Kontron MSM800BEV User Manual
If it's embedded, it's Kontron.
with small cooler
MSM800BEV
Document Revision 100
» Table of Contents «
1 User Information............................................................................ 6
1.1 About this Document ...............................................................................................................6
1.2 Copyright Notice .....................................................................................................................6
1.3 Trademarks ............................................................................................................................6
1.4 Standards..............................................................................................................................6
1.5 Warranty ...............................................................................................................................6
1.6 Technical Support ...................................................................................................................7
1.7 Environmental Protection Statement ...........................................................................................7
1.8 RoHS Commitment ..................................................................................................................7
1.8.1 RoHS Compatible Product Design...............................................................................................8
1.8.2 RoHS Compliant Production Process ...........................................................................................8
1.8.3 WEEE Application ...................................................................................................................8
1.9 Swiss Quality ..........................................................................................................................8
1.10 The Swiss Association for Quality and Management Systems..............................................................9
2 Introduction ................................................................................10
2.1 MSM800BEV Ordering Information ............................................................................................ 10
2.2 MSM800BEV Applications ........................................................................................................ 10
2.3 MSM800BEV Features ............................................................................................................. 11
2.3.1 The MSM800BEV Model.......................................................................................................... 11
2.4 Block Diagram ...................................................................................................................... 12
2.4.1 MSM800BEV........................................................................................................................ 12
2.5 MICROSPACE® Documentation .................................................................................................. 12
2.6 Product Photo ...................................................................................................................... 13
2.6.1 MSM800BEV........................................................................................................................ 13
3 Specifications...............................................................................14
4 Quick Start Guide...........................................................................17
4.1 Print Manuals from the Product CD ............................................................................................ 17
4.2 The MSM800CON, Part Nr. 803036 ............................................................................................. 17
4.3 The LANCON, Part Nr. 803046................................................................................................... 18
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4.4 The DVICON, Part Nr. 803042 ................................................................................................... 19
4.5 Connect Peripherals to the Board.............................................................................................. 20
4.6 The Development Kit, Part Nr. 802118........................................................................................ 21
4.7 Power Up the Board ............................................................................................................... 22
4.8 BIOS Setup .......................................................................................................................... 25
4.9 Boot Up the Operating System and Install the Drivers.................................................................... 25
5 Connectors & Jumpers....................................................................26
5.1 Connectors .......................................................................................................................... 26
5.1.1 Top Side of the MSM800BEV V2.1 ............................................................................................. 27
5.1.2 Bottom Side of the MSM800BEV V2.1 ........................................................................................ 28
5.1.3 X1 Power Supply .................................................................................................................. 29
5.1.4 X10 VGA Monitor (CRT-signals)................................................................................................ 29
5.1.5 X15 LCD TFT Interface (flat panel signals) .................................................................................. 30
5.1.6 X29 Sound/Audio Port........................................................................................................... 31
5.1.7 X30 Printer Port (Centronics) .................................................................................................. 31
5.1.8 X31 Keyboard PS/2/-Mouse Utility Connector ............................................................................. 31
5.1.9 X33 10/100 BASE-T Interface Connector ................................................................................... 32
5.1.10 X38 Serial Port COM1 ............................................................................................................ 33
5.1.11 X39 Serial Port COM2 ............................................................................................................ 33
5.1.12 X44 IrDA Connector .............................................................................................................. 33
5.1.13 X50 USB 1 Connector ............................................................................................................ 33
5.1.14 X51 USB 2 Connector ............................................................................................................ 34
5.1.15 X52 USB 3 Connector ............................................................................................................ 34
5.1.16 X53 USB 4 Connector ............................................................................................................ 34
5.1.17 X60 IDE Interface ................................................................................................................. 34
5.1.18 X70 Floppy Disk Interface Connector ........................................................................................ 35
5.1.19 X101 PC/104+ BUS Interface .................................................................................................. 35
5.1.20 X102 PC/104 BUS Interface .................................................................................................... 36
5.1.21 X110 LPC-Port ..................................................................................................................... 37
5.1.22 X230 JTAG-Port ................................................................................................................... 37
