Kontron SMARC-sXBTi User Manual

SMARC-sXBTi

Document Revision 0.1 preliminary

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» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 SMARC™ Computer-on-Modules....................................................................................................... 7

3 Product Specification............................................................................8

3.1 Modules & Accessories................................................................................................................... 8

3.2 Functional Specification............................................................................................................... 10

3.3 Block Diagram............................................................................................................................ 14

3.4 Electrical Specification................................................................................................................15

3.4.1 Supply Voltage........................................................................................................................... 15

3.4.2 Power Supply Rise Time................................................................................................................ 15

3.4.3 Supply Voltage Ripple.................................................................................................................. 15

3.4.4 Power Consumption..................................................................................................................... 15

3.5 Power Control............................................................................................................................ 16

3.6 Environmental Specification......................................................................................................... 17

3.6.1 Temperature Specification............................................................................................................ 17

3.6.2 Humidity................................................................................................................................... 17

3.7 Standards and Certifications.........................................................................................................18

3.8 MTBF........................................................................................................................................ 19

3.9 Mechanical Specification.............................................................................................................. 20

3.9.1 Module Dimension...................................................................................................................... 20

3.9.2 Height on Top............................................................................................................................ 20

3.9.3 Height on Bottom....................................................................................................................... 20

3.9.4 Mechanical Drawing.................................................................................................................... 20

3.10 Module Dimensions..................................................................................................................... 21

3.11 Thermal Management, Heatspreader and Cooling Solutions.................................................................22

4 Features and Interfaces.......................................................................23

4.1 Onboard eMMC Flash.................................................................................................................... 23

4.2 Secure Digital Card...................................................................................................................... 23

4.3 S5 Eco Mode.............................................................................................................................. 24

4.4 Speedstep Technology................................................................................................................. 25

4.5 C-States.................................................................................................................................... 26

4.6 Graphics Features....................................................................................................................... 27

4.7 ACPI Suspend Modes and Resume Events..........................................................................................28

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SMARC-sXBTi /

5 Connectors........................................................................................29

5.1 SMARC™ Connector Top Side.......................................................................................................... 29

5.2 SMARC™ Connector Bottom Side..................................................................................................... 31

6 BIOS Operation...................................................................................35

6.1 Determining the BIOS Version....................................................................................................... 35

6.2 BIOS Update.............................................................................................................................. 35

6.3 POST Codes................................................................................................................................ 35

6.4 Setup Guide............................................................................................................................... 35

SMARC-sXBTi / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

SMARC-sXBTi / User Information

1.5 Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

SMARC-sXBTi / Introduction

2 Introduction

2.1 Product Description

The new Kontron SMARC-sXBTi Computer-on-Modules has been developed to comply with the SMARC specification and is equipped with Intel® Atom™ processor E3800 series and up to 8 GB RAM, optional with ECC. They support the extended temperature range of -40°C to +85°C, measure only 82mm x 50mm and have an especially low-profile design thanks to the use of edge card connectors. Nevertheless, there is still enough space for up a 64GB on-board SSD to store OS and application data. A highlight of the pin-out is the mobile feature set with 3 UARTs with complete function range also for, e.g., GPS as well as support of the MIPI-compliant serial camera interface (MIPI CSI = Mobile Industry Processor Interface Camera Serial Interface). The powerful Intel® Gen 7 Graphics are carried out via HDMI 1.4 and LVDS (optional eDP) with up to 2560×1600 and 60 Hz to the display. Further interfaces include 1x GbE LAN via Intel® Ethernet Controller I210, 1x USB 3.0 and 2x USB 2.0, amongst others. Customer-specific extensions can be implemented via 2 SDIO and 3 PCIe x1 lanes with 5GT/s.

2.2 SMARC™ Computer-on-Modules

The SMARC™ standard was developed especially for new modules with ARM- and SOC-processors and is characterized by the extremely flat build of its form factor. It is based on the MXM 3.0 connector with 314 pins and a construction height of just 4.3 millimeters and it thus allows robust and flatly constructed designs with a cost-effective card edge connector. The connector is also available in a shock- and vibration-resistant version for rough environmental conditions. Furthermore, the standard integrates dedicated interfaces for the latest ARM and SOC processors which not only means LVDS, 24-bit RGB and HDMI support but also support of embedded DisplayPort for future designs. In addition, and for the first time, dedicated camera interfaces are being incorporated into a COM standard. OEMs profit from minimized design effort and bill of material costs. SMARC™ defines two different module sizes in order to offer a high level of flexibility regarding different mechanical requirements: a short modules measuring 82 mm x 50 mm and a full-size module measuring 82 mm x 80 mm.

