Kontron TIGW1U User Manual
Kontron Carrier Grade Server
TIGW1U
Product Guide
December 2009
Rev. 1.3
Copyright © 2009, Kontron AG. All Rights Reserved.
All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully
checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and
all other trademaarks or registed trademarks are the property of their respective owners and are recognized. Specifications are
subject to change without notice.
Kontron Carrier Grade Server TIGW1U
Product Guide, rev. 1.3 December 2009
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Contents
1Introduction9
1.1 About this Manual............................................................................9
1.1.1 Manual Organization..............................................................9
1.2 What Your Server Includes............................................................. ..9
1.3 Product Accessories........................................................................10
1.4 Additional Information and Software.................................................10
2 Features...............................................................................................13
2.1 Server Components........................................................................15
2.2 Back Panel....................................................................................16
2.3 Front Panel....................................................................................16
2.4 Rear Panel Ethernet Ports................................................................18
2.5 SAS Front Panel (SFP) Board............................................................18
2.5.1 Front Panel Board Features...................................................18
2.6 Server Board Connector and Component Locations..............................19
2.7 Hard Disk Drives............................................................................20
2.8 Riser Card Assembly.......................................................................20
2.8.1 PCI/PCI-X Riser Card...........................................................20
2.8.2 PCI Express Riser Card.........................................................21
2.9 Power Supply................................................................................21
2.10 System Cooling..............................................................................21
2.10.1 Front Panel Cooling Area......................................................22
2.10.2 PCI Cooling Area ................................................................22
2.10.3 CPU / Memory / HDD Cooling Area........................................22
2.11 Hardware Requirements .................................................................22
2.11.1 Processor...........................................................................22
2.11.2 Memory.............................................................................22
3...... Server Installations and Upgrades........................................................23
3.1 Before You Begin23
3.1.1 Tools and Supplies Needed...................................................23
3.1.2 System References..............................................................23
3.1.3 Cable Routing Reference.......................................................23
3.2 General Installation Procedures........................................................24
3.2.1 Removing the Chassis Cover.................................................24
3.2.2 Installing the Chassis Cover..................................................25
3.2.3 Removing the Front Bezel.....................................................25
3.2.4 Installing the Front Bezel......................................................26
3.2.5 Removing the Processor Air Duct...........................................26
3.2.6 Installing the Processor Air Duct............................................27
3.3 Hot-Swappable Component Installation Procedures.............................27
3.3.1 Installing or Replacing a Hard Drive.......................................27
3.3.1.1 Removing a Hard Drive Tray from the Chassis............28
3.3.1.2 Attaching a Hard Drive to the Drive Tray...................28
3.3.2 Replacing a Power Supply Module .........................................29
3.3.2.1 Removing the Power Supply Module .........................30
3.3.2.2 Installing the Power Supply Module ..........................30
3.3.2.3 Grounding a DC-Powered System ............................30
3.4 Internal System Component Installation Procedures ...........................30
3.4.1 Configuring Jumpers on the Server Board ...............................31
3.4.1.1 Jumper Blocks ......................................................31
3.4.1.2 CMOS Clear and Password Reset Procedures .............32
3.4.1.3 BMC Force Update Procedure ..................................32
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3.4.1.4 BIOS Select Jumper ..............................................33
3.4.1.5 Serial B Port Configuration Jumper ..........................33
3.4.1.6 Processor Select Jumper .........................................33
3.4.2 Configuring Memory DIMMs .................................................34
3.4.2.1 DIMM Population Rules ...........................................35
3.4.2.2 Supported DIMM Configurations ............................. 35
3.4.2.3 Sparing Mode Memory Configuration .......................36
3.4.3 Installing and Removing Memory DIMMs ................................36
3.4.3.1 Installing DIMMs ...................................................36
3.4.3.2 Removing DIMMs ..................................................37
3.4.4 Adding or Replacing a Processor ...........................................37
3.4.4.1 ESD and Handling Processors ..................................37
3.4.4.2 Removing a Processor ............................................38
3.4.4.3 Installing a New Processor .....................................39
3.4.4.4 Setting the Processor Select Jumper ........................41
3.4.4.5 Installing the Heat Sink .................................... .....41
3.4.5 Installing or Replacing a PCI Add-in Card ........................... ...42
3.4.5.1 Removing the PCI Riser Card Assembly ....................42
3.4.5.2 Removing a PCI card from the Riser Card Assembly ...43
3.4.5.3 Installing a PCI Card in the Riser Card Assembly ... ...43
3.4.5.4 Installing the Riser Card Assembly onto the Server Board
...........................................................................45
3.4.6 Installing a SMART Embedded USB Solid-State Drive............... 46
3.4.7 Installing Hardware RAID Components ..................................47
3.4.7.1 Installing the Intel
®
RAID Smart Battery ..................48
3.4.7.2 Installing the RAID Activation Key and the ECC Mini-
DIMM ..................................................................50
3.5 Internal System Component Replacement Procedures .........................50
3.5.1 Replacing an Optical Device .................................................50
3.5.1.1 Removing the Optical Device Tray from the Chassis ...51
3.5.1.2 Installing a New Optical Drive .......................... ......52
3.5.2 Replacing a Fan Assembly ...................................................53
3.5.2.1 Replacing the CPU Four-Fan Assembly ......................54
3.5.2.2 Replacing the PCI Fan ............................................55
3.5.3 Replacing the SAS Front Panel Board .....................................56
