Cinterion® PLS8-X/PLS8-V
Hardware Interface Description
Version: 03.016
DocId: PLS8-X_PLS8-V_HD_v03.016
M2M.GEMALTO.COM
Cinterion® PLS8-X/PLS8-V Hardware Interface Description
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
03.016
2015-12-09
PLS8-X_PLS8-V_HD_v03.016
Confidential / Released
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE
SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,
MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY
AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY
AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED
BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.
THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED
ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without ex press autho rization are prohib ited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2015, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain
countries. Microsoft and Win dows are e ither regis tered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other register ed trademarks or trademarks mention ed
in this document are property of their respective owners.
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Contents
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Contents
0 Document History.......................................................................................................8
1 Introduction.................................................................................................................9
1.1 Supported Products...........................................................................................9
1.2 Related Documents ...........................................................................................9
1.3 Terms and Abbreviations............ ........... .......... ........... ........... ............................9
1.4 Regulatory and Type Approval Information .....................................................12
1.4.1 Directives and Standards....................................................................12
1.4.2 SAR requirements specific to portable mobiles..................................14
1.4.3 SELV Requirements ...........................................................................15
1.4.4 Safety Precautions..............................................................................15
2 Product Concept.......................................................................................................16
2.1 Key Features at a Glance................................................................................16
2.2 PLS8-X/PLS8-V System Overview..................................................................19
2.3 Circuit Concept ................................................................................................20
3 Application Interface.................................................................................................21
3.1 Operating Modes .............................................................................................22
3.2 Power Supply...................................................................................................23
3.2.1 Minimizing Power Losses ...................................................................24
3.2.2 Monitoring Power Supply by AT Command........................................24
3.3 Power-Up / Power-Down Scenarios ................................................................25
3.3.1 Turn on PLS8-X/PLS8-V.....................................................................25
3.3.2 Signal States after Startup..................................................................26
3.3.3 Turn off PLS8-X/PLS8-V Using AT Command ...................................27
3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line............................................28
3.3.5 Automatic Shutdown...........................................................................29
3.3.5.1 Thermal Shutdown..............................................................29
3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions.... 30
3.3.5.3 Undervoltage Shutdown......................................................31
3.3.5.4 Overvoltage Shutdown........................................................31
3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency ................................ 32
3.4 Power Saving...................................................................................................33
3.4.1 Wake-up via RTS0..............................................................................34
3.5 RTC Backup.....................................................................................................35
3.6 USB Interface...................................................................................................36
3.6.1 Reducing Power Consumption (TBD.)................................................37
3.7 Serial Interface ASC0 ......................................................................................38
3.8 UICC/SIM/USIM Interface................................................................................40
3.8.1 Enhanced ESD Protection for SIM Interface.......................................42
3.9 Digital Audio Interface......................................................................................43
3.9.1 Pulse Code Modulation Interface (PCM) ............................................43
3.10 Inter IC Sound Interface (I
3.11 Analog-to-Digital Converter (ADC)...................................................................44
3.12 GPIO Interface.................................................................................................44
2
S)...........................................................................43
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3.13 Control Signals.................................................................................................45
3.13.1 PWR_IND Signal ...................... .......... ................................................45
3.13.2 Behavior of the RING0 Line................................................................45
3.13.3 Remote Wakeup.................................................................................46
3.13.4 Low Current Indicator (LCI).................................................................47
3.13.5 Network Connectivity and Technology Status Signals........................48
3.13.6 700MHz Antenna Switch Control........................................................49
4 GNSS Receiver..........................................................................................................50
5 Antenna Interfaces....................................................................................................51
5.1 GSM/UMTS/LTE Antenna Interface.................................................................51
5.1.1 Antenna Installation ............................................................................52
5.1.2 RF Line Routing Design......................................................................53
5.1.2.1 Line Arrangement Examples...............................................53
5.1.2.2 Routing Example.................................................................55
5.2 GNSS Antenna Interface ................................................................................. 56
6 Electrical, Reliability and Radio Characteristics.................................................... 58
6.1 Absolute Maximum Ratings.............................................................................58
6.2 Operating Temperatures..................................................................................59
6.2.1 Temperature Allocation Model............................................................60
6.3 Storage Conditions ..........................................................................................60
6.4 Reliability Characteristics.................................................................................61
6.4.1 Bending Tests.....................................................................................62
6.5 Pad Assignment and Signal Description..........................................................63
6.6 Power Supply Ratings......................................................................................72
6.7 RF Antenna Interface Characteristics..............................................................76
6.8 GNSS Interface Characteristics.......................................................................80
6.9 Electrostatic Discharge....................................................................................81
7 Mechanics, Mounting and Packaging.....................................................................82
7.1 Mechanical Dimensions of PLS8-X/PLS8-V....................................................82
7.2 Mounting PLS8-X/PLS8-V onto the Application Platform ................................ 84
7.2.1 SMT PCB Assembly ...........................................................................84
7.2.1.1 Land Pattern and Stencil.....................................................84
7.2.1.2 Board Level Characterization..............................................86
7.2.2 Moisture Sensitivity Level ...................................................................86
7.2.3 Soldering Conditions and Temperature..............................................87
7.2.3.1 Reflow Profile......................................................................87
7.2.3.2 Maximum Temperature and Duration..................................88
7.2.4 Durability and Mechanical Handling....................................................89
7.2.4.1 Storage Life.........................................................................89
7.2.4.2 Processing Life....................................................................89
7.2.4.3 Baking.................................................................................89
7.2.4.4 Electrostatic Discharge........................................................89
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7.3 Packaging........................................................................................................90
7.3.1 Tape and Reel .......................... .......... ........... .....................................90
