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TIGH2U
User Manual
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Kontron TIGH2U User Manual

Kontron Carrier Grade Server TIGH2U
Product Guide
December 2009
Rev. 1.2
Legal Lines and Disclaimers
Copyright © 2009, Kontron AG. All Rights Reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is
believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademaarks or registed trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice.
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 2
Contents—TIGH2U Server
Contents
1Introduction..............................................................................................................8
1.1 About this Manual ...............................................................................................8
1.1.1 Manual Organization.................................................................................8
1.2 What Your Server Includes ...................................................................................9
1.3 Product Accessories .............................................................................................9
1.4 Additional Information and Software .................................................................... 10
2Features..................................................................................................................11
2.1 Server Components........................................................................................... 13
2.2 Back Panel ....................................................................................................... 14
2.3 Front Panel....................................................................................................... 15
2.4 Rear Panel Ethernet Ports...................................................................................18
2.5 SAS Front Panel (SFP) Board .............................................................................. 18
2.5.1 SFP Board Features ................................................................................ 18
2.6 Telco Alarms Manager Board...............................................................................18
2.6.1 TAM Board Features ............................................................................... 19
2.7 Server Board Connector and Component Locations ................................................ 19
2.8 Hard Disk Drives ............................................................................................... 20
2.9 Riser Card Assembly.......................................................................................... 21
2.9.1 Full-Height PCI-X/PCIe Riser Card.............................................................21
2.9.2 Low-Profile PCIe Riser Card ..................................................................... 21
2.10 Power Supply.................................................................................................... 22
2.11 System Cooling................................................................................................. 22
2.11.1 CPU 1 and Memory Cooling Area .............................................................. 23
2.11.2 CPU 2 and Chipset Cooling Area ...............................................................23
2.11.3 PCI Cooling Area .................................................................................... 23
2.11.4 Hard Disk Drive and Power Supply Cooling................................................. 23
2.11.5 Fan Speed Control.................................................................................. 23
2.11.6 Cooling Summary................................................................................... 24
2.12 Hardware Requirements..................................................................................... 24
2.12.1 Processor .............................................................................................. 24
2.12.2 Memory ................................................................................................ 24
3 Server Component Installations and Upgrades ........................................................25
3.1 Before You Begin............................................................................................... 25
3.1.1 Tools and Supplies Needed ...................................................................... 25
3.1.2 System References................................................................................. 25
3.2 General Installation Procedures........................................................................... 25
3.2.1 Removing the Front Bezel........................................................................ 25
3.2.2 Installing the Front Bezel......................................................................... 26
3.2.3 Removing the Chassis Cover.................................................................... 26
3.2.4 Installing the Chassis Cover..................................................................... 27
3.2.5 Removing the Processor Air Duct.............................................................. 28
3.2.6 Installing the Processor Air Duct............................................................... 29
3.3 Hot-Swappable Component Installation Procedures................................................ 30
3.3.1 Installing or Replacing a Hard Drive ..........................................................30
3.3.1.1 Removing a Hard Drive Tray....................................................... 30
3.3.1.2 Attaching a Hard Drive to the Drive Tray...................................... 31
3.3.2 Replacing a Power Supply........................................................................ 32
3.3.2.1 Removing the Power Supply Module ............................................ 33
3.3.2.2 Installing a Power Supply Module ................................................ 33
3.3.2.3 Installing or Replacing a DC Power Supply.................................... 34
3.3.2.4 Grounding a DC-Powered System................................................ 34
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Kontron Carrier Grade Server TIGH2U
TIGH2U Server—Contents
3.4 Internal System Component Configuration and Installation Procedures .....................34
3.4.1 Configuring Jumpers on the Server Board ..................................................34
3.4.1.1 Configuration Jumpers ...............................................................35
3.4.1.2 BIOS Select Jumper...................................................................36
3.4.1.3 DCD/DSR Signal Select Jumper...................................................37
3.4.2 Configuring Memory DIMMs......................................................................37
3.4.2.1 Memory RASUM Features ...........................................................39
3.4.2.2 Supported Memory....................................................................39
3.4.2.3 DIMM Population Rules and Supported DIMM Configurations ...........40
3.4.2.4 Non-Mirrored Mode Minimum Configuration...................................41
3.4.2.5 Non-Mirrored Mode Memory Upgrades..........................................42
3.4.2.6 Mirrored Mode Memory Configuration...........................................42
3.4.2.7 DIMM Sparing Mode Memory Configuration...................................43
3.4.2.8 Single Branch Mode Sparing ......................................................43
3.4.2.9 Dual Branch Mode Sparing..........................................................43
3.4.3 Installing DIMMs.....................................................................................44
3.4.4 Removing Memory DIMMs........................................................................45
3.4.5 Adding or Replacing a Processor ...............................................................46
3.4.5.1 ESD and Processor Handling Precautions ......................................46
3.4.5.2 Removing a Processor................................................................47
3.4.5.3 Installing a New Processor..........................................................48
3.4.5.4 Installing the Heat Sink..............................................................50
3.4.6 Other Installation and Upgrade Options .....................................................50
3.5 Installing the Server into a Rack ..........................................................................50
3.5.1 Connecting the Power Cord ......................................................................50
3.5.2 Equipment Rack Precautions ....................................................................51
4 Optional Component Installations ............................................................................52
4.1 Before You Begin ...............................................................................................52
4.1.1 Tools and Supplies Needed.......................................................................52
4.1.2 System References .................................................................................52
4.1.3 Cable Routing Reference..........................................................................53
4.2 Installing or Replacing a PCI Add-in Card ..............................................................53
4.2.1 Riser Card Options..................................................................................54
4.2.2 Removing the PCI Riser Card Assembly......................................................56