3.5.3.1 Removing the SAS Front Panel (SFP) Board ..............56
3.5.3.2 Replacing the Light Pipe Assembly ...........................58
3.5.3.3 Installing the SFP Board .........................................58
3.5.4 Installing the Intel
®
Remote Management Module 2 ................59
3.5.4.1 Installing the GCM Module ......................................59
3.5.4.2 Installing the RMM2 ...............................................59
3.5.5 Replacing the Power Distribution Board ..................................61
3.5.5.1 Removing the Power Distribution Board ....................61
3.5.5.2 Installing the Power Distribution Board Back into the
Chassis ...............................................................61
3.5.6 Replacing the Server Board ..................................................62
3.5.6.1 Removing the Server Board ....................................62
3.5.6.2 Installing the Server Board Back into the Chassis ......63
3.5.7 Replacing the CMOS Battery on the Server Board ....................64
3.5.8 Installing the Battery Insulator .............................................67
3.6 Installing the Server into a Rack .......................................................68
3.6.1 Connecting the Power Cord ..................................................68
3.6.2 Equipment Rack Precautions ................................................68
4 Server Utilities .....................................................................................71
4.1 Using the BIOS Setup Utility ............................................................71
4.1.1 Starting Setup ...................................................................71
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4.1.2 If You Cannot Access Setup .................................................71
4.1.3 Setup Menus ......................................................................71
4.1.4 CMOS Clear and Password Reset Procedure ............................72
4.1.5 BMC Force Update Procedure ................................................73
4.2 Upgrading the BIOS .......................................................................73
4.2.1 Preparing for the Upgrade ....................................................73
4.2.1.1 Recording the Current BIOS Settings .......................74
4.2.1.2 Obtaining the Upgrade ...........................................74
4.2.2 Updating the BIOS ..............................................................74
4.3 Clearing the Password ....................................................................74
4.4 Clearing the CMOS .........................................................................75
5 Troubleshooting ...................................................................................77
5.1 Resetting the System .....................................................................77
5.2 Problems Following Initial System Installation ....................................77
5.2.1 First Steps Checklist ...........................................................77
5.3 Hardware Diagnostic Testing ...........................................................78
5.3.1 Verifying Proper Operation of Key System Lights .....................78
5.3.2 Confirming Loading of the Operating System ..........................79
5.4 Specific Problems and Corrective Actions ..........................................79
5.4.1 Power Light does not Light ...................................................79
5.4.2 No Characters Appear on Screen ...........................................79
5.4.3 Characters are Distorted or Incorrect ....................................80
5.4.4 System Cooling Fans do not Rotate Properly ..........................80
5.4.5 Cannot Connect to a Server .................................................80
5.4.6 Diagnostics Pass but the Connection Fails ..............................81
5.4.7 The Server Hangs When the Drivers are Loaded ......................81
5.4.8 The Controller Stopped Working When an Add-in Adapter was
Installed............................................................................81
5.4.9 The Add-in Adapter Stopped Working Without Apparent Cause ..81
5.4.10 System Boots When Installing a PCI Card ..............................81
5.4.11 Problems with Newly Installed Application Software .................82
5.4.12 Problems with Application Software that Ran Correctly Earlier ...82
5.4.13 Devices are not Recognized under Device Manager (Windows*
Operating System) .............................................................82
5.4.14 Hard Drive(s) are not Recognized .........................................82
5.5 LED Information ............................................................................83
5.6 BIOS Error Messages ......................................................................83
5.6.1 BIOS POST Beep Codes .......................................................84
6 Warranty ..............................................................................................87
A Safety Information ...............................................................................89
A.1 Emissions Disclaimer ......................................................................89
A.2 Intended Uses ...............................................................................89
A.2.1 If AC Power Supplies Are Installed ........................................89
A.2.2 If DC Power Supplies Are Installed ........................................90
A.2.3 Temperature and Ventilation.................................................91
A.3 Safety Cautions .............................................................................91
B Regulatory and Certification Information .............................................99
B.1 Product Regulatory Compliance .......................................................99
B.1.1 Product Safety Compliance ...................................................99
B.1.2 Product EMC Compliance - Class A Compliance .......................99
B.1.3 Certifications / Registrations / Declarations ............................99
B.2 Electromagnetic Compatibility Notices .............................................100
B.2.1 FCC (USA) .......................................................................100
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B.2.2 Industry Canada (ICES-003) ..............................................101
B.2.3 Europe (CE Declaration of Conformity) .................................101
B.2.4 VCCI (Japan) ...................................................................101
B.2.5 BSMI (Taiwan) .................................................................101
B.2.6 Regulated Specified Components ........................................102
C Getting Help .......................................................................................103
C.1 World Wide Web ..........................................................................103
C.2 Telephone ..................................................................................103
C.3 Emai .........................................................................................l103
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Revision History
Date Revision Description
December 2009 005 Kontron version; Changed all Z-U130 drive references to SMART Embedded USB Solid-State Drive
®
Edited processor information to include Quad-Core Intel
Minor grammar and formatting changes.