7.3.1.1 Orientation...........................................................................90
7.3.1.2 Barcode Label.....................................................................91
7.3.2 Shipping Materials ..............................................................................92
7.3.2.1 Moisture Barrier Bag...........................................................92
7.3.2.2 Transportation Box..............................................................94
8 Sample Application...................................................................................................95
8.1 Sample Level Conversion Circuit.....................................................................97
9 Reference Approval..................................................................................................98
9.1 Reference Equipment for Type Approval.........................................................98
9.2 Compliance with FCC and IC Rules and Regulations ..................................... 99
10 Appendix..................................................................................................................101
10.1 List of Parts and Accessories.........................................................................101
10.2 Mounting Advice Sheet..................................................................................103
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Tables
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Tables
Table 1: Directives ....................................................................................................... 12
Table 2: Standards of North American type approval.................................................. 12
Table 3: Requirements of quality ................................................................................. 12
Table 4: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 13
Table 5: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 13
Table 6: Overview of operating modes ........................................................................ 22
Table 7: Signal states................................................................................................... 26
Table 8: Temperature dependent behavior.................................................................. 29
Table 9: DCE-DTE wiring of ASC0 .............................................................................. 39
Table 10: Signals of the SIM interface (SMT application interface)............................... 40
Table 11: Overview of PCM pin functions...................................................................... 43
Table 12: Overview of I
Table 13: Host wakeup lines.......................................................................................... 46
Table 14: Low current indicator line............................................................................... 47
Table 15: Return loss in the active band........................................................................ 51
Table 16: Absolute maximum ratings............................................................................. 58
Table 17: Board temperature......................................................................................... 59
Table 18: Temperature allocation model........................................................................ 60
Table 19: Storage conditions ......................................................................................... 60
Table 20: Summary of reliability test conditions............................................................. 61
Table 21: Overview: Pad assignments........................................................................... 64
Table 22: Signal description........................................................................................... 67
Table 23: Voltage supply ratings.................................................................................... 72
Table 24: Current consumption ratings.......................................................................... 72
Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range).. 76
Table 26: GNSS properties............................................................................................ 80
Table 27: Power supply for active GNSS antenna......................................................... 80
Table 28: Electrostatic values........................................................................................ 81
Table 29: Reflow temperature ratings............................................................................ 87
Table 30: Antenna gain limits for FCC and IC................................................................ 99
Table 31: List of parts and accessories........................................................................ 101
Table 32: Molex sales contacts (subject to change).................................................... 102
Table 33: Hirose sales contacts (subject to change)................................................... 102
2
S pin functions......................................................................... 43
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Figures
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Figures
Figure 1: PLS8-X/PLS8-V system overview.................................................................. 19
Figure 2: PLS8-X/PLS8-V block diagram...................................................................... 20
Figure 3: Decoupling capacitor(s) for BATT+................................................................ 23
Figure 4: Power supply limits during transmit burst....................................................... 24
Figure 5: Power-on with IGT......................................................................................... 25
Figure 6: Signal states during turn-off procedure .......................................................... 27
Figure 7: Timing of IGT if used as ON/OFF switch....................................................... 28
Figure 8: Shutdown by EMERG_OFF signal................................................................. 32
Figure 9: Wake-up via RTS0......................................................................................... 34
Figure 10: RTC supply variants....................................................................................... 35
Figure 11: USB circuit..................................................................................................... 36
Figure 12: Serial interface ASC0..................................................................................... 38
Figure 13: First UICC/SIM/USIM interface...................................................................... 41
Figure 14: Second UICC/SIM/USIM interface................................................................. 41
Figure 15: SIM interface - enhanced ESD protection...................................................... 42
Figure 16: PWR_IND signal............................................................................................ 45
Figure 17: Low current indication timing (still to be confirmed)....................................... 47
Figure 18: LED circuit (example)..................................................................................... 48
Figure 19: Antenna pads (bottom view).......................................................................... 52
Figure 20: Embedded Stripline line arrangement............................................................ 53
Figure 21: Micro-Stripline line arrangement samples...................................................... 54
Figure 22: Routing to application‘s RF connector........................................................... 55
Figure 23: PLS8-X/PLS8-V evaluation board layer table................................................ 55
Figure 24: Supply voltage for active GNSS antenna....................................................... 56
Figure 25: ESD protection for passive GNSS antenna................................................... 57
Figure 26: Board and ambient temperature differences.................................................. 59
Figure 27: Bending test setup......................................................................................... 62
Figure 28: PLS8-X/PLS8-V bottom view: Pad assignments............................................ 65
Figure 29: PLS8-X/PLS8-V top view: Pad assignments.................................................. 66
Figure 30: PLS8-X/PLS8-V – top and bottom view......................................................... 82
Figure 31: Dimensions of PLS8-X/PLS8-V (all dimensions in mm)................................. 83
Figure 32: Land pattern (top layer).................................................................................. 84
Figure 33: Recommended design for 110 micron thick stencil (top layer) ...................... 85
Figure 34: Recommended design for 150 micron thick stencil (top layer) ...................... 85
Figure 35: Reflow Profile................................................................................................. 87
Figure 36: Carrier tape.................................................................................................... 90
Figure 37: Roll direction.................................................................................................. 90
Figure 38: Barcode label on tape reel............................................................................. 91
Figure 39: Moisture barrier bag (MBB) with imprint......................................................... 92
Figure 40: Moisture Sensitivity Label.............................................................................. 93
Figure 41: Humidity Indicator Card - HIC........................................................................ 94
Figure 42: PLS8-X/PLS8-V sample application............................................................... 96
Figure 43: Sample level conversion circuit...................................................................... 97
Figure 44: Reference equipment for type approval......................................................... 98
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0 Document History
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0 Document History
Page 8 of 105
Preceding document: "Cinterion® PLS8-X/PLS8-V Hardware Interface Description" v02.510
