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microETXexpress-OH
User Manual
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Kontron microETXexpress-OH User Manual

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microETXexpress®-OH Computer-on-Module (COM)
Version 0.65
If it’s embedded, it’s Kontron.
Page 2
www.kontron.com
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» Table of Contents «
1 User Information ............................................................................. 1
2 Introduction ................................................................................... 3
3 Specifications ................................................................................. 7
4 COM Connectors ............................................................................. 12
www.kontron.com
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5 Special Features ............................................................................ 35
5.4 Fast I2C ................................................................................................................................. 35
6 Design Considerations .................................................................... 37
7 System Resources .......................................................................... 39
www.kontron.com
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8 BIOS Operation ............................................................................. 43
8.2.1Start AMIBIOS®8 Setup Utility .................................................................................................. 43
9 Appendix B: Architecture Information ................................................ 46
10 Appendix C: Document Revision History.............................................. 48
www.kontron.com
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Kontron microETXexpress-OH User’s Guide
1 User Information
1.1 About This Document
This document provides information about products from Kontron and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2011 Kontron
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron.
1.3 Trademarks
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron. Kontron is a trademark or registered trademark of Kontron AG.
The following components used on this board are trademarked as follows:
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corporation. » Microsoft is a registered trademark of Microsoft Corporation. » Intel is a registered trademark of Intel Corporation. » COM Express is a trademark of PICMG. » All other products and trademarks mentioned in this manual are trademarks of their respective owners and
indicated with an “*”.
1.4 Standards
Kontron is certified to ISO 9000 standards.
1.5 Warranty
This Kontron product is warranted against defects in material and workmanship for the warranty period from the date of shipment. During the warranty period, Kontron will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
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Kontron microETXexpress-OH User’s Guide
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper installation or maintenance.
Kontron will not be responsible for any defects or damages to other products not supplied by Kontron that are caused by a faulty Kontron product.
1.6 Technical Support
Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems.
Please consult our website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section for the latest BIOS downloads, Product Change Notifications and additional tools and software. You can also always contact your board supplier for technical support.
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Kontron microETXexpress-OH User’s Guide
2 Introduction
2.1 The microETXexpress®-OH COM
The Kontron microETXexpress®-OH Computer-on-Module (COM) complies with the newly updated Rev. 2.0 COM
Express® specification that provides for a compact form factor (95 x 95 mm) a new COM Express® Type 6 connector
definition. The microETXexpress®-OH COM design enables the development of graphics-intensive applications based
on the Advanced Micro Devices (AMD) G-series Advanced Processing Unit (APU) and the AMD Fusion Controller Hub
(FCH) using the secure development path of an established, future-proof industry standard, the COM Express®
compact form factor, pin-out Type 6.
The Kontron microETXexpress®-OH module processor has an integrated memory controller for up to 8Gbytes of single
channel DDR3 memory. The integrated DirectX®11-capable graphics processing unit (GPU) within the FCH supports
display interfaces with a maximum resolution of 2560 x 1600 VGA and 18-bit single-channel LVDS. With six PCI
Express lanes for flexible configurations, the microETXexpress®-OH COM is ideal for multi-interface designs and
brings the added benefit of low power consumption. These special features make this 95 x 95 mm Computer-on-
Module a key solution for applications such asmultimedia content delivery, outdoor digital signage, infotainment
kiosks, POS/POI devices, panel PCs, and professional gaming systems that require high-level graphics performance
and support for the latest APIs like DirectX 11, and where low thermal power design is also an advantage.
All modules in the Kontron microETXexpress® family are compliant with the COM Express® standard, compact form
factor and follow either the Type 2 or Type 6 pin-out definition. These modules also take advantage of the new
Kontron Embedded Application Programming Interface (Kontron EAPI), which is cross-platform middleware that is
both form factor and operating system independent. This ensures easy interchangeability as well as design scalability
and future migration paths.
The microETXexpress®-OH COM is a complete PC with standard interfaces such as USB, Gigabit Ethernet, SATA 2.0 as
2
well as additional options like high-definition audio (HDA) and ACPI, I
supports the MARS and K-STATION Kontron tools.
C. The microETXexpress®-OH COM also
2.2 Naming Clarifications
The COM Express® standard defines a Computer-On-Module, or COM, with all the components necessary for a bootable
host computer, packaged as a super-component. The interfaces provide a smooth transition path from legacy parallel
interfaces such as IDE or parallel ATA (PATA) to Low Voltage Differential Signaling (LVDS) interfaces including the PCI
bus, PCI Express*, and Serial ATA (SATA).
» ETXexpress® modules are Kontron COM Express® modules in the basic form factor (125mm x 95mm) that follow
pin-out types 2 or 6.
» microETXexpress® modules are Kontron COM Express® modules in the compact form factor (95mm x 95mm) that
follow pin-out types 2 or 6.
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» nanoETXexpress® modules are Kontron COM Express® compatible modules in an ultra-small form factor that
follow pin-out types 1 or 10 (55mm x 84mm)
NOTE: The Kontron microETXexpress®-OH module takes advantage of new features introduced in the PICMG COM
COM.0 R2.0 COM Express® Specification.
2.3 Understanding the COM Functionality
All Kontron microETXexpress® and ETXexpress® modules contain two connectors (X1A and X1B), each with two rows. The primary connector rows are Row A and Row B (connector X1A). The secondary connector rows are Row C and Row D (connector X1B). The microETXexpress-OH COM uses the PICMG COM Express® pin-out Type 6 definition, which is a new addition to the PICMG COM Express standard and documented in Revision 2.0 of the PICMG specification. The Type 6 pin-out is based on Type 2 and also supports new features on the secondary connector (rows C and D). The key changes are:
» The PCI interface is no longer supported and the pins are used instead for digital display interfaces (DDI) and two
additional PCI Express lanes
» The IDE (PATA) parallel interface is no longer supported and the pins are used instead for additional transmit and
receive pairs for four USB 3.0 ports.
» Three dedicated DDI ports have been added. Ports 1, 2, and 3 can be configured individually for Display Port (DP),
HDMI, or DVI and port 1 can also be used for SDV0.
» SDVO is no longer supported. » Two optional two-wire RS232 serial ports have been added using pins formerly assigned to 12V signals.
The primary connector (Row A and Row B) on the microETXexpress®-OH COM features the following functionality:
» Analog VGA graphics » LVDS 18-bit single channel » Gigabit Ethernet LAN » Serial ATA (SATA) » PCI Express* » SPI Bus » USB 2.0 and USB 3.0 » LPC (Low Pin Count) bus » Watchdog timer (WDT) » GPIO
2
» I
C
» Intel® High Definition Audio (HDA)
The secondary connector (Row C and Row D) supports the following buses and I/O:
» SDVO/DP/DVI/HDMI » DP/DVI/HDMI » PCI Express
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Kontron microETXexpress-OH User’s Guide
NOTE: For full descriptions of the COM Express Type 6 pin-outs, refer to the PICMG documentation that can be obtained
from the the PICMG website.
2.4 COM Express® Documentation
This product manual serves as one of three principal references for this COM Express® module design. It documents
the specifications and features of the microETXexpress®-OH COM. The other two references, which are available from
your Kontron support representative or from PICMG, include:
» The PICMG COM Express® Specification, R2.0, which defines the COM Express® module form factors, pin-outs, and
signals. This document can be obtained by filling out the order form on the PIGMG website at
http://www.picmg.com .
» The PICMG COM Express® Design Guide, which serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules. This guide is on the PICMG website at http://www.picmg.com.
2.5 COM Express® COM Benefits
Compact form factor (95 x 95 mm) Computer-on-Module Express (COM Express) modules are very compact, highly integrated computers that use either the Type 2 or Type 6 COM Express® connector pin-outs. All microETXexpress® modules feature a standardized form factor and a standardized connector layout for a specified set of signals, as defined in the PICMG COM Express® specification (PICMG COM.0.R2). This standardization lets designers create a single-system baseboard that can accept present and future microETXexpress modules.
Kontron microETXexpress® modules include common personal computer (PC) peripheral functions such as:
» Graphics » USB ports » Ethernet » Audio » SATA hard disk drive format
Baseboard designers can optimize exactly how each of these functions is implemented physically for the intended application by placing connectors precisely where they are needed on a baseboard that is designed for an optimal fit in the system packaging.
A peripheral PCIe bus can be implemented directly on the application-specific baseboard rather than on mechanically unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in super-component simplifies packaging, eliminates cabling, and significantly reduces system-level total cost of ownership.
A single baseboard design can use a range of COM Express modules. This flexibility enables product differentiation at various price/performance points, and the design of future-proof systems with a built-in upgrade path. The
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Kontron microETXexpress-OH User’s Guide
modularity of a COM Express solution also ensures against obsolescence as computer technology evolves. A properly designed COM Express baseboard can work with several successive generations of COM Express modules.