April 2008 004
April 2007 003 Added more recent information to Appendix A, “Safety Information” based on agency input.
April 2007 002
March 2007 001 Initial version
Added Intel
Removed SysCon board
Updated RAID component product names
Updated Intel
Added the “Configuring Jumpers on the Server Board” section.
Added the “Recovery Jumpers” section.
Added the “Serial Port B Configuration Jumper” section.
Added the “Configuring Memory DIMMs” section.
Added new Fan Replacement, SysCon board installation, and Hardware RAID 5 component
installation sections to Chapter 3.
®
Z-U130 Value Solid State Drive
®
Remote Management Module product name
Xeon® processors 5400 series.
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TIGW1U server—
Kontron Carrier Grade Server TIGW1U
Product Guide, rev. 1.3 December 2009
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December 2009Introduction—TIGW1U server
1 December 2009Introduction
1.1 About this Manual
Thank you for purchasing and using the Kontron Carrier Grade Server TIGW1U.
This manual is for system technicians who are trained and responsible for
troubleshooting, upgrading, and repairing this server. This document provides a brief
overview of the features of the board/chassis, a list of accessories or other components
you may need, troubleshooting information, and instructions on how to add and replace
components on the TIGW1U server.
Note: See the Support web site at http://us.kontron.com/support/ for the latest version of
this manual.
1.1.1 Manual Organization
Chapter 2 provides a brief overview of the TIGW1U server. In this chapter, you will find
a list of the server board features, chassis features, illustrations of the product, and
product diagrams to help you identify components and their locations.
Chapter 3 provides instructions on adding and replacing components. Use this chapter
for step-by-step instructions and diagrams for installing or replacing components such
as the memory, processor(s), front panel board, the battery, and other components.
Chapter 4 provides instructions on using the utilities that are shipped with the board or
that may be required to update the system. This includes how to navigate through the
BIOS (Basic Input/Output System) Setup screens, how to perform a BIOS update, and
how to reset the password or CMOS (Complementary Metal Oxide Semiconductor).
Information about the specific BIOS settings and screens is available in the Intel
Server Board S5000PHB Technical Product Specification.
Chapter 5 provides troubleshooting information. In this chapter, you will find BIOS
error messages and POST (Power-on Self Test) code messages. You will also find
suggestions for performing troubleshooting activities to identify the source of a
problem.
®
1.2 What Your Server Includes
Your Kontron Carrier Grade Server TIGW1U includes the following components:
®
•One Intel
• One 1U chassis
• Three SAS hard disk drive trays
• One optical drive
• A PCI-X* riser card assembly
• DC or AC power subsystem (one hot-swappable PSU; for redundancy a separately
orderable supply is needed) and power distribution board (PDB)
Server Board S5000PHB server board
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• Four dual-rotor fans for cooling the processor(s), DIMM(s), PCI slot(s) and other
internal components
• SAS front panel (SFP) board
• Cables and connectors
See the Kontron Carrier Grade Server TIGW1U-F Hardware Reference Guide for initial
installation instructions.
1.3 Product Accessories
You may need or want to purchase one or more of the following accessory items for
your server:
• One or two Dual-Core Intel
• Processor heat sink(s)
• 24 Gbyte DDR2-667 FBD ECC memory DIMM(s)
• SAS hard disk drives (HDDs)
• PCI-Express* (PCIe*) riser card; instead of the PCI-X riser card installed
• PCI-X or PCIe add-in card
• AC or DC power supply; second one for redundancy and hot-swapping
• Rack mount kit
•One Intel
®
Xeon
processor 5400 Series
®
Remote Management Module 2 (Intel® RMM2) and RMM NIC
TIGW1U server—December 2009Introduction
®
Xeon® processor 5100 Series or Quad-Core Intel®
For information about the accessories, memory, processors, and third-party hardware
that have been tested and can be used with your system, and for ordering information
for Intel products, see the accessories and spares list at
http://us.kontron.com/products/systems+and+platforms/
commuincation+rackmount+servers/ip+network+servers/
ip+network+server+nsw1u.html.
Click on Downloads, and then Ordering Guide. Click on Downloads, and then Ordering
Guide
1.4 Additional Information and Software
If you need more technical information about this product or information about the
accessories that can be used with this TIGW1U server, see the Technical Product
Specifications (for both system and server board) and the test reports at
http://us.kontron.com/support/ for the following types of information:
• In-depth technical information about the server board included with this server,
including BIOS settings and chipset information
• The latest product information
• Accessories or other Intel server products
• Hardware (peripheral boards, adapter cards) and operating systems that have been
tested with this product
• DIMMs that have been tested with this product
• The power budget for this product
• Software to manage your server
• Diagnostics testing software
• Firmware and BIOS updates
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December 2009Introduction—TIGW1U server
•System drivers
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TIGW1U server—December 2009Introduction
Kontron Carrier Grade Server TIGW1U
Product Guide, rev. 1.3 December 2009
12
Features—TIGW1U server
AF000800
2Features
This chapter briefly describes the main features of the Kontron Carrier Grade Server
TIGW1U. This chapter provides a diagram of the product, a list of the server features,
and diagrams showing the location of important components and connections on the
server system.
