-WiredEthernet_AN.pdf.

The xPico module can also be powered from POE using a POE magnetic and POE powered device controller. Lantronix uses the Silabs, Si3402 POE controller to power the xPico development board via POE. If using POE the Ethernet magnetic module should be changed to a POE compatible module such as Pulse HX2019.

Refer to the evaluation board schematic in the xPico-DevKit_UG for an example circuit.

http://www.lantronix.com/pdf/xPico-DevKit_UG.pdf

Refer to the SiLabs data sheet for Si3402 for more information on using the SiLabs POE controller.

xPico® Embedded Device Server Integration Guide 22

Serial Interface

Signal

Description

Reset State

TXD1 10

Serial Transmit Data output

Output

RTS1

Serial Ready-to-Send / Serial Transmit enable

Output

RXD1 7

Serial Receive Data input

Input

CTS1 16

Serial Clear-to-Send

Input

TXD2 25

Serial Transmit Data output 2

Output

RXD2 23

Serial Receive Data input 2

Input

2: Functional Description

Figure 2-7 Ethernet Connection Example (xPico wired unit only)

The xPico and xPico Wi-Fi embedded device servers have two external serial interfaces. The signal levels on the serial interface are 3.3V logic level with 5V tolerant inputs. The serial interfaces require an external transceiver in order to connect to external RS232, RS485, or RS422 networks. The signals of Serial Port 1 may be connected as shown in the reference schematic, Figure 2-8 serial port example, below. The transceiver shown in the reference schematic is of type Exar, part number SP336. This transceiver is a multiprotocol RS232, RS485, RS422 transceiver. Single protocol transceivers may be used as required. The xPico interface may also be directly connected to the UART

interface of an external CPU. Serial Port 2 is a three wire interface only. It operates like Serial Port 1, except it does not support hardware Flow Control (i.e. no RTS/CTS) and modem control (i.e. no DTR/DCD). It is highly recommended to connect RTS and CTS for serial port 1.

Table 2-8 xPico and xPico Wi-Fi Serial Port Signals

xPico® Embedded Device Server Integration Guide 23

Figure 2-8 Serial Port Example

xPico Signal

DCE Connector

DTE Connector

Signal (Logic)

Description

DB9

DB25

Signal

DB9

DB25

Signal

RXDx

Data In

2 3 RXDx

3 2 TXDx

TXDx

Data Out

3 2 TXDx

2 3 RXDx

RTSx

H/W Flow Control Output

7 4 RTSx

8 5 CTSx

CTSx

H/W Flow Control Input

8 5 CTSx

7 4 RTSx

CPx

Modem Control Input

1 8 DCDx

DTRx

CPy

Modem Control Output

DTRx

1 8 DCDx

xPico

(logic)

Description

RS485

DB25 4

DB25 2

DB9 4

DB9 2

TXDx

Data Out

TX+485

14 7 7

TXDx

Data Out

TX-485

15 3 3

RXDx

Data In

RX+485

14 2 7

RXDx

Data In

RX-485

15 8 3

RTSx

TX Enable

CPx

RS485 Select

CPy

RS485 2-wire

2: Functional Description

Signal

Table 2-9 RS232 Connections (Serial Transceiver Required)

Table 2-10 RS422/485 Connections (Serial Transceiver Required)

Signal

Wire

wire

Note: The IO pins for xPico Wi-Fi embedded device server are set to floating

input on power up until configured by unit firmware. An external 100K ohm pullup may be required on the serial transmit signal to prevent downstream UART devices from detecting false characters on initial power up.

xPico® Embedded Device Server Integration Guide 24

USB Device Port (xPico Wi-Fi Units Only)

The xPico Wi-Fi embedded device server has one USB2.0 Full Speed Device port interfaces for connection to an upstream USB device. The port consists of a differential pair, signals DDP and DDM. These signals should be routed as a 90 ohm differential pair on a signal layer next to the signal ground plane. The use of vias should be minimized on these signals. The USB signals can be connected to a USB Mini Type B USB port (as shown in Table 2-12) directly to an IC with a USB host port. If connecting to an external port that is user accessible it is recommended to add a TVS diode array to the signal nets for ESD protection. The ESD array shown in the figure is of type Semtech RCIamp0502A. This device features through pin routing to minimize trace impedance changes and simplify routing. The footprint for the TVS array can be added to the PCB and the part can be depopulated if it is not needed. It is recommended that the power drawn off the USB Mini Type B connector be limited to less than 500mA per USB requirements. If the USB device port is unused the DDP and DDM pins may be left unconnected.

