Kontron VMP1 User Manual
VMP1
Power PC-based CPU Board
for VME Applications
Manual ID 26037, Rev. Index 01
Aug 02
The product described in this manual is
in compliance with all applied CE standards.
This page was intentionally left blank.
® 2002 PEP Modular Computers GmbH
VMP1 Preface
Table of Contents
Preface
Manual Table of Contents...................................................................................... 0 - 3
Revision History................................................................................................... 0 - 10
Trademarks.......................................................................................................... 0 - 10
Explanation of Symbols ....................................................................................... 0 - 11
For Your Safety.................................................................................................... 0 - 12
High Voltage Safety Instructions.......................................................................... 0 - 12
Special Handling and Unpacking Instructions...................................................... 0 - 12
General Instructions on Usage ............................................................................ 0 - 13
Two Year Warranty.............................................................................................. 0 - 14
Chapt
Chapter
Chapter
1
1
1
Introduction.................................................................................................1 - 3
1.1 Board Introduction .........................................................................................1 - 4
1.2 Board Overview .............................................................................................1 - 5
1.3 VMP1 Main Specifications .............................................................................1 - 6
1.4 Applied Standards .........................................................................................1 - 8
1.4.1 CE Compliance ........................................................................................1 - 8
1.4.2 Mechanical Compliance ...........................................................................1 - 8
1.4.3 Environmental Tests .................................................................................1 - 8
1.5 Related Publications ......................................................................................1 - 8
1.5.1 VME Systems/Boards ..............................................................................1 - 8
1.5.2 PMC Add-on Modules/Carriers ................................................................1 - 8
ID 26037, Rev. 01 Page 0 - 3® 2002 PEP Modular Computers GmbH
Preface VMP1
Chapter
2
Functional Description.....................................................................2 - 3
2.1 Functional Block Diagram .............................................................................2 - 3
2.2 Front Panels .................................................................................................. 2 - 4
2.3 Board Layout .................................................................................................2 - 5
2.4 Main Features ............................................................................................... 2 - 6
2.4.1 CPU .........................................................................................................2 - 6
2.4.1.1 MPC8240 (Kahlua) Features ............................................................... 2 - 6
2.4.2 Memory ....................................................................................................2 - 8
2.4.2.1 System Memory (DRAM) .....................................................................2 - 8
2.4.2.2 Flash ....................................................................................................2 - 8
2.4.2.3 EEPROM .............................................................................................2 - 8
2.4.2.4 Memory Expansion Socket (DIL600) ................................................... 2 - 8
2.4.3 Board Interfaces........................................................................................2 - 9
2.4.3.1 VME Interface and Pinout .................................................................... 2 - 9
2.4.3.2 Ethernet Connector and Pinout .........................................................2 - 11
2.4.3.3 Serial Interfaces and Pinouts .............................................................2 - 12
2.4.3.4 PCI Expansion Connector and Pinout................................................2 - 13
2.4.3.5 Serial Interface Expansion Connector & Pinout ................................. 2 - 16
2.4.3.6 Memory Expansion Connector........................................................... 2 - 16
2.4.3.7 Debug Interface and Pinout ...............................................................2 - 17
2.4.4 Digital Temperature Sensor (LM75)........................................................ 2 - 17
2.5 Special Board Features ................................................................................ 2 - 18
2.5.1 Watchdog Timer .....................................................................................2 - 18
2.5.2 RTC (STC M41T56) ............................................................................... 2 - 18
2.5.3 Reset/Abort ............................................................................................2 - 18
2.5.4 Front Panel LED’s ..................................................................................2 - 19
ID 26037, Rev. 01Page 0 - 4 ® 2002 PEP Modular Computers GmbH
VMP1 Preface
Chapter
3
Installation....................................................................................................3 - 3
3.1 Board Installation ...........................................................................................3 - 3
3.1.1 Front Panel I/O Connectors ......................................................................3 - 4
Chapter
4
Configuration.............................................................................................4 - 3
4.1 Jumper Settings .............................................................................................4 - 3
4.1.1 Bootstrap Loader / Socket Jumper J1 ......................................................4 - 3
4.1.2 RTC (Real-time clock) Calibration Output J2 ...........................................4 - 3
4.1.3 Resistor Setting for Non-standard Socket Devices...................................4 - 4
4.1.4 RS485 Termination (Onboard Interface Only)...........................................4 - 4
4.2 Pinouts ..........................................................................................................4 - 5
4.2.1 Flash Socket Type Selection ....................................................................4 - 5
4.2.1.1 Socket Device Selection .......................................................................4 - 5
4.2.2 Serial Interface Expansion Connector CON3 ...........................................4 - 6
4.3 Board Address Map .......................................................................................4 - 7
4.3.1 Address Map Overview ............................................................................4 - 7
4.3.2 VME Address Area....................................................................................4 - 8
4.3.3 Onboard Device Addresses ......................................................................4 - 9
4.3.4 Special Registers Overview ...................................................................4 - 10
