If it's embedded, it's Kontron.
» Kontron User's Guide «
AM4211
Document Revision 1.0
May 2012
www.kontron.com
Revision History
Rev. Index Brief Description of Changes Date of Issue
1.0 First Release May 2012
Customer Service
Contact Information: Kontron Canada, Inc.
4555 Ambroise-Lafortune
Boisbriand, Québec, Canada
J7H 0A4
Tel: (450) 437-5682
(800) 354-4223
Fax: (450) 437-8053
E-mail: support@ca.kontron.com
Visit our site at: www.kontron.com
© 2011 Kontron, an International Corporation. All rights reserved.
The information in this user's guide is provided for reference only. Kontron does not assume any
liability arising out of the application or use of the information or products described herein. This
user's guide may contain or reference information and products protected by copyrights or patents
and does not convey any license under the patent rights of Kontron, nor the rights of others.
Kontron is a registered trademark of Kontron. All trademarks, registered trademarks, and trade
names used in this user's guide are the property of their respective owners. All rights reserved.
Printed in Canada. This user's guide contains information proprietary to Kontron. Customers may
reprint and use this user's guide in other publications. Customers may alter this user's guide and
publish it only after they remove the Kontron name, cover, and logo.
Kontron Modular Computer GMBH
Sudetenstrasse 7
87600 Kaufbeuren
Germany
+49 (0) 8341 803 333
+49 (0) 8341 803 339
Support@kontron-modular.com
Kontron reserves the right to make changes without notice in product or component design as
warranted by evolution in user needs or progress in engineering or manufacturing technology.
Changes that affect the operation of the unit will be documented in the next revision of this user's
guide.
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Table of Contents
Safety Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
Before You Begin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .vii
Preventing Electrostatic Discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
Safety Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
How to Use This Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x
Customer Comments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x
Advisory Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Unpacking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii
Regulatory Compliance Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii
Limited Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiv
Table of Contents
1. Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 What’s Included. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Board Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Hot Swap Capability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Software Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Board Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 System Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.1 Cavium OCTEON II CN6645. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.3 eUSB Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 SFP+ Front IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Gigabit Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.6 Serial Rapid I/O (SRIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.7 PCIe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8 SGMII / XAUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9 RS232 Management Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.10 IPMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.11 AMC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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2.12 Front Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.12.1 Hot Swap LED (Blue LED) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.12.2 Out-Of-Service (OOS) LED (LED1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.12.3 Health LED (LED2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.12.4 SFP + LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
3. Installing the Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 Hot Swap Insertion Procedures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2 Hot Swap Extraction Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3.1 Memory List and Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
3.4 Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.5 System Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.5.1 Front Port Serial Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4. Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1 Thermal Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2 External Thermal Regulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2.1 Forced Airflow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4.2.2 Thermal Characteristic Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4.2.3 Airflow Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
4.2.4 Airflow Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
5. Software Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.1 MMC Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.1.1 Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
5.1.2 IPMI Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
5.1.3 Field Replaceable Unit (FRU) Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
5.1.4 E-Keying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
5.1.5 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
5.1.6 MMC Firmware Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
5.1.7 Updating MMC Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
5.1.8 Override AMC.0 R2 support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
5.2 Board Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.2.1 Switching between Firmware Images . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
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5.3 Bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3.1 Bootloader shell and options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
5.3.2 Protected variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
5.3.3 NetConsole . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
5.3.4 Booting Embedded Linux firmware from eUSB device . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
5.3.5 U-boot memory configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
5.3.6 Network interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
5.3.7 Bootloader Update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
5.3.8 Embedded Linux update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
5.4 Embedded Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.4.1 Embedded filesystem and init script customizations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.4.2 Access to NFS share from Cavium Embedded Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.4.3 eUSB Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.4.4 Booting over PCI (oct-remote-boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
5.4.5 Onboard flash access within Cavium Embedded Linux. . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
5.4.6 Ethernet over Serial Rapid IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
5.5 Using CFGTOOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.5.1 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
5.6 Cavium Linux BSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.6.1 Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
5.6.2 Install Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
5.6.3 Build. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
5.6.4 Simple executive applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
A. Connectors Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1
A.1 USB SSD Flash Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
A.2 SFP+ Front IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
A.3 Serial Port Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
B. Getting Help. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .B-1
B.1 Returning Defective Merchandise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
B.2 When Returning a Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .B-3
C. Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C-1
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List of Figures
Figure 2-1: Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Figure 2-2: AM4211 Quick Reference Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Figure 2-3: Front Panel of AM4211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 3-1: Approved Memory List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Figure 4-1: Temperature Sensor Locations (AM4211 Top View, heat sinks not shown) . . . . . . . . . . . . . . . .22
Figure 4-2: 100% Operational Limits for the AM4211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 4-3: AM4211 Impedance Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Figure 4-4: Thermal Zones of the AM4211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
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List of Tables
Table 1-1 Board Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 1-2 AM4211 Software Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2-1 SFP+ Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2-2 SFP+ LED Significations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 2-3 AMC Port Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 2-4 Hot Swap LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 2-5 Red LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 2-6 Amber/Green LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 2-7 Amber/Green LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 4-1 MMC Temperature Sensors Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 4-2 Deviation of the Airflow Rate on the AM4211 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 5-1 Sensor list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 5-2 Kontron FRU info agent sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 5-3 Kontron IPMB-L Link sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 5-4 Kontron MMC FW upgrade status sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 5-5 Kontron reset sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5-6 Kontron user SW upgrade status sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 5-7 Voltage sensor thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 5-8 Fabric Default Flash Sector to Image Association . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5-9 Swapped Flash Sector to Image Association . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 5-10 On-board 128 MB NOR Flash layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5-11 Bootloader environment variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 5-12 Bootloader network interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5-13 Embedded Linux MTD partitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 5-14 SRIO MAC adress . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
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Safety Instructions
Before You Begin
Before handling the board, read the instructions and safety guidelines on the following pages to prevent
damage to the product and to ensure your own personal safety. Refer to the "Advisory Convention" section
in the Preface for advisory conventions used in this user's guide, including the distinction between
Warnings, Cautions, Important Notes, and Notes.
• Always use caution when handling/operating the computer. Only qualified, experienced and
authorized electronics service personnel should access the interior of the computer. The power
supplies produce high voltages and energy hazards, which can cause bodily harm.
• Use extreme caution when installing or removing components. Refer to the installation
instructions in this user's guide for precautions and procedures. If you have any questions, please
contact Kontron Technical Support.
WARNING
High voltages are present inside the chassis when the unit's power cord is plugged
into an electrical outlet. Turn off system power, turn off the power supply, and then
disconnect the power cord from its source before removing the chassis cover. Turning
off the system power switch does not remove power to components.
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Preventing Electrostatic Discharge
Static electricity can harm system boards. Perform service at an ESD workstation and follow proper ESD
procedure to reduce the risk of damage to components. Kontron strongly encourages you to follow proper
ESD procedure, which can include wrist straps and smocks, when servicing equipment.
Take the following steps to prevent damage from electrostatic discharge (ESD):
• When unpacking a static-sensitive component from its shipping carton, do not remove the
component's antistatic packing material until you are ready to install the component in a
computer. Just before unwrapping the antistatic packaging, be sure you are at an ESD workstation
or grounded. This will discharge any static electricity that may have built up in your body.
• When transporting a sensitive component, first place it in an antistatic container or packaging.
• Handle all sensitive components at an ESD workstation. If possible, use antistatic floor pads and
workbench pads.
• Handle components and boards with care. Don't touch the components or contacts on a board.
Hold a board by its edges.
• Do not handle or store system boards near strong electrostatic, electromagnetic, magnetic or
radioactive fields.
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Safety Requirements
The following safety precautions must be observed when installing or operating the AM4211. Kontron
assumes no responsibility for any damage resulting from failure to comply with these requirements.
WARNING
Due care should be exercised when handling the board due to the fact that the heat
sink can get very hot. Do not touch the heat sink when installing or removing the
board.
In addition, the board should not be placed on any surface or in any form of storage
container until the board and heat sink have cooled down. Remove the such time as
have cooled down to room temperature.
ESD Equipment
This AMC board contains electrostatically sensitive devices. Please observe the necessary
precautions to avoid damage to your board:
• Discharge your clothing before touching the assembly. Tools must be discharged before use.
• Do not touch components, connector-pins or traces.
• If working at an anti-static workbench with professional discharging equipment, please do
not omit to use it.
WARNING
This product has gold conductive fingers which are susceptible to contamination.
Take care not to touch the gold conductive fingers of the AMC Card-edge connector
when handling the board.
Failure to comply with the instruction above may cause damage to the board or result
in improper system operation.
CAUTION
Laser light from fiber-optic transmission cables and components can damage your
eyes. The laser components plugged into the switch are Class 1 laser components.
Class 1 laser is considered incapable of producing damaging radiation levels during
normal operation or maintenance.
To avoid damaging your eyes and to continue safe operation in case of abnormal
circumstances:
• Never look directly into the outlets of fiber-optic transmission components or
fiber-optic cables with unprotected eyes.
• Never allow fiber-optic transmission path to operate until all the connections
have been made.
Always fit protective plugs to any unused ports of the switch.
WARNING
Be careful when inserting or removing the AM4211. The SFP+ cage has sharp edges
which might lead to injuries.
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Preface
How to Use This Guide
This user's guide is designed to be used as step-by-step instructions for installation, and as a reference for
operation, troubleshooting and upgrades.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
The following is a summary of chapter contents:
• Chapter 1, Product Description
• Chapter 2, Board Features
• Chapter 3, Installing the board
• Chapter 4, Thermal
• Chapter 5, Software Setup
• Appendix A, Connector Pinouts
• Appendix B, Getting Help
• Appendix C, Glossary
Customer Comments
If you have any difficulties using this user's guide, discover an error, or just want to provide some feedback,
please send a message to: Tech.Writer@ca.kontron.com
or problems as soon as possible and post the revised user's guide on our Web site. Thank you.
. Detail any errors you find. We will correct the errors
xAM4211
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Advisory Conventions
Seven types of advisories are used throughout the user guides to provide helpful information or to alert you
to the potential for hardware damage or personal injury. They are Note, Signal Paths, Jumpers Settings, BIOS
Settings, Software Usage, Cautions, and Warnings. The following is an example of each type of advisory. Use
caution when servicing electrical components.
Note:
Indicates information that is important for you to know.
Signal Path:
Indicates the places where you can find the signal on the board.
Jumper Settings:
Indicate the jumpers that are related to this section.
BIOS Settings:
Indicates where you can set this option in the BIOS.
Software Usage:
Indicates how you can access this feature through software.
CAUTION
Indicates potential damage to hardware and tells you how to avoid the problem.
WARNING
Indicates potential for bodily harm and tells you how to avoid the problem.
ESD Sensitive Device:
This symbol and title inform that electronic boards and their components are sensitive to static
electricity. Therefore, care must be taken during all handling operations and inspections of this
product, in order to ensure product integrity at all times.
Please read also the section "Special Handling and Unpacking Instructions".
CE Conformity:
This symbol indicates that the product described in this manual is in compliance with all applied CE
standards. Please refer also to the section "Regulatory Compliance Statements" in this manual.
Disclaimer: We have tried to identify all situations that may pose a warning or a caution condition in this
user's guide. However, Kontron does not claim to have covered all situations that might require the use of a
Caution or a Warning.
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Unpacking
Follow these recommendations while unpacking:
• Remove all items from the box. If any items listed on the purchase order are missing, notify
Kontron customer service immediately.
• Inspect the product for damage. If there is damage, notify Kontron customer service immediately.
• Save the box and packing material for possible future shipment.
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Regulatory Compliance Statements
FCC Compliance Statement for Class B Devices
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generated, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experience radio/TV technician for help.
WARNING
This is a Class B product. If not installed in a properly shielded enclosure and used in
accordance with this User's Guide, this product may cause radio interference in
which case users may need to take additional measures at their own expense.
Safety Certification
All Kontron equipment meets or exceeds safety requirements based on the IEC/EN/UL/CSA 609501 family of standards entitled, "Safety of information technology equipment. " All components are
chosen to reduce fire hazards and provide insulation and protection where necessary. Testing and
reports when required, are performed under the international IECEE CB Scheme. Please consult the
"Kontron Safety Conformity Policy Guide" for more information.
CE Certification
The product(s) described in this user's guide complies with all applicable European Union (CE)
directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant
parts may be used. Maintaining CE compliance also requires proper cables and cabling techniques.
Although Kontron offers accessories, the customer must ensure that these products are installed
with proper shielding to maintain CE compliance. Kontron does not offer engineering services for
designing cabling systems. In addition, Kontron will not retest or recertify systems or components
that have been reconfigured by customers.
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Limited Warranty
Kontron grants the original purchaser of Kontron's products a TWO YEAR LIMITED HARDWARE WARRANTY as
described in the following. However, no other warranties that may be granted or implied by anyone on behalf
of Kontron are valid unless the consumer has the express written consent of Kontron.
Kontron warrants their own products, excluding software, to be free from manufacturing and material
defects for a period of 24 consecutive months from the date of purchase. This warranty is not transferable nor
extendible to cover any other users or long- term storage of the product. It does not cover products which
have been modified, altered or repaired by any other party than Kontron or their authorized agents.
Furthermore, any product which has been, or is suspected of being damaged as a result of negligence,
improper use, incorrect handling, servicing or maintenance, or which has been damaged as a result of
excessive current/voltage or temperature, or which has had its serial number(s), any other markings or parts
thereof altered, defaced or removed will also be excluded from this warranty.
If the customer's eligibility for warranty has not been voided, in the event of any claim, he may return the
product at the earliest possible convenience to the original place of purchase, together with a copy of the
original document of purchase, a full description of the application the product is used on and a description
of the defect. Pack the product in such a way as to ensure safe transportation.
Kontron provides for repair or replacement of any part, assembly or sub-assembly at their own discretion, or
to refund the original cost of purchase, if appropriate. In the event of repair, refunding or replacement of
any part, the ownership of the removed or replaced parts reverts to Kontron, and the remaining part of the
original guarantee, or any new guarantee to cover the repaired or replaced items, will be transferred to cover
the new or repaired items. Any extensions to the original guarantee are considered gestures of goodwill, and
will be defined in the "Repair Report" issued by Kontron with the repaired or replaced item.
Kontron will not accept liability for any further claims resulting directly or indirectly from any warranty claim,
other than the above specified repair, replacement or refunding. In particular, all claims for damage to any
system or process in which the product was employed, or any loss incurred as a result of the product not
functioning at any given time, are excluded. The extent of Kontron liability to the customer shall not exceed
the original purchase price of the item for which the claim exists.