Table 2-11 USB Host Port Signals

2: Functional Description

Pin Name Description Connector

Pins

Signal Requirement

Mini Type B USB Device connector pin

DDP USB Device Port

Positive pin

DDM USB Device Port

Negative pin

5V 5V power from USB

cable

Ground Signal Ground Ground Ground plane 5

Figure 2-9 USB Device Interface Example (xPico Wi-Fi unit only)

22 Route as 90 ohm

differential pair with DDM signal

24 Route as 90 ohm

differential pair with DDP signal

Current limit to 500

mA per port

xPico® Embedded Device Server Integration Guide 25

LEDs

Signal

Description

LED1/WI-FI LED

WI-FI Status LED, active low

SYSTEM_LED 20

System status LED, active high

Signal

Description

LED0/SPEED

Ethernet speed LED, active low

LED1/LINK

Ethernet Link LED, active low

LED2/ACTIVITY 8

Ethernet Activity LED, active low

LED3/DUPLEX 14

Ethernet Duplex LED, active low

SYSTEM_LED 20

System status LED, active high

Signal

Description for xPico Wired

Description xPico Wi-Fi

Reset State

CP1 35

Configurable I/O

Input

CP2/INT

input

CP3 28

Configurable I/O

Configurable I/O-SPI MISO

Input

CP4 30

Configurable I/O

Configurable I/O-SPI MOSI

Input

CP5 32

Configurable I/O

Input

CP6 34

Configurable I/O

Input

CP7 27

Configurable I/O

Configurable I/O-SPI Clock

Input

CP8

Configurable I/O

Configurable I/O-SPI Chip Select

Input

2: Functional Description

The xPico embedded device server contains several external signals that are intended to drive external status LEDs. The LEDs are listed below. The signals may be connected as shown in the reference schematic figure below.

Note: The System LED usually remains on. When the Default button is pressed

for 5-6 seconds, the System LED starts blinking every second to indicate the default button can be released to complete resetting the unit to factory default. The unit reboots after release of the Default button. A lit WLAN LED indicates the STA interface is associated with an access point.

Table 2-12 xPico Wi-Fi Status LED Output Signals

Table 2-13 xPico Status LED Output Signals

General Purpose I/O Pins

xPico and xPico Wi-Fi unit contains eight pins which may be used as configurable inputs or outputs. Listed below are the configurable I/O pins. These pins are 3.3V CMOS logic level and 5V input tolerant.

Table 2-14 Ethernet Interface xPico Serial Port Signals

26 Configurable I/O-External interrupt

Note 1. For xPico Wi-Fi 5V tolerant pins, in order to sustain a voltage higher than Vcc+0.3, the internal pull-up/ pull-down resistors must be disabled.

Configurable I/O-SPI interrupt

Input

xPico® Embedded Device Server Integration Guide 26

Reset Pins

Signal

Description

Reset State

Internal pull-up

EXT_RESET#

Unit hardware reset, active low. Assert

be left floating.

Input

10K (xPico unit)

DEFAULT#

Unit reset to default, active low.

established.

Input

Active 56K to

WAKE (xPico

Toggle signal from low to high can wake

configuration settings.

Input

40K

The xPico and xPico Wi-Fi embedded device servers have two signals for use as reset signals. Signal EXT_RESET# is a hardware controlled input signal that will reboot the xPico processor when asserted low. Signal DEFAULT# is polled by the xPico software. When DEFAULT# is asserted low for six seconds, the unit will reset the system to the default manufacturing settings and reboot the unit. xPico Wi-Fi embedded device server has an additional signal on pin 14 that can be used to wake up the unit processor when the unit is in a sleep or power down state.

2: Functional Description

Table 2-15 xPico Reset Signals

Wi-Fi unit only)

low for a minimum of 50 milliseconds, then release to reboot unit. Signal may

• For wired xPico units Drive low and reboot the device to reset unit to factory defaults.