4.3.4.1 Board Control Registers .....................................................................4 - 10
4.3.4.2 Board ID Register ...............................................................................4 - 10
4.3.4.3 Software Compatibility ID ...................................................................4 - 10
4.3.4.4 Memory Configuration Register .........................................................4 - 11
4.3.4.5 SDRAM Size ......................................................................................4 - 11
4.3.4.6 Flash Bank Select Register ................................................................4 - 11
4.3.4.7 Watchdog Control Register ................................................................4 - 12
4.3.4.8 Watchdog Timeout Time ....................................................................4 - 12
ID 26037, Rev. 01 Page 0 - 5® 2002 PEP Modular Computers GmbH
Preface VMP1
4.3.4.9 Control Register ................................................................................. 4 - 13
4.3.4.10 Event Register .................................................................................4 - 13
4.3.4.11 Board / Logic Revision Register ...................................................... 4 - 14
4.3.4.12 UART A / Registers .......................................................................... 4 - 15
4.3.4.13 UART B / Registers .......................................................................... 4 - 16
4.3.5 IRQ Routing ...........................................................................................4 - 17
4.3.6 Real-time Clock ......................................................................................4 - 18
4.3.7 EEPROM ................................................................................................ 4 - 19
4.3.8 Digital Temperature Sensor.................................................................... 4 - 19
Chapter
5
NetBootLoader.........................................................................................5 - 3
5.1 General Operation ........................................................................................5 - 3
5.2 NetBootLoader Interfaces ............................................................................. 5 - 3
5.2.1 ABT (Abort) Switch .................................................................................. 5 - 4
5.2.2 TERM Serial Interface ..............................................................................5 - 4
5.2.3 SER0 Serial Interface ..............................................................................5 - 4
5.2.4 Ethernet Interface ....................................................................................5 - 4
5.3 NetBootLoader Functions ............................................................................. 5 - 4
5.3.1 NetBootLoader Control ............................................................................5 - 5
5.3.2 System Status Monitoring ........................................................................ 5 - 5
5.3.3 ftp Server Access ..................................................................................... 5 - 6
5.3.4 FLASH Operation .....................................................................................5 - 6
5.3.5 Motorola S-Records ................................................................................. 5 - 6
5.4 Operating the NetBootLoader .......................................................................5 - 7
5.4.1 Initial Setup ..............................................................................................5 - 7
5.4.2 Accessing the NetBootLoader ................................................................. 5 - 7
5.4.3 NetBootLoader Configuration ..................................................................5 - 8
5.4.4 telnet Login .............................................................................................. 5 - 9
5.4.5 FLASH Operations ................................................................................... 5 - 9
5.4.6 Updating the NetBootLoader ................................................................. 5 - 11
5.4.7 Uploading a FLASH Area .......................................................................5 - 12
5.5 Plug and Play ..............................................................................................5 - 12
ID 26037, Rev. 01Page 0 - 6 ® 2002 PEP Modular Computers GmbH
VMP1 Preface
5.6 Porting an Operating System to the CPU Board .........................................5 - 12
5.7 Commands ..................................................................................................5 - 13
Appendix
VMP1-IO1 Module (Optional)...................................................... A - 3
A Overview ........................................................................................................ A - 3
B Board Interfaces ............................................................................................. A - 4
C Board Layout .................................................................................................. A - 5
D F ront Panel ..................................................................................................... A - 6
E Technical Specifications ................................................................................. A - 7
F Board Installation ........................................................................................... A - 8
G Pinouts .........................................................................................................A - 10
G1 Jn1 (CON4) Pin Assignment ................................................................. A - 10
G2 Jn2 (CON5) Pin Assignment ................................................................. A - 11
H Jumper Setting.............................................................................................. A - 12
Appendix
A
B
VMP1-Post (Optional) ....................................................................... B - 3
Appendix
Optoisolation RS485 Module for VMP1 (Optional) .C - 3
Appendix
JTAG Subsystem.................................................................................D - 3
C
D
ID 26037, Rev. 01 Page 0 - 7® 2002 PEP Modular Computers GmbH
Preface VMP1
Figures
Figure Number and Title
2-1 Functional Block Diagram ............................................................................. 2 - 3
2-2 Front Panels .................................................................................................. 2 - 4
2-3 VMP1 Board (Front View) .............................................................................2 - 5
2-4 VMP1 Board (Rear View) .............................................................................. 2 - 5
2-5 PCI Expansion Connector............................................................................ 2 - 12
4-1 VMP1 Address Map, 2 MB 8-bit Bank .......................................................... 4 - 7
4-2 VMP1 Address Map, Bank 0..........................................................................4 - 8
5-1 S etting of COM2 Properties .......................................................................... 5 - 9
5-2 Screen after Entering the Command Mode .................................................. 5 - 9
5-3 Select Transfer/Send Text File Dialogue Box ............................................5 - 10
5-4 Selecting the MOTOROLA S-Records File ................................................. 5 - 10
A-1 Board Layout (Front View) ............................................................................A - 5
A-2 VMP1-IO1 Front Panel ..................................................................................A - 6
