Kontron ETX-CD User Manual

ETX®-CD

Document Revision 130

www.kontron.com

» Table of Contents «

1 User Information..................................................................................5

1.1 About This Document.................................................................................................................... 5

1.2 Copyright Notice.......................................................................................................................... 5

1.3 Trademarks................................................................................................................................. 5

1.4 Standards................................................................................................................................... 5

1.5 Warranty.................................................................................................................................... 6

1.6 Technical Support......................................................................................................................... 6

2 Introduction........................................................................................7

2.1 Product Description...................................................................................................................... 7

2.2 ETX® Documtentation................................................................................................................... 7

2.3 ETX® Benefits.............................................................................................................................. 8

3 Specification.......................................................................................9

3.1 Modules & Accessories................................................................................................................... 9

3.2 Functional Specification............................................................................................................... 10

3.3 Block Diagram............................................................................................................................ 13

3.4 Electrical Specification................................................................................................................ 14

3.4.1 Supply Voltage........................................................................................................................... 14

3.4.2 Power Supply Rise Time................................................................................................................ 14

3.4.3 Supply Voltage Ripple.................................................................................................................. 14

3.4.4 Power Consumption..................................................................................................................... 14

3.5 Environmental Specification......................................................................................................... 15

3.5.1 Temperature Specification............................................................................................................ 15

3.5.2 Humidity................................................................................................................................... 15

3.6 Standards and Certifications......................................................................................................... 16

3.7 MTBF........................................................................................................................................ 18

3.8 Mechanical Specification.............................................................................................................. 19

3.9 Module Drillhole Dimension.......................................................................................................... 19

3.10 Thermal Management.................................................................................................................. 20

3.11 Heatspreader............................................................................................................................. 20

3.12 Onboard Fan Connector................................................................................................................ 21

3.12.1 Electrical Characteristics.............................................................................................................. 23

4 Features and Interfaces.......................................................................24

4.1 LPC.......................................................................................................................................... 24

4.2 M.A.R.S.................................................................................................................................... 25

4.3 JIDA16 and JIDA32..................................................................................................................... 26

4.4 K-Station 1................................................................................................................................ 27

4.5 GPIO - General Purpose Input and Output.........................................................................................28

4.6 Watchdog Timer.......................................................................................................................... 29

4.7 Speedstep Technology................................................................................................................. 30

www.kontron.com

ETX®-CD /

4.8 C-States.................................................................................................................................... 31

4.9 ACPI Suspend Modes and Resume Events..........................................................................................32

4.10 ISA Bus Limitation...................................................................................................................... 33

5 System Resources...............................................................................34

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 34

5.2 Direct Memory Access (DMA) Channels............................................................................................. 36

5.3 Memory Area............................................................................................................................. 36

5.4 I/O Address Map......................................................................................................................... 36

5.5 Inter-IC (I2C) Bus....................................................................................................................... 36

5.6 System Management (SM) Bus....................................................................................................... 36

5.7 JILI-I2C Bus.............................................................................................................................. 36

6 ETX® Connectors................................................................................37

6.1 Connector Locations.................................................................................................................... 37

6.2 General Signal Description............................................................................................................ 37

6.3 Connector X1 (PCI bus, USB, Audio)................................................................................................ 38

6.3.1 Connector X1 Signal Levels........................................................................................................... 39

6.3.2 Connector X1 Signal Description..................................................................................................... 41

6.4 Connector X2 (ISA Bus)................................................................................................................ 42

6.4.1 Connector X2 Signal Levels........................................................................................................... 43

6.4.2 Connector X2 Signal Description.................................................................................................... 45

6.5 Connector X3 (VGA, LCD, Video, COM1 and COM2, LPT/Floppy, Mouse, Keyboard).......................................45

6.5.1 Connector X3 (Signal Levels).........................................................................................................47

6.5.2 Connector X3 Signal Description.................................................................................................... 49

6.6 Connector X4 Subsystems............................................................................................................. 51

6.6.1 Connector X4 (IDE 1, IDE 2, Ethernet, Miscellaneous).......................................................................... 51

6.6.2 Connector X4 (Signal Levels)......................................................................................................... 52