®
New document: "Cinterion
Chapter What is new
Throughout
document
1.4 Removed ECE-R 10 directive from Table 1.
2.1 Added USAT as supported feature.
3.3.4 Revised section including Figure 7.
3.4 Revised description of power save mode and removed previous sections 3.4.1, 3.4.2,
3.9 Shortened section, because PLS8-X and PLS8-V are data on ly modules, an d the mod-
3.13.1 Revised section to mention VCC µC in PWR_IND circuit.
3.13.3 Revised description of remote host wakeup functionality.
3.13.6 New section 700MHz Antenna Switch Control.
5.2 Revised ratings for VGNSS in Figure 24.
6.2.1 Revised temperature allocation model given in Table 18.
Added information on dead reckoning syn ch ro niz at ion line.
Updated NAPRD version in Table 2.
and 3.4.2.
ule’s digital audio interface therefore on ly sup por ts local tones.
Updated other sections accordingly.
PLS8-X/PLS8-V Hardware Interface Description" Version 03.016
6.5 Host wakeup functionality added for GPIOs in Table 22.
7.2.3.1 Revised ramp down rate given in Table 29.
9.2 Revised maximum antenna gain limits - added Table 30.
Preceding document: "Cinterion
New document: "Cinterion
Chapter What is new
Throughout
document
2.3 Revised Figure 2 to differentiate between PLS8-X and PLS8-V.
3.5 New section RTC Backup.
6.5 Added characteristics for VDDLP line (RTC backup) in Table 22.
6.6 Revised current consumption ratings for IDLE mode in Table 24.
7.2.3.1 Revised description for average ramp up and ramp down rates in Table 29.
Added real time clock (RTC) information.
Added VDDLP line information.
Added current consumption rating for GPRS data transfer (4Tx/1Rx @ total mismatch).
Revised average GSM/UMTS/LTE current consumption ratings while GNSS is ON.
New document: "Cinterion
Chapter What is new
®
®
®
PLS8-X/PLS8-V Hardware Interface Description" v02.502
PLS8-X/PLS8-V Hardware Interface Description" Version 02.510
PLS8-X/PLS8-V Hardware Interface Description" Version 02.502
-- Initial document setup.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
1 Introduction
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1 Introduction
The document1 describes the hardware of the two Cinterion® modules variants PLS8-V and
PLS8-X, designed to connect to a cellular device application and the air interface. It helps you
quickly retrieve interface specifications, electrical and mechanical details and information on
the requirements to be considered for integrating further components.
The product variants differ in their radio access technology support:
• PLS8-X is available for operation in LTE, UMTS and GSM radio networks - for supported
frequency bands please refer to Section 2.1. Connected to this, the module has two separate firmware images on board that can be activated based on the used (U)SIM card.
Employing the module’s two (U)SIM interfaces, it is thus possible to switch between firmware images on the fly - making PLS8-X a multi carrier/provider module.
• PLS8-V in contrast is available for operation in LTE radio networks only - for supported fre-
quency bands please refer to Section 2.1. It has only a single firmware image on board that
can be activated by (U)SIM card - making it a single carrier/provider module.
If not otherwise mentioned, this document applies to both product variants. Where necessary
a note is made to differentiate between the variants.
1.1 Supported Products
This document applies to the following Gemalto M2M products:
•Cinterion
•Cinterion
®
PLS8-V module
®
PLS8-X module
1.2 Related Documents
[1] AT Command Set for your Gemalto M2M product
[2] Release Notes for your Gemalto M2M product
[3] Application Note 48: SMT Module Integration
[4] Universal Serial Bus Specification Revision 2.0, April 27, 2000
1.3 Terms and Abbreviations
Abbreviation Description
ANSI American National Standards Institute
ARP Antenna Reference Point
CE Conformité Européene (European Conformity)
CS Coding Scheme
CS Circuit Switched
CSD Circuit Switched Data
DCS Digital Cellular System
1.
The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Gemalto M2M product.