4.2.3 Removing an Add-in Card from the Riser Card Assembly ..............................57
4.2.4 Installing an Add-in Card in the Riser Card Assembly ...................................58
4.2.5 Installing the PCI Riser Card Assembly ......................................................59
4.3 Installing an I/O Expansion Module ......................................................................59
4.4 Installing Remote Management Module 2 Components............................................61
4.4.1 Installing the RMM2 NIC Module ...............................................................61
4.4.2 Installing the Remote Management Module 2..............................................62
4.5 Installing an Embedded USB Solid-State Drive.......................................................62
4.6 Installing Hardware RAID 5 Components...............................................................65
4.6.1 Installing the RAID Activation Key and the RAID DIMM ................................66
4.6.2 Installing the RAID Smart Battery .............................................................67
4.7 Installing an Optical Device.................................................................................69
4.7.1 Removing the Optical Device Filler Panel ....................................................69
4.7.2 Installing a New Optical Device.................................................................71
5 Server Component Replacements.............................................................................73
5.1 Before You Begin ...............................................................................................73
5.1.1 Tools and Supplies Needed.......................................................................73
5.1.2 System References .................................................................................73
5.1.3 Cable Routing Reference..........................................................................73
5.2 Replacing the Fan Assemblies..............................................................................74
5.2.1 Removing the CPU Fan Assembly..............................................................75
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 4
Contents—TIGH2U Server
5.2.2 Replacing the CPU Fans in the Bracket ...................................................... 76
5.2.3 Installing the CPU Fan Assembly............................................................... 77
5.2.4 Removing the PCI Fan Assembly .............................................................. 78
5.2.5 Replacing the PCI Fans in the Fan Bracket ................................................. 81
5.2.6 Installing the Fan Assembly ..................................................................... 82
5.3 Replacing the TAM Board.................................................................................... 83
5.3.1 Removing the TAM Board ........................................................................ 84
5.3.2 Removing the LED Light Pipe Assembly .....................................................87
5.3.3 Installing the TAM Board ......................................................................... 88
5.4 Replacing the SAS Front Panel Board ................................................................... 89
5.4.1 Removing the Front Panel Board............................................................... 89
5.4.2 Installing the Front Panel Board ............................................................... 92
5.5 Replacing the Removable Drive Bay Assembly and the SAS Backplane Board............. 93
5.5.1 Removing the Drive Bay Assembly............................................................ 93
5.5.2 Removing the SAS Backplane Board from the Drive Bay Assembly ................ 94
5.5.3 Installing a New SAS Backplane Board ...................................................... 95
5.5.4 Installing the Drive Bay Assembly............................................................. 96
5.6 Replacing the Power Distribution Assembly ........................................................... 97
5.6.1 Removing the Power Distribution Board..................................................... 97
5.6.2 Installing the Power Distribution Board...................................................... 99
5.7 Replacing the Server Board .............................................................................. 100
5.7.1 Removing the Server Board................................................................... 100
5.7.2 Installing the Server Board .................................................................... 103
5.8 Replacing the CMOS Battery on the Server Board ................................................ 104
6 Server Utilities ...................................................................................................... 106
6.1 Using the BIOS Setup Utility ............................................................................. 106
6.1.1 Starting Setup ..................................................................................... 106
6.1.2 If You Cannot Access Setup ................................................................... 106
6.1.3 Setup Menus ....................................................................................... 106
6.2 Upgrading the BIOS......................................................................................... 107
6.2.1 Preparing for the Upgrade ..................................................................... 108
6.2.1.1 Recording the Current BIOS Settings......................................... 108
6.2.1.2 Obtaining the Upgrade............................................................. 108
6.2.2 Updating the BIOS ............................................................................... 108
6.3 Clearing the CMOS .......................................................................................... 108
6.4 Clearing the Password...................................................................................... 109
6.5 BMC Force Update Procedure ............................................................................ 109
7 Troubleshooting .................................................................................................... 110
7.1 Resetting the System....................................................................................... 110
7.2 Problems Following Initial System Installation ..................................................... 110
7.2.1 First Steps Checklist ............................................................................. 110
7.3 Hardware Diagnostic Testing............................................................................. 111
7.3.1 Verifying Proper Operation of Key System Lights ...................................... 111
7.3.2 Confirming the Operating System Load ................................................... 111
7.4 Specific Problems and Corrective Actions............................................................ 112
7.4.1 Power Light does not Light .................................................................... 112
7.4.2 No Characters Appear on Screen ............................................................ 112
7.4.3 Characters are Distorted or Incorrect ...................................................... 112
7.4.4 Ctrl-G Option is not available to Configure RAID ....................................... 113
7.4.5 System Cooling Fans do not Rotate Properly ............................................ 113
7.4.6 Cannot Connect to a Server................................................................... 113
7.4.7 Diagnostics Pass but the Connection Fails ................................................ 113
7.4.8 The Controller Stopped Working When an Add-in Adapter was Installed....... 113
7.4.9 The Add-in Adapter Stopped Working Without Apparent Cause................... 114
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Kontron Carrier Grade Server TIGH2U
TIGH2U Server—Contents
7.4.10 System Boots When Installing a PCI Card ................................................114
7.4.11 Problems with Newly Installed Application Software...................................114
7.4.12 Problems with Application Software that Ran Correctly Earlier..................... 114
7.4.13 Devices are not Recognized under Device Manager (Windows* OS) ............. 115
7.4.14 Hard Drive(s) are not Recognized ...........................................................115
7.5 LED Information ..............................................................................................115
7.6 BIOS Error Messages........................................................................................ 116
7.6.1 BIOS POST Beep Codes ......................................................................... 117
8 Warranty ...............................................................................................................118
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 6
Revision History—TIGH2U Server
Revision History
Date Revision Description
September 2007 001 Initial release; rev 0.5
November 2007 002 Gold release
April 2008 003
December 2009 004
Minor edits for SRA posting. Primarily grammar ed with Intel Z-U130 Value Solid State Drive.
Kontron version: Changed Intel Z-U130 Value Solid State Drive to SMART Embedded USB Sol
id-State Drive
its. Replaced SysCon board text and art
December 2009 Product Guide, rev.1.2
Kontron Carrier Grade Server TIGH2U
Introduction—TIGH2U Server