Kontron issues no warranty or representation, either explicit or implicit, with respect to its products
reliability, fitness, quality, marketability or ability to fulfil any particular application or purpose. As a result,
the products are sold "as is," and the responsibility to ensure their suitability for any given task remains that
of the purchaser. In no event will Kontron be liable for direct, indirect or consequential damages resulting
from the use of our hardware or software products, or documentation, even if Kontron were advised of the
possibility of such claims prior to the purchase of the product or during any period since the date of its
purchase.
Please remember that no Kontron employee, dealer or agent is authorized to make any modification or
addition to the above specified terms, either verbally or in any other form, written or electronically
transmitted, without the company's consent.
xiv AM4211
Chapter 1
Product Description
www.kontron.com
1.1 Product Overview....................................................2
1.2 What’s Included .....................................................3
1.3 Board Specifications ...............................................3
1.4 Hot Swap Capability ................................................4
1.5 Software Support....................................................5
www.kontron.com
1. Product Description
1.1 Product Overview
The AM4211 is an Advanced Mezzanine Card (AMC) from Kontron supporting the Cavium OCTEON II CN6645
Network Service Processor. It is cost and performance competitive with other NSP AdvancedMC cards
featuring similar number of cores and process technology. The big advantage of the Cavium NSP is it’s broad
market acceptance and large ecosystem solution providers. It is also an excellent choice for future upgrade
to the existing Cavium OCTEON Plus AM42xx series offered by Kontron.
The AM4211 is a 10 GbE card with one 10 Gb Ethernet port on front panel using a SFP+ cage and software
configurable Interfaces to the Fabric side (one PCIe/SRIO on ports 4 to 7 and one PCIe/SGMII/XAUI on ports
8 to 11).
Two Gigabit Ethernet Ports are connected to ports 0 and 1 of the AMC connector.
A debug port is accessible via a low profile serial port connector on front plate or AMC port 15 of Extended
Option Region. Two different UART can be routed at the same time in two differents places (ex: CPU UART0 to
front, CPU UART1 to rear).
An eUSB mezzanine that has a capacity of up 16 GB is available for storage.
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1.2 What’s Included
This board is shipped with the following items:
• One AM4211 AMC board;
• One Quick Reference Sheet;
• One low profile serial port to D-sub (female) adapter cable (1016-6698);
• One Documentation & Drivers disk;
If any item is missing or damaged, contact your supplier.
1.3 Board Specifications
Table 1-1: Board Specifications
Features Description
Multicore Processor Unit
Memory
Flash Memory
eUSB Storage • Single Port USB 2.0 interface
Dual Gigabit Ethernet
Controller
IPMI
I/O Interfaces
• CN6645 Cavium OCTEON II processor capable of supporting 10 Cores at 1.1 GHz
•Socketless
• 1 to 32 GB DDR3 Memory support with ECC
• Up to 1333 MHz ECC SO-DIMM
•128MB NOR Flash
• Boot sector protection
• Dual Gigabit Ethernet Controller Broadcom BCM5482
• SGMII interface to processor
• 2 1000Base-BX (Serdes) interfaces to AMC connector
•IPMI 2.0 compliant
• Voltage and Temperature Sensors
• ATCA LED control
• FRU data storage for AMC
• Firmware Update handling for field upgrades, rollbacks and watchdog functions
• Front: 1 SFP+ cage to support multi-rate fiber SFP+ modules
• Front: low profile connector for RS232 access to Processor
• AMC TCLKA and TCLKC support
• AMC FCLKA input with 100MHz
• AMC Port 0 and Port 1: 1000Base-BX
• AMC port 4 to 7 : Configurable PCIe Gen 2 5 GT/s x4 or SRIO x4 Level I (up to 3.125 GBaud)
• AMC port 8 to 11: PCIe Gen2 5GT/s x4, XAUI or SGMII
• AMC Port 15: RS232 (proprietary mapping)
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Features Description
This board is compliant to the following standards:
• AMC.0 R2.0 Advance Mezzanine Card Base Specification
• AMC.1 R2.0 PCI Express and Advance Switching
Standards Compliance
Mechanical
Characteristics
Operating Voltages
Operation Power
Temperature
Humidity
Altitude
Shock & Vibration
Safety
Electromagnetic
Compatibility
• AMC.2 R1.0 Ethernet Specification
• AMC.4 R1.0 Serial RapidIO Specification
• MTCA.0 R1.0 Micro Telecommunication Computing Architecture Base Specification
• IPMI v2.0.
• RoHS compliant.
• 4HP single Mid-size AMC Module
• Management: 3.3V +/-0.3V
• Payload: 10VDC to 14VDC
• Management: 0.495 W max., TBD W typ.
• Payload: 40 W max., TBD W typ.
• Operates from -5°C to 55°C ambient air temperature with forced convection. Based on B.4.
chassis.
• Operating @ 8 CFM: up to 25°C
• Operating @ 11.4 CFM: 26°C to 40°C
• Operating @ 18.0 CFM: 41°C to 55°C
• Non-Operating: -40°C to 85°C
• Designed to meet Bellcore GR-63, Section 4.1
• Operating: 5%-93% (non-condensing) at 40°C
• Non-Operating: 5%-93% (non-condensing) at 40°C
• Designed to meet the following requirements according to Belcore GR-63, section 4.1.3:
• Operating: -300 m to 4,000 m (13123 ft) (GR63 4.1.3), may require additional cooling
above 1800m (5905ft)
• Non-Operating: -300 m to 14,000 m (45931.2 ft)
• Designed to meet EN 300 019 and Telcore GR-63
• Designed to meet NEBS Level 3, Earthquake Zone 4
• Low Voltage Directive 2006/95/EC
• Complies with IEC/EN/CSA/ UL 60950-1
• The board meets flammability requirement, as specified in Telcordia GR-63
• UL 94V-0/1 with Oxygen index of 28% or greater material
• Meets or exceeds the following specifications (assuming an adequate chassis):
• EMC Directive 2004/108/EC
• EN55022; EN55024; CISPR22; VCCI
• EN 300 386
• FCC 47 CFR Part 15
•Telcordia GR-1089
1.4 Hot Swap Capability
The AMC supports Full Hot Swap capability as required by AMC.0 R2.0. It can be removed from or installed in
the system while it is on (without powering-down the system). Please refer to the AMC.0 R2.0 specification
for additional details.
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1.5 Software Support
The following table contains information related to software supported by the AM4211.
Table 1-2: AM4211 Software Specification
Specifications
• The system supports IPMI version 2.0 for board level management (AMC.0).
• Support for onboard IPMI event log (SEL)
General
Bootloader
Operating System
• Reliable field upgrades for all software components, including boot loader and IPMI firmware
• Optional Dual boot images with roll-back capability.
• Offline Diagnostic software for running diagnostic tests
U-Boot
• Power On Self Test
• Loadable boot image from onboard flash
• Reliable field upgradable
• KCS interface to MMC
• Serial console support
Linux Operating System is based on Cavium SDK 2.2.0 (2.6.32).
5AM4211
Chapter 2
Board Features
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2.1 Block Diagram ........................................................ 7
2.2 System Core ........................................................... 8
2.3 eUSB Storage ......................................................... 9
2.4 SFP+ Front IO.......................................................... 10
2.5 Gigabit Ethernet...................................................... 10
2.6 Serial Rapid I/O (SRIO)............................................. 11
2.7 PCIe...................................................................... 11
2.8 SGMII / XAUI.......................................................... 12
2.9 RS232 Management Interface .................................... 12
2.10 IPMI ..................................................................... 12
2.11 AMC Connector ....................................................... 13
2.12 Front Panel LEDs ..................................................... 14
www.kontron.com
2. Board Features
2.1 Block Diagram
Figure 2-1:Block Diagram
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2.2 System Core
2.2.1 Cavium OCTEON II CN6645
• Ten(10) Cores at 1.1GHz
• Up to 30 Billion MIPS64 instructions per second
• 12 high-speed SERDES, flexibly configured in blocks of 4 (referred to as QLM)
• XAUI, SGMII, PCIe or SRIO depending on QLM
• Integrated coprocessors for application acceleration, including: Packet I/O processing, QoS, TCP
Acceleration; Support for IPsec, SSL, SRTP, WLAN and 3G/UMB/LTE security (includes DES, 3DES, AESGCM, AES up to 256, SHA1, SHA-2 up to SHA-512, RSA up to 8192, DH, KASUMI); and Compression/
Decompression with up to 10Gbps throughput and highest compression ratios.
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2.3 eUSB Storage
J8
J6
J5
J4
JP1
TS2
TS1
TS3
Serial Port Connector
SFP+ Connector
DDR3 Memory Socket SO-DIMM ECC
eUSB Flash Connector
AMC Gold Fingers
J3
J4
J5
J6
J8
» AM4211 Quick Reference Sheet «
Connectors
Reserved
JP1
Jumper Settings
Symbols Chart
Hot Swap
Out of Service
Healthy
Serial Port (RJ45)
LEDs Signification available on back.
Cavium Advanced Mezzanine Card
Top Side Sensor
SO-DIMM Sensor
Cavium Internal Sensor
TS1
TS2
TS3
Temperature Sensors
J3
AM4211
1
20
SFP+
The AM4211 supports one (1) Solid State Drive. It is a NAND flash disk module with a USB 2.0 interface. The
module is connected to a 2x5 header (refers to J6 on showed in Figure 2-2) on the AM4211 board.
Figure 2-2:AM4211 Quick Reference Sheet
Signal Path:
USB Flash Module Connector is located close to the heatsink and the memory socket.
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2.4 SFP+ Front IO
The front SFP+ cage supports a multi-rate fiber SFP+ module.
Table 2-1: SFP+ Connection
SFP+ Connection
1 10 GbE XAUI
SFP+ module is not provided with the AM4211 and has to be obtained separately. The SFP+ uplink port is
compliant to the Enhanced 8.5 and 10 Gigabit Small Form Factor Pluggable Module “SFP+” MultiSource
Agreement (MSA), February 16th 2007, and the Improved Pluggable Formfactor MSA, February 26th 2007.
An application note with a list of SFP+ modules successfully operated by Kontron in the AM4211 is available
upon request.
CAUTION LASER LIGHT!
Do not look into the laser beam!
The SFP+ module is fitted with a class 1 or 1M laser. To avoid possible exposure to
hazardous levels of invisible laser radiation, do not exceed maximum ratings.
The SFP+ port has a bi-color green/amber LED with the following signification:
Table 2-2: SFP+ LED Significations
LED Signification
Green on Link 10Gbit
Green blink Activity 10Gbit
Amber on Link 1000Mbit
2.5 Gigabit Ethernet
Two Gigabit Ethernet Ports are connected to ports 0 and 1 of the AMC connector.
Signal Path:
Two Gigabit Ethernet Ports are connected to ports 0 and 1 of the AMC connector.
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2.6 Serial Rapid I/O (SRIO)
AMC provides SRIO x4 interfaces only as per AMC.4 R1.0 fat pipe region on ports 4 to 7. The supported SRIO
speed are using a priority order controlled by E-Keying mechanism.
SRIO speed priority list:
SRIO 3.125Gbs
SRIO 2.5Gbs
SRIO 1.25Gbs
Signal Path:
Serial Rapid I/O is connected to ports 4 to 7 of the AMC connector.
2.7 PCIe
AMC provides two independant PCIe links. A PCIe x4 Gen2 interface on fat pipe region ports 4 to 7 as per
AMC.1 R2.0. And a PCIe x4 Gen2 interface on the extended fat pipe region ports 8 to 11.The supported PCIe
modes are using a priority order controlled by E-Keying mechanism.
PCIe mode priority list:
PCIe Gen2 x4 SCC
PCIe Gen2 x4 NoSCC
PCIe Gen2 x1 SCC
PCIe Gen2 x1 NoSCC
PCIe Gen1 x4 SCC
PCIe Gen1 x4 NoSCC
PCIe Gen1 x1 SCC
PCIe Gen1 x1 NoSCC.
Signal Path:
PCIe is connected to ports 4 to 7 and 8 to 11 of the AMC connector.
11 A M42 11
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2.8 SGMII / XAUI
One SGMII / XAUI interface, as per AMC.2 R1.0, is available on ports 8 to 11 in the fat pipes region.
Signal Path:
The SGMII / XAUI is connected to ports 8 to 11 of the AMC connector.
2.9 RS232 Management Interface
The RS232 interface of the OCTEON is connected to the front panel low profile connector.
Use a special cable with low profile serial port connector to SubD connector.
Signal Path:
The serial port is available through the AMC faceplate.
2.10 IPMI
The AM4211 supports an intelligent hardware management system based on the Intelligent Platform
Management Interface (IPMI) Specification 2.0. It provides the ability to manage the power, cooling and
interconnect needs of intelligent devices, to monitor events and to log events to a central repository.
The MMC (“Module Management Controller”) controls all hotswap and E-Keying processes required by ATCA.
It activates the board power supply and enables communication with the AMC carrier. The MMC manages the
Ethernet switch E-Keying and the baseboard ATCA feature. The controller is connected to the IPMC of the
ATCA carrier board via IPMB-L bus.
All voltages and currents on the board are monitored by the MMC. Three temperature sensors on the board
make sure that thermal conditions are met:
• Temp NPU (OCTEON Internal Sensor)
• Temp MMC
•Temp DIMM
For more information on the thermal design and management, consult the “Thermal Consideration” section.
12 AM4211
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2.11 AMC Connector
Table 2-3: AMC Port Assignment
Port Region Connection
0 GbE GbE eth0
1 GbE GbE eth1
2 Storage -
3 Storage -
4 Fat Pipe PCIe / SRIO Port 0 (Lane 0)
5 Fat Pipe PCIe / SRIO Port 0 (Lane 1)
6 Fat Pipe PCIe / SRIO Port 0 (Lane 2)
7 Fat Pipe PCIe / SRIO Port 0 (Lane 3)
8 Fat Pipe PCIe / XAUI / SGMII Port 1 (Lane 0)
9 Fat Pipe PCIe / XAUI / SGMII Port 1 (Lane 1)
10 Fat Pipe PCIe / XAUI / SGMII Port 1 (Lane 2)
11 Fat Pipe PCIe / XAUI / SGMII Port 1 (Lane 3)
12 Extended -
13 Extended -
14 Extended -
15 Extended RS232
17 Extended -
18 Extended -
19 Extended -
20 Extended -
TCLKA Clock For GPS clock from AMC Connector
TCLKB Clock Optional SyncE to the AMC Connector
TCLKC Clock Optional SyncE from AMC Connector
TCLKD Clock Optional SyncE to the AMC Connector
FCLKA Clock
PCIe Reference Clock (FCLKA input may be damaged if dr iven by an
M-LVDS driver.)
