» User Guide «
AM4011
Single Mid- and Full-Size AMC Module based on the
Intel® Core™2 Duo Processor with the
Intel® 3100 Chipset
Doc. ID: 1022-1626, Rev. 2.0
May 6, 2011
P R E L I M I N A R Y
If it’s embedded, it’s Kontron.
Preface AM4011
Revision History
Publication Title:
Doc. ID: 1022-1626
Rev. Brief Description of Changes Date of Issue
1.0 Initial issue 6-May-2008
2.0 General update 6-May-2011
AM4011: Single Mid- and Full-Size AMC Module based on the Intel®
Core™2 Duo Processor with the Intel® 3100 Chipset
Imprint
Kontron Modular Computers GmbH may be contacted via the following:
MAILING ADDRESS TELEPHONE AND E-MAIL
Kontron Modular Computers GmbH +49 (0) 800-SALESKONTRON
Sudetenstraße 7 sales@kontron.com
D - 87600 Kaufbeuren Germany
P R E L I M I N A R Y
For further information about other Kontron products, please visit our Internet website:
www.kontron.com.
Disclaimer
Copyright © 201 1 Kontron AG. All rights reserved. All data is for information purposes only and
not guaranteed for legal purposes. Information has been carefully checked and is believed to
be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron
logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice.
Page ii ID 1022-1626, Rev. 2.0
AM4011 Preface
Table of Contents
Revision History .........................................................................................................ii
Imprint ........................................................................................................................ii
Disclaimer ..................................................................................................................ii
Table of Contents ......................................................................................................iii
List of Tables ............................................................................................................vii
List of Figures ...........................................................................................................ix
Proprietary Note ........................................................................................................xi
Trademarks ...............................................................................................................xi
Environmental Protection Statement .........................................................................xi
Explanation of Symbols ...........................................................................................xii
For Your Safety .......................................................................................................xiii
High Voltage Safety Instructions .........................................................................xiii
Special Handling and Unpacking Instructions ....................................................xiii
General Instructions on Usage ...........................................................................xiv
Two Year Warranty ...................................................................................................xv
1. Introduction ............................................................................. 1 - 3
1.1 Board Overview .......................................................................................1 - 3
1.2 Board-Specific Information ......................................................................1 - 4
1.3 System Relevant Information ..................................................................1 - 5
1.4 Board Diagrams ......................................................................................1 - 5
1.4.1 Functional Block Diagram ...............................................................1 - 5
1.4.2 Front Panel .....................................................................................1 - 7
1.4.3 Board Layouts .................................................................................1 - 8
1.5 Technical Specification ............................................................................1 - 9
1.6 Kontron Software Support .....................................................................1 - 12
1.7 Standards ..............................................................................................1 - 13
1.8 Related Publications .............................................................................1 - 14
2. Functional Description ........................................................... 2 - 3
2.1 CPU, Memory and Chipset ......................................................................2 - 3
P R E L I M I N A R Y
2.1.1 CPU ................................................................................................2 - 3
2.1.2 Memory ...........................................................................................2 - 3
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Preface AM4011
2.1.3 Intel® 3100 Chipset .........................................................................2 - 4
2.2 Peripherals ...............................................................................................2 - 4
2.2.1 Timer ...............................................................................................2 - 4
2.2.2 Watchdog Timer ..............................................................................2 - 4
2.2.3 Battery .............................................................................................2 - 4
2.2.4 Power Monitor and Reset Generation .............................................2 - 5
2.2.5 FLASH Memory ...............................................................................2 - 5
2.3 Board Interfaces ......................................................................................2 - 6
2.3.1 Front Panel LEDs ............................................................................2 - 6
2.3.2 Module Handle ................................................................................2 - 9
2.3.3 General Purpose DIP Switch ........................................................2 - 10
2.3.4 Debug Interface .............................................................................2 - 10
2.3.5 Onboard USB 2.0 NAND Flash Connector ...................................2 - 10
2.3.6 USB Host Interface .......................................................................2 - 11
2.3.7 Serial Ports ....................................................................................2 - 12
2.3.8 Serial ATA Interface .......................................................................2 - 14
2.3.9 Gigabit Ethernet Interfaces ...........................................................2 - 14
2.4 AMC Interconnection .............................................................................2 - 16
2.4.1 Fabric Interface .............................................................................2 - 16
2.4.2 Synchronization Clock Interface ....................................................2 - 18
2.4.3 System Management Interface .....................................................2 - 18
2.4.4 JTAG Interface ..............................................................................2 - 18
2.4.5 Module Power Interface ................................................................2 - 18
2.4.6 Pinout of AMC Card-edge Connector J1 .......................................2 - 19
P R E L I M I N A R Y
2.5 Module Management .............................................................................2 - 23
2.5.1 Module Management Controller ....................................................2 - 23
3. Installation ................................................................................3 - 3
3.1 Safety Requirements ...............................................................................3 - 3
3.2 Module Handle Positions .........................................................................3 - 4