A-3 Installation Diagrams ....................................................................................A - 9
A-4 Cascading of IO1 (or other) Modules onto the VMP1 .................................A - 12
B-1 Plan and Profile Views of VMP1 POST Module.............................................B - 3
C-1 View of underside of RS485 Module..............................................................C - 3
D-1 JTAG Chain Illustration..................................................................................D - 3
D-2 Resistor Positions on Reverse of VMP1 Board .............................................D - 4
Tables
Table Number and Title
1-1 VMP1 Main Specifications ............................................................................. 1 - 6
2-1 Pin Assignment J1/P1 VME.........................................................................2 - 10
2-2 E thernet RJ45 Pin Assignment ...................................................................2 - 11
2-3 Serial Port RJ45 Pin Assignment ................................................................ 2 - 12
2-4 PCI Expansion Connector Pinout ............................................................... 2 - 13
ID 26037, Rev. 01Page 0 - 8 ® 2002 PEP Modular Computers GmbH
VMP1 Preface
2.5 Serial Interface Expansion Connector (CON3) Pinout .................................2 - 15
2.6 Debug Interface Connector (CON10) Pinout................................................2 - 16
2-7 Watchdog Time Values ...............................................................................2 - 17
4-1 Bootstrap Loader / Socket Jumper J1 Settings .............................................4 - 3
4-2 Resistor Setting for Various Non-standard Socket Devices ..........................4 - 4
4-3 Jumper Settings for RS485 Termination .......................................................4 - 4
4-4 D IL 32 Pinout for Various Devices .................................................................4 - 5
4-5 RS Expansion Connector (CON3) Pinout ......................................................4 - 6
4-6 B oard Control Registers ................................................................................4 - 9
4-7 Board ID Register ..........................................................................................4 - 9
4-8 Software Compatibility ID ............................................................................4 - 10
4-9 Memory Configuration Register ...................................................................4 - 10
4-10 SDRAM Size ..............................................................................................4 - 10
4-11 Flash Bank Select Register .......................................................................4 - 11
4-12 Watchdog Control Register ........................................................................4 - 11
4-13 Watchdog Timeout Time ............................................................................4 - 11
4-14 Control Register .........................................................................................4 - 12
4-15 Event Register ...........................................................................................4 - 12
4-16 Board / Logic Revision Register ................................................................4 - 13
4-17 General Register Set (THR/RHR, IER/ISR, MCR/MSR, LCR/LSR, SPR) .4 - 13
4-18 Baud Rate Register Set (DLL/DLM) ..........................................................4 - 14
4-19 Enhanced Register Set ..............................................................................4 - 14
4-20 General Register Set (THR/RHR, IER/ISR, MCR/MSR, LCR/LSR, SPR) .4 - 15
4-21 Baud Rate Register Set (DLL/DLM) ..........................................................4 - 15
4-22 Enhanced Register Set ..............................................................................4 - 16
4-23 Serial IRQ’s ................................................................................................4 - 17
4-24 Register Map RTC M41T56 .......................................................................4 - 18
5-1 NetBootLoader Control Commands .............................................................5 - 5
5-2 System Status Monitoring Commands ........................................................5 - 5
5-3 ftp Server Commands ..................................................................................5 - 6
5-4 FLASH Operation Commands .....................................................................5 - 6
5-5 Motorola S-Records Commands .................................................................5 - 6
A-1 VMP1-IO1 Specifications .............................................................................. A - 7
A-2 Jn1, 32-bit PCI ............................................................................................ A - 10
A-3 Jn2, 32-bit PCI ............................................................................................ A - 11
A-4 IO1 Jumper Settings for Different Module Positions................................... A - 12
ID 26037, Rev. 01 Page 0 - 9® 2002 PEP Modular Computers GmbH
Preface VMP1
Revision History
Revision History
Manual/Product Title: VMP1
Manual ID Number: 26037
Rev.
Index
0100 Initial Issue 01 Aug 02
This document contains information proprietary to PEP Modular Computers. It may not be
copied or transmitted by any means, disclosed to others or stored in any retrieval system or
media, without the prior written consent of PEP Modular Computers GmbH or one of its authorized agents.
The information contained in this document is, to the best of our knowledge, entirely correct.
However, PEP Modular Computers cannot accept liability for any inaccuracies, or the conse-
quences thereof, nor for any liability arising from the use or application of any circuit, product,
or example shown in t his document.
Brief Description of Changes Board Index
Date of
Issue
PEP Modular Computers reserve the right to change, modify, or improve this document or the
product described herein, as seen fit by PEP Modular Computers without further notice.
Trademarks
PEP Modular Computers, the PEP logo and “CXM” are trademarks owned by PEP Modular
Computers GmbH, Kaufbeuren, Germany. In addition, this document may include names,
company logos and trademarks which are registered trademarks and are, therefore, proprietary of their respective owners.
ID 26037, Rev. 01Page 0 - 10 ® 2002 PEP Modular Computers GmbH
Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this
manual is in compliance with all applied CE standards.
Please see also the section “Applied Standards” in this manual.
Caution!
This symbol and title warn you of hazards due to electrical
shocks (> 60 V) when touching products or parts of them.
Failure to observe the necessary precautions as described
and/or prescribed by the law may result in damage to your
product and/or endanger your life/health.
Please see also the section “High Voltage Safety Instructions”.
PrefaceVMP1
!
ESD-Sensitive Device!
This symbol and title highlight the fact that electronic boards
and their components are sensitive to static electricity.
Therefore, care must be taken during all handling operations
and inspections of this product, in order to ensure product
integrity at all times.
Please read also the section “Special Handling and Unpacking Instructions” on the following pageof this manual.
Attention!
This symbol and title emphasize aspects which, if not under-
stood and taken into consideration by the reader, may result
in hazards to health and/or material damage.