Figure 1 shows the Kontron Carrier Grade Server TIGW1U.
Figure 1. Kontron Carrier Grade Server TIGW1U
Tab le 1 summarizes the major features of the server system.
Table 1. Kontron Carrier Grade Server TIGW1U Features
Feature Description
Compact, high-density
system
Configuration flexibility
Serviceability
December 2009 Product Guide, rev. 1.3
Rack-mount server with a height of 1U (1.75 inches) and a depth of 20.0 inches
Two-way capability in low profile and cost/value-effective packaging
Stand-alone system
Support for two processors: Dual-Core Intel
Quad-Core Intel
Note: Quad-Core Intel
TIGW1U server systems that have product codes TMRA0201W and TMRD0201W.
Rear access to hot-swappable power supplies
Front access to hot-swappable disk drives
®
Xeon® processor 5400 Series
®
Xeon® processor 5400 series support is available only on
®
Xeon® processor 5100 Series or
Kontron Carrier Grade Server TIGW1U
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Table 1. Kontron Carrier Grade Server TIGW1U Features (Continued)
Feature Description
Two hot-swappable 450 W power supplies in a redundant (1+1) configuration
Integrated support for software RAID levels 0 and 1 using three internal hot-
swappable 2.5-inch SAS disk drives and RAID levels 0, 1, and 10 when using
Availability
Manageability
Upgradeability and
investment protection
System-level scalability
Front panel
I/O
additional external SAS drive(s) through rear-panel connector.
Supports ROMB (RAID On Mother Board) hardware RAID operation for RAID 5
capability with addition of optional Intel
DIMM.
®
RAID Activation Key and ECC Mini-
Memory rank sparing
Remote management and diagnostics support
Emergency management port (serial and LAN)
IPMI 2.0-compliant
Support for optional SMART Embedded USB Solid-State Drive
Supports two processors from the Dual-Core Intel
or from the Quad-Core Intel
Note: Quad-Core Intel
TIGW1U server systems that have product codes TMRA0201W and
TMRD0201W.Multi-generational chassis
Supports Intel
Supports 24 Gbyte DDR2-533 or DDR2-667 MHz Registered SDRAM FBD DIMM
memory
Two sockets for Dual-Core Intel
®
Intel
Note: Quad-Core Intel
TIGW1U server systems that have product codes TMRA0201W and
TMRD0201W.Full-height, full-length, 64-bit x 100/66 MHz PCI-X or x8 PCI
Express slot
®
64 architecture
Xeon® processor 5400 Series
®
Xeon® processor 5400 Series
®
Xeon® processor 5400 series support is available only on
®
Xeon® processor 5100 Series or Quad-Core
®
Xeon® processor 5400 series support is available only on
Three internal hot-swappable 2.5-inch hard disk drives
Supports up to four external SAS hard disk drives
Low profile optical drive
Power switch
Reset switch
NMI switch
ID switch
Main power LED
HDD activity LED
Front Access:
• Serial B port (RJ45)
•USB port
NIC activity LED
ID LED
Telco power alarm fault LED/relay
Telco critical alarm fault LED/relay
Telco major alarm fault LED/relay
Telco minor alarm fault LED/relay
Rear Access:
• Dual PS/2 ports for keyboard and
mouse
• Serial B port (RJ45)
•Two USB ports
• Four GbE ports
• 100 Mb RMM management port
• SAS 4x drive port with RAID
support
•Video port
• Telco alarms port
TIGW1U server—Features
®
Xeon® processor 5100 Series
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Features—TIGW1U server
2.1 Server Components
Figure 2 shows the internal components of the TIGW1U server (top cover and front
bezel removed).
Figure 2. Carrier Grade Server TIGW1U Components
C
B
A
D
E
F
M
L
K
J
I
Item Description Item Description
A SAS front panel (SFP) board H System fans
B Power distribution board (PDB) I SAS hard disk drive bays
C Power supplies (AC or DC) J Optical drive
D PCI card bracket (full-length) K
E Riser card assembly L Front panel LEDs and switches
F Server board M
G System memory
SMART Embedded USB Solid-State Drive
(optional)
Front panel serial port (COM2 / Serial B),
USB connector
G
H
AF000801
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TIGW1U server—Features
AF000813
A
R Q P N M L KO
B C D E F G H I J
AF000806
A
D
B C
2.2 Back Panel
Note: Figure 3 shows the AC input power configuration. Items G to J can also be configured
for DC operation.
