Kontron mITX-BDW-U User Manual

The information contained in this document has been carefully researched and is, to the best of our knowledge, accurate. However, we assume no liability for any product failures or damages, immediate or consequential, resulting from the use of the information provided herein. Our products are not intended for use in systems in which failures of product could result in personal injury. All trademarks mentioned herein are property of their resp ective owners. All specifications are subject to change without notice.
Manual
mITX-BDW-U
Kontron
Our company network supports you worldwide with offices in Germany, Austria,
Switzerland, Great Britain and the USA. For more information please contact:
FORTEC Elektronik AG Hauptniederlassung Lechwiesenstr. 9 86899 Landsberg am Lech
Telefon: +49 (0) 8191 91172-0 Telefax: +49 (0) 8191 21770 E-Mail:
sales@fortecag.de
Internet: www.fortecag.de
FORTEC Elektronik AG Büro West Hohenstaufenring 55 50674 Köln
Telefon: +49 (0) 221 272 273-0 Telefax: +49 (0) 221 272 273-10 E-Mail:
west@fortecag.de
Internet: www.fortecag.de
FORTEC Elektronik AG
Büro Wien Nuschinggasse 12 A-1230 Wien
Telefon: +43 1 8673492-0 Telefax: +43 1 8673492-26 E-Mail: office@fortec.at Internet: www.fortec.at
ALTRAC AG (Tochter der FORTEC): Bahnhofstraße 3 CH-5436 Würenlos
Telefon: +41 (0) 44 7446111 Telefax: +41 (0) 44 7446161 E-Mail: info@altrac.ch Internet: www.altrac.ch
USER GUIDE
mITX-BDW-U
KTD-NOXXX-A
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 2 - 104
TABLE OF CONTENTS 01/
TABLE OF CONTENTS ................................................................................................................................................................. 2 01/
USER INFORMATION .................................................................................................................................................................. 4
02/
DOCUMENT REVISION HISTORY ............................................................................................................................... 4
02.01.
COPYRIGHT NOTICE ...................................................................................................................................................... 4
02.02.
TRADEMARK ACKNOWLEDGEMENT ...................................................................................................................... 4
02.03.
DISCLAIMER ..................................................................................................................................................................... 4
02.04.
LIFE SUPPORT POLICY ................................................................................................................................................. 4
02.05.
WARRANTY ...................................................................................................................................................................... 5
02.06.
KONTRON AG TECHNICAL SUPPORT AND SERVICES ....................................................................................... 5
02.07.
INTRODUCTION ............................................................................................................................................................................ 7
03/
INSTALLATION PROCEDURE ................................................................................................................................................... 8
04/
INSTALLING THE BOARD ............................................................................................................................................. 8
04.01.
............................................................................................................................................................................................... 9
04.02.
SYSTEM SPECIFICATIONS ........................................................................................................................................................ 11
05/
COMPONENT MAIN DATA .......................................................................................................................................... 11
05.01.
mITX-BDW-U BLOCK DIAGRAM ............................................................................................................................ 14
05.02.
PROCESSOR SUPPORT TABLE ................................................................................................................................ 14
05.03.
SYSTEM MEMORY SUPPORT .................................................................................................................................. 15
05.04.
mITX-BDW-U GRAPHICS SUBSYSTEM ................................................................................................................ 16
05.05.
POWER CONSUMPTION ............................................................................................................................................
17 05.06.
CONNECTOR LOCATIONS....................................................................................................................................................... 22
06/
mITX-BDW-U - FRONTSIDE .................................................................................................................................... 22
06.01.
CONNECTOR DEFINITION ....................................................................................................................................................... 23
07/
IO-AREA CONNECTORS .......................................................................................................................................................... 24
08/
DP CONNECTORS DP1 & DP2 (J8 & J9) ............................................................................................................... 24
08.01.
ETHERNET CONNECTORS (J4 & J5) ......................................................................................................................25
08.02.
USB CONNECTORS (IO AREA) ................................................................................................................................ 26
08.03.
AUDIO JACK CONNECTORS (J1 & J2) ................................................................................................................... 28
08.04.
INTERNAL CONNECTORS ....................................................................................................................................................... 30
09/
DC POWER - ATX CONNECTOR (INT12V - J10) ................................................................................................. 30
09.01.
DC POWER - JACK CONNECTOR (EXT19 V – J3) .............................................................................................. 30
09.02.
FAN CONNECTORS (J34 AND J29) ........................................................................................................................ 30
09.03.
PS/2 KEYBOARD AND MOUSE CONNECTOR (KBDMSE) (J15) .................................................................... 31
09.04.
SATA (SERIAL ATA) DISK INTERFACE ................................................................................................................. 32
09.05.
USB CONNECTORS (INTERNAL)............................................................................................................................ 34
09.06.
SPEAKER CONNECTOR (J13) ................................................................................................................................... 34
09.07.
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SPDIF-OUT (J14) ......................................................................................................................................................... 34 09.08.
FRONT PANEL CONNECTOR (FRONTPNL) (J23) ............................................................................................. 34
09.09.
SERIAL COM1 – COM2 PORTS (J21, J25) .............................................................................................................. 36
09.10.
LVDS FLAT PANEL CONNECTOR (J33) ................................................................................................................... 37
09.11.
FEATURE CONNECTOR (J28)................................................................................................................................... 38
09.12.
“LOAD DEFAULT BIOS SETTINGS” JUMPER (JP1) ............................................................................................. 42
09.13.
ALWAYS ON JUMPER SETTING (JP1) .................................................................................................................... 42
09.14.
SPI CONNECTOR (J30) ............................................................................................................................................... 42
09.15.
LPC CONNECTOR (J31) ............................................................................................................................................... 43
09.16.
SLOT CONNECTORS (MINIPCIE) ........................................................................................................................................... 44
10/
ON-BOARD -& MATING CONNECTOR TYPES .................................................................................................................. 45
11/
BIOS................................................................................................................................................................................................. 47
12/
MAIN.................................................................................................................................................................................. 47
12.01.
ADVANCED ......................................................................................................................................................................53
12.02.
SECURITY ........................................................................................................................................................................ 98
12.03.
BOOT ............................................................................................................................................................................... 101
12.04.
MISC ................................................................................................................................................................................ 102
12.05.
EXIT ................................................................................................................................................................................. 103
12.06.
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USER INFORMATION 02/
DOCUMENT REVISION HISTORY 02.01.
COPYRIGHT NOTICE 02.02.
Copyright  2015, Kontron AG, ALL RIGHTS RESERVED.
No part of this document may be reproduced or transmitted in any form or by any means, electronically or mechanically, for any purpose without the express written permission of Kontron AG.
TRADEMARK ACKNOWLEDGEMENT 02.03.
Brand and product names are trademarks or registered trademarks of their respective owners.
DISCLAIMER 02.04.
Kontron AG reserves the right to make changes without notice to any product, including circuits and/or software described or contained in this manual in order to improve design and/or performance.
Specifications listed in this manual are subject to change without notice. Kontron AG assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these products and makes no representations or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise specified. Applications that are described in this manual are for illustration purposes only. Kontron AG makes no representation or warranty that such application will be suitable for the specified use without further testing or modification.
LIFE SUPPORT POLICY 02.05.
KONTRON AG PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF THE GENERAL MANAGER OF KONTRON AG.
As used herein:
Life support devices or systems are devices or systems which (a) are intended for surgical implant into body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user.
A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
REVISION DATE BY COMMENT
0.0 20-02-2015 CDO Preliminary version
0.1 21-04-2015 CDO Removed fan assembly drawing.
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 5 - 104
WARRANTY 02.06.
Kontron AG warrants its products to be free from defects in material and workmanship during the warranty period. If a product proves to be defective in material or workmanship during the warranty period Kontron AG will, at its sole option, repair or replace the product with a similar product.
Replacement Product or parts may include remanufactured or refurbished parts or components.
The warranty does not cover:
1. Damage, deterioration or malfunction resulting from:
Accident, misuse, neglect, fire, water, lightning or other acts of nature, unauthorized product
modification or failure to follow instructions supplied with the product.
Repair or attempted repair by anyone not authorized by KONTRON Technology.
Causes external to the product, such as electric power fluctuations or failure.
Normal wear and tear.
Any other causes which does not relate to a product defect.
2. Removal, installation and set-up service charges.
Exclusion of damages:
KONTRON TECHNOLOGY LIABILITY IS LIMITED TO THE COST OF REPAIR OR REPLACEMENT OF THE PRODUCT. KONTRON TECHNOLOGY SHALL NOT BE LIABLE FOR:
1. DAMAGE TO OTHER PROPERTY CAUSED BY ANY DEFECTS IN THE PRODUCT, DAMAGES BASED UPON INCONVENIENCE, LOSS OF USE OF THE PRODUCT, LOSS OF TIME, LOSS OF PROFITS, LOSS OF BUSINESS OPPORTUNITY, LOSS OF GOODWILL, INTERFERENCE WITH BUSINESS RELATIONSHIPS OR OTHER COMMERCIAL LOSS, EVEN IF ADVISED OF THEIR POSSIBILITY OF SUCH DAMAGES.
2. ANY OTHER DAMAGES, WHETHER INCIDENTAL, CONSEQUENTIAL OR OTHERWISE.
3. ANY CLAIM AGAINST THE CUSTOMER BY ANY OTHER PARTY.
KONTRON AG TECHNICAL SUPPORT AND SERVICES 02.07.
If you have questions about installing or using your Kontron AG Product, then please notice that you will find many answers in this Users Guide. To obtain support please contact your local Distributor or Field Application Engineer (FAE).
Before Contacting Support: Please be prepared to provide as much information as possible:
CPU Board
1. Type.
2. Part Number (find PN on label).
3. Serial Number if available (find SN on label).
Configuration
1. DRAM Type and Size.
2. BIOS Revision (find the version info in the BIOS Setup).
3. BIOS Settings different than Default Settings (refer to the BIOS Setup section).
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System
1. O/S Make and Version.
2. Driver Version numbers (Graphics, Network, and Audio).
3. Attached Hardware: Harddisks, CD-Rom, LCD Panels etc.
If the Kontron Technology product seems to be defect and you want to return it for repair, please follow the guide lines from the following page:
http://kontron.com/services/rma-information/kontron-technology-a-s
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 7 - 104
INTRODUCTION 03/
This manual describes the mITX-BDW-U board made by Kontron AG. This board will also be denoted mITX-BDW-U within this Users Guide.
The mITX-BDW-U board is based on the BDW-U chipset, support 5
th
generation Intel® Broadwell i7 -, i5 -,
i3 2Core mobile processors. See “Processor Support Table” for more specific details.
Use of this Users Guide implies a basic knowledge of PC-AT hard- and software. This manual is focused on describing the mITX-BDW-U board’s special features and is not intended to be a standard PC-AT textbook.
New users are recommended to study the short installation procedure stated in the following chapter before switching-on the power.
All configuration and setup of the CPU board is either done automatically or manually by the user via the BIOS setup menus.
Latest revision of this manual, datasheet, thermal simulations, BIOS, drivers, BSP’s (Board Support Packages), Mechanical drawings (2D and 3D) can be downloaded from here:
http://www.kontron.com/products/boards-and-mezzanines/embedded-motherboards/mini-itx­motherboards/
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 8 - 104
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INSTALLATION PROCEDURE 04/
INSTALLING THE BOARD 04.01.
To get the board running follow these steps. If the board shipped from Kontron has already components like RAM and CPU cooler mounted, then relevant steps below can be skipped.
1. Turn off the PSU (Power Supply Unit)
Warning
: Turn off PSU (Power Supply Unit) completely (no mains power connected to the PSU)
or leave the Power Connectors unconnected while configuring the board. Otherwise components (RAM, LAN cards etc.) might get damaged. Make sure only to use standard ATX PSU running the board with non-compliant ATX PSU may damage the board within minutes.
2. Insert the DDR3L SO-DIMM 204pin SO-DIMM module(s)
Be careful to push it in the slot(s) before locking the tabs. For a list of approved DDR3L SO-DIMMs contact your Distributor or FAE. See also chapter “System Memory Support”.
3. Cooler Installation
The mITX-BDW-U comes with a passive heatsink pre-installed and a separate fan, which can be mounted onto the heatsink, should the system require additional airflow. Connect Cooler Fan electrically to the FANCPU connector.
4. Connecting Interfaces
Insert all external cables for hard disk, keyboard etc. A monitor must be connected in order to change BIOS settings.
5. Connect and turn on PSU
Connect PSU to the board by the ATX+12 V- 4p connector or alternatively connect a 19 V power adapter to the Rear I/O power jack.
6. Power Button
If the board does not start by itself when switching on the ATX PSU AC mains, then follow these instructions to start the board. Install the Always On Jumper in the Always On position or toggle the PWRBTN_IN# signal (available in the FRONTPNL connector), by momentary shorting pins 16 (PWRBTN_IN#) and pin 18 (GND). A “normally open” switch is recommended.
7. BIOS Setup
Enter the BIOS setup by pressing the <F2> key during boot up.
Enter “Exit Menu” and Load Setup Defaults.
Refer to the “BIOS Configuration / Setup“ section of this manual for details on BIOS setup.
Note:
To clear all BIOS settings, including Password protection, activate “Load Default BIOS Settings”
Jumper for ⋲10 sec (without power connected).
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!