A COM Express baseboard design has many of the advantages of a custom, computer-board design, but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.
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3 Specifications
3.1 Functional Specification
Processor: AMD G-Series Fusion Advanced Processing Unit (APU)
» CPU: AMD T44R with 1.2 GHz single-core APU (9W)
AMD T52R with 1.5 GHz single-core APU (18W) AMD T40N with 1.0 Ghz dual-core APU (9W) AMD T56N with 1.6 GHz dual-core APU (18W)
» Cores: Up to 2 cores » Bus Speed: Up to 2x1.66 GHz » Cache: TBD » Memory Controller: Up to 8GB (2x4GB)single channel, two non-ECC DDR3 S0DIMMs (1066 MHz or with the
T56N CPU only, 1333 MHz)
» Video Controller: DirectX®11-capable graphics and parallel processing engine
Universal Video Decoder (UVD) 3.0 (the dedicated highdefinition video acceleration block in the APU)
» Graphics Processing: General purpose graphics processing unit (GPGPU)
AMD Radeon HD6310 with support for DirectX® 11, OpenCL 1.0, and OpenGL 3.2 and 2.1
» Instruction Set: Kontron Embedded Application Programming Interface (Kontron EAPI)
» Package: 19mm x 19mm » Thermal Spec: Operation: 0° to +60°C
Storage: -30° to +85°
Chipset: AMD Fusion Controller Hub (FCH) A50M I/O Controller Hub
» Speed: TBD » USB: 8xUSB 2.0 channels
2xUSB 3.0 channels as a build option
» Audio: 3 channelsHigh Definition Audio » PCI Express: PCI Express 1.0 or 2.0
Six PCIe general purpose lanes 2xExpressCard
» Storage 4xSATA » Ethernet Intel® 82574 GbE Controller » Suspend Modes Core Sleep States: S0, S3, S4, S5eco » TDP: TBD » Package: TBD
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Display Interfaces
» Features: 2 Digital Display Interfaces 0 and 1 (as defined by COM Express Rev. 2 Type 6)
Dual independent display pipes - two active display interfaces allowed Display Port – resolution to 2560 x 1200 x 60 Hz HDMI/DVI - resolution to 1920 x 1200 x 60 Hz Single channel (18 bit) LVDS channel A (as defined by COM Express Rev. 2 Type 6) (Pin shared (multiplexed) with (TBD) DDI) Analog VGA, with max resolution TBD (on COM Express A-B connector)
Storage
» SATA: 4xSATA TBD ports supporting up to 6.0 Gbps transfer rate
Onboard Devices:
» Ethernet: Intel® 82574 GbE Controller » Ethernet Features: S0 or S5 power, under BIOS control, supporting WakeOnLAN, PXE Lanboot (TBD), » TPM: TBD » Watchdog Timer: SIO implementation
BIOS enables and configures watchdog in the CPLD (TBD). Watchdog has the option to generate NMI after the delay has expired.
» Power Management: BIOS enables ACPI power management revision 3.0 in the CPLD for supported OS.
Additional Interfaces:
» LPC bus: Yes, to COM Express A-B connector » SMBus: Yes, to COM Express A-B connector
2
» I
C: Yes, the I2C bus can be implemented using an FCH SMBus port or via the SIO hardware.
(COM Express Rev 2.0 specifies that the I
» GPIO: Yes, 8xGPIO, 4 GPI and 4 GPO (inputs are interrupt-capable) » SPI Yes, to COM Express A-B connector, SPI bus includes carrier board SPI device support » K-Station: Yes » Bootlogo: TBD » MARS: Supported for smart battery management
2
C bus shall be active in S5)
» HWM: Temperature Monitoring for CPU and Board Temperature (Nuvoton NCT5577D SIO hardware
monitor)
» Passive Cooling: TBD » ACPI: ACPI 3.0 » Suspend Modes: S0, S3, S5/WOL enabled, S5/WOL disabled, S5eco (S4 not supported in the FCH) » Input Voltage: Single supply support with wide range power supply input, 4.75V – 18V
5.0V supply is the optional standby power rail.
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3.2 Functional Block Diagram
Figure 1 is t he microETXexpress®-OH COM block diagram
Figure 1: microETXexpress®-OH COM Block Diagram
To be supplied in a later version
3.3 Mechanical Specifications
Module Dimensions
» 95 mm x 95 mm ±0.2 mm (3.47 in. x 3.47 in)
Height on Top
» Approximately TBD mm maximum (without the PCB)
Kontron microETXexpress-OH User’s Guide
» Height varies depending on whether the optional cooling solution (either a passive heat sink or a heat spreader
plate) is installed
Height on Bottom
» Approximately TBD mm maximum (without the PCB)
Figure 2 is the microETXexpress®-OH COM mechanical drawing
Figure 2: microETXexpress®-OH COM Mechanical Drawing
To be supplied in a later version
All dimensions are shown in millimeters. The COM Express® specification says that these holes should be ± 0.25mm [±0.010"], unless otherwise noted. The tolerances for placement of the COM Express connector with respect to the peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"]. The mounting holes shown in the drawing use 6mm diameter pads and 2.7mm plated holes for use with 2.5mm hardware. The pads are tied to the PCB ground plane. Gray circles represent the mechanical mounting holes. Black circles represent the mounting holes required by the PICMG COM Express® standard.
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3.4 Electrical Specifications
3.4.1 Supply Voltage
ATC Power
» 4.75V to +18V main power is on the COM Express VCC_12V pins and 4.75V to 5.25V standby power is on the
VCC_5V_SBY. RTC power is provided on the VCC_RTC pins. VCC_12V may or may not collapse in suspend states S3, S4, and S5.
Single Power Supply
» 4.75V to +18V main power is on the COM Express VCC_12V pins and standby power if needed is also provided on
the VCC-12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the carrier board. RTC power is provided on the VCC_RTC pins.
Power Supply Risetime
» TBD
3.4.2 Supply Current (Windows XP SP3)
The testing performed to capture the supply current data used tested modules mounted on a Kontron evaluation board with a mouse and keyboard connected. The power consumption tests were executed in Windows XP (with SP3) using a tool to stress the CPU at 100 % load. The power measurement values were captured after 15 minutes of full load or a stable CPU core temperature of 90°C. To ensure a stable die temperature, a corresponding heat sink was used to hold the temperature under the critical trip point. The modules were tested using the maximum CPU frequency. For more detailed information, refer to the “Power Consumption” diagrams on the EMD Customer section of the Kontron website.
Tables to be supplied in a later version
NOTE: It is difficult to test for all possible applications on the market. There may be an application that draws more
power from the CPU than the values measured in the table above. Take this into consideration if you are at the limit of the thermal specification, in which case you should consider improving your thermal solution.
3.5 Environmental Specifications
3.5.1 Temperature
Operating: (with Kontron heat spreader plate assembly):
» Ambient temperature: 0 to TBD°C
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» Maximum heat sink temperature: 0 to 70°C* (without a fan on the 9W APU SKUs) » Non-operating: TBD°C
NOTES: *1) The maximum operating temperature with the heat spreader plate installed is the maximum measurable
temperature on any spot on the heat spreader surface. You must maintain the temperature according to the specification above.
Operating (without Kontron heat spreader plate assembly):
» Maximum operating temperature: TBD°C » Non operating: TBD°C
NOTE: **The maximum operating temperature is the maximum measurable temperature on any spot on the module
surface. You must maintain the temperature according to the specification above.
Humidity
» Operating: TBD% (non-condensing)at 40°C » Non operating: TBD (non-condensing) at 40°C
3.6 MTBF
TBD
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Kontron microETXexpress-OH User’s Guide
4 COM Connectors
The pin-outs for microETXexpress® interface connectors X1A (primary connector, rows A and B) and X1B (secondary connector, rows C and D) are documented for convenient reference. See the PICMG COM Express® Specification on the PICMG website and COM Express® Design Guide on the Kontron website for detailed, design-level information.