3.3 Hot Swap Procedures ..............................................................................3 - 5
3.3.1 Hot Swap Insertion ..........................................................................3 - 5
3.3.2 Hot Swap Extraction ........................................................................3 - 7
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AM4011 Preface
3.4 Installation of Peripheral Devices ............................................................3 - 8
3.4.1 Installation of USB Devices ...........................................................3 - 8
3.4.2 Installation of Serial Devices ..........................................................3 - 9
3.4.3 USB 2.0 NAND Flash Module Installation ....................................3 - 10
3.5 Software Installation ..............................................................................3 - 10
4. Configuration ........................................................................... 4 - 3
4.1 DIP Switch Configuration ........................................................................4 - 3
4.1.1 User-Specific LED Configuration (BIOS POST Code) ....................4 - 4
4.1.2 BIOS Firmware Hub Flash Configuration .......................................4 - 4
4.1.3 Boot Order Configuration ................................................................4 - 4
4.1.4 Clear BIOS CMOS Configuration ...................................................4 - 4
4.2 Interrupts .................................................................................................4 - 5
4.3 Memory Map ...........................................................................................4 - 6
4.3.1 I/O Address Map .............................................................................4 - 6
4.4 AM4011-Specific Registers .....................................................................4 - 6
4.4.1 BIOS Configuration Register ..........................................................4 - 7
4.4.2 MMC I/O Status Register ................................................................4 - 7
4.4.3 Watchdog Timer Control Register ..................................................4 - 8
4.4.4 AMC Geographic Addressing Register .........................................4 - 10
4.4.5 Board and Logic Revision Register ..............................................4 - 10
4.4.6 Reset Status Register ...................................................................4 - 11
4.4.7 Host I/O Status Register ..............................................................4 - 12
4.4.8 Host I/O Configuration Register ....................................................4 - 12
4.4.9 Board ID Register .........................................................................4 - 12
4.4.10 Board Interrupt Configuration Register .........................................4 - 13
4.4.11 Hot Swap Status Register .............................................................4 - 13
P R E L I M I N A R Y
4.4.12 User-Specific LED Configuration Register ....................................4 - 14
4.4.13 User-Specific LED Control Register .............................................4 - 15
4.4.14 Serial Over LAN Configuration Register .......................................4 - 16
4.4.15 Delay Timer Control/Status Register ...........................................4 - 17
4.4.16 MMC Configuration Register ........................................................4 - 18
4.4.17 IPMI Keyboard Controller Style Interface .....................................4 - 18
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Preface AM4011
5. Power Considerations .............................................................5 - 3
5.1 AM4011 Voltage Ranges .........................................................................5 - 3
5.2 Carrier Power Requirements .. .................................................................5 - 3
5.2.1 Payload Power ................................................................................5 - 3
5.2.2 Payload and MMC Voltage Ramp ...................................................5 - 4
5.2.3 Module Management Power Consumption .....................................5 - 4
5.3 Payload Power Consumption of the AM4011 ..........................................5 - 4
5.4 IPMI FRU Payload Power Consumption ..................................................5 - 5
5.5 Payload Start-Up Current of the AM4011 ................................................5 - 6
6. Thermal Considerations .........................................................6 - 3
6.1 Thermal Monitoring ..................................................................................6 - 3
6.1.1 Placement of the Temperature Sensors ..........................................6 - 4
6.1.2 Board Thermal Monitoring ...............................................................6 - 5
6.1.3 Processor Thermal Monitoring ........................................................6 - 5
6.1.4 Chipset Thermal Monitor Feature ....................................................6 - 7
6.2 System Airflow .........................................................................................6 - 8
6.2.1 Forced Airflow in MicroTCA Systems ..............................................6 - 8
6.2.2 Airflow Impedance .........................................................................6 - 10
6.2.3 Airflow Paths .................................................................................6 - 11
P R E L I M I N A R Y
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AM4011 Preface
List of Tables
1-1 System Relevant Information ................................................................... 1 - 5
1-2 AM4011 Main Specifications .................................................................... 1 - 9
1-3 Standards ............................................................................................... 1 - 13
1-4 Related Publications .............................................................................. 1 - 14
2-1 Module Management LED Function ........................................................ 2 - 6
2-2 User-Specific LED Function ..................................................................... 2 - 7
2-3 POST Code Sequence ............................................................................ 2 - 8
2-4 POST Code Example ............................................................................... 2 - 8
2-5 Module Handle Positions ......................................................................... 2 - 9
2-6 DIP Switch Functions ............................................................................. 2 - 10
2-7 USB NAND Flash Connector J6 Pinout ................................................. 2 - 10
2-8 Mini USB Type A Connector J2 Pinout .................................................. 2 - 11
2-9 Mini Connector J5 (COM1) Pinout ......................................................... 2 - 12
2-10 Pinout of the Serial Adapter Connectors ................................................ 2 - 13
2-11 Gigabit Ethernet Con. J3 and J4 Pinout Based on Implementation ....... 2 - 15
2-12 Pinout of AMC Card-edge Connector J1 ............................................... 2 - 19
2-13 Reserved Pins Description ..................................................................... 2 - 22
2-14 Extended Options Region Pins Description ........................................... 2 - 22
2-15 JTAG Pins Description ........................................................................... 2 - 22
2-16 Processor and Chipset Supervision ....................................................... 2 - 24
2-17 AMC-Specific Signals ............................................................................ 2 - 24
2-18 Onboard Power Supply Supervision ...................................................... 2 - 24
2-19 Temperature Signals .............................................................................. 2 - 25