8. Mounting the board in chassis
Warning
: When mounting the board to chassis etc. please notice that the board contains
components on both sides of the PCB which can easily be damaged if board is handled without reasonable care. A damaged component can result in malfunction or no function at all.
When fixing the Motherboard on a chassis it is recommended using screws with integrated washer and a diameter of ⋲7 mm. Do not use washers with teeth, as they can damage the PCB and cause short circuits.
04.02.
Take care when designing chassis interface connectors in order to fulfil the IEC60950 standard.
Users of mITX-BDW-U (T4006) must evaluate the end-product to ensure compliance the requirements of the 60950-1 safety standard are met:
The motherboard must be installed in a suitable mechanical, electrical and fire enclosure.
The system in its enclosure must be evaluated for temperature and air flow considerations.
The motherboard must be powered by a CSA or UL approved power supply that limits the maximum
input current to 10A via external barrel-type 19Vdc connector, and to 16A via internal square 12Vdc ATX connector.
For interfaces having a power pin such as external power or fan, ensure that the connectors and
wires are suitably rated. All connections from/to the product shall be with SELV circuits only.
Wires have suitable rating to withstand the maximum available power.
That the enclosure of the peripheral device fulfils the fire protecting requirements of IEC60950.
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Lithium battery precautions
CAUTION!
Danger of explosion if battery is incorrectly re­placed. Replace only with same or equivalent type recommended by manufacturer. Dispose of used batteries according to the manufacturer’s instruc­tions.
VORSICHT!
Explosionsgefahr bei unsachgemäßem Austausch der Batterie. Ersatz nur durch den selben oder einen vom Hersteller empfohlenen gleichwertigen Typ. Entsorgung gebrauchter Batterien nach Angaben des Herstellers.
ATTENTION!
Risque d'explosion avec l'échange inadéquat de la batterie. Remplacement seulement par le même ou un type équivalent recommandé par le producteur. L'évacuation des batteries usagées conformément à des indications du fabricant.
PRECAUCION!
Peligro de explosión si la batería se sustituye incorrectamente. Sustituya solamente por el mismo o tipo equivalente recomendado por el fabricante. Disponga las baterías usadas según las instrucciones del fabricante.
ADVARSEL!
Lithiumbatteri – Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.
ADVARSEL!
Eksplosjonsfare ved feilaktig skifte av batteri. Benytt samme batteritype eller en tilsvarende type anbefalt av apparatfabrikanten. Brukte batterier kasseres i henhold til fabrikantens instruksjoner.
VARNING!
Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS!
Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan lalteval­mistajan suosittelemaan tyyppiln. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
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SYSTEM SPECIFICATIONS 05/
COMPONENT MAIN DATA 05.01.
The table below summarizes the features of the mITX-BDW-U embedded motherboard.
FORM FACTOR
mITX-BDW-U: miniITX (170.18 mm by 170.18 mm), Height approx. 23 mm from top of PCB board.
PROCESSOR
On board CPU variants Support 5th Generation Intel® Core™ (Broadwell-U Mobile) processors on a BGA 1168 in a Multi-chip package with the PCH (max. 15 W TDP)
Intel® Core™ i7Intel® Core™ i5Intel® Core™ i3
MEMORY DDR3L SO-DIMM 204pin socket (2 sockets)
Support single and dual ranks DDR3L 1333/1600MT/s (PC3-10600/PC3-12800) Support system memory from 1x 1GB up to 2x 8GB. Notes: Less than 4 GByte displayed in System Properties using 32 bit OS (Shared Video Memory/PCI resources is subtracted) ECC not supported
CHIPSET
Intel Series 9 PCH-LP (Platform Controller Hub)
Intel ® VT-d (Virtualisation Technology for Directed I/O) Intel ® TXT (Trusted Execution Technology)Intel ® HD Audio TechnologyIntel ® RST (Rapid Storage Technology)SATA (Serial ATA) 6Gb/s USB revision 2.0USB revision 3.0PCI Express revision 2.0ACPI 4.0a compliantTriple Display support (Triple Graphic Pipes)Blue-ray HD video playback Enhanced DMA controller, interrupt controller and timer functions
AUDIO
Audio, 5.1 Channel High Definition Audio Codec using the Realtek ALC662 codec
Line-in and Line-out Microphone: MIC1 and MIC2SPDIF-Out (electrical Interface only) On-board speaker (Electromagnetic Sound Generator like Hycom HY-05LF)
VIDEO
Intel ® i3, i5 & i7 5
th
Generation Mobile processors support 3x digital display ports via
the Intel® Broadwell-U CPU:
2x DP (DisplayPorts), comply with DisplayPort 1.2a specification.HDMI panel support via DP to HDMI Adapter Converter. LVDS panel support up to 2 pixel/clock 24 bit colors (VESA and JEIDA)Triple independent pipes for Mirror or Triple independent display support Triple independent pipes for triple independent or cloned displays are
supported from OS. Any 3 displays via DP1, DP2 and LVDS can be used.
I/O CONTROL
Via ITE IT8528E Embedded Controller via LPC Bus interface
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 12 - 104
PERIPHERAL INTERFACES
Four USB 3.0 / USB 2.0 on I/O area
Four USB 2.0 ports on internal pinrowsTwo Serial ports (RS232) on internal pinrowsTwo Serial ATA-600 (one further SATA port implemented in M.2 connector) RAID 0/1 support
LAN SUPPORT 1x 10/100/1000Mbits/s LAN (ETHER1) using Intel® Clarksville WGI218LM Gigabit
PHY connected to BDW-U
1x 10/100/1000Mbits/s LAN (ETHER2) using Intel® Pearsonville I211AT PCI
Express controller
PXE Netboot supported. Wake On LAN (WOL) supported
EXPANSION CAPABILITIES
PCI-Express slots:
1x mPCIe connector with USB 2.0 port support for 3G modem (SIM socket)
1x M.2 connector with 1x SATA/ PCIe x2SMBus, compatible with ACCES BUS and I2C BUS, (via Feature connector)SPI bus routed to SPI connector (BIOS Recovery module interface) DDC/AUX Bus routed to DP connector (Auto detect to DDC when using passive
DP to HDMI adapters)
18x GPIOs (General Purpose I/Os), (via Feature connector)DAC, ADC, PWM and TIMER (Multiplexed), (via Feature connector)WAKE UP / Interrupt Inputs (Multiplexed), (via Feature connector) 3 Wire Bus for GPIO Expansion (up to 152 GPIOs), (via Feature connector)8 bit Timer output, (via Feature connector)
HARDWARE MONITOR SUBSYSTEM
Smart Fan control system, support Thermal® and Speed® cruise for two on-
board Fan connectors: CPU Fan (on-board) and System Fan (on-board) Thermal inputs: CPU Die temperature (precision +/- 3º C), System temperature
(precision +/- 3º C)
Intrusion (Case Open) detect input, (via Feature connector)Sleep S5# Indication, (via Feature connector)System Powergood Signal, (via Feature connector)
POWER SUPPLY UNIT
ATX+12 V PSU 4-pin on internal 2x 2 pin connector.
Or:
19V notebook-style Power adapter through Rear I/O power jack.
BATTERY
Exchangeable 3.0V Lithium battery for on-board Real Time Clock and CMOS RAM.
Manufacturer Panasonic / Part-number CR-2032L/BN, CR2032N/BN or CR-2032L/BE.
Approximate 6.2 years retention.
Current draw is less than 4.2µA when PSU is disconnected and 0 µA in S0 – S5.
CAUTION: Danger of explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s instructions.
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BIOS
Kontron Technology / Phoenix BIOS (EFI core version)Support for ACPI 4.0 ( Advanced Configuration and Power Interface), Plug &
Play
Suspend (S1 mode)
Suspend To Ram (S3 mode)
Suspend To Disk (S4 mode) “Always On” BIOS power setting RAID Support (RAID modes 0 and 1)
OPERATING SYSTEMS SUPPORT
Windows 7 (32 b* + 64 b ) Windows 8 (32 b* + 64 b ) Linux
*= Out Of The Box installation test only.
ENVIRONMENTAL CONDITIONS
Operating:
0° C – 60° C operating temperature (forced cooling). It is the customer’s responsibility to provide sufficient airflow around each of the components to keep them within allowed temperature range. Please refer to the thermal simulation report for information about airflow.
10 % - 90 % relative humidity (non-condensing)
Storage:
-20° C – 70° C; lower limit of storage temperature is defined by specification restriction of on-board CR2032 battery. Board with battery has been verified for storage temperature down to -40°C by Kontron.
5 % - 95 % relative humidity (non-condensing)
Electro Static Discharge (ESD) / Radiated Emissions (EMI):
All Peripheral interfaces intended for connection to external equipment are ESD/ EMI protected.
EN 61000-4-2:2000 ESD Immunity
EN55022:2006+A1:2007 class B Generic Emission Standard.
Electrical Fast Transients (EFT) (Burst):
EN 61000-4-4 Burst Immunity.
Safety:
IEC 60950-1: 2005, 2
nd
Edition
UL 60950-1
CSA C22.2 No. 60950-1
Product Category: Information Technology Equipment Including Electrical Business Equipment. Product Category CCN: NWGQ2, NWGQ8. File number: E194252
Shock:
IAW IEC 60068-2-27, Test Ea, shock, 18 shocks 3 per axis, 6 directions.
Shock pulse 50g, 11ms halfsine.
Bump:
IAW IEC 60068-2-29, Test Eb, Bump, 3000 bumps, 500 per axis, 6 directions.
Half Sine Waveform Acceleration 2g; Pulse Duration 11ms.
Vibration:
IAW IEC 60068-2-64, Test Fh, Random Vibration. 90 min per axis, 3 axes, at 1.9 grms, with PSD: 10-20 Hz: 0.05 g²/Hz and 20-500 Hz: -3dB/octave.
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 14 - 104
Theoretical MTBF:
365475 hours @ 30º C for the mITX-BDW-U
Restriction of Hazardous Substances (RoHS):
All boards in the mITX-BDW-U family are RoHS compliant.
Capacitor utilization:
No Tantalum capacitors on board
Only Japanese brand Solid capacitors rated for 100 ºC used on board
mITX-BDW-U BLOCK DIAGRAM 05.02.
PROCESSOR SUPPORT TABLE 05.03.
mITX-BDW-U is designed to support the following BGA1168 Mobile processors:
5th generation Intel® Core™ i7 processor
5th generation Intel® Core™ i5 processor
5th generation Intel® Core™ i3 processor
The BGA CPU is premounted from factory. Kontron has defined the board versions as listed in the following table, so far all based on Embedded CPUs. Later other versions are expected.
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 15 - 104
MITX-BDW-U VARIANTS CPU
NAME SALES PN SPEED EMBED. CACHE
mITX-BDW-U i7-5650U 810610-4500
3.2 GHz Yes 4 MByte
mITX-BDW-U i5-5350U 810611-4500
2.9 GHz Yes 3 MByte
mITX-BDW-U i3-5010U 810612-4500
2.1 GHz Yes 3 MByte
Sufficient cooling must be applied to the CPU in order to remove the effect as listed as TDG (Thermal Design Guideline) in above table. The sufficient cooling is also depending on the worst­case maximum ambient operating temperature and the actual worst-case load of processor.
The mITX-BDW-U is delivered with premounted heatsink:
SYSTEM MEMORY SUPPORT 05.04.
The mITX-BDW-U has two DDR3L SO-DIMM sockets. The sockets support the following memory features:
2x DDR3L 1.35 V SO-DIMM 204-pin
Dual-channel with 1 SO-DIMM per channel
From 1 GByte and up to 2x 8 GByte.
Note:
If using 32bit OS then less than 4GB in displayed in System
(Shared Video Memory/PCI resources is subtracted)
Single/dual rank unbuffered 1333/1600MT/s (PC3-10600/PC3-12800)
SPD timings supported
ECC not supported
The installed DDR3L SO-DIMM should support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read and configure the memory controller for optimal performance. If non-SPD memory is used, the BIOS will attempt to configure the memory settings, but performance and reliability may be impacted.
Memory Operating Frequencies
Regardless of the SO-DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR3L 1600 memory is used with a 1333 MHz system bus frequency processor, the memory clock will operate at 167 MHz. The table below lists the resulting operating memory frequencies based on the combination of SO-DIMMs and processor.
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SO-DIMM TYPE MODULE NAME MEMORY DATA
TRANSFERS
[MT/S]
PROCESSOR SYSTEM BUS FREQUENCY
[MHZ]
RESULTING MEMORY CLOCK FREQUENCY
[MHZ]
PEAK TRANSFER RATE
[MB/S]
DDR3L 1333 PC3-10600 1333 1333 / 1600 167 10666
DDR3L 1600 PC3-12800 1600 1333 167 10666
DDR3L 1600 PC3-12800 1600 1600 200 12800
Notes
: Kontron offers the following memory modules:
2 GByte DDR3L 1600 PC3-12800, P/N: 1055-9939 4 GByte DDR3L 1600 PC3-12800, P/N: 1055-9941 8 GByte DDR3L 1600 PC3-12800, P/N: 1055-9942
Memory modules have in general a much lower longevity than embedded motherboards, and therefor EOL of modules can be expected several times during lifetime of the motherboard. Kontron guarantees that the above P/N will be maintained so that EOL module will be replaced by other similar type of qualified module.
As a minimum it is recommend using Kontron memory modules for prototype system(s) in order to prove stability of the system and as for reference.