Figure 3. Rear View
Item Description Item Description
A PS/2 mouse J AC power socket
B RJ45 serial port (COM2/Serial B) K External x4 SAS connector
®
Intel
C RJ45 NIC connector L
D RJ45 NIC connector M RJ45 NIC connector
E PCI add-in card bracket or filler panel N RJ45 NIC connector
F Ground studs for DC input (2) O USB port 0 and USB port 1
G Power supply #1 P Telco alarms connector
H AC power connection Q Video connector
I Power supply #2 R Keyboard connector
Remote Management Module 2
®
RMM2) connector (optional)
(Intel
2.3 Front Panel
Figure 4. Front View (Bezel Installed)
Item Description Item Description
A RJ45 serial port (COM2/Serial B) C Optical drive
B Control panels D USB port 2
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Features—TIGW1U server
AF000807
A
H G
C
F
E
D
Alarms
Status
ID ONNIC
CRT MNR PWRMJR
B
Figure 5. Front View (Bezel Removed)
Item Description Item Description
A RJ45 serial port (COM2/Serial B) E Drive bay 1 and handle
B Front panel control switches and LEDs F Drive bay 2 and handle
C Optical drive G
D Drive bay 0 and handle H USB port 2
HDD LEDs
top = fault (amber)
bottom = activity (ready/green;
active/blinking green)
Figure 6. Control Panel
Item Feature Description
A Power switch Toggles the system power
B Reset switch Resets the system
K ID switch Toggles the system ID LED
L NMI switch Asserts NMI to the server board
C Critical (amber)
A
B
C
CRT MNR PWRMJR
ID ONNIC
D
E F
Alarms
Status
L GHIJK
AF000808
Front Panel Switches
Front Panel Alarm LEDs and Relays
When continuously lit, this indicates a Critical System Fault. A critical system
fault is an error or event with a fatal impact to the system. In this case, the
system cannot continue to operate. An example is the loss of a large section
of memory, or other corruption, that renders the system non-operational.
The front panel critical alarm relay engages.
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Item Feature Description
When continuously lit, it indicates a Major System Fault. A major system
fault is an error or event that has discernable impact to system operation. In
DMajor (amber)
E Minor (amber)
F Power (amber)
Disk activity/fault LED
G
(green/amber)
Main power LED
H
(green)
NIC activity LED
I
(green)
J System ID LED (white)
this case, the system can continue to operate but in a “degraded” fashion
(reduced performance or loss of non-fatal feature reduction). An example is
the loss of one of two mirrored disks. The front panel major alarm relay
engages.
When continuously lit, it indicates a Minor System Fault. A minor system
fault is an error or event that is detected by the system but likely has little
impact to system operation. An example is a correctable ECC error. The front
panel minor alarm relay engages.
When continuously lit, it indicates a Power System Fault. The front panel
power alarm relay engages.
Front Panel Status LEDs
Indicates SAS hard drive activity when blinking green, or a disk SAS hard
drive fault when amber. See the SAS HDD LEDs to determine specific drive
activity or fault.
When continuously lit, it indicates the presence of DC power in the server.
The LED goes out when the power is turned off or the power source is
disrupted.
Indicates NIC activity
Indicates system identity. THis LED can be toggled remotely or by frontpanel ID switch for identification purposes
TIGW1U server—Features
2.4 Rear Panel Ethernet Ports
The server has four GbE NIC ports mounted on the server board. These ports are
accessible from the rear of the chassis. Copper and fiber options are available. An
additional set of four rear-accessible GbE NIC ports can be added by using an x4 GbE
NIC PCI Express* (PCIe*) or PCI-X* card with rear I/O panel access ports. There are no
GbE NIC ports accessible from the front of the TIGW1U server.
The GbE NIC ports are intended to be installed with shielded cabling that is grounded at
both ends of the cable.
Warning: The intra-building port(s) of the equipment or subassembly is suitable for connection to
intra-building or unexposed wiring or cabling only. The intra-building port(s) of the
equipment or subassembly MUST NOT be metallically connected to interfaces that
connect to the OSP or its wiring. These interfaces are designed for use as intra-building
interfaces only (Type 2 or Type 4 ports as described in GR-1089-CORE, Issue 4) and
require isolation from the exposed OSP cabling. The addition of Primary Protectors is
not sufficient protection in order to connect these interfaces metallically to OSP wiring.
2.5 SAS Front Panel (SFP) Board
The SAS front panel (SFP) board is located in front of the power supplies and extends
behind the hard drives. The SAS drives connect into the SFP board for power and
signals. The SFP board also provides optical drive and fan power connectors and the
user interface for the system’s front panel.