4-1 DIP Switch Functions ............................................................................... 4 - 3
4-2 User-Specific LED Configuration (BIOS POST Code) ............................. 4 - 4
4-3 BIOS Firmware Hub Flash Configuration ................................................. 4 - 4
P R E L I M I N A R Y
4-4 BIOS Boot Order Configuration ............................................................... 4 - 4
4-5 BIOS CMOS Configuration ...................................................................... 4 - 4
4-6 Interrupt Setting ....................................................................................... 4 - 5
4-7 I/O Address Map ...................................................................................... 4 - 6
4-8 BIOS Configuration Register .................................................................... 4 - 7
4-9 MMC I/O Status Register ......................................................................... 4 - 7
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Preface AM4011
4-10 Watchdog Timer Control Register ............................................................ 4 - 9
4-11 AMC Geographic Addressing Register .................................................. 4 - 10
4-12 Board and Logic Revision Register ........................................................ 4 - 10
4-13 Reset Status Register ............................................................................. 4 - 11
4-14 Host I/O Status Register ......................................................................... 4 - 12
4-15 Host I/O Configuration Register ............................................................. 4 - 12
4-16 Board ID Register ................................................................................... 4 - 12
4-17 Board Interrupt Configuration Register ................................................... 4 - 13
4-18 Hot Swap Status Register ...................................................................... 4 - 13
4-19 User-Specific LED Configuration Register ............................................. 4 - 14
4-20 User-Specific LED Control Register ....................................................... 4 - 15
4-21 Serial over LAN Configuration Register ................................................. 4 - 16
4-22 Delay Timer Control/Status Register ..................................................... 4 - 17
4-23 MMC Configuration Register .................................................................. 4 - 18
5-1 DC Operational Input Voltage Ranges ..................................................... 5 - 3
5-2 Payload Power Consumption: AM4011 with Core™2 Duo, 1.5 GHz ....... 5 - 5
5-3 IPMI FRU Payload Power Consumption of the AM4011 .......................... 5 - 5
5-4 Payload Start-Up Current of the AM4011 ................................................. 5 - 6
6-1 Pressure Drop vs. Airflow Data .............................................................. 6 - 10
6-2 Deviation of the Airflow Rate on a Mid-Size AM4011 ............................. 6 - 11
6-3 Deviation of the Airflow Rate on a Full-Size AM4011 ............................. 6 - 12
P R E L I M I N A R Y
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AM4011 Preface
List of Figures
1-1 AM4011 Functional Block Diagram .......................................................... 1 - 6
1-2 AM4011 Front Panel Versions ................................................................. 1 - 7
1-3 AM4011 Board Layout (Top View) ........................................................... 1 - 8
1-4 AM4011 Board Layout (Bottom View) ...................................................... 1 - 8
2-1 Front Panel LEDs ................................................................................... 2 - 6
2-2 Module Handle Positions ....................................................................... 2 - 9
2-3 USB NAND Flash Connector J6 ............................................................ 2 - 10
2-4 Mini USB Type A Connector J2 ............................................................ 2 - 11
2-5 Adapter for Mini USB Type A to USB Type A Connectors ..................... 2 - 11
2-6 Mini Connector J5 (COM1) .................................................................... 2 - 12
2-7 Adapter for 10-Pin Mini Connector to 9-Pin D-Sub Female Connector . 2 - 13
2-8 Gigabit Ethernet Connectors J3 and J4 ................................................. 2 - 15
2-9 AM4011 Port Mapping ........................................................................... 2 - 17
3-1 Module Handle Positions ........................................................................ 3 - 4
3-2 Adapter for Mini USB Type A to USB Type A Connectors ....................... 3 - 8
3-3 Adapter for 10-Pin Mini Connector to 9-Pin D-Sub Female Connector ... 3 - 9
4-1 DIP Switch ............................................................................................... 4 - 3
6-1 Board Temperature Sensor Placement (AM4011 Bottom View) ............. 6 - 4
6-2 Processor Temperature Sensor Placement (AM4011 Top View) ............. 6 - 4
6-3 Temperature vs. Airspeed Graph of a Mid-Size AM4011 ......................... 6 - 8
6-4 Temperature vs. Airspeed Graph of a Full-Size AM4011 ......................... 6 - 9
6-5 Mid-Size and Full-Size AM4011 Impedance Curves .............................. 6 - 10
6-6 Thermal Zones of the Mid-Size AM4011 Module ................................... 6 - 11
6-7 Thermal Zones of the Full-Size AM4011 Module ................................... 6 - 12
P R E L I M I N A R Y
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AM4011 Preface
Proprietary Note
This document contains information proprietary to Kontron. It may not be copied or transmitted by any means, disclosed to others, or stored in any retrieval system or media without the
prior written consent of Kontron or one of its authorized agents.
The information contained in this document is, to the best of our knowledge, entirely correct.
However , Kontro n cannot accept liab ility for any inaccuracies or the consequences thereof, or
for any liability arising from the use or application of any circuit, product, or example shown in
this document.
Kontron reserves the right to change, modify, or improve this document or the product
described herein, as seen fit by Kontron without further notice.
Trademarks
This document may include names, company logos and trademarks, which are registered
trademarks and, therefore, proprietary to their respective owners.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements where
possible. Many of the components used (structural parts, printed circuit boards, connectors,
batteries, etc.) are capable of being recycled.
Final disposition of this product after its service life must be accomplished in accordance with
applicable country, state, or local laws or regulations.
P R E L I M I N A R Y
ID 1022-1626, Rev. 2.0 Page xi
Preface AM4011
Explanation of Symbols
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V)
when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your
life/health and/or result in damage to your material.
Please refer also to the section “High Voltage Safety Instructions” on
the following page.
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to static electricity. Therefore, care must be taken
during all handling operations and inspections of this product, in
order to ensure product integrity at all times.
Please read also the section “Special Handling and Unpacking
Instructions” on the following page.
Warning!
This symbol and title emphasize points which, if not fully understood
and taken into consideration by the reader, may endanger your health
and/or result in damage to your material.
Note ...
This symbol and title emphasize aspects the reader should read
through carefully for his or her own advantage.