For volume production you might request to test and qualify other types of RAM. In order to qualify RAM it is recommend configuring 3 systems running RAM Stress Test program in heat chamber at 60° C for a minimum of 24 hours.
mITX-BDW-U GRAPHICS SUBSYSTEM 05.05.
The mITX-BDW-U equipped with Intel ® i3, i5 or i7 processor, supports Intel ® Gen 8 HD Graphics core. All mITX-BDW-U versions support three displays pipes. The DP interface supports the DisplayPort 1.2a specification. The PCH supports High-bandwidth Digital Content Protection for high definition content playback over digital interfaces. The PCH also integrates audio codecs for audio support over DP interfaces.
Up to three displays (DP1, DP2 & LVDS) can be used simultaneously and be used to implement independent or cloned display configuration. PCIe cards can be used to replace on-board graphics or in combination with on-board graphics.
Intel® HD Graphics
Features of the Intel Gen 8 Graphics core built into the i3, i5 and i7 processors, includes:
High quality graphics engine supporting
3 Symmetric Pipe Support
DirectX11.1 and OpenGL 4.x compliant and lower
Full AVC/VC1/MPEG2 HW Decode
Extension of H.264 format
VP8* Decode HW Acceleration
Advanced Scheduler 2.0, 1.0, XPDM support
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OpenGL* 4.0, OpenGL* 4.2 support
DP1 & DP2
16/32bit colours in WQXGA 3840x2160 @ 60 Hz.
Max HDMI resolution 4096x2304 @ 24 Hz
DisplayPort standard 1.2a
LVDS
One or two pixels per clock, up to 1920x1200 - 24b bit colors.
12V for backlight, up to 2.5A
3.3V or 5V for panel power, up to 1.0A
PWM Brightness/Dimming
VESA and JEIDA color coding
3-displays Configurations:
DISPLAY1 DISPLAY2 DISPLAY3
MAX RESOLUTION @60 HZ
DISPLAY1 DISPLAY2 DISPLAY3
LVDS DP DP 1920x1200 3840x2160 3840x2160
LVDS HDMI DP 1920x1200 2560x1600 3840x2160
LVDS HDMI HDMI 1920x1200 2560x1600 2560x1600
By HDMI means using “DP to HDMI passive adapter”.
If using “Active adapter” the HDMI resolution will be increased to match “DP” in above table.
DP Adapters
Use of DP Adapter Converters (3
rd
party accessories) can provide HDMI panel support.
The DP to HDMI supports the HDMI 1.4a specification including audio codec.
DP to HDMI
PN 1045-5781
Cable DP Extender cable 200mm PN1051-7619
For alle the above adapter’s the maximum resolution is: 1920 x 1200. Extension cable available:
POWER CONSUMPTION 05.06.
In order to ensure safe operation of the board, the input power supply must monitor the supply voltage and shut down if the supply is out of range – refer to the actual power supply specification. Please note,
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In order to keep the power consumption to a minimal level, boards do not implement a guaranteed minimum load. In some cases, this can lead to compatibility problems with ATX power supplies, which require a minimum load to stay in regulation. The mITX-BDW-U
board must be powered through either
the ATX+12V-4p (4-pole) connector using standard ATX power supply or by an external 19V power adapter through the Rear I/O power jack.
ATX12V supply: Both ATX+12V-4p connector must be used in according to the ATX12V PSU standard.
Warning: Hot Plugging power supply is not supported. Hot plugging might damage the board.
The requirements to the supply voltages are as follows:
SUPPLY MIN MAX NOTE
+12 V 11.4 V 12.6 V
Should be ±5 % for compliance with the ATX specification
+19 V - 13.2 V - 10.8 V
Should be ±10 % for mITX-BDW-U compatibility
Total System power example
More detailed Static Power Consumption
On the following pages the power consumption of the T4006 Board is measured under:
1- Windows 7 Idle
2- Windows 7 3Dmark 2006
3- Windows 7 Intel® TAT, 100 % on all CPU cores and GFX
4- Windows 7 S3 (Sleep)
5- Windows 7 S5 (Shutdown)
The principal test system and test equipment used
1. Tektronix DPO7254
2. Tektronix TCP202
3. HP 34401A
4. ATX rail switch
Note:
Power consumption of PSU (power loss), Monitor and HDD are not included.
mITX-BDW-U Low Power Setup:
Standard system configuration equipped with Internal graphics, 1x SATA disks, Intel® Core™ i3 CPU, 1x SO-DIMM (2 GByte Module), DP Monitor, Keyboard & Mouse (USB),1x 8 GByte USB2 Stick, 12 V active cooler, >90 W 12 V ATX PSU.
mITX-BDW-U High Power Setup:
Standard system configuration equipped with PCIe M.2 SSD, 2x SATA disks, mPCI Wifi, Intel® Core™ i3 CPU, 2x SO-DIMM (8 GByte Modules), DP Monitor, Keyboard & Mouse (USB), 4x 1-8 GByte USB2 Sticks, 12 V active cooler, 1x Ethernet connected, >120 W 12 V ATX PSU.
mITX-BDW-U Low Power Setup results:
ATX supplies
BDW-U
Gnd
Current Probe
Oscilloscope
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WINDOWS 7 - IDLE
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 636 7.808
+19 V x x
TOTAL
7.808
WINDOWS 7 – 3DMARK2006
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 1688 20.72
+19 V x x
TOTAL
20.72
WINDOWS 7 – INTEL® TAT 100% ALL CPU CORES AND GFX
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 1733 21.26
+19 V x x
TOTAL
21.26
WINDOWS 7 – S3 (SLEEP)
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 74 0.9102
+19 V x x
TOTAL*
0.9102
WINDOWS 7 – S5 (SHUTDOWN)
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 67 0.824
+19 V x x
TOTAL*
0.824
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High Power Setup results:
WINDOWS 7 - IDLE
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 1260 15.48
+19 V x x
TOTAL
15.48
WINDOWS 7 – 3DMARK2006
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 2367 29.01
+19 V x x
TOTAL
29.01
WINDOWS 7 – INTEL TAT 100% ALL CPU CORES AND GFX
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 2175 26.66
+19 V x x
TOTAL
26.66
WINDOWS 7 – S3 (SLEEP)
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 120 1.475
+19 V x x
TOTAL*
WINDOWS 7 – S5 (SHUTDOWN)
SUPPLY CURRENT DRAW / [MA] POWER CONSUMPTION / [W]
+12 V 78.87 0.969
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+19 V x x
TOTAL*
0.969
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CONNECTOR LOCATIONS 06/
mITX-BDW-U - FRONTSIDE 06.01.
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CONNECTOR DEFINITION 07/
The following sections provide pin definitions and detailed description of all on-board connectors.
The connector definitions follow the following notation:
COLUMN NAME DESCRIPTION
Pin Shows the pin-numbers in the connector. The graphical layout of the connector
definition tables is made similar to the physical connectors.
Signal The mnemonic name of the signal at the current pin. The notation “XX#” states that
the signal “XX” is active low.
Type AI: Analogue Input.
AO: Analogue Output.
I: Input, TTL compatible if nothing else stated.
IO: Input / Output. TTL compatible if nothing else stated.
IOT: Bi-directional tristate IO pin.
IS: Schmitt-trigger input, TTL compatible.
IOC: Input / open-collector Output, TTL compatible.
IOD: Input / Output, CMOS level Schmitt-triggered. (Open drain output)
NC: Pin not connected.
O: Output, TTL compatible.
OC: Output, open-collector or open-drain, TTL compatible.
OT: Output with tri-state capability, TTL compatible.
LVDS: Low Voltage Differential Signal.
PWR: Power supply or ground reference pins.
Ioh: Typical current in mA flowing out of an output pin through a grounded load,
while the output voltage is > 2.4 V DC (if nothing else stated).
Iol: Typical current in mA flowing into an output pin from a VCC connected load, while the output voltage is < 0.4 V DC (if nothing else stated).
Pull U/D On-board pull-up or pull-down resistors on input pins or open-collector output
pins.
Note Special remarks concerning the signal.
The abbreviation TBD is used for specifications which are not available yet or which are not sufficiently specified by the component vendors.
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IO-AREA CONNECTORS 08/
DP CONNECTORS DP1 & DP2 (J8 & J9) 08.01.
The DP (DisplayPort) connectors are based on standard DP type Foxconn 3VD51203-H7JJ-7H or similar.
PIN SIGNAL DESCRIPTION TYPE NOTE
1 Lane 0 (p) LVDS
2 GND PWR
3 Lane 0 (n) LVDS
4 Lane 1 (p) LVDS
5 GND PWR
6 Lane 1 (n) LVDS
7 Lane 2 (p) LVDS
8 GND PWR
9 Lane 2 (n) LVDS
10 Lane 3 (p) LVDS
11 GND PWR
12 Lane 3 (n) LVDS
13 Config1 Aux or DDC selection I Internally pull down (1Mohm).
Aux channel on pin 15/17 selected as default (when NC)
DDC channel on pin 15/17, If HDMI adapter used (3.3 V)
14 Config2 (Not used) O Internally connected to GND
15 Aux Ch (p) Aux Channel (+) or DDC Clk AUX (+) channel used by DP
DDC Clk used by HDMI
16 GND PWR
17 Aux Ch (n) Aux Channel (-) or DDC Data AUX (-) channel used by DP
DDC Data used by HDMI
18 Hot Plug I Internally pull down (100 Kohm).
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19 Return PWR Same as GND
20 3.3 V PWR Fused by 1.5 A resetable PTC fuse.
ETHERNET CONNECTORS (J4 & J5) 08.02.
The mITX-BDW-U supports two channels of 10/100/1000 Mbit Ethernet, one (LAN1) is based on Intel® Clarkville i218LM Gigabit PHY and one other controller (LAN2) are based on Intel® Pearsonville i211AT PCI Express controller.
In order to achieve the specified performance of the Ethernet port, Category 5 twisted pair cables must be used with 10/100 MByte and Category 5E, 6 or 6E with 1 Gbit LAN networks.
The signals for the Ethernet ports are as follows:
SIGNAL DESCRIPTION
MDI[0]+ / MDI[0]- In MDI mode, this is the first pair in 1000Base-T,
i.e. the BI_DA+/- pair, and is the transmit pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DB+/- pair, and is the receive pair in 10Base-T and 100Base-TX.
MDI[1]+ / MDI[1]- In MDI mode, this is the second pair in 1000Base-T,
i.e. the BI_DB+/- pair, and is the receive pair in 10Base-T and 100Base-TX.
In MDI crossover mode, this pair acts as the BI_DA+/- pair, and is the transmit pair in 10Base-T and 100Base-TX.
MDI[2]+ / MDI[2]- In MDI mode, this is the third pair in 1000Base-T,
i.e. the BI_DC+/- pair.
In MDI crossover mode, this pair acts as the BI_DD+/- pair.
MDI[3]+ / MDI[3]- In MDI mode, this is the fourth pair in 1000Base-T,
i.e. the BI_DD+/- pair.
In MDI crossover mode, this pair acts as the BI_DC+/- pair.
Note:
MDI = Media Dependent Interface.
The pinout of the RJ45 connectors is as follows:
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USB CONNECTORS (IO AREA) 08.03.
The mITX-BDW-U board contains a EHCI (Enhanced Host Controller Interface) and a XHCI (Extensible Host Controller Interface). The EHCI controller supports six USB 2.0 ports allowing data transfers up to 480 Mb/s.
The XHCI controller supports up to four USB 3.0 ports allowing data transfers up to 5Gb/s. Four of
the USB 3.0 ports are shared with four of the USB 2.0 ports (USB0 – USB3).
Note:
Not all USB 2.0 and USB 3.0 ports are physically connected to the board.
Legacy Keyboard/Mouse and wakeup from sleep states are supported. Over-current detection on all USB ports is supported. The following USB connectors are available in the IO Area.
USB 2.0/3.0 Port 0, 1, 2 & 3 are supplied on the dual USB connectors in the IO Area (J6 & J7).
USB 2.0 Port 4, 5 are supplied on the combined Front Panel connector (J23).
USB 2.0 Port 7 is available in the mPCIe connector (J27).
For USB2.0 cabling it is required to use only HiSpeed USB cable, specified in USB2.0 standard:
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For USB3.0 cabling it is required to use only HiSpeed USB cable, specified in USB3.0 standard:
USB Connector J6 & J7 (USB0, 1, 2 & 3)
The dual USB connectors J6 & J7, Ports 0, 1, 2 and 3 supports USB3.0/USB2.0.
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SIGNAL DESCRIPTION
USBn+ USBn-
RXn+ RXn-
TXn+ TXn-
(n= 0,1,2,3)
Differential pair works as serial differential receive/transmit data lines.
5 V/SB5 V 5 V supply for external devices. SB5 V is supplied
during power-down to allow wakeup on USB device activity. Protected by resettable 2A fuse covering both USB ports.
AUDIO JACK CONNECTORS (J1 & J2) 08.04.
The on-board Audio circuit implements up to 6 Channel High Definition Audio via SPDIF-Out connector, see SPDIF-Out (J14) description.
Interface is based on UAA (Universal Audio Architecture), featuring five 24-bit stereo DACs and three 20­bit stereo ADCs. The Following Audio connector is available in IO Area.