5.2 Jumpers.............................................................................................................................. 37
5.2.1 The Jumpers on the MSM800BEV ............................................................................................. 37
6 Detailed System Description ............................................................38
6.1 Incompatibilities to a Standard PC/AT........................................................................................ 38
6.1.1 PC104 BUS / ISA BUS ............................................................................................................ 38
6.1.2 Keyboard versus NUM-Lock .................................................................................................... 38
6.2 Related Application Notes ....................................................................................................... 38
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6.3 High Frequency Radiation (to meet EN55022) ............................................................................. 38
6.3.1 For Peripheral Cables ............................................................................................................ 38
6.3.2 For Stack-Through Applications............................................................................................... 39
6.3.3 Power Supply ...................................................................................................................... 39
6.4 Battery Lifetime.................................................................................................................... 39
6.4.1 External Battery Assembly:..................................................................................................... 39
6.5 Power Requirements .............................................................................................................. 40
6.6 Boot Time............................................................................................................................ 40
6.7 CPU, Boards and RAMs............................................................................................................ 40
6.7.1 CPUs of this MICROSPACE Product ............................................................................................ 40
6.7.2 Numeric Coprocessor ............................................................................................................ 40
6.7.3 DDRAM Memory on MSM800BEV .............................................................................................. 41
6.8 Interfaces............................................................................................................................ 41
6.8.1 AT Compatible Keyboard & PS/2 Mouse X31................................................................................ 41
6.8.2 Line Printer Port LPT1 ........................................................................................................... 41
6.8.3 Serial Ports COM1-COM2 ........................................................................................................ 41
6.8.4 Floppy Disk Interface ............................................................................................................ 42
6.8.5 Speaker Interface................................................................................................................. 43
6.9 Controllers .......................................................................................................................... 43
6.9.1 Interrupt Controllers ............................................................................................................ 43
6.10 Timers and Counters .............................................................................................................. 43
6.10.1 Programmable Timers ........................................................................................................... 43
6.10.2 RTC (Real Time Clock) ............................................................................................................ 44
6.10.3 Watchdog ........................................................................................................................... 44
6.11 CMOS RAM Map ..................................................................................................................... 44
6.11.1 CMOS Map .......................................................................................................................... 45
6.12 EEPROM saved CMOS Setup ...................................................................................................... 48
6.12.1 EEPROM Memory for Setup...................................................................................................... 49
6.13 Memory & I/O Map................................................................................................................. 49
6.13.1 System Memory Map ............................................................................................................. 49
6.13.2 System I/O Map ................................................................................................................... 50
7 System Resources..........................................................................54
7.1 Bus Signals .......................................................................................................................... 54
7.1.1 PC104 Bus .......................................................................................................................... 54
7.1.2 PC104+ Bus ........................................................................................................................ 56
7.1.3 Expansion Bus..................................................................................................................... 57
7.1.4 Addressing PCI Devices.......................................................................................................... 58
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7.2 VGA/LCD ............................................................................................................................. 58
7.2.1 VGA/LCD Controller of the Geode LX800 .................................................................................... 58
7.2.2 Graphic Modes..................................................................................................................... 58
7.2.3 DVICON Resolution ............................................................................................................... 58
7.2.4 Flat Panel Functional Description ............................................................................................ 59
7.3 Cable Interfaces.................................................................................................................... 60
7.3.1 The Hard Disk Cable 44pin ...................................................................................................... 60
7.3.2 The COM 1/2 Serial Cable ....................................................................................................... 61
7.3.3 The Printer Cable.................................................................................................................. 61
7.3.4 The Micro-Floppy Cable.......................................................................................................... 62
7.3.5 The LAN Cable (RJ45)............................................................................................................ 63
8 Design Considerations....................................................................64
8.1 Dimensions and Diagrams ....................................................................................................... 64
8.1.1 Board Dimensions ................................................................................................................ 64