13 AM4211
www.kontron.com
2.12 Front Panel LEDs
SFP
AM4211
Figure 2-3:Front Panel of AM4211
2.12.1 Hot Swap LED (Blue LED)
The AM4211 board supports a blue Hot Swap LED mounted on the front panel. This LED indicates when it is
safe to remove the Module. The on-board MMC drives this LED to indicate the hot swap state but is controlled
by the carrier’s IPMC or the MicroTCA carrier manager. The following states are possible:
Table 2-4: Hot Swap LED
LED state Description
OFF Module is in M3 or M4 state, normal state when module is in operation.
ON Module is ready for hot swap
Short blink Module is in M5 state (Deactivation Request) or in M6 state (Deactivation in progress)
Long blink Activation in progress.
2.12.2 Out-Of-Service (OOS) LED (LED1)
Table 2-5: Red LED
LED state Description
ON MMC in reset
Blinking MMC upgrade / rollback in progress
OFF MMC operational
Application
Defined
May be controlled by application using PICMG API
14 AM4211
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2.12.3 Health LED (LED2)
Table 2-6: Amber/Green LED
LED state Description
OFF Payload power down
Green Payload is On and no critical event is detected by the sensors
Amber Payload is On and at least one critical event is detected by the sensors
Application
Defined
May be controlled by application using PICMG API
2.12.4 SFP + LED
Table 2-7: Amber/Green LED
LED state Description
Green OFF no 10GbE link
Green ON 10GbE link
Green Blink 10GbE traffic
Amber OFF no 1000Base-x link
Amber ON 1000Base-x link
15 AM4211
Chapter 3
Chapter 3
Installing the Board
www.kontron.com
3.1 Hot Swap Insertion Procedures...........................17
3.2 Hot Swap Extraction Procedures .........................18
3.3 Memory .........................................................19
3.4 Software........................................................19
3.5 System Access.................................................19
www.kontron.com
3. Installing the Board
3.1 Hot Swap Insertion Procedures
The AM4211 is designed for hot swap operation. Hot swapping allows the coordinated insertion and
extraction of modules without disrupting other operational elements within the system. This allows for
identified faulty elements to be removed and replaced without taking the carrier card out of service that will
typically be hosting others modules.
The following procedures are applicable when inserting the AM4211 in a running system.
1 Ensure that the safety requirements are observed.
WARNING
Failure to comply with the instruction below may cause damage to the board or result
in improper system operation.
2 Ensure that the board is properly configured for operation in accordance with application requirements
before installing.
WARNING
Care must be taken when applying the procedures below to ensure that neither the
AM4211 nor other system boards are physically damaged by the application of these
procedures.
3 To install the AM4211, perform the following:
1 Carefully insert the board into the slot designated by the application requirements until it makes
contact with the AMC Card-edge connector located on the carrier or backplane.
2 Connect all external interfacing cables to the board as required.
3 Using the handle on the front panel, engage the board with the carrier or backplane. When the
handle is locked, the board is engaged and the following steps occur:
1 The BLUE HS LED turns on.
If the carrier recognizes that the AM4211 is fully seated, the carrier then enables the
management power for the AM4211 and the BLUE HS LED turns on.
2 Long blinks of the BLUE HS LED.
If the carrier IPMI controller detects the AM4211, it sends a command to the AM4211 to
perform long blinks of the BLUE HS LED.
3 The BLUE HS LED turns off.
The Intelligent Platform Management Controller on the carrier reads the Module Current
Requirements record and the AMC Point-to-Point Connectivity record. If the Module FRU
information is valid and the carrier can provide the necessary payload power, the BLUE HS
17 AM4211
www.kontron.com
LED will be turned off. If the module FRU information is invalid or the carrier cannot provide
the necessary payload power, the insertion process is stopped and the BLUE HS LED keeps
blinking. Should this problem occur, please contact Kontron’s Technical Support.
4 Short blinks of the Module Management LEDs and the User-Specific LEDs.
The carrier enables the payload power for the AM4211, and the Module Management LEDs and the
User-Specific LEDs emit a short blink.
5 Ensure that the board and all required interfacing cables are properly secured.
4 The AM4211 is now ready for operation. Refer to appropriate AM4211- specific software, application, and
system documentation for operating instructions, etc.
3.2 Hot Swap Extraction Procedures
To extract the board, proceed as follows:
1 Ensure that the safety requirements, listed at page ix above, are observed. Particular attention must be
paid to the warning regarding the heat sink!
2 Pull the handle on the AM4211’s front panel initiating the deactivation. This changes the state of the
handle to open. Now, the following steps occur:
1 Short blinks of the BLUE HS LED
•When the carrier IPMI controller receives the handle opened event, the carrier sends a command
to the MMC with a request to perform short blinks of the BLUE HS LED. This indicates to the
operator that the AM4211 is waiting to be deactivated.
•Now the AM4211 waits for a permission from higher level management (Shelf Manager or System
Manager) to proceed with its deactivation.
•Once the AM4211 receives the permission to continue the deactivation, all used ports are
disabled.
• The Intelligent Platform Management Controller on the Carrier disables the AM4211's Payload
Power.
2 The BLUE HS LED turns on.
•Now the AM4211 is ready to be safely extracted.
3 Disconnect any interfacing cables that may be connected to the AM4211.
4 Pull the AM4211 out of the slot. Now the carrier disables the management power for the AM4211.
WARNING
Due care should be exercised when handling the board due to the fact that the heat
sink can get very hot. Do not touch the heat sink when handling the board.
18 AM4211
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3.3 Memory
The AM4211 has one memory channel connected to the Octeon processor. There is one SO-DIMM populated
in an SO-DIMM socket. The AM4211 accepts DDR3, SO-DIMM, registered or unregistered, ECC, x8 or x16, with
up to 2 ranks. The DDR3 channel supports data rates up to 1333Mhz. The maximum memory that the board
will accept is 32GB, although 8GB is the highest capacity tested to date.
Only use validated memory with this product. Thermal issues or other problems may arise if nonrecommended modules are used. At the time of publication of this user guide, the following memories have
been qualified and approved. As the memory market is volatile, this list is subject to change, please consult
your local technical support for an up to date list.
3.3.1 Memory List and Characteristics
Figure 3-1: Approved Memory List
Manufacturer Part Number Description Company
VL41B5263A-K9S 4GB 1333MHz unbuf fered (SO-UDIMM) Virtium
VL43B5263A-K9S 4GB 1333MHz registred (SO-RDIMM) Virtium
VL41B5663A-F8S 2GB 1066MHz unbuffered (SO-UDIMM) Virtium
VL41B2863F-F8S 1GB unbuffered (SO-UDIMM) Virtium
VR7PU127258GBDK 4GB Modular 1 1333MHz unbuffered (SO-UDIMM) Viking Modular
VL41B1G63A-K9S 8GB 1333MHz unbuffered (SO-UDIMM) Virtium
3.4 Software
The AM4211 comes as a pre-installed system with all necessary OS, Filesystem, drivers and applications
factory-installed with default configurations.
Updating the Software with a new Operating System or applications or new versions is provided by a
dedicated update mechanism, which is described under the “Software Setup” section.
3.5 System Access
This section gives instructions for accessing the AM4211 using the Serial port via front plate connector.
3.5.1 Front Port Serial Connection
The OCTEON II processor’s serial console can be accessed directly via the front port connector with the
appropriate cabling. The corresponding procedure is described below.
19 AM4211
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1 Connect the serial port on AM4211 front plate using the RS232 adapter, consult “RS232 Management
Interface” section for more details .
Port settings are:
•115 200 bps
•8 bit, no parity, 1 stop bit (8N1)
•no flow control
2 Ensure that the board is powered up.
3 Wait for boot process to complete. Login is not required by default:
BusyBox v1.2.1 (2008.09.15-08:10+0000) Built-in shell (ash)
Enter 'help' for a list of built-in commands.
~ #
20 AM4211
Chapter 4
Thermal Considerations
www.kontron.com
4.1 Thermal Monitoring.................................................. 22
4.2 External Thermal Regulation....................................... 23
www.kontron.com
4. Thermal Considerations
Temp NPU
(OCTEON Processor)
Temp DIMM
Temp MMC
(Top Side)
4.1 Thermal Monitoring
To ensure optimal operation and long-term reliability of the AM4211, all onboard components must remain
within the maximum temperature specifications. Operating the AM4211 above the maximum operating limits
will result in permanent damage to the board. To ensure functionality at the maximum temperature, the
Module Management Controller supports several temperature monitoring and control features.
The AM4211 includes three temperature sensors that are accessible via the Module Management Controller.
Although temperature sensing information is made available to the MMC, the AM4211 itself does not provide
any active means of temperature regulation.
Figure 4-1:Temperature Sensor Locations (AM4211 Top View, heat sinks not shown)
The Temp NPU is an on-chip sensor and the Temp MMC sensor is a diode located next to the MMC. The Temp
DIMM sensor is a separate sensor measuring the temperature in the memory module. The Dual 10 GE Phy
does not have a sensor. Simulations show that its temperature remains uncritical under operating conditions
compared to the processor.
The following table shows the temperature thresholds of all three sensors.
22 AM4211
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Table 4-1:MMC Temperature Sensors Thresholds
Sensor Lower Non
Recoverable
Temp DIMM -8°C 0°C 5°C 70°C 75°C 98°C
Temp NP U -6°C 0°C 5°C 85°C 90°C 101°C
Temp MMC -8°C 0°C 5°C 60°C 65°C 72°C
Lower Critical Lower Non
Critical
Upper Non
Critical
Upper Critical Upper Non
Recoverable
Temperature values are measured with an accuracy of 1°C for the NPU and 3°C for the DIMM and the MMC.
4.2 External Thermal Regulation
The external thermal regulation of the AM4211 is realized using a dedicated heat sink design in conjunction
with a system chassis that provides thermal supervision, controlled system airflow and thermal protection,
such as increased airflow, reduced ambient air temperature, or power removal.
The main heat sink provided on the AM4211 has been specifically designed to ensure the best possible basis
for operational stability and long-term reliability. The physical size, shape, and construction of the heat sink
ensure the lowest possible thermal resistance. In addition, it has been specifically designed to efficiently
support forced airflow concepts as found in modern AMC carriers and MicroTCA systems.
4.2.1 Forced Airflow
When developing applications using the AM4211, the system integrator must be aware of the overall system
thermal requirements. All system chassis requirements must be provided to make sure they satisfy these
requirements. As an aid to the system integrator, characteristic graphs are provided for the AM4211.
WARNING
As Kontron assumes no responsibility for any damage to the AM4211 or other
equipment resulting from overheating any of the components, it is highly
recommended that system integrators as well as end users confirm that the
operational environment of the AM4211 complies with the thermal considerations
set forth in this document.
4.2.2 Thermal Characteristic Graphs
The thermal characteristic graph shown in the following pages illustrates the maximum ambient air
temperature as a function of the linear airflow rate for the power consumption indicated. The diagram is
intended to serve as guidance for reconciling board and system, considering the thermal aspect. When
operating below the indicated curves, the AMC runs steadily without any intervention of thermal supervision.
When operated above the indicated curves, various thermal protection mechanisms may take effect
eventually resulting in an emergency stop in order to protect the AMC from thermal destruction. In real
applications this means that the board can be operated temporarily at a higher ambient temperature or at a
reduced flow rate and still provide some margin for temporarily requested peak performance before thermal
protection will be activated.
23 AM4211
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4.2.2.1 How to Read the Diagram
The diagram contains multiple curves displaying the thermal sensors temperature versus the provided
airflow and the proper system class required. Full thermal load is not expected to be reached under real
operating conditions. For a given flow rate there is a maximum airflow input temperature (= ambient
temperature) provided. Below this operating point, a safe operation is guaranteed. Above this operating
point, the chassis thermal management must become active and take the necessary steps to protect the AMC
from thermal destruction.
4.2.2.2 Airflow
At a given cross-sectional area and a required flow rate, an average, homogeneous airflow speed can be
calculated using the following formula:
Airflow = Volumetric flow rate / area.
The airflow is specified in m/s = meter-per-second or in LFM = linear-feet-per-minute, respectively.
Conversion: 1 LFM = 0.00508 m/s; 1 m/s = 196.85 LFM
The following figure illustrates the operational limits of the AM4211 taking into consideration power
consumption vs. ambient air temperature vs. airflow rate. The values are based on simulation data taking
into account the actual power values of all components.
WARNING
In all situations, the maximum specified case temperature of the components must
be kept below the maximum allowable temperature.
Figure 4-2:100% Operational Limits for the AM4211
24 AM4211
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4.2.3 Airflow Impedance
In order to determine the cooling requirements of the AM4211, the airflow impedance of the module has
been determined via simulation. No card guides or struts have been used for the simulations because the
resulting airflow impedance depends on individual configuration of the AMC carrier or MicroTCA system.
Figure 4-3:AM4211 Impedance Curve
4.2.4 Airflow Paths
The area between the front panel and the AMC Card-edge connector is divided into five zones, one I/O zone
and four uniform thermal zones, A, B, C, and D. The PICMG AMC.0 Specification states that the uniformity of
the airflow paths' resistance should provide an impedance on the A, B, C, and D zones that is within ± 25% of
the average value of the four thermal zones.
Figure 4-4:Thermal Zones of the AM4211
25 AM4211
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Table 4-2:Deviation of the Airflow Rate on the AM4211
Inlet Velocity Deviation (%)
CFM m/s LFM ZONE A ZONE B ZONE C ZONE D
2.3 0.28 55.6 -26.5 -12.7 22.8 16.4
3.4 0.42 82.8 -21.2 -14.1 20.9 14.4
4.5 0.56 110. 0 -17.7 -15.2 19.3 13.6
9.0 1.11 219.1 -10.5 -16.8 15.3 12.0
13.6 1. 68 329.7 -6.9 -17.0 12.8 11 .0
18.3 2.25 442.4 -4.6 -16.6 11.0 10 .1
22.9 2.82 555.1 -2.5 -15.6 9.2 8.9
27.6 3.40 668.8 -1.0 -15.1 7.9 8.2
32.3 3.98 782 .5 0.1 -14.2 63.9 7. 2
26 AM4211
Chapter 5
Chapter 5
Software Setup
www.kontron.com
5.1 MMC Firmware...................................28
5.2 Board Firmware.................................38
5.3 Bootloader.......................................40
5.4 Embedded Linux................................47
5.5 Using CFGTOOL..................................49
5.6 Cavium Linux BSP ..............................54
www.kontron.com
5. Software Setup
5.1 MMC Firmware
The Module Management Controller (MMC) is a crucial component of any AMC module. Besides acting as a
regular IPMI management controller (sensor monitoring, event generation, etc.), it also provides an
interface to all necessary data related to module power requirements and implemented interfaces (EKeying). Further, it plays an active role in the module hot swap state management. The carrier IPMI
Controller (IPMC) communicates with the MMC using the local IPMB (IPMB-L) bus. In an ATCA/AMC
environment, it is the IPMC that actually turns on/off module (payload) power. However, before the IPMC
enables the module payload power, various criteria must be satisfied by both the carrier and the module,
including handle switch state, power requirements and capabilities, matching interfaces, current module hot
swap state, and any other special conditions as specified by the Shelf Manager policy.