6.6.3 Connector X4 Signal Description.................................................................................................... 54

6.7 Feature Connector J11................................................................................................................. 56

6.7.1 SDVO Output.............................................................................................................................. 56

6.7.2 SDVO Connector and Flat Foil Cable.................................................................................................56

6.7.3 Pinout Feature Connector J11........................................................................................................ 56

7 BIOS Operation...................................................................................58

7.1 Determining the BIOS Version....................................................................................................... 58

7.1.1 Start Phoenix BIOS Setup Utility.................................................................................................... 58

7.2 BIOS Setup Menu........................................................................................................................ 60

7.2.1 Info Screen................................................................................................................................ 60

7.2.2 Main Menu................................................................................................................................. 61

7.2.3 Advanced.................................................................................................................................. 63

7.2.4 Security.................................................................................................................................... 82

7.2.5 Power....................................................................................................................................... 83

7.2.6 Boot........................................................................................................................................ 86

7.2.7 Exit Menu.................................................................................................................................. 87

4

ETX®-CD / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.

1.2 Copyright Notice

Copyright © 2003-2012 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

5

ETX®-CD / User Information

1.5 Warranty

This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.

Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

6

ETX®-CD / Introduction

2 Introduction

2.1 Product Description

Based on the ETX® standard, Kontron’s ETX®-CD, powered by a variety of Intel Pentium core duo processors, is a next­generation embedded module that brings advanced technology to tomorrow’s applications, as well as continuing today’s
legacy devices. Built around serial differential signaling technologies, ETX®-CD modules incorporate the following
interfaces into a 95 x 114 small form factor embedded module:

» PCI

» 2x Serial ATA (SATA)

» 1x Parallel ATA (IDE)

» USB

» 2x Serial Port (COM)

» 1x Parallel Port (LPT) shared with Floppy

» LVDS, SDVO, VGA

» 10/100 MB Ethernet

» ISA bus

» Audio

» Advanced Configuration and Power Interface (ACPI)

The ETX®-CD is built around the Intel Core Duo processors that use the Yonah and Merom Core and the Mobile Intel
945GME Express chipset, which is the first mobile platform to offer PCI Express functionality with extended life cycle
support. These modules feature the most current desktop features such as USB, SATA, and PCI buses. The ETX®-CD delivers
up to 2GHz performance and up to 2GB DDR2 RAM. For applications that require advanced real-time video capabilities, the
ETX®-CD has integrated graphics based on the Intel® Graphics Media Accelerator 900 architecture. The ETX®-CD supports
4 PCI 32-bit PCI devices. A 10/100 megabits per second Ethernet port provides fast connectivity to LAN/WAN and 4x USB
interface provides fast and sufficient interfaces for external peripherals. ETX®-CD modules also provide the following
interfaces that are always located in the same physical position on each board: PCI32, USB, serial ATA (SATA), parallel ATA
(PATA), LVDS Multi Media ports, as well as an ACPI (Advanced Configuration and Power Interface) for optimized power
management are available on the board. Six mounting holes on the board provide secure mounting to allow the module
increased shock and vibration resistance.

2.2 ETX® Documtentation

This product manual serves as one of three principal references for an ETX® design. It documents the specifications and
features of ETX®-CD. The other two references, which are available from the Kontron Europe GmbH Web site, include:

» The ETX® Specification defines the ETX® module form factor, pinout, and signals.

» The ETX® Design Guide serves as a general guide for baseboard design, with a focus on maximum flexibility to

accommodate a wide range of ETX® modules.

Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

7

ETX®-CD / Introduction

2.3 ETX® Benefits

Embedded technology extended (ETX) modules are very compact (114 x 95 mm), highly integrated computers. All ETX®
modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. This
standardization allows designers to create a single-system baseboard that can accept present and future ETX® modules.
ETX® modules include common personal computer (PC) peripheral functions such as:

» Graphics

» Parallel, Serial, and USB ports

» Keyboard/mouse

» Ethernet

» Sound

» IDE (and SATA)

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
Peripheral PCI or ISA buses can be implemented directly on the baseboard rather than on mechanically unwieldy
expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in component
simplifies packaging, eliminates cabling, and significantly reduces system-level cost. A single baseboard design can use a
range of ETX® modules. This flexibility can differentiate products at various price/performance points, or to design future
proof systems that have a builtin upgrade path. The modularity of an ETX® solution also ensures against obsolescence as
computer technology evolves. A properly designed ETX® baseboard can work with several successive generations of ETX®
modules. An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

8

ETX®-CD / Specification

3 Specification

3.1 Modules & Accessories

The Computer-on-Module ETX®-CD (MCAL) based on Intel's Napa platform is available in different variants to cover the
demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number Product Name Processor Chipset and Features

18030-0000-11-4 ETX-CD 1.06GHz C423 Intel® Celeron® M ULV 423 Intel® 945GME, ICH7M

18030-0000-12-5 ETX-CD 1.2GHz U2500 Intel® Core™ Duo U2500 Intel® 945GME, ICH7M

18030-0000-15-6 ETX-CD 1.5GHz L7400 Intel® Core™ 2 Duo L7400 Intel® 945GME, ICH7M

18030-0000-17-5 ETX-CD 1.66GHz L2400 Intel® Core™ Duo L2400 Intel® 945GME, ICH7M

18030-0000-19-4 ETX-CD 1.86GHz C440 Intel® Celeron® M ULV 423 Intel® 945GME, ICH7M

Extended Temperature modules (-25°C to 75°C operating)

Product Number Product Name Processor Chipset and Features

18030-0000-17-5EXT ETX-CD 1.66GHz E1 Intel® Core™ Duo L2400 Intel® 945GME, ICH7M

18030-0000-11-4EXT ETX-CD 1.06GHz C423 E1 Intel® Celeron® M ULV 423 Intel® 945GME, ICH7M

Documentation is also valid for following End-of-Live (EOL) variants:

Product Number Product Name Processor Chipset and Features

18030-0000-11-1 ETX-CD 1.06GHz Intel® Celeron® M ULV 423 Intel® 945GM, ICH7M

18030-0000-11-1EXT ETX-CD 1.06GHz E1 Intel® Celeron® M ULV 423 Intel® 945GM, ICH7M

18030-0000-12-2 ETX-CD 1.2GHz Intel® Core™ Duo U2500 Intel® 945GM, ICH7M

18030-0000-15-3 ETX-CD 1.5GHz Intel® Core™ 2 Duo L7400 Intel® 945GM, ICH7M

18030-0000-17-2 ETX-CD 1.66GHz Intel® Core™ Duo L2400 Intel® 945GM, ICH7M

18030-0000-17-2EXT ETX-CD 1.66GHz E1 Intel® Core™ Duo L2400 Intel® 945GM, ICH7M

Accessories

Product Number Product Name

18010-0000-00-0 ETX® Eval (ADA8)

18028-0000-00-0 ETX® miniBaseboard (ADAB)

97011-5120-08-0 DDR2-800 SODIMM / 512MB

97011-1024-08-0 DDR2-800 SODIMM / 1GB

97011-2048-08-0 DDR2-800 SODIMM / 2GB

97011-5120-08-2 DDR2-800 SODIMM / 512MB E2 (industrial temperature)

97011-1024-08-2 DDR2-800 SODIMM / 1GB E2 (industrial temperature)

97011-2048-08-2 DDR2-800 SODIMM / 2GB E2 (industrial temperature)

18030-0000-99-0 ETX®-CD, Heatspreader, threaded

18030-0000-99-1 ETX®-CD, Heatspreader, through hole

18030-0000-99-0C01 ETX®-CD, Passive Cooling Solution, threaded

18030-0000-99-0CO2 ETX®-CD, Active Cooling Solution, threaded

96006-0000-00-4 ADA-ETX-CD-FC4 (SDVO FFC45 to 2xDVI Adaptor)

96006-0000-00-5 ADA-SDVOB-FC5 (SDVO FFC45 to 1xDVI Adaptor)

96006-0000-00-6 ADA-SDVOB-LVDS (SDVO FFC45 to LVDS Adaptor)

