Lanner LEC-7900D User Manual

LEC-7900D User Manual
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LEC-7900D
User Manual
LEC-7900D User Manual
1
LEC-7900D
Manual
Version 1.0 : Jane 24, 2011
Copyright 2007, Lanner Electronics, Inc. All rights reserved. This document contains proprietary information that is protected by copyright. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form by any means without the written express of Lanner Electronics, Inc. The author and Lanner Electronics, Inc. have used their best efforts in preparing this manual. However, the author and Lanner Electronics, Inc. make no warranties of any kind, expressed or implied, with regard to the informational content, documentation, or files contained in this manual, and shall not be liable for technical or editorial errors or omissions contained herein. In no event shall the author or publisher be responsible or liable for any incidental or consequential damages resulting from the furnishing, performance, or use of this material.
TRADEMARKS Internet Explorer, Windows Explorer, and Windows are trademarks or registered trademarks of Microsoft Corporation. Other products mentioned herein may be trademarks/or registered trademarks of their respective owners.
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Safety Guidelines
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after installation. Do not wear loose clothing or jewelry that could get caught in the chassis.
Fasten your tie or scarf and roll up your sleeves.
Wear safety glasses if you are working under any conditions that might be
hazardous to your eyes.
Do not perform any action that creates a potential hazard to people or
makes the equipment unsafe.
Disconnect all power by turning off the power and unplugging the power
cord before installing or removing a chassis or working near power supplies
Do not work alone if potentially hazardous conditions exist. Never assume that power is disconnected from a circuit; always check the
circuit.
Operating Safety
Electrical equipment generates heat. Ambient air temperature may not be
adequate to cool equipment to acceptable operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling
air to circulate effectively. An open chassis permits air leaks, which may interrupt and redirect the flow of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when electronic components are improperly handled and can result in complete or intermittent failures. Be sure to follow ESD-prevention procedures when removing and replacing components to avoid these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin
contact. If no wrist strap is available, ground yourself by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap, which should
be between 1 and 10 megohms (Mohms).
LITHIUM BATTERY CAUTION:
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
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EMC Notice
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case users will be required to correct the interference at their own expense.
Class A Notice for FCC Modifying the equipment without the authorization of Lanner Electronics, Inc. may result in the equipment no longer complying with FCC requirements for Class A digital devices. In that event, your right to use the equipment may be limited by FCC regulations, and you may be required to correct any interference to radio or television communications at your own expense.
This equipment is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC.
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SAFETY GUIDELINES ................................................................................................................................................... 2
EMC NOTICE...................................................................................................................................................................3
1
PRODUCT OVERVIEW
......................................................................................................................................... 5
1.1 PRODUCT INTRODUCTION ................................................................................................................................. 5
1.2 SPECIFICATIONS ................................................................................................................................................ 6
2 SYSTEM COMPONENTS .....................................................................................................................................8
2.1 BLOCK DIAGRAM.............................................................................................................................................. 8
2.2 LEC-7900D(LEB-7900D) SYSTEM BOARD...................................................................................................... 9
2.3 JUMPER SETTING AND PIN ASSIGNMENT.......................................................................................................... 11
3
HARDWARE
INSTALLATION
GUIDE
............................................................................................................ 18
3.1 LEC-7900D EMBEDDED SYSTEM ................................................................................................................... 18
3.1.1
Begin Installation
....................................................................................................................................... 18
3.1.2 System Memory Installation
....................................................................................................................... 19
3.1.3 SIM Card Installation
................................................................................................................................ 19
3.1.4
CompactFlash Card Installation
................................................................................................................ 20
3.1.5
HDD Installation
....................................................................................................................................... 20
3.1.6
Heat sink Installation
................................................................................................................................. 23
3.1.7 Mini-PCIexpress Socket Installation
.......................................................................................................... 25
3.1.8
System Complete
........................................................................................................................................ 25
APPENDIX A. WATCHDOG TIMER...................................................................................................................26
APPENDIX B. DIGITAL I/O ................................................................................................................................. 29
TERMS AND CONDITIONS.........................................................................................................................................34
WARRANTY POLICY :.....................................................................................................................................................34
RMA SERVICE :............................................................................................................................................................. 34
Requesting a RMA# ................................................................................................................................................. 34
RMA Service Request Form..................................................................................................................................... 35
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1
Product Overview
1.1 Product Introduction
Front Pane
l
Back Panel
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1.2 Specifications
FEATURE
DESCRIPTION LEC-7900D
Form Factor Embedded System
Processor Intel Core 2 Duo, Celeron M (Socket P)
Chipset Nvidia MCP7A-LP
BIOS AMIBIOS with 8Mbit FWH
Platform
Max. FSB 1066MHz
Memory IC On Board No
Memory Socket SODIMM x 2 (up to 2GB per slot)
Memory
Max Memory 4GB (2GB Module x 2)
Compact Flash CF Socket Type I/II x1
Storage
HDD 2.5” SATA HDD support
Networking
Controller (Interface) RTL8111C(D) (PCIe 1X)
Video
Controller Nvidia MCP7A-LP
Audio
Codec ALC888 HD Codec
COM Ports RS-232 x 1
DIO 4 Digital In, 4 Digital Out
USB 2.0 4 (External x 4)
Video Grabber / 3G / GPS Video Grabber (Manufacture Option)
VGA 2 (1920 x 1440 / 75Hz)
DVI-D UXGA (1600 x 1200)
HDMI 1 x (1.3 Mode 1920 x 1200)
LAN RJ45 GbE x 2
I/O
Audio Stereo Line out (RCA L/R)
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Internal CF 1
DC-in Connector Type Phoenix Contact 2-pin, DC Jack (MP Version)
Expansion Mini-PCIe x 1
Watchdog timer Yes (1~255 level)
Hardware Monitor
Controller
Winbond W83627 UHG integrated hardware monitor
OS Supported
Win XP-32bit/ Windows Vista
Operating Temperature (With Industrial Components: CF, Memory, SSD, HDD)
-10°~55°C / 14°~131°F
Operating Temperature (With Commercial Components)
-5°C~45°C / 23°~113°F
Environmental Parameters
Extended Operating Temperature Tested
N/A
W x H x D (mm) 268(W) x 44(H) x 174(D)
W x H x D (Inch) 10.55”(W) x 1.73”(H) x 6.85”(D)
Dimensions
Input (Mode) DC +12V (ATX Mode)
Power
AC Adapter AC Adapter D: 75W (+12V)
Compliance
CE, FCC, RoHS
Cooling
System Fan
1 x Smart FAN
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-
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2 System Components
2.1 Block Diagram
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-
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2.2 LEC-7900D(LEB-7900D) System Board
LEB-7900D is the system board bundled with the LEC-7900D Fanless Embedded System platform. The succeeding sections list LEB-7900D related jumper settings and connector pin assignments.
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