Figure 3: COM Interface Connector Locations
To be supplied in a later version
Table 1: General Signal Description Key
Type Description
I/O-3,3
I/O-5T
I/O-5
I-3,3
I/OD
I-5T
OA
OD
O-1,8
O-3,3
O-5
DP-I/O
DP-I
DP-O
PU
PD
PWR
nc
Bi-directional 3,3 V IO-Signal Bi-dir. 3,3V I/O (5V Tolerance) Bi-directional 5V I/O-Signal
3.3V Input Bi-directional Input/Output Open Drain
3.3V Input (5V Tolerance) Output Analog Output Open Drain
1.8V Output
3.3V Output 5V Output Differential Pair Input/Output Differential Pair Input Differential Pair Output Pull-Up Resistor Pull-Down Resistor Power Connection Not connected, Signal not available
NOTE: To protect external power lines of peripheral devices, make sure that the wires have the right diameter to
withstand the maximum available current and the enclosure of the peripheral device fulfils the fire­protection requirements in IEC/EN60950
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Kontron microETXexpress-OH User’s Guide
t
4.1 Pin-Outs
4.1.1 Connectors X1A and X1B: microETXexpress® Interface
Table 2: Connector X1A - Row A
Pin Signal Description Type Termination Commen
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
GND (Fixed) GBE0_MDI3­GBE0_MDI3+ GBE0_LINK100#
GBE0_LINK1000#
GBE0_MDI2­GBE0_MDI2+ GBE0_LINK# GBE0_MDI1­GBE0_MDI1+ GND (Fixed) GBE0_MDI0­GBE0_MDI0+ GBE0_CTREF
SUS_S3#
SATA0_TX+ SATA0_TX­SUS_S4#
SATA0_RX+ SATA0_RX­GND (Fixed) SATA2_TX+ SATA2_TX­SUS_S5# SATA2_RX+ SATA2_RX­BATLOW#
(S)ATA_ACT#
AC/HDA_SYNC AC/HDA_RST# GND Fixed) AC/HDA_BITCLK
Power Ground PWR - -
Ethernet Receive Data- DP-I Intel® 82577 -
Ethernet Receive Data+ DP-I Intel® 82577 -
Ethernet Speed LED 100Mbps Ethernet Speed LED 1000Mbps Ethernet Receive Data- DP-I Intel® 82577 -
Ethernet Receive Data+ DP-I Intel® 82577 -
LAN Link LED OD Intel® 82577 -
Ethernet Receive Data- DP-I Intel® 82577 -
Ethernet Receive Data+ DP-I Intel® 82577 -
Power Ground PWR - -
Ethernet Transmit Data- DP-O Intel® 82577 -
Ethernet Transmit Data+ DP-O Intel® 82577 -
LAN Reference Voltage O-3.3 is on a power rail
Indicates Suspend to RAM state SATA 0 Transmit Data+ DP-O -
SATA 0 Transmit Data- DP-O -
Indicates Suspend to Disk state SATA 0 Receive Data+ DP-I
SATA 0 Receive Data- DP-I -
Power Ground PWR -
SATA 2 Transmit Data- DP-O
SATA 2 Transmit Data+ DP-O
Indicates Soft Off state O-3.3 CPLD I/O CPLD I/O
SATA 2 Receive Data+ Not connected nc nc
SATA 2 Receive Data- Not connected nc nc
Indicates low external battery SATA, IDE, SD Activity Indicator HD Audio Sync O-3.3
HD Audio Reset O-3.3
Power Ground PWR - -
HD Audio Clock O-3.3
O-3.3 Intel® 82577 -
O-3.3 Intel® 82577 -
-
controlled
O-3.3 CPLD I/O CPLD I/O
O-3.3 CPLD I/O CPLD I/O
I-3.3 CPLD I/O
O-3.3 Buffered output
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t
Pin Signal Description Type Termination Commen
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
AC/HDA_SDOUT BIOS_DIS0#
THRMTRIP#
USB6­USB6+ USB_6_7_OC# USB4­USB4+ GND (Fixed) USB2­USB2+ USB_2_3_OC# USB0­USB0+ VCC_RTC EXCD0_PERST# EXCD0_CPPE#
LPC_SERIRQ
GND (Fixed) PCIE_TX5+ PCIE_TX5­GPI0 PCIE_TX4+ PCIE_TX4­GND (Fixed) PCIE_TX3+ PCIE_TX3­GND (Fixed) PCIE_TX2+ PCIE_TX2­GPI1 PCIE_TX1+ PCIE_TX1­GND (Fixed) GPI2 PCIE_TX0+ PCIE_TX0­GND (Fixed) LVDS_A0+
HD Audio Data O-3.3
Disable Module BIOS Enables boot from a BIOS on Baseboard CPU thermal shutdown indicator USB Data- Port #6 DP-I/O -
USB Data+ Port #6 DP-I/O -
USB Overcurrent Pair 6/7 I-3.3
USB Data- Port #4 DP-I/O
USB Data+ Port #4 DP-I/O -
Power Ground PWR - -
USB Data- Port #2
USB Data+ Port #2 DP-I/O
USB Overcurrent Pair 2/3 I-3.3
USB Data- Port #0 DP-I/O
USB Data+ Port #0 DP-I/O
RTC Power Supply +3V PWR - -
PCIe Express Card 0 ResetO-3.3
PCIe Express Card 0 Request LPC Serial Interrupt Request Power Ground PWR - -
PCIe 5 Transmit Data+ DP-O
PCIe 5 Transmit Data- DP-O
General Purpose Input 0 I-3.3
PCIe 4 Transmit Data+ DP-O
PCIe 4 Transmit Data- DP-O
Power Ground PWR - -
PCIe 3 Transmit Data+ DP-O
PCIe 3 Transmit Data- DP-O
Power Ground PWR - -
PCIe 2 Transmit Data+ DP-O
PCIe 2 Transmit Data- DP-O
General Purpose Input 1 I-3.3
PCIe 1 Transmit Data+ DP-O
PCIe 1 Transmit Data- DP-O
Power Ground PWR - -
General Purpose Input 2 I-3.3
PCIe lane #0 Transmit+ DP-O
PCIe lane #0 Transmit- DP-O
Power Ground PWR - -
LVDS Channel A (positive) DP-O
I-3.3
O-3.3
I-3.3
IO-3.3
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t
T
y
Pin Signal Description Type Termination Commen
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
A96
A97
A98
A99
A100
A101
A102
A103
LVDS_A0-
LVDS_A1+ LVDS_A1-
LVDS_A2+ LVDS_A2-
LVDS_VDD_EN
LVDS_A3+ LVDS_A3-
GND (Fixed) LVDS_A_CK+ LVDS_A_CK­LVDS_I2C_CK LVDS_I2C_DAT GPI3 RSVD RSVD PCIE0_CK_REF+ PCIE0_CK_REF­GND (Fixed) SPI_Power
SPI_MISO
GPO0 SPI_CLK
SPI_MOSI
TPM_PP
TYPE10#
SER0_TX
SER0_RX
GND (Fixed) SER1_TX
SER1_RX
LID#
LVDS Channel A (negative) LVDS Channel A (positive) DP-O -
LVDS Channel A (negative) LVDS Channel A (positive) DP-O
LVDS Channel A (negative) LVDS Panel Power Controller LVDS Channel A (positive) DP-O
LVDS Channel A (negative) Power Ground PWR - -
LVDS Channel A Clock+ DP-O
LVDS Channel A Clock- DP-O
LVDS I2C Clock IO-3.3
LVDS I2C Data IO-3.3
General Purpose Input 3 I-3.3
Reserved Not connected nc nc
Reserved Not connected Nc nc
PCIe Clock (positive) DP-O
PCIe Clock (negative) DP-O
Power Ground PWR - -
Power for off-board SPI flash SPI Master In Slave Out data line General Purpose Output 0 O-3.3
SPI clock line for off­board SPI SPI Master Out Slave In data line Trusted Platform Module Physical Presence pin Not connected for module Gen. Purpose Serial Port 0 Transmit Gen. Purpose Serial Port 0 Receive Power Ground PWR - -
Gen. Purpose Serial Port 1 Transmit Gen. Purpose Serial Port 1 Receive LID Button I/OP-3.3
pe 6
DP-O -
DP-O
DP-O
O-3.3
DP-O
O-3.3
I-3.3
O-3.3
O-3.3 -
I-3.3
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
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t
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t
t
t
t
Pin Signal Description Type Termination Commen
A104
A105
A106
A107
A108
A109
A110
VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
Power Ground PWR - -
Table 3: Connector X1A - Row B
Pin Signal Description Type Termination Commen
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
GND (Fixed) GBE0_ACT# LPC_FRAME# LPC_AD0 LPC_AD1 LPC_AD2 LPC_AD3 LPC_DRQ0# LPC_DRQ1# LPC_CLK GND (Fixed) PWRBTN# SMB_CLK SMB_DAT SMB_ALERT# SATA1_TX+ SATA1_TX­SUS_STAT#
SATA1_RX+ SATA1_RX­GND (Fixed) SATA3_TX+ SATA3_TX­PWR_OK SATA3_RX+ SATA3_RX­WDT AC/HDA_SDIN2
Power Ground PWR - -
Ethernet Activity LED Not connected nc nc
LPC Frame Indicator O-3.3
LPC Address/Data Bus IO-3.3
LPC Address/Data Bus IO-3.3
LPC Address/Data Bus IO-3.3
LPC Address/Data Bus IO-3.3
LPC Serial DMA Reques
LPC Serial DMA Reques
LPC Clock O-3.3
Power Ground PWR - -
Power Button Inpu
SMBus Clock O-3.3
SMBus Data IO-3.3
SMBus Interrup
SATA 1 Transmit Data+ DP-O
SATA 1 Transmit Data- DP-O
Imminent suspend operation; used to notify LPC devices. SATA 1 Receive Data+ DP-I
SATA 1 Receive Data- DP-I
Power Ground PWR - -
SATA 3 Transmit Data+ DP-O
SATA 3 Transmit Data- DP-O
Power OK from power supply I-3.3
SATA 3 Receive Data+ DP-I
SATA 3 Receive Data- DP-I