9-5000-0352 ADA-LVDS-DVI 18bit (LVDS to DVI converter)

9-5000-0353 ADA-LVDS-DVI 24bit (LVDS to DVI converter)

96079-0000-00-0 KAB-HSP 200mm (Cable adapter to connect FAN to module)

96079-0000-00-2 KAB-HSP 40mm (Cable adapter to connect FAN to module)

9

ETX®-CD / Specification

3.2 Functional Specification

Processor

The Intel® Core™ Duo / Celeron® (Yonah / Merom) CPU supports:

» Intel® Hyper-Threading Technology (HTT)

» Enhanced Intel SpeedStep® Technology (EIST)

» Thermal Monitoring Technologies

» Idle States (C-States)

» Execute Disable Bit

Processor # of Cores Lithography Core Core Clock L2 Cache VT-x HT Intel® 64 EIST Max TDP

Intel® Celeron® M ULV 423 1 65nm Yonah 1066 MHz 1MB No No No No 5.5W

Intel® Celeron® M 440 1 65nm Yonah 1866 MHz 1MB No No No No 27W

Intel® Core™ Duo U2500 2 65nm Yonah 1200 MHz 2MB Yes No No Yes 9W

Intel® Core™ Duo L2400 2 65nm Yonah 1666 MHz 2MB Yes No No Yes 15W

Intel® Core™ 2 Duo L7400 2 65nm Merom 1500 MHz 4MB Yes No No Yes 17W

Chipset

Chipset Graphic Outputs

82945GM VGA, SDVO, LVDS, TVout

82945GME VGA, SDVO, LVDS

Memory

Sockets

1x DDR2 SO-DIMM

Memory Type

DDR2-533, DDR2-667

Maximum Size

2GB

Technology

Single Channel

Graphics Core

The integrated Intel® GMA950 (Gen3.5) supports:

Graphics Core Render Clock

250 MHz

Execution Units / Pixel Pipelines

4

Max Graphics Memory

256MB

GFX Memory Bandwidth (GB/s)

10.7

GFX Memory Technology

DVMT 3.0

API (DirectX/OpenGL)

9.0c / 1.4

Shader Model

3.0 (SW) / 2.0

Hardware accelerated Video

-

Independent/Simultaneous Displays

2

Display Interfaces

CRT max Resolution

2048x1536

TV out:

YES

Digital Display:

SDVOB and SDVOC (onboard FFC45)

LVDS

LVDS Bits/Pixel

1x18, 2x18

LVDS Bits/Pixel with dithering

1x24 and 2x24

LVDS max Resolution:

1600x1200

PWM Backlight Control:

-

10

ETX®-CD / Specification

Chipset & IOH

# of USB:

4x USB 1.1/2.0

USB onboard Connector:

-

Audio:

Crystal CS4299 / Via VT1612 AC97 Audio

PCI Bus:

PCI Rev 2.3 (33MHz/3.3V)

ISA Bus:

LPC2ISA Fintek F85226FG

SuperI/O Controller

Winbond 83627HFJ LPC-I/O

COM Ports:

2x RS232

IrDA Support:

IrDA 1.0 (SIR) or ASK-IrDA (COM2)

LPT Support:

EPP, ECP, bi-dir.

Max TDP:

7W + 3.3W

Storage

Primary IDE:

PATA 100

Secondary IDE:

-

SATA onboard connector:

2x SATA 1.5Gb/s

SATA features:

NCQ, HotPlug, Staggered Spinup

SATA RAID support:

-

onboard SSD:

-

onboard CF Card:

-

Onboard devices

Audio

Crystal CS4299 / Via VT1612 AC97 Audio

Trusted Platform Module

STMicro ST19WP18 optional

Ethernet

The Intel 82562GZ ethernet supports:

» Jumbo Frames

» Time Sync Protocol Indicator

» WOL (Wake On LAN)

» PXE (Preboot eXecution Environment)

Kontron Features

I2C/SMB support:

YES/YES

M.A.R.S. support

YES

Embedded API

JIDA16 / JIDA32

JIDA32 Applications / K-Station

YES, K-Station 1 w/o BIOS modification

Custom BIOS Settings / Flash Backup

-

Watchdog support

YES

11

ETX®-CD / Specification

Power Features

ACPI

ACPI 1.0b / 2.0

S-States

S0, S1, S3, S4, S5

Graphic States

D0, D3

Misc Power Management

DPST 2.0

Power Consumption and Performance

Full Load Power Consumption

19 - 40W

Kontron Performance Index

1387-3296

Kontron Performance/Watt

71 - 103

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer

Section.