5.1.1 Related Documentation
IPMI specifications: (http://www.intel.com/design/servers/ipmi/spec.htm)
•IPMI-Intelligent Platform Management Interface Specification. Second Generation v2.0, February 12,
2004 (part)
•IPMI- Platform Management FRU Information Storage Definition v1.0, Document Revision 1.1,
September 1999
PICMG specifications: http://www.picmg.org
•PICMG® AMC.0 R2.0 - Advanced Mezzanine Card Base Specification
•PICMG® AMC.1 R1.0 - PCI Express and Advanced Switching on AdvancedMC
•PICMG® AMC.2 R1.0 – AMC Gigabit Ethernet/10 Gigabit XAUI Ethernet
Open tools documentation
•Ipmitool documentation: http://ipmitool.sourceforge.net
•OpenIPMI documentation: http://www.openipmi.sourceforge.net
The AM4211 is built in accordance to the AMC.0 R2.0 specification, and is also AMC.1 and AMC.2 compliant
and is easily managed via IPMI v1.5/v2.0.
28 AM4211
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5.1.2 IPMI Sensors
The MMC includes many sensors for voltage or temperature monitoring and various others for pass/fail type
signal monitoring.
Every sensor is associated with a Sensor Data Record (SDR). Sensor Data Records contain information about
the sensors identification such as sensor type, sensor name and sensor unit. SDRs also contain the
configuration of a specific sensor such as threshold/hystheresis, event generation capabilities that specifies
sensor behavior. Some field of the sensor SDR are configurable through IPMI v1.5 command and are set to
built-in initial values. The sensor also includes a field, identifying the sensor owner's address in the system.
This allows the carrier to pre-pend an appropriate code when the SDR is scanned so the reader of the sensor
list can determine which sensors belong to which physical board in the ATCA carrier or uTCA system.
From an IPMI perspective, the MMC is set up as a satellite management controller (SMC). It does support
sensor devices, and uses the IPMI static sensor population feature of IPMI v1.5. All SDRs can be queried using
Device SDR commands to the MMC.
The sensor name in its SDR has a name prefix which after module insertion is automatically adapted to the
physical position of the module in a carrier or in a μTCA chassis. The format of this prefix is:
•in AMC bay 1…8 or μTCA slot 1…8: ‘A1:’, ‘A2:’, ‘A3:’, ‘A4:’, ‘B1:’, ‘B2:’, ‘B3:’, ‘B4:’.
•in μTCA slot 9…12: 'C1:', 'C2:', 'C3:', 'C4:'.
Please note that in the case that the module is installed elsewhere, then the IPMB-L address of the module is
unknown and the interface is off.
Module sensors that have been implemented are listed in the sensor list below.
Table 5-1:Sensor list
SDR IDName Sensor Type Code Reading Type Code Description Event Offset
0 IPMI Info-1
1 IPMI Info-2
2 FRU Agent
3 ModuleHotSwap
C0h
(OEM Kontron)
C0h
(OEM Kontron)
C5h
(OEM Kontron FRU
Info Agent State)
F2h
(Module Hot
Swap)
70h
(Discrete)
75h
(Discrete)
0Ah
(Generic Discrete)
6Fh
(Sensor Specific)
Internal Management
Controller firmware
diagnostic
Internal Management
Controller firmware
diagnostic
FRU Information
Agent - FRU Data
Error Detection
Refer to AMC.0
specification.
Offset 6: transition to
Degraded
Offset 8: Install Error
Offset 0: Module Handle
Closed
Offset 1: Module Handle
Opened
Offset 2: Quiesced
Offset 3: Backend Power
Failure
Offset 4: Backend Power
Shutdown
Refer to AMC.0 R2.0 Section
3.6.6 Module Hot Swap
Sensor.
29 AM4211
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SDR IDName Sensor Type Code Reading Type Code Description Event Offset
4 IPMBL State
5 MMC Stor Err
6 MMC Reboot
7 MMC FWUP
8 MMC Ver Chg
9 FPGA Ver Chg
10 IPMI Watchdog
11 Board Reset
12 Temp MMC
13 Temp NPU
14 Temp DIMM
15 Vcc +12V
16 Vcc +5V
17 Vcc +3.3V
C3h
(OEM Kontron)
28h
(Management
Subsystem
Health)
24h
(Platform Alert)
C7h
(Kontron OEM MC
Firmware Upgrade
Status)
2Bh
(Version Change)
2Bh
(Version Change)
23h
(Watchdog 2)
CFh
(OEM Kontron
Reset Sensor)
01h
(Temperature)
01h
(Temperature)
01h
(Temperature)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
6Fh
(Sensor Specific)
6Fh
(Sensor Specific)
03h
(Digital Discrete)
6Fh
(Sensor Specific)
6Fh
(Sensor Specific)
6Fh
(Sensor Specific)
6Fh
(Sensor Specific)
03h
(Digital Discrete)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
For additional
information, refer to
section Kontron
IPMB-L Link
Generates an event
when a local EEPROM
storage error is
detected.
Generates an event
when MMC reboot is
detected.
Generates events
after IPMI Firmware
upgrade process is
finished
Generates an event
when the IPMI FW
changes
Generates an event
when the IPMI FW
changes
OS Watchdog
Type and source of
Board Reset
Temperature Sensor
of the outlet region
Temperature Sensor
of the NPU
Temperature Sensor
of the DIMM memory)
Voltage on 12v board
power supply
Voltage on 5v board
power supply
Voltage on 3.3v board
power supply
Offset 2: IPMB-L disabled
Offset 3: IPMB-L enabled
Offset 1: Controller access
degraded or unavailable
See IPMI v1.5 table 36.3,
Sensor type code 28h for
sensor definition
Offset 0: State Deasserted
Offset 1: State Asserted
Offset 0: Firmware upgrade in
progress (no event)
Offset 1: Firmware upgrade
succeeded
Offset 1: Firmware / Software
change detected
See IPMI v1.5 table 36.3,
Sensor type code 2Bh (Version
Change) for sensor definition
Offset 1: Firmware / Software
change detected
Offset 0: Timer expired
Offset 1: Board Reset
Offset 2: Power Down
Offset 3: Power Cycle
Offset 8: Timer Interrupt
See IPMI v1.5 table 36.3,
Sensor type code 23h
(Watchdog 2) for sensor
definition
Offset 0: Warm Reset
Offset 1: Cold Reset
See OEM sensor table, Sensor
type code CFh for sensor
definition
Sensor is only readable when
Payload Power is on
Sensor is only readable when
Payload Power is on
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
30 AM4211
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SDR IDName Sensor Type Code Reading Type Code Description Event Offset
18 Vcc +3.3V SUS
19 Vcc +2.5V
20 Vcc +1.8V
21 VCC +1.5V
22 Vcc +1.2V
23 Vcc +1.2V SUS
24 Vcc +1.1V
25 Vcc +1.0V BCM
26 Vcc VTT_DDR
27 Vcc Vcore
28 Power Good
29 Health Error
30 Memory Error
31 FPGA Error
32 MMC SEL State
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
02h
(Voltage)
08h
(Power Supply)
24h
(Platform Alert)
0Ch
(Memory
configuration
Error)
24h
(Platform Alert)
10h
(Event Logging
Disable)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
01h
(Threshold Based)
03h
(Sensor Specific)
03h
(Digital Discrete)
6Fh
(Digital Discrete)
03h
(Digital Discrete)
6Fh
(Sensor Specific)
Voltage on 3.3v
suspend
(management) power
supply
Voltage on 2.5v board
power supply
Voltage on 1.8v board
power supply
Voltage on 1.5v board
power supply
Voltage on 1.2v board
power supply
Voltage on 1.2v
suspend
Voltage on 1.1v board
power supply
Voltage on 1.0v board
power supply
Voltage on VTT_DDR
board power supply
Voltage on Vcore
board power supply
Power Good of the
system
The sensor is an
aggregation of a nalog
sensors and shows
the healthy state of
the module. If the
sensor is asserted,
the health LED lit on
amber
Specify memory is not
supported
FPGA health status,
assert when f irmware
is bad.
Status of the system
event log
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Sensor is only readable when
Payload Power is on.
Offset 3: Power Supply Input
Post
See IPMI v1.5 table 36.3,
Sensor type code 25h (Entity
Presence)
for definition
Offset 0: platform generated
page
Offset 1:platform generated
LAN alert
See IPMI v1.5 table 36.3,
Sensor type code 27h (LAN)
for definition
Offset 7: Configuration error
See IPMI v1.5 table 36.3,
Sensor type code 24h for
sensor definition
Offset 1:firmware bad
See IPMI v1,5 table 36.3,
Sensor type code 24h for
sensor definition.
Offset 2: Log area reset/
cleared
Offset 4:SEL FULL
Offset 5:SEL Almost FULL
See IPMI v1.5 table 36.3,
Sensor type code 10h (Event
Log Disable)for definition
31 AM4211
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SDR IDName Sensor Type Code Reading Type Code Description Event Offset
33 Mod SFP
34 SFP Link
35 GbE Link0
36 GbE Link1
25h
(Entity Present)
27h
(LAN)
27h
(LAN)
27h
(LAN)
08h
(Sensor specific)
6Fh
(sensor Specific)
6Fh
(sensor Specific)
6Fh
(sensor Specific)
The sensor shows
presence or absence
of SFP. No event is
generated.
Status of the SFP Link
Status of the GbE Link
0
Status of the GbE Link
1
Offset 0: Entity Present
Offset 1: Entity Absent
Sensor is only readable when
Payload Power is on.
Offset 0: LAN Hearthbeat lost
Offset 1: LAN Hearthbeat
See IPMI v1.5 table 36.3,
sensor type code 27h (L AN) for
definition
Offset 0: LAN Hearthbeat lost
Offset 1: LAN Hearthbeat
See IPMI v1.5 table 36.3,
sensor type code 27h (L AN) for
definition
Offset 0: LAN Hearthbeat lost
Offset 1: LAN Hearthbeat
See IPMI v1.5 table 36.3,
sensor type code 27h (L AN) for
definition
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5.1.2.1 OEM Sensor Description
5.1.2.1.1 Kontron FRU Info Agent
Table 5-2:Kontron FRU info agent sensor
Event/Read ing type
code
0Ah
Sensor type Sensor specific offset Event trigger
06h
C5h
OEM Kontron FRU
Info Agent
08h
Transition to degraded
Event Data 2 is used a bit flag error
Bit 7: unspecifiedError
Bit 6: notPresentError
Bit 5: multirecHeaderError
Bit 4: multirecDataError
Bit 3: timeout error
Bit 2: ipmcError
Bit 1: fruDataError
Bit 0: commonHeaderError
Event Data 3 is used a bit flag error
Bit 7: reserved
Bit 6: reserved
Bit 5: SetPortState Not Supported
Bit 4: SetPortState Error
Bit 3: reserved
Bit 2: reserved
Bit 1: reserved
Bit 0: Match Error, Not in single link matches
Install Error
Event Data 2 is used a bit flag error
Bit 7: unspecifiedError
Bit 6: notPresentError
Bit 5: multirecHeaderError
Bit 4: multirecDataError
Bit 3: timeout error
Bit 2: ipmcError
Bit 1: fruDataError
Bit 0: commonHeaderError
Event Data 3 is used a bit flag error
Bit 7: SetClockState Not Supported
Bit 6: SetClockState Error
Bit 5: SetPortState Not Supported
Bit 4: SetPortState Error
Bit 3: Clock Internal Mismatch
Bit 2: Clock Match Error, Not a single clock matches
Bit 1: Internal mismatch
Bit 0: Match Error, Not in single link matches
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5.1.2.1.2 Kontron IPMB-L Link
Table 5-3:Kontron IPMB-L Link sensor
Event/Read ing type
code
6Fh
Sensor type Sensor specific offset Event trigger
02h
C3h
OEM Kontron
IPMB-L Link
03h
IPMB-L Disable
Event Data 2: always 0
Event Data 3:
bit[7:3]: always 0
bit [2:0]:
0h = no failure
1h = Unable to drive clock HI
2h = Unable to drive data HI
3h = Unable to drive clock LO
4h = Unable to drive data LO
5h = clock low timeout
6h = Under test (the IPM Controller is attempting to
determine who is causing a bus hang)
7h = Undiagnosed Communication Failure
IPMB-L Enable
Event Data 2: always 0
Event Data 3:
bit[7:3]: always 0
bit [2:0]:
0h = no failure
1h = Unable to drive clock HI
2h = Unable to drive data HI
3h = Unable to drive clock LO
4h = Unable to drive data LO
5h = clock low timeout
6h = Under test (the IPM Controller is attempting to
determine who is causing a bus hang)
7h = Undiagnosed Communication Failure
5.1.2.1.3 Kontron MMC Firmware Upgrade Status
Table 5-4:Kontron MMC FW upgrade status sensor
Event/Read ing type
code
6Fh
Sensor type Sensor specific offset Event trigger
CAh
OEM Kontron
External
Component
Firmware Upgrade
Status
00h Firmware Upgrade in Progress (no event)
01h Firmware upgrade succeeded
02h Firmware upgrade failed
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5.1.2.1.4 Kontron Reset
Table 5-5:Kontron reset sensor
Event/Read ing type
code
03h
Sensor type Sensor specific offset Event trigger
CFh
OEM Kontron
RESET
00h
01h
State Asserted /
State Deasserted
Event Data 2: Reset Type
00h: Warm reset
01h: Cold reset
02h: Forced Cold [Warm reset reverted to Cold]
03h: Soft reset [Software jump]
Event Data 3: Reset Source
00h: IPMI Watchdog [cold, warm or forced cold]
(IPMI Watchdog2 sensors gives dditional details)
01h: IPMI commands cold, warm or forced cold]
(chassis control, fru control)
02h: Processor internal checkstop
03h: Processor internal reset request
04h: Reset button [warm or forced cold]
05h: Power up [cold]
06h: Legacy Initial Watchdog / Warm Reset Loop Detection
* [cold reset]
07h: Legacy Programmable Watchdog [cold, warm or forc ed
cold]
08h: Software Initiated [soft, cold, warm of forced cold]
09h: Setup Reset [Software Initiated Cold]
FFh: Unknown
5.1.2.1.5 Kontron User SW UpgradeStatus
Table 5-6:Kontron user SW upgrade status sensor
Event/Read ing type
code
6Fh
Sensor type Sensor specific offset Event trigger
CAh
OEM Kontron
External
Component
Firmware Upgrade
Status
00h Firmware Upgrade in Progress (no event)
01h Firmware upgrade succeeded
02h Firmware upgrade failed
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5.1.2.2 Sensor Thresholds
Following table shows sensor thresholds for voltages
Table 5-7:Voltage sensor thresholds
SENSOR Number / ID string Lower Non-Re-
coverable
Vcc +3.3VSUS 2.802V 2.955V - - 3.623V 3.806V
Vcc +12V In 8.152V 9.826V - -
Vcc Vcore 0.987V 1.087V - -
Vcc +1.1V 0.971V 1.032V - -
Vcc +1.5V 1.321V 1.423V - -
Vcc +1.8V 1.062V 1.682V - -
Vcc VTT_DDR 0.643V 0.682V - -
Vcc +2.5V 2.197V 2.342V - -
Vcc +1.2V 0.907V 1.120V - -
Vcc +1.0V BCM 0.569V 0.932V - -
Vcc +3.3V 2.951V 3.093V - -
Vcc +1.2V SUS 1.053V 1.114V - -
Vcc +5V 4.126V
Lower critical
4.126V
Lower non critical
- -
Upper non
critical
Upper
critical
1 4 . 2 4 4 V
1. 16 5V
1.1 70 V
1. 57 9V
1.920V
0.821V
2.660V
1.312V
1.051V
3.512V
1.289V
5.597V
Upper Non-Recoverable
15.918V
1.230V
1.231V
1.681V
2.540V
0.860V
2.805V
1.525V
1.414V
3.654V
1.350V
5.597V
Note:
Lower non critical and upper non critical values are not set to ensure no error in normal operation.