2.5.1 Front Panel Board Features
The SFP board has the following features:
• Four switches to control power-on, reset, NMI, and the system ID LED
• Four alarm relay and power relay LEDs
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Features—TIGW1U server
AF000765
DE G H I LKJFA BC
R PQS
M
N
BB
DD
T
O
V
X
W
U
Y
Z
AA
CC
• One system ID LED that can be controlled remotely or by the system ID switch
• Two system activity LEDs that indicate power-on and NIC activity
• One hard drive activity LED that indicates fault status for drives 0 and 1
• Three hot-swappable SAS hard drives
• Connectors on the SFP board for interfacing to the server board and fans
2.6 Server Board Connector and Component Locations
Figure 7. Server Board Connector and Component Locations
Item Description Item Description
A SAS connector P CPU #2 socket
B System identification LED (blue) Q CPU #1 socket
C Systen status LED (green/amber) R CMOS battery
D Serial Port B DSR/DCD jumper (J2A2) S Flex connector to front panel board
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E RMM NIC connector T Serial Port A header
F PCI Express/PCI-X riser card super slot U Main power connector
G POST code diagnotic LEDs V PATA (IDE) connector
H Dual-port LAN connector W Password clear jumper (J1H2)
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Item Description Item Description
I Dual-port LAN connector X BIOS Bank Select jumper (J1G1)
J Dual USB 2.0/RJ45 serial port B connector Y Intel
K Telco alarms connector Z CMOS Clear jumper (J1F1)
L Video connector AA BMC Force Update jumper (J1E3)
M PS/2 keyboard and mouse connector BB 3-Pin IPMB header
N FBDIMM slots CC Processor select jumper
OIntel
®
500P Memory Controller Hub (MCH) DD
2.7 Hard Disk Drives
The TIGW1U server chassis provides three hot-swappable hard drive tray assemblies at
the front of the chassis.
For information on how to install these drives, see Section 3.3.1, “Installing or
Replacing a Hard Drive”.
TIGW1U server—Features
®
ESB2-E I/O controller hub
®
Intel
Remote Management Module 2
®
(Intel
RMM2) connector
Note: The TIGW1U server does not support all SAS hard drives. For a list of validated hard
drive manufacturers and hard drive types, see the Tested Hardware and Operating
Systems List (THOL) on the Kontron support website at
http://us.kontron.com/support/.
(Search for TIGW1U, click on Product Downloads, and then Compatability Matrix.)
Each drive can consume up to 17 W of power. Drives must be specified to run at a
maximum ambient temperature of 45° C.
2.8 Riser Card Assembly
The TIGW1U server default riser card assembly contains a PCI-X riser card. There is
also a PCI Express (PCIe) version available as a separately orderable accessory.
The S5000PHB server board implements a PCI super slot that contains the signals
necessary for a PCI/PCI-X or PCIe expansion slot. One of two different low-profile riser
cards is inserted into the super slot to access the appropriate signals and provide the
appropriate connector for a PCI/PCI-X or PCIe riser card. (See Figure 7 for this
location.) The Carrier Grade Server TIGW1U is designed to accommodate full-length,
full-height PCI add-in cards with the card’s I/O bracket accessible through an opening
in the rear panel of the system.
The PCI/PCI-X riser card supports speeds of 33 or 66 MHz PCI and 100 or 133 MHz
PCI-X.
The PCIe riser card implements a x8 link interface, and can be used with add-in cards
that implement x1, x4, or x8 interfaces.
See Section 3.4.5, “Installing or Replacing a PCI Add-in Card” for how to install a PCI
add-in card or how to replace the default PCI-X riser card assembly with a PCIe version.
2.8.1 PCI/PCI-X Riser Card
The PCI/PCI-X riser card, which is the default riser card installed in the assembly,
supports one 3.3 V 64-bit slot and speeds of 33 or 66 MHz for PCI and 66, 100, or
133 MHz for PCI-X. The bus speed varies from 66 MHz to 100 MHz depending on the
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Features—TIGW1U server
Front Panel
Board Area
Airflow
PCI Area
Airflow
CPU-Memory-
HDD Area
Airflow
TS000216
type of PCI add-in card configured in the PCI-X riser card. For detailed information
about the pinouts and electrical specifications, see the Kontron Carrier Grade Server
TIGW1U Technical Product Specification.
2.8.2 PCI Express Riser Card
The PCI Express (PCIe) riser card implements a x8 link interface and can be used with
add-in cards with a x1, x4, or x8 interface. For detailed information about the pinouts
and electrical specifications, see the Kontron Carrier Grade Server TIGW1U Technical
Product Specification.
2.9 Power Supply
The power subsystem has up to two power supply modules capable of operating in
redundant mode and a power distribution board (PDB). A power supply filler panel for
the empty power supply site is supplied for systems without redundancy.
The power supply is rated for 450 W output capability in full AC (or DC) input voltage
range.
2.10 System Cooling
There are three cooling areas in the TIGW1U server: front panel board area, PCI area,
and CPU-memory-HDD area.
Figure 8. Cooling Areas
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2.10.1 Front Panel Cooling Area
The left one-fourth of the SFP board and the portion of the power distribution board
(PDB) in this area are cooled by 40 x 40 x 56 mm PSU dual-rotor fans. One PSU fan is
sufficient to cool this portion of the front panel board area and two PSU fans provide
cooling redundancy for this area.
PSU fans draw air in through the front bezel and from vents in the left front side of the
chassis. The air is exhausted out the rear of the PSUs. The left wall of the PCI fan air
duct and the PSU guide wall provide an air flow barrier between the front panel board
cooling area and the PCI cooling area.