Supported Operating Systems

The ETX®-CD currently supports:

» Microsoft Windows XP x86

» Microsoft Windows 7 x86

» Microsoft Windows CE 6.0

» Microsoft Windows XP embedded

» Linux

» WindRiver VxWorks

12

ETX®-CD / Specification

3.3 Block Diagram

13

ETX®-CD / Specification

3.4 Electrical Specification

3.4.1 Supply Voltage

Following supply voltage is specified at the ETX® connector:

Supply Voltage:

5V +/- 5%

5V_Stb:

5V DC +/- 5%

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point

following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4 Power Consumption

The maximum Power Consumption of the different ETX®-CD modules is 19 - 40W (100% CPU load; 90°C CPU temperature).
Further details with measurements and TDP values of the single variants can be found in our customer section.
Information there is available after registration.

14

ETX®-CD / Specification

3.5 Environmental Specification

3.5.1 Temperature Specification

General Kontron Specification Operating Non-operating

Commercial grade 0°C to +60°C -30°C to +85°C

Extended Temperature(E1) -25°C to +75°C -30°C to +85°C

Industrial grade by Screening (XT) -40°C to +85°C -40°C to +85°C

Industrial grade by Design (E2) -40°C to +85°C -40°C to +85°C

Please see chapter Product Specification for available variants for extended or industrial
temperate grade

With Kontron heatspreader plate assembly

The operating temperature defines two requirements:

» the maximum ambient temperature with ambient being the air surrounding the module.

» the maximum measurable temperature on any spot on the heatspreader's surface

Without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.5.2 Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

15

ETX®-CD / Specification

3.6 Standards and Certifications

RoHS

The ETX®-CD is compliant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances

(RoHS) in electrical and electronic equipment.

CE marking

The ETX®-CD is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950

Component Recognition UL 60950-1

The ETX® form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of

this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

» NWGQ2.E304278

» NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.

16

ETX®-CD / Specification

Shock & Vibration

The ETX® form factor Computer-on-Modules successfully passed shock and vibration tests according to

» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the ETX®-CD follows the requirements for electromagnetic compatibility

standards

» EN55022

17

ETX®-CD / Specification

3.7 MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation methode used is “Bellcore Method 1 Case 1” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 109418 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.

18

ETX®-CD / Specification

3.8 Mechanical Specification

» 95.0 mm x 114.0 mm

» Hight approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

3.9 Module Drillhole Dimension

The not shown drill holes match with the ETX® specification.

The maximum height of electrical components on the bottom side of the module is
specified with 2.0mm in the ETX@ specification. On the ETX@-CD the Southbridge is
soldered on the bottom side and Intel specified the ICH7 with 2.28mm ± 0.21mm

19

ETX®-CD / Specification

3.10 Thermal Management

A heatspreader plate assembly is available from Kontron Europe GmbH for the ETX®-CD. The heatspreader plate on top of
this assembly is NOT a heat sink. It works as a ETX®-standard thermal interface to use with a heat sink or other cooling
device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst­case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the ETX®-CD. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the ETX® application and environmental conditions. Please see the
ETX® Design Guide for further information on thermal management.

3.11 Heatspreader

Documentation and CAD drawings of ETX®-CD heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

20

ETX®-CD / Specification

3.12 Onboard Fan Connector

This section describes how to connect a fan to the connector located directly on the ETX®-CD. With certain BIOS-settings
it is possible to control the fan depending on the Active Trip Point temperature. The fan switches on/off depending on the
adjusted Active Trip Point temperature. In order for this feature to function properly an ACPI compliant OS is necessary.

The ETX® CD can not control the revolutions per minute (R.P.M) of the fan.

