Kontron ETX-LX User Manual

Kontron User's Guide

ETX®-LX

Document Revision 1.20

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Table of Contents

Kontron User's Guide ETX®-LX

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Table of Contents

1 User Information ........................................................................................................ 7

1.1 About This Document ......................................................................................... 7

1.2 Copyright Notice ............................................................................................... 7

1.3 Trademarks ...................................................................................................... 7

1.4 Standards ........................................................................................................ 7

1.5 Warranty ......................................................................................................... 7

1.6 Technical Support .............................................................................................. 8

2 Introduction .............................................................................................................. 9

2.1 ETX®-LX .......................................................................................................... 9

2.2 ETX® Documentation ......................................................................................... 9

2.3 ETX® Benefits ................................................................................................... 9

3 Specifications ........................................................................................................... 11

3.1 Functional Specifications .................................................................................. 11

3.2 Mechanical Specifications ................................................................................. 13

3.2.1 Module dimensions .......................................................................................... 13

3.3 Memory ......................................................................................................... 13

3.4 Electrical Specifications .................................................................................... 13

3.4.1 Supply Voltage ................................................................................................ 13

3.4.2 Supply Voltage Ripple ...................................................................................... 13

3.4.3 Supply Current 5 V_SB ...................................................................................... 13

3.4.4 Supply Current ................................................................................................ 14

3.4.5 CMOS Battery Power Consumption ...................................................................... 14

3.5 Environmental Specifications ............................................................................ 15

3.5.1 Temperature ................................................................................................... 15

3.5.2 Humidity ....................................................................................................... 15

3.6 MTBF ............................................................................................................. 15

4 Connector X1 Subsystems ........................................................................................... 16

4.1 PCI Bus .......................................................................................................... 16

4.2 USB .............................................................................................................. 16

4.3 Audio ............................................................................................................ 16

4.4 Serial IRQ ...................................................................................................... 16

4.5 3.3V Power Supply for External Components ......................................................... 16

5 Connector X2 Subsystems ........................................................................................... 18

5.1 ISA Bus Slot ................................................................................................... 18

6 Connector X3 Subsystems ........................................................................................... 19

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6.1 VGA Output .................................................................................................... 19

6.2 LVDS Flat Panel Interface (JILI) .......................................................................... 20

6.3 Digital Flat Panel Interface (JIDI) ....................................................................... 20

6.4 Serial Ports (1 and 2) ....................................................................................... 20

6.5 PS/2 Keyboard ................................................................................................ 20

6.6 PS/2 Mouse .................................................................................................... 20

6.7 IrDA .............................................................................................................. 21

6.8 Parallel Port ................................................................................................... 21

6.9 Floppy ........................................................................................................... 21

7 Connector X4 Subsystems ........................................................................................... 22

7.1 IDE Ports ....................................................................................................... 22

7.2 Ethernet ........................................................................................................ 22

7.3 Power Control ................................................................................................. 22

7.3.1 Power Good / Reset Input ................................................................................. 22

7.4 Power Management ......................................................................................... 22

7.4.1 ATX PS Control ................................................................................................ 22

7.5 Miscellaneous Circuits ...................................................................................... 23

7.5.1 Speaker ......................................................................................................... 23

7.5.2 Battery .......................................................................................................... 23

7.5.3 I2C Bus .......................................................................................................... 23

7.5.4 SM Bus .......................................................................................................... 23

8 Special Features ........................................................................................................ 24

8.1 Watchdog Timer .............................................................................................. 24

8.2 SATA ............................................................................................................. 25

9 Design Considerations ................................................................................................ 26

9.1 Thermal Management ....................................................................................... 26

9.2 Module Dimensions ......................................................................................... 27

Appendix A: block diagram ........................................................................................... 28

10 Appendix B: System Resources .................................................................................... 29

10.1 Interrupt Request (IRQ) Lines ............................................................................ 29

10.2 Direct Memory Access (DMA) Channels ................................................................. 29

10.3 Memory Area .................................................................................................. 30

10.4 I/O Address Map ............................................................................................. 30

10.5 Peripheral Component Interconnect (PCI) Devices ................................................. 31

10.6 Inter-IC (I2C) Bus ............................................................................................ 31

10.7 System Management (SM) Bus ........................................................................... 31

10.8 JILI-I2C Bus .................................................................................................... 31

11 Appendix C: BIOS Operation ........................................................................................ 32

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11.1 Overview........................................................................................................ 32