1 Introduction

1.1 About this Manual

Thank you for purchasing and using the Kontron Carrier Grade Server TIGH2U.
This manual is for trained system technicians who are responsible for troubleshooting, upgrading, and maintaining this server. This document provides a brief overview of the features of the system, a list of accessories or other components you may need, troubleshooting information, and instructions on how to add and replace components on the TIGH2U Server.
Note: Always be sure to check the Support web site at http://us.kontron.com/ for the latest
version of this manual.

1.1.1 Manual Organization

Chapter 2 provides a brief overview of the TIGH2U Server. In this chapter, you will find a list of the
server board features, chassis features, illustrations of the product, and product diagrams to help you identify components and their locations.
Chapter 3 provides instructions on adding and replacing hot-swappable and standard components
such as processors and memory DIMMs. Use this chapter for step-by-step instructions and diagrams for installing or replacing components.
Chapter 4 provides instructions on adding optional components such as PCI add-in cards, I/O
expansion modules, hardware RAID 5 components, and optical devices. Use this chapter for step-by­step instructions and diagrams for installing components.
Chapter 5 provides instructions on replacing components such as fans, boards, the drive bay
assembly, and the battery. Use this chapter for step-by-step instructions and diagrams for replacing components.
Chapter 6 provides instructions on using the utilities that are shipped with the board or that may be
required to update the system. This includes how to navigate through the BIOS (Basic Input/Output System) setup screens, how to perform a BIOS update, and how to reset the password or CMOS (Complementary Metal Oxide Semiconductor). Information about the specific BIOS settings and screens is available in the Intel® Server Board S5000PAL/S5000XAL Technical Product Specification.
Chapter 7 provides troubleshooting information. In this chapter, you will find BIOS error messages
and POST (Power-on Self Test) code messages. You will also find suggestions for performing troubleshooting activities to identify the source of a problem.
December 2009 Product Guide, rev.1.2
11
Kontron Carrier Grade Server TIGH2U
TIGH2U Server—Introduction

1.2 What Your Server Includes

Your Kontron Carrier Grade Server TIGH2U includes the following components:
•One Intel® Server Board T5000PAL
• One 2U chassis
• Six internal hard disk drive trays in a removable drive bay assembly. A SAS backplane board is attached to the rear of the drive bay assembly.
• A riser card assembly for PCI-X* and PCI Express* (PCIe*) add-in cards
• DC or AC power subsystem: one hot-swappable PSU and power distribution board (PDB). You must order a second power supply for a redundant system.
• Four dual-rotor fan assemblies for cooling the processor(s), DIMM(s), PCI slot(s), power supply modules, and other internal components
• SAS front panel (SFP) board
• Telco Alarms Manager (TAM) board
• Internal cables and connectors
See Chapter 3 for initial system installation and configuration instructions. See Chapter 4 for optional component installation and configuration instructions.

1.3 Product Accessories

You may need or want to purchase one or more of the following items for your server as spares or for more processing power:
• Quad-Core Intel® Xeon® processor 5400 series and appropriate heat sink(s)
• DDR2-667 FBD ECC memory DIMM(s) (system maximum = 32 Gbytes)
• SAS hard disk drives (system maximum = six HDDs)
• 0.5-inch slim-line optical drive
• PCI-X* or PCIe* add-in cards
• Additional AC or DC power supply for redundancy and hot-swapping
•Intel® Remote Management Module 2 (Intel® RMM2) and RMM2 NIC module
• I/O expansion module for dual-GbE or 4xSAS external drive support
• SMART Embedded USB Solid-State Drive
For information about the accessories, memory, processors, and third-party hardware that have been tested and can be used with your system, and for ordering information, see the accessories and spares list on
http://us. kontron.com/support/
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 12
Introduction—TIGH2U Server

1.4 Additional Information and Software

For more technical information about this product or information about the accessories that can be used with this TIGH2U Server, see
http://us.kontron.com/support. This site also contains information
about:
• In-depth technical information about the server board included with this server, including BIOS settings and chipset information
• The latest product information
• Accessories or other server products
• Hardware (peripheral boards, add-in cards) and operating systems that have been tested with this product
• DIMMs that have been tested with this product
• The power budget for this product
• Software to manage your server
• Diagnostics testing software
• Firmware and BIOS updates
•System drivers
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13
Kontron Carrier Grade Server TIGH2U
TS000342
Features—TIGH2U Server

