Lanner LVC-2000 User Manual

In-Vehicle Computing

Hardware Platforms for mobile applications

LVC-2000
Preliminary

User's Manual

>>

Publication date:2014-10-13

About

About

Overview

Icon Descriptions

The icons are used in the manual to serve as an indication
of interest topics or important messages. Below is a
description of these icons:

NOTE: This check mark indicates that

there is a note of interest and is something
that you should pay special attention to
while using the product.

Online Resources

The listed websites are links to the on-line product
information and technical support.

Resource Website

Lanner http://www.lannerinc.com

Product Resources http://assist.lannerinc.com

WARNING: This exclamation point

indicates that there is a caution or
warning and it is something that could
damage your property or product.

Acknowledgement

Intel, Pentium and Celeron are registered trademarks of
Intel Corp.

Microsoft Windows and MS-DOS are registered trademarks
of Microsoft Corp.

All other product names or trademarks are properties of
their respective owners.

Compliances and Certification

CE Certication

This product has passed the CE test for environmental
specifications. Test conditions for passing included the
equipment being operated within an industrial enclosure.
In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly
recommend the use of CE-compliant industrial enclosure
products.

FCC Class A Certication

This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required
to correct the interference at his own expense.

RMA http://eRMA.lannerinc.com

Copyright and Trademarks

This document is copyrighted, © 2014. All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.

No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original
manufacturer assumes no responsibility for its use, nor for
any infringements upon the rights of third parties that
may result from such use.

Embedded and Industrial Computing

e Mark Certication

E13 - Luxembourg

2

About

About

Mechanical compliance

Low Pressure (Altitude):

• MIL-STD-810G, Method 500.5, Procedure I (Storage)

• MIL-STD-810G, Method500.5, Procedure II

(Operational)

High Temperature:

• MIL-STD-810G, Method 500.5, Procedure I (Storage)

• MIL-STD-810G, Method500.5, Procedure II

(Operational)

Low Temperature:

• MIL-STD-810G, Method 500.5, Procedure I (Storage)

• MIL-STD-810G, Method500.5, Procedure II

(Operational)

Temperature Shock:

MIL-STD-810G, Method 503.5, Procedure I-C

General Vibration (Operating):

MIL-STD-810G, Method 514.6, Procedure I, Category4,
Figure 514.6C-1 (Common Carrier, US Highway Truck
Vibration Exposure)

Revision History

General Vibration (Non-operating):

MIL-STD-810G, Method 514.6, Procedure I, Category 24,
Figure 514.6E-1 (General Minimum Integrity)

Shock (Operating):

MIL-STD-810G, Method 516.6, Procedure I (Functional Test
for Ground Equipment)

Shock (Non-operating):

MIL-STD-810G, Method 516.6, Procedure V (Crash Hazard
Shock Test for Ground Equipment)

Transit Drop:

MIL-STD-810G, Method 516.6, Procedure IV (Transit Drop)

Embedded and Industrial Computing

3

TTaTTable of Contentsbeable of Contents

Chapter 1: Introduction 5

System Specications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Package Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Chapter 2: System Components 7

System Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Block Diagram: The MainBoard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Front Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Rear Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Chapter 3: Board Layout 11

External Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Internal Connectors and Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Internal Connectors and Jumpers (backside) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Connectors and Jumpers List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Chapter 4: Hardware Setup 20

Preparing the Hardware Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

HDD Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

mSATA Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Wireless Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

3G SIM Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Connecting Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Chapter 5: The Flow Chart 23

Appendix A: Using the Ignition System Manager (ISM) 24

Appendix B: Digital Input/Output 25

Appendix C: Accessing the Digital Accelerometer Data from the LVC-2000 31

Appendix D: Accessing the GPS Data from the LVC-2000 32

Appendix E: Programming System Watchdog Timer of the LVC-5000 34

Appendix F: Terms and Conditions 41

Warranty Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

RMA Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

4

Chapter 1

Chapter 1:
Introduction

Introduction

Thank you for choosing the LVC-2000.

The LVC-2000 is a compact in-vehicle computing system
designed with support for wall mount 1 and it has a
vibration kit built in for eliminating shock and vibration,
ideal for deployment and installation on moving
transportation vehicles.