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1.3 Terms and Abbreviations
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Abbreviation Description
DL Download
dnu Do not use
DRX Discontinuous Reception
DSB Development Support Board
DTX Discontinuous Transmission
EDGE Enhanced Data rates for GSM Evolution
EGSM Extended GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
ETSI European Telecommunications Standards Institute
FCC Federal Communications Commission (U.S.)
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FDD Frequency Division Duplex
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HSDPA High Speed Downlink Packet Access
I/O Input/Output
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LCI Low Current Indicator
LED Light Emitting Diode
LGA Land Grid Array
LTE Long term evolution
MBB Moist ur e ba rr ier bag
Mbps Mbits per second
MCS Modulation and Coding Scheme
MIMO Multiple Input Multiple Output
MLCC Multi Layer Ceramic Capacitor
MO Mobile Originated
MS Mobile Station, also referred to as TE
MSL Moisture Sensitivity Level
MT Mobile Terminated
nc Not connected
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1.3 Terms and Abbreviations
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Abbreviation Description
NTC Negative Temperature Coefficient
PCB Printed Circuit Board
PCL Power Control Level
PCS Personal Communication System, also referred to as GSM 1900
PD Pull Down resistor
PDU Protocol Data Unit
PS Packet Switched
PSK Phase Shift Keying
PU Pull Up resistor
QAM Quadrature Amplitude Modulation
R&TTE Radio and Telecommunication Terminal Equipment
RF Radio Frequency
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rfu Reserved for future use
ROPR Radio Output Power Reduction
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMD Surface Mount Device
SMS Short Message Service
SMT Surface Mount Technology
SRAM Static Random Access Memory
SRB Signalling Radio Bearer
TE Terminal Equipment
TPC Transmit Power Control
TS Technical Specification
Tx Transmit Direction
UL Upload
UMTS Universal Mobile Telecommunications System
URC Unsolicited Result Code
USB Universal Serial Bus
UICC USIM Integrated Circuit Card
USIM UMTS Subscriber Identification Module
WB-AMR Wideband Adaptive Multirate
WCDMA Wideband Code Division Multiple Access
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1.4 Regulatory and Type Approval Information
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1.4 Regulatory and Type Approval Information
1.4.1 Directives and Standards
PLS8-X/PLS8-V has been designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "PLS8-X/PLS8-V Hardware Interface Description".
Table 1: Directives
1
2002/95/EC (RoHS 1)
2011/65/EC (RoHS 2)
Table 2: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22, Part 24 and Part 27; US Equipmen t
OET Bulletin 65
(Edition 97-01)
UL 60 950-1 Product Safety Certification (Safety requirements)
NAPRD.03 V5.23 Overview of PCS Type certification review board Mobile Equipment Type
RSS132, RSS133,
RSS139
Directive of the European Parliament and of the Council of
27 January 2003 (and revised on 8 June 2011) on the
restriction of the use of certain hazardous substances in
electrical and electronic equipment (RoHS)
Authorization FCC
Evaluating Compliance with FCC Guidelines for Human Exposure to Radio-
frequency Electromagnetic Fields
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
Canadian Standard
Table 3: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
1.
Manufacturers of applications which can be used in the US shall en sure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances
in Electronic Information Products” (2006-06).
SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on th e Control of
Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Hardware
Interface Description.
Please see Table 5 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the
limits defined by SJ/T 11363-2006.
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Table 5: Toxic or hazardous substances or elements with defined concentration limits
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1.4.2 SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable PLS8-X/ PLS8-V based applications to
be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For US markets the
relevant directives are mentioned below. It is the responsibility of the manufacturer of the final
product to verify whether or not further standards, recommendations or directives are in force
outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic
fields (EMFs) from mobile telecommunication equipment (MTE) in the
frequency range 30MHz - 6GHz
IMPORTANT:
Manufacturers of portable applications based on PLS8-X/PLS8-V modules are required to
have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile.
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1.4.3 SELV Requirements
The power supply connected to the PLS8-X/PLS8-V module shall be in compliance with the
SELV requirements defined in EN 60950-1.
1.4.4 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating PLS8-X/PLS8-V. Manufacturers of the cellular terminal are advised to convey the following safety information to users and
operating personnel and to incorporate these guidelines into all manuals supplied with the
product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted med ical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make su re it cannot be switched on inadvertently. The operation of wirele ss appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel d epots,
chemical plants or where blasting operations are in progress. Oper ation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special re gulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals an d cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellu lar terminal or mobile.