2Features

This chapter briefly describes the main features of the Kontron Carrier Grade Server TIGH2U. This chapter provides a diagram of the product, a list of the server features, and diagrams that show the location of important components and connections.
Figure 1 shows the Kontron Carrier Grade Server TIGH2U.
Figure 1. K
ontron Carrier Grade Server TIGH2U
Tab le 1 summarizes the major features of the server system.
Table 1. K
December 2009 Product Guide, rev.1.2
ontron Carrier Grade Server TIGH2U Features
Feature Description
Compact, high-density syst
em
Configuration flexibility One- or two-way capability in low-profile and cost / v
Serviceability Rear access to hot-swappable power supplies
Rack-mount server with a height of 2U (3.45 inches, 8.9 cm) and a depth of
20.0 inches (50.8 cm)
Stand-alone system Supports up to two Quad-Core Intel
Front access to hot-swappable SAS disk drives Front access to optical drive Ability to swap the entire drive bay as a unit
11
®
Xeon® processor 5400 series †
Kontron Carrier Grade Server TIGH2U
alue-effective packaging
Table 1. Kontron Carrier Grade Server TIGH2U Features (Continued)
Feature Description
Availability Two hot-swappable 600 W power supplies in a redundant (1+1) configuration
Disk subsystem configurable as hardware or software RAID Memory sparing and memory mirroring configurations supported
Manageability Remote management
Emergency management port (serial and LAN) IPMI 2.0 compliant Remote diagnostics support Optional SMART Embedded USB Solid-State Drive Optional Intel® Remote Management Module 2 (Intel® RMM2) providing GCM
support
Upgradeability and investment protection
System-level scalability Supports up to 32 Gbytes FBDIMM memory in non-mirrored mode
Front panel Switches:
I/O Front panel:
Internal connection options Internal connectors/headers:
Add-in card support One full-height riser slot supporting 2U PCI-X and PCIe add-in cards
† For a list of compatible processors, see http://us.kontron.com/support/.
Supports up to two Quad-Core Intel® Xeon® processor 5400 series † Multi-generational chassis Intel® 64 architecture support
Supports up to 16 Gbytes FBDIMM memory in mirrored mode Supports up to two Quad-Core Intel® Xeon® processor 5400 series † Two full-height / full-length x4 PCI Express* (PCIe)* slots One full-height / full-length 64-bit x 133 MHz PCI-X* slot Two low-profile / half-length x4 PCI Express slots Six internal hot-swappable 2.5-nch SAS disk drives One optical drive (optional)
•Power switch
• Reset switch
• NMI switch
•ID switch
• Serial B port (RJ45)
•USB 2.0 port
• One 44-pin ATA/100 connector (power and I/O) for optical drive
•One Intel® Remote Management Module 2 (Intel® RMM2) connector
•One Intel® I/O Expansion Module (optional) supporting either:
- a dual GbE NIC Intel® connection
- an external x4 SAS drive
One low-profile riser slot supporting PCIe add-in cards
LEDs / Relays:
• Telco critical alarm fault LED / relay
• Telco major alarm fault LED / relay
• Telco minor alarm fault LED / relay
• Telco power alarm fault LED / relay
•ID LED
•NIC activity LED
•Main power LED
•HDD activity LED
Rear panel:
• Dual PS/2 ports for keyboard and mouse
• Serial B port (RJ45)
• Two USB 2.0 ports
•Intel® RMM2 NIC 100 Mbps management port
• Two RJ45 NIC connectors for 10 / 100 / 1000 Mbps connections
• Video connector
• Alarms connector
TIGH2U Server—Features
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 12
TS000343
F
A
B
J
K
C
D
E
G
H
L
I
Note: View with fan ducting removed.
Features—TIGH2U Server

2.1 Server Components

Figure 2 shows the TIGH2U Server with top cover and front bezel removed to show the internal
components. The components are listed on the next page.
Figure 2. Carrier Grade Server TIGH2U Components
December 2009 Product Guide, rev.1.2
Item Description Item Description
A Optical drive (optional) G System fans
Power supply cage (contains one power
B
s
upply module with provision for an optional
second module)
Provision for PCI-X* and
C
(PCIe*) full-height and full-length add-in cards
Riser card assembly (containing riser cards
D
fo
r both full-height and low-profile add-in
cards)
Provision for two PCI Express low-profile
E
ad
d-in cards
®
F Intel
Server Board T5000PAL L
PCI Express*
H SAS front panel (SFP) board
TAM board (behind front panel) Note: Th
I
J RJ45 COM2 and USB port 2 connectors
K Control panel and status indicators
Hot-swappable SAS 2.5-inch disk drives (up to
six)
Kontron Carrier Grade Server TIGH2U
13
e bracket on which the TAM board is installed can also include an optional SMART Embedded USB Solid-State Drive, which provides local memory storage

2.2 Back Panel

TS000354
01
L
K
G F
J
I
H
A
D
E
B
C
N
M
Figure 3 shows the back panel of the TIGH2U Server.
Figure 3. Rear View
Item Description Item Description
Low-profile PCI Express add-in cards
A
(or filler panels)
Full-height PCI-X/PCI Express add-in cards (or
B
filler pane
C Ground studs (used for DC-input system) J GbE NIC #2 connector ††††
D Power supply 2 slot; filler panel shown K GbE NIC #1 connector ††††
E Power supply 1 † L RJ45 serial port connector
F RMM2 NIC connector (optional) †† M PS/2 keyboard and mouse connectors
G I/O expansion module connector (optional) ††† N Alarms connector
†In Figure 3, the power supply shown is an AC-input modul †† If an RMM2 NIC is not present, a fi ††† May be either an external SAS port connector or Gigabit Etherport port connector. If neither of the
optional m
†††† The GbE ports are only designed to pass intra-building lightn
cabling, which must be grounded at both ends.
ls)
ller panel occupies this space.
odules is installed, a filler panel occupies this space.
TIGH2U Server—Features
H USB 0 and USB 1 port connectors
I Video connector
e. DC-input modules are also available.
ing surge when used with shielded
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 14
TS000345
Alarms
Status
ID ONNIC
CRT MNR PWRMJR
A
C B
Features—TIGH2U Server