P R E L I M I N A R Y
Page xii ID 1022-1626, Rev. 2.0
AM4011 Preface
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a
long fault-free life. However, the life expectancy of your product can be drastically reduced by
improper treatment during unpacking and installation. Therefore, in the interest of your own
safety and of the correct operation of your new Kontron product, you are requested to conform
with the following guidelines.
High Voltage Safety Instructions
Warning!
All operations on this device must be carried out by sufficiently skilled
personnel only.
Caution, Electric Shock!
Before installing any piggybacks or carrying out maintenance operations always ensure that your mains power is switched off.
Serious electrical shock hazards can exist during all installation,
repair and maintenance operations with this product. Therefore,
always unplug the power cable and any other cables which provide
external voltages before performing work.
Special Handling and Unpacking Instructions
ESD Sensitive Device!
Electronic boards and their components are sensitive to static elec-
tricity. Therefore, care must be taken during all handling operations
and inspections of this product, in order to ensure product integrity at
all times.
Warning!
This product has gold conductive fingers which are susceptible to contamination. Take care not to touch the gold conductive fingers of the
AMC Card-edge connector when handling the board.
Failure to comply with the instruction above may cause damage to the
board or result in improper system operation.
P R E L I M I N A R Y
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where
a safe work station is not guaranteed, it is important for the user to be electrically discharged
before touching the product with his/her hands or tools. This is most easily done by touching a
metal part of your system housing.
ID 1022-1626, Rev. 2.0 Page xiii
Preface AM4011
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices, jumper settings etc. If the product contains batteries for RTC or memo ry
backup, ensure that the board is not placed on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the batteries or conductive circuits
on the board.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in
any way. Changes or modifications to the device, which are not explicitly approved by Kontron
and described in this manual or received from Kontron’s Technical Support as a special handling instruction, will void your warranty.
This device should only be installed in or connected to systems that fulfill all necessary technical and specific environmental requirements. This applies also to the operational temperature
range of the specific board version, which must not be exceeded. If batteries are present, their
temperature restrictions must be taken into account.
In performing all necessary installation and application operations, please follow only the instructions supplied by the present manual.
Keep all the original packaging material for future storage or warranty shipment s. If it is necessary to store or ship the board, please re-pack it as nearly as possible in the manner in which
it was delivered.
Special care is necessary when handling or unp acking the product. Please co nsult the special
handling and unpacking instruction on the previous page of this manual.
P R E L I M I N A R Y
Page xiv ID 1022-1626, Rev. 2.0
AM4011 Preface
Two Year Warranty
Kontron grants the original purchaser of Kontron’s products a TWO YEAR LIMITED HARDWARE
WARRANTY
implied by anyone on behalf of Kontron are valid unless the consumer has the expre ss written
consent of Kontron.
Kontron warrants their own products, excluding software, to be free from manufacturing and
material defects for a period of 24 consecutive months from the date of purchase. This warranty is not transferable nor extendible to cover any other users or long-term storage of the
product. It does not cover products which have been modified, altered or repaired by any
other party than Kontron or their authorized agents. Furthermore, any product which has
been, or is suspected of being damaged as a result of negligence, improper use, incorrect
handling, servicing or maintenance, or which has been damaged as a result of excessive current/voltage or temperature, or which has had its serial number(s), any other markings or
parts thereof altered, defaced or removed will also be excluded from this warranty.
If the customer’s eligibility for warranty has not been voided, in the event of any claim, he may
return the product at the earliest possible convenience to the original place of purchase,
together with a copy of the original document of purchase, a full description of the application
the product is used on and a description of the defect. Pack the product in such a way as to
ensure safe transportation (see our safety instructions).
as described in the following. However , no other warranties that may be granted or
Kontron provides for repair or replacement of any p art, assembly or su b-assembly at their own
discretion, or to refund the original cost of purchase, if appropriate. In the event of repair,
refunding or replacement of any part, the ownership of the removed or replaced parts reverts
to Kontron, and the remaining part of the original guarantee, or any new guarantee to cover
the repaired or replaced items, will be transferred to cover the new or repaired items. Any
extensions to the original guarantee are considered gestures of goodwill, and will be defined
in the “Repair Report” issued by Kontron with the repaired or replaced item.
Kontron will not accept liability for any further claims resulting directly or indirectly from any
warranty claim, other than the above specified repair, replacement or refunding. In particular,
all claims for damage to any system or process in which the product was employed, or any
loss incurred as a result of the product not functioning at any given time, are excluded. The
extent of Kontron liability to the customer shall not exceed the original purchase price of the
item for which the claim exists.
Kontron issues no warranty or representation, either explicit or implicit, with respect to its
products’ reliability, fitness, quality, marketability or ability to fulfil any particular application or
purpose. As a result, the products are sold “as is,” and the responsibility to ensure their suitability for any given task remains that of the purchaser. In no event will Kontron be liable for
direct, indirect or consequential damages resulting from the use of our hardware or software
products, or documentation, even if Kontron were advised of the possibility of such claims
prior to the purchase of the product or during any period since the date of its purchase.
Please remember that no Kontron employee, dealer or agent is authorized to make any modification or addition to the above specified terms, either verbally or in any other form, written or
electronically transmitted, without the company’s consent.
P R E L I M I N A R Y
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Preface AM4011
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AM4011 Introduction
Chapter 1
1
Introduction
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P R E L I M I N A R Y
Introduction AM4011
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AM4011 Introduction
1. Introduction
1.1 Board Overview
The AM4011 is a highly integrated CPU board implemented as a Single, Mid-size or Full-size
Advanced Mezzanine Card (AMC) Module. The design is based on the Intel® Core™2 Duo
processor combined with the Intel® 3100 server-class chipset.