• For xPico Wi-Fi units While device is running, drive low for greater than 6 seconds, then release to reset unit to factory defaults. While device is held in reset, drive low, release reset to boot device with Line 1 CLI default settings (original configuration is preserved), then release after CLI session is

device from Sleep or Standby mode. Hold low to allow device to enter Sleep or Standby mode. Subject to

40K (xPico Wi-Fi unit)

122K (xPico unit) 40K (xPico Wi-Fi unit)

xPico® Embedded Device Server Integration Guide 27

2: Functional Description

xPico® Embedded Device Server Integration Guide 28

Evaluation Board Schematics

Figure 2-10 Evaluation Board Schematic, Part 1 of 5

2: Functional Description

xPico® Embedded Device Server Integration Guide 29

Figure 2-11 Evaluation Board Schematic, Part 2 of 5

2: Functional Description

xPico® Embedded Device Server Integration Guide 30

Figure 2-12 Evaluation Board Schematic, Part 3 of 5

2: Functional Description

xPico® Embedded Device Server Integration Guide 31

Figure 2-13 Evaluation Board Schematic, Part 4 of 5

2: Functional Description

xPico® Embedded Device Server Integration Guide 32

Figure 2-14 Evaluation Board Schematic, Part 5 of 5

3: Mounting Instructions and PCB Footprint

3. Mounting Instructions and PCB Footprint

The xPico embedded device server dimensions and mounting instructions are shown in the following drawings below. You may also directly access the CAD files through the Lantronix website.

Note: The mounting instructions in this section are applicable to both the xPico

and the xPico Wi-Fi embedded device servers though the xPico pictures below are used to demonstrate installation.

For temperature environments up to +85° Celsius, it is recommended that the mating PCB have its outer layers flooded with signal ground and a heat pad be placed between the module and mating PCB. The recommended heat pad is Lantronix part number XPC100A002-01-B. The ground flooding and heat pad are only required for xPico Wi-Fi units in environments above +70°C. For environments below +70°C the heat pad and ground flooding are not required.

To Access CAD Files

1. Go to http://www.lantronix.com/products/cad-visio.html.

2. Click Download CAD files here to access the Registration Form.

Figure 3-1 White Mounting Quick Clip Dimensions

xPico® Embedded Device Server Integration Guide 33

3: Mounting Instructions and PCB Footprint

Module/Mounting

White

Module

To Install the xPico or xPico Wi-Fi Module

In the xPico embedded device server development kit (part number XPC100100K-02) and xPico Wi-Fi development kit (XPW100100K-01), the xPico module comes installed to the xPico Evaluation Board via the connector J1 (Hirose component). If ordered separately, you may need to install it by following the directions below. The included white Mounting Quick Clip is used to align and fasten the module to the evaluation board.

1. Place the module into the white mounting clip, lining up the clip legs and the four module grooves so that the module is seated inside the white clip. For xPico Wi-Fi unit connect the RF cable to the module U.FL connector prior to installing the Quick Clip.

Mounting Clip

xPico/xPico Wi-Fi

2. Push the legs of the white clip inward to secure the module to the clip.

3. Flip over the module/mounting clip combination so that the product label displays on top and the white mounting clip legs are pointed downward.

4. For xPico Wi-Fi embedded device server high temperature operation, above +70C, it is recommended to place a heat pad between the module and the adjacent PCB. The recommended heat pad is Lantronix part number XPC100A002-01-B (available in a 50 piece bulk pack).

5. Place the module/mounting clip combination so that the four mounting clip legs align with the four standoff holes on the board surrounding the J1 connector (see Figure 3-2). Make sure to properly orientate the module/mounting clip combination on the board, so that the J1 connector/Hirose component is properly aligned.

Clip Combination

xPico® Embedded Device Server Integration Guide 34

3: Mounting Instructions and PCB Footprint

Figure 3-2 Aligning Mounting Clip Legs to Standoff Holes

6. Insert the white clip legs furthest from the J1 connector first and gently push down on the xPico module above the J1 connector. Keep the module as level as possible during installation.

Note: When removing the xPico embedded device server from the evaluation

board, gently tug the module. Do not use excessive force or attempt to remove the xPico module by grasping and pulling the module from the short end opposite the module connector as this may cause damage to the J1 evaluation board connector.

xPico® Embedded Device Server Integration Guide 35

3: Mounting Instructions and PCB Footprint

Figure 3-3 Mounting Instructions for PEM Standoff

xPico® Embedded Device Server Integration Guide 36

3: Mounting Instructions and PCB Footprint

Figure 3-4 Hirose Connector Layout

xPico® Embedded Device Server Integration Guide 37

Product Information Label

Part Number

Date Code

Product Model

Country of Origin

Revision

MAC Address

Product Model

FCC Radio ID

Part Number

Japan Radio Equipment Mark

Japan Telecommunication Mark

Canada Radio ID

Manufacturing Date Code

Revision Number

The product information label contains important information about your specific unit, such as its part number, revision, manufacturing date code, product model, country of origin, datamatrix barcode and MAC address.