Location and Pinout of Fan Connector

21

ETX®-CD / Specification

The onboard fan connector (J6) can be found near the northbridge at the corner of the module.

Connector J1 has following specification:

» Part number (Molex) J8: 53261-0390

» Mates with: 51021-0300

» Crimp terminals: 50079-8100

The Pin assignement is:

» Pin1: Tacho

» Pin2: VCC

» Pin3: GND

BIOS Settings for Fan Control

The fan can be controlled via the BIOS Settings “Power Thermal Control”→

Feature Option Description

Active Trip Point Disabled

15 C
23 C
…
55 C
63 C
…
119 C

This value controls the temperature of the ACPI active
trip point - the point in which the OS will turn on the
CPU fan (connector on PCB). If DTS is enabled only
values below 97°C are valid.

22

ETX®-CD / Specification

3.12.1 Electrical Characteristics

Vcc = 5 V Imax (continuous) = 0,68 A Imax (pulsed) = 2 A Sense (Tacho-pulse) = 4 Pulses per turn

The 5 V output is not short circuit proof. The user has to ensure that the circuit is protected
externally, for example by a fuse on the backplane.

To connect a standard FAN with 3pin connector to the module please use adaptor cable
KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

23

ETX®-CD / Features and Interfaces

4 Features and Interfaces

4.1 LPC

The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.

The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.

All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:

83627HF/G Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM YES YES NO

Floppy NO NO NO

GPIO NO NO NO

83627DHG-P Phoenix BIOS AMI CORE8 AMI Aptio

PS/2 YES YES YES

COM1/COM2 YES YES YES

LPT YES YES YES

HWM NO NO NO

Floppy NO NO NO

GPIO NO NO NO

Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.

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ETX®-CD / Features and Interfaces

4.2 M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems

is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address 7-bit Address Device

12h 0x09 SMART_CHARGER

14h 0x0A SMART_SELECTOR

16h 0x0B SMART_BATTERY

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ETX®-CD / Features and Interfaces

4.3 JIDA16 and JIDA32

JIDA16 (JUMPtec® Intelligent Device Architecture) is a BIOS interface which allows programs running in Real Mode
operating systems (i.e. MS DOS) to call certain functions implemented in the BIOS. These functions can be used to get
module information, make settings and access the I2C Bus and the Watchdog unit. JIDA16 functions are INT 15h BIOS calls
which are only available in 16 Bit Real Mode operating systems.

For 32bit operating systems (i.e. WindowsXP, Windows 7, Windows CE, VxWorks, Linux) a different JIDA implementation
called JIDA32 is implemented. The same common driver for all JIDA32 capable modules talks to the JIDA32 part in the
BIOS, which is hardware dependent to interact with the hardware.

Please refer to EMD Customer Section for detailed documentation, JIDA utilities and Libraries for DOS, Windows, Linux,
VxWorks or QNX.

Usage of JIDA16 and JIDA32

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ETX®-CD / Features and Interfaces

4.4 K-Station 1

Based on the JIDA32 interface users can implement advanced board functionality in their application. As an example
utility Kontron provides K-Station for most 32bit Windows Operating Systems. K-Station 1 is a summary of command line
utilities (Shell Tools) for easy access to JIDA32 BIOS implementations. Second part of K-Station is a JAVA based example
GUI which gives a view an all available features using the Shell Tools.

Following K-Station Shell Tools are available:

» KSystemSummary.exe (System Information)

» KGenInfo.exe (Module Information)

» KCPUPerf.exe (CPU Throttling control)

» KHWMon.exe (Hardware Monitoring)

» KI2CBus.exe (I2C and SMBus access)

» KIOPort.exe (GPIO control)

» KStorage.exe (JIDA EEPROM access to user bytes)

» KVGATool.exe (LVDS Backlight control)

» KWDog.exe (Watchdog control)

» KAMIMod.exe (AMICore8 BIOS Modification with Bootlogo or Usercode …)

» KFlash.exe (AMICore8 BIOS Update)

The full K-Station package, the stand-alone Shell Tools with drivers, example batch files and documentation is available
on EMD Customer Section for free.

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