2.3 Front Panel

Figure 4 shows the front panel of the TIGH2U Server with the bezel installed.
Figure 4. Front View (Bezel Installed)
Item Description Item Description
A Front panel control switches and status LEDs C USB port
B COM port
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15
Kontron Carrier Grade Server TIGH2U
TIGH2U Server—Features
Alarms
Status
ID ONNIC
CRT MNR PWRMJR
TS000346
A B C
DEK HJ GI F
L
M
Figure 5 shows the front panel of the TIGH2U Server with the bezel removed. The components are
listed on the next page.
Figure 5. Front View (Bezel Removed)
Item Description Item Description
A Anti-static connection point H Hard drive bay 4
Optical drive (optional) or filler panel if no
B
driv
e is installed
Front panel control switches and status LEDs
C
(See Figure 6 for details)
D Front panel serial port connector (RJ45) K Hard drive bay 5
E USB port 2 connector L Drive fault indicator (one per hard drive)
F Hard drive bay 0 M Drive activity indicator (one per hard drive
G Hard drive bay 2
I Hard drive bay 1
J Hard drive bay 3
Kontron Carrier Grade Server TIGH2U Product Guide, rev.1.2 December 2009 16
Alarms
Status
ID ONNIC
CRT MNR PWRMJR
A B E F G H
C D I J K L
TS000347
Features—TIGH2U Server
Figure 6 shows the control panel.
Figure 6. Control Panel
December 2009 Product Guide, rev.1.2
Item Feature Description
Front Panel Switches
A Power switch Toggles the system power
B Reset switch Resets the system
C NMI switch (pin hole) Asserts NMI to the server board
D ID switch Toggles the system ID LED on / off
Front Panel Alarm LEDs and Relays
The Critical alarm LED can be either amber (default) or red (set with an FRUSD
R update). When continuously lit, indicates a Critical System Fault
E Critical (amber or red)
F Major (amber or red)
occurred. A critical system fault is an error or event that has a fatal system impact. In this case, the system cannot continue to operate. An example is the loss of a large section of memory, or other corruption. The front panel critical alarm relay is engaged.
The Major alarm LED can be either amber (default) or red (set with an
R update). When continuously lit, indicates a Major System Fault
FRUSD occurred. A major system fault is an error or event that has discernible impact to the system operation. In this case, the system can continue to operate, but in a degraded fashion (reduce performance or with the loss of non-fatal features). An example is the loss of a mirrored disk. The front panel major alarm relay is engaged.
When continuously lit, indicates a Minor System Fault occurred. A minor
ystem fault typically has little impact to the system operation. An
G Minor (amber)
H Power (amber)
s example is a correctable ECC error. The front panel minor alarm relay is engaged.
When continuously lit, indicates a Power System Fault occurred. The front panel power alarm rela
y is engaged.
Front Panel Status LEDs
I System ID LED (white)
Indicates system identity This LED can be toggled remotely or by front panel ID switch
J NIC activity LED (green) Indicates NIC activity when lit
When continuously lit, indicates the pres
K Main power LED (green)
HDD activity / fault LED
L
een / amber)
(gr
power in the server. The LED turns off when the main output power from the power supply is turned off or if the power source is disrupted.
Indicates HDD activity when green or an HDD fault when amber. This is an agg
regated indication for all hard drives in the system (up to six). Each
hard disk contains its own activity and fault indicators.
17
ence of power supply DC output
Kontron Carrier Grade Server TIGH2U
TIGH2U Server—Features

2.4 Rear Panel Ethernet Ports

The TIGH2U Server has two GbE NIC ports that are mounted on the server board and accessible from the rear of the chassis. Additional rear-accessible GbE NIC ports can be added by using full-height PCI-X/PCIe add-in cards or low-profile PCIe add-in cards.
A dual GbE I/O option module is available. This module adds two RJ45, 1 Gigabit Ethernet ports accessible on the rear panel. The GbE NIC ports are intended to be installed with shielded cabling that is grounded at both ends of the cable.
The possible configurations of full-height PCI-X/PCIe add-in cards are in Tabl e 2 on page 21 and the possible configurations of low-profile PCIe add-in cards are in Tab le 3 on page 21.
Warning: The intra-building port(s) of the equipment or subassembly is suitable for connection to
intra-building or unexposed wiring or cabling only. The intra-building port(s) of the equipment or subassembly MUST NOT be metallically connected to interfaces that connect to the OSP or its wiring. These interfaces are designed for use as intra-building interfaces only (Type 2 or Type 4 ports as described in GR-1089-CORE, Issue 4) and require isolation from the exposed OSP cabling. The addition of Primary Protectors is not sufficient protection to connect these interfaces metallically to OSP wiring.

2.5 SAS Front Panel (SFP) Board

The SAS Front Panel (SFP) board adds SAS support and provides support for hardware RAID 0, 1, 10, and 5, and software RAID 0, 1, and 10. This board is located on the floor of the chassis between the front panel and the two 80 mm fans.