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2 Product Concept
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2 Product Concept
2.1 Key Features at a Glance
Feature Implementation
General
Frequency bands PLS8-X:
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII)
LTE: Five band, 700 (Bd13) / 700 (Bd17) / 850 (Bd5) / AWS (Bd4) /
1900MHz (Bd2)
PLS8-V:
LTE: Triple band, 700 (Bd13) / AWS (Bd4) / 1900MHz (Bd2)
GSM class Small MS
Page 16 of 105
Output power (according to
Release 99)
Output power (according to
Release 8)
Power supply 3.3V <
Operating temperature
(board temperature)
Physical Dimensions: 33mm x 29mm x 2.95mm
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIV
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD Bd2
Class 3 (+23dBm +-2dB) for LTE AWS, LTE FDD Bd4
Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd17
V
Normal operation: -30°C to +85°C
Extended operation: -40°C to +95°C
Weight: approx. 4.5g
BATT+
< 4.2V
RoHS All hardware components fully compliant with EU RoHS Directive
LTE features
3GPP Release 9 UE CAT 3 supported
DL 100Mbps, UL 50Mbps
2x2 MIMO in DL direction
HSPA features
3GPP Release 8 UE CAT. 14, 24
DC-HSPA+ – DL 42Mbps
HSUPA – UL 5.76Mbps
Compressed mode (CM) supported according to 3GPP TS25.212
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2.1 Key Features at a Glance
20
Feature Implementation
UMTS features
3GPP Release 8 PS data rate – 384 kbps DL / 384 kbps UL
GSM / GPRS / EGPRS features
Data transfer GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• 1 phase/2 phase access proce d ur es
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
Page 17 of 105
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Software
AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprie tary Gemalto M2M com-
mands
Firmware update Generic update from host application over USB and ASC0
U/SIM application toolkit USAT letter c; with BIP
GNSS Features
Protocol NMEA
Modes Standalone GNSS
Assisted GNSS
- Control plane - E911
- User plane - gpsOneXTRA™
General Power saving modes
Power supply for active antenna
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development
equipment.
Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO
antenna, (active/passive) GNSS antenna
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Feature Implementation
USB USB 2.0 High Speed (480Mbit/s) device interface
Serial interface ASC0:
• 8-wire modem interface with status and control lines, unbalanced,
asynchronous
• Adjustable baud rate of 115,200bps to 921,600bps
• Supports RTS0/CTS0 hardware flow control
UICC interface 2 UICC interfaces (switchable)
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Audio 1 digital interface (PCM or I
Status Signal line to indicate network connectivity state
2
S)
Page 18 of 105
RING0 Signal line to indicate incoming calls and other types of
Power on/off, Reset
Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO) or IGT
Automatic switch-off in case of critical temperature or voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency-off Emergency-off by hardware signal EMERG_OFF if IGT is not active
Special Features
Antenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx Diversity (receiver type 3i - 64-QAM) / MIMO
GPIO 10 I/O pins of the application interface programmable as GPIO.
GPIOs can be configured as low current indicator (LCI).
GPIO1 can be configured as dead reckoning synchronization signal.
GPIO2 can be configured as 700MHz antenna switch control signal.
GPIOs can be configured as remote host wakeup lines.
Programming is done via AT commands.
URCs
ADC inputs Analog-to-Digital Converter with three unbalanced analog inputs.
Evaluation kit
Evaluation module PLS8-X/PLS8-V module soldered onto a dedicated PCB tha t can be con-
nected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the PLS8-X/
PLS8-V evaluation module to the DSB75.
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USB
Serial
ASC0
UICC
Power
supply
IGT,
Emergency Off
SIM
card
Host applic a tio n
On/Off
Module
Applica t ion
GSM/UMTS/LTE
Antenna diversity
Power for application
(VEXT)
Power indication
(PWR_IND)
Modem interface
Digital
audio
PCM or I2S
codec
GSM/UMTS/LTE
12
GNSS
GNSS antenna
GPIO
Power
supply
GNSS active
antenna supply,
current limiter
ADC
Net state/
status
SIM
card
RTC
or
2.2 PLS8-X/PLS8-V System Overview
20
2.2 PLS8-X/PLS8-V System Overview
Page 19 of 105
Figure 1: PLS8-X/PLS8-V system overview
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Power management
IC
32.768kHz
Flash /
DDR RAM
VEXT
USB
GPIO 1..10
DAI/PCM/I2 S
2x USIM
Serial (A S C 0)
VDDLP
PWR_IND
EMERG_OFF
STATUS
3xADC
IGT
VGNSS
GND
BATT+_RF
BATT+
ANT_GNSS_DC
19.2MHz
32.768kHz
19.2MHz
X-tals:
Power supply
Control interface
Reset
USB supply
Temp.