Audio Speakers, Line-in and Microphone are available in a stacked audiojack connector:
SIGNAL TYPE NOTE
TIP
LINE1-IN-L IA 1.0 V
RMS,
30 kΩ
RING
LINE1-IN-R IA 1.0 V
RMS
, 30 kΩ
SLEEVE GND PWR
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SIGNAL TYPE NOTE
TIP OUT-L OA For headphone, max 1.6 V
RMS
RING OUT-R OA For headphone, max 1.6 V
RMS
SLEEVE GND PWR
SIGNAL DESCRIPTION NOTE
LINE1-IN-L Line In signal Left
LINE1-IN-R Line In signal Right
OUT-L Speaker Out Left Shared with J34 pin header connector
OUT-R Speaker Out Right Shared with J34 pin header connector
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INTERNAL CONNECTORS 09/
DC POWER - ATX CONNECTOR (INT12V - J10) 09.01.
The mITX-BDW-U boards are designed to be supplied from either a 12 V ATX-style power supply or an external 19 V power adapter.
ATX+12 V-4p Power Connector (J10):
NOTE TYPE SIGNAL PIN SIGNAL TYPE NOTE
PWR GND 2 4 +12 V PWR 1
PWR GND 1 3 +12 V PWR 1
Warning:
Hot plugging any of the two power connectors (J10 and J3) is not allowed. Hot plugging might
damage the board. In other words, turn off main supply etc. to makesure all the power lines (+12 V or +19 V) are turned off when connecting to the motherboard.
DC POWER - JACK CONNECTOR (EXT19 V – J3) 09.02.
Either the DC Power Jack Connector (Ext19 V) or the “Int12 V.” connector must be used to supply the board with +12 V +/-5 % or +19 V+/-10 %.
The Ext19 V power connector has Vin to the center pin and mates with Ø 5.5 mm DC Power jack with Ø 2.5 mm pin hole. Maximum allowed current is 5A.
Warning:
Hot Plugging power supply is not supported. Hot plugging might damage the board.
FAN CONNECTORS (J34 AND J29) 09.03.
The FAN1SYS (J29) can be used to power, control and monitor a fan for chassis ventilation etc.
The FANCPU (J34) is used for the connection of the FAN for the CPU.
The 4pin header is recommended to be used for driving 4-wire type Fan in order to implement FAN speed control. 3-wire Fan support is also possible, but no fan speed control is integrated.
4-pin Mode:
HEADER PIN SIGNAL DESCRIPTION TYPE
1 PWM PWM output O-3.3
2 TACHO Tacho signal I
3 12 V Power +12 V PWR
4 GND Ground PWR
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3-pin Mode:
HEADER PIN SIGNAL DESCRIPTION TYPE
1 Not used
2 TACHO Tacho signal I
3 12 V Power +12 V PWR
4 GND Ground PWR
SIGNAL DESCRIPTION
PWM PWM output signal for FAN speed control.
TACHO Tacho input signal from the fan, for rotation speed supervision RPM (Rotation Per
Minute). The signal shall be generated by an open collector transistor or similar. Onboard is a pull-up resistor 4K7 to +12 V. The signal has to be pulsed and onboard circuit is prepared for two pulses per rotation.
12 V +12 V supply for fan. A maximum of 2000 mA can be supplied from this pin.
GND Power Supply GND signal
PS/2 KEYBOARD AND MOUSE CONNECTOR (KBDMSE) (J15) 09.04.
Attachment of a PS/2 keyboard/mouse can be done through the pinrow connector KBDMSE (J15).
Both interfaces utilize open-drain signalling with on-board pull-up.
The PS/2 mouse and keyboard is supplied from SB5 V when in standby mode in order to enable keyboard or mouse activity to bring the system out from power saving states. The supply is provided through a 1.1 A resettable fuse.
Note:
The PS/2 connector does not support wake functions.
PIN SIGNAL TYPE IOH/IOL PULL U/D NOTE
1 KBDCLK IOD /14 mA 2K7
2 KBDDAT IOD /14 mA 2K7
3 MSCLK IOD /14 mA 2K7
4 MSDAT IOD /14 mA 2K7
5 5 V/SB5 V PWR - -
6 GND PWR - -
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Signal Description – Keyboard & and mouse Connector (KBDMSE).
SIGNAL DESCRIPTION
MSCLK Bi-directional clock signal used to strobe data/commands from/to the PS/2 mouse.
MSDAT
Bi-directional serial data line used to transfer data from or commands to the PS/2 mouse.
KDBCLK
Bi-directional clock signal used to strobe data/commands from/to the PC-AT keyboard.
KBDDAT
Bi-directional serial data line used to transfer data from or commands to the PC-AT keyboard.
Available cable kit:
PN 1053-2384 Bracket Cable 6-Pin to PS2-Kbd-Mse
SATA (SERIAL ATA) DISK INTERFACE 09.05.
The mITX-BDW-U has an integrated SATA Host controller (PCH in the BDW-U chipset) that supports independent DMA operation on two ports. One device can be installed on each port for a maximum of two SATA devices via two SATA connectors and one M.2 connector. A point-to-point interface (SATA cable) is used for host to device connections. Data transfer rates of up to 6.0/3.0/1.5Gb/s are supported on all SATA ports.
Note:
Before installing OS on a SATA drive make sure the drive is not a former member of a RAID system.
If so some hidden data on the disk has to be erased. To do this, connect two SATA drives and select RAID in BIOS. Save settings and select <Ctrl> <I> while booting to enter the RAID setup menu. Now the hidden RAID data will be erased from the selected SATA drive.
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Supported SATA features:
2 to 4-drive RAID 0 (data striping)
2-drive RAID 1 (data mirroring)
AHCI (Advanced Host Controller Interface)
NCQ (Native Command Queuing). NCQ is for faster data access.
Swap bay support (not supported on M.2)
Intel® Rapid Recover Technology
2 – 256 TByte volume (Data volumes only)
Capacity expansion
TRIM in Windows 7 (in AHCI and RAID mode for drives not part of a RAID volume). (TRIM is for SSD
data garbage handling).
SATA0 & SATA1 connector pinning:
PIN SIGNAL TYPE IOH/IOL NOTE
1 GND PWR -
2 SATA* TX+
3 SATA* TX-
4 GND PWR -
5 SATA* RX-
6 SATA* RX+
7 GND PWR -
SIGNAL DESCRIPTION
SATA* RX+ / RX- Host transmitter differential signal pair
SATA* TX+ / TX- Host receiver differential signal pair
“*” specifies 0 or 1 depending on SATA port.
Available cable kit:
PN 821035 Cable SATA 500 mm
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USB CONNECTORS (INTERNAL) 09.06.
The following USB2.0 ports are available on Internal Pinrows:
USB2.0 Port 4 and 5 are supplied on the internal FRONTPNL connector (J23).
See “Front Panel Header” description.
USB2.0 Port 7 is supplied on the internal mPCIe connectors (J27). See “PCIe Connectors” description.
SPEAKER CONNECTOR (J13) 09.07.
The headphone interface is available through the connector J13 (4 pins). These outputs are shared with the Speaker Audio Jack connector (green).
Up to 100 dB Signal-to-Noise Ratio (SNR).
HEADER PIN SIGNAL TYPE
4 HPOUT-R AO
3 GND PWR
2 HPOUT-L AO
1 GND PWR
SPDIF-OUT (J14) 09.08.
The digital audio interface (electrical SPDIF-Out) is available through the 2 pin connector J14 and can be used to implement 6 (5.1) Channel High Definition Audio.
Circuit is based on high fidelity 6-channel HD audio codec which is compatible with Intel HD Audio specification and supports stereo 24-bit resolution and up to 192 kHz sample rate for DACs/ADCs.
Up to 90 dB Signal-to-Noise Ratio (SNR).
16/20/24-bit S/PDIF TX Outputs supporting 48 K/96 K/44.1 K/88.2 KHz sample rate
HEADER PIN SIGNAL TYPE
2
GND PWR
1
SPDIF_OUT O-3.3
FRONT PANEL CONNECTOR (FRONTPNL) (J23) 09.09.
NOTE
PULL
U/D
IOH/IOL TYPE SIGNAL PIN SIGNAL TYPE
IOH/
IOL
PULL
U/D
NOTE
- - PWR USB8_5 V 1 2 USB9_5 V PWR - -
- - USB8- 3 4 USB9- - -
1
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- - USB8+ 5 6 USB9+ - -
- - PWR GND 7 8 GND PWR - -
- - NC NC 9 10 LINE2-L - -
- - PWR +5 V 11 12 +5 V PWR - -
-
25/25 mA
O
SATA_LED #
13 14 SUS_LED O 7mA -
- - PWR GND 15 16
PWRBTN_I N#
I 1K1
4K7 - I RSTIN# 17 18 GND PWR - -
- - PWR SB3V3 19 20 LINE2-R - -
- - PWR AGND 21 22 AGND PWR - -
- - AI MIC2-L 23 24 MIC2-R AI - -
SIGNAL DESCRIPTION
USB4_5 V & USB5_5 V
5 V supply for external devices. SB5V is supplied during powerdown to allow wakeup on USB device activity. Protected by active power switch 1A fuse for each USB ports.
USB4+/USB4- Universal Serial Bus Port 8 Differentials: Bus Data/Address/Command Bus.
USB5+/USB5- Universal Serial Bus Port 11 Differentials: Bus Data/Address/Command Bus.
+5 V
Maximum load per pin is 1 A (using IDC connector) or 2 A (using crimp terminals).
SATA_LED# SATA Activity LED (active low signal). 3V3 output when passive.
SUS_LED
Suspend Mode LED (active high signal). Output 3.3 V via 470
.
PWRBTN_IN#
Power Button In. Toggle this signal low to start the ATX / BTX PSU and boot the board.
RSTIN#
Reset Input. When pulled low for a minimum 16ms, the reset process will be initiated. The reset process continues even though the Reset Input is kept low.
LINE2 Line2 is second stereo Line signals
MIC2 MIC2 is second stereo microphone input.
SB3V3 Standby 3.3 V voltage
AGND Analogue Ground for Audio
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Available cable kit:
PN 821042 Cable Front Panel Open-End, 300 mm
SERIAL COM1 – COM2 PORTS (J21, J25) 09.10.
Two RS232 serial ports are available on the mITX-BDW-U.
The typical definition of the signals in the COM ports is as follows:
SIGNAL DESCRIPTION
TxD
Transmitted Data, sends data to the communications link. The signal is set to the marking state (-12 V) on hardware reset when the transmitter is empty or when loop mode operation is initiated.
RxD Received Data, receives data from the communications link.
DTR
Data Terminal Ready, indicates to the modem etc. that the on-board UART is ready to establish a communication link.
DSR
Data Set Ready, indicates that the modem etc. is ready to establish a communications link.
RTS
Request To Send, indicates to the modem etc. that the on-board UART is ready to exchange data.
CTS Clear To Send, indicates that the modem or data set is ready to exchange data.
DCD
Data Carrier Detect, indicates that the modem or data set has detected the data carrier.
RI
Ring Indicator, indicates that the modem has received a ringing signal from the telephone line.
The pinout of Serial ports COM1 (J21), COM2 (J25)
NOTE IOH/IOL TYPE SIGNAL PIN SIGNAL TYPE IOH/IOL NOTE
- I DCD
1 2
DSR I -
- I RxD
3 4
RTS O
O TxD
5 6
CTS I -
O DTR
7 8
RI I -
- PWR GND
9 10
5V PWR - 1
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Note 1:
The COM1, COM2 5V supply is fused with common 1.5A resettable fuse.
DB9 adapter cables (PN 821016 200 mm long and 821017 100 mm long) are available for implementing standard COM ports on chassis.
Available cable kit (DB9 adapter cables):
PN 821017 - 100 mm or PN 821016 - 200 mm
LVDS FLAT PANEL CONNECTOR (J33) 09.11.
The LVDS connector is based on 40 pole connector type Don Connex C44-40BSB1-G.
NOTE TYPE SIGNAL PIN SIGNAL TYPE NOTE
Max. 0.5 A PWR +12 V 1 2 +12 V PWR Max. 0.5 A
Max. 0.5 A PWR +12 V 3 4 +12 V PWR Max. 0.5 A
Max. 0.5 A PWR +12 V 5 6 GND PWR Max. 0.5 A
Max. 0.5 A PWR +5 V 7 8 GND PWR Max. 0.5 A
Max. 0.5 A PWR LCDVCC 9 10 LCDVCC PWR Max. 0.5 A
2K2Ω, 3.3 V OT DDC CLK 11 12 DDC DATA OT 2K2Ω, 3.3 V
3.3 V level OT BKLTCTL 13 14 VDD ENABLE OT 3.3 V level
3.3 V level OT BKLTEN# 15 16 GND PWR Max. 0.5 A
LVDS LVDS A0- 17 18 LVDS A0+ LVDS
LVDS LVDS A1- 19 20 LVDS A1+ LVDS
LVDS LVDS A2- 21 22 LVDS A2+ LVDS
LVDS LVDS ACLK- 23 24 LVDS ACLK+ LVDS
LVDS LVDS A3- 25 26 LVDS A3+ LVDS
Max. 0.5 A PWR GND 27 28 GND PWR Max. 0.5 A
LVDS LVDS B0- 29 30 LVDS B0+ LVDS
LVDS LVDS B1- 31 32 LVDS B1+ LVDS
LVDS LVDS B2- 33 34 LVDS B2+ LVDS
LVDS LVDS BCLK- 35 36 LVDS BCLK+ LVDS
LVDS LVDS B3- 37 38 LVDS B3+ LVDS
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Max. 0.5 A PWR GND 39 40 GND PWR Max. 0.5 A
Note:
The mITX-BDW-U on-board LVDS connector supports single and dual channel, 18/24 bit SPWG
panels up to a resolution of 1600x1200 or 1920x1080 and with limited frame rate up to 1920x1200.