2.10.2 PCI Cooling Area
The 40 x 40 x 28 mm single-rotor PCI fan cools the portions of the server board, PDB,
and SFP that are in this area as well as a PCI add-in card installed in the riser card
assembly.
The PCI fan draws in air is through the front bezel and exhausts through the rear of the
system. A plastic air duct directs the air flow in this area, houses the PCI fan, and
provides air flow barriers between:
• The front panel board and the PCI cooling areas
• The PCI and the CPU / memory / HDD cooling areas
TIGW1U server—Features
A second plastic part behind the PCI air duct continues the air flow barrier between the
PCI cooling area and the CPU / memory / HDD cooling area. The riser card provides the
third portion of the air flow barrier between the PCI cooling area and the CPU / memory
/ HDD cooling area.
2.10.3 CPU / Memory / HDD Cooling Area
The server uses four 40 x 40 x 56 mm dual-rotor fans that are assembled in a sheet
metal bracket attached to the chassis.
The server draws air in through the front bezel and exhausts it out the rear of the
chassis. The CPU / memory / HDD cooling area air flow path is isolated from the rest of
the system by an air duct and riser card. Air entering the CPU / memory air duct is
preheated by the hard drives.
2.11 Hardware Requirements
To avoid integration difficulties and possible board damage, your system must meet the
requirements outlined in the subsections below. For a list of qualified components, see
Section 1.4, “Additional Information and Software”.
2.11.1 Processor
The S5000PHB server boardaccommodates two Dual-Core Intel® Xeon® processor
5100 Series or two Quad-Core Intel
2.11.2 Memory
®
Xeon® processor 5400 series.
The S5000PHB server board supports up to six DDR2-533 or DDR2-667 Fully Buffered
DIMMs (FBD memory) in six DIMM slots across two channels, Channel 0 and Channel 1.
Channel 0 consists of DIMM sockets A1, A2, and A3. Channel 1 consists of DIMM
sockets B1, B2, and B3. See Section 3.4.2, “Configuring Memory DIMMs” on page 34
for population rules and configuration information.
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Server Installations and Upgrades—TIGW1U server
3 Server Installations and Upgrades
3.1 Before You Begin
Before working with your server product, pay close attention to the safety instructions
provided in this manual. See Appendix A, “Safety Information”.
Warning: Electrostatic discharge (ESD) and ESD protection: ESD can damage disk drives,
boards, and other parts. We recommend that you perform all procedures in this chapter
only at an ESD workstation. If an ESD workstation is not available, provide some ESD
protection by wearing an antistatic wrist strap attached to chassis ground (any
unpainted metal surface) on your server when handling parts.
3.1.1 Tools and Supplies Needed
• Phillips* (cross-point) screwdriver (#1 bit and #2 bit)
• Anti-static wrist strap and conductive foam pad
3.1.2 System References
All references to left, right, front, top, and bottom assume that you are facing the front
of the server, as it would be positioned for normal operation.
3.1.3 Cable Routing Reference
It is important for cables to be connected correctly. See Figure 9. For more detailed
information about cable connectors, see the Kontron Carrier Grade Server TIGW1U
Technical Product Specification.
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Figure 9. TIGW1U server System Cable Routing
TIGW1U server—Server Installations and Upgrades
3.2 General Installation Procedures
The following sections present general installation and removal procedures that are
required before removing or installing non-hot-swappable internal components.
3.2.1 Removing the Chassis Cover
The TIGW1U server must be operated with the top cover in place to ensure proper
cooling. You need to remove the top cover to add or replace components inside of the
server. Before removing the top cover, power down the server system and unplug all
peripheral devices and the power cable.
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Server Installations and Upgrades—TIGW1U server
A
B
C
TS000201
Note: A non-skid surface or a stop behind the server may be needed to prevent the server
from sliding on your work surface.
1. Observe the safety and ESD precautions in Appendix A, “Safety Information”.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Disconnect the power cord.
4. Remove the shipping screw from the front of the chassis on the left side (“A”), if
present.
5. While pressing down the blue button at the top of the chassis (“B”), slide the top
cover back until it stops. (“C”).
6. Lift the cover straight up to remove it. (“C”)
Figure 10. Removing the Chassis Cover
3.2.2 Installing the Chassis Cover
1. Place the cover over the chassis so that the side edges of the cover sit just inside
the chassis sidewalls, with the front of the cover with about a 1/8-inch (3-mm) gap
between the chassis cover and the sheet-metal at the front of the chassis.
2. Press down slightly on the chassis cover behind the peripheral area and slide the
cover forward until it clicks into place.
3. (Optional) Install the shipping screw.
4. Reconnect all peripheral devices and the power cord.
Caution: This unit must be operated with the top cover installed to ensure proper cooling.
3.2.3 Removing the Front Bezel
Note: Hold the bezel in place while you loosen the screws. After both screws are loosened,
the bezel drops from the chassis.
1. Remove the left-side screw. (“A” in Figure 11)
2. Remove the right-side screw to release the bezel.
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Figure 11. Removing the Front Bezel
A
TIGW1U server—Server Installations and Upgrades
A
TS000202
3.2.4 Installing the Front Bezel
While holding the front bezel in place, tighten the captive screws at the left and right
edges of the bezel.