SMARC™ is the low-power embedded architecture platform for computer-on-modules based on ARM technology.

» Creating mobile, embedded, connected solutions

» Scalable building blocks

» Optimized pin-out definition for ARM technology

» Ultra low-power, low-profile solutions

» Constructed to withstand harsh industrial environments

SMARC-sXBTi / Product Specification

3 Product Specification

3.1 Modules & Accessories

The SMARC short sized Computer-on-Module SMARC-sXBTi (SXVV) is based on Intel's Bay Trail platform and is available in different variants to cover the demand of different performance, price and power:

Industrial temperature grade modules (E2: -40°C to +85°C operating)

Part Number Product Name Processor Frequency Memor y ECC eMMC Ethernet

51004-4016-19-4 SMARC-sXBTi

E3845 4E/16GB

BayTrail-I Intel® Atom E3845

4×1,91GHz 4GB Yes 16GB MLC Intel® i210IT

51004-1040-17-2 SMARC-sXBTi E3827

1E/4S

BayTrail-I Intel® Atom E3827

2×1,75GHz 1GB Yes 4GB SLC Intel® i210IT

51004-2000-19-4 SMARC-sXBTi

E3845 2GB

BayTrail-I Intel® Atom E3845

4×1,91GHz 2GB - - Intel® i210IT

51004-2000-17-2 SMARC-sXBTi E3827

2GB

BayTrail-I Intel® Atom E3827

2×1,75GHz 2GB - - Intel® i210IT

51004-2000-15-2 SMARC-sXBTi E3826

2GB

BayTrail-I Intel® Atom E3826

2×1,46GHz 2GB - - Intel® i210IT

51004-2000-13-2 SMARC-sXBTi E3825

2GB

BayTrail-I Intel® Atom E3825

2×1,33GHz 2GB - - Intel® i210IT

51004-1000-15-1 SMARC-sXBTi E3815

1GB

BayTrail-I Intel® Atom E3815

1×1,46GHz 1GB - - Intel® i210IT

Memory configurations:

» MM = 10: 1024MB DDR3L Memory (8x1Gbit / 128Mx8)

» MM = 20: 2048MB DDR3L Memory (8x2Gbit / 256Mx8)

» MM = 40: 4096MB DDR3L Memory (8x4Gbit / 512Mx8)

» MM = 80: 8192MB DDR3L Memory (8x8Gbit / 1024Mx8) (not available now, will come up in a later release)

Onboard Flash configurations

» FF = 00: without eMMC Flash

» FF = 20: 2GB onboard eMMC Flash

» FF = 40: 4GB onboard eMMC Flash

» FF = 80: 8GB onboard eMMC Flash

» FF = 16: 16GB onboard eMMC Flash

» FF = 32: 32GB onboard eMMC Flash

» FF = 64: 64GB onboard eMMC Flash

Optional hardware features:

» eDP on SMARC Connector, instead of LVDS

» ECC memory

Optional BIOS/Software features:

» AES-NI Support

» FSP with Coreboot

SMARC-sXBTi / Product Specification

Optional hardware and BIOS features are available project based only for variants not listed above. Please contact your local sales for customized articles.

Accessories

Product Number Carrier Boards

51100-0000-00-0 SMARC Evaluation Carrier

51100-0000-00-S SMRAC Starterkit

Product Number Cooling & Mounting

51004-0000-99-1 HSP SMARC-sXBT

51004-0000-99-3 HSK SMARC-sXBT active

Product Number Adapter & Cables

59000-0000-00-0 ADA-SMARC sacrifice

59000-0000-01-0 ADA-SMARC camera1

59200-0000-04-0 KLAS JILI30

SMARC-sXBTi / Product Specification

3.2 Functional Specification

Processor

The 32nm Intel® ATOM™ / Celeron® (BayTrail-I SOC (Valleyview)) CPU family supports:

» Intel® 64

» Enhanced Intel SpeedStep® Technology

» Thermal Monitoring Technologies

» Execute Disable Bit

» Virtualization Technology VT-x

» 2 Display Pipes for dual independent displays

CPU specifications

Intel® Atom™ Atom™ Atom™ Atom™ Atom™

- E3845 E3827 E3826 E3825 E3815

Stepping B3/D0 B3/D0 B3/D0 B3/D0 B3/D0

# of Cores 4 2 2 2 1

# of Threads 4 2 2 2 1

CPU Nominal frequency

1.91GHz 1.75GHz 1.46GHz 1.33GHz 1.46GHz

CPU Burst frequency - - - - -

LFM/LPM Frequency 533MHz 533MHz 533MHz 533MHz 533MHz

Tjunction -40 to 110°C -40 to 110°C -40 to 110°C -40 to 110°C -40 to 110°C

Thermal Design Power (TDP) 10W 8W 7W 6W 5W

SDP - - - - -

Smart Cache 2x1MB 2x512kB 2x512kB 2x512kB 512kB

Memory Type DDR3L-1333 DDR3L-1333 DDR3L-1066 DDR3L-1066 DDR3L-1066

Max Memory Size 8GB 8GB 8GB 8GB 8GB

ECC Memory(optional) Yes Yes Yes Yes Yes

Graphics Model Intel HD® Intel HD® Intel HD® Intel HD® Intel HD®

GFX Base Frequency 542MHz 542MHz 533MHz 533MHz 400MHz

GFX Max Dynamic Frequ. 792MHz 792MHz 667MHz - -

GFX Technology GT1 4EU GT1 4EU GT1 4EU GT1 4EU G T1 4EU

AEC Q100 automtovie Qual. Yes Yes Yes Yes Yes

SDIO Yes Yes Yes Yes Yes

eMMC Yes Yes Yes Yes Yes

AES-NI (optional) Yes Yes Yes Yes Yes

Memory

Sockets

memory down

Memory Type

DDR3L-1066/1333

Maximum Size

2 - 4GB (ECC optional)

Technology

Single Channel (64bit)

SMARC-sXBTi / Product Specification

Graphics Core

The integrated Intel® HD Graphics (Gen 7) supports:

Execution Units / Pixel Pipelines

Max Graphics Memory

tbd

GFX Memory Bandwidth (GB/s)

tbd

GFX Memory Technology

DVMT

API (DirectX/OpenGL)

11 / 3.0 + OCL 1.1

Shader Model

3.0

Hardware accelerated Video

H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray

Independent/Simultaneous Displays

Display Port

HDCP support

HDCP / PAVP 2

LVDS

LVDS Bits/Pixel

1x18 / 1x24 with DP2LVDS NXP3460

LVDS Bits/Pixel with dithering

LVDS max Resolution:

1920x1200

PWM Backlight Control:

YES

Supported Panel Data:

EDID/DID

Display Interfaces

Discrete Graphics

Digital Display Interface DDI1

HDMI

Digital Display Interface DDI2

Digital Display Interface DDI3

Maximum Resolution on DDI

2560x1600@60Hz

Storage

onboard SSD

2-64GB eMMC

SD Card support

yes

IDE Interface

Serial-ATA

1x SATA 3Gb/s

SATA AHCI

AHCI

SATA RAID

Connectivity

USB 2.0

2x USB 2.0

USB 3.0

1x USB 3.0

USB Client

1 client (optional)

PCI

PCI External Masters

PCI Express

3x PCIe x1 Gen2

Max PCI Express

PCI Express x2/x4 configuration

Ethernet

10/100/1000 Mbit

Ethernet controller

Intel® i210IT / i211AT

Ethernet

The Intel® i210IT / i211AT ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

+ 25 hidden pages

Kontron SMARC-sXBTi User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 User Information

1.1 About This Document

1.2 Copyright Notice

1.3 Trademarks

1.4 Standards

1.5 Warranty

1.6 Technical Support

2 Introduction

2.1 Product Description

2.2 SMARC™ Computer-on-Modules

3 Product Specification

3.1 Modules & Accessories

3.2 Functional Specification

Processor

CPU specifications

Memory

Graphics Core

LVDS

Display Interfaces

Storage

Connectivity

Ethernet