Signal Description – LVDS Flat Panel Connector:
SIGNAL DESCRIPTION
LVDS A0..A3 LVDS A Channel data
LVDS ACLK LVDS A Channel clock
LVDS B0..B3 LVDS B Channel data
LVDS BCLK LVDS B Channel clock
BKLTCTL
Backlight control (1), PWM signal to implement voltage in the range 0-3.3 V
BKLTEN# Backlight Enable signal (active low) (2)
VDD ENABLE Output Display Enable.
LCDVCC
VCC supply to the display. 5 V or 3.3 V (1 A Max.) selected in BIOS setup menu. Power sequencing depends on LVDS panel selection. (Shared with eDP connector)
DDC CLK DDC Channel Clock
Notes:
Windows API will be available to operate the BKLTCTL signal. Some Inverters have a limited
voltage range 0- 2.5V for this signal: If voltage is > 2.5V the Inverter might latch up. Some Inverters generates noise on the BKLTCTL signal, causing the LVDS transmission to fail (corrupted picture on the display). By adding a 1Kohm resistor in series with this signal, mounted at the Inverter end of the cable kit, the noise is limited and the picture is stable. If the Backlight Enable is required to be active high then, check the following BIOS Chipset setting: Backlight Signal Inversion = Enabled.
FEATURE CONNECTOR (J28) 09.12.
NOTE PULL
U/D
IOH/
IOL
TYPE SIGNAL PIN SIGNAL
TYP E
IOH/
IOL
PULL U/D
NOT E
2 2M/ - I
CASE_
OPEN#
1 2
SMBC /4 mA 10K/ 1
-
25/25 mA
O S5#
3 4
SMBD /4 mA 10K/ 1
-
25/25 mA
O PWR_OK
5 6
EXT_BAT PWR - -
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- I
TOUCH_ RST#
7 8 TOUCH_
INTR#
O - -
- - PWR SB3V3 9 10 SB5V PWR - -
- IOT GPIO0 11 12 GPIO1 IOT -
- IOT GPIO2 13 14 GPIO3 IOT -
- IOT GPIO4 15 16 GPIO5 IOT -
- IOT GPIO6 17 18 GPIO7 IOT -
- - PWR GND 19 20 GND PWR - -
- I GPIO8 21 22 GPIO9 I -
- I GPIO10 23 24 GPIO11 I -
- I GPIO12 25 26 GPIO13 IOT -
- IOT GPIO14 27 28 GPIO15 IOT -
- IOT GPIO16 29 30 GPIO17 IOT -
- - PWR GND 31 32 GND PWR - -
-
8/8 mA
O EGCLK
33 34
EGCS# O
8/8 mA
-
-
8/8 mA
EGAD
35 36
TMA0 O
- PWR +12 V 37 38 GND PWR - -
4 -1K/ - I
TOUCH_I2C _CLK
39 40 TOUCH_I2C
_DAT
I/O - 1K/ 4
- - PWR GND 41 42 GND PWR - -
- - PWR GND
43 44
S3# O
25/25 mA
-
Notes: 1
. Pull-up to +3V3Dual (+3V3 or SB3V3). 2. Pull-up to on-board Battery. 3. Pull-up to +3V3. 4. Pull-
up to SB3V3.
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SIGNAL DESCRIPTION
CASE_OPEN#
CASE OPEN, used to detect if the system case has been opened. This signal’s status is readable, so it may be used like a GPI when the Intruder switch is not required.
SMBC SMBus Clock signal
SMBD SMBus Data signal
S3# S3 sleep mode, active low output, optionally used to deactivate external system.
S5# S5 sleep mode, active low output, optionally used to deactivate external system.
PWR_OK
PoWeR OK, signal is high if no power failures are detected. (This is not the same as the P_OK signal generated by ATX PSU).
EXT_BAT
(EXTernal BATtery) option for connecting + terminal of an external primary cell battery (2.5 - 3.47 V) (– terminal connected to GND). The external battery is protected against charging and can be used with/without the on-board battery installed.
SB3V3 Max. load is 0.75 A (1.5 A < 1 sec.)
SB5 V StandBy +5 V supply.
TOUCH_I2C_DAT Serial I/O – I2 C interface data Line
TOUCH_I2C_CLK Serial I/O – I2 C interface clock Line
TOUCH_RST# Serial I/O –interface reset
TOUCH_INTR# Serial I/O –interrupt line
SIGNAL DESCRIPTION
GPIO0..17
General Purpose Inputs / Output. These Signals may be controlled or monitored through the use of the KT-API-V2 (Application Programming Interface).
EGCLK Extend GPIO Clock signal
EGAD Extend GPIO Address Data signal
EGCS# Extend GPIO Chip Select signal, active low
TMA0 Timer Output
+12 V Max. load is 0.75 A (1.5 A < 1 sec.)
The GPIO’s are controlled via the ITE IT8528E Embedded Controller. Each GPIO has 100pF to ground, clamping Diode to 3V3 and has multiplexed functionality. Some pins can be DAC (Digital to Analogue Converter output), PWM (Pulse Width Modulated signal output), ADC (Analogue to Digital Converter input), TMRI (Timer Counter Input), WUI (Wake Up Input), RI (Ring Indicator Input) or some special function.
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SIGNAL IT8516F PIN NAME TYPE DESCRIPTION
GPIO0 DAC0/GPJ0 AO/IOS
GPIO1 DAC1/GPJ1 AO/IOS
GPIO2 DAC2/GPJ2 AO/IOS
GPIO3 DAC3/GPJ3 AO/IOS
GPIO4 PWM2/GPA2 O8/IOS
GPIO5 PWM3/GPA3 O8/IOS
GPIO6 PWM4/GPA4 O8/IOS
GPIO7 PWM5/GPA5 O8/IOS
GPIO8 ADC0/GPI0 AI/IS
GPIO9 ADC1/GPI1 AI/IS
GPIO10 ADC2/GPI2 AI/IS
GPIO11 ADC3/GPI3 AI/IS
GPIO12 ADC4/WUI28/GPI4 AI/IS/IS
GPIO13 RI1#/WUI0/GPD0 IS/IS/IOS
GPIO14 RI2#/WUI1/GPD1 IS/IS/IOS
GPIO15 TMRI0/WUI2/GPC4 IS/IS/IOS
GPIO16 TMRI1/WUI3/GPC6 IS/IS/IOS
GPIO17 L80HLAT/BAO/WUI24/GPE0 O4/O4/IS/IOS
Available cable kit and Break-Out-Board:
PN 1052-5885 Cable, Feature 44pol 1 to1, 300 mm
PN 820978 Feature BOB (Break-Out-Board)
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“LOAD DEFAULT BIOS SETTINGS” JUMPER (JP1) 09.13.
The “Load Default BIOS Settings” Jumper (JP1) can be used to recover from incorrect BIOS settings. As an example, an incorrect BIOS setting which causes the attached display not to turn on can be erased by this Jumper.
The Jumper has 6 positions: Pin 5-6 are used for this function.
ALWAYS ON JUMPER SETTING (JP1) 09.14.
When jumper is installed in the (JP1) Pin 1-2 “Always On” position, then the Board will automatically power up, when the external power supply is switched ON.
When jumper is in not mounted, then Always On feature is disabled and it might be necessary to activate the power on buttom (PWRBTN_IN#) at the Front Panel connector (FRONTPNL) in order to switch on the board.
SPI CONNECTOR (J30) 09.15.
The SPI Connector is normally not used. If however a SPI BIOS is connected via the SPI Connector then the board will attempt to boot from it.
NOTE
PULL U/D
IOH/IOL TYPE SIGNAL PIN SIGNAL TYPE IOH/IOL
PULL U/D
NOTE
1 - CLK 1 2 SB3V3 PWR - -
- I CS0# 3 4 ADDIN IO /10K
10K/ - NC 5 6 NC - - -
10K/ IO MOSI 7 8 ISOLATE# IO 100K
- IO MISO 9 10 GND PWR - -
1K IO
SPI_IO2 _#
WP
11 12
SPI_IO3_
#HOLD
IO 1K
SIGNAL DESCRIPTION
CLK Serial Clock
SB3V3
3.3 V Standby Voltage power line. Normally output power, but when Motherboard is turned off then the on-board SPI Flash can be 3.3 V power sourced via this pin.
CS0# CS0# Chip Select 0, active low.
ADDIN ADDIN input signal must be NC.
MOSI Master Output, Slave Input.
ISOLATE#
The ISOLATE# input, active low, is normally NC, but must be connected to GND when programming the SPI flash. Power Supply to the Motherboard must be turned off when loading SPI flash. The pull up resistor is connected via diode to 5VSB.
MISO Master Input, Slave Output
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SPI_IO2_#
WP
SPI Data I/O: A bidirectional signal used to support Dual IO Fast Read, Quad IO Fast Read and Quad Output Fast Read modes. The signal is not used in Dual Output Fast Read mode.
SPI_IO3_#HOLD
SPI Data I/O: A bidirectional signal used to support Dual IO Fast Read, Quad IO Fast Read and Quad Output Fast Read modes. The signal is not used in Dual Output Fast Read mode.
LPC CONNECTOR (J31) 09.16.
The LPC connector is in general unsupported. Only under special circumstances may the LPC interface be of interest.
NOTE
PULL U/D
IOH/IOL TYPE SIGNAL PIN SIGNAL TYPE IOH/IOL
PULL U/D
NOTE
- - PWR LPC CLK 1 2 GND
- - PWR
LPC FRAME #
3 4
KEY
LPC RST#
5 6
+5 V
LPC AD3 7 8 LPC AD2
+3V3 9 10 LPC AD1
LPC AD0 11 12 GND
SMB_CLK 13 14 SMB_DAT
A
SB3V3
15 16 LPC
SERIRQ
GND 17 18 CLKRUN#
SUS_ST AT#
19 20 TPM_DRQ
#0
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SLOT CONNECTORS (MINIPCIE) 10/
MiniPCIe with mSATA/USB2.0 & SIM-card support (J27)
Slot J27 supports mPCIe, USB2.0 and SIM-card socket (J35). The SIM-card socket makes it possible to use a 2G/3G-wireless modem in this mPCIe slot. The USB does support WAKE function.
NOTE TYPE SIGNAL PIN SIGNAL TYPE NOTE
WAKE# 1 2 +3V3 PWR
NC NC 3 4 GND PWR
NC NC 5 6 +1.5V PWR
1 CLKREQ# 7 8 UIM_PWR PWR
PWR GND 9 10 UIM_DATA NC
PCIE_mini CLK# 11 12 UIM_CLK NC
PCIE_mini CLK 13 14 UIM_RESET NC
PWR GND 15 16 UIM_VPP NC
NC UIM_IC_DM 17 18 GND PWR
NC UIM_IC_DP 19 20 W_Disable# 2
PWR GND 21 22 RST#
SATA5_RXP 23 24 +3V3 PWR
SATA5_RXN 25 26 GND PWR
PWR GND 27 28 +1.5 V PWR
PWR GND 29 30 SMB_CLK
SATA5_TXN 31 32 SMB_DATA
SATA5_TXP 33 34 GND PWR
PWR GND 35 36 USB12N IO
PWR GND 37 38 USB12P IO
PWR +3V3 39 40 GND PWR
PWR +3V3 41 42 NC NC
SATA_DET5# 43 44 NC NC
NC NC 45 46 NC NC
NC NC 47 48 +1.5 V PWR
NC NC 49 50 GND PWR
NC NC 51 52 +3V3 PWR
Note 1:
10K ohm pull-up to 3V3.
Note 2:
2K2 ohm pull-up to 3V3 Dual.
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ON-BOARD -& MATING CONNECTOR TYPES 11/
The Mating connectors / Cables are connectors or cable kits which are fitting the On-board connector. The Kontron cable kits marked with “*” are included in the “mITX-BDW-U Cable & Driver Kit” PN 826603.
CONNECTOR
ON-BOARD CONNECTORS MATING CONNECTORS / CABLES
MANUFACT TYPE NO. MANUFACT. TYPE NO.