Sensor
NTC
HW-
ID’s
GPIO’s
D/A/C
Flash
GNSS
GSM/
UMTS/
LTE
UMTS/
LTE
Diversity/MIMO
Antenna pads
LGA Pads
GNSS
RF
GSM/UMTS/LTE
* Baseband controller
* RF transceiver
GNSS
* receiver
ADC
Power supply
Power Supply
BATT+
BATT+_RF
SP10T
SP5T
2x
2x
5x
3x
5x
3x
5x
3x
GSM-TX
GSM-RX
LTE/UMTS-RX
LTE/
UMTS-TX
MIMO
RF Part
HDET
RF
D/A/C
RAM
Interrupt
BATT+_RF
2
2
DC
DC
RF
Control
Blue: PLS8-X only
Red: PLS8-V only
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2.3 Circuit Concept
20
2.3 Circuit Concept
Figure 2 shows a block diagram of the PLS8-X/PLS8-V module and illustrates the major func-
tional components:
Baseband block:
• GSM/UMTS/LTE controller/transceiver/power supply
• Stacked Flash/RAM memory with multiplexed address data bus
• Application interface (SMT with connecting pads)
RF section:
• RF transceiver
• RF power amplifier/frontend
• RF filter
• GNSS re ceiver/Front end
• Antenna pad
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Figure 2: PLS8-X/PLS8-V block diagram
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Page 21 of 105
3 Application Interface
PLS8-X/PLS8-V is equipped with an SMT application interface (LGA pads) that connects to the
external application. The host interface incorporates several sub-interfaces described in the following sections:
• Operating modes - see Section 3.1
• Power supply - see Section 3.2
• RTC backup - see Section 3.5
• Serial interface USB - see Section 3.6
• Serial interface ASC0 - Section 3.7
• UICC/SIM/USIM interface - see Section 3.8
• Digital audio interface (PCM or I
• ADC interface - Section 3.11
• GPIO interface - Section 3.12
• Control and status lines: PWR_IND, STATUS, RING0, STATUS, LCI - see Section 3.13
2
S) - see Section 3.9
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Page 22 of 105
3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 6: Overview of operating modes
Mode Function
Normal
operation
Power
Down
Airplane
mode
GSM / GPRS /
UMTS / HSPA /
LTE SLEEP
GSM / GPRS /
UMTS / HSPA /
LTE IDLE
GPRS DATA GPRS data transfer in progress. Power consumption depends on net-
EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-
UMTS DATA UMTS data transfer in progress. Power consumption depends on net-
HSPA DATA HSPA data transfer in progress. Power consumption depends on net-
LTE DATA LTE data transfer in progress. Power consumption depends on network
Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active
for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.
Airplane mode shuts down the radio part of the module , causes th e module to log off from
the GSM/GPRS network and disables all AT commands whose execution r equires a rad io
connection.
Airplane mode can be controlled by AT command (see [1]).
Power saving set automatically when no call is in progress and the USB
connection is detached and no active communication via ASC0. Also,
the GNSS active antenna mode has to be turned off or set to "auto".
Power saving disabled or an USB connection active , but no da ta tra nsfer in progress.
work settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
work settings (e.g. power control level), uplink / downlink data rates and
EGPRS configuration (e.g. used multislot settings).
work settings (e.g. TPC Pattern) and data transfer rate.
work settings (e.g. TPC Pattern) and data transfer rate.
settings (e.g. TPC Pattern) and data transfer rate.
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BATT+
2
2
Decoupling capacitors
e.g. 47µF X5R MLCC
4x
GND
BATT+
BATT+_RF
Module
SMT interface
1x
3.2 Power Supply
50
Page 23 of 105
3.2 Power Supply
PLS8-X/PLS8-V needs to be connected to a power supply at the SMT application interface - 4
lines BATT+, and GND. There are two separate voltage domains for BATT+:
• BATT+_RF with 2 lines for the RF power amplifier supply
• BATT+ with 2 lines for the general power management.
The main power supply from an external application has to be a single voltage source and has
to be expanded to two sub paths (star structure). Each voltage domain must be deco upled by
application with low ESR capacitors (
as close as possible to LGA pads. Figure 3 shows a sample circuit for decoupling capacitors
for BATT+.
> 47µF MLCC @ BATT+; > 4x47µF MLCC @ BATT+_RF)
Figure 3: Decoupling capacitor(s) for BATT+
In addition, the VDDLP pad may be connected to an external capacito r or a battery to backup
the RTC (see Section 3.5). Please note that for proper module startup the voltage at BATT+
should be higher than at VDDLP.
The power supply of PLS8-X/PLS8-V must be able to provide the peak current during the uplink
transmission.
All key functions for supplying power to the device are handled by the power managemen t IC.
It provides the following features:
• Stabilizes the supply voltages for the baseband using switching regulators and low drop linear voltage regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• Delivers, across the VEXT line, a regulated voltage for an external application.
• LDO to provide SIM power supply.
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Page 24 of 105
3.2.1 Minimizing Power Losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage V
board, not even in a transmit burst where current consumption can rise to typical peaks of 2A.
It should be noted that PLS8-X/PLS8-V switches off when exceeding these limits. Any voltage
drops that may occur in a transmit burst should not exceed 400mV to ensure the expected RF
performance in 2G networks.
never drops below 3.3V on the PLS8-X/PLS8-V
BATT+
The module switches off if the minimum battery voltage (V
Example:
VImin = 3.3V
Dmax = 0.4V
V
min = VImin + Dmax
BATT
V
min = 3.3V + 0.4V = 3.7V
BATT
Figure 4: Power supply limits during transmit burst
min) is reached.
BATT
3.2.2 Monitoring Power Supply by AT Command
To monitor the supply voltage you can use the AT^SBV command which returns the averaged
value related to BATT+ and GND at the SMT application interface.
The module continuously measures the voltage at intervals depending on the operating mode
of the RF interface. The duration of measuring ranges from 0.5 seconds in DATA mode to 50
seconds when PLS8-X/PLS8-V is in Limited Service (deregistered). The displayed voltage (in
mV) is averaged over the last measuring period before the AT^SBV command was executed.
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BATT+
IGT
Power
supply
active
EMERG_OFF
Function
active
PWR_IND
IGT
Module
Firmware start up, command interface initialization
USB*
Undefined state
0ms ~60ms
~5s
>100ms
* USB interface may take up to 12s to reach its active state
VEXT
~36ms
ASC0
Initial state Intermediate state
Page 25 of 105
3.3 Power-Up / Power-Down Scenarios
50
3.3 Power-Up / Power-Down Scenarios
In general, be sure not to turn on PLS8-X/PLS8-V while it is beyond the safety limits of voltage
and temperature stated in Section 6.1. PLS8-X/PLS8-V immediately switches off after having
started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module.