The board supports the Intel® Core™2 Duo processor, 1.5 GHz version built on 65-nm process technology in a 479 µFCBGA package providing 64 kB L1 and 4 MB L2 cache as well as
667 MHz front side bus (FSB) speed. The processor and the memory are soldered on the
AM4011, which results in higher Mean Time Between Failures (MTBF) and a significant improvement in cooling.
The Intel® Core™2 Duo processor is a low-power, dual-core processor supporting Intel’s Virtualization Technology (VT), Intel® Extended Memory 64 Technology (Intel® EM64T), and enhanced address range for up to 64 GB memory. It delivers optimized power-efficient computing
and outstanding dual-core performance with low power consumption.
The board includes up to 4 GB registered Double Data Rate (DDR2) memory with Error
Checking and Correcting (ECC) running at 400 MHz. Tw o Dual Gigabit Ethernet controllers,
each utilizing a x4 lane PCI Express interconnection to the Intel® 3100 chipset, ensure maximum data throughput between processor and memory. The AM4011 further provides up to 8
GB Flash memory via an optional USB 2.0 NAND Flash module.
The AM4011 has full hot swap capability, which enables the board to be replaced, monitored
and controlled without having to shut down the ATCA carrier board or the MicroTCA system. A
dedicated Module Management Controller (MMC) is used to manage the board and support a
defined subset of Intelligent Platform Management Interface (IPMI) commands and PICMG
(ATCA/AMC) command extensions, which enables operators to detect and eliminate faults
faster at module level. This includes monitoring several onboard temperature conditions, board
voltages and the power supply status, managing hot swap ope rations, rebooting the board, etc.
All in all, IPMI enhances the board’s availability and reliability while reducing the operating
costs and the mean-time-to-repair.
As a “headless” AMC design (no onboard graphics controller), the AM4011 supports one USB
2.0 host interface, one standard RS-232 COM port, and two Gigabit Etherne t port s to t he front
as well as a variety of high-speed interconnect topologies to the system, such as Dual Gigabit
SerDes connection and Dual Serial ATA storage interface in the Common Options Region, x4
PCI Express, and a Debug port and a Serial port in the Extended Options Region.
Optimized for high-performance, packet-based telecom systems, the AM4011 is targeted towards, but not limited to the telecom market application such as radio network controllers, media streaming, traffic processing, database management and routing. The AM4011 also fits into
applications situated in industrial environments, including I/O intensive applications. The careful design and the selection of high temperature resistant components ensure a high product
availability . This, together with a high level of scalability, reliability, and st ability , make this stateof-the-art product a perfect core technology for long-life embedded applications.
P R E L I M I N A R Y
The board is offered with the generic Linux Board Support Package which supports various Linux
distributions including the Carrier Grade Linux (CGL) operating system. Please contact Kontron
for further information concerning the operation of the AM4011 with other operating systems.
ID 1022-1626, Rev. 2.0 Page 1 - 3
Introduction AM4011
1.2 Board-Specific Information
Due to the outstanding features of the AM4011, such as superior processing power and flexible
interconnect topologies, this AMC board provides a highly scalable solution not only for a wide
range of telecom and data network applications, but also for several highly integrated indu strial
environment applications with solid mechanical interfacing.
Some of the AM4011's outstanding features are:
• Intel® Core™2 Duo processor L7400 (LV), 1.5 GHz, 667 MHz FSB, 4 MB L2 cache
• Intel® 3100 chipset
• Up to 4 GB DDR2 SDRAM memory with ECC running at 400 MHz (PC3200)
• AMC interconnection:
• Dual Gigabit SerDes connection in the Common Options Region
• Dual SATA storage interface in the Common Options Region
• x4 PCI Express in the Fat Pipes Region (operates as a root complex controller only)
• Serial port in the Extended Options Region
• Debug port in the Extended Options Region
• PCI Express clock reference input, FCLKA
• Full hot swap support
• Two Intel® 82571EB Dual Gigabit Ethernet controllers:
• One controller connected to the Common Options Region
• One controller connected to Front I/O
• Onboard USB 2.0 port for up to 8 GB NAND Flash memory
• One USB 2.0 host port on Front I/O
• One Serial port on Front I/O (RS-232)
• Two Gigabit Ethernet ports on Front I/O
• Two redundant FWH Flash chips for BIOS (2 x 1 MB)
• Dedicated IPMI Module Management Controller with redundant Firmware Flash (2 x 512 kB)
• Watchdog Timer
• JTAG interface for debugging and manufacturing
• Four bicolor Debug LEDs
• Standard temperature range: -5°C to + 55°C
• Thermal management
• Passive heat sink solution
• Single, Mid-size and Full-size AMC module
P R E L I M I N A R Y
• Designed to be compliant with the following specifications:
• PICMG AMC.0, Advanced Mezzanine Card Specification R2.0
• PICMG AMC.1, PCI Express and Advanced Switching R1.0
• PICMG AMC.2, Gigabit Ethernet R1.0
• PICMG AMC.3, Storage Interfaces R1.0
• PICMG MTCA.0 Micro Telecommunications Computing Architecture R1.0
• IPMI - Intelligent Platform Management Interface Specification, v2.0, R1.0
•AMI BIOS
Page 1 - 4 ID 1022-1626, Rev. 2.0
AM4011 Introduction
1.3 System Relevant Information
The following system relevant information is general in nature but should still be considered
when developing applications using the AM4011.