3.2.5 Removing the Processor Air Duct
The air duct must be removed to access the processors, memory DIMMs, and the fourfan assembly. The processor air duct is required for proper airflow within the chassis.
Be sure the air duct is in place before installing the chassis cover. To remove the
processor air duct:
1. Power down the server system and unplug all peripheral devices and the AC power
cable.
2. Remove the chassis cover. For instructions, see Section 3.2.1, “Removing the
Chassis Cover” on page 24.
3. Lift the air duct straight up and lift it from the chassis (“A” in Figure 12).
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Server Installations and Upgrades—TIGW1U server
TS000203
A
Figure 12. Removing the Air Duct
3.2.6 Installing the Processor Air Duct
1. Place the processor air duct over the processor sockets and four-fan assembly,
using caution to make sure you do not pinch any wires beneath the edges of the air
duct.
The top of the installed air duct should be flush with the top surface of the PCI riser
card assembly.
2. Replace the chassis cover if you have completed all work inside of the chassis.
3.3 Hot-Swappable Component Installation Procedures
The following components are hot-swappable and do not require powering down the
system or removing the chassis cover:
• Hard disk drives
• AC and DC power supplies
3.3.1 Installing or Replacing a Hard Drive
Up to three hot-swappable drives can be installed in your TIGW1U server. You must
remove the front bezel to add or replace a hard drive.
Caution: If you install fewer than three hard drives, the empty bays must be populated with
drive trays that have baffles in them to maintain proper system cooling.
The Carrier Grade Server TIGW1U does not support all SAS hard drives. To see a list of
validated manufacturers and hard drive types, go to:
http://us.kontron.com/support/
Search for TIGW1U, click on Product Downloads, and then select Compatibility Matrix.
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TIGW1U server—Server Installations and Upgrades
A
TS000218
TS000219
A
3.3.1.1 Removing a Hard Drive Tray from the Chassis
1. Remove the front bezel. For instructions, see Section 3.2.3, “Removing the Front
Bezel” on page 25.
2. Select the drive bay where you want to install the drive. Remove the drive tray by
pressing the green button to open the lever.
Note: If you will have fewer than three drives installed, drive bay 0 must be used first, then
drive bay 1.
3. Pull the drive tray assembly out of the chassis. (“A” in Figure 13)
Figure 13. Removing a Drive Tray from the Chassis
3.3.1.2 Attaching a Hard Drive to the Drive Tray
1. If a drive is already installed (that is, if you are replacing the drive), remove it by
unfastening the four screws that attach it to the drive tray. (“A” in Figure 14)
Figure 14. Removing a Disk Drive from the Drive Tray
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Server Installations and Upgrades—TIGW1U server
AF000810
A
B
AF000809
A
C
B
D
2. Install the new drive in the drive tray and secure the drive with the four screws that
come with the drive tray. (“A” and “B” in Figure 15)
Figure 15. Installing a Hard Drive
3. With the drive tray locking lever fully open, push the hard drive tray into the drive
bay in the chassis until it stops. (“A”, “B” and “C” in Figure 16)
4. Press the lever until it snaps shut to close the drive in the bay. (“D”)
Figure 16. Inserting a New Drive Assembly into the Chassis
5. Replace the front bezel.
3.3.2 Replacing a Power Supply Module
Caution: Your server does not have a redundant power supply unless you have purchased the
optional second power supply module. If there is no second supply, before replacing the
power supply you must first take the server out of service, turn off all peripheral
devices connected to the system, turn off the system by pressing the power button,
and unplug the power cord from the system or wall outlet.
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TIGW1U server—Server Installations and Upgrades
DC PS
AC PS
TS000204
A
B
B
C
D
To maintain hot-swap capability, make sure an active power supply module is in each
chassis slot before replacing (hot-swapping) a power supply module.
3.3.2.1 Removing the Power Supply Module
1. Check the status LED to determine which power supply has failed (“A” in
Figure 17). Disconnect the appropriate power cable.
2. Press and hold the green safety lock to the left to disengage the power supply
module.
3. Grasp the handle and pull the power supply from the chassis. (“B”)
Figure 17. AC and DC Power Supplies
3.3.2.2 Installing the Power Supply Module
Press and hold the green safety lock to the left and slide the power supply module into
the chassis slot.
3.3.2.3 Grounding a DC-Powered System
The DC chassis provides two #10-32 threaded studs for chassis enclosure grounding.
A single 90º standard barrel, two-hole, compression terminal lug with 5/8-inch pitch
suitable for #14-10 AWG conductor (such as the Thomas & Betts* terminal lug p/n
256-31426-141) must be used for proper safety grounding. See “D” in Figure 3, “Rear
View” on page 16 for the location of the ground studs.
A crimping tool may be needed to secure the terminal lug to the grounding cable.
3.4 Internal System Component Installation Procedures
Note: The procedures in this section assume that you have powered down the server and
removed the chassis cover as described in Section 3.2, “General Installation
Procedures” on page 24.
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