Note:
This symbol and title relate to information the user should
read through carefully for his or her own advantage.
PEP Advantage
This symbol and title accompany information highlighting
positive aspects of a PEP product and/or procedure.
Troubleshooting
This symbol and title accompany information about trouble-
shooting and problem solving.
ID 26037, Rev. 01 Page 0 - 11® 2002 PEP Modular Computers GmbH
VMP1Preface
For your safety
Your new PEP product has been developed and carefully tested in order to p rovide all the features necessary to ensure full compliance with all electrical safety requirements. It has also
been designed for a long fault-free life. However, the life expectancy of your product will be
drastically reduced by improper treatment during unpacking and installation. Therefore, in the
interests of your own safety and of the correct operation of your new PEP product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
Warning!
!
All operations on this device must be carried out by sufficiently
skilled personnel.
Caution!
The power supply must always be disconnected before installation, repair and maintenance operations are carried out on this
product. Failure to comply with this basic precaution will subject
the operator to serious electrical shock hazards. Always unplug
the power cable before such operations.
Before installing your new PEP product into a system always
ensure that your mains power is switched off. This applies also to
the installation of piggybacks.
Special Handling and Unpacking Instructions
ESD Sensitive Device!
Electronic boards and their components are sensitive to static
electricity. Care must therefore be exercised at all times during
handling and inspection of the board, in order to ensure product
integrity.
Do not handle this product while it is outside its protective enclosure while it is not used
for operational purposes, unless it is otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations.
Where safe work stations are not guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands or tools. This is most
easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing
piggybacks, ROM devices, jumper settings etc. If the product contains batteries for RTC
or memory backup, ensure that the board is not placed on conductive surfaces, including anti-static plastics or sponges. They can cause short circuit s and damage the batteries or tracks on the board.
ID 16566, Rev. 01Page 0 - 12 ® 2002 PEP Modular Computers GmbH
PrefaceVMP1
General Instructions on Usage
In order to maintain PEP’s product warranty, this product must not be altered or modi-
fied in any way. Changes or modifications to the device, which are not explicitly
approved by PEP Modular Computers and described in this manual or received from
PEP Te chnical Support as a special handling instruction, will void your warranty.
Th is device shou ld only be installe d in or connected to systems that fulfill all necessary
technical and specific environmental requirements. This applies also to the operational
temperature range of the specific board version, which must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, please, follow only
the instructions supplied by the present manual.
Keep all the original packaging material for future storage or warranty shipments. If it is
necessary to store or ship the board please re-pack it as nearly as possible in the manner in which it was delivered.
Special care is necessary when handling or unpacking the product. Please consult the
special handling and unpacking instructions on the previous page of this manual.
ID 26037, Rev. 01 Page 0 - 13® 2002 PEP Modular Computers GmbH
VMP1Preface
Two Year Warranty
PEP Modular Computers grants the original purchaser of a PEP product a TWO YEAR LIMITED
HARDWARE
be granted or implied by anyone on behalf of PEP are valid unless the customer has the
express written consent of PEP Modular Computers.
PEP Modular Computers warrants their own products, excluding software, to be free from
manufacturing and material defects for a period of 24 consecutive months from the date of
purchase. This warranty is not transferable nor extendible to cover any other users or longterm storage of the product. It does not cover products which have been modified, altered or
repaired by any other party than PEP Modular Computers or their authorized agents. Further-
more, any product which has been, or is suspected of being damaged as a result of negligence, improper use, incorrect handling, servicing or maintenance, or which has been
damaged as a result of excessive current/voltage or temperature, or which has had its serial
number(s), any other markings or parts thereof altered, defaced or removed will also be
excluded from this warranty.
WARRANTY as described in the following. However, no other warranties that may
If the customer’s eligibility for warranty has not been voided he should, in the event of any
claim, return the product at the earliest possible convenience to the original place of purchase,
together with a copy of the original document of purchase, a full description of the application
in which the product has been used and a description of the defect. Please pack the product in
such a way as to ensure safe transportation (see our safety instructions).
PEP provides for repair or replacement of any part, assembly or sub-assembly at the company’s own discretion, or to refund the original cost of purchase, if appropriate. In the event of
repair, refunding or replacement of any part, the ownership of the removed or replaced parts
reverts to PEP Modular Computers, and the remaining portion of the original guarantee, or
any new guarantee to cover the repaired or replaced items, will be transferred to cover the
new or repaired items. Any extensions to the original guarantee are considered gestures of
goodwill, and will be defined in the “Repair Report” issued by PEP with the repaired or
replaced item.
PEP Modular Computers will not accept liability for any further claims resulting directly or indirectly from any warranty claim, other than the above specified repair, replacement or refund.
In particular, all claims for damage to any system or process in which the product was
employed, or any loss incurred as a result of the product not functioning at any given time, are
excluded. The extent of PEP Modular Computers liability to the customer shall not exceed the
original purchase price of the item for which the claim exists.
PEP Modular Computers issues no warranty or representation, either explicit or implicit, with
respect to its products’ reliability, fitness, quality, marketability or ability to fulfil any particular
application or purpose. As a result, the products are sold “as is,” and the responsibility to
ensure their suitability for any given task remains that of the purchaser. In no event will PEP
be liable for direct, indirect or consequential damages resulting from the use of our hardware
or software products, or documentation, even if PEP were advised of the possibility of such
claims prior to the purchase of the product or during any period since t he da te of its purchase.