Note:
Vcc +1.8V Sensor is only monitored when the SyncE option is installed.
5.1.3 Field Replaceable Unit (FRU) Information
This FRU information contains the IPMI defined Board and Product Information areas that hold the part
number and serial number of the board and the Multirecord Information Area that contains the PICMG
defined Module Current Requirement Record, the AMC Point-to-Point Connectivity Record and the Clock
Configuration Record.
The Internal Use Area is pre-allocated to 384 bytes and is free for customer use.
This FRU information responds to FRU ID #0, which is the ID for the MMC.
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5.1.4 E-Keying
E-Keying has been defined in the AMC.0 Specification to prevent board damage, prevent wrong operation,
and verify fabric compatibility. The FRU data contains the AMC Point-to-Point Connectivity record as
described in Section 3.9 of the AMC.0 R2.0 specification.
When the Module is inserted in an ATCA AMC carrier or MicroTCA system, the carrier manager reads in the AMC
Point-to-Point Connectivity record from FRU and determines whether the Board can enable the ports to the
AMC connector. Set/Get AMC Port State IPMI commands defined by the AMC.0 specification are used for
either granting or rejecting the E-keys.
5.1.5 Watchdog
The complete startup and execution process is guarded using external watchdog timers implemented by the
hardware management subsystem IPMC. There are 4 distinct watchdog timers running during:
•boot initialization and early boot monitor execution
•boot monitor execution and preparation for OS loading
•OS execution and initialization
The watchdog timers will trigger a specific action when expired. The action is dependent on previous resets
and on watchdog type.
The standard IPMI watchdog as implemented by the Linux IPMI driver supports different actions on watchdog
timer expiry and a configurable watchdog pre-timeout.
This pre-timeout period is configurable from 1 second up. The pre-timeout allows application software to
take actions just before the watchdog is triggered and causes a reset or error-halt-state. The pre-timeout
action can either be configured to trigger a Linux kernel panic, where appropriate panic-handlers can collect
data, or to inform a user-space application of the pre-timeout event.
5.1.6 MMC Firmware Code
MMC firmware code is organized into boot code and operational code, both of which are stored in a flash
module. Upon an MMC reset, the MMC executes the boot code and performs the following:
•Self test to verify the status of its hardware and memory.
•Calculates a checksum of the operational code.
Upon successful verification of the operational code checksum, the firmware will jump to the operational
code.
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5.1.7 Updating MMC Firmware
Updating the MMC is possible in 2 different ways depending on the operating system running on the module.
Those are:
•using ipmitool from the Linux shell (HPM.1 specification)
•IOL/Bridge + HPM
5.1.8 Override AMC.0 R2 support
Some carrier board are not AMC.0 R2 compliant.The AM4211 board firmware does not boot when Fat pipe is
configured in PCIe mode.Use the following command to override AMC.0 R2:
• Override support of AMC.0 R2
# ipmitool raw 0x3e 0x20 0x18 0x1
• Enable support of AMC.0 R2 (default)
# ipmitool raw 0x3e 0x20 0x18 0x0
5.2 Board Firmware
The system is delivered with a bootloader and Linux OS preinstalled on the on-board 128MB NOR flash. The
system will boot by default from this flash, which is directly connected to the bootbus of the Cavium OCTEON
NPU. In addition to the on-board flash the board supports a mounted USB flash drive that can be used for
application data. This USB flash drive is not used for booting in the default configuration.
The on-board flash is logically divided into two 64MB sections each consisting of 512 flash sectors. They are
referred to as image0 and image1. The table 5-13 shows the physical addresses and associated flash sectors
for each image once the board has booted on image 0.
Table 5-8:Fabric Default Flash Sector to Image Association
Physical Address Range Linux MTD Partitions Flash Sectors Logical Image
0x17C00000 – 0x1BBFFFFF mtd0 - mtd3 0 – 511 Image0
0x1BC00000 – 0x1FBFFFFF mtd4 - mtd7 512 – 1023 Image1
Image0 and image1 can be swapped by a simple IPMI command. Physically, the uppermost address line of the
flash device is inverted in this case. Flash sector to logical image association remains the same; however
physical address to logical image association will be swapped as shown below.
Table 5-9:Swapped Flash Sector to Image Association
Physical Address Range Linux MTD Partitions Flash Sectors Logical Image
0x17C00000 – 0x1BBFFFFF mtd0-mtd3 512 – 1023 Image1
0x1BC00000 – 0x1FBFFFFF mtd4 - mtd7 0 – 511 Image0
As the OCTEON NPU always starts booting from the first physical address in the flash, image0 system is started
in the first case and image1 in the second.
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After Linux startup, the flash is divided into 8 partitions (mtd0-mtd7) associated to the physical addresses as
shown in the AM4211 partition scheme below. Note that association of MTD partitions to image depends on
the started image as shown above.
Table 5-10:On-board 128 MB NOR Flash layout
Physical Address Offset in flash Size Linux Partition Designation Description
0x17C00000 0 896KiB mtd0 uboot Active bootloader image
0x17CE0000 0xE0000 256KiB mtd1 env
0x17D20000 0x120000 40960KiB mtd2 kernel_rootfs Active linux and Root file system
0x1A520000 0x2920000 23424KiB mtd3 user_jffs2 Active user filesystem
0x1BC00000 0x4000000 896KiB mtd4 uboot_backup Backup bootloader
0x1BCE0000 0x40E0000 256KiB mtd5 env_backup
0x1BD20000 0x4120000 40960KiB mtd6 kernel_rootfs_backup Backup Linux and root filesystem
0x1E520000 0x6920000 23424KiB mtd7 user_jffs2_backup Backup user file system
Active bootloader configuration
variables
Backup bootloader configuration
variables
When shipped from factory, image0 and image1 contain identical bootloader and firmware images and
image0 system is booted by default. Image1 serves as a backup system which is started in case that image0
fails for some reason. It is recommended to always boot and work from image0 and leave image1 firmware
untouched. This allows easy activation of the original firmware in case of any errors or corruption in the
active image.
5.2.0.1 Image swap using bootloader predefined commands
The current firmware image is displayed during startup. It can be changed from the bootloader. Below are the
available commands to change boot image. Those commands can be used in the U-Boot.
•Change to image 0
Kontron T5519# run activate_image0
•Change to image 1
Kontron T5519# run activate_image1
Using one of these commands, the board will immediately boot the selected image.
5.2.0.2 Image swap using ipmitool
Image swap can also be achieved using the ipmitool from the Linux shell of the board. The following
command syntax must be used (IMAGE: 0 or 1):
~ # ipmitool raw 0x3e 0x20 0x00 <IMAGE>
It is possible to invoke the ipmitool with the same parameters from the AMC carrier that holds the AM4211 or
even from external server provided that the ipmitool installed supports the Kontron OEM extensions.
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However, the command must be invoked with appropriate bridging parameters set. E.g. on an AT8404 carrier
with the AM4211 inside Bay 4, the syntax would be:
# ipmitool -b 7 -t 0x80 kontron boot set 0 0
Note:
In case that no ipmitool is available on a carrier or host server and image 0 has been corrupted, the
board will perform an image swap automatically triggered by the system watchdog. An image swap
is performed automatically by the MMC after the 3rd unsuccessful boot attempt (3 consecutive
boot-up watchdog triggers)
5.2.1 Switching between Firmware Images
The IPMI command used for image swap can be executed either from the bootloader shell with a predefined
script command or with a specific ‘ipmitool’ command either from the board itself, from an ATCA carrier or
from an external server.
5.3 Bootloader
On the AM4211 Advanced Mezzanine Card (AMC), the bootloader ‘u-boot‘ (universal bootloader) is used. The
bootloader initializes the main components of the board like CPU, DDR3 RAM, serial lines etc. for operation
and performs a power on self test (POST). After these steps have been finished, Linux kernel and application
are started from flash. Bootloader used on the AM4211 is a modified version from u-boot version 2011.03
included in the OCTEON SDK 2.2. The following section describes most of the differences from the original uboot that are used for the AM4211.
Generic u-boot features are not described in this section. Please read the u-boot documentation if the
requested information is not describe in this section.
5.3.1 Bootloader shell and options
The boot process can be interrupted by typing the bootstopkey phrase “stop”. This will open a bootloader
command line interface.
Entering “?” provides a list of possible built-in commands, “printenv” provides a list of current environment
settings. The bootloader shell can be used to customize boot options and system startup by changing some of
its environment variables. A list of available environment variables and its description can be seen in the
table below.
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Table 5-11: Bootloader environment variables
Name Type Description
Contains the default base MAC address for the OCTEON Ethernet interfaces. This
boardmacaddr Var
bootcmd Script
bootdelay Var
kernel_rootfs_update Script
kernel_rootfs_backup_update Script
disable_kcs Var
ethact Var
linuxcores Var
linuxmem Var
loadaddr Var
netretry Var
nuke_user_jffs2 Script
nuke_user_jffs2_backup Script
uboot_backup_update Script
uboot_update /
bootloaderupdate
watchdogboot Var
Script
variable is automatically set by the bootloader when the MAC address was read from
the MMC/KCS interfaces. This should only be set manually when disable_kcs=yes or
ignore_kcserr=yes to provide a “fallback” MAC address, when the KCS/MMC
interface is not available or fails
This variable defines a command string that is automatically executed when the
initial countdown is not interrupted.
This command is only executed when the variable bootdelay is also defined!
After reset, U-Boot will wait this number of seconds before it executes the contents
of the bootcmd variable. If the bootstopkey phrase is typed during this time, the
bootloader command line interface is entered.
Set this variable to 0 boots without delay. Be careful: depending on the contents of
your bootcmd variable, this can prevent you from entering interactive commands
again forever!
Set this variable to -1 to disable autoboot.
default: 5 for flash based bootloader, -1 for RAM resident bootloader
Command script to flash a binary image transferred with tftpboot to the active
image flash partition kernel_rootfs
Command script to flash a binary image transferred with tftpboot to the backup
image flash partition kernel_rootfs_backup
yes – completely disable all IPMI KCS access from bootloader
<not set> - use KCS interface to retrieve MAC address and program watchdog et al
(default)
Default network interface used by network commands (bootp, tftpboot)
default: octmgmt0
Contains the number of CPU cores to allocate to the Linux kernel booted by the
default boot commands
default: 10
Contains the amount of RAM in MB to allocate for the Linux kernel booted by the
default boot comands
default: 2048 (with a 2 Gig) 4096 (with a 4 Gig)
Default load address for network transfers. This is used as a temporary storage for
netbooting and firmware updates.
default: 0x20000000
<not set> – retry a failed netboot command infinitely with the interface defined by
‘ethact’ environment variable.
no – do not retry failed net boot commands (bootp, tf tpboot et al) using all
available interfaces (default)
yes – retry a failed netboot command by iterating through all available interfaces
Command script that erases the active image partition of the onboard flash
partition user_jffs2
Command script that erases the backup image partition of the onboard flash
partition user_jffs2_backup
Command script to flash a U-Boot binary image transferred with tftpboot to the
backup image bootloader
Command script to flash a U-Boot binary image transferred with tftpboot to the
active image bootloader
0 – disable boot monitor watchdog (default)
5...n – timeout in seconds before boot monitor watchdog fires
Note: This is the pBMWD watchdog
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Name Type Description
0 – disable OS load watchdog (default)
watchdogos Var
ignoreposterr Var
postresult Auto
memtest Var
bootstopkey Var
15...n – timeout in seconds before load OS watchdog fires
Note: This is the pOSWD watchdog
0 – stop boot process if power on self test errors are detected
1 – continue boot in the presence of power on self test errors (default)
Contains the power on self tests results:
0 - POST successful (default),
1 - POST failed
0 = no DRAM test during POST
1 - quick DRAM test (default)
2 - full DRAM test
string to wait for during startup. If this string is entered, U-Boot will interrupt the
boot process, stop the watchdog and will start its internal command line interface.
default: “stop”
There are 3 different types of bootloader environment variables:
•Script: The variable is a set of consecutive (more simple) bootloader commands to perform a specific
task. A command script is invoked using the ‘run <script>’ syntax. E.g. the ‘run nuke_env’
command would erase the bootloader environment sectors causing the bootloader to use its
default environment upon next restart.