FANCPU (J29)
FANSYS (J28)
ccTALK (J25)
Foxconn HF2704E-M1 AMP 1375820-4 (4-pole)
Foxconn HF2704F-M2 AMP 1375820-3 (3-pole)
AMP 1470947-1
KBDMSE (J26)
Molex
22-23-2061
Molex
22-01-2065
Tyco AMP 3-647050-6 Kontron 1046-3381 (kit) *
Jaws 254K-WS-06T-S Kontron 1053-2384 (kit)
LPC (J30)
Wieson G2100C888-034H
Foxconn HC11101-P0
SATA0,1 (J3,J2)
Lotes
ABA-SAT-010-K08
Molex
67489-8005
Kontron 821035 (kit)
SATA,2,3 (J1,J4)
Lotes
ABA-SAT-010-K07
Molex
67489-8005
Molex
47155-4001 Kontron 821035 (kit) *
ATX+12V-24p (J20)
Molex
44206-0002 Molex 5557-24R
ATX+12V-4p (J21)
Lotes
ABA-POW-003-K02 Molex 39-01-2045
Speaker (J34)
Molex
53047-0410
LVDS (J31)
Don Connex
C44-40BSB1-G
Don Connex
A32-40-C-G-B-1
Samtec SHF-120-01-FDSMKTR Kontron 910000005
Hon Kon HB12-220-VFS-20R Kontron 821515 (kit) *
Wieson G2124-03200101-00 Kontron 821155 (kit)
COM1,2 (J19,J18)
Pinrex 510-90-10GB00 Molex 90635-1103
Cen Link ZP91-014B1-10Y1 Kontron 821016 (kit)
Foxconn HL2205F Kontron 821017 (kit) *
USB8/9 (*) (FRONTPNL) - Kontron 821401 (kit)
SPI (J32) Pinrex 210-92-06GB01
SPDIF-out (J33)
Molex
53047-0210
FRONTPNL (J12) Pinrex 510-80-24GB05 Molex 90635-1243
Foxconn HL2112V-P9 Kontron 821042 (kit) *
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FEATURE (J27)
Pinrex 52A-90-44GB00
Don Connex
A05c-44-B-G-A-1-G
Molex
87831-4420 Kontron 1052-5885 (kit) *
* USB4/USB5 are located in FRONTPNL connector.
Note
: More than one connector can be listed for each type of on-board connectors even though several
types with same fit, form and function are approved and could be used as alternative. Please also notice that standard connectors like DP, miniPCIe, Audio Jack, Ethernet and USB are not included in the list.
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BIOS 12/
The BIOS Setup is used to view and configure BIOS settings for the board. The BIOS Setup is accessed by pressing the <F2>-key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins.
The BIOS settings will be loaded automatically when loading “Load Setup Defaults” see “Exit” menu. In this Users Guide, the default settings are indicated by bold. Please notice that “Load Optimized Defaults” might have different set of default values.
F9 and F10 keys only works if pressed form a keyboard (not working from a console terminal, use “Exit” menu instead).
MAIN 12.01.
Sub Menu available.
White text for actual selected function which can be modified.
Blue text for functions (not all can be modified).
Black background for actual selection. Black text actual settings.
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 48 - 104
FEATURE OPTIONS DESCRIPTION
System Date MM/DD/YYYY Set the system date.
System Time HH:MM:SS Set the system time.
The following table describes the changeable settings:
System Information
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 49 - 104
Boot Features
FUNCTION SELECTION DESCRIPTION
NumLock:
On
Off
Select Power-on state for NumLock.
Timeout
2
Note 1
Number of seconds that P.O.S.T will wait for the user input before booting.
CSM Support
No
Yes
Compatibility Support Module that provides backward compatibility services for legacy BIOS services, like int10/int13, dependent OS.
Quick Boot
Disabled
Enabled
Enable/Disable quick boot
Dark Boot
Disabled
Enabled
Enable/Disable dark boot
Diagnostic Splash Screen
Disabled
Enabled
If you select ‘Enabled’ the diagnostic splash screen always displays during boot. If you select ‘Disabled’ the diagnostic splash screen does not display unless you press HOTKEY during boot.
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Diagnostic Summary Screen
Disabled
Enabled
Display the diagnostic summary screen during boot.
BIOS Level USB
Disabled
Enabled
Enable/Disable all BIOS support for USB in order to reduce boot time.
Note that this will prevent using a USB keyboard in setup or a USB biometric scanner such as a finger print reader to control access to setup, but does not prevent the operating system for supporting such hardware.
USB Legacy
Disabled
Enabled
Enable/Disable USB BIOS SMM support for mouse, keyboard, mass storage, etc. in legacy operating systems such as DOS.
Console Redirection
Disabled
Enabled
Enable/Disable Universal Console Redirection.
Allow Hotkey in S4 resume
Disabled
Enabled
Enable hotkey detection when system resuming from Hibernate state.
UEFI Boot
Disabled
Enabled
Enable the UEFI boot.
Legacy Boot
Disabled
Enabled
Enable the Legacy boot.
Boot in Legacy Video Mode
Disabled
Enabled
Enable to force the display adapter to switch the video mode to Text Mode 3 at the end of BIOS POST for non-UEFI boot mode (Legacy Boot). Some legacy software, such as DUET, requires that the BIOS explicitly enter text video mode prior to boot.
Load OPROM
All
On Demand
Load all OPROMs or on demand according to the boot device.
Boot Priority
UEFI First
Legacy First
Select priority of boot option between UEFI and Legacy.
Note 1
: Use either digit keys to enter value (0 – 99) or +/- keys to increase/decrease value.
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Network Stack
FUNCTION SELECTION DESCRIPTION
Network Stack
(Note 1)
Disabled
Enabled
Enable/Disable UEFI Network Stack
IPv4
(Note 2)
Disabled
Enabled
Enable/Disable IPv4
IPv6
(Note 2)
Disabled
Enabled
Enable/Disable IPv6
UEFI PXE Boot Priority
(Note 2)
IPv6 First
IPv4 First
Set the priority of UEFI PXE Boot
Note 1
: To use legacy PXE boot support, disable this option.
Note 2
: Only visible if Network Stack is enabled.
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Error Manager
FUNCTION SELECTION DESCRIPTION
View Error Manager Log Enter Display Error Manager Log information.
Clear Error Manager Log Enter Clear Error Manager Log.
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ADVANCED 12.02.
The Advanced (top) menu contains only submenu selections which will be described in more details on the following pages.
In order to make a selection of a submenu activated the ↑↓ keys until the requested submenu becomes white color, then activate the <Enter>.
FUNCTION SELECTION DESCRIPTION
Select Language
English
Francais
Etc.
Select Language.
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Silicon Information
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 55 - 104
ACPI Configuration
FUNCTION SELECTION DESCRIPTION
FACP – KTC S4 Flag Value
Disabled
Enabled
Valid Only for ACPI. Controls the value for the RTC S4 flag in the FACP table.
APIC – IO APIC Mode
Disabled
Enabled
This is valid only for WIN2000, Windows XP. A fresh install of OS must occur when APIC mode is enabled. The APIC table will be pointed to by the RSDT, the Local APIC will be initialized, and the proper enable bits are set in the PCH.
ALS Support
Legacy
ACPI
Valid only for ACPI. Legacy = ALS support through the IGD INT10 function. ACPI = ALS support through an ACPI ALS driver.
EMA Support
Disabled
Enabled
Valid only for ACPI. Controls the EMA device in an ACPI environment.
MEF Support
Disabled
Enabled
Valid only for ACPI. Controls the Mobile East Fork feature support in an ACPI environment.
Enabled PTID
Disabled
Enabled
Enable/Disable Power and Temperature Instrumentation Details.
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FACP – PM Timer Flag Value
Disabled
Enabled
Valid only for ACPI. Controls the PM Timer Flag Value in the FACP table.
FACP – Low Power S0 Idle Capable Flag Value
Disabled
Enabled
Valid only for ACPI. Controls the Low Power S0 Idle Capable Flag (Bit 21) in the FACP table.
CPPC
Disabled
Enabled
ACPI 5.0 Collaborative Processor Performance Control. When CPPC is enabled, the newer ACPI 5.0 method for processor performance control will be used. When disabled, the older methods (P-State and T-State) will be used.
CPPC Platform Sci enable
Disabled
Enabled
When enabled, the platform will generate a GPE/SCI upon CPPC command completion. If disabled, the OS must poll for command completion.
Native PCI Express
Disabled
Enabled
Native PCI Express Enable/Disable
Runtime D3 Support
Disabled
Enabled
Enable/Disable ACPI runtime D3 support.
Note: to support RTD3, there must be hardware related design to control devices powered by software. A custom BIOS configuration may be needed.
Processor Configuration
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FUNCTION SELECTION DESCRIPTION
Active Processor Cores
All
1
2
3
Number of cores to enable in each processor package.
Note: number of cores vary according to the CPU SKU
present.
Intel ® HT Technology
Disabled
Enabled
When Disabled only one thread per enabled core is enabled.
CPU Flex Ratio Override
Disabled
Enabled
Enable/Disable CPU Flex Ratio Programming
Enable XD
Disabled
Enabled
Enabled Execute Disabled functionality. Also known as Data Execution Prevention (DEP).
Limit Cpuid Maximum value
Disabled
Enabled
When set to enable, this causes the cupid to return maximum value of 3.
Enable for BIST
Disabled
Enabled
Enable/Disable BIST (Built-In Self Test) on reset.
Machine Check
Disabled
Enabled
Enable processor Machine Check feature (disable only for test).
Intel ® Virtualization Technology
Disabled
Enabled
When enabled. A VMM can utilize the additional hardware capabilities.
Intel ® Streamer Prefetcher
Disabled
Enabled
Enable or disable MLC Streamer Prefetcher.
Intel ® Spatial Prefetcher
Disabled
Enabled
Enable or disable MLC Spatial Prefetcher
MP MWAIT/Cx State Support
Disabled
Enabled
BIOS Guard
Disabled
Enabled
Enable/Disable BIOS Guard feature.
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Processor Power Management
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FUNCTION SELECTION DESCRIPTION
Intel ® SpeedStep ™
Disabled
Enabled
Enable processor performance states (P-States).
Boot Performance Mode
Max Performance
Max Battery
Auto
Select the performance state that the BIOS sets before OS handoff.
Turbo Mode
Disabled
Enabled
Enable processor Turbo Mode. EMTTM must also be enabled.
Turbo Mode Power Limit Lock
Disabled
Enabled
Enable/Disable Locking of turbo settings. When Enabled, TURBO_POWER_LIMIT MSR will be locked and a reset will be required to unlock the register.
Long Power Limit 0, 1,2,…200
Turbo Mode Long Duration Power Limit (aka Power Limit 1) in Watts. The value may vary from 0 to Fused Value. If the value is 0, the fused value will be programmed. A value greater than fused TDP value will not be programmed.
Continue
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FUNCTION SELECTION DESCRIPTION
Long Power Limit Time 0,1… 28,…55,56
Long Duration Time Window (aka Power Limit 1 Time) value in seconds. The value may vary from 0 to 56. Indicates the time window over which TDP value should be maintained. If the value is 0, the fused value will be programmed.
Short Power Limit 0, 1, … 32767
Turbo Mode Long Duration Power Limit (aka Power Limit 2) in Watts. The value may vary from 0 to Fused Value. If the value is 0, the fused value will be programmed. A value greater than fused TDP value will not be programmed.
Short Duration Turbo mode
Disabled
Enabled
Enable Short Duration Turbo mode for processor.
Power Limit 3 0,1,… , 199,200
Power Limit 3 in Watts. The value may vary from 0 to Fused Value. If the value is 0, the fused value wil be programmed. A value greater than fused TPD value will not able programmed.
Power Limit 3 Time 0,1,…55,56
Power Limit 3 value in seconds. The value may vary from 3 to 64. Indicates the time window over which Power Limit 3 value should be maintained. If the value is 0, the fused value will be programmed.
Power Limit 3 Duty Cycle 0,1,… , 99,100
Duty Cycle in percentage that the CPU is required to maintain the Power Limit 3 time.
Energy Efficient Enable
Disabled
Enabled
Enable Energy Efficient for processor.
Configure TDP Boot Mode
Nominal
Down
Up
Disabled
Configure TDP Mode as [Nominal] [Up] [Down] [Disabled] TDP selection. Disabled options will skip all cTDP boot configurations but dynamic cTDP can still work.
Lock TDP Setting
Disabled
Enabled
Lock TDP in MSR_CONFIG_TDP_CONTROL
CTPD BIOS control
Disabled
Enabled
Enables CTPD control via runtime ACPI BIOS methods. This
“Bios only” feature does not
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 61 - 104
require EC or driver support.
TDP Custom Setting
Disabled
Enabled
Use TDP Custom Setting.
C-States
Disabled
Enabled
Enable processor idle power saving states (C-States).
Extend C-States
Disabled
Enabled
Enable C-State transitions to occur in combination with P­States.
C3-State
Disabled
Enabled
Enable processor idle power saving C3 state.
C6-State
Disabled
Enabled
Enable processor idle power saving C6 state.
C6 Latency
Short
Long
Configure Short/Long Latency.
C7-State
Disabled
C7
C7s
Enable processor idle power saving C7 state.
C7 Latency
Short
Long
Configure Short/Long Latency.
C8-State
Disabled
Enabled
Enable processor idle power saving C8 state.
C9-State
Disabled
Enabled
Enable processor idle power saving C9 state.
C10-State
Disabled
Enabled
Enable processor idle power saving C10 state.
C-State Auto Demotion
Disabled
C1
C3
C1 and C3
Configure C-State Auto Demotion.
C-State UnDemotion
Disabled
C1
C3
C1 and C3
Configure C-State Auto UnDemotion.
Package C State Demotion
Disabled
Enabled
Enable/Disable Package C State Demotion.
Package C State UnDemotion
Disabled
Enabled
Enable/Disable Package C State UnDemotion.
C State Pre-Wake
Disabled
Enabled
Enable/Disable C State Pre­Wake.
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Lake Tiny
Disabled
Enabled
Lake Tiny Settings.
HDD Configuration
“Software Feature Mask Configuration” see next page.