Watchdog Timeou
Audio CODEC Serial Data In 2 I-3.3
I-3.3
I-3.3
I-3.3
IO-3.3
O-3.3
O-3.3
B29
AC/HDA_SDIN1
Audio CODEC Serial Data In 1
I-3.3
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Pin Signal Description Type Termination Commen
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
B50
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
B70
AC/HDA_SDIN0
GND (Fixed) SPKR I2C_CK I2C_DAT THRM# USB7­USB7+ USB_4_5_OC# USB5-
USB5+
GND (Fixed) USB3­USB3+ USB_0_1_OC# USB1­USB1+ EXCD1_PERST# EXCD1_CPPE# SYS_RESET# CB_RESET# GND (Fixed) PCIE_RX5+ PCIE_RX5­GPO1 PCIE_RX4+ PCIE_RX4­GPO2 PCIE_RX3+ PCIE_RX3­GND (Fixed) PCIE_RX2+ PCIE_RX2­GPO3 PCIE_RX1+ PCIE_RX1­WAKE0# WAKE1# PCIE_RX0+ PCIE_RX0­GND (Fixed)
Audio CODEC Serial Data In 0 Power Ground PWR - -
Speaker Interface O-3.3
I2C Clock IO-3.3
I2C Data IO-3.3
Over Temperature Indicator I-3.3
USB Data- Port #7 DP-I/O
USB Data+ Port #7 DP-I/O
USB Overcurrent Pair 4/5 I-3.3
USB Data- Port #5 DP-I/O
USB Data+ Port#5 DP-I/O
Power Ground PWR - -
USB Data- Port #3 DP-I/O
USB Data+ Port #3 DP-I/O
USB Overcurrent Pair 0/1 I-3.3
USB Data- Port #1 DP-I/O
USB Data+ Port #1 DP-I/O
PCIe Express Card 1 Rese
PCIe Express Card 1 RequestI-3.3
Reset button inpu
Carrier Board Rese
Power Ground PWR - -
PCIe 5 Receive Data+ DP-I
PCIe 5 Receive Data- DP-I
General Purpose Output 1 O-3.3
PCIe 4 Receive Data+ DP-I
PCIe 4 Receive Data- DP-I
General Purpose Output 2 O-3.3
PCIe 3 Receive Data+ DP-I
PCIe 5 Receive Data- DP-I
Power Ground PWR - -
PCIe 2 Receive Data+ DP-I
PCIe 2 Receive Data- DP-I
General Purpose Output 3 O-3.3
PCIe 1 Receive Data+ DP-I
PCIe 1 Receive Data- DP-I
PCI Express Wake Even
General Purpose Wake EventI-3.3
PCIe lane #0 Receive+ DP-I
PCIe lane #0 Receive- DP-I
Power Ground PWR - -
I-3.3
O-3.3
I-3.3
O-3.3
I-3.3
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Pin Signal Description Type Termination Commen
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
B82
B83
B84
B85
B86
B87
B88
B89
B90
B91
B92
B93
B94
B95
B96
B97
B98
B99
B100
B101
B102
B103
B104
B105
B106
B107
B108
B109
B110
LVDS_B0+ LVDS_B0­LVDS_B1+ LVDS_B1­LVDS_B2+ LVDS_B2­LVDS_B3+ LVDS_B3­LVDS_BKLT_EN GND (Fixed) LVDS_B_CK+ LVDS_B_CK­LVDS_BKLT_CTRL
VCC_5V_SBY VCC_5V_SBY VCC_5V_SBY VCC_5V_SBY BIOS_DIS1#
VGA_RED GND (Fixed) VGA_GRN VGA_BLU VGA_HSYNC
VGA_VSYNC VGA_I2C_CK VGA_I2C_DAT SPI_CS# RSVD RSVD GND (Fixed) FAN_PWMOUT FAN_TACHIN SLEEP# VCC_12V_16 VCC_12V_17 VCC_12V_18 VCC_12V_19 VCC_12V_20 VCC_12V_21 GND (Fixed)
LVDS Channel B0 (Positive) DP-O
LVDS Channel B0 (Negative) DP-O
LVDS Channel B1 (Positive) DP-O
LVDS Channel B1 (Negative) DP-O
LVDS Channel B2 (Positive) DP-O
LVDS Channel B2 (Negative) DP-O
LVDS Channel B3 (Positive) DP-O
LVDS Channel B3 (Negative) DP-O
Backlight Enable O-3.3
Power Ground PWR - -
LVDS Channel B Clock+ DP-O
LVDS Channel B Clock- DP-O
Backlight Brightness Control +5V Standby PWR - -
+5V Standby PWR - -
+5V Standby PWR - -
+5V Standby PWR - -
BIOS Disable 1 (offboard SPI select) Analog Video Red O
Power Ground PWR - -
Analog Video Green O
Analog Video Blue O
Analog Video Horizontal Sync Analog Video Vertical Sync O-3.3
Analog Video I2C Clock IO/OD-3.3
Analog Video I2C Data IO/OD-3.3
SPI Chip Select O-3.3
Reserved Not connected nc nc
Reserved Not connected nc nc
Power Ground PWR - -
Fan Speed Control O/OP-3.3
Fan Tachometer Inpu
Sleep Button I/OP-3.3
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
Power Ground PWR
O-3.3
I-3.3
O-3.3
I/OP-3.3
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NOTE: The termination resistors in this table are already mounted on the microETXexpress® board. Refer to the
PICMG COM Express® Design Guide for information about additional termination resistors.
Table 4: Connector X1B - Row C
Pin Signal Description Type Termination Commen
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20 PCIE_RX6- PCI Express
C21
C22
C23
C24
GND (Fixed) GND USB_SSRXO-
USB_SSRXO+
GND USB_SSRX1-
USB_SSRX1+
GND USB_SSRX2-
SUB_SSRX2+
GND (Fixed) USB_SSRX3-
USB_SSRX3+
GND DDI1_PAIR6+
DDI1_PAIR6-
RSVD RSVD PCIE_RX6+
GND (Fixed) PCIE_RX7+
PCIE_RX7-
DDI1_HPD
Power Ground PWR - -
Power Ground PWR - -
SuperSpeed USB Data Receive Path 0­SuperSpeed USB Data Receive Path 0+ Power Ground PWR - -
SuperSpeed USB Data Receive Path 1­SuperSpeed USB Data Receive Path 1+ Power Ground PWR - -
SuperSpeed USB Data Receive Path 2­SuperSpeed USB Data Receive Path 2+ Power Ground PWR
SuperSpeed USB Data Receive Path 3­SuperSpeed USB Data Receive Path 3+ Power Ground PWR - -
Digital Display Interface Digital Display Interface Reserved Not connected nc nc
Reserved Not connected nc nc
PCI Express Differential Receive Pair 6+
Differential Receive Pair 6­Power Ground PWR
PCI Express Differential Receive Pair 7+ PCI Express Differential Receive Pair 7­Digital Display Interface Hot-plug
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
DP-I
DP-I
Not connected nc nc
Not connected nc nc
I-3.3
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Pin Signal Description Type Termination Commen
detect
C25
C26
C27
C28
C29
C30
C31
C32
C33
C34
C35
C36
C37
C38
C39
C40
C41
C42
C43
C44
C45
C46
C47
C48
C49
C50
C51
C52
DDI1_PAIR4+
DDI1_PAIR4-
RSVD RSVD DDI1_PAIR5+
DDI1_PAIR5-
GND (Fixed) DDI2_CRTLCLK_AUX+ DDI2_CRTLDATA_AUX-
DDI2_DDC_AUX_SEL
RSVD DDI3_CRTLCLK_AUX+
DDI3_CRTLDATA_AUX-
DDI3_DDC_AUX_SEL
DDI3_PAIR0+
DDI3_PAIR0-
GND (Fixed) DDI3_PAIR1+
DDI3_PAIR1-
DDI3_HPD
RSVD DDI3_PAIR2+
DDI3_PAIR2-
RSVD DDI3_PAIR3+
DDI3_PAIR3-
GND (Fixed) PEG_RX0+
Digital Display Interface Digital Display Interface Reserved Not connected nc nc
Reserved Not connected nc nc
Digital Display Interface Digital Display Interface Power Ground PWR - -
HDMI/DVI I2C CRTLCLK I/O-3.3
HDMI/DVI I2C CRTLDATA Selects function of DDI CRTL & DATA Aux Reserved Not connected nc nc
HDMI/DVI I2C CRTLCLK HDMI/DVI I2C CRTLDATA Selects function of DDI CRTL & DATA Aux Digital Display Interface Digital Display Interface Power Ground PWR - -
Digital Display Interface Digital Display Interface Digital Display Interface Hot-plug detect Reserved Not connected nc nc
Digital Display Interface Digital Display Interface Reserved Not connected nc nc
Digital Display Interface Digital Display Interface Power Ground PWR - -
PCI Express Graphics DP-I
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
I/O-3.3
I-3.3
I/O-3.3
I/O-3.3
I-3.3
DP-O
DP-O
DP-O
DP-O
I-3.3
DP-O
DP-O
DP-O
DP-O
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Pin Signal Description Type Termination Commen
Receive Lane 0 Positive
C53
C54
C55
C56
C57
C58
C59
C60
C61
C62
C63
C64
C65
C66
C67
C68
C69
C70
C71
C72
C73
C74
PEG_RX0-
TYPE0#
PEG_RX1+
PEG_RX1-
TYPE1#
PEG_RX2+
PEG_RX2-
GND (Fixed) PEG_RX3+
PEG_RX3-
RSVD
RSVD
PEG_RX4+
PEG_RX4-
RSVD
PEG_RX5+
PEG_RX5-
GND (Fixed) PEG_RX6+
PEG_RX6-
GND PEG_RX7+
PCI Express Graphics Receive Lane 0 Negative Not connected for Type 6 module PCI Express Graphics Receive Lane 1 Positive PCI Express Graphics Receive Lane 1 Negative Not connected for Type 6 module PCI Express Graphics Receive Lane 2 Positive PCI Express Graphics Receive Lane 2 Negative Power Ground PWR - -
PCI Express Graphics Receive Lane 3 Positive PCI Express Graphics Receive Lane 3 Negative Reserved