2.5.1 SFP Board Features

The TIGH2U Server SFP board has the following features:
• One RS-232 front panel port
• One USB2.0 front panel port
• One USB2.0 interface to local memory storage
• One flex cable connection to the SAS backplane to support the interface to six independent 2.5­inch SAS hard drives
• One socket for a DDR2 mini-DIMM that provides data caching for hardware RAID
• One connector for the Intel® RAID Smart Battery that allows the contents of the DDR2 mini-DIMM to be preserved if power falls below specifications.
• Four fan connectors to provide power, control, and monitoring for the four cooling fans
• Four fan fault LEDs (for diagnostics purposes only, not visible on front panel)

2.6 Telco Alarms Manager Board

The Telco Alarms Manager (TAM) board adds LEDs and power functions to the front of the server chassis. It also uses a cable to provide an alarms function with fault relays to the back of the chassis. This board is located over the top of the SFP board between the front panel and the two 80 mm fans.
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2.6.1 TAM Board Features

The TIGH2U Server TAM board has the following features:
• Four switches to control power on, reset,
• One system ID LED that can be controlled remotely
NMI, and the system ID LED
or by the system ID switch
• Two system activity LEDs that indicate power-on and NIC activity
• One hard drive / fault LED that indicates activity or faults for any of the six HDDs
• Four system fault LEDs that indicate critical, major, minor, and power system fault status
• Four system fault relays for external critical, major, minor, and power fault indicators
• One connector to interface with the SFP board
• One connector to route the contacts of the four system fault relays to a connector at the back of the chassis

2.7 Server Board Connector and Component Locations

Figure 7 shows the locations of connectors and components on the T5000PAL Server Board.
Figure 7. Intel® Server Board T5000PAL Layout
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Description Description
A BIOS Bank Select Jumper P CPU Power Connector
B I/O Module Option Connector Q Main Power Connector
C POST Code Diagnostic LEDs R Battery
®
D Intel
E PCI Express Riser Slot – Low-profile T Dual Port USB 2.0 Header
F System Identification LED - Blue U Serial Port Connector
G External I/O Connectors V SSI 24-pin Control Panel Header
H Status LED – Green/Amber W
I Serial ‘B’ Port Configuration Jumper X System Recovery Jumper Block
J FBDIMM Sockets Y Chassis Intrusion Switch Header
K CPU #1 Connector Z 3-pin IPMB Header
L CPU #2 Connector AA Intel
M Voltage Regulator Heat Sink BB Serial ‘A’ Header
N Bridge Board Connector CC Intel
O
Note: In Figure 7, connectors shown but not called out are “not used”.
Adaptive Slot – Full-height S Power Supply Management Connector
®
Intel
Remote Management Module 2 (Intel®
RMM) Connector
®
Local Control Panel Header
®
RMM2 NIC Connector
ATA-100 Optical Drive Connector (power and I/O)

2.8 Hard Disk Drives

The TIGH2U Server chassis supports up to six 2.5-inch SAS drives in hot-swappable hard drive tray assemblies at the front of the chassis.
For information on how to install these drives, see Section 3.3.1, “Installing or Replacing a Hard
Drive”.
Note: The
Drives can consume up to 17 W of power each. Drives must be specified to run at a maximum ambient temper
TIGH2U Server does not support all SAS hard drives. For a list of validated hard drive manufacturers and hard drive types, see the Tested Hardware and Operating Systems List (THOL) at
http://us.kontron.com/support/
ature of 45° C.
ntron Carrier Grade Server TIGH2U
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Features—TIGH2U Server

2.9 Riser Card Assembly

The Carrier Grade Server TIGH2U incorporates a PCI riser assembly that supports installation of PCI­X and PCI Express add-in boards. The assembly includes two riser cards that connect into the Intel
®
Server Board S5000PAL.
• One of the riser card slots facilitates installing PCI-X* and PCI Express* add-in cards.
• The second riser card slot facilitates installing low-profile PCIe add-in cards.
See Section 4.2, “Installing or Replacing a PCI Add-in Card” on page 53, for instructions describing how to install a PCI-X or PCIe add-in card. After the
add-in cards are installed, the riser assembly is plugged back into the system and the I/O brackets of all the add-in cards are accessible through the rear panel of the server chassis.

2.9.1 Full-Height PCI-X/PCIe Riser Card

The PCI-X/PCIe riser card plugs into the super slot on the server board. For PCI-X add-in cards, the super slot riser card implements a 64-bit PCI-X slot with bus speeds of 66 MHz, 100 MHz, or 133 MHz. F
or PCIe cards, the super slot has eight PCIe lanes which can be used for a single x8 add-in card or for one or two x4 or x1 add-in cards. See Tabl e 2 for the supported configurations. For detailed information about the pinouts and electrical specifications, see the K TIGH2U Technical Product Specification.
Table 2. Full-Height Riser Card Configurations and Throughput
Configuration Bottom Slot Middle Slot Top Slot
PCI-X † – –
One add-in card
Two a d d - in cards
Three add-in cards PCI-X † x4 PCIe x4 PCIe
Note: † U
p to 133 MHz bus speed
– x8 or x4 PCIe –
– – x4 PCIe
PCI-X † x8 or x4 PCIe –
PCI-X † – x4 PCIe
– x4 PCIe x4 PCIe
ontron Carrier Grade Server

2.9.2 Low-Profile PCIe Riser Card

The low-profile PCIe riser card plugs into the server board and supports the connection of low-profile PCIe add-in cards only. The low-profile PCIe riser card implements two ×4 link interfaces. Up to two low-profile PCIe add-in cards can be installed. See Tabl e 3 for the supported configurations. For detailed information about the pinouts and electrical specifications, see the Ko Server TIGH2U Technical Product Specification.
Table 3. Low-Profile PCI Add-in Card Configuration
Configuration Lower Slot Upper Slot
One add-in card
Two a d d - in cards x4 PCIe x4 PCIe
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A
B
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2.10 Power Supply

The power subsystem has a power distribution board (PDB) and up to two hot-swap power supply modules capable of operating in redundant mode. A power supply filler panel for the empty power supply site is supplied for systems without redundancy.
The power supply is rated for 600 W output capability in full AC (or
DC) input voltage range.