11.2 Determining the BIOS Version ............................................................................ 32

11.3 Setup Guide ................................................................................................... 32

11.3.1 Starting the BIOS Setup Utility ........................................................................... 32

11.4 Main Menu ..................................................................................................... 32

11.4.1 Setup Items ................................................................................................... 33

11.5 Standard CMOS Features ................................................................................... 35

11.5.1 Primary Master and Slave Submenu ..................................................................... 36

11.6 Advanced BIOS Features ................................................................................... 37

11.7 Advanced Chipset Features ................................................................................ 39

11.8 Integrated Peripherals ..................................................................................... 41

11.9 Power Management Setup ................................................................................. 44

11.9.1 IRQ Wakeup Events .......................................................................................... 45

11.10 PnP/PCI Configurations .................................................................................... 46

11.11 PC Health Status ............................................................................................. 47

11.12 Load Fail-Safe Defaults ..................................................................................... 47

11.13 Load Optimized Defaults ................................................................................... 47

11.14 Supervisor/User Password Setting ...................................................................... 47

11.15 Exit Selection ................................................................................................. 48

12 Appendix D: ETX® Connector Pinouts ............................................................................ 49

12.1 Connector Locations ........................................................................................ 49

12.2 Signal Description ........................................................................................... 50

12.3 Connector X1 (PCI Bus, USB, Audio) .................................................................... 50

12.3.1 Connector X1 (Signal Levels) ............................................................................. 51

12.4 Connector X2 (ISA Bus) .................................................................................... 53

12.4.1 Connector X2 (Signal Levels) ............................................................................. 54

12.5 Connector X3 (VGA, LVDS, TTL, COM1 and COM2, LPT/Floppy, Mouse, Keyboard) ........... 56

12.5.1 Flat-Panel Interfaces ........................................................................................ 56

12.5.2 Parallel Port / Floppy Interfaces ......................................................................... 57

12.5.3 Connector X3 (Signal Levels) ............................................................................. 58

12.6 Connector X4 (IDE 1, IDE 2, Ethernet, Miscellaneous) ............................................. 60

12.6.1 Connector X4 (Signal Levels) ............................................................................. 61

12.7 Serial ATA connectors ....................................................................................... 63

12.8 Compact Flash Socket ....................................................................................... 64

12.8.1 Compact Flash Socket pinout ............................................................................. 64

13 Appendix F: Limitations ............................................................................................. 65

13.1 BIOS Limitations ............................................................................................. 65

13.2 Limitations of hardware revision CE B.3.x (18027-0000-

50-0 / 18027-0000-50-1) ................................................................................. 65

13.3 Limitations of hardware revision CE 2.x.x/3.x.x/4.x.x (180027-

0000-50-4 / 18027-0000-50-5) ......................................................................... 65

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13.4 Workaround for drop in supply voltage in AT/single supply mode .............................. 66

14 Appendix E: JIDA Standard .......................................................................................... 67

14.1 JIDA Information ............................................................................................ 67

15 Appendix F: PC Architecture Information ...................................................................... 68

15.1 Buses ............................................................................................................ 68

15.1.1 ISA, Standard PS/2 – Connectors ........................................................................ 68

15.1.2 PCI/104 ......................................................................................................... 68

15.2 General PC Architecture .................................................................................... 68

15.3 Ports ............................................................................................................. 69

15.3.1 RS-232 Serial ................................................................................................. 69

15.3.2 Serial ATA ...................................................................................................... 69

15.3.3 USB .............................................................................................................. 69

15.4 Programming ................................................................................................. 69

16 Appendix G: Document-Revision History ....................................................................... 71

1 User Information

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1 User Information

1.1 About This Document

This document provides information about products from Kontron Embedded Modules GmbH and/or its
subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is
supplied ―as-is‖ and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2007 Kontron Embedded Modules GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language or computer language, in any form or by any means
(electronic, mechanical, photocopying, recording, or otherwise), without the express written permission
of Kontron Embedded Modules GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are
trademarks or registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or
registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business
Machines Corp.

Microsoft is a registered trademark of Microsoft Corp.

Intel is a registered trademark of Intel Corp.

All other products and trademarks mentioned in this manual are trademarks of their
respective owners.

1.4 Standards

Kontron Embedded Modules GmbH is certified to ISO 9000 standards.

1.5 Warranty

This Kontron Embedded Modules GmbH product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During the warranty period, Kontron
Embedded Modules GmbH will at its discretion decide to repair or replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are
observed.

