Lantronix Micro125 Integration Manual

Micro125
Embedded Device Server
Integration Guide
Part Number 900-587
Revision C December 2015
Copyright and Trademark
Date
Rev.
Comments
March 2011
A
Initial Release
April 2011
B
Updated serial interface information.
C
Updated reset input tolerance information.
© 2015 Lantronix, Inc. All rights reserved. No part of the contents of this publication may be transmitted or reproduced in any form or by any means without the written permission of Lantronix. Printed in the United States of America.
Lantronix is a registered trademark of Lantronix, Inc. in the United States and other countries. DeviceInstaller is a trademark of Lantronix, Inc.
Patented: patents.lantronix.com Ethernet is a trademark of XEROX Corporation. UNIX is a registered trademark of The
Open Group. Windows is a trademark of Microsoft Corporation.
Contacts
Lantronix Corporate Headquarters
7535 Irvine Center Drive Suite 100 Irvine, CA 92618, USA Toll Free: 800-526-8766 Phone: 949-453-3990 Fax: 949-453-3995
Technical Support Online: www.lantronix.com/support
Sales Offices For a current list of our domestic and international sales offices go to the Lantronix web
site at www.lantronix.com/about/contact
Disclaimer and Revisions
; Additional patents pending.
.
Operation of this equipment in a residential area is likely to cause interference, in which case the user, at his or her own expense, will be required to take whatever measures may be required to correct the interference.
Changes or modifications to this device not explicitly approved by Lantronix will void the user’s authority to operate this device.
The information in this guide may change without notice. The manufacturer assumes no responsibility for any errors which may appear in this guide.
December 2015
Contents
Copyright and Trademark ............................................................................................. 2
Contacts ........................................................................................................................ 2
Disclaimer and Revisions .............................................................................................. 2
List of Figures ................................................................................................................ 4
List of Tables ................................................................................................................. 4
1: Introduction 5
Embedded Integration Kits ............................................................................................ 5
About the Integration Guide .......................................................................................... 5
Chapter Summaries ...................................................................................................... 6
Additional Documentation ............................................................................................. 6
2: Description and Specifications 7
The Micro125 ................................................................................................................ 7
Layout and Dimensions ................................................................................................ 8
Connectors .................................................................................................................... 9
Ethernet Interface ........................................................................................................ 10
Status LEDs ................................................................................................................ 11
Product Information Label ........................................................................................... 12
Technical Specifications ............................................................................................. 12
3: Integration Guidelines 14
Power Supply .............................................................................................................. 14
Network Connector ..................................................................................................... 14
Virtual Ground ............................................................................................................. 15
Serial Signals .............................................................................................................. 15
Additional Emission Improvements ............................................................................. 15
4: Test Bed 16
Board Layout ............................................................................................................... 16
Test Bed Connectors .................................................................................................. 17
A: Compliance and Warranty Information 18
Compliance Information .............................................................................................. 18
RoHS Notice ......................................................................................................... 19
Warranty ...................................................................................................................... 19
List of Figures
Figure 2-1 Micro125 Board Layout ............................................................................................................... 8
Figure 2-2 Micro125 Top View ...................................................................................................................... 8
Figure 2-3 Micro125 Connector End View .................................................................................................... 9
Figure 2-4 Micro125 Connectors .................................................................................................................. 9
Figure 2-5 RJ45 Ethernet Connector .......................................................................................................... 10
Figure 2-6 Micro125 Status LEDs ............................................................................................................... 11
Figure 2-7 Product Label ............................................................................................................................. 12
Figure 3-1 Multi-Layer Board Strategy ........................................................................................................ 15
Figure 4-1 Carrier Board ............................................................................................................................. 16
Figure 4-2 Pin Configurations ..................................................................................................................... 17
List of Tables
Table 1-1 Micro125 Part Num ber s ................................................................................................................ 5
Table 2-1 Micro125 Connector Pinouts ...................................................................................................... 10
Table 2-2 Micro125 Status LEDs ................................................................................................................ 11
Table 2-3 Micro125 Technical Specifications ............................................................................................. 12
Table 4-1 Micro125 Test Bed Connectors .................................................................................................. 17
Part Number
Description
MO00AA003-01R
Micro125, No RJ45 connector, No LEDS, with TTL pin header, RoHS
MO00AA0E3-01R
AES Encrypted Micro125, No RJ45 connector, No LEDS, with TTL pin header, RoHS
MO11AA003-01R
Micro125 with RJ45 connec tor, LEDS, with TTL pin header, RoHS
MO11AA0E3-01R
AES Encrypted Micro125 with RJ45 connector, LEDS, with TTL pin header, RoHS
MO22AA003-01R
Micro125, Pin header for Ethernet, Pin header for LED connection, with TTL pin header, RoHS
MO22AA0E3-01R
AES Encrypted Micro125, Pin header for Ethernet, Pin header for LED connection, with TTL pin header, RoHS
1: Introduction
Embedded Integration Kits
The Embedded Integration Kit provides a simple method of evaluating our Micro125 embedded device server. This product allows software engineers to test our device servers with their products prior to the hardware development of those products.
Each kit contains an embedded device server, board carrier unit, and all the connectors needed to interface our product with your serial device.
The Embedded Integration Kits include the following:
An embedded device server: Micro125 Board carrier unit with serial (DB9) interface. (Some carriers also have RJ45
Ethernet)
Power supply CAT5 Ethernet cable, RJ45M/M, 10-foot 10-foot serial cable, DB9 (cable end depends on kit) DB9 to DB-25 converter
About the Integration Guide
This guide provides the information needed to install and test the Micro125 embedded device server on the Evaluation Board. The intended audience is the engineer responsible for integrating the device server into your product.
This document covers the following Micro125 Device Server part numbers:
Table 1-1 Micro125 Part Numbers
Chapter Summaries
Chapter
Description
2: Description and
Specifications
Describes and provides information about the Micro125
device server.
3: Integration Guidelines
Provides general guidelines to help you integrate the
Micro125 board into your design.
4: Test Bed
Describes the board layout and connectors of the test bed.
A: Compliance and Warranty
Information
Describes the compliance and warranty information.
Document
Description
Micro125 User Guide
Provides information needed to configure, use, and update the Micro125 firmware.
Device Installer User Guide
Provides instructions on using the Windows-based uti lity used to configure Lantronix embedded device servers.
Com Port Redirector User Guide
Provides information on using the Window s-ba sed uti lity to create a virtual com port.
The remaining chapters in this guide include:
Additional Docume ntation
1: Introduction
Visit the Lantronix website at www.lantronix.com/support/documentation for the latest documentation and the following additional documentation.
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