Table 1-1: System Relevant Information
SUBJECT INFORMATION
Hardware Requirements The AM4011 can be installed on any AMC-supporting carrier board or MicroTCA
backplane with the following AMC Card-edge connector port mapping:
• Common Options Region ports 0-1
• Two Gigabit Ethernet SerDes ports
• Common Options Region ports 2-3
• Two Serial ATA 150 ports
• Fat Pipes Region ports 4-7
• One x4 PCI Express interface
• Extended Options Region port 14
• One Debug port
• Extended Options Region port 15
• One Serial port
• Clock
• PCI Express clock reference input, FCLKA
For further information on the AMC interconnection, refer to section 2.4, “AMC
Interconnection”.
PCI Express Configuration The AM4011 supports only the PCI Express root complex configuration. Non-
transparent bridge functionality is not supported.
Operating Systems The AM4011 is offered with the generic Linux Board Support Package which sup-
ports various Linux distributions including the Carrier Grade Linux (CGL) operating system. Please contact Kontron for further information concerning the
operation of the AM4011 with other operating systems.
1.4 Board Diagrams
The following diagrams provide additional information concerning board functionality and
component layout.
1.4.1 Functional Block Diagram
The following figure shows the block diagram of the AM4011.
P R E L I M I N A R Y
ID 1022-1626, Rev. 2.0 Page 1 - 5
Introduction AM4011
Front Panel
Health
Hot Swap
Out-of-Service
POST Code /
Debug
Front Panel LEDs
400 MHz
72 bit
FPGA
Board Control
MMC
EEP
1 MB
Temp.
Sense
AMC Card-edge Con.
Port No.
0
1
DC/DC
converters
12V payload
TCLK
14
IPMB-L
Clk
COM2
Com. Opt. Reg.
Dual
Mag.
1000BT
RJ-45
4 - 7 Fat Pipes Reg.
Mini
USB A
Mini
Con.
Clk
COM2
I
2
C
RS-232COM 1
COM1 and COM2
Ext. Opt. Reg.
Serial
Intel®
Core™2 Duo
1.5 GHz
667 MHz
ITP
Debug
Temp.
Sense
EEP
64 kbit
I
2
C
Intel®
3100 chipset
COM USB
DDR2
PCIe B
PCIe A
LPC
FSB
SATA
2 - 3
Intel®
Dual GbE
82571EB
SERDES
SERDES
x4 PCIe
x4 PCIe
x4 PCIe
Com. Opt. Reg.
15
EEP
64 kbit
CMOS backup
PCIe
clock
FCLK
I
2
C I
2
C
Clk
Clock to all
PCIe devices
Debug
Debug
CPU and
chipset temp.
PCIe A
SATA
USB
3.3V management
power
LPC
Debug
Con.
1st
BIOS
FLASH
1 MB
LPC
SMB
USB
Con.
USB NAND Flash
USB 2.0
USB 2.0
Hot Swap Switch
2nd Boot Flash
LPC
Intel®
Dual GbE
82571EB
Cu PHY
Cu PHY
RAM RAM RAM RAM RAM RAM RAM RAM
Soldered DRAM up to 4 GB DDR2 w ECC
RAM
USB
GbE D
1000BT
RJ-45
GbE C
2nd
BIOS
FLASH
1 MB
I²C
Figure 1-1: AM4011 Functional Block Diagram
P R E L I M I N A R Y
Page 1 - 6 ID 1022-1626, Rev. 2.0
AM4011 Introduction
3
2
1
0
0
1
2
3
AM4011
GbE D
GbE C
0
1
2
3
AM4011
GbE D
GbE C
Mid-size Full-size
Module Management LEDs
• LED1 (red): Out-of-Service LED
• LED2 (red/green/amber): Health LED
• HS LED (blue): The hot swap indicator provides basic feedback to the
user on the hot swap state of the module. The HS LED
states are off, short blink, long blink, and on.
User-Specific LEDs
• ULED3 (red/green): AMC Eth. port A link signal status or BIOS POST code LED
• ULED2 (red/green): Front Eth. port C link signal status or BIOS POST code LED
• ULED1 (red/green): Front Eth. port D link signal status or BIOS POST code LED
• ULED0 (red/green): AMC Eth. port B link signal status or BIOS POST code LED
Connectors
• Serial Connector
• Gigabit Ethernet Connector
• USB Connector
For further information on the LEDs used on the AM4011, refer to section 2.3.1, “Front Panel
LEDs”.
1.4.2 Front Panel
Figure 1-2: AM4011 Front Panel Versions
ID 1022-1626, Rev. 2.0 Page 1 - 7
P R E L I M I N A R Y
Introduction AM4011
Intel
®
Core™2 Duo
1.5 GHz
Intel® 3100
Chipset
J8
1
J1
1
85
GbE
Contr.
GbE
Contr.
USB 2.0
NAND Flash
J4
J3
J2
J5
Mag.
Heat Sink
1
J6
DDR2 Memory
DIP
Switch
J9
J1
86
170
R411
R402
R407
ON
1
2
3
4
1.4.3 Board Layouts
Figure 1-3: AM4011 Board Layout (Top View)
Figure 1-4: AM4011 Board Layout (Bottom View)
P R E L I M I N A R Y
Page 1 - 8 ID 1022-1626, Rev. 2.0
AM4011 Introduction
1.5 Technical Specification
Table 1-2: AM4011 Main Specifications
FEATURES SPECIFICATIONS
CPU The AM4011 supports the Intel® Core™2 Duo processor L7400 (LV), 1.5 GHz
clock speed, 667 MHz FSB, and 4 MB L2 cache in a 479 µFCBGA packaging.