1 User Information

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The warranty does not apply to defects resulting from improper or inadequate maintenance or handling

Asia

Europe

North/South America

Kontron Asia Inc.

Kontron Embedded Modules GmbH

Kontron America

4F, No.415, Ti-Ding Blvd., NeiHu

District,

Taipei 114, Taiwan

Brunnwiesenstr. 16

94469 Deggendorf – Germany

14118 Stowe Drive

Poway, CA 92064-7147

Tel: [phone]

Tel: [phone]

Tel: [phone]

Fax: + 886 2 2799 7399

Fax: [phone]

Fax: [phone]

mailto:[e-mail]

mailto:[e-mail]

mailto:[e-mail]

by the buyer, unauthorized modification or misuse, operation outside of the product‘s environmental

specifications or improper installation or maintenance.

Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products
not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded
Modules GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available
for technical support. We are committed to making our product easy to use and will help you use our
products in your systems.

Before contacting Kontron Embedded Modules GmbH technical support, please consult our Web site at
http://www.kontron-emea.com/emd for the latest product documentation, utilities, and drivers. If the
information does not help solve the problem, contact us by telephone or email.

2 Introduction

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2 Introduction

2.1 ETX®-LX

The ETX®-LX is an ETX® (Embedded Technology eXtended) form factor computer-on-module combining
the extremely low power consumption and high performance of the AMD Geode™ LX 800 Processor with
integrated Northbridge and the AMD CS5536 Companion Device. The LX 800 features a 128KB L2 Cache
and supports DDR400 SODIMM up to 1024 MB.

The ETX®-LX is fully compliant with the ETX® Component SBC™ Specification V3.0. This computer-on-
module features a 32-bit/33MHz PCI Bus Interface, IDE, serial ports, parallel port, Ethernet, Compact
Flash, USB v2.0, LVDS panel support, keyboard/mouse and AC‘97 audio. The flexibility of the ETX®
computer-on-module concept allows the baseboard designer to optimize how each of these functions is
physically implemented.

2.2 ETX® Documentation

This product manual serves as one of three principal references for an ETX® design. It documents the
specifications and features of ETX®-LX modules. The other two references, which are available from the
Kontron Web site, include:

The ETX® Specification defines the ETX® module form factor, pin out, and signals. You should read this
first.

The ETX® Design Guide serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a range of ETX® modules.

2.3 ETX® Benefits

Embedded technology extended (ETX®) modules are very compact (~100mm square, 12mm thick),
highly integrated computers. All ETX® modules feature a standardized form factor and a standardized
connector layout that carry a specified set of signals. This standardization allows designers to create a
single-system baseboard that can accept present and future ETX® modules.

ETX® modules include common personal computer (PC) peripheral functions such as:

Graphics

Parallel, Serial, and USB ports

Keyboard/mouse

Ethernet

Sound

IDE

The baseboard designer can optimize exactly how each of these functions implements physically.
Designers can place connectors precisely where needed for the application on a baseboard designed to
optimally fit a system‘s packaging.

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Peripheral PCI or ISA buses can be implemented directly on the baseboard rather than on mechanically
unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one
plug-in component simplifies packaging, eliminates cabling, and significantly reduces system-level cost.

A single baseboard design can use a range of ETX® modules. This flexibility can differentiate products at
various price/performance points, or to design future proof systems that have a built-in upgrade path.
The modularity of an ETX® solution also ensures against obsolescence as computer technology evolves.
A properly designed ETX® baseboard can work with several successive generations of ETX® modules.

An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

3 Specifications

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3 Specifications

3.1 Functional Specifications

Processor & Northbridge: AMD Geode™ LX 800 @ 500MHz

AMD Geode™ LX 800 CPU, operates from 200MHz up to 500MHz

Cache: 64KB-I /64KB-D Cache, 128KB L2 Cache

MMX and 3DNow

GeodeLink™ Control Processor, Interface Units, Memory Controller, PCI Bridge

PCI 2.2 compliant 33 MHz operation

Memory: One unbuffered DDR 266/333/400 DDR SODIMM up to 1024MB

PCI Bus: 32-bit/33MHz 4 PCI Masters (3,3V only)