FUNCTION SELECTION DESCRIPTION
SATA Device
Disabled
Enabled
Enable/Disable SATA Device.
Interface Combination
IDE
AHCI
RAID
Select the SATA controllers operation mode.
Serial ATA Port x
(x = 0 – 3)
(Device if installed)
Port Enable
Disabled
Enabled
Enable/Disable this port.
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Hot Plug
Disabled
Enabled
Designates the port as Hot Pluggable. Note: Requires hardware support.
External Port
Disabled
Enabled
Configure system to treat the port as internal or external.
SATA Device Type
Hard Disk Drive
Solid State Drive
Select ´Solid State Drive´ only if a Solid State Drive is connected to this SATA port.
DevSlp
Disabled
Enabled
RTD3 Device Sleep Support
DITO Configuration
Disabled
Enabled
Enable/Disable Device Sleep Idle Timeout Configuration.
DITO Value 625
DITO Multiplier Value 15
Software Feature Mask Configuration
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FUNCTION SELECTION DESCRIPTION
HDD Unlock
Disabled
Enabled
If enabled, indicates that the HDD password unlock in the OS is enabled.
LED Locate
Disabled
Enabled
If enabled, indicates that the LED/SGPIO hardware is attached and ping to locate feature is enabled on the OS.
Memory Configuartion
FUNCTION SELECTION DESCRIPTION
Memory Frequency Limiter
Auto
1067
1333
1600
1867
2133
2400
2667
Maximum Memory Frequency Selections in Mhz.
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Max TOLUD
Dynamic
1 GByte
1.25 GByte
1.5 GByte
1.75GByte
2 GByte
2.25 GByte
2.5 GByte
2.75 GByte
3 GByte
3.25 GByte
Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on largest MMIO length of installed graphic controller.
NMode Support
Auto
1N Mode
2N Mode
Enable/Disable system to support N Mode.
Channel A DIMM Control
Disabled
Enabled
Channel A DIMM control support.
Enable or disable DIMMs on Channel A.
Channel B DIMM Control
Disabled
Enabled
Channel B DIMM control support.
Enable or disable DIMMs on Channel B.
Memory Remap
Disabled
Enabled
Enable/Disable Memory Remap above 4GB.
MRC FastBoot
Disabled
Enabled
Enable/Disable MRC FastBoot. Generally, this option only takes effect when doing cold boots/resets.
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System Agent (SA) Configuaration
FUNCTION SELECTION DESCRIPTION
Cpu Audio Device (D0:D3:F0)
Disabled
Enabled
Enable/Disable Cpu Audio Device.
CHAP Device (D0:D7:F0)
Disabled
Enabled
Enable/Disable SA CHAP Device.
Thermal Device (D0:D4:F0)
Disabled
Enabled
Enable/Disable SA Thermal Device.
CRID support
Disabled
Enabled
Enable Compatible Revision ID.
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DMI Settings
FUNCTION SELECTION DESCRIPTION
DMI Vc1 Control
Disabled
Enabled
Enable/Disable DMI Virtual channel 1 control.
DMI Vcp Control
Disabled
Enabled
Enable/Disable DMI Virtual channel P control.
DMI Vcm Control
Disabled
Enabled
Enable/Disable DMI Virtual channel M control.
DMI Link ASPM Control
Disabled
L0S
L1
L0S And L1
Auto
Enable/Disable the control of Active State Power Management on SA side of the DMI Link.
DMI Extended Sync
Disabled
Enabled
Enable/Disable DMI Extend Sync control.
DMI Gen2 Support Control
Disabled
Enabled
Enable/Disable DMI Gen2 Support Control.
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Auto
DMI De-emphasis Control
-6 dB
-3.5 dB
DeEmphasis Control for DMI.
DMI IOT Control
Disabled
Enabled
IOT Control for DMI.
Intel® VT for Directed I/O (VT-d)
FUNCTION SELECTION DESCRIPTION
Intel® VT for Directed I/O (VT-d)
Disabled
Enabled
Enable/Disable Intel® VT for Directed I/O (VT-d) by reporting the I/O device assignment to VMM through DMAR ACPI Tables.
X2APIC Opt Out
Disabled
Enabled
Enable/Disable X2APIC_OPT_OUT bit.
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Graphics Configuration
FUNCTION SELECTION DESCRIPTION
Graphics Turbo IMON Current 14, 15,… 30, 31
Graphics Turbo IMON Current value supported (14 – 31).
Primary Display Selection
IGD
PEG
PCI
Auto
Select the primary display device.
Internal Graphics
Disabled
Enabled
Auto
Enable/Disable the Internal Graphics Device. This has no effect if external graphics are present.
GTT Size
1 MByte
2 MByte
Gtt Memory Size of IGD.
Aperture Size
128 MByte
256 MByte
512 MByte
Graphics Aperture Size.
DVMT Pre-Allocated 32 MByte
Select Pre-Allocated Graphics
Memory size used by the
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64 MByte
128 MByte
Internal Graphics Device. This has no effect if external graphics are present.
DVMT Total Gfx Mem
128 MByte
256 MByte
MAX
DVMT5.0 DVMT Graphic Memory Size. This has no effect if external graphics are present.
Gfx Low Power Mode
Disabled
Enabled
Enable/Disable Gfx Low Power Mode.
IGD Configuration
FUNCTION SELECTION DESCRIPTION
IGD – Boot Type
VBIOS Default
CRT
EFP
LFP
EFP3
EFP2
LFP2
Select the Video Device activated during POST. This has no effect if external graphics are present.
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IGD – LCD Panel Type
VBIOS Default
640 x 480 LVDS Color Panel
800 x 600 LVDS Color Panel
1024 x 768 LVDS Color Panel
1280 x 1024 LVDS Color Panel
1400 x 1050 LVDS Color Panel Reduced Blanking
1400 x 1050 LVDS Color Panel, non-Reduced Blanking
1600 x 1200 LVDS Color Panel
1200 x 768 LVDS Color Panel
1600 x 1050 LVDS Color Panel
1920 x 1200 LVDS Color Panel
Reserved 11#
Reserved 12#
Reserved 13#
Reserved 14# - 1280x800 LVDS Color Panel
Reserved 15# - 1280x600 LVDS Color Panel
Reserved 16#
Select the video Device which will be activated during POST. This has no effect if external graphics present.
IGD – Panel Scaling
Auto
Force Scaling
off
Select the LCD Panel Scaling option used by the Internal Graphics Device.
Backlight Control
PWM-Inverted
PWM-Normal
Back Light Control Setting
BIA
Auto
Disabled
Level 1
Level 2
Level 3
Level 4
Level 5
Auto: GMCH Use VBT Default;
Level n: Enabled with Selected Aggressiveness Level.
Spread Spectrum clock Chip
Off
Hardware
Software
Hardware: Spread is controlled by chip.
Software: Spread is controlled by BIOS.
IGD – Active LFP
No LVDS
eDP Port-A
eDP Port-D
Select the Active LFP Configuration.
Panel Color Depth
18 Bit
24 Bit
Select the LFP Panel Color Depth.
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PEG Port Configuration
FUNCTION SELECTION DESCRIPTION
PEG0 – Gen X
Auto
Gen1
Gen2
Gen3
Configure PEG0 B0:D1:F0 Speed.
PEG1 – Gen X
Auto
Gen1
Gen2
Gen3
Configure PEG1 B0:D1:F1 Speed.
PEG2 – Gen X
Auto
Gen1
Gen2
Gen3
Configure PEG2 B0:D1:F2 Speed.
Run-time C7 Allowed
Enabled
Disabled
Enable/Disable the entry to C7 state [Run-time control] . Don’t enable this feature until you have all the appropriate
Save/Restore
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Controller/Endpoint state.
Always Enable PEG
Disabled
Enabled
Enable PEG.
PEG ASPM
Disabled
L0S
L1
L0S And L1
Auto
PEG ASPM Settings.
Program PCIe ASPM later than
OpROM
Disabled
Enabled
Enabled: PCIe ASPM will be programmed after OpROM. Disabled: PCIe ASPM will be programmed before OpROM
De-emphasis Control
-6 dB
-3.5 dB
DeEmphasis control for PEG.
Swing Control
Reduced
Half
Full
Perform PEG Swing Control.
PEG Sample Calibrate
Disabled
Enabled
Auto
Enable/Disable PEG Sample Calibrate.
Gen3 Equalization
Disabled
Enabled
Perform PEG Gen3 Equalization steps.
PEG Gen3 Equalization Phase2
Disabled
Enabled
Enable/Disable PEG Gen3 Equalization Phase2.
Gen3 Root Port Preset 1, 2, …8, …11
Root Port Preset value for Gen3 Equalization.
Gen3 Endpoint Preset 0, 1, …7, …10
Endpoint Preset value for Gen3 Equalization.
Gen3 Endpoint Hint 0, 1, 2, …10
Endpoint Hint value for Gen3 Equalization.
Gen3 Eq Preset Search
Disabled
Enabled
Perform PEG Gen3 SW Preset Search algorithm.
Always re-search Gen3 Eq
Preset
Disabled
Enabled
Always re-search PEG Gen3 Preset even it has been done once.
Allow PREST# GPIO Usage
Disabled
Enabled
Enable/Disable GPIO-based resets to PEG endpoint(s) during margin search, if needed.
Preset Search Dwell Time 0, …1000, …65535
PEG Gen3 Preset Search dwell time in [ms].
Timing Start Margin 4, …15, …255
The starting value [4…255] for
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the backward margin search.
Voltage Start Margin 4, …20, …255
The starting value [4…255] for the backward margin search.
Error Target 0, 1, …65535
The margin search error target value [1 … 65535].
PEG RxCEM Loopback Mode
Disabled
Enabled
Enable/Disable PEG RxCEM Loopback Mode.
PEG Gen3 RxCTLE Control 0, …8, …255
PEG Gen3 RxCTLE for Bundle0(Lane0, Lane1).
Generate BDAT PEG Margin Data
Disabled
Enabled
Enable to generate BDAT PCIe margin tables
South Bridge Configuration
FUNCTION SELECTION DESCRIPTION
SMBUS Device
Disabled
Enabled
Enable/Disable SMBUS Device.
Port 80h Cycles LPC Bus
Control where the Port 80h
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PCI Bus cycles are sent.
PCI Clock Run Logic
Disabled
Enabled
Controls PCIe clock gate power saving feature.
HPET Support
Disabled
Enabled
Control the High Precision Event Timer through this setup option. When enabled, the RSDT points to the HPET table and the proper enable bits are set.
HPET Memory Map BAR
FED00000
FED01000
FED02000
FED03000
Select the HPET Memory Map Base Address.
Enable CRID
Disabled
Enabled
Enable Compatible Revision ID.
DeepSx Mode
Disabled
Enabled only in S5/Battery
Enabled only in S4-S5/Battery
Enabled in S3-S5/Battery
Configure the DeepSx Mode configuration.
GP27 Wake From DeepSx
Disabled
Enabled
Wake From DeepSx by the assertion of GP27 pin.
State After G3
State S5
State S0
Specify what state to switch to when power is re-applied after a power failure (G3 state).
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SB PCI Express Config
FUNCTION SELECTION DESCRIPTION
PCI Express Root Port Clock Gating
Disabled
Enabled
Enabled or Disabled PCI Express Root Port Clock Gating.
DMI Link ASPM Control
Disabled
L0S
L1
L0S And L1
Auto
The control of Active State Power Management of the DMI Link.
DMI Link Extended Synch Control
Disabled
Enabled
The control of Extended Sync on SB side of the DMI Link.
PCI Express port assigned to LAN 3
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PCI Express Root Port x Config (x= 4, 5, 6)
FUNCTION SELECTION DESCRIPTION
PCI Express Root Port x Config
(x= 4, 5, 6)
Disabled
Enabled
Control the PCI Express Root Port.
PCIe Speed
Auto
Gen1
Gen2
Select PCIe Speed to Gen1 or Gen2.
ASPM
Disabled
L0S
L1
L0S And L1
Auto
Control PCIe Active State Power Management settings.
L1 Substates
Disabled
L1.1
L1.2
L1.1 & L1.2
PCI Express L1 Substates setting.
HOT PLUG Disabled
PCI Express Hot Plug Enabled/Disabled.
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Enabled
URR
Disabled
Enabled
PCI Express Unsupported Request Reporting Enabled/Disabled.
FER
Disabled
Enabled
PCI Express Device Fatal Error Reporting Enabled/Disabled.
NFER
Disabled
Enabled
PCI Express Device Non-Fatal Error Reporting Enabled/Disabled.
CER
Disabled
Enabled
PCI Express Device Correctable Error Reporting Enabled/Disabled.
SEFE
Disabled
Enabled
Root PCI Express System Error on Fatal Error Enabled/Disabled.
SENFE
Disabled
Enabled
R oot PCI Express System Error on Non-Fatal Error Enabled/Disabled.
SECE
Disabled
Enabled
Root PCI Express System Error on Correctable Error Enabled/Disabled.
PME Interrupt
Disabled
Enabled
Root PCI Express PME Interrupt Enabled/Disabled.
PME SCI
Disabled
Enabled
PCI Express PME SCI Enabled/Disabled.
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SB USB Configuration
FUNCTION SELECTION DESCRIPTION
USB Precondition
Disabled
Enabled
Precondition work on USB host controller and root ports for faster enumeration.
xHCI Mode
Disabled
Enabled
Auto (note 1)
Smart Auto (note 2)
Mode of operation of xHCI controller.