Please contact Kontron for further information concerning the suitability of
other Intel processors for use with the AM4011.
Memory Main Memory:
• Up to 4 GB registered DDR2 SDRAM memory with ECC running at 400
MHz (PC3200)
Cache structure:
• 64 kB L1 on-die full speed processor cache
• 32 kB for instruction cache
• 32 kB for data cache
Processor and Memory
Intel® 3100 Intel® 3100 chipset:
Chipset
• 4 MB L2 on-die full speed processor cache
FLASH Memory:
• Two redundant Firmware Hub (FWH) Flash chips (2 x 1 MB) controlled
by the MMC
Mass Storage Device:
• Up to 8 GB NAND Flash memory optionally available
Serial EEPROM with 64 kbit
• Support for a single Intel® Core™2 Duo processor
• 64-bit AGTL/AGTL+ based System Bus interface at up to 667 MHz
• System Memory interface with optimized support for DDR2 SDRAM
memory at 400 MHz with ECC
• Three x4 PCI Express ports
• RASUM (Reliability, Availability, Serviceability, Usability, and Manage-
ability) features:
• Memory error detection and reporting of 1-bit and 2-bit errors includ-
ing correction of 1-bit failures
• Integrated Memory Scrub Engine, which logs any uncorrectable
memory errors
• Support for automatic read retry on uncorrectable errors
• Memory sparing allows for one memory bank per channel to be held
in reserve and brought on-line if another memory bank in the channel becomes defective (only supported with 2 GB and 4 GB main
memory configuration)
• Six-Channel SATA 150 interface (only two channels are used)
• USB 2.0 host interface with up to four USB ports available (only two
USB 2.0 ports are used on the AM4011)
• Firmware Hub (FWH) interface support
• Low Pin Count (LPC) interface
• PCI Rev. 2.2 compliant with support for 32-bit/33 MHz PCI operations
(not used on the AM4011)
• Power management logic support
• Enhanced DMA controller, interrupt controller, and timer functions
• System Management Bus (SMBus) compatible with most I²C™ devices
• Two 16550-compatible Serial ports (COM)
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ID 1022-1626, Rev. 2.0 Page 1 - 9
Introduction AM4011
Table 1-2: AM4011 Main Specifications (Continued)
FEATURES SPECIFICATIONS
Gigabit Ethernet Two Intel® 82571EB Dual Gigabit Ethernet PCI Express bus controllers:
• One controller connected to the Common Options Region
Onboard
Controller
Gigabit Ethernet Common Options Region ports 0-1
Serial ATA Common Options Region ports 2-3
PCI Express Fat Pipes Region ports 4-7
Debug Interface E xtended Options Region port 14
AMC Interconnection
Serial Interface Extended Options Region port 15
• One controller connected to Front I/O
• Two Gigabit Ethernet SerDes ports
• Two Serial ATA 150 ports
• One x4 PCI Express interface operating as a root complex controller only
• One Debug port
• One Serial port
Clock Input Clocks
• PCI Express clock reference input (FCLKA)
Front Panel
Connectors
• One USB 2.0 port on a 5-pin, mini USB type A connector
• One Serial port (COM1) with RS-232 signal level on a mini 10-pin con-
nector
• Two Gigabit Ethernet ports on two RJ-45 connectors
Onboard Connector
Connectors
AMC Card-edge
Connector
DIP Switch One DIP switch consisting of four switches for board configuration
Switch
Module Management
LEDs
• One USB 2.0 connector for optional NAND Flash
• One 170-pin AMC Card-edge connector
• LED1 (red): Out-of-Service LED
• LED2 (red/green/amber): Health LED
• HS LED (blue): The hot swap indicator provides basic feed-
P R E L I M I N A R Y
User-Specific LEDs
LEDs
• ULED3 (red/green): AMC Eth. port A link signal status or BIOS
• ULED2 (red/green): Front Eth. port C link signal stat us or BIOS
• ULED1 (red/green): Front Eth. port D link signal stat us or BIOS
• ULED0 (red/green): AMC Eth. port B link signal status or BIOS
back to the user on the hot swap state of the
module. The HS LED states are off, sh ort
blink, long blink, and on.
POST code LED
POST code LED
POST code LED
POST code LED
Page 1 - 10 ID 1022-1626, Rev. 2.0
AM4011 Introduction
Table 1-2: AM4011 Main Specifications (Continued)
FEATURES SPECIFICATIONS
Watchdog Timer • Software-configurable, two-stage Watchdog with programmable timeout
ranging from 125 ms to 256 s in 12 steps
• Serves for generating IRQ or hardware reset
System Timer
Timer
• The Intel® 3100 chipset contains three 8254-style counters which have
fixed uses
• In addition to the three 8254-style counters, the Intel® 3100 chipset in-
cludes three individual high-precision event timers that may be used by
the operating system. They are implemented as a single counter each
with its own comparator and value register.
• Hardware delay timer for short reliable delay times
Module Management
Controller
• Renesas H8 microcontroller with 40 kB RAM and redundant 512 kB
Firmware Flash with automatic roll-back strategy
• The MMC carries out IPMI commands such as monitoring several on-
board temperature conditions, board voltages and the power supply status, and managing hot swap operations
• The MMC is accessible via a local IPMB (IPMB-L) and two host Key-
board Controller Style (KCS) interfaces
IPMI
Hot Swap The AM4011 has full hot swap capability.