Please remember that no PEP Modular Computers employee, dealer or agent is authorized to
make any modification or addition to the above specified terms, either verbally or in any other
form, written or electronically transmitted, without the company’s prior consent.
ID 26037, Rev. 01Page 0 - 14 ® 2002 PEP Modular Computers GmbH
VMP1
Introduction
Introduction
1.1
1.2 Board Introduction ...............................................................1 - 4
1.3 Board Overview ................................................................... 1 - 5
1.4 VMP1 Main Specifications ...................................................1 - 6
1.5 Applied Standards ...............................................................1 - 8
1.5.1 CE Compliance ........................................................... 1 - 8
1.5.2 Mechanical Compliance .............................................. 1 - 8
Chapter
1
1.5.3 Environmental Tests ...................................................1 - 8
1.6 Related Publications ............................................................ 1 - 8
1.6.1 VME Systems/Boards ................................................. 1 - 8
1.6.2 PMC Add-on Modules/Carriers ................................... 1 - 8
ID 26037, Rev. 01
Page 1 - 1® 2002 PEP Modular Computers GmbH
This page was intentionally left blank.
® 2002 PEP Modular Computers GmbH
VMP1 Introduction
1. Introduction
The VMP1 is a comprehensive computing platform which brings togethor the latest
advances in computing technology in a board designed for maximum performance, flexibility and versatility within a rugged compact format.
The design centered on realizing a board which addresses the need for increased computing capacity while at the same time reducing the size and number of system components in order to reduce space requirement s and optimize power dissipation.
The VMP1 is based on the MPC8240, a highly integrated microprocessor containing a
PowerPC MPC603e core. This is the 250 MHz version with a Floating Point Unit (FPU).
One of the prime advantages of utilizing the established and proven MPC603e core is
the associated broad infrastructure of support that has built up around it . All of the noteworthy third-party software tool vendors provide tools for the MPC8240.
An important feature of the board is the integration of a PCI bus within a VME-CPU
board. This connects the MPC8240 with the Fast Ethernet controller and the Tundra
Universe II PCI/VME bridge and also to the onboard 100-pin PCI expansion connector,
enabling the connection of the full range of PCI peripherals.
The VMP1 employs an OS-independent boot loader that enables the loading of any
operating system. This boot loader makes an update of the Flash content s and automatically downloads from Flash to SDRAM before booting the OS. For performance reasons the OS is started from the SDRAM.
The power of the board is greatly enhanced by means of the PCI expansion connector
which makes it possible to cascade one or two additional IO1 modules onto the board
resulting in a total package of either 8HP or 12HP. Both IO1 modules may be used to
carry PMC modules. Given the wide range of PMC modules now available, this feature
affords the user a very wide range of options. Additionally, one can substitute a module
designed to provide an even greater range of PCI peripherals in place of either of the
IO1 modules. These features enable, for example, the connection of the widest range of
system I/O components such as various field busses, Fast Ethernet and Ultra 2 SCSI, to
name just a few . The complete range of expansion possibilities is thus mad e available to
the user by the VMP1.
ID 26037, Rev. 01 Page 1 - 3® 2002 PEP Modular Computers GmbH
VMP1 Introduction
1.1 Board Introduction
The VMP1 is a VME PowerPC-based single-board computer specifically designed for
use in highly integrated platforms with solid mechanical interfacing for a wide range of
industrial environment applications.
Some of the VMP1’s outstanding features are:
• PowerPC MPC8240 Kahlua (603E core with an integrated FPU,
combined with PCI interface and memory controller)
• 16 kB data cache
• 16 kB instruction cache
• up to 128 MB SDRAM (100MHz) with optional ECC support
• up to 8 MB onboard Flash
• Fast Ethernet interface
• two serial I/O’s (RS232 / ESD protected and EMI compliant)
• Memory Expansion Socket e.g. Flash memory (up to 144 MB) or SRAM
• onboard PCI bus with expansion connector
• four counter/timers
• programmable watchdog timer
• real-time clock
• double-width version for PCI expansion
• Tundra Universe II VME-to-PCI Bridge
• compliance with VITA VME-S pecification ANSI / IEEE STD1014-1987 / IEC 821 and 297
ID 26037, Rev. 01Page 1 - 4 ® 2002 PEP Modular Computers GmbH
VMP1 Introduction
1.2 Board Overview
The VMP1 is a 3U VME CPU board featuring a powerful CPU (number cruncher). The
design is based on the new highly integrated Motorola PowerPC processor MPC8240,
which integrates a PCI interface and several peripherals inside one Chip.
Two standard memory configurations (32 MB or 64 MB SDRAM) are available, with
128 MB available on request. Flash memory for integrating the initial bootloader and
ROMable operating systems are provided . Additionally, NV SRAM or a Disk-On-Chip
(by M-Systems) can be placed on a DIL socket for special purposes.
The board controls the VMEbus through the Tundra UNIVERSE II PCI-VME bridge
which is an industrial standard for connecting the PCI bus to the VME. Improved VMEbus master and VMEbus slave performance with an increase of FIFO depth and optimized DMA transfer are some of the outstanding features of this device.