8.1.2 Top of BEV board with small heat sink (Option 807041) ................................................................ 65
8.1.3 BEV board profile with small heat sink (Option 807041) and CompactFlash (Option 807007) ................ 65
8.1.4 3D perspective, bottom of BEV board, with L+ (Option 807006)...................................................... 66
8.1.5 3D perspective, bottom of BEV board with CompactFlash (Option 807007) ........................................ 66
8.1.6 Top of BEV board with large heat sink (Option 807042) ................................................................ 67
8.1.7 BEV board profile with large heat sink (Option 807042) and CompactFlash (Option 807007)................. 67
8.1.8 3D perspective, top of BEV board with large heat sink (Option 807042)............................................ 68
8.1.9 Top of BEV board with thermojunction (Option 807043) ............................................................... 69
8.1.10 BEV board profile with thermojunction (Option 807043) and CompactFlash (Option 807007) ............... 69
8.1.11 3D perspective, top of BEV board with thermojunction (Option 807043)........................................... 70
8.1.12 MSM800LVDSCON ................................................................................................................. 71
8.1.13 MSM800DVICON ................................................................................................................... 72
8.1.14 MSM800CON ....................................................................................................................... 73
8.2 Assembly Views..................................................................................................................... 75
8.2.1 MSM800BEV V2.1, Top View .................................................................................................... 75
8.2.2 MSM800BEV V2.1, Bottom View ............................................................................................... 76
8.3 Thermoscan ......................................................................................................................... 76
8.4 Thermal Specifications ........................................................................................................... 77
9 BIOS...........................................................................................79
9.1 BIOS History ........................................................................................................................ 79
9.2 Core BIOS Download .............................................................................................................. 79
9.2.1 Before downloading a BIOS .................................................................................................... 79
9.2.2 Start the download............................................................................................................... 79
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9.2.3 If the download does not work ................................................................................................ 79
9.3 ROM-BIOS Sockets ................................................................................................................. 80
9.3.1 Standard BIOS ROM .............................................................................................................. 80
9.4 BIOS CMOS Setup .................................................................................................................. 80
10 Previous Product Versions ...............................................................81
10.1 Board Dimensions – Versions 1.0 / 1.1 / 1.2 ................................................................................ 81
10.2 Assembly Views..................................................................................................................... 82
10.2.1 Top Side of the MSM800BEV V1.1 ............................................................................................. 82
10.2.2 Bottom Side of the MSM800BEV V1.1 ........................................................................................ 83
10.3 Connectors and Jumpers of Previous Product Versions ................................................................... 84
10.3.1 Description of the Connectors for V1.0 /V1.1 /V1.2...................................................................... 85
11 Appendix A: Architecture Information................................................93
11.1 Buses ................................................................................................................................. 93
11.1.1 ISA, Standard PS/2 – Connectors............................................................................................. 93
11.1.2 PCI/104 ............................................................................................................................. 93
11.2 General PC Architecture .......................................................................................................... 93
11.3 Ports .................................................................................................................................. 94
11.3.1 RS-232 Serial ...................................................................................................................... 94
11.3.2 Serial ATA........................................................................................................................... 94
11.3.3 USB .................................................................................................................................. 94
11.4 Programming ....................................................................................................................... 94
12 Appendix B: Document Revision History .............................................95
13 Index..........................................................................................96
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MSM800BEV / User Information
1 User Information
1.1 About this Document
This document provides information about products from Kontron AG and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied "as-is" and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.
1.2 Copyright Notice
Copyright© 2003-2010 Kontron AG
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron AG.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron AG. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this product.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron AG is certified to ISO 9000 standards.
1.5 Warranty
This Kontron AG product is warranted against defects in material and workmanship for the warranty period from the
date of shipment. During the warranty period, Kontron AG will, at its discretion, decide to repair or replace defective
products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron AG will not be responsible for any defects or damages to other products not supplied by Kontron AG that are
caused by a faulty Kontron AG product.
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MSM800BEV / User Information
1.6 Technical Support
Technicians and engineers from Kontron AG and/or its subsidiaries are available for technical support. We are
committed to making our products easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest
BIOS downloads, Product Change Notifications and additional tools and software. In any case, you can always contact
your product supplier for technical support.
1.7 Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible. Many of the
components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled.
Final disposal of this product after its service life must be accomplished in accordance with applicable country, state,
or local laws or regulations. All components within this product fulfill the requirements of the RoHS (Restriction of
Hazardous Substances Directive). The product is soldered with a lead free process.