3.3.1 Turn on PLS8-X/PLS8-V
When the PLS8-X/PLS8-V module is in Power Down mode, it can be started to Normal mode
by driving the IGT (ignition) line to ground. it is recommended to use an open drain/collector
driver to avoid current flowing into this signal line. Pulling this signal low triggers a power-on
sequence. To turn on PLS8-X/PLS8-V, IGT has to be kept active at least 100 milliseconds.
After turning on PLS8-X/PLS8-V, IGT should be set inactive to prevent the module from turning
on again after a shut down by AT command or EMERG_OFF. For details on signal states during startup see also Section 3.3.2.
Figure 5: Power-on with IGT
Note: After power up IGT should remain high. Also note that with a USB connection the USB
host may take up to 12 seconds to set up the virtual COM port connection.
After startup or mode change the following URCs are sent to every port able to receive AT commands indicating the module’s ready state:
• "^SYSSTART" indicates that the module has entered Normal mode.
• "^SYSSTART AIRPLANE MODE" indicates that the module has entered Airplane mode.
These URCs notify the external application that the first AT command can be sent to the module. If these URCs are not used to detect then the only way of checking the module’s ready
state is polling. To do so, try to send characters (e.g. “at”) until the module is responding.
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3.3 Power-Up / Power-Down Scenarios
50
3.3.2 Signal States after Startup
Table 7 describes the various states each interface signal passes through after startup and dur-
ing operation.
Signals are in an initial state while the module is initializing. Once the startup initialization has
completed, i.e. when the software is running, all signals are in defined state. The state of several signals will change again once the respective interface is activated or configured by AT
command.
Table 7: Signal states
Signal name Power on reset
Duration appr. 60ms
CCINx PD and PU (24k) PU(24k) I, PU(24k)
CCRSTx Not driven (similar PD) Not driven (similar PD) O, L
CCIOx PD(10k) PD(10k) PD(10k)
CCCLKx Not driven (similar PD) Not driven (similar PD) O, L
CCVCCx Off Off Off
RXD0 PD PU PU
TXD0 PD PD PD
CTS0 PD PD PD
RTS0 PU and PD PD PD
DTR0 PD PD PD
DCD0 PD PU
DSR0 PD PD PD
RING0 PD O, H O, H
PCM_I2S_IN PU PD PD
PCM_I2S_CLK PD PD PD
PCM_I2S_FSC PD PD PD
PCM_I2S_OUT PD PD PD
I2S_MCLKOUT PD PD PD
PWR_IND Z O, L O, L
STATUS PD PD PD
EMERG_OFF PU I, PU I, PU
IGT I, PU I, PU I, PU
GPIO1...10
1.
2.
3.
4.
4
If CCINx = High level
If CCINx = Low level
No external pull down allowed during this phase.
Please note that during its startup phase the GPIO8 signal will be in an active low state for appr. 80ms.
PD PD PD
Startup phase
Duration appr. 4s
3
State after first
firmware initialization
After 4-5s
1
2
O, H
PU(10k)
Clock
1.8V/3V
1
2
1
2
1
2
PD
L = Low level
H = High level
I = Input
O = Output
1.
Internal pulls are implemented using JFETs; strengths vary between devices, possible range: 55k…390k
PD = Pull down resistor with appr. 100k
PD(…k) = Pull down resistor with ...k
PU = Pull up resistor with appr. 100k
PU(…k) = Pull up resistor with ...k, Z = High impedance
1
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PWR_IND
Digital outputs Reset state
VEXT
Inputs driven by
application
BATT+ driven by
application
AT^SMSO
3s...25s
Deregister from
network, system
shut down
Prepare to
reset
50...90µs
Reset state,
power down procedure
appr. 12ms >6ms
See
Note 1
See
Note 2
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3.3 Power-Up / Power-Down Scenarios
50
3.3.3 Turn off PLS8-X/PLS8-V Using AT Command
The best and safest approach to powering down PLS8-X/PLS8-V is to issue the AT^SMSO
command. This procedure lets PLS8-X/PLS8-V log off from the network and allows the software to enter into a secure state and save data before disconnecting the power supply. The
mode is referred to as Power Down mode. In this mode, only the RTC stays active. After sending AT^SMSO do not enter any other AT commands. While powering down the module may
still send some URCs. To verify that the module turned off it is possible to monitor the
PWR_IND signal. A high state of the PWR_IND signal line indicates that the module is being
switched off as shown in Figure 6.
Be sure not to disconnect the supply voltage V
before the module’s switch off procedure
BATT+
has been completed and the VEXT signal has gone low. Otherwise you run the risk of losing
data. Signal states during switch off are shown in Figure 6.
While PLS8-X/PLS8-V is in Power Down mode the application interface is switched off and
must not be fed from any other source. Therefore, your application must be designed to avoid
any current flow into any digital signal lines of the application interface. No special care is required for the USB interface which is protected from reverse current.