USB Per-Port Disable Control
Disabled
Enabled
Control each of the USB ports (0~13) enable/disable.
Note 1:
“Auto”. This mode uses ACPI protocol to provide an option that enables the xHCI controller and
reroute USB ports via the _OSC ACPI method call. Note, this mode switch requires special OS driver support for USB 3.0.
Note 2:
“Smart Auto”. This mode is similar to “Auto”, but it adds the capability to route the ports to xHCI or EHCI according to setting used in previous boots (for non-G3 boot) in the pre-boot environment. This allows the use of USB 3.0 devices prior to OS boot. Note, this mode switch requires special OS driver support for USB 3.0 and USB 3.0 software available in the pre-boot environment.
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SB Azalia Configuration
FUNCTION SELECTION DESCRIPTION
Azalia
Disabled
Auto
Control Detection of the Azalia device.
Azalia Docking Support Enable
Disabled
Enabled
Enable/Disable Docking Support for Azalia.
Azalia PME Enabled
Disabled
Enabled
Enable/Disable PME for Azalia.
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SB Serial IRQ Configuration
FUNCTION SELECTION DESCRIPTION
Enable Serial IRQ
Disabled
Enabled
Enable/Disable the serial IRQ function in the PCH.
Serial IRQ Mode
Quiet
Continuous
The “Quit” mode Serial IRQ is active only when needed, In “Continuous” it is active all the time.
Start frames
4 Frames
6 Frames
8 Frames
The number of start frames at the beginning of the serial IRQ.
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SB Security Config
FUNCTION SELECTION DESCRIPTION
GPIO Lockdown
Disabled
Enabled
Enable/Disable the PCH GPIO Lockdown feature.
RTC Lock
Disabled
Enabled
Enable will lock bytes 38h-3Fh in the lower/upper 128-byte bank of RTC RAM.
BIOS Lock
Disabled
Enabled
Enable/Disable the PCH BIOS Lock Enable feature. The whole BIOS region is not writable.
SMM LOCK
Disabled
Enabled
Enable/Disable SMM LOCK feature. It will lock the SMRAM and unable load SMM driver any more.
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SB Serial IO Config
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FUNCTION SELECTION DESCRIPTION
SerialIo MODE
ACPI Mode
PCI Mode
Use ACPI mode in Win8 environment.
PCI mode is only for debugging.
SerialIo DMA
Disabled
Enabled
If ACPI mode for SerialIO is choosen, DMA controller must be enable for proper functionality.
SerialIo I2C0
Disabled
Enabled
I2C0 host controller.
SerialIo I2C0 Voltage
3.3 V
1.8 V
Use 1.8v for I2C0 devices listed below.
SerialIo I2C0 Sensor Hub
Disabled
USB Sensor
Hub
Intel
Kalapana
Beach Sensor
Hub
Please Select Sensor Hub
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Intel STM
Sensor Hub
SerialIo I2C0 ST test Wake Device
Disabled
Enabled
Enables/Disables the Vendor Sensor
SerialIo I2C0 Synaptics Precision Touchpad
Disabled
Enabled
Enables/Disables the Synaptics Precision Touchpad
SerialIo I2C0 Synaptics Wake Touchpad
Disabled
Enabled
Enables/Disables the Synaptics Wake Touchpad
SerialIo I2C0 Elantech Wake Touchpad
Disabled
Enabled
Enables/Disables the Elantech Wake Touchpad
SerialIo I2C0 WITT Devices
Disabled
Enabled
Enables/Disables the Vendor Sensor
I2C0 Parameters Override
Disabled
Enabled
Override the I2C0 Controller Parameters
SerialIo I2C1
Disabled
Enabled
I2C1 host controller.
SerialIo I2C1 Voltage
3.3 V
1.8 V
Use 3.3 V for I2C1 devices listed below
SerialIo I2C1 Atmel TouchPanel
Disabled
Enabled
Enables/Disables the Vendor Sensor
SerialIo I2C1 Elan TouchPanel
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 Elan TouchPad
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 Synaptics Precision Touchpad
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 NTRIG TouchPanel
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 EETL TouchPanel
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 ALPS TouchPad
Disabled
Enabled
Enables/Disables the Vendor Sensor.
SerialIo I2C1 Cypress TouchPad
Disabled
Enabled
Enables/Disables the Vendor Sensor.
I2C1 Parameters Override
Disabled
Enabled
Overrides the I2C1 Controller Parameters
SerialIo SPI0
Disabled
Enabled
SPIO host controller.
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SerialIo SPI1
Disabled
Enabled
SPI1 host controller
SerialIo SDIO
Disabled
Enabled
SDHC host controller
SerialIo SDIO Wifi
Disabled
Enabled
Enables/Disables the Vendor Sensor.
LAN Configuration
Note:
The “+” and “-“ (to the right of the MAC address) indicates respectively if link is established or not.
FUNCTION SELECTION DESCRIPTION
ETH1 Configuration (Left)
Disabled
Enabled
With PXE boot
Control the Ethernet Devices and PXE boot.
Wake on LAN
Disabled
Enabled
Enable or disable integrated LAN to wake the system. (The Wake On LAN cannot be disabled if ME is on at Sx state).
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ETH2 Configuration (Right)
Disabled
Enabled
With PXE boot
Control the Ethernet Devices and PXE boot.
Hardware Health Configuration
Note:
System Temperature readout is the temperature measured by the selected sensor via System
Temperature Ext Type. If disabled then onboard sensor is used.
FUNCTION SELECTION DESCRIPTION
System Temperature Ext Type
Disabled (Note 1)
LM75 @ 0x90
OneWire @ GPIO16
Use external connected sensor instead of onboard.
Fan Cruise Control (Note 2)
Disabled
Thermal
Speed
Disabled = Full speed.
Thermal: does regulate fan speed according to specified temperature.
Speed: does regulate according to specified RPM.
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Fan Settings
10 – 90 (note3)
1000 – 10000 (note4)
Fan Min limit (Note 5) 0 (note6)
Minimum PWM %, can be used to make sure fan is always active. Make sure Min limit < Max limit.
Fan Max limit (Note 5) 100 (note6)
Maximum PWM %, can be used to limit the fan noise. Make sure Min limit < Max limit.
Watchdog Function 0 - 255 (note7)
0 = Disabled.
Enter the service interval in seconds before system will reset.
Note 1:
When not Disabled then the System Temperature readout will only be valid if the sensor is
physically connected to the Feature connector.
Note 2:
Two sets of settings (Fan Cruise Control, Fan Settings, Fan Min limit, Fan Max limit), one set for
System Fan and one set for CPU Fan. The Fan Cruise Control is by default Disabled for System Fan and by default Thermal for CPU Fan.
Note 3:
ºC (if Fan Cruise Control is Thermal) use either digit keys to enter value or +/- keys to
increase/decrease value. Don’t use mix of digit keys and +/- keys.
Note 4:
RPM (if Fan Cruise Control is Speed) use either digit keys to enter value or +/- keys to
increase/decrease value by 100. Don’t use mix of digit keys and +/- keys.
Note 5:
Only visible if Fan Cruise Control is Thermal.
Note 6:
Use number keys to enter value.
Note 7:
Seconds, use digit keys to enter value. Value 0 means Watchdog is disabled. Refer to “KT-API-V2
User Manual” to control the Watchdog via API or refer to “KT-API-V2 User Manual DLL” how to control Watchdog via Windows DLL.
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SMBIOS Event Log
Note:
Entering View SMBIOS event log will show log only.
FUNCTION SELECTION DESCRIPTION
Event Log
Disabled
Enabled
Enable/Disable Event Log.
Mark SMBIOS as read Enter
Mark SMBIOS events as read. Marked SMBIOS events won’t be displayed.
Clears SMBIOS events Enter Clears SMBIOS events.
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ME Configuration
FUNCTION SELECTION DESCRIPTION
Intel® ME
Disabled
Enabled
Enable/Disable Intel® Management Engine.
ME FW Downgrade
Disabled
Enabled
Enable/Disable ME FW Downgrade function.
ME Debug Event Service
Disabled
Enabled
Enable/Disable ME Debug Event Service.
MDES for BIOS
Disabled
Enabled
Enable/Disable ME Debug Event Service for BIOS events.
ME IFR Feature
Disabled
Enabled
Enable/Disable Intel ® ME Independent Firmware Recovery.
Firmware TPM Feature
Disabled
Enabled
Enables or disables the Firmware TPM present in the ME.
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Thermal Configuration
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CPU Thermal Configuration
FUNCTION SELECTION DESCRIPTION
Thermal Monitor
Disabled
Enabled
Enable processor Thermal Monitor thermal control. Requires GV3.
Bi-directional PROCHOT#
Disabled
Enabled
When a processor thermal sensor trips (either core), the PROCHOT# is driven. If bi­direction is enabled, external agents can drive PROCHOT# to throttle the processor.
PROCHOT# OUT
Disabled
Enabled
If bi-directional PROCHOT# is enabled, PROCHOT# OUT can be disabled selectively.
PROCHOT# Response
Disabled
Enabled
Enable/Disable PROCHOT Response.
Disable VR Thermal Alert
Disabled
Enabled
Enable/Disable VR Thermal Alert.
ACPI 3.0 T-States Disabled
Enable/Disable ACPI 3.0 T­States.
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Enabled
DTS
Disabled
Enabled
Out of Spec Only
Enable CPU Digital Thermal Sensor function.
Platform Thermal Configuration
FUNCTION SELECTION DESCRIPTION
Automatic Thermal Reporting
Disabled
Enabled
Configure _CRT, _PSV, and _AC0 automatically based on values recommended in BWG’s Themal Reporting for Thermal Management settings. Set to Disabled for manual configuration.
Active Trip Point Lo Fan
Disabled
15, 23, …55, …119
This value controls the temperature of the ACPI Active Trip Point – the point where the OS turns the processor fan on low.
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Passive TC1 Value 1, 2, …16
This value sets the TC1 value for the ACPI Passive Cooling Formula.
Use “+” and “-“ keys to change value.
Passive TC2 Value 1, 2, …, 5, …16
This value sets the TC2 value for the ACPI Passive Cooling Formula.
Use “+” and “-“ keys to change value.
Passive TSP Value 2, 4, …, 10, …32
This value sets the TSP value for the ACPI Passive Cooling Formula. It represents in tenths of a second how often the OS reads the temperature when passive cooling is enabled. Use “+” and “-“ keys to change value.
Thermal Sensor Device Enable
Disabled
Enabled
Enable Thermal Sensor Device.
ME SMBus Thermal Reporting
Disabled
Enabled
Enable/Disable ME SMBus Thermal Reporting Configuration.
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ICC Configuration
FUNCTION SELECTION DESCRIPTION
ICC Profile 0 ICC profile Selection
Use Watchdog Timer for ICC
Disabled
Enabled
Enable Watchdog Timer operation for ICC. If enabled, Watchdog Timer will be started after ICC related changed. This timer detects platform instability caused by wrong cloch settings.
Clock Manipulation
ICC Success
ICC Failure
Status of the clock configuration.
Apply ICC settings after reboot
None
Permanently after reboot
None: Change will not apply.
Permanently: Changes will be applied permanently, starting after the next reboot. Use it to provide changes that are verified and safe.
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Clock 2
FUNCTION SELECTION DESCRIPTION
New SSC spread percent
[0.01 %]
0, 1, …, 50
Clock spectrum spread in 0.01 % increments. Determines spectrum deviation away from base frequency. Allowed range is limited by Max supported SSC %. Changes will not be applied unless ‘Apply settings’ is pressed.
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Intel® Smart Connect Technology
FUNCTION SELECTION DESCRIPTION
ISCT Configured
Disabled
Enabled
Enable ISCT
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SECURITY 12.03.
Note:
“Secure Boot Configuration” and “TPM Configuration” see next pages.
FUNCTION SELECTION DESCRIPTION
Secure Boot Activation
(Note1)
Disabled
Enabled
Enable this option and the secure boot feature is activated. When the menu item is enabled, it cannot be set to disabled.
Set Supervisor Password (up to 20 characters)
Set or clear the Supervisor account’s password.
Supervisor Hint String (up to 20 characters)
Press Enter to type Supervisor Hint String.
Set User Password (Note1) (up to 20 characters)
Set or clear the User account’s password.
User Hint String (Note1) (up to 20 characters)
Press Enter to type User Hint String.
Min. password length 1, 2, …, 20
Set the minimum number of characters for password (1-20).
Authenticate User on Boot Disabled
Enable/Disable User
MITX-BDW-U (KTD-NO886-B) www.kontron.com // 99 - 104
(Note1) Enabled Authenticate Prompt on Boot.
HDD Password Select
User+Master
User Only
Supports user only or both user and master password.
Set HDD01 User Password Enter Set HDD01 User Password.
TPM Support
Disabled
Enabled
This is used to decide whether TPM support should be enabled or disabled.
Note 1:
Only selectable if “Supervisor Password” is set.
Secure Boot Configuration
FUNCTION SELECTION DESCRIPTION
Secure Boot Option
Disabled
Enabled
Enable or disable secure boot function.
Reset to Defaults Enter
Reset secure boot variables to manufacturing defaults.
Change to Customization Enter
PK will be deleted, the platform
will be changed to setup mode,
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