2.11 System Cooling

There are three cooling areas (domains) in the TIGH2U Server system:
• Domain 1 - CPU 1 and memory; see area outlined in blue in Figure 8
• Domain 2 - CPU 2, chipset, and any low-profile PCIe add-in cards; see
Figure 8
• Domain 3 - any full length PCI-X or PCIe add-in cards; see area outlined in red in Figure 8
Letter A in the following figure calls out the
PCI fans. Letter B calls out the CPU fans.
Figure 8. System Cooling Areas
area outlined in green in
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Features—TIGH2U Server

2.11.1 CPU 1 and Memory Cooling Area

One of the system’s large fans provides cooling for domain 1, outlined in blue in Figure 8. This fan facilitates the flow of air through the front bezel over the SF
P, through the fan, and over the server
board, CPU 1, memory, and ultimately out through the rear of the chassis.

2.11.2 CPU 2 and Chipset Cooling Area

One of the system’s large fans provides cooling for domain 2, outlined in green in Figure 8. This fan facilitates the flow of air through the front bezel over the SF
P, through the fan, and over the server board, CPU 2, chipset and any low-profile PCIe add-in cards, and ultimately out through the rear of the chassis.

2.11.3 PCI Cooling Area

The two 40 × 40 × 56 mm dual-rotor fans (A in Figure 8) facilitate the flow of air through the front bezel, through the fans, over the server board and any full-length PCI-X or PCIe add-in cards, and ultimately ou
t through the rear of the chassis.

2.11.4 Hard Disk Drive and Power Supply Cooling

Fans that are integrated into the PSUs provide the airflow to cool the hard disk drives. The airflow is adequate even with a single PSU installed as long as a filler panel is installed in the other PSU slot.

2.11.5 Fan Speed Control

The server board contains Pulse Width Modulation (PWM) circuits, which control the 12 VDC fan voltage to provide quiet operation when system ambient temperature is low and there are no fan failures. There is one PWM circuit for each cooling domain, resulting in one PWM being connected to each of the two 80 × 38 mm fans and the other PWM connected to the two dual-rotor 56 × 40 mm fans. Based on the ambient temperature, monitored by the front panel sensor, the fan speeds (PWM duty cycle) are set per Tab le 4.
Table 4. Fan Speed Settings
Temperature (°C)
0 - 28 46 46 46
29 47 47 47
30 48 48 48
31 53 53 53
32 58 58 58
33 63 63 63
34 68 68 68
35 73 73 73
36 78 78 78
37 84 84 84
38 89 89 89
39 95 95 95
40 100 100 100
CPU1 Fan
PWM DC (%)
CPU2 Fan
PWM DC (%)
PCI Fans
PWM DC (%)
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2.11.6 Cooling Summary

The four-fan cooling subsystem of the TIGH2U Server is sized to provide cooling for:
• Up to two server board processors
• Up to 32 Gbytes of FBDIMM memory
• Up to six SAS hard drives
• Up to five PCI add-in cards consuming a maximum of 25 W for each full-height PCI-X / PCIe add-in cards and 10 W for each low-profile PCIe add-in card
The cooling subsystem meets acoustic and thermal requirements at the lower fan speed settings. At the higher fan speed settings, thermal requirements are met for the maximum ambient temperatures, but acoustic requirements are not met.

2.12 Hardware Requirements

To avoid integration difficulties and possible board damage, your system must meet the requirements outlined below. For a list of qualified components, see
Software”.

2.12.1 Processor

Section 1.4, “Additional Information and
The server board accommodates two Quad-Core Intel® Xeon® processor 5400 series. For a list of the currently supported processors, see the product support page at:
http://us.kontron.com/support/

2.12.2 Memory

The memory controller hub (MCH) on the T5000PAL server board accommodates four channels of fully buffered DIMM (FBDIMM) memory. Each channel can support up to two dual-ranked FBDIMM DDR2 DIMMs. FBDIMM memory channels are organized into two branches for support of RAID 1 (mirroring). See population rules and instructions for installing DIMMs in the sockets on the server board.
Section 3.4.2, “Configuring Memory DIMMs” for detailed information about
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Server Component Installations and Upgrades—TIGH2U Server

3 Server Component Installations and Upgrades

3.1 Before You Begin

Before working with your server product, pay close attention to the safety instructions provided in this manual. See
Warning: Electrostatic discharge (ESD) and ESD protection: ESD can damage disk drives,

3.1.1 Tools and Supplies Needed

Appendix A, “Safety Information”.
boards, and other parts. Perform the procedures in this chapter at an ESD workstation. If one is not available, provide some ESD protection by wearing an antistatic wrist strap attached to chassis ground (any unpainted metal surface) on your server when handling parts.
• #1 and #2 Phillips (cross-point) screwdrivers (or interchangeable tip screwdriver with #1 and #2 Phillips bits)
• Personal grounding device such as an anti-static wrist strap and a grounded conductive pad

3.1.2 System References

All references to left, right, front, top, and bottom assume that you are facing the front of the server, as it would be positioned for normal operation.