1.8 RoHS Commitment
Kontron Compact Computers AG (Switzerland) is committed to develop and produce environmentally friendly products
according to the Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and
Electronic Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a directive,
which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical
equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC,
which has set targets for collection, recycling and recovery of electrical goods and is part of a legislative initiative to
solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the directive
as a guide. Therefore, there could be as many different versions of the law as there are states in the EU. Additionally,
non-EU countries like China, Japan, or states in the U.S. such as California may have their own regulations for green
products, which are similar, but not identical, to the RoHS directive.
RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
» Lead
» Mercury
» Cadmium
» Chromium VI
» PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which
is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply to the weight of the
finished product, or even to a component but to any single substance that could (theoretically) be separated
mechanically.
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MSM800BEV / User Information
1.8.1 RoHS Compatible Product Design
All Kontron Compact Computers (KCC) AG standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical
components during the design-in phase of all KCC AG standard products.
1.8.2 RoHS Compliant Production Process
Kontron Compact Computers AG selects external suppliers that are capable of producing RoHS compliant devices.
These capabilities are verified by:
» A confirmation from the supplier indicating that their production processes and resulting devices are RoHS
compliant.
» If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned substances in a
produced device will be measured. These measurements are carried out by an accredited laboratory.
1.8.3 WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
» Large and small household appliances
» IT equipment
» Telecommunications equipment (although infrastructure equipment is exempt in some countries)
» Consumer equipment
» Lighting equipment – including light bulbs
» Electronic and electrical tools
» Toys, leisure and sports equipment
» Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that brings
the product to market, as defined in the directive. Components and sub-assemblies are not subject to product
compliance. In other words, since Kontron Compact Computers AG does not deliver ready-made products to end users
the WEEE directive is not applicable for KCC AG. Users are nevertheless encouraged to properly recycle all electronic
products that have reached the end of their life cycle.
1.9 Swiss Quality
» 100% Made in Switzerland
» This product was not manufactured by employees earning piecework wages
» This product was manufactured in humane work conditions
» All employees who worked on this product are paid customary Swiss market wages and are insured
» ISO 9000:2001 (quality management system)
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MSM800BEV / User Information
1.10 The Swiss Association for Quality and Management Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment services for
all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss
Accreditation Service (SAS), active membership in the International Certification Network, IQNet, and co-operation
contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to Kontron Compact Computers AG in the field of development,
manufacturing and sales of embedded computer boards, embedded computer modules and computer systems. The
certification is valid for three years at which time an audit is performed for recertification.
www.kontron.com 9
MSM800BEV / Introduction
2 Introduction
2.1 MSM800BEV Ordering Information
Part / Option Part Nr. Description
MSM800BEV 802110 Standard version with: full ISA-16bit support and PCI-ISA-bridge
Option -P+ 807005 PC/104-Plus with short connector
Option -L+ 807006 PC/104-Plus with long connector
Option -CF 807007 CompactFlash socket (not with 807006)
MSM800-CKCON 803035 MSM800 PC/104-cable kit
MSFLOPPY 891001 3.5" Micro-floppy drive (26pin)
MSFDCK 802600 Micro-floppy cable (26pin)
MSM800-LANCON 803046 LAN cable with PCB
MSM800-DVICON 803042 DVI-D interface
MSM800-LVDSCON 803044 LVDS interface
MSM800 Small Cooler 807041 For -25°C to +70°C temperatures
MSM800 Large Cooler 807042 For -40°C to +85°C temperatures (not with 802100, 802105)
MSM800 Thermojunction 807043 Direct thermal coupling, -40°C to +85°C temperatures (not with 802100, 802105)
MSM800DK 802118 Development Kit
Note: These are only examples; for current ordering codes, please see the current price list.