Reserved
PCI Express Graphics Receive Lane 4 Positive PCI Express Graphics Receive Lane 4 Negative Reserved
PCI Express Graphics Receive Lane 5 Positive PCI Express Graphics Receive Lane 5 Negative Power Ground
PCI Express Graphics Receive Lane 6 Positive PCI Express Graphics Receive Lane 6 Negative Power Ground
PCI Express Graphics
DP-I
Not connected nc nc
DP-I
DP-I
Not connected nc nc
DP-I
DP-I
DP-I
DP-I
Not connected nc nc
Not connected nc nc-
DP-I
DP-I
Not connected nc nc
DP-I
DP-I
PWR - -
DP-I
DP-I
PWR - -
DP-I
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Pin Signal Description Type Termination Commen
Receive Lane 7 Positive
C75
C76
C77
C78
C79
C80
C81
C82
C83
C84
C85
C86
C87
C88
C89
C90
C91
C92
C93
C94
C95
C96
C97
C98
C99
PEG_RX7-
GND (Fixed) RSVD
PEG_RX8+
PEG_RX8-
GND (Fixed) PEG_RX9+
PEG_RX9-
RSVD
GND PEG_RX10+
PEG_RX10-
GND PEG_RX11+
PEG_RX11-
GND (Fixed) PEG_RX12+
PEG_RX12-
GND PEG_RX13+
PEG_RX13-
GND RSVD
PEG_RX14+
PEG_RX14-
PCI Express Graphics Receive Lane 7 Negative Power Ground PWR - -
Reserved
PCI Express Graphics Receive Lane 8 Positive PCI Express Graphics Receive Lane 8 Negative Power Ground
PCI Express Graphics Receive Lane 9 Positive PCI Express Graphics Receive Lane 9 Negative Reserved
Power Ground PWR - -
PCI Express Graphics Receive Lane 10 Positive PCI Express Graphics Receive Lane 10 Negative Power Ground PWR - -
PCI Express Graphics Receive Lane 11 Positive PCI Express Graphics Receive Lane 11 Negative Power Ground
PCI Express Graphics Receive Lane 12 Positive PCI Express Graphics Receive Lane 12 Negative Power Ground PWR - -
PCI Express Graphics Receive Lane 13 Positive PCI Express Graphics Receive Lane 13 Negative Power Ground PWR - -
Reserved
PCI Express Graphics Receive Lane 14 Positive PCI Express Graphics
DP-I
Not connected nc nc
DP-I
DP-I
PWR - -
DP-I
DP-I
Not connected nc nc
DP-I
DP-I
DP-I
DP-I
PWR - -
DP-I
DP-I
DP-I
DP-I
Not connected nc nc
DP-I
DP-I
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Pin Signal Description Type Termination Commen
Receive Lane 14 Negative
C100
C101
C102
C103
C104
C105
C106
C107
C108
C109
C110
GND (Fixed) PEG_RX15+
PEG_RX15-
GND VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (Fixed)
Power Ground PWR - -
PCI Express Graphics Receive Lane 15 Positive PCI Express Graphics Receive Lane 15 Negative Power Ground PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR 8 - -
12V VCC PWR - -
Power Ground PWR - -
DP-I
DP-I
NOTE: The termination resistors in this table are already mounted on the microETXexpress® board. Refer to the
PICMG COM Express® Design Guide for information about additional termination resistors.
Table 5: Connector X1B - Row D
Pin Signal Description Type Termination Commen
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
GND (Fixed) GND USB_SSTX0-
USB_SSTX0+
GND USB_SSTX1-
USB_SSTX1+
GND USB_SSTX2-
USB_SSTX2+
GND (Fixed) USB_SSTX3-
USB_SSTX3+
GND
Power Ground PWR - -
Power Ground PWR - -
SuperSpeed USB Data Transmit Path 0­SuperSpeed USB Data Transmit Path 0+ Power Ground PWR - -
SuperSpeed USB Data Transmit Path 1­SuperSpeed USB Data Transmit Path 1+ Power Ground PWR - -
SuperSpeed USB Data Transmit Path 2­SuperSpeed USB Data Transmit Path 2+ Power Ground PWR - -
SuperSpeed USB Data Transmit Path 3­SuperSpeed USB Data Transmit Path 3+ Power Ground PWR - -
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
Not connected nc nc
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Pin Signal Description Type Termination Commen
D15
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
D32
D33
D34
D35
D36
D37
D38
D39
D40
D41
D42
D43
DDI1_CTRLCLK_AUX+ DDI1_CTRLDATA_AUX-
RSVD RSVD PCIE_TX6+
PCIE_TX6-
GND (Fixed) PCIE_TX7+
PCIE_TX7-
RSVD RSVD DDI1_PAIR0+
DDI1_PAIR0-
RSVD DDI1_PAIR1+
DDI1_PAIR1-
GND (FIXED) DDI1_PAIR2+
DDI1_PAIR2-
DDI1_DDC_AUX_SEL
RSVD DDI1_PAIR3+
DDI1_PAIR3-
RSVD DDI2_PAIR0+
DDI2_PAIR0-
GND (FIXED) DDI2_PAIR1+
DDI2_PAIR1-
HDMI/DVI I2C CRTLCLK I/O-3.3 - -
HDMI/DVI I2C CRTLDATA Reserved Not connected nc nc
Reserved Not connected nc nc
PCI Express Differential Transmit Pair 6+ PCI Express Differential Transmit Pair 6­Power Ground PWR - -
PCI Express Differential Transmit Pair 7+ PCI Express Differential Transmit Pair 7­Reserved Not connected nc nc
Reserved Not connected nc nc
Digital Display Interface Digital Display Interface Reserved Not connected nc nc
Digital Display Interface1+ Digital Display Interface1­Power Ground PWR - -
Digital Display Interface2+ Digital Display Interface2­Selects function of DDI CRTL & DATA Aux Reserved
Digital Display Interface3+ Digital Display Interface3­Reserved - - -
Digital Display Interface0+ Digital Display Interface0­Power Ground PWR - -
Digital Display Interface1+ Digital Display Interface1-
I/O-3.3 - -
DP-O
DP-O
Not connected nc nc
Not connected nc nc
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
I-3.3
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
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T
y
Pin Signal Description Type Termination Commen
D44
D45
D46
D47
D48
D49
D50
D51
D52
D53
D54
D55
D56
D57
D58
D59
D60
D61
D62
D63
D64
D65
DDI2_HPD
RSVD DDI2_PAIR2+
DDI2_PAIR2-
RSVD DDI2_PAIR3+
DDI2_PAIR3-
GND (Fixed) PEG_TX0+
PEG_TX0-
PEG_LANE_RV#
PEG_TX1+
PEG_TX1-
TYPE2#
PEG_TX2+
PEG_TX2-
GND (Fixed) PEG_TX3+
PEG_TX3-
RSVD RSVD PEG_TX4+
Digital Display Interface Hot-Plug Detect Reserved Not connected nc nc
Digital Display Interface2+ Digital Display Interface2­Reserved Not connected nc nc
Digital Display Interface3+ Digital Display Interface3­Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 0 Positive PCI Express Graphics Transmit Data Lane 0 Negative PCI Express Graphics Lane Reversal Input strap PCI Express Graphics Transmit Data Lane 1 Positive PCI Express Graphics Transmit Data Lane 1 Negative Not connected for 6 module PCI Express Graphics Transmit Data Lane 2 Positive PCI Express Graphics Transmit Data Lane 2 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 3 Positive PCI Express Graphics Transmit Data Lane 3 Negative Reserved Not connected nc nc
Reserved Not connected nc nc
PCI Express Graphics Transmit Data Lane 4
I-3.3
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
I-3.3
DP-O
DP-O
pe
Not Connected nc nc
DP-O
DP-O
DP-O
DP-O
DP-O
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Pin Signal Description Type Termination Commen
Positive
D66
D67
D68
D69
D70
D71
D72
D73
D74
D75
D76
D77
D78
D79
D80
D81
D82
D83
D84
D85
D86
PEG_TX4-
GND PEG_TX5+
PEG_TX5-
GND (Fixed) PEG_TX6+
PEG_TX6-
GND PEG_TX7+
PEG_TX7-
GND RSVD PEG_TX8+
PEG_TX8-
GND (Fixed) PEG_TX9+
PEG_TX9-
RSVD GND PEG_TX10+
PEG_TX10-
PCI Express Graphics Transmit Data Lane 4 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 5 Positive PCI Express Graphics Transmit Data Lane 5 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 6 Positive PCI Express Graphics Transmit Data Lane 6 Negative Power Ground PWR
PCI Express Graphics Transmit Data Lane 7 Positive PCI Express Graphics Transmit Data Lane 7 Negative Power Ground PWR - -
Reserved Not connected nc nc
PCI Express Graphics Transmit Data Lane 8 Positive PCI Express Graphics Transmit Data Lane 8 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 9 Positive PCI Express Graphics Transmit Data Lane 9 Negative Reserved Not connected nc nc
Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 10 Positive PCI Express Graphics Transmit Data Lane 10 Negative
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O - -
DP-O - -
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
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Pin Signal Description Type Termination Commen
D87
D88
D89
D90
D91
D92
D93
D94
D95
D96
D97
D98
D99
D100
D101
D102
D103
D104
D105
D106
D107
D108
D109
D110
GND PEG_TX11+
PEG_TX11-
GND (Fixed) PEG_TX12+
PEG_TX12-
GND PEG_TX13+
PEG_TX13-
GND RSVD PEG_TX14+
PEG_TX14-
GND (Fixed) PEG_TX15+
PEG_TX15-
GND VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V VCC_12V GND (Fixed)
Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 11 Positive PCI Express Graphics Transmit Data Lane 11 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 12 Positive PCI Express Graphics Transmit Data Lane 12 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 13 Positive PCI Express Graphics Transmit Data Lane 13 Negative Power Ground PWR - -
Reserved -- -- --
PCI Express Graphics Transmit Data Lane 14 Positive PCI Express Graphics Transmit Data Lane 14 Negative Power Ground PWR - -
PCI Express Graphics Transmit Data Lane 15 Positive PCI Express Graphics Transmit Data Lane 15 Negative Power Ground PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
12V VCC PWR - -
Power Ground PWR - -
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
DP-O
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NOTE: The termination resistors in this table are already mounted on the microETXexpress® board. Refer to the
PICMG COM Express® Design Guide for information about additional termination resistors.
Figure 4: Onboard Connectors
To be supplied in a later version
J1 - CPLD Debug
4.1.2 Connector J1 – Fan
J1 is a connector for a fan for 3- or 4-wire fan control. By default, it is set for 3-wire fan control. The 9W APU uETXe­OH SKUs do not require a fan to function fully in the 0°C to 60°temperature range. When active cooling is required, the default population is the 3-wire fan option. See Section 6.3, “Onboard Fan Connector” for more detailed information.
Table 6. J1 Fan Connector Pin-Out
To be supplied in a later version
4.1.3 Connectors J2 and J3 – SO-DIMM DDR3 Memory Sockets
This design supports up to 8 GBytes (single channel, 4 GBytes each) of DDR3 memory.
4.1.4 Connector J5 –JTAG
J5 is a 22-pin flat foil connector (FFC) used to support the AMD Embedded Probe Header interface definition.
NOTE: A cable adapter must be used to connect a Sage debugger tool to the debug connector.
WARNING: The debug port is for internal use only. Do not connect any devices.
Table 7. J5 JTAG Connector Pin-Out
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4.1.5 PCI Express Interface
The PCI Express*1.0 or 2.0 general purpose lanes provide a fast connection interface for many different system devices, such as network controllers, I/O controllers or express card devices. The implementation of this subsystem complies with the ETXexpress® COM Express Specification. Refer to the PICMG COM Express® Design Guide for additional implementation information.
The microETXexpress
®
-OH COM supports up to 6 PCI Express lanes. PCIe lanes 0 – 3 are software-configurable as x4,
x2, or x1. PCIe lanes 4 – 5 are software configurable as x1 or x2. See Table 8 for detailed configuration information.
Table 8: PCI Express Configuration
To be supplied in a later version
4.1.6 USB Interface
The USB interface supports both USB 2.0 and USB 3.0 (new with COM Express Type 6)
USB 2.0 Interface
Eight high speed USB 2.0 ports are brought from the Fusion Control Hub to the COM Express A-B connector. The FCH
employs three EHCI controllers. The eight COM Express USB ports are distributed with two EHCI controllers serving
three COM Express ports each and the third EHCI controller serving the remaining two COM Express ports.
Table 9 shows how the eight USB 2.0 ports are used for USB configuration in the microETXexpress®-OH module.
USB 3.0 Interface
Two super speed USB 3.0 ports can be implemented on COM Express connector A-B USB ports 0 and 1. These two ports
are supported using a Renesas uPD720200A USB 3.0 Host Controller as a PCIe 2.0 to USB 3.0 bridge.
Table 9: USB Configuration
COMexpress™ Port
USB0 N/A USB1 USB 3.0 build option USB1 N/A USB2 USB 3.0 build option USB2 USB14 N/A? USB 2.0 (EHC1) USB3 USB1 N/A? USB 2.0 (EHC2) USB4 USB6 N/A? USB 2.0 (EHC2) USB5 USB11 N/A? USB 2.0 (EHC2) USB6 USB2 N/A? USB 2.0 (EHC3) USB7 USB7 N/A? USB 2.0 (EHC3)
FCH USB 2.0 Port
USB 3.0 Host Controller
Description
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Figure 5 shows the internal USB mapping from the AMD FCH.
Figure 5: USB Mapping
To be supplied in a later version
NOTE: Additional USB connections can be added using external USB hubs.
Configuration
The USB controllers are PCIe bus devices
The BIOS allocates the required system resources during configuration of the PCIe bus.
4.1.7 SATA Interface
Four of the AMD Fusion Control Hub SATA 2.0 channels are routed to the four COM Express SATA channels. The FCH
SATA 0-3 ports ma to the COM Express SATA 0-3 pins.
Configuration
The SATA controller is a PCIe bus device. The BIOS allocates the required system resources during the PCIe device configuration.
4.1.8 Audio Interface
The AMD Fusion Control Hub supports High Definition Audio (HDA). This HD audio configuration supports three audio channels.
Configuration
The audio controller is in the AMD FCH. The BIOS allocates the required system resources during configuration.
4.1.9 Graphics Interface
The microETXexpress®-OH uses a graphics controller that is integrated in the AMD Dual Core CPUThe graphics engine
supports multiple display types (LVDS, single analog VGA, two digital display interfaces –DDI-0 and DDI-1 for DP and
HDMI/DVI-I, DVI-D, HDTV, and CRT), and resolutions up to 2560x1200x60 Hz.
Analog VGA
The analog VGA graphics core, with a maximum resolution of 2560x1600x60Hz, is integrated in the processor and is connected to the Com Express connector A-B.
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LVDS Flat Panel Interface
The AMD Dual Core processor has integrated 18-bit single channel LVDS for WXGA. The processor LVDS channel A is multiplexed to share two outputs; the 18-bit LVDS channel to COM Express LVDS A and a Digital Display Interface (DDI) to COM Express DDI 1
4.1.10 Ethernet Interface
The Ethernet interface on the microETXexpress®-OH COM is the Intel® 82574 GbE Controller. Per the COM Express specification, the LAN magnetics are not on the module.The GbE controller PHY is located close to the COM Express MDI LAN interconnect pins to keep the MDI path short. The controller supports a 10/100/1000 Base-T interface.
The hardware supports either S0 or S5 power under BIOS to support WOL (WakeOnLAN.
For cable lengths and terminations on your baseboard, refer to the PICMG COM Express® Design Guide on the PICMG website.
Configuration
The BIOS allocates the required system resources during the configuration of the device.