Note 1: Depending on capacitance load from host application
Note 2: The power supply voltage (BATT+) may be disconnected or switched off only after
the VEXT went low.
Note 3: After module shutdown by means of AT command is completed, please allow for a
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time period of at least 1 second before restarting the module.
Figure 6: Signal states during turn-off procedure
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
1 2
>
5s
>
100ms >2.1s
1–TriggersswitchONroutine
2–TriggersswitchOFFroutine
IGT
3.3 Power-Up / Power-Down Scenarios
50
Page 28 of 105
3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line
The IGT line can be configured for use in two different switching modes: You can set the IGT
line to switch on the module only, or to switch it on and off. The switching mode is determined
by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. This approach is useful for external application manufacturers who wish to have an ON/OFF switch installed on the
host device.
By factory default, the ON/OFF switch mode of IGT is disabled:
at^scfg=meshutdown/onignition
^SCFG: "MEShutdown/OnIgnition","off"
OK
# Query the current status of IGT.
# IGT can be used only to switch on PLS8-X/
PLS8-V.
IGT works as described in Section 3.3.1.
To configure IGT for use as ON/OFF switch:
at^scfg=meshutdown/onignition
^SCFG: "MEShutdown/OnIgnition","on"
OK
# Enable the ON/OFF switch mode of IGT.
# IGT can be used to switch on and off PLS8-X/
PLS8-V.
Take great care before changing the switching mode of the IGT line. To ensure that the IGT
line works properly as ON/OFF switch it is of vital importance that the following conditions are
met:
Switch-on condition: If the PLS8-X/PLS8-V is off, the IGT line must be asserted for at least 100
milliseconds before being released.
Switch-off condition: If the PLS8-X/PLS8-V is on, the IGT line must be asserted for at least 2.1
seconds before being released. The module switches off after the line is
released. The switch-off routine is identical with the procedure initiated
by AT^SMSO, i.e. the software performs an orderly shutdown as
described in Section 3.3.3.
Before switching off the module wait at least 12 seconds after startup.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Figure 7: Timing of IGT if used as ON/OFF switch
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3.3.5 Automatic Shutdown
Automatic shutdown takes effect if:
• The PLS8-X/PLS8-V board is exceeding the critical limits of overtemperature or undertemperature
• Undervoltage or overvoltage is detected
The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO
command, i.e. PLS8-X/PLS8-V logs off from the network and the software en ters a secure state
avoiding loss of data.
Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of the temperature URCs can be enabled or disabled with
the AT commands AT^SCTM. The URC presentation mode varies with the condition, please
see Section 3.3.5.1 to Section 3.3.5.4 for details. For further instructions o n AT commands refer
to [1].
3.3.5.1 Thermal Shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the PCB.
The values detected by the NTC resistor are measured directly on the board and the refore, are
not fully identical with the ambient temperature.
Each time the board temperature goes out of range or back to normal, PLS8-X/PLS8-V instantly displays an alert (if enabled).
• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as
protecting the module from exposure to extreme conditions. The presentation of the URCs
depends on the settings selected with the AT^SCTM write command:
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minutes guard period
after start-up of PLS8-X/PLS8-V. After expiry of the 2 minutes guard period, the presentation will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.
• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be outp ut even though the factory
setting AT^SCTM=0 was never changed.
The maximum temperature ratings are stated in Section 6.2. Refer to Table 8 for the associated
URCs.
Table 8: Temperature dependent behavior
Sending temperature alert (2 minutes after PLS8-X/PLS8-V start-up, otherwise only if URC presentation enabled)
^SCTM_B: 1 Caution: Board close to overtemperatur e limit, i.e., boar d is 5° C below over tem-
perature limit.
^SCTM_B: -1 Caution: Board close to undertemperature limit, i.e., board is 5°C above under-
temperature limit.
^SCTM_B: 0 Board back to uncritical temperature range, i.e., board is 6°C below its over- or
above its undertemperature limit.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Confidential / Released
Cinterion® PLS8-X/PLS8-V Hardware Interface Description
3.3 Power-Up / Power-Down Scenarios
50
Table 8: Temperature dependent behavior
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. PLS8-X/PLS8-V switche s
off.
^SCTM_B: -2 Alert: Board equal or below undertemperature limit. PLS8-X/PLS8-V switches
off.
Page 30 of 105
The AT^SCTM command can also be used to check the present status of the board. Depending
on the selected mode, the read command returns the current board temperature in degrees
Celsius or only a value that indicates whether the board is within the safe or critical temperature
range. See [1] for further instructions.
3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions
In the following cases, automatic shutdown will be deferred if a critical temperature limit is exceeded:
• While an emergency call is in progress.
• During a two minute guard period after power-up. This guard period has been introduced in
order to allow for the user to make an emergency call. The start of any one of these calls
extends the guard period until the end of the call. Any other network activity may be terminated by shutdown upon expiry of the guard time.
While in a "deferred shutdown" situation, PLS8-X/PLS8-V continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard period is expired or the call is terminated, full temperature control will be resumed. If
the temperature is still out of range, PLS8-X/PLS8-V switches off immediately (without another
alert message).
CAUTION! Automatic shutdown is a safety feature intended to prevent damage to the module.
Extended usage of the