The VMP1 is also able to communicate with the environment through a Fast Ethernet
interface and two serial interfaces at the front side of the board. One of the serial interfaces is a RS232 full modem interface while the other is a software-configurable
RS232/RS485 port. These UARTS support baud rates up to 1.5 Mbps and are software
compatible with the 16550 UART from National Semiconductor. They contain 128 Byte
Transmit FIFO and 128 Byte Receive FIFO for reducing the bandwidth requirement of
the CPU.
The Ethernet is realized with the Intel 82559 with full duplex support at both 10/100
Mbps possible. This Fast Ethernet controller with an integrated 10/100 Mbps physical
layer device is the foremost solution for PCI board LAN designs. It combines low power
consumption with a small package design which is ideal for power and space constrained environments.
Anticipating the VMP1's use in data critical applications, the memory data path contains
a selectable in-line ECC controller which can provide SDRAM single-bit error correct or
double-bit error detect.
For mass data transmission a dual channel DMA controller is provided. It can be
programmed directly or through the use of descriptor chains located in memory. Data
can thus be moved from PCI to memory or vice versa, memory to memory, or PCI to
PCI.
The MPC8240 supports processor control and visibility through the JTAG/COP
(common on-chip processor) interface that is available on the VMP1. Utilizing third party
tools, the developer can access and control the processor. It also has standard IEEE
1149.1a-1993 compliant boundary scan capability. The ECC data path has a mechanism to manually inject errors into memory for use with maintenance and diagnostic
utilities. Furthermore a watch point and capture register on the internal bus and a set of
address attributes on the external memory and PCI buses facilitate debugging analysis.
VME interface
In addition to the standard functionality required by a VME CPU, the VMEbus interface
(Tundra Universe 2) provides:
• automatic First-Slot detection
• integral FIFO buffers for multiple transactions in both directions
• programmable DMA controller with linked list support.
• Mailbox
ID 26037, Rev. 01 Page 1 - 5® 2002 PEP Modular Computers GmbH
VMP1 Introduction
1.3 VMP1 Main Specifications
Table 1-1: VMP1 Main Specifications
VMP1 Specifications
Operating System
Support
VME Interface
Processor
Boot Device
Main Memory
Cache Structure
Flash
DIL600 Socket
PCI Expansion Connector
Ethernet
Initial boot loader with capability to load VxWorks and other
Real-time operating systems
ANSI/VITA 1-1994 for VME, approved April 10, 1 995
Support for A24: D16/D8 master and A24: D16/D8 slave
interface
Motorola MPC8240 with integrated PCI interface 250MHz
8 MB Flash for bootloader and ROMable OS / Socket
32 MB or 64 MB of onboard SDRAM with ECC support
available as standard (128 MB available on request)
16K, 32 byte line, 4-way set associative instruction cache
16K, 32 byte line, 4-way set associative data cache
8 MB on-board Flash (soldered)
Socket for Flash extension by another 512 kB or addition of
Flash disk (M-System) with up to 144 MB
1 x Samtec SMT Board-to-Board connector 100-pin
order number: FLE - 15 - 01 - G - DV
10Base-T / 100Base-TX
SRAM
Serial Port
Watchdog
RTC
EEPROM
LED’s
Switches
256 or 512 kB NV SRAM on the DIL60 0 socket
16550 compatible Dual UART; 2 x RS-232 or
1 x RS232 + 1 x RS485
Watchdog generates Exception Condition / Reset or NMI
(software configurable)
backed up with GoldCap / Data retention for about 5 days /
backup battery possible
1 x 24LC16 for special purposes (8x256Byte)
6 LED’s:
red = general purpose
yellow = watchdog active
green = general purpose
green = Ethernet Link Integrity,
green = Ethernet Activity
green = Ethernet Speed
Two push-buttons (Reset and Abort)
ID 26037, Rev. 01Page 1 - 6 ® 2002 PEP Modular Computers GmbH
VMP1 Introduction
Table 1-1: VMP1 Main Specifications
VMP1 Specifications
Debug Interface
VME Connector
Onboard Connectors
PCI Expansion Modules
Mechanical Conformance
Power Supply
Temperature Range
Humidity
Dimensions
Board Weight
JTAG/BDM
96-pin VME connector
2 x RJ45 for RS232, 1 x RJ45 for Ethernet
PMC carrier, future PCI based I/O board with
nd
VGA/SCSI/2
Conforms with IEEE 1101.10
5V in accordance with the VME Specification, 1.79 Amp
current
–40°C to +85°C (operating)
–55°C to +125°C (storage)
0% to 95% non-condensing
100mm x 160mm single-height Eurocard
182 grams
Ethernet
ID 26037, Rev. 01 Page 1 - 7® 2002 PEP Modular Computers GmbH
VMP1 Introduction
1.4 Applied Standards
1.4.1 CE Compliance
The PEP Modular Computers’ VME systems comply with the requirements of the following CE-relevant standards:
• Emission EN50081-1