The system is equipped with the newest 22nm process
Intel® Atom™ processor E3845 family (formerly
codenamed Bay Trail). This system-on-chip (SoC)
incorporates up to four cores and supports system
memory DDR3L-1066/1333 SO-DIMM maximum up to 8
GB. This small form factor is capable of operating under
wide temperatures from -20°C to +60°C in fanless
operation, which allows the system to operate in rugged
environments. Moreover, it comes with multiple display
outputs: HDMI and VGA. With integrated Intel® Gen
HD graphics, visual capabilities are enhanced, including
faster media processing, full HD over HDMI, spectacular
HD playback, etc.

The system encompasses a wide variety of communication
ports to facilitate every possible in-vehicle applications:

• One Ethernet port provided by Intel i210IT Ethernet

controller.

• Two additional digital input pins from the Multiple

(MIO) I/O port can be used for system wake-up to
power on the system automatically; another two
digital output pins from the same Multiple I/O (MIO)
port can be used for control relay (current @2mA)

• Multiple I/O ports for Digital I/O and serial port

connections

• Rich I/O ports: two RS-232, 3 USB ports (one USB 3.0

type A, 2 USB 2.0 with pin headers)

• Three Mini-PCIe connectors (one supports mSATA; one

full-size with SIM card reader for 3G wireless Internet
connection; one half-size for Wi-Fi connection)

• Dual video display: HDMI+VGA output with Intel

integrated HD graphic engine

• Power ignition control mechanism with programmable

on/off/delay switch

• Wide range of DC power input from 9V to 36V, suitable

for vehicular 12V or 24V battery with Ignition control.

–Power input current protection by 15KP30A TVS

--12V DC output current with a maximum of 1A

• Battery voltage protection: Over Voltage Protection

and Under Voltage Protection

Embedded and Industrial Computing

System Specifications

Dimensions (WxHxD) 210 x 52 x 144 mm

ntel Atom processor E3845

Processor

System
Memory

Storage mSATA/SATA

Ethernet Controller Intel i210IT

Graphic Controller

Audio Controller Realtek ALC886-GR

IO

Power Input

OS Support

Certications CE, FCC Class A, E13, RoHS

Technology

Max. Capacity Up to 8GB (user option)

LAN GbE RJ45 x1

Display

Audio

Serial I/O

GPS Ublox NEO-7N GPS receiver
G-sensor ADXL 345

MIO

USB 2.0

Power Input

Expansion

CAN bus supports J1939 & J1708

1.9GHz (Option for E3815 /
E3825 / E3826 / E2827)

DDR3L SO-DIMM x1 ( Factory
default: 2GB module pre­installed )

Removable 2.5” SSD/HDD drive
bay x1, Mini-PCIe connector for
mSATA

Intel integrated HD graphic
engine

VGA, maximum resolution up to
2048x1536@60Hz
HDMI, maximum resolution up to
1920x1200@75Hz

Internal pin header for Mic-in
and Line-out

1 x RS-232
1 x RS-232/422/485

4x DI ( 5V or 12V TTL selectable)
4x DO (12V TTL , Max. 100mA)
2x DO control Relay support
9~36V@max 2A each
2x DI to Ignition MCU as remote
control
1x 12VDC Out
1x Rx/Tx

USB 3.0Type A x 1
USB 2.0 Pin headers x2

3-pin terminal block (+, -, igni­tion)

Mini-PCIe x2 (one is full-size
with SIM card reader; the other
one is half-size)

+9~36VDC input range, with
ignition delay on/off control

Windows7/ 7 Embedded /8
embedded OS Image:
WES7 (64bit & 32bit) / W7
FES (64bit & 32bit) / Windows
8(32bit); Linux kernel 2.6.X or
later

5

Chapter 1

Introduction

Compliance

Low Temperature:

MIL-STD-810G, Method 502.5,
Procedure I (Storage)
MIL-STD-810G, Method 502.5,
Procedure II (Operational)

Temperature Shock:

MIL-STD-810G, Method 503.5,
Procedure I-C

General Vibration (Operat­ing):

MIL-STD-810G, Method 514.6,
Procedure I, Category4, Figure

514.6C-1 (Common Carrier,
US Highway Truck Vibration
Exposure)

General Vibration (Non­operating):

MIL-STD-810G, Method 514.6,
Procedure I, Category 24, Figure

514.6E-1 (General Minimum
Integrity)

Package Contents

Your package contains the following items:

LVC-2000 Fanless Embedded System with rubber
stands:

• Terminal Block Connectors:

-Power connector 3 pin x1 (P/N:04AW20031E001)

-MIO Connector 20 pin x1 (P/N: 04AW20203Z101)

• HDD Screws x 4 (P/N: 070W102400602)

• Mini-PCIe Screws x 4 (P/N: 070W101000401)

Operating
Temperature
Range

Extended

Shock (Operating):

MIL-STD-810G, Method 516.6,
Procedure I (Functional Test for
Ground Equipment)

Shock (Non-operating):

MIL-STD-810G, Method 516.6,
Procedure V (Crash Hazard Shock
Test for Ground Equipment)

Transit Drop:

MIL-STD-810G, Method 516.6,
Procedure IV (Transit Drop)

With Selected Industrial Com­ponents

-20~60°C/-4~140°F

Embedded and Industrial Computing

6

Chapter 2

Chapter 2:
System Components

System Drawing

Mechanical dimensions of the LVC-2000 with the wall
mount kit (suspension kit).

Unit: mm

System Components

198

52

165

Embedded and Industrial Computing

7

Chapter 2

Block Diagram: The MainBoard

The block diagram depicts the relationships among the
interfaces and modules on the motherboard.

System Components

Embedded and Industrial Computing

8

Chapter 2

System Components

Front Components

Component Description Pin Definition Reference

F1 GPS Antenna
F2 HDD/SSD and

Power LED (Green)

F3 USB 3.0 Ports USB 3.0 type A connectors. There are additional

F4 CAN bus CAN bus connector for controller area network

F5 COM1/COM2 RS232 ports for serial communication COM1/COM2 on page

F4

F2

F1

Reserved for GPS antenna

HDD/SSD

• Blinking: means data access activities

• Off: means no data access activities or no

hard disk present

Power

• On: The computer is on.

• Off: The computer is off .

2 USB 2.0 ports with pin headers

communication. It supports J1939 &J1708
standards.

F3

F5

USB2 on page

CAN1 on page

Embedded and Industrial Computing

9

Chapter 2

Rear Components

R1 Multiple-I/O Connector A 20-pin male connector for the

System Components

R4

R1

Component Description Pin Definition Reference

following functions:

• 4 Digital-In & 4 Digital-output

• 12VDC power output

• Two Output relay control with

contact current which support
9~36V@ 2A each

R2

R3

R5

MIO2 on page 20

• MCU input detection to wake up
the system automatically

• One serial communication port

F3 One 10/100/1000Mbps LAN
ports

SPEED

R2 HDMI Port (‡) A HDMI port which is provided

R4 VGA Port (‡) It connects an external VGA

R6 Power-In (DC) Power-in with ignition support. The

LINK/ACT

One RJ-45 (provided by Intel i210IT)
jacks with LED indicators as described
below

LINK/ACT (Yellow)

• On/Flashing: The port is linking
and active in data transmission.

• Off: The port is not linking.

SPEED (Green/Amber)

• Amber: The connection speed is
1000Mbps.

• Green: The connection speed is
100Mbps

• Off: The connection speed is
10Mbps.

by Intel HD graphics (resolution:
1920x1080@60Hz). There is also an

internal Audio pin header for HD Audio
MIC-in/Line-out

monitor or projector (resolution:
1600x1200@60Hz)

system support a wide range of power
input +9~+36V including the prevalent
12V and 24V vehicular power system.
It has a 2KV ESD protection on the DC
input and ignition line.

HDMI1 on page 19

VGA1 on page 19

PRJK1 on page 21

Embedded and Industrial Computing

10

Chapter 3

Chapter 3:
Board Layout

External Connectors

The following picture highlights the location of internal
connectors and jumpers. Refer to the table 3.1 Connector
List for more details.

USB2

CAN1 COM2

Board Layout

COM1

ATX1

PRJK1

Embedded and Industrial Computing

VGA1

POEIO1 (on the back)

HDMI1

LAN1

MIO1

11

Chapter 3

Internal Connectors and Jumpers

The following picture highlights the location of internal
connectors and jumpers. Refer to the table 3.2 Connector
List for more details.

Board Layout

JSPI1

JCMOS1

USBF1

MSATA1

JMCU1

MPCIE2

JRI1

Embedded and Industrial Computing

SATA1

SATAPWR1

JLPC1

JRI2

CN1

JKBMS1

SIM1

MPCIE1

12