3: Mounting Instructions and PCB Footprint

Figure 3-5 xPico Product Label

Manufacturing

Lantronix

Datamatrix

Barcode

Figure 3-6 xPico Wi-Fi Product Label

Japan Certification Number

Lantronix Datamatrix Barcode

xPico® Embedded Device Server Integration Guide 38

Serial Number Country of Origin

4. Specifications

Parameter

Symbol

Min

Max

Units

Supply Voltage

VCC 0 3.6

Vdc

Operating Temperature

-40

°C

Storage Temperature

-40

°C

Parameter

Symbol

Min

Typical

Max

Units

Supply Voltage

VCC

3.15

3.3

3.46

Vdc

Supply Voltage Ripples

CC_PP

100 BaseTX Active (Normal CPU Speed)

ICC

200

10 BaseT Active (Normal CPU Speed)

ICC

220

No Link (Normal CPU Speed)

ICC

150

100 BaseTX Active (High CPU Speed)

ICC

240

10 BaseT Active (High CPU Speed)

ICC

260

No Link (High CPU Speed)

ICC

190

100 BaseTX Active (Low CPU Speed)

ICC

170

10 BaseT Active (Low CPU Speed)

ICC

190

No Link (Low CPU Speed)

ICC

120

Supply Reset Threshold

RST

2.7

Vdc

CPx Pull-ups, except CP5, CP6

RPU

56 122

Kohm

CP5,CP6 Pull-up

RPU 10 Kohm

CPx, RX Input Low Voltage

0.8

Vdc

CPx, RX Input High Voltage

2 5.5

Vdc

CPx, TX Output Low Voltage (IOL = 4 mA)

0.4

Vdc

CPx, TX Output High Voltage (IOH = -4 mA)

2.4

Vdc Reset Pin Low Voltage

VRES_IL

0.36

Vdc

Reset Pin High Voltage

VRES_IL

2.0 3.46

Vdc

Electrical Specifications

Caution: Stressing the device above the rating listed in this table may cause

permanent damage to the xPico embedded device server. Exposure to Absolute Maximum Rating conditions for extended periods may affect the xPico unit’s reliability. For xPico Wi-Fi operation above +70° Celsuis, it is recommended that a heat pad be placed between the module and mating PCB.

4: Specifications

Table 4-1 Absolute Maximum Ratings

Table 4-2 xPico Wired Recommended Operating Conditions

CP_IL

CP_IH

xPico® Embedded Device Server Integration Guide 39

CP_OL

CP_OH

Table 4-3 xPico Wi-Fi Recommended Operating Conditions

Parameter

Symbol

Min

Typical

Max

Units

Supply Voltage

VCC

3.15

3.3

3.46

Vdc

Supply Voltage Ripples

CC_PP

TX Power @ 16.5dBm, 802.11b, 11Mbps

ICC

330

380

TX Power @ 15dBm, 802.11g, 6Mbps

ICC

300

345

TX Power @ 13dBm, 802.11g, 54Mbps

ICC

255

295

TX Power @ 14.5dBm, 802.11n, MCS0

ICC

290

335

TX Power @ 12dBm, 802.11n, MCS7

ICC

230

265

RX Power @ 802.11b, 11Mbps

ICC

125

150

RX Power @ 802.11g, 54Mbps

ICC

125

150

RX Power @ 802.11n, MCS7

ICC

125

150

Power Management State 1 @ 25°C

ICC

μA

Power Management State 1 @ +85°C

ICC

μA

Power Management State 1 @ -40°C

ICC

μA

Supply Reset Threshold

RST

Vdc

CPx Pull-ups/ Pull-downs

RPU

Kohm

CPx, RX Input Low Voltage

-0.3 0.75

Vdc

CPx, RX

(1)

Input High Voltage

2 5.5

Vdc

CPx, TX Output Low Voltage (IOL = 4 mA)

0.4

Vdc

CPx, TX Output High Voltage (IOH = -4 mA)

2.4

Vdc Reset Pin Low Voltage

VRES_IL

-0.3 0.8

Vdc

Reset Pin High Voltage

VRES_IL

2 Vcc+0.3

Vdc

4: Specifications

CP_IL

CP_IH

CP_OL

CP_OH

Note 1. For xPico Wi-Fi 5V tolerant pins, in order to sustain a voltage higher than Vcc+0.3, the internal pullup/pull-down resistors must be disabled.

xPico® Embedded Device Server Integration Guide 40

Technical Specifications

Lantronix xPico 900-619 Integration Manual

Specifications and Main Features

Frequently Asked Questions

User Manual