• Immission EN50082-2
• Electrical Safety EN60950
1.4.2 Mechanical Compliance
• Mechanical Dimensions IEEE 1101.10
1.4.3 Environmental Tests
• Vibration IEC68-2-6
Random Vibration, Broadband IEC68-2-64 (3U boards)
• Permanent Shock IEC68-2-29
• Single Shock IEC68-2-27
1.5 Related Publications
1.5.1 VME Systems/Boards
VME Specification, ANSI/VITA 1-1994 for VME, approved April 10, 1995
1.5.2 PMC Add-on Modules/Carriers
• Draft Standard for a Common Mezzanine Card Family, P1386/Draft 2.0
• Draft Standard Physical and Environment Layers for PCI Mezzanine Cards,
P1386.1/Draft 2.0
ID 26037, Rev. 01Page 1 - 8 ® 2002 PEP Modular Computers GmbH
VMP1
Functional Description
Functional Description
2.1 Functional Block Diagram .................................................... 2 - 3
2.2 Front Panels ........................................................................2 - 4
2.3 Board Layout .......................................................................2 - 5
2.4 Main Features ..................................................................... 2 - 6
2.4.1 CPU ............................................................................ 2 - 6
2.4.1.1 MPC8240 (Kahlua) Features ................................ 2 - 6
2.4.2 Memory ....................................................................... 2 - 8
Chapter
2
2.4.2.1 System Memory (DRAM) ......................................2 - 8
2.4.2.2 Flash .....................................................................2 - 8
2.4.2.3 EEPROM ..............................................................2 - 8
2.4.2.4 Memory Expansion Socket (DIL600) .................... 2 - 8
2.4.3 Board Interfaces .......................................................... 2 - 9
2.4.3.1 VME Interface and Pinout ..................................... 2 - 9
2.4.3.2 Ethernet Connector and Pinout ........................... 2 - 11
2.4.3.3 Serial Interfaces and Pinouts .............................. 2 - 12
2.4.3.4 PCI Expansion Connector and Pinout ................ 2 - 13
2.4.3.5 Serial Interface Expansion Connector & Pinout .. 2 - 16
2.4.3.6 Memory Expansion Connector ............................ 2 - 16
2.4.3.7 DEBUG Interface and Pinout ..............................2 - 17
2.4.4 Digital Temperature Sensor (LM75) .......................... 2 - 17
2.5 Special Board Features ..................................................... 2 - 18
2.5.1 Watchdog Timer ........................................................2 - 18
ID 26037, Rev. 01
Page 2 - 1® 2002 PEP Modular Computers GmbH
VMP1
Functional Description
Functional Description
2.5.2 RTC (STC M41T56) .................................................. 2 - 18
2.5.3 Reset/Abort ............................................................... 2 - 18
2.5.4 Front Panel LED’s ..................................................... 2 - 19
ID 26037, Rev. 01
Page 2 - 2® 2002 PEP Modular Computers GmbH
VMP1 Functional Description
2. Functional Description
2.1 Functional Block Diagram
Figure 2-1: Functional Block Diagram
PUSH
BUTTONS/
LED’S
SERIAL
INTERFACE
2 × 16550
compatible
SYSTEM
LOGIC
Serial IRQ
(Registry
Watchdog)
POWER
SUPPLY
2 × DC/DC
RESET
GENERATION
FLASH
2 × 4MB
Port X (8 bit wide)
RTC
M41T56
FLASH
SOCKET
DIP600,
<52kB
CPU
Motorola
MPC 8240
200-250 MHz
Memory Bus
64-bit
SYSTEM
MEMORY
SDRAM
32 - 128 MB
DEBUG
JTAG/T est
interface
PCI
EXPANSION
CONNECTOR
EEPROM
I2C
FAST
ETHERNET
82559ER
PCI Bus
32-bit 33 MHz
ID 26037, Rev. 01 Page 2 - 3® 2002 PEP Modular Computers GmbH
VME
INTERFACE
Tundra
Universe II
VMP1 Functional Description
2.2 Front Panels
Figure 2-2: Front Panels
WUH WUH
ABRST
LNK.
SPEEDACT.
WUH
ABRST
LNK.
SPEEDACT.
VMP1VMP1
UH
W
VMP1-IO1
Standard VMP1 and
Standard with IO1 Module
KEY
LED colors
(for B&W monitors
and printouts):
U = green
W = yellow
H = red
ABRST
LNK.
VMP1
ABRST
VMP1 Optoisolated version
and Optoisolated version
with IO1 Module - note the
LNK.
SPEEDACT.
VMP1
SPEEDACT.
VMP1-IO1
different position of the
SER 0 connector
ID 26037, Rev. 01Page 2 - 4 ® 2002 PEP Modular Computers GmbH
VMP1 Functional Description
2.3 Board Layout
Figure 2-3: VMP1 Board (Front View)
1
LED
RJ45
GND
RTC
UART
X BUS
BUFFERS
ABORT
& RESET
(Serial)
RJ45
(Term.)
LOGIC
12
11
LED
ETHERNET
1
2
GOLDCAP
BATTERY
(Optional)
ETHERNET
CPU
216
CON10
115
JTAG
Figure 2-4: VMP1 Board (Reverse View)
SDRAM MEMORY
BANK 1
DC/DC DC/DC
PCI TO VME
BRIDGE
1
2
PCI EXPANSION CONNECTOR
CON11
J1
99
100
SDRAM MEMORY
BANK 2
R3
R8 R6R7
R11R12R13
MAGNIFIED
R3
R8 R6R7
R11R12R13
ID 26037, Rev. 01 Page 2 - 5® 2002 PEP Modular Computers GmbH
VMP1 Functional Description
2.4 Main Features
The following descriptions provide an overview of the main features of the principa l functional blocks of the VMP1.