Onboard video graphics array (VGA): Integrated in LX 800

CRT: 1920x1440x8bpp at 60Hz, 1600x1200x16bpp at 72Hz

One channel LVDS 87.5MHz with LVDS Transmitter NS DS90C385A

LVDS: 1x24bpp (open LDI) or 1x18bpp

TFT Resolution up to 1024x768 with LVDS variant and 1600x1200 with TTL variant

Real-Time Clock (RTC) with CMOS RAM

Power Management Controller — ACPI v2.0 compliant

Southbridge: AMD CS5536 Companion Device

Primary IDE: 1 Channel UDMA-66/100 IDE port

Universal Serial Bus (USB): 4x USB 2.0

USB 1.1 supported by one OHCI-based host controller

USB 2.0 supported by one EHCI-based host controller

Audio Codec ‗97 (AC‘97) Controller

System Management Bus (SMB) Controller

LPC Bus

Watchdog Timer (WDT)

ISA Bus: Fintek LPC to ISA Bridge F85226FG

Supports only 8/2x8 bit memory, I/O, IRQ slave feature

PCI to SATA Controller: VIA VT6421A

2 Channels Serial ATA Spec. Rev. 1.0, up to 150 MB/s per channel

Secondary IDE: 1 Channel UDMA-66/100/133 IDE port

Onboard Compact Flash socket (Master on secondary IDE)

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Super I/O: Winbond W83627HF LPC Super I/O

Serial Ports (COM1 and COM2)

Two high-speed 16550 compatible UARTs with 16-byte send/receive FIFOs

Transistor-to-transistor (TTL) signals only

Infrared Device Association (IrDA) 1.0 SIR interface

Parallel Port (LPT1) - Shared with floppy signals: Enhanced Parallel Port (EPP) and
Extended Capabilities Port (ECP) with bi-directional capability

Floppy - shared with LPT signals: 360K/720K/1.2M/1.44M/2.88M format; 250K,
300K, 500K, 1M, 2M bps data transfer rate

IrDA version 1.0 SIR protocol

PS/2 Keyboard and Mouse

Onboard Ethernet: Intel® 82551ER

10BASE-T/100BASE-T LAN

Audio: Realtek ALC203

16-bit, full-duplex AC'97 Rev. 2.3 compatible audio CODEC

BIOS: Award, 512KB Flash BIOS

BIOS support for external super I/O (COM3, COM4, LPT, and Floppy)

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3.2 Mechanical Specifications

3.2.1 Module dimensions

95.0 mm x 114.0 mm (3.75‖ x 4.5‖)

Height approx. 10 mm (0.4‖)

3.3 Memory

The maximum recommended height of a memory module is 2.8mm. SO-DIMM DDR
memory modules not following this specification may cause mounting problems and
contact the heatspreader and/or the LPCtoISA Bridge

Recommended memory:

256MB: Part No. 97007-2560-00-0MLX
512MB: Part No. 97007-5120-00-0MLX
1024MB: Part No. 97007-1024-00-0MLX

3.4 Electrical Specifications

3.4.1 Supply Voltage

5V DC +/- 5%

3.4.2 Supply Voltage Ripple

Maximum 100 mV peak to peak 0 – 20 MHz

3.4.3 Supply Current 5 V_SB

Typical 100 mA, peak 250 mA

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3.4.4 Supply Current

CPU Clock

500MHz

Mode

Prompt

Standby

Suspend

Power

Consumption

1.48 A

7,38 W

1,28 A

6,43 W

1,28 A
6,43 W

CPU Clock

500MHz

Mode

Full Load

Idle

Standby S1

Standby S3

Power

Consumption

1.52 A
7,58 W

1,26 A

6,50 W

0,96 A
5,00 W

0,35 W

RTC

Voltage

Current

Winbond W83627HF

2.5V

1.6 µA

3.0V

2.7 µA

Power-consumption tests were executed under DOS and WindowsXP with 512MB of RAM.

DOS:

Windows XP:

3.4.5 CMOS Battery Power Consumption

CMOS battery power consumption was measured with an ETX®-LX module on a standard Kontron ETX®
evaluation board. The system was turned off and the battery was removed from the evaluation board.
The 2.5 V or 3.0 V of power was supplied from a DC power supply. Do not use these values to calculate the
CMOS battery lifetime.

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3.5 Environmental Specifications

3.5.1 Temperature

Operating: (with Kontron Embedded Modules GmbH heat-spreader plate assembly):

Ambient temperature: 0 to +60 C

Maximum Heatspreader-plate temperature: 0 to +60 C (*)

Non-operating: -30 to +85 C

See the Thermal Management chapter for additional information.

Note: *The maximum operating temperature with the Heatspreader plate is the maximum measurable temperature

on any spot on the Heatspreader’s surface. You must maintain the temperature according to the above
specification.