Thermal Management CPU and board overtemperature protection is provided by:
• Four temperature sensors for monitoring the board temperature
• Six processor sensors
• One chipset sensor
• Specially designed heat sink
USB 2.0 NAND Flash Up to 8 GB USB 2.0 NAND Flash memory can be added to the AM4011 using
Option
an optionally available USB 2.0 NAND Flash module.
Power Consumption See Chapter 5, “Power Considerations” for details.
Temperature Range Operational: -5°C to +55°C
Storage: -40°C to + 70°C
Mechanical Single Module:
• Mid-size version
• Full-size version
Dimensions Mid-size: 181.5 mm x 73.5 mm x 18.96 mm
Full-size: 181.5 mm x 73.5 mm x 28.95 mm
General
Board Weight Mid-size: 259 grams (with heat sink and USB NAND Flash module)
Full-size: 315 grams (with heat sink and USB NAND Flash module)
JTAG Two JTAG interfaces:
• One processor JTAG interface routed to the onboard debug connector
for debugging purposes
• One onboard JTAG interface connected to the AMC Card-edge connec-
tor for debugging and manufacturing purposes
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ID 1022-1626, Rev. 2.0 Page 1 - 11
Introduction AM4011
Table 1-2: AM4011 Main Specifications (Continued)
FEATURES SPECIFICATIONS
Software BIOS AMI BIOS with 1 MB of Flash memory and having the following features:
• Serial console redirection via the Serial port or LAN
• QuickBoot
• QuietBoot
• BootBlock
• LAN boot capability for diskless systems (standard PXE boot)
• Boot from USB device (floppy, CD-ROM, hard disk, memory stick)
• BIOS support for USB keyboards
• Plug and Play capability
• BIOS parameters are saved in the EEPROM
• Board serial number is saved within the EEPROM
• ACPI
Software IPMI Module Management Controller Firmware providing the following features:
Software
• The MMC is accessible via IPMB-L and two KCS interfaces with inter-
rupt support
• The MMC Firmware can be updated in field through all supported inter-
faces using the function “fwum...” of the free tool “ipmitool”. For further
information on the ipmitool refer to the sourceforge.net website.
• Two MMC Flash banks with automatic roll-back capability in case of an
upgrade Firmware failure
• Board supervision and control extensions such as board reset, power
and Firmware Hub Flash control, and boot order configuration
Operating Systems The AM4011 is offered with the generic Linux Board Support Package which
supports various Linux distributions including the Carrier Grade Linux (CGL)
operating system. Please contact Kontron for further information concerning
the operation of the AM4011 with other operating systems.
1.6 Kontron Software Support
Kontron is one of the few AdvancedTCA and CompactPCI vendors providing inhouse support
for most of the industry-proven real-time operating systems that are currently available. Due to
its close relationship with the software manufacturers, Kontron is able to produce and support
BSPs and drivers for the latest operating system revisions thereby taking advantage of the
P R E L I M I N A R Y
changes in technology.
Finally, customers possessing a maintenance agreement with Kontron can be guaranteed
hotline software support and are supplied with regular sof twa re u pdates. A dedicate d web site
is also provided for online updates and release downloads.
Page 1 - 12 ID 1022-1626, Rev. 2.0
AM4011 Introduction
1.7 Standards
The Kontron AMC boards comply with the requirements of the following standards.
Table 1-3: Standards
COMPLIANCE TYPE STANDARD TEST LEVEL
CE Emission EN55022
EN61000-6-3
EN300386
Immission EN55024
EN61000-6-2
EN300386
Electrical Safety EN60950-1 -Mechanical Mechanical Dimensions IEEE 1101.10 -Environmental and
Health Aspects
Vibration (sinusoidal) IEC60068-2-6
Vibration (sinusoidal,
transportation)
Shock (operating) IEC60068-2-27 4 [g]
IEC60068-2-6
--
--
5-150 [Hz] / 1 [g] / 1 [oct/min]
10 [cycles/axis]
3 [directions: x,y,z]
2-50 [Hz] / 1 [g] / 0.1 [oct/min]
50-500 [Hz] / 3 [g] / 0.25 [oct/min]
10 [cycles/axis]
3 [directions: x,y,z]
22 [ms]
3 [shocks per direction]
5 [s] recovery time
6 [directions, ±x, ±y, ±z]
Climatic Humidity IEC60068-2-78 93% RH at 40°C, non-condensing
WEEE Directive 2002/96/EC Waste electrical and electronic equipment
RoHS Directive 2002/95/EC Restriction of the use of certain
hazardous substances in electrical and
electronic equipment
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ID 1022-1626, Rev. 2.0 Page 1 - 13
Introduction AM4011
1.8 Related Publications
The following publications contain information relating to this product.
Table 1-4: Related Publications
PRODUCT PUBLICATION
ATCA PICMG® 3.0 AdvancedTCA Base Specification R2.0, March 18, 2005
MicroTCA PICMG® MTCA.0 Micro Telecommunications Computing Architecture R1.0, July 6,
2006
AMC PICMG® AMC.0, Advanced Mezzanine Card Specification R2.0
PICMG® AMC.1, PCI Express and Advanced Switching R1.0
PICMG® AMC.2, Gigabit Ethernet R1.0
PICMG® AMC.3, Storage Interfaces R1.0
IPMI IPMI - Intelligent Platform Management Interface Specification, v2.0 Document
Revision 1.0, February 12, 2004
IPMI - Platform Management FRU Information Storage Definition, V1.0 Document
Revision 1.1, September 27, 1999
PCI Express PCI Express Base Specification Revision 1.0a
Serial ATA Serial ATA 2.5 Specification
P R E L I M I N A R Y
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