2.2 MSM800BEV Applications
» Information terminals
» Control of interactive devices
» Play systems with music output
» Measuring instruments
» Telecommunication devices
» Use in vehicles
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MSM800BEV / Introduction
2.3 MSM800BEV Features
The MICROSPACE® MSM800 is a miniaturized modular device incorporating major elements of a standard PC/AT
compatible computer such as:
» Powerful Geode LX-800 500MHz
» BIOS ROM
» Timers, DMA
» Real-time clock with CMOS-RAM and battery buffer (external/onboard)
» LPT1 parallel port
» COM1-, COM2-RS2332 serial port
» Speaker interface
» AT keyboard interface or PS/2 keyboard interface
» Floppy disk interface
» AT IDE hard disk interface
» VGA/LCD video interface
» PC/104 ISA bus
» PC104+ PCI bus (option)
» PS/2 mouse interface
» 4 channel USB 2.0
» Optional: onboard CF socket Type II
» Single 5V supply
» EEPROM for setup and configuration
» UL approved parts
» Watchdog
The 8W power consumption permits passive cooling within a very broad ambient temperature range. Cooling options
must always be ordered separately.
The PC/104-Plus bus (ISA and PCI) and 4 USB interfaces are available as functional extensions.
This product complies with the PC/104 Consortium form factor 3.55 × 3.775 inches (90.17 × 95.89 mm) and is
available in "stack through" versions. The MSM800 is PCI/104-Express, version 1.0, compliant.
2.3.1 The MSM800BEV Model
» LAN Ethernet, INTEL 82551ER (V2.1 and later – or on request [optional] 82551QM)
» PCI to ISA bridge for full ISA support. Needs one PCI load/resource.
» SODIMM DDR-Memory holder (128-1024MByte)
» Sound controller
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2.4 Block Diagram
2.4.1 MSM800BEV
MSM800BEV / Introduction
2.5 MICROSPACE® Documentation
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems based on
the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the MICROSPACEComputer family. This manual provides instructions for installing and configuring the board and describes the system
and setup requirements. This document contains information on hardware requirements, interconnections, and
details of how to program the system. Please check the Product CD for further information and manuals.
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2.6 Product Photo
2.6.1 MSM800BEV
Top View, with Option 807041 (small cooler):
MSM800BEV / Introduction
Bottom View:
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3 Specifications
Note: All information is subject to change without notice.
CPU
CPU Geode LX800
CPU Core Supply 1.8V very low powered
Mode Real/Protected
Compatibility 8086 – P5
Word Size 32bits
Secondary Cache –
Physical Addressing 32 lines
Virtual Addressing 16GBytes
Clock Rates 500MHz
Socket Standard Soldered BGA
Chipset
Northbridge AMD LX800
Southbridge AMD 5536
LAN 10/100Mbit Intel 82C551ER
Audio AC97 – V2.3
Firewire IEEE1394 Not onboard
Video 16MByte Video-DDRAM
MSM800BEV / Specifications
Power Management
The LX800/900 supports ACPI and APM Version 1.2.
The following ACPI Sleep States are supported:
» S1 Sleep with CPU content.
» S4 Hibernation (LED is blinking) with transition to S5.
Available since V2.0
» S5-G2 Power Off (LED is blinking).
The device can be switched on by the Main Button (or with WOL if available).
» S5-G3 Power Off (mechanically)
= if available
DMA
8237A comp.
Interrupts
8259 comp. 8 + 7 levels, PC compatible
Timers
8254 comp. 3 programmable counters/timers
4 channel 8bits
3 channel 16bits
Memory
MSM800BEV SODIMM200pin DDR PC2700 333MHz 128-1024MByte
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MSM800BEV / Specifications
5V
Video
Controller MSM800BEV
Bus 32bit high speed 33MHz PCI bus
Enhanced BIOS VGA/LCD BIOS
Memory 2-254MByte shared RAM
CRT-Monitor VGA, SVGA up to 1920x1440
Flat Panel TFT 3.3V 18/24bit up to 1600x1200
Controller Modes CRT only; flat panel only; or simultaneous CRT and flat panel
Video Input No
Drivers WIN2000, XP
Mass Storage
FD Floppy disk interface, for max. 1 floppy with 26pin connector