3.5.2 Humidity

Operating: 10% to 90% (non condensing)

Non operating: 5% to 95% (non condensing)

3.6 MTBF

The following MTBF (Mean Time between Failure) values were calculated using a combination of

manufacturer‘s test data, if the data was available, and a Bellcore calculation for the remaining parts.
The Bellcore calculation used is ―Method 1 Case 1‖. In that particular method the components are

assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is
assumed to have not been burned in. Manufacturer‘s data has been used wherever possible. The

manufacturer‘s data, when used, is specified at 50° C, so in that sense the following results are slightly

conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt
water exposure, etc.) lower MTBF values.

System MTBF (hours): 142148

Notes: Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour typical operating

life. The above estimates assume no fan, but a passive heat sinking arrangement.
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need
to be considered for separately. Battery life depends on both temperature and operating conditions. When
the Kontron unit has external power; the only battery drain is from leakage paths.

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4 Connector X1 Subsystems

4.1 PCI Bus

The implementation of this subsystem complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

4.2 USB

One OHCI and EHCI USB host controller each supporting both version 1.1 and 2.0 USB standards are on
the Geode™ CS5536 Companion Device. A total of 4 USB ports are provided.

Configuration

The USB controllers are PCI bus devices. The BIOS allocates required system resources during
configuration of the PCI bus.

4.3 Audio

The sound function on the ETX®-LX board comes from an AC‘97 controller integrated in the Geode™
CS5536 Companion Device and a Realtek ALC203 AC‘97 Codec. The 20-bit DAC, 18-bit ADC, AC'97 2.3
compatible, full-duplex codec supports a Line In, a Stereo Line Out, and a Mono Microphone In
interface.

Configuration

The audio controller is a PCI bus device. The BIOS allocates required system resources during
configuration of the PCI device.

4.4 Serial IRQ

The serial IRQ pin offers a standardized interface to link interrupt request lines to a single wire.

Configuration

The serial IRQ machine is in ―Quiet Mode‖, the frame size is 21 frames and the start frame pulse width is
4 clocks.

4.5 3.3V Power Supply for External Components

The ETX®-LX offers the ability to connect external 3.3V devices to the onboard-generated supply voltage.
Pin 12 and Pin 16 of Connector X1 are used to connect to the +3.3V ±5% power supply. The maximum
external load is 500mA. Contact Kontron Embedded Systems Technical Support for help with this
feature.

Warning: Do not connect 3.3 V pins to an external 3.3 V supply!

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For additional information, refer to the ETX® Design Guide, I2C application notes, and JIDA
specifications, all of which are available on the Kontron Embedded Systems Web site.

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5 Connector X2 Subsystems

5.1 ISA Bus Slot

The implementation of this subsystem complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

LPC type, only supports 8/2x8 bit memory, I/O, IRQ slave feature

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6 Connector X3 Subsystems

6.1 VGA Output

The ETX®-LX graphics subsystem is integrated in the AMD Geode™ LX 800 CPU/Northbridge.

Graphics Processor

Command buffer interface

Hardware accelerated rotation BLTs

Colour depth conversion

Palletized colour

Full 8x8 colour pattem buffer

Separate base addresses for all channels

Monochrome inversion

Display Controller

Retrieves graphics, video, and cursor data.

Serializes the streams.

Performs any necessary colour lookups and output for matting.

Interface to the Video Processor for driving the display device(s).

CRT resolution: 1920x1440x8bbp@60Hz, 1600x1200x16bbp@100Hz

Supports up to 1600*1200*32bbp@60Hz TTL and 1027*768*32bbp@60Hz LVDS

Video Processor

Supports video scaling, mixing and VOP

Hardware video up/down scalar

Graphics/video alpha blending and colour key muxing

Digital VOP (SD and HD) or TFT outputs

Legacy RGB mode

VOP supports SD and HD 480p, 480i, 720p, and 1080i

VESA 1.1, 2.0 and BT.601 24-bit (out only), BT.656 compliant

Integrated Analog CRT DAC, System Clock PLLs and Dot Clock PLL

Configuration

The graphics controller requires the following resources:

An IRQ

Several I/O addresses

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Memory-address blocks in high memory

The BIOS allocates the resources during AGP configuration. Many resources are set for compatibility with
industry-standard settings.

6.2 LVDS Flat Panel Interface (JILI)

The user interface for flat panels is the JUMPtec Intelligent LVDS Interface (JILI). The implementation of
this subsystem complies with the ETX® Specification. Implementation information is provided in the
ETX® Design Guide. Refer to the documentation for additional information.