3.2 General Installation Procedures

The following sections present general installation and removal procedures that are required before removing or installing internal components that are not hot-swappable.

3.2.1 Removing the Front Bezel

Remove the front bezel to
• Install or remove hard drives or an optical device
• Access the front-panel serial port and USB connectors
• Observe the individual HDD activity/fault indicators
• Install or remove the optional Intel® RAID Smart Battery
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TIGH2U Server—Server Component Installations and Upgrades
Note: The front bezel can be removed while the server power is on.
1. Disconnect the cables from the front panel USB port and / or serial port connectors.
2. Loosen the bezel retention screw from the right side. (“A”)
3. Rotate the bezel outward as shown and remove. (“B”)
Figure 9. Removing the Front Bezel
A
B
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3.2.2 Installing the Front Bezel

1. Align the four tabs on the left side of the bezel with the slots in the front panel and then rotate the free end of the bezel to the closed position.
2. Snap the front bezel into place and tighten the screw at the right edge of the bezel (if used).
3. Re-connect the serial port and USB cables if they are used.

3.2.3 Removing the Chassis Cover

The TIGH2U Server must be operated with the top cover in place to ensure proper cooling. You will need to remove the top cover to add or replace components inside of the server that are not hot­swappable from the front or rear panels.
Caution: 5
Before removing the top cover, power down the server system the power cable.
Note: A
1. Observe the safety and ESD precautions in Appendix A, “Safety Information”.
2. Turn off all peripheral devices connected
3. Disconnect the power cord(s).
V standby power is present inside the chassis whenever the PSU(s) are connected to
a source of power.
and unplug all peripheral devices and
non-skid surface or a stop behind the server may be needed to prevent the server
from sliding on your work surface.
to the server. Turn off the server.
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A
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Server Component Installations and Upgrades—TIGH2U Server
4. Remove the shipping screw at the left side, near the rear.
5. While holding the blue button at the top of the chassis in stops.
6. Lift the cover straight up to remove it from the server.
Figure 10. Removing the Chassis Cover
(“A”), slide the top cover back until it

3.2.4 Installing the Chassis Cover

1. Place the cover over the chassis so that the side edges of the cover sit just inside the chassis side walls, with the front of the cover with about 1/8-inch (3-mm) gap showing between the chassis cover and the sheet-metal at the front of the chassis.
2. Press down slightly on the chassis cover behind the
peripheral area and slide the cover forward
until it clicks into place.
3. Install the shipping screw if tooled entry is required or if the system will be shipped.
4. Reconnect all peripheral devices and the power cord(s).
Caution: This unit must be operated with the top cover installed to ensure proper cooling.
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TIGH2U Server—Server Component Installations and Upgrades
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B
C
E
D

3.2.5 Removing the Processor Air Duct

The air duct must be removed to access the processors, memory DIMMs, CPU fan assembly, the SFP board, or the inside of the front panel. The processor air duct is required for proper airflow within the chassis. Be sure the air duct is in place before installing the chassis cover.
1. Power down the server system and unplug all pe
2. Remove the chassis cover. For instructions, see Section 3.2.3, “Removing the Chassis Cover”.
3. Loosen the captive fastener on the left side of the air duct. (“A”)
4. Slide the duct several millimeters toward t The front edge will disengage from the front panel. (“C”) The metal tab at the rear will release. (“D”)
5. Lift the air duct straight up and remove it from the chassis. (“E”)
Figure 11. Removing the Processor Air Duct
ripheral devices and the AC power cable.
he rear panel until it stops. (“B”)
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Server Component Installations and Upgrades—TIGH2U Server

3.2.6 Installing the Processor Air Duct

1. Place the processor air duct over the processor sockets and fan assembly, using caution to make sure you do not pinch any cables beneath the edges of the air duct. (“A”)
The top of the installed air duct should be flush with the top surface assembly.
The front of the air duct should line up with the metal tab. (“B”)
2. Slide the air duct forward until it is flush with the front panel. (“C”)
3. Ensure that the rear of the air duct is fastened to the metal tab on the chassis. (“D”)
4. Tighten the captive fastener. (“E”)
5. Replace the chassis cover if you have completed all work inside of the chassis.
Figure 12. Installing the Processor Air Duct
of the PCI riser card
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A

3.3 Hot-Swappable Component Installation Procedures

The following components are hot-swappable and do not require powering down the system or removing the chassis cover:
• Hard disk drives
• AC and DC power supplies (if power redundancy is a

3.3.1 Installing or Replacing a Hard Drive

Up to six hot-swappable SAS drives can be installed in your TIGH2U Server. You must remove the front bezel to add or replace a hard drive in one of the six drive bays.
vailable)
Caution: If y
The Carrier Grade Server TIGH2U does not support all SAS hard drives. To see a list of validated manufacturers and hard drive types, see the Tested Hardware and Operating System List (THOL) at :
http://us.kontron.com/support/
Click on Downloads and then Compatability Matrix.
ou install fewer than six hard drives, the empty bays must have drive trays with
baffles in them to maintain proper system cooling.
3.3.1.1 Removing a Hard Drive Tray
1. Remove the front bezel. For instructions, see Section 3.2.1, “Removing the Front Bezel”.
2. Select the drive bay where you want to install the d green button to open the lever. (“A”)
Note: If y
3. Pull the drive tray assembly out of the chassis.
Figure 13. Removing a Drive Tray
ou will have fewer than six drives installed, drive bay 0 must be used first, then
drive bay 1, and so forth.
rive and remove the drive tray by pressing the
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