4.1.11 SPI Bus Interface
The Serial Peripheral Interface (SPI) signals are connected to the COM Express connector A-B from the AMD Fusion
Controller Hub. SPI BIOS is supported at the maximum level the FCH supports, 16 MBytes. Two BIOS disable straps, as
defined in the COM Express Rev 2.0 specification, allow the selection of either on-module SPI BIOS or carrier board SPI
or LPC BIOS.
The SPI interface can be used to connect two carrier board devices, including external BIOS flash memory. The
implementation of this subsystem complies with the COM Express Rev 2.0 specification. Carrier Board SPI boot support
is new with COM Express Rev 2.0. For additional implementation information, refer to the PICMG COM Express® Design
Guide on the PICMG website
4.1.12 LPC Bus Interface
The Low Pin Count (LPC) interface signals are connected to the AMD Fusion Controller Hub.
WARNING: Connecting more than one device to the LPC bus requires using a clock buffer. Because of the power
management of the LPC bus, you must use great care with clock buffers that require synchronization as they could prevent the board from booting up.
Figure 6: Standard Clock Buffer
To be supplied in a later version
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NOTE: When using a standard clock buffer on the baseboard, be aware that the generated delay must be considered
for the length matching of the layout.
Clock Buffer Reference Schematic
The schematic in Figure 7 shows an implementation example for the clock buffer.
Figure 7: LPC Clock Buffer
To be supplied in a later version
Table 10: LPC Addresses
To be supplied in a later version
Table 11: Device Addresses
To be supplied in a later version
For further details, please refer to the processor and I/O controller hub information on the Intel website at
http://www.intel.com.
4.1.13 Power Control Interface
VCC_12V is allowed to range from 4.75V to 18V. This range is above and beyond the requirements of the COM Express
specification.
Power Good (PWR_OK)
The microETXexpress®-OH COM provides an external input for a power-good signal (pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be sampled as logic high to power on the module.
Power Button (PWRBTN#)
The power button (pin B12) is available through the module connector as defined in the pin-out list.
To power-off the module, press and hold the power button for at least four seconds.
Reset Button (SYS_RESET#)
The reset button (pin B49) is available through the module connector as defined in the pin-out list. The module stays in reset as long as SYS_RESET# is grounded.
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Power Supply
The microETXexpress®-OH COM has a wide range of power inputs, from TBDV to TBDV DC. The supply voltage is applied through TBD pins (VCC) on the module connector. In ATX mode with optional 5V standby voltage, the VCC input must be higher than the standby voltage. RTC power is provided on the VCC RTC pins. VCC_12V may or may not collapse in suspend states S3, S4, S5
ATX Mode / Single Supply Mode
ATX Mode:
TBD
Table 12: ATX Mode
To be supplied in a later version
Single Supply Mode:
Main power is provided on the COM Express VCC_12V pins. Standby power, if needed, is also provided on the VCC_12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the Carrier. RTC power is provided on the VCC_RTC pins
To power on the module from the S5 state, press the power button or reconnect VCC.
Table 13: Single Supply Mode
To be supplied in a later version
4.1.14 Miscellaneous Circuits
Speaker
The implementation of this subsystem complies with the COM Express® Specification. For additional implementation information, refer to the PICMG COM Express® Design Guide.
Battery
The implementation of this subsystem complies with the COM Express® specification. For additional implementation information, refer to the PICMG COM Express® Design Guide on the PICMG website.
The COM Express® Rev 2.0 specificationrequires the carrier board and the module to have two current-limiting devices (resistor and diode) between the battery and the consuming component.
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2
I
C Bus
The I2C bus implementation suppports on- and off-module use. I2C is configured to use one of the SMBus ports on the
2
Fusion Controller Hub. The I
C implementation is an I2C master with 7- bit I2C addressing, capable of 100 KHz or 400
KHz operation.
2
COM Express Rev 2 specifies I
module. The microETXe-OH module I
For additional information, refer to the PICMG COM Express® Design Guide on the PICMG website and I
C on the standby rail now, so in the S5 state a carrier board I2C master can query the
2
C bus is multi-master capable.
2
C application
notes, which are available on the Kontron website at http://emdcustomersection.kontron.com/.
See the Chapter 8, “BIOS Operation” for supported I
2
C features.
SMBus
System Management Bus (SMBus) signals are connected to the SMBus controller, which is located on the AMD Fusion Controller Hub. The SMBus is a 2-wire bi-directional bus (clock and serial data) used for system management tasks such as reading parameters from a memory card or reading temperatures and voltages of system components.
The SMBus uses the same signaling scheme as the I
The implementation complies with the COM Express® specification. For additional implementation information, refer to the PICMG COM Express® Design Guide on the PICMG website
2
C bus.
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5 Special Features
5.1 Parallel Processing
TBD
5.2 Watchdog
The implementation complies with the COM Express® specification. Timer modes 1, 2, and 3 are supported. For additional implementation information, refer to the PICMG COM Express® Design Guide on the PICMG website
5.3 General Purpose Input and Output (GPIO)
The microETXexpress®-OH COM provides four interrupt-capable general purpose inputs and four general purpose outputs that can be accessed through the module connector described in the pin-out lists, in Section 4.1. The GPIO interface can be enabled in the BIOS setup.
Table 14: GPIO COM Express Pin-Outs
Bit of GPIO Port0 Function COM Express Pin
0 GPI0 A54 1 GPI1 A63 2 GPI2 A67 3 GPI3 A85 4 GPO0 A93 5 GPO1 B54 6 GPO2 B57 7 GPO3 B63
5.4 Fast I
TBD
2
C
5.5 ACPI Suspend Modes and Resume Events
The microETXexpress®-OH COM supports the following suspend modes:
» S0 (Normal on) » S3 (Suspend to RAM) » S4 (Suspend to Disk) » S5 /WOL(soft-off, WOL enabled) » S5 (soft-off, WOL disabled)
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» S5 ECO deep soft-off
NOTE: The S5 ECO state is an ultra low power state in which the module power draw from the available supplies
(VCC_12V and/or optional VCC_5V_SBY) is under TBD mW.
In addition to these Suspend modes, all AMD defined ‘C’ states for power savings are supported.
Events that Resume the System from S3
» USB keyboard (1) » USB mouse (1) » Power button » WakeOnLan (2)
Events that Resume the System from S4/S5
» Power button » WakeOnLan
NOTES: 1) The OS must support wake-up via USB devices and the baseboard must power the USB port with StandBy-
Voltage
2) WakeOnLan must be enabled in the driver options.
3) Wake from S5 ECO is enabled “on” by the power button.
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6 Design Considerations
6.1 Thermal Management
A heat spreader plate (TBD) assembly is available from Kontron Embedded Modules for the microETXexpress®-OH COM. The heat spreader plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to be used with a heat sink or other cooling device.
External cooling must be provided to maintain the heat spreader plate at proper operating temperatures. Under worst-case conditions, the cooling mechanism must maintain an ambient air and heat spreader plate temperature of 60° C or less.
The aluminum slugs and thermal pads on the underside of the heat spreader assembly implement thermal interfaces between the heat spreader plate and the major heat-generating components on the microETXexpress®-OH. About 80 percent of the power dissipated within the module is conducted to the heat spreader plate and can be removed by the cooling solution.
Kontron also has defined a passive heat sink (TBD) that can be used in place of the heat spreader plate to provide additional cooling. You can use many thermal-management solutions with the heat spreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the COM Express® application and environmental conditions and the module is fully functional at the full -40C to +85C temperature even without the heat spreader plate or the passive heat sink. Drawings for both the heat spreader plate and the passive heat sink are available on request. Also, see the PICMG COM Express® Design Guide on the PICMG website for further information about thermal management.
6.2 Heat Spreader Dimensions
Documentation for the microETXexpress®-OH COM heat spreader and cooling solutions is provided at
http://emdcustomersection.kontron.com.
6.3 Onboard Fan Connector
The 3-pin fan connector supports 3-wire fan control for modules that require active cooling. The default population is the 3-wire fan option.
Figure 8: Fan Connector (J1) Location and Pin-Out
To be supplied in a later version
The onboard fan connector (J1) is on the right top side of the PCB. The connection details are covered in the Figure 9 schematic.
Table 15. Fan Connector (J1) Pin-Out
Pin Description
1 Sense
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2 Power 12V 3 GND
Figure 9: Fan Connector Schematic
To be supplied in a later version
» Part number: (Molex) J8: 53261-0371 » » Mates with: 51021-0300 » » Crimp terminals: 50079-8100
6.3.1 Fan Connector Electrical Characteristics
The fan connector supply pin is connected to a PWM made directly from the VCC_12V supply from the COM Express connector
CAUTION: Be aware of the wide range input voltage and acceptable fan voltage).
The maximum current supported on that output is 125mA @ 60°C ambient because it is current limited by a resettable fuse. The voltage is not limited to +12V on this pin.