6.3 Digital Flat Panel Interface (JIDI)

The ETX®-LX does support the JUMPtec Intelligent Digital Interface (JIDI) optional.

6.4 Serial Ports (1 and 2)

The ETX®-LX supports two serial interfaces (TTL). You can use COM2 for IrDA SIR Operation. This feature is
implemented in the super I/O device, which is a Winbond 83627HF.

The implementation of the serial interface complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

Configuration

The serial-communication interface uses I/O and IRQ resources. The resources are allocated by the BIOS
during POST configuration and are set to be compatible with common PC/AT settings. Use the BIOS setup
to change some parameters that relate to the serial-communication interface.

6.5 PS/2 Keyboard

The implementation of the keyboard interface complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

Configuration

The keyboard uses I/O and IRQ resources. The BIOS allocates the resources during POST configuration.
The resources are set to be compatible with common PC/AT settings. Use the BIOS setup to change some
keyboard-related parameters.

6.6 PS/2 Mouse

The implementation of the mouse interface complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

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Configuration

The mouse uses I/O and IRQ resources. The BIOS allocates the resources during POST configuration. The
resources are set to be compatible with common PC/AT settings. You can change some mouse-related
parameters from the BIOS setup.

6.7 IrDA

The ETX®-LX is capable of IrDA SIR operation. This feature is implemented in the Winbond 83627HF.
Contact Kontron Embedded Systems for help with this feature.

6.8 Parallel Port

The parallel-communication interface shares signals with the floppy-disk interface. The implementation
of this parallel port complies with the ETX® Specification. Implementation information is provided in the
ETX® Design Guide. Refer to the documentation for additional information.

Configuration

The parallel-communication interface uses I/O, IRQ, and DMA resources. The resources are allocated by
the BIOS during POST configuration and are set to be compatible with common PC/AT settings. You can
change some parameters of the parallel-communication interface through the BIOS setup.

6.9 Floppy

The floppy-disk interface shares signals with the parallel-communication interface. The floppy interface
is limited to one drive (drive_1). A standard floppy cable has two connectors for floppy drives. One
connector has a non-twisted cable leading to it, the other has a twisted cable leading to it. When using
the floppy interface you must connect the floppy drive to the connector (drive_1) that has the non­twisted cable leading to it.

The implementation of this subsystem complies with the ETX® Specification. Implementation
information is provided in the ETX® Design Guide. Refer to the documentation for additional
information.

Configuration

The floppy-disk controller uses I/O, IRQ, and direct memory access (DMA) resources. These resources are
allocated by BIOS during POST configuration and are compatible with common PC/AT settings. You can
change some parameters of the parallel-communication interface through the BIOS setup.

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7 Connector X4 Subsystems

7.1 IDE Ports

The Primary IDE host adapter is capable of UDMA/100 operation. The implementation of this subsystem
complies with the ETX® Specification. Implementation information is provided in the ETX® Design Guide.
Refer to those documents for additional information.

A Compact Flash socket (Secondary Master) for commercial Compact Flash modules and a Secondary IDE
Channel is integrated on the module via VT6421A SATA Controller.

Configuration

Primary and secondary IDE host adapters are PCI bus devices. They are configured by the BIOS during PCI
device configuration. You can disable them in setup. Resources used by the primary and secondary IDE
host adapters are compatible with the PC/AT.

7.2 Ethernet

The Ethernet interface is based on the Intel® 82551ER Fast Ethernet PCI controller. This 32-bit PCI
controller is a fully integrated 10/100BASE-TX LAN solution.

The Ethernet interface requires an external transformer. See the ETX® Design Guide for suggestions on
transformer selection.

Configuration

The ETX®-LX provides Ethernet connectivity using the Intel® 82551ER Integrated
10BASE-T/100BASE-TX Ethernet Controller.

Note: Implementation and limitation information is provided in the ETX® Design Guide from document revision

2.1. Refer to the documentation for additional information.

7.3 Power Control

7.3.1 Power Good / Reset Input

The ETX®-LX provides an external input for a power-good signal or a manual- reset pushbutton. The
implementation of this subsystem complies with the ETX® Specification. Implementation information is
provided in the ETX® Design Guide. Refer to the documentation for additional information.

7.4 Power Management

7.4.1 ATX PS Control

The ETX®-LX can control the main power output of an ATX-style power supply. The implementation of this
subsystem complies with the ETX® Specification. Implementation information is provided in the ETX®
Design Guide. Refer to the documentation for additional information.