2.4.1 CPU
The VMP1 is based on the Motorola PowerPC processor MPC8240 which integrates a
large number of peripherals, such as a PCI interface, PCI arbiter, Interrupt Controller,
Memory Controller and multiple Timers. CPU speed is 250 MHz.
2.4.1.1 MPC8240 (Kahlua) Features
Important features of the MPC8240 implemented on the VMP1 are as follows:
Peripheral logic
Memory interface
• Programmable timing supporting either FPM DRAM, EDO DRAM or SDRAM
(The VMP1 uses SDRAM at 100 MHz)
• High bandwidth bus (64-bit data bus) to SDRAM
• 2 memory banks with up to 64 MB each (64 or 128 Mbit memory devices)
• Supports 32, 64, 96 and 128 MB SDRAM
• Contiguous memory mapping
• 8-bit ROM interface
• Write buffering for PCI and processor accesses
• Supports ECC
• SDRAM data path buffer
• Low voltage transistor-to-transistor logic (LVTTL)
• Port X: 8-bit general-purpose I/O port using ROM controller
interface with address strobe
32-bit PCI interface operating up to 33 MHz on the VMP1
• PCI Specification Revision 2.1 compatible
• PCI 5.0-V tolerance
• Support for PCI-locked accesses to memory
• Support for accesses to all PCI address spaces
• Selectable big- or little-endian operation
• Store gathering of processor-to-PCI write and PCI-to-memory write accesses
• Memory prefetching of PCI read accesses
• Selectable hardware-enforced coherency
• PCI bus arbitration unit (five request/grant pairs)
ID 26037, Rev. 01Page 2 - 6 ® 2002 PEP Modular Computers GmbH
VMP1 Functional Description
PCI agent mode capability
• Address translation unit
• Internal configuration registers accessible from PCI
• Two-channel integrated DMA controller
• Supports direct mode or chaining mode (automatic linking of DMA transfers)
• Supports scatter gathering - read or write discontinuous memory
• Interrupt on completed segment, chain, and error
• Local-to-local memory
• PCI-to-PCI memory
• PCI-to-local memory
• Local-to-PCI memory
Message unit
• I2O message controller
• Two door-bell registers
• In-bound and out-bound messaging registers
I2C controller with full master/slave support
Embedded programmable interrupt controller (EPIC)
• Five hardware interrupts (IRQs) or 16 serial interrupts
• Four programmable timers
Integrated PCI bus and SDRAM clock generation
Programmable memory and PCI bus output drivers
Debug features
• Watchpoint monitor
• Address attribute and PCI attribute signals
• JTAG/COP - common onboard processor for in-circuit hardware debugging
• Performance monitor
603e core
High performance, superscalar 603e core
SPECint95 = 6.2 / SPECfp95 = 5.2 / 352Dhrystone (2.1) MIPS
Integer unit (IU), floating point unit (FPU) (user enabled or disabled), load/store unit
(LSU), system register unit (SRU), and a branch processing unit (BPU)
16 kB instruction cache
16 kB data cache
Lockable L1 cache - entire cache or on a per-way basis
Dynamic power management
ID 26037, Rev. 01 Page 2 - 7® 2002 PEP Modular Computers GmbH
VMP1 Functional Description
2.4.2 Memory
2.4.2.1 System Memory (DRAM)
The main memory of the VMP1 consists of 32 MB or 64 MB SDRAM (128 MB available
on request) soldered onto the board for mechanical stability.
The VMP1 provides ECC support (optional) and a maximum memory speed of 100MHz.
2.4.2.2 Flash
4 or 8 MB of soldered Flash memory accommodate the bootstrap loader software and
can be used to store ROMable operating systems or user data. This Flash memory is 8bit wide and windowed with window sizes of 512 kB.
2.4.2.3 EEPROM
A serial EEPROM is provided, organised into 8 blocks with 256 bytes per block
(24LC16). This EEPROM is connected to the I2C bus provided by the MPC8240.
2.4.2.4 Memory Expansion Socket (DIL600)
The VMP1 provides one 32-pin DIL socket on which to place SRAM, non-volatile SRAM
or other DIL600 devices on the board. Access to this Memory is controlled by the
onboard logic.
The following devices may be added to the VMP1 via the 32-pin DIL600 socket:
• Standard Flash memory of up to 512 kB, for example, the AMD29F010 and
AMD29F040
• The NV SRAM from Dallas Semiconductor. These devices are available in the
temperature range –40°C to +85°C for the industrial environment and guarantee
a minimum data retention of 10 years (e.g. DS1250Y-100).
• Disk-on-chip Flash memory. In order to achieve flexibility with low cost, the VMP1
Flash disk is not soldered but connected via a special module from M-Systems
(Disk-on-Chip 2000) which comes in the following sizes:
2 - 24 MB (dimensions 41.7 x 17.9 x 5.6mm);
4 - 144 MB (dimensions 42.0 x 18.3 x 11.8mm).
ID 26037, Rev. 01Page 2 - 8 ® 2002 PEP Modular Computers GmbH
Loading...