•Var: The variable controls a specific behavior of the bootloader startup sequence. E.g. the
‘bootdelay’ variable controls the time u-boot waits before execution of the bootcmd which
normally loads and starts the Linux kernel.
•Auto: The variable is automatically set during bootloader startup sequence. E.g. the ‘postresult’
variable stores the result of the POST.
It is possible to modify environment variables and start the pre-defined scripts from the bootloader shell. It
is strongly recommended not to modify the pre-defined script variables. However, definition and execution
of user-defined script variables can be done.
CAUTION
Changing bootloader environment variables must be taken very carefully. It will
change system behavior and can lead to a non-booting system
For additional information about u-boot, refer to http://sourceforge.net/projects/u-boot/
Modification of bootloader environment variables is done using the ‘setenv’ and ‘saveenv’ bootloader CLI
commands. In the following example, the new environment script variable ‘bootcmdmyscript’ is defined. In
addition, bootdelay is increased to 10. Finally, all changes are stored into flash environment sector.
Kontron T5519# setenv bootcmdmyscript ‘bootp; tftpboot ${loadaddr} myimg.multi; bootm ${loadaddr}’
Kontron T5519# setenv bootdelay 10
Kontron T5519# saveenv
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Environment changes are stored in the bootloader environment sectors. In case of failure (e.g. power loss),
default setting are used and the following startup message is displayed:
Using default environment
Any changes of the environment can be cleared using the following commands:
Kontron T5519# env default -f
Kontron T5519# saveenv
5.3.2 Protected variables
Several variables are of great relevance for the system and are stored in a protected section of NVRAM. Some
of these protected variables are, for example, the serial number of the module and the MAC addresses of the
network interfaces, which are programmed during production and normally should not be changed.
5.3.3 NetConsole
If you are deploying a system, which has no UART connected to it, or is not practical to connect, you can use
the network console. In U-Boot, the network console is implemented via the standard “devices” mechanism,
which means that you can switch between the serial and network input/output devices by adjusting the
'stdin' and 'stdout' environment variables. To switch to the networked console, follow these instructions:
1 On AM4211, run the u-boot and enter the monitor shell
2 Setup network environment. For example:
LOCAL IP
# setenv ipaddr 192.168.100.2
# setenv netmask 255.255.255.0
HOST IP
# setenv gatewayip 192.168.100.1
# setenv serverip 192.168.100.1
# setenv ncip 192.168.100.1
3 To activate Netconsole, type the following command:
# run nc
4 On the host computer, create the “my_nc” script with the following content:
#! /bin/bash
[ $# = 1 ] || { echo "Usage: $0 target_ip" >&2 ; exit 1 ; }
TARGET_IP=$1
stty -icanon -echo intr ^T
nc -u -l 6666 < /dev/null &
nc -u ${TARGET_IP} 6666
stty icanon echo intr ^C
5 On the host computer, run network console startup script.
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# ./my_nc 192.168.100.2
The U-Boot shell should be accessed
5.3.4 Booting Embedded Linux firmware from eUSB device
Follow these instructions to boot Cavium Embedded Linux from onboard USB mass-storage:
1 Make sure the USB mass-storage is formatted in FAT32 and copy any firmware to the USB mass-storage
supported by board under test.
2 Connect to bootloader shell by entering the bootloader bootstop phrase ‘stop‘
3 Start the USB controller:
Kontron T5519# usb start
4 Copy the firmware file from the USB storage device to board memory:
Kontron T5519# fatload usb 0:1 0x20000000 [firmware_file]
5 Start the new firmware from memory:
Kontron T5519# bootoctlinux 0x20000000 numcores=${linuxcores} mem=${linuxmem} console=ttyS0,${baudrate} ${mtdparts} ${bootargs}
5.3.5 U-boot memory configurations
Some of the memory configurations need to be done manually using u-boot environment variables.
The following are the possible memory configurations:
1 Configuring the DDR clock / data rate:
Kontron T5519# setenv ddr_clock_hertz [CLOCK]
[CLOCK] = DDR clock in hertz, the real data rate will be de double of this value.
Here is an example:
Kontron T5519# setenv ddr_clock_hertz 533333333
Will configure the DDR clock at 533Mhz, the data rate will be 1066Mhz.
Kontron T5519# setenv ddr_clock_hertz 666666666
Will configure the DDR clock at 666Mhz, the data rate will be 1333Mhz.
2 Configuring the memory window used in Linux environment:
Kontron T5519# setenv linuxmem [SIZE]
[SIZE] = size of memory in megabytes, here is an example:
Kontron T5519# setenv linuxmem 2048M
Will configure a memory window of 2GB for Embedded Linux.
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5.3.6 Network interfaces
The following table represents the logical u-boot network interfaces related to their physical Cavium
connection (QLM):
Table 5-12:Bootloader network interfaces
AMC Port Cavium physical interfaces (QLM) u-boot logical name(s)
0 RGMII 0 octmgmt0
1 RGMII1 octmgmt1
8 to 11 QLM1 / XAUI octeth1
8 QLM1 / SGMII Lane 0 octeth1
9 QLM1 / SGMII Lane 1 octeth2
10 QLM1 / SGMII Lane 2 octeth3
11 QLM1 / SGMII Lane 3 octeth4
Front SFP QLM2 / 1000Base-X octeth0
Front SFP+ QLM2 / 10GbE octeth0
U-Boot automatically sets the variable ethact to the name of the Ethernet interface that is currently active
(default: octmgmt0). This variable can be changed on host to force U-Boot to use a different network
interface.
5.3.7 Bootloader Update
To update the bootloader, the new U-boot binary is transferred to the board using TFTP. After that, this
binary is written into the onboard flash. The internal controller is used for network connection.
Prerequisites: a working TFTP server, DHCP server and network connectivity to the DHCP and TFTP server. The
new bootloader image has to be stored on the TFTP server. No jumper settings are required on the AM4211.
There is one possible way to update the bootloader image and it’s by using the predefined update scripts from
the bootloader CLI. It is recommended to always update firmware of the active image. In case of a failure, it is
possible to restore the board using the still unchanged redundant image. After the updated firmware is
running properly, the redundant image can be updated to the same version, only if it is required.
The following procedure defines the update of the image 0 bootloader:
•Start system and connect to serial console
•Connect to bootloader shell by entering the bootloader bootstop phrase ‘stop’
U-Boot 2011.03-KCI-0.42 (Development build, svnversion: u-boot:exported, exec:) (Build time:
Mar 12 2012 - 13:56:25)
Skipping PCIe port 0 BIST, in EP mode, can't tell if clocked.
Skipping PCIe port 1 BIST, reset not done. (port not configured)
BIST check passed.
DFM interface initialized 512 MB
KONTRON_T5519 FPGA version: 14 Revision: 3
Reset Type: 01 cold reset, Source: 08 Software Initiated
KONTRON_T5519 board revision major:3, minor:0
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OCTEON CN6645-AAP pass 1.2, Core clock: 1100 MHz, IO clock: 800 MHz, DDR clock: 533 MHz (1066
Mhz data rate)
Base DRAM address used by u-boot: 0x4f800000, size: 0x800000
DRAM: 1 GiB
Clearing DRAM...... done
KCS: Reading boot image number : Image 0
KCS: Reading front SFP settings : Front SFP GE
KCS: Reading fat pipe settings : Port 4-7 = Target PCIe, Port 8-11 = Disable
KCS: Reading PCIe clock source : external FCLKA
KCS: Reading ethaddr : 00:a0:a5:78:5d:74
KCS: Reading serial# : 9009096065
KCS: Reading Power throttling : CORE0:70 CORE1:70 CORE2:70 CORE3:70 CORE4:70
: CORE5:70 CORE6:70 CORE7:70 CORE8:70 CORE9:70
Flash: 128 MiB
PCIe: Port 0 in endpoint mode.
PCIe: Port 1 is unknown, skipping.
PCI console init succeeded, 1 consoles, 1024 bytes each
Net: Bcm8707: probed
octmgmt0, octmgmt1, octeth0
USB: USB EHCI 1.00
scanning bus for devices... 1 USB Device(s) found
Type the command 'usb start' to scan for USB storage devices.
autoboot in 5 seconds...
press 'stop' phrase to abort
IPMI watchdog stopped
Kontron T5519#
<==== Enter ‘stop’ now
•Get proper network settings
Kontron T5519# dhcp
•Update U-Boot
Kontron T5519# tftp ${loadaddr} u-boot-kontron_t5519-0.42.bin
Kontron T5519# bootloaderupdate
Kontron T5519# reset
5.3.8 Embedded Linux update
1 Start system and connect to serial console
2 Connect to bootloader shell by entering the bootloader bootstop phrase ‘stop’
3 Get proper network settings
Kontron T5519# dhcp
4 Update Embedded linux to version x.xx. Below is an example (kernel_rootfs is the first bank):
Kontron T5519# tftpboot ${loadaddr} vmlinux.64-kontron_t5519_0.42
Kontron T5519# run kernel_rootfs_update
Kontron T5519# reset
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5.4 Embedded Linux
5.4.1 Embedded filesystem and init script customizations
The embedded Linux file system on the AM4211 is an initramfs. This means that any file can be modified but
will return to their original states after a Cavium NPU restart.
By default there is a flash partition that is automatically mounted to /mnt. This partition can be
used to have permanent R/W storage space. All data stored in /mnt will be permanently saved to the
flash (user_jffs2, /dev/mtd3).
You can also creating custom initialization script by adding this in the user_jffs2 partition (/mnt):
# mkdir /mnt/etc
# vi /mnt/etc/rc.local
Add your init code in this file (shell script).
# chmod +x /mnt/etc/rc.local
The script file /mnt/etc/rc.local will be executed at the end of each boot.
5.4.2 Access to NFS share from Cavium Embedded Linux
There is no portmap included in Cavium embedded Linux. To mount NFS share you need to disable
the locking mechanism with the -o arguments, here is an example:
# mount -o nolock [SHARE_ADDRESS] [MOUNT_POINT]
5.4.3 eUSB Storage
The optional eUSB storage can be used into the Linux environment. To mount the device, use the following
commands:
# mkdir /mnt/usb
# mount /dev/sda1 /mnt/usb
5.4.4 Booting over PCI (oct-remote-boot)
Octeon can be booted from a remote host without the need for a boot flash on the Octeon board. For PCI
targets, the Octeon board must be configured for PCI boot mode. This keeps all cores in reset after the chip is
taken out of reset.
1 With cfgtool, select one of the following modes:
[23] Port 4-7 = Target PCIe, Port 8-11 = Disable ( BOOT_PCIE )
[24] Port 4-7 = Target PCIe, Port 8-11 = Target PCIe ( BOOT_PCIE )
[25] Port 4-7 = Target PCIe, Port 8-11 = LAN - XAUI ( BOOT_PCIE )
[26] Port 4-7 = Target PCIe, Port 8-11 = LAN - SGMII ( BOOT_PCIE )
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Power cycle the PCIe Host board.
2 On the PCIe Host board, use <lspci> and validate that the AM4211 is present in the displayed list
0f:00.0 MIPS: Cavium Networks Unknown device 0092 (rev ff)
3 On the PCIe Host board, go to the remote-utils folder of the Cavium SDK.
cd <Cavium SDK>/host/remote-utils
4 Configure the remote protocol env variable
export OCTEON_REMOTE_PROTOCOL=PCI
5 Start U-boot on AM4211
./oct-remote-boot --board=generic --ddr0spd=0x50 --ddr_clock_hz=5333333333 u-bootkontron_t5519.bin
Note:
To disable the Boot PCIe mode, use the one of the following method:
From the Host Board:
# ipmitool -m 0x20 -t 0x7a -b 7 raw 0x3e 0x20 2 0
From the AM4211 u-boot shell:
# kcs raw 0x3e 0x20 2 0
From the AM4211 linux shell:
# ipmitool raw 0x3e 0x20 2 0
# cfgtool –p 0 –s -c
Please refer to the online documentation provided with the Cavium Networks SDK for more details.
5.4.5 Onboard flash access within Cavium Embedded Linux
The Linux environment use MTD support to access the Flash device, here are the MTD partitions:
Table 5-13:Embedded Linux MTD partitions
Flash logical name Descriptions Partitions address
Size
uboot Active bootloader /dev/mtd0
env Active bootloader configuration /dev/mtd1
kernel_rootfs Active Linux et Root filesystem /dev/mtd2
user_jffs2 Active User filesystem /dev/mtd3
uboot_backup Backup bootloader /dev/mtd4
env_backup Backup bootloader configuration /dev/mtd5
kernel_rootfs_backup Backup Linux et Root filesystem /dev/mtd6
user_jffs2_backup Backup User filesystem /dev/mtd7
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5.4.6 Ethernet over Serial Rapid IO
Linux has an Ethernet device for each of the four standard Rapid IO mailboxes. The following Ethernet
interfaces are available through «ifconfig».
• rio0 = Interface 0, send/receive on mailbox 0
• rio1 = Interface 0, send/receive on mailbox 1
• rio2 = Interface 0, send/receive on mailbox 2
• rio3 = Interface 0, send/receive on mailbox 3
Since the Rapid IO transport is different from the expected ethernet transport, these devices treat MAC
addresses specially. Extra data describing the Rapid IO message header fields is encoded into the
destination MAC address. The format of the MAC address is:
Table 5-14:SRIO MAC adress
Byte Bits Description
0-3 31: 0 Must be zero.
4-5 15:0 16 bits for the SRIO destination ID.
Please refer to the online documentation provided with the Cavium Networks SDK for more details.
5.5 Using CFGTOOL
cfgtool is a central configuration software included in the embedded firmware of the AM4211. This software
perform the low-level configuration of the AM4211 including updating the FRU data to reflect the selected
configuration.
What cfgtool can do:
• Configure the QLM interfaces connected to the backplane.
• Configure the PCI-express clock source of the QLM interfaces.
• Configure the SFP+ front interface mode.
• Configure power throttling of the Cavium processor.
