12 A Snubberless™, logic level and standard Triacs
Features
•Medium current Triac
•Low thermal resistance with clip bonding
•Low thermal resistance insulation ceramic for insulated BTA
•High commutation (4Q) or very high commutation (3Q) capability
•BTA series UL1557 certified (file ref: 81734)
•Packages are RoHS (2011/65/EU) compliant
Description
Available either in through-hole or surface mount packages, the BTA12, BTB12 and
T12xx Triac series are suitable for general purpose mains power AC switching. They
can be used as ON/OFF function in applications such as static relays, heating
regulation or induction motor starting circuit. They are also recommended for phase
control operations in light dimmers and appliance motors speed controllers.
The Snubberless™ versions (W suffix and T12xx) are especially recommended for
use on inductive loads, because of their high commutation performance. By using an
internal ceramic pad, the Snubberless™ series provide an insulated tab (rated at
2500 V
Logic Level BTA12-600TW and BTA12-600SW offer low holding current, ideal to
design light dimmers for LED lamps.
) complying with UL standards (file reference: E81734).
RMS
Product status link
Product summary
I
T(RMS)
V
DRM/VRRM
IGT(Snubberless)
IGT(standard)
BTA12
BTB12
T1205
T1210
T1235
T1250
600 and 800 V
5 / 10 / 35 / 50 mA
25 / 50
12 A
DS2115 - Rev 12 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings (Tj = 25 °C unless otherwise stated)
SymbolParameterValueUnit
I
T(RMS)
I
TSM
I2tI2t value for fusing
dl/dt
V
DSM/VRSM
I
GM
P
G(AV)
T
T
RMS on-state current (full sine wave)
Non repetitive surge peak on-state current (full cycle, T
initial = 25 °C)
Critical rate of rise of on-state current IG = 2 x IGT, tr ≤
100 ns
Non repetitive surge peak off-state voltage
Peak gate current
Average gate power dissipation
Storage junction temperature range-40 to +150°C
stg
Operating junction temperature range-40 to +125°C
j
BTA12, BTB12, T1205, T1210, T1235, T1250
Characteristics
TO-220AB, D²PAK
TO-220AB Ins.
f = 50 Hzt = 20 ms120
j
f = 60 Hz
f = 120 Hz
tp = 10 msTj = 25 °C
tp = 20 µsTj = 125 °C
Tc = 105 °C
Tc = 90 °C
tp = 16.7 ms
tp = 10 ms
Tj = 125 °C
Tj = 125 °C
12A
126
78
50A/µs
V
/ V
DRM
100
A2s
+
RRM
4A
1W
A
V
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless™ and logic level
(3 quadrants)
Symbol
(1)
IGT
ParameterQuadrant
VD = 12 V, RL = 30 Ω
V
GT
V
IH
IL
dV/dt
GD
(2)
(2)
(2)
VD = V
DRM
IT = 100 mA
IG = 1.2 x I
VD = 67% V
, RL = 3.3 kΩ, Tj = 125 °C
GT
, gate open, Tj = 125 °C
DRM
(dV/dt)c = 0.1 V/µs, Tj = 125 °C
(2)
(dl/dt)c
(dV/dt)c = 10 V/µs, Tj = 125 °C
Without snubber, Tj = 125 °C
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
T1205
BTB12-TW
BTA12-TW
T1210
BTB12-SW
BTA12-SW
T1235
BTB12-
CW
BTA12-CW
I - II - IIIMax.5103550mA
I - II - IIIMax.1.3V
I - II - IIIMin.0.2V
I - II - IIIMax.10153550mA
I - IIIMax.10255070
IIMax.15306080
Max.20405001000V/µs
Min.3.56.5
Min.1.02.9
Min.6.512
T1250
BTB12-
BW
BTA12-BW
A/ms
Unit
mA
DS2115 - Rev 12
page 2/16
BTA12, BTB12, T1205, T1210, T1235, T1250
Characteristics
Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Standard Triac (4 quadrants)
SymbolParameterQuadrant
Value
CB
(1)
IGT
V
GT
V
GD
(2)
IH
I
L
dV/dt
(dV/dt)c
VD = 12 V, RL = 30 Ω
VD = V
, RL = 33 kΩ, Tj = 125 °C
DRM
IT = 500 mA
IG = 1.2 I
(2)
VD = 67 % V
(2)
(dI/dt)c = 5.3 A/ms, Tj = 125 °C
GT
DRM
gate open, Tj = 125 °C
I - II - III
IV50100
Max.
AllMax.1.3V
AllMin.0.2V
I - II - IIIMax.2550mA
I - III - IV
II80100
Max.
Min.200400V/µs
Min.510V/µs
2550
4050
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Table 4. Static electrical characteristics
SymbolTest conditionsValueUnit
(1)
VTM
(1)
V
TO
(1)
R
D
I
DRM IRRM
1. For both polarities of A2 referenced to A1
ITM = 17 A, tp = 380 µsTj = 25 °C
threshold on-state voltage
Dynamic resistance
Tj = 125 °C
Tj = 125 °C
Tj = 25 °C
V
= V
DRM
RRM
Tj = 125 °C
Max.1.55V
Max.0.85V
Max.35mΩ
Max.5µA
Max.1mA
Unit
mA
mA
Symbol
R
R
1. S = Copper surface under tab.
Max. junction to case thermal resistance (AC)
th(j-c)
Junction to ambient
th(j-a)
Junction to ambientTO-220AB / TO-220AB insulatedTyp.60
Table 5. Thermal resistance
ParameterValueUnit
Max.1.4
S = 2 cm²
D2PAK / TO-220AB
TO-220AB insulatedMax.2.3
(1)
D²PAKTyp.45
°C/W
°C/W
DS2115 - Rev 12
page 3/16
1.1Characteristics (curves)
16
14
12
10
8
6
4
2
0
0123456789101112
P(W)
I
T(RMS)
(A)
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
255075100125
T ( °C)
C
BTA
BTB /T12
I
T(RMS)
(A)
02 55 075100125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
T (°C )
C
D PAK
(S = 1cm )
2
2
I
T(RMS)
(A)
1E-31E-21E-11E+01E+11E+25E+2
1E-2
1E-1
1E+0
K = [Z /R
th th
]
tP( s)
Z
th(j-c)
Z
th(j-a)
BTA12, BTB12, T1205, T1210, T1235, T1250
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 3. RMS on-state current versus ambient
temperature (printed circuit board FR4, copper thickness:
35 μm) (full cycle)
Figure 2. RMS on-state current versus case temperature
(full cycle)
Figure 4. Relative variation of thermal impedance versus