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7 System Resources
7.1 Interrupt Request (IRQ) Lines
Table 16: TBD Mode
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Table 17: TBD Mode
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7.2 Memory Area
To be supplied in a later version.
7.3 I/O Address Map
To be supplied in a later version.
Kontron microETXexpress-OH User’s Guide
Table 18: I/O Address Assignments
To be supplied in a later version
7.4 Peripheral Component Interconnect (PCI) Devices
All devices follow the PCI Express Base 1.0a specifications. The BIOS and OS control memory and I/O resources.
Table 19: PCI Device IRQs
To be supplied in a later version
7.5 System Management Bus (SMBus)
Table 20: SMBus Address Assignments
To be supplied in a later version
7.6 K-Station Resources
Table 21: I2C
To be supplied in a later version
41
Table 22: Storage
To be supplied in a later version
Table 23: GPIO
To be supplied in a later version
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Table 24: Hardware Monitor
Sensor Function
Temp 0
Temp 1 Module temperature (internal IC temperature of onboard
FAN 0
Voltage 0
Voltage 1
Voltage 2
CPU ACPI temperature (measured with Nuvoton
NCT5577D SIO HWM)
ADT7476 HWM) Module CPU fan sensor (measured with NCT5577D SIO
HWM)
Nuvoton NCT5577D SIO Voltage Sensor 0: CoreA Nuvoton NCT5577D SIO Voltage Sensor 1: VRAM Nuvoton NCT5577D SIO Voltage Sensor 2: +3.3V
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8 BIOS Operation
8.1 Determining the BIOS Version
To be supplied in a later version
8.2 Setup Guide
The AMIBIOS Setup Utility changes system behavior by modifying the BIOS configuration. The setup program uses a number of menus to make changes and turn features on or off.
NOTE: Selecting incorrect values may cause system boot failure. Load setup default values to recover by pressing
<F9>.
8.2.1 Start AMIBIOS
To start the AMIBIOS® setup utility, press <DEL> when the following string appears during boot-up:
Press <DEL> to enter Setup
The Info menu then appears.
The Setup screen has several sections:
Setup Screen Location Function
Menu Bar Top Lists and selects all top level menus. Legend Bar Right side bottom Lists setup navigation keys. Item Specific Help Window Right side top Help for selected item. Menu Window Left center Selection fields for current menu.
®
8 Setup Utility
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Menu Bar
The menu bar at the top of the window lists different menus. Use the arrow key or the arrow key to make a selection.
Legend Bar
Use the keys listed on the bottom of the legend bar to make your selections or exit the current menu. The table below describes the legend keys and their alternates.
Key Function
<F1> or <Alt-H> General Help window. <Esc> Exit menu.
or Arrow key or Arrow key
<Home> or <End> Move cursor to top or bottom of current window. <PgUp> or <PgDn> Move cursor to next or previous page. <F9> Load the default configuration values for this menu. <F10> Save and exit. <Enter> Execute command or select submenu. <Alt-R> Refresh screen.
Select a menu.
Select fields in current menu.
Selecting an Item
Use the or key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The Save Value commands in the Exit menu save the values displayed in all the menus.
Displaying Submenus
Use the arrow key or the arrow key to move the cursor to the submenu you want and then press <Enter>. A pointer () marks all submenus.
Item Specific Help Window
The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the cursor through each field.
General Help Window
Pressing <F1> or <Alt-F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press <Esc> to exit the General Help window.
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8.3 BIOS Setup
This whole section to be supplied in a later version
8.3.1 Main Menu
8.3.2 Advanced Settings Menu
8.3.3 PCIPnP Settings
8.3.4 Boot Settings
8.3.5 Hard Disk Drives
Kontron microETXexpress-OH User’s Guide
8.3.6 Security Settings
8.3.7 Chipset Settings
8.3.8 Exit Options
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9 Appendix B: Architecture Information
The following sources of information can help you better understand PC architecture.
9.1 Buses
9.1.1 ISA, Standard PS/2 – Connectors
» AT Bus Design: Eight and Sixteen-Bit ISA, E-ISA and EISA Design, Edward Solari, Annabooks, 1990, ISBN 0-
929392-08-6
» AT IBM Technical Reference Vol. 1 and 2, 1985 » ISA and EISA Theory and Operation, Edward Solari, Annabooks, 1992, ISBN 0929392159 » ISA Bus Specifications and Application Notes, Jan. 30, 1990, Intel » ISA System Architecture, Third Edition, Tom Shanley and Don Anderson, Addison-Wesley Publishing Company,
1995, ISBN 0-201-40996-8
» Personal Computer Bus Standard P996, Draft D2.00, Jan. 18, 1990, IEEE Inc » Technical Reference Guide, Extended Industry Standard Architecture Expansion Bus, Compaq 1989
9.1.2 PCI/104
» Embedded PC 104 Consortium
The consortium provides information about PC/104 and PC/104-Plus technology. You can search for information about the consortium on the Web.
» PCI SIG
The PCI-SIG provides a forum for its ~900 member companies, who develop PCI products based on the specifications that are created by the PCI-SIG. You can search for information about the SIG on the Web.
» PCI and PCI-X Hardware and Software Architecture and Design, Fifth Edition, Edward Solari and George Willse,
Annabooks, 2001, ISBN 0-929392-63-9.
» PCI System Architecture, Tom Shanley and Don Anderson, Addison-Wesley, 2000, ISBN 0-201-30974-2.
9.2 General PC Architecture
» Embedded PCs, MarktandTechnik GmbH, ISBN 3-8272-5314-4 (German) » Hardware Bible, Winn L. Rosch, SAMS, 1997, 0-672-30954-8 » Interfacing to the IBM Personal Computer, Second Edition, Lewis C. Eggebrecht, SAMS, 1990, ISBN 0-672-22722-
3
» The Indispensable PC Hardware Book, Hans-Peter Messmer, Addison-Wesley, 1994, ISBN 0-201-62424-9 » The PC Handbook: For Engineers, Programmers, and Other Serious PC Users, Sixth Edition, John P. Choisser and
John O. Foster, Annabooks, 1997, ISBN 0-929392-36-1
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9.3 Ports
9.3.1 RS-232 Serial
» EIA232E standard
The EIA-232-E standard specifies the interface between (for example) a modem and a computer so that they can exchange data. The computer can then send data to the modem, which then sends the data over a telephone line. The data that the modem receives from the telephone line can then be sent to the computer. You can search for information about the standard on the Web.
» RS-232 Made Easy: Connecting Computers, Printers, Terminals, and Modems, Martin D. Seyer, Prentice Hall, 1991,
ISBN 0-13-749854-3
» National Semiconductor: The Interface Data Book includes application notes. Type “232” as search criteria to
obtain a list of application notes. You can search for information about the data book on National Semiconductor’s Web site.
9.3.2 Serial ATA
» Serial AT Attachment (ATA) Working Group
This X3T10 standard defines an integrated bus interface between disk drives and host processors. It provides a common point of attachment for systems manufacturers and the system. You can search for information about the working group on the Web. We recommend you also search the Web for information on 4.2 I/O cable, if you use hard disks in a DMA3 or PIO4 mode.
9.3.3 USB
» USB Specification
USB Implementers Forum, Inc. is a non-profit corporation founded by the group of companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a support organization and forum for the advancement and adoption of Universal Serial Bus technology. You can search for information about the standard on the Web.
9.4 Programming
» C Programmer’s Guide to Serial Communications, Second Edition, Joe Campbell, SAMS, 1987, ISBN 0-672-22584-
0
» Programmer’s Guide to the EGA, VGA, and Super VGA Cards, Third Edition, Richard Ferraro, Addison-Wesley, 1990,
ISBN 0-201-57025-4
» The Programmer’s PC Sourcebook, Second Edition, Thom Hogan, Microsoft Press, 1991, ISBN 1-55615-321-X » Undocumented PC, A Programmer’s Guide to I/O, CPUs, and Fixed Memory Areas, Frank van Gilluwe, Second
Edition, Addison-Wesley, 1997, ISBN 0-201-47950-8
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10 Appendix C: Document Revision History
Revision Date Changes
0.5 07-04-11 Initial review draft
0.65 16-06-11 Updated with first review changes
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Corporate Offices
Europe, Middle East and Africa
Oskar-von-Miller-Str. 1 85386 Eching/Munich Germany Tel.: +49 (0)8165/ 77 777 Fax: +49 (0)8165/ 77 219
info@kontron.com
North America
14118 Stowe Drive Poway, CA 92064-7147 USA Tel.: +1 888 294 4558 Fax: +1 858 677 0898
info@us.kontron.com
Asia Pacific
17 Building, Block #1, ABP. 188 Southern West 4th Ring Beijing 100070, P.R.China Tel.: + 86 10 63751188 Fax: + 86 10 83682438
info@kontron.cn
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