5.5.1 Usage
cfgtool [--help|-h][--status|-t][--interface|-i][--fatpipe|-p][--clock|-k]
[--power|-w][--core0|-0][--core1|-1]
[--core2|-2][--core3|-3][--core4|-4][--core5|-5]
[--core6|-6][--core7|-7][--core8|-8][--core9|-9]
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[--set|-s][--cycle|-c][--nofru|-n]
[--debug|-d]
-h Show possible settings available for this board
-t Show current running configuration
-i <num> Interface setting
-p <num> Fatpipe setting
-k <num> Clock setting
-w <pwr> AMC optimized power (Watts)
-0 <pwr> Core 0 power throttle (%)
-1 <pwr> Core 1 power throttle (%)
-2 <pwr> Core 2 power throttle (%)
-3 <pwr> Core 3 power throttle (%)
-4 <pwr> Core 4 power throttle (%)
-5 <pwr> Core 5 power throttle (%)
-6 <pwr> Core 6 power throttle (%)
-7 <pwr> Core 7 power throttle (%)
-8 <pwr> Core 8 power throttle (%)
-9 <pwr> Core 9 power throttle (%)
-s Set configuration (change HW setting and update ekeying info)
-c Perform power cycle of payload power to activate settings
-n No FRU data modification
-d Debug flag
-V Version information
5.5.1.1 Detailed Description of the Options
-h | --help
This option shows a list of possible settings.
~ # cfgtool -h
Config Options for [3] AM4211/T5519, Rev 2 CN66XX
[--interface|-i <num>]
[0] Front SFP XAUI
[1] Front SFP GE
[--fatpipe|-p <num>]
[ 0] Port 4-7 = Disable, Port 8-11 = Disable
[ 1] Port 4-7 = Disable, Port 8-11 = Target PCIe
[ 2] Reserved
[ 3] Port 4-7 = Disable, Port 8-11 = Host PCIe
[ 4] Port 4-7 = Disable, Port 8-11 = LAN - XAUI
[ 5] Port 4-7 = Disable, Port 8-11 = LAN - SGMII
[ 6] Port 4-7 = Target PCIe, Port 8-11 = Disable
[ 7] Port 4-7 = Target PCIe, Port 8-11 = Target PCIe
[ 8] Port 4-7 = Target PCIe, Port 8-11 = LAN - XAUI
[ 9] Port 4-7 = Target PCIe, Port 8-11 = LAN - SGMII
[10] Port 4-7 = Host PCIe, Port 8-11 = Disable
[11] Port 4-7 = Host PCIe, Port 8-11 = Host PCIe
[12] Port 4-7 = Host PCIe, Port 8-11 = LAN - XAUI
[13] Port 4-7 = Host PCIe, Port 8-11 = LAN - SGMII
[14] Port 4-7 = Target sRIO, Port 8-11 = Disable
[15] Port 4-7 = Target sRIO, Port 8-11 = Target PCIe
[16] Reserved
[17] Port 4-7 = Target sRIO, Port 8-11 = LAN - XAUI
[18] Port 4-7 = Target sRIO, Port 8-11 = LAN - SGMII
[19] Port 4-7 = Host sRIO, Port 8-11 = Disable
[20] Port 4-7 = Host sRIO, Port 8-11 = Host PCIe
[21] Port 4-7 = Host sRIO, Port 8-11 = LAN - XAUI
[22] Port 4-7 = Host sRIO, Port 8-11 = LAN - SGMII
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[23] Port 4-7 = Target PCIe, Port 8-11 = Disable ( BOOT_PCIE )
[24] Port 4-7 = Target PCIe, Port 8-11 = Target PCIe ( BOOT_PCIE )
[25] Port 4-7 = Target PCIe, Port 8-11 = LAN - XAUI ( BOOT_PCIE )
[26] Port 4-7 = Target PCIe, Port 8-11 = LAN - SGMII ( BOOT_PCIE )
[--clock|-k <num>]
[0] Local Clock
[1] External FCLKA
[--power|-w <pwr>]
[20-40] AMC Optimized Power Value in Watts
[--core0|-0 <pwr>]
[10-100] Core Power Throttle in %
[--core1|-1 <pwr>]
[10-100] Core Power Throttle in %
[--core2|-2 <pwr>]
[10-100] Core Power Throttle in %
[--core3|-3 <pwr>]
[10-100] Core Power Throttle in %
[--core4|-4 <pwr>]
[10-100] Core Power Throttle in %
[--core5|-5 <pwr>]
[10-100] Core Power Throttle in %
[--core6|-6 <pwr>]
[10-100] Core Power Throttle in %
[--core7|-7 <pwr>]
[10-100] Core Power Throttle in %
[--core8|-8 <pwr>]
[10-100] Core Power Throttle in %
[--core9|-9 <pwr>]
[10-100] Core Power Throttle in %
-t | --status
This option shows the present configuration stored in NVRAM of the MMC. This setting will take effect after
invoking a "Chassis Control Power cycle" command or after a complete hotswap cycle with remove and
reinsertion of the module.
~ # cfgtool -t
Getting Current Settings...
==============================================================================
Board Type: [3] AM4211/T5519, Rev 2 CN66XX
Image : [1] Image 1
==============================================================================
Current Setting:
-----------------------------------------------------------------------------Interf.: [0] Front SFP XAUI
Fatpipe: [19] Port 4-7 = Host sRIO, Port 8-11 = Disable
CLK : [0] Local Clock
Power : 39.60 Watt
Core 0 : 100%
Core 1 : 100%
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Core 2 : 100%
Core 3 : 100%
Core 4 : 100%
Core 5 : 100%
Core 6 : 100%
Core 7 : 100%
Core 8 : 100%
Core 9 : 100%
==============================================================================
-I | --interface <INTF>
This option configures the FRONT SFP+ interface.
This option checks if the setting <INTF> is possible for this board.
To set this setting the
[-s|--set] option has to be appended.
Possible configurations are:
0 XAUI, 10G Optical fiber.
1 GE, 1G copper.
-p | --fatpipe <num>
This option configures the QLM0/1 connected to the AMC connector.
Possible configurations are:
[ 0] Port 4-7 = Disable, Port 8-11 = Disable
[ 1] Port 4-7 = Disable, Port 8-11 = Target PCIe
[ 2] Reserved
[ 3] Port 4-7 = Disable, Port 8-11 = Host PCIe
[ 4] Port 4-7 = Disable, Port 8-11 = LAN - XAUI
[ 5] Port 4-7 = Disable, Port 8-11 = LAN - SGMII
[ 6] Port 4-7 = Target PCIe, Port 8-11 = Disable
[ 7] Port 4-7 = Target PCIe, Port 8-11 = Target PCIe
[ 8] Port 4-7 = Target PCIe, Port 8-11 = LAN - XAUI
[ 9] Port 4-7 = Target PCIe, Port 8-11 = LAN - SGMII
[10] Port 4-7 = Host PCIe, Port 8-11 = Disable
[11] Port 4-7 = Host PCIe, Port 8-11 = Host PCIe
[12] Port 4-7 = Host PCIe, Port 8-11 = LAN - XAUI
[13] Port 4-7 = Host PCIe, Port 8-11 = LAN - SGMII
[14] Port 4-7 = Target sRIO, Port 8-11 = Disable
[15] Port 4-7 = Target sRIO, Port 8-11 = Target PCIe
[16] Reserved
[17] Port 4-7 = Target sRIO, Port 8-11 = LAN - XAUI
[18] Port 4-7 = Target sRIO, Port 8-11 = LAN - SGMII
[19] Port 4-7 = Host sRIO, Port 8-11 = Disable
[20] Port 4-7 = Host sRIO, Port 8-11 = Host PCIe
[21] Port 4-7 = Host sRIO, Port 8-11 = LAN - XAUI
[22] Port 4-7 = Host sRIO, Port 8-11 = LAN - SGMII
[23] Port 4-7 = Target PCIe, Port 8-11 = Disable ( BOOT_PCIE )
[24] Port 4-7 = Target PCIe, Port 8-11 = Target PCIe ( BOOT_PCIE )
[25] Port 4-7 = Target PCIe, Port 8-11 = LAN - XAUI ( BOOT_PCIE )
[26] Port 4-7 = Target PCIe, Port 8-11 = LAN - SGMII ( BOOT_PCIE )
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To set this setting, the [-s|--set] option has to be appended.
-X | --core <0-100%>
This option configures the Maximum power usage for each core of the the Cavium processor.
To set this setting, the
-w | --power <20-40 WATTS>
[-s|--set] option has to be appended.
This option configures the maximum power budget for the AM4211.
To set this setting, the
Power(w) Throttling(%)
------------------------<20W 10%
20W 10%
27,5W 100%
>27,5W 100%
Power = (Throttling + 230) / 12
-k | --clock <CLOCK>
[-s|--set] option has to be appended.
This option configures the QLM0/1 clock reference source.
Possible configurations are:
0 QLM0/1 use local AMC clock.
1 QLM0/1 use external FCLKA signal from the AMC connector.
Note:
FCLKA input may be damaged if driven by an M-LVDS driver.
To set this setting the [-s|--set] options has to be appended.
-s | --set
This option sets the configuration in the MMCs NV ram, updates the FRU data multirecord and performs a MMC
reset (IPMI Cold Reset).
-c | --cycle
This option send the IPMI command "Chassis control Power cycle" to the MMC to perform a payload power
cycle. During the power cycle the configuration will be enabled. This option is allowed without any other
options or when a valid PCIe or Interface setting is configured and activated with the
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-n | --nofru
This option prevent FRU data update when changing an interface.
-d | --debug
This option sets the debug level. If this option is used twice the debug level is increased.
5.6 Cavium Linux BSP
This package includes the required modifications to the OCTEON SDK 2.2.0 to support Kontron AM4211
device.
5.6.1 Requirements
- Linux operating system (tested with Redhat Linux Enterprise 5.4).
- Full Octeon SDK version 2.2.0
- Update to SDK 2.2.0 - patch level 1
5.6.2 Install Instructions
1 Perform the full installation of Octeon SDK 2.2.0.
OCTEON-SDK-2.2.0-414.i386.rpm
OCTEON-LINUX-2.2.0-414.i386.rpm
2 Perform installation of Update to SDK 2.2.0 - patch level 1
sdk_2.2.0_update_p1.tgz
3 Go to Octeon SDK directory and install all Kontron patches included:
# cd [OCTEON_SDK]
# patch -p1 < T5519-bootloader_0.42.patch
# patch -p1 < T5519-executive_0.42.patch
# patch -p1 < T5519-linux_0.42.patch
4 Copy ipmitool
# cp ipmitool-1.8.11-K26.tar.gz [OCTEON_SDK]/linux/embedded_rootfs/storage
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5 Copy watchdog
# cp watchdog-5.8.tar.gz [OCTEON_SDK]/linux/embedded_rootfs/storage
5.6.3 Build
1 Go to OCTEON SDK directory and configure the SDK environment :
# source env-setup OCTEON_CN66XX_PASS1_2
2 Set the build subversion, here is an example :
# export U_BOOT_BUILD_NUMBER_STR="-KCI 0.34"
# export KONTRON_CONFIG_LOCAL_VERSION=-0.34
3 Build U-boot binary
# cd [OCTEON_SDK]/bootloader/u-boot
# make kontron_t5519_config
# make
The generated file is [OCTEON_SDK]/bootloader/uboot/u-boot-kontron_t5519.bin
4 Build linux kernel and root file system :
# cd [OCTEON_SDK]/linux
# make kernel
# make strip
The generated file is [OCTEON_SDK]/linux/kernel2.6/linux/vmlinux.64
Please refer to the online documentation provided with the Cavium Networks SDK for more detail.
5.6.4 Simple executive applications
Building simple executive applications requires the availability of the Cavium Networks SDK which must be
obtained from Cavium Networks directly. The Cavium Networks SDK includes OCTEON Executive Library as well
as documentation and examples for OCTEON simple executive development. The OCTEON Executive Library
provides runtime support, hardware abstraction, memory management, and synchronization routines for the
OCTEON processor. It is composed of the libcvmx.a library as well as header files that provide a lot of
functionality with inline functions. The Executive is designed to provide an efficient environment for
developing data plane code for OCTEON. It supports a single thread of execution per cnMIPS core.
Simple executive applications can be used without the support of an OS, however, memory TLBs for each core
must have been set up correctly before starting a SE. This is done by the bootloader ‘bootoct’ command which
is part of the OCTEON u-boot port.
Please refer to the online documentation provided with the Cavium Networks SDK for more detail.
Refer to previous section for the procedure to install the SDK.
•Build the ‘passthrough’ sample application
# make –C examples/passthrough
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A. Connectors Pinouts
A.1 USB SSD Flash Module
Signal Pin Number Signal Pin Number
V_5V 1 NC 2
USB DATA (-) 3 NC 4
USB DATA (+) 5 NC 6
GND 7 NC 8
NC (KEY) 9 NC 10
A.2 SFP+ Front IO
Pin Number Signal Pin Number Signal
20 VeeT 1 VeeT
19 TD- 2 Tx Fault
18 TD+ 3 Tx Disable
17 Vee T 4 SDA
16 VccT 5 SCL
15 VccR 6 SFP Present #
14 VeeR 7 Rate Select 0
13 RD+ 8 LOS
12 RD- 9 Rate Select 1
11 Vee R 10 VeeR
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A.3 Serial Port Pinout
Signal Pin
N.C. 1
RXD # 2
TXD# 3
DTR 4
GND 5
DSR 6
RTS 7
CTS 8
N.C. 9
N.C. 10
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B. Getting Help
If, at any time, you encounter difficulties with your application or with any of our products, or if you simply
need guidance on system setups and capabilities, contact our Technical Support at:
North America EMEA
Tel.: (450) 437-5682 Tel.: +49 (0) 8341 803 333
Fax: (450) 437-8053 Fax: +49 (0) 8341 803 339
If you have any questions about Kontron, our products, or services, visit our Web site at: www.kontron.com
You also can contact us by E-mail at:
North America: support@ca.kontron.com
EMEA: support@kontron-modular.com
Or at the following address:
North America EMEA
Kontron Canada, Inc. Kontron Modular Computers GmbH
4555, Ambroise-Lafortune Sudetenstrasse 7
Boisbriand, Québec 87600 Kaufbeuren
J7H 0A4 Canada Germany
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B.1 Returning Defective Merchandise
Before returning any merchandise please do one of the following:
•Call
1 Call our Technical Support department in North America at (450) 437-5682 and in EMEA at +49
(0) 8341 803 333. Make sure you have the following on hand: our Invoice #, your Purchase Order
#, and the Serial Number of the defective unit.
2 Provide the serial number found on the back of the unit and explain the nature of your problem
to a service technician.
3 The technician will instruct you on the return procedure if the problem cannot be solved over
the telephone.