HD
E-IDE interface, AT-type, for max. 2 hard disks, 44pin connector, for 1.3, 1.8 and 2.5" hard
disks with 44 pins IDE
Standard AT Interfaces
Name FIFO IRQs Address Standard Option
Serial
Parallel LPT1 printer interface mode: SPP(output), EPP (bidirectional) (Centronics)
Keyboard AT or PS/2 –keyboard
Mouse PS/2
Speaker 0.1 W output drive
RTC Integrated into the chipset, RTC with CMOS-RAM 256Byte
Backup Current
Non-chargeable Battery MSM800BEV: 3.6V lithium 400mAh internally or externally connected
COM1
COM2
(Baud rates: 50-115 KBaud programmable)
<5 µA
yes
yes
IRQ4
IRQ3
3F8
2F8
RS232C
RS232C
Bus
PC/104 ISA
Clock 8MHz defined by the Geode
IEEE-996 standard ISA bus, buffered
MSM800BEV: full 16bit ISA support
USB
USB 2.0
Transfer Rate 400MBps, 12.5MBps/1.5MBps
Channels 4
Peripheral Extension
ISA
PCI
With PC/104 bus
MSM800BEV: no ISA limitation
With PC/104-Plus bus
MSM800BEV: 4 slots – max. 4 master devices
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MSM800BEV / Specifications
Power Supply
Working
Power Rise Time Unspecified
Power Consumption MSM800SEV V2.1 with HD, MS/KB (PS/2), CRT monitor, WindowsXP Desktop: typ. 7.5-10W
Standby Power Consumption
5 Volts ± 5%
MSM800BEV:
Windows Standby: 2.5W (without MS/KB wake-up function)
Windows Standby: 4.5W (with PS/2 wake-up function)
Physical Characteristics
Length: 90mm
Dimensions
Weight 90-170gr depending on model and cooler option
PCB Thickness 1.6mm / 0.0625 inches nominal
PCB Layer Multilayer
Depth: 96/99mm
Height: 17-25mm
Operating Environment
Relative Humidity 5-90% non-condensing
Vibration 5 to 2000Hz, 0.1G
Shock 1 g
Temperature
Storage All models: -55°C to +85°C
Operating Temperature without Cooler All models: 0°C to +60°C
Operating Temperature with 807041 All models: -25°C to +70°C
Extended Operating Temperature with 807042 Model BEV with E48: -40°C to +85°C
Extended Operating Temp. with 807043 and E48 Model BEV: -40°C to +85°C
EMI / EMC (IEC1131-2 refer MIL 461/462)
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
ESD Electro Static Discharge
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested)
EFT Electric Fast Transient (Burst)
SIR Surge Immunity Requirements
High-frequency Radiation EN55022
Metallic protection needed
Separate ground layer included
15 kV single peak
IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 Ohms, Ts=5ns
Grade 2: 1kV Supply, 500 I/O, 5kHz
IEC 801-5, IEEE587, VDE 0843 Part 5
Supply: 2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: none
Compatibility
MSM800BEV
Mechanically compatible to Kontron Compact Computers MSMx86 boards and to
all other PC/104 boards.
Note: All information is subject to change without notice.
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MSM800BEV / Quick Start Guide
4 Quick Start Guide
Warning: ESD Sensitive Device! Place the embedded computer board on an isolated, ESD-protected surface.
Ensure that all equipment, tools and people are fully protected against ESD.
4.1 Print Manuals from the Product CD
Place the Product CD into the CD drive of a personal computer with a connected printer.
Open the CD; open the directory Manuals/MSM800.
Print out the required manuals (for example the BIOS manual or the User's Guide).
4.2 The MSM800CON, Part Nr. 803036
The MSM800CON must be ordered separately.
www.kontron.com 17
The MSM800CON connected to an MSM800BEV board:
MSM800BEV / Quick Start Guide
4.3 The LANCON, Part Nr. 803046
www.kontron.com 18
4.4 The DVICON, Part Nr. 803042
The DVICON connected to an MSM800BEV board:
MSM800BEV / Quick Start Guide
www.kontron.com 19
MSM800BEV / Quick Start Guide
4.5 Connect Peripherals to the Board
Prepare the following peripherals:
» VGA monitor (LCD or CRT) with a resolution up to 1024x768 pixel
» PS2 keyboard
» USB mouse
» LAN cable, if available
» Hard disk or CompactFlash
» USB CD drive or floppy drive
» Power supply with 5 Volts and min. 30 Watts
Make sure the polarity is correct. Otherwise the hard disk and/or electronic board may be destroyed.
1. Connect the VGA monitor to the 15pin high density DSub-connector.
2. Connect the keyboard to the PS/2 connector.
3. Connect the USB mouse to one of the USB connectors.
4. Connect the hard disk with a 44pin cable to the IDE connector.
Alternatively to the hard disk, the CompactFlash card may be inserted into the CF socket.
Pin1 of the cable must go to Pin1 of the connector, which has a red mark next to it (not visible in the photo).
5. Connect a USB CD-Drive or a USB Floppy drive to one of the USB connectors.
6. Insert a boot device: USB stick, floppy, hard disk or bootable CF.
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MSM800SEV with the contents of the Cable Kit (CKCON):
MSM800BEV / Quick Start Guide
All of the above cables and PCB connectors are included in the MSM800CKCON, Part Nr. 803035 (the MSM800 board is
not included).
4.6 The Development Kit, Part Nr. 802118
The Development Kit (DK) allows for an immediate start-up with the embedded system. The hard disk includes a DOS
and a LINUX kernel V2.6 boot partition.
The following material is included in the current MSM800DK:
Item Part Number
1x MSM800BEV 802110
1x MSM800CKCON 803035
1x MSM800DVICON 803042
1x 256MB DRAM 890670
1x 3.5" floppy drive 891001
1x 2.5" hard disk 890003
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4.7 Power Up the Board
1. Check that the voltage is regulated to +5Volt and that the polarity is correct.
Attention! The supply voltage must be in the range of 4.9Volt to maximum 5.25Volt.
2. Switch on the connected monitor.
3. Switch on the external 5V power supply.
Attention! Jumper J1 determines the mode of the CompactFlash disk.
J1 – CF Master
MSM800BEV / Quick Start Guide
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Attention! Jumper J2 determines the behavior after power-on.
J2 – Autostart
MSM800BEV / Quick Start Guide
In autostart mode the board will automatically enter the boot sequence and the green "Power LED" will turn on.
In non-autostart mode the board will remain in standby mode until the power button is pressed.
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After a few seconds the screen should display the BIOS initial message/picture:
MSM800BEV / Quick Start Guide
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MSM800BEV / Quick Start Guide
4.8 BIOS Setup
Since the BIOS is auto-configuring during the start-up procedure, the user normally does not enter the BIOS setup.
Manual setup is needed only to change the default settings. Please refer to the driver/software/BIOS manual printed
from the Product CD for the BIOS setup details.
4.9 Boot Up the Operating System and Install the Drivers
Depending on which boot drive is available, boot up the operating system from the CompactFlash, hard disk, or floppy
disk.
To install the drivers, see the BIOS/Driver/Software/ manual on the Product CD.
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5 Connectors & Jumpers
5.1 Connectors
The following pages describe the connector pin-out for all current MSM800 boards.
Flat cable
44pin IDE is: IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable
All others are: IDT Terminal for Dual Row 0.1" (2.54mm grid) and 1.27mm flat cable
NC: not connected
Connector Structure Pin Remarks
X1 Power 2x4 2.54mm
X10 VGA 2x5 2.54mm
X15 LCD 2x22 2mm
X29 Sound Audio I/O 2x15 2.00mm
X30 LPT1 2x13 2.54mm
X31 Keyboard, mouse, utility 2x5 2.54mm
X33 LAN / Battery 2x5 2.00mm
X38 COM1 2x5 2.54mm
X39 COM2 2x5 2.54mm
X44 IrDA 4 2.54mm
X50 USB 1 4 2.54mm
X51 USB 2 4 2.54mm
X52 USB 3 4 2.54mm
X53 USB 4 4 2.54mm
X60 IDE 2x22 2mm
X70 Floppy 26 FCC micro
X71 CompactFlash Holder
X101 PC104+ 120 2mm
X102 PC104 104 2.54mm
X110 POD Port 2x7 2mm
X230 JTAG-Port 4 2.54mm
X300 SODIMM 144 0.8mm
MSM800BEV / Connectors & Jumpers
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5.1.1 Top Side of the MSM800BEV V2.1
MSM800BEV / Connectors & Jumpers
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5.1.2 Bottom Side of the MSM800BEV V2.1
With CompactFlash (Option 807007, connector X71).
MSM800BEV / Connectors & Jumpers
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