4 Make sure you receive an RMA # from our Technical Support before returning any merchandise.
•E-mail
1 Send us an e-mail at: RMA@ca.kontron.com
orderprocessing@kontron-modular.com
your company name, your address, your city, your postal/zip code, your phone number, and
your e-mail. You must also include the serial number of the defective product and a description
of the problem.
in North America and at:
in EMEA. In the e-mail, you must include your name,
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B.2 When Returning a Unit
• In the box, you must include the name and telephone number of a contact person, in case
further explanations are required. Where applicable, always include all duty papers and
invoice(s) associated with the item(s) in question.
• Ensure that the unit is properly packed. Pack it in a rigid cardboard box.
• Clearly write or mark the RMA number on the outside of the package you are returning.
• Ship prepaid. We take care of insuring incoming units.
North America EMEA
Kontron Canada, Inc. Kontron Modular Computers GmbH
4555, Ambroise-Lafortune Sudetenstrasse 7
Boisbriand, Québec 87600 Kaufbeuren
J7H 0A4 Canada Germany
B-3 AM4211
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C. Glossary
Acronyms Descriptions
ACL Access Control List. IP Access Control List.
ACPI Advanced Configuration & Power Interface
AdvancedMC (Same as AMC). Advanced Mezzanine Card.
AMC (Same as AdvancedMC). Advanced Mezzanine Card.
AMC.0 Advanced Mezzanine Card Base Specification.
AMC.1
AMC.2
AMC.3
API Application Programming Interface
APIC Advanced Programmable Interrupt Controller
APM Advanced Power Management
ARMD ATAPI Removable Media Device
ARP Address Resolution Protocol
ASCII
ASF
ATC A Advanced Telecommunications Computing Architecture
BCD Binary-Coded Decimal
BER Bit Error Ratio
BI Base Interface. Backplane connectivity defined by the ATCA.
BMC Base Management Controller
BT Block Transfer. An optional IPMI system management interface.
CB Certification Body
CCB Core Complex Bus (Inside PowerQuicc III CPU)
CFM Cubic Foot per Minute
CLI Command-Line Interface
CLK1 AdvancedTCA bused resource Synch clock group 1
CLK1A AdvancedTCA bused resource Synch clock group 1, bus A
CLK1B AdvancedTCA bused resource Synch clock group 1, bus A
CLK2 AdvancedTCA bused resource Synch clock group 2
CLK2A AdvancedTCA bused resource Synch clock group 2, bus A
CLK2B AdvancedTCA bused resource Synch clock group 2, bus B
CLK3 AdvancedTCA bused resource Synch clock group 3
CLK3A AdvancedTCA bused resource Synch clock group 3 , bus A
CLK3B AdvancedTCA bused resource Synch clock group 3 , bus B
CPLD Complex Programmable Logic Device
CP-TA Communications Platforms Trade Association
PCI Express and Advanced Switching on AdvancedMC. A subsidiary specif ication to the Advanced
Mezzanine Card Base Specification (AMC.0).
Ethernet Advanced Mezzanine Card Specification. A subsidiary specification to the Advanced
Mezzanine Card Base Specification (AMC.0).
Advanced Mezzanine Card Specification for Storage. A subsidiary specification to the Advanced
Mezzanine Card Base Specification (AMC.0).
American Standard Code for Information Interchange. ASCII codes represent text in computers,
communications equipment, and other devices that work with text.
Alert Standard Format. A standard for how alerting and remote-control capabilities on network
controllers work.
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Acronyms Descriptions
CRC Cyclic Redundancy Check
CS1 Components Side 1 as describes in PICMG3.0.
CS2 Components Side 2 as describes in PICMG3.0.
CTCA Compact Telecom Computing Architecture
CTS Clear To Send
DDR2
DHCP Dynamic Host Configuration Protocol
DIMM Dual In-line Memory Module
DIN Deutsches Institut für Normung. German Institute for Standardization.
DMA Direct Memory Access
DMI Desktop Management Interface
DPLL Digital Phase-Locked Loop
DRAM Dynamic Random Access Memory
DTC Data Transfer Controller
DTR Data Terminal Ready
DTS Digital Thermal Sensor in IA32 processors.
ECC Error Checking and Correction
EEPROM Electrically Erasable Programmable Read-Only Memory
EFI Extensible Firmware Interface
EFT Electric Fast Transient
EHCI Enhanced Host Controller Interface. Specification for Universal Serial Bus specification, revision 2.0.
EIA Electronic Industries Alliance
EISA Extended Industry Standard Architecture. Superset of ISA, 32-bit bus architecture.
EIST (Same as SpeedStep). Enhanced Intel SpeedStep Technology
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
EMTTM Turbo mode and enhanced Multi Threaded Thermal Management
ERM Electromagnetic compatibility and Radio spectrum Matters
ESD ElectroStatic Discharge
ETH Same as Ethernet.
ETSI European Telecommunications Standards Institute
FADT Fixed ACPI Description Table
FC Fibre Channel
FC-AL Fibre Channel-Arbitrated Loop
FI Fabric Interface. Backplane connectivity defined by the ATCA.
FML Fast Management Link
FPGA Field-Programmable Gate Array
FPL
FRBx
(Same as DDR-II). DDR2 SDRAM or Double-Data-Rate two (2) Synchronous Dynamic Random Access
Memory.
FPGA-to-PLD Link. FPL is a 20 MHz serial link that exchange 32-bit of data in each direction between
the FPGA and a companion PLD. Comes from Kontron Canada.
Fault-Resilient Booting level [1-3]. A term used to describe system features and algorithms that
improve the likelihood of the detection of, and recovery from, processor failures in a multiprocessor
system.
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Acronyms Descriptions
FRB2 Fault-Resilient Booting, Level 2.
FRT Free-Running Timer
FRU
FTP File Transfer Protocol
FW FirmWare
FWH FirmWare Hub. Boot flash connected to the LPC bus containing BIOS FW.
GARP Generic Attribute Registration Protocol
Gb Gigabit
GB (Same as GByte) GigaByte.
GByte (Same as GB) GigaByte.
GbE Gigabit Ethernet
GHz GigaHertz
GMRP GARP Multicast Registration Protocol
GND GrouND
GPCM General-Purpose Chip select Machine
GPI General Purpose Input
GPIO General Purpose Input Output
GPO General Purpose Output
GRUB GRand Unified Bootloader
GUID Globally Unique Identifier
GVRP GARP VLAN Registration Protocol
HFM High Frequency Mode. The highest operating speed for the processor.
HMS Hardware Management System
HPM PICMG Hardware Platform Management specification family
HPM.1 Hardware Platform Management IPM Controller Firmware Upgrade Specification
HW HardWare
I2C Inter Integrated Circuit bus
IICH Integrated I/O Controller Hub. Sub-part of the MICH chipset.
INT INTerrupt
IMCH Integrated Memory Controller Hub. Sub-part of the MICH chipset.
IMVP-6
IO (Same as I/O). Input Output
IOAPIC (Same as IO-APIC). IO Advanced Programmable Interrupt Controller
IOH I/O Hub
IO-APIC (Same as IOAPIC). IO Advanced Programmable Interrupt Controller
IOL IPMI-Over-LAN
IP Internet Protocol
IPM Intelligent Platform Management
IPMB Intelligent Platform Management Bus
IPMB-0 Intelligent Platform Management Bus Channel 0, the logical aggregation of IPMB-A and IPMB-B.
Field Replaceable Unit. Any entity that can be replaced by a user in the field. Not all FRUs are hot
swappable.
Intel Mobile Voltage Positioning. The Intel Mobile Voltage Positioning specification for the Intel®
Core™ Duo Processor. It is a DC-DC converter module that supplies the required voltage and current to
a single processor.
C-3 AM4211
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Acronyms Descriptions
IPMB-A Intelligent Platform Management Bus A
IPMB-B Intelligent Platform Management Bus B
IPMB-L Intelligent Platform Management Bus Local
IPMC Intelligent Platform Management Controller
IPMI Intelligent Platform Management Interface
IPMIFWU Intelligent Platform Management Interface FirmWare Update
IPv6 Internet Protocol version 6
IRQ Interrupt ReQuest
ISA Industry Standard Architecture. 16-bit (XT) bus architecture.
ISE Xilinx electronic design automation (EDA) tools for use with its devices.
ISO International Organization for Standardization
ITU International Telecommunication Union
ITU-T ITU Telecommunication standardization sector. ITU is International Telecommunication Union.
JTAG Joint Test Action Group
KB KiloByte
KHz KiloHertz
LAN Local Area Network
LBA Logical Block Addressing
LBC Local Bus Controller (On PowerQuicc III CPU)
LED Light-Emitting Diode
LFM Low Frequency Mode. The lowest operating speed for the processor.
LIP
LSB Least Significant Byte
LUN Logical Unit Number
LV Low Voltage
LVC MOS Low-Voltage Complementary Metal Oxide Semiconductor
LVD S Low-Voltage Differential Signaling
MAC Media Access Controller address of a computer networking device.
MB MegaByte
MC Management Controller
MCH Memory Controller Hub
MemBIST
MDn Message Digest algorithm (n=2, 5)
MDI Medium Dependent Interface. MDI port or uplink port.
MHz MegaHertz
MMC Module Management Controller. MMCs are linked to the IPMC.
MMIO Memory-Mapped IO
MP MultiProcessor
MPS MultiProcessor Specification
MRC
Loop Initialization Primitive. Related to FC arbitrated loop topology (an initial message needed for
learning the loop addresses and acquiring one).
(same as MBIST). Memory Built-In Selft-Test. Chipset feature for out-of-band memory testing and
intialization.
Memory Reference Code. Chipset specific code provided by the manufacturer and integrated into the
BIOS to test and intialize the system memory.
C-4 AM4211
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Acronyms Descriptions
MSB Most Significant Byte
MSI Message Signaled Interrupts
MSR Model Specific Register inside IA32 processors.
MTBF Mean Time Between Failures
MTRR Memory Type Range Register. CPU cache control registers.
NAND Type of Flash Memory, used for mass storage.
NC Not Connected
NDA Non-Disclosure Agreement
NEBS Network Equipment-Building System
NEDS Network Equipment Development Standard
NMI Non-Maskable Interrupt
O&M (Same as OAM/OA&M). Operations and Maintenance
OAM (Same as OA&M/O&M). Operations, Administration and Maintenance
OA&M (Same as OAM/O&M). Operations, Administration and Maintenance
OEM Original Equipment Manufacturer
OMU Operations and maintenance Unit
OOS Out Of Service
OS Operating System
OSI Open Source Initiative
PCB Printed Circuit Board
PCIe (Same as PCI-E). PCI-Express. Next generation I/O standard
PCI-E (Same as PCIe). PCI-Express. Next generation I/O standard.
PERR Parity ERRor. A signal on the PCI bus that indicates a parity error on the bus.
PHY
PICMG PCI Industrial Computer Manufacturers Group
PICMG® PCI Industrial Computer Manufacturers Group
PIR Product Issue Report
PIU Plug-In Unit
PLCC Plastic Leaded Chip Carrier
PLD Programmable Logic Device
PLL Phase Lock Loop
PMM POST Memory Manager
PNE Platform for Network Equipment. A Carrier Grade Linux (4.0) platform.
POR Power-On Reset
POST Power-On Self-Test
PXE Preboot eXecution Environment
RAM Random Access Memory
RHEL Red Hat Enterprise Linux
RMS Root Mean Square
RoHS Restriction of the Use of Certain Hazardous Substances
PHYsical layer. Generic electronics term referring to a special electronic integrated circuit or
functional block of a circuit that takes care of encoding and decoding between a pure digital domain
(on-off) and a modulation in the analog domain.
C-5 AM4211
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Acronyms Descriptions
ROM
RS-232 (Same as RS232). Recommended Standard 232.
RS232 (Same as RS-232). Recommended Standard 232.
RTC Real Time Clock
RTM Rear Transition Module
RTS Request To Send
S0 ACPI OS System State 0. Indicates fully on operating state.
S5 ACPI OS System State 5. Indicates Sof t Off operating state.
SBC Single Board Computer
SBE Single Bit Error
SCI System Control Interrupt
SCL Serial CLock
SDR Sensor Data Record
SDRAM Synchronous Dynamic Random Access Memory
SEC Single-bit Error Correct
SEEPROM Serial EEPROM
SEL System Event Log
SERDES
SERIRQ Serial IRQ
SERR System ERRor. A signal on the PCI bus that indicates a ‘fatal’ error on the bus.
SGMII
ShMC Shelf Management Controller
SMB (Same as SMBus/SMBUS). System Management Bus.
SMBIOS System Management BIOS
SMBUS (Same as SMB/SMBus). System Management Bus.
SMBus (Same as SMB/SMBUS). System Management Bus.
SMI System Management Interrupt
SMM System Management Mode
SMP
SOL Serial Over LAN
SONET Synchronous Optical NETworking
SPD
SPI Serial Peripheral Interface
SSE2 Streaming SIMD Extension 2. SIMD is "Single Instruction, Multiple Data".
SSE3 Streaming SIMD Extension 3. SIMD is "Single Instruction, Multiple Data".
SSH
TCLKA Telecom CLocK A. AMC Clock Interface.
Read Only Memory. Also refers to option ROM or expansion ROM code used during POST to provide
services for specific controllers, such as boot capabilities.
SERializer/DESerializer. Pair of functional blocks commonly used in high speed communications.
These blocks convert data between serial data and parallel interfaces in each direction.
Serial Gigabit Media Independent Interface. Standard interface used to connect a Gigabit Ethernet
MAC-block to a PHY.
Symmetric MultiProcessing. SMP systems allow any processor to work on any task no matter where the
data for that task are located in memory; with proper operating system support, SMP systems can
easily move tasks between processors to balance the workload efficiently.
Serial Presence Detect. A standardized way to automatically access information about a computer
memory module.
Secure SHell. A network protocol that allows data to be exchanged over a secure channel between two
computers.
C-6 AM4211
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Acronyms Descriptions
TCLKB Telecom CLocK B. AMC Clock Interface.
TCLKC Telecom CLocK C. AMC Clock Interface.
TCLKD Telecom CLocK D. AMC Clock Interface.
TPM Trusted Platform Module
TX Tr ans mit
TXD Trans mit
UART Universal Asynchronous Receiver Transmitter
UL Underwriters Laboratories inc
USB Universal Serial Bus
VLAN Virtual Local Area Network
WD WatchDog
WDT WatchDog Timer
XAUI
XDP eXtended Debug Port
X (meaning ten) Attachement Unit Interface. A standard for connecting 10 Gigabit Ethernet (10GbE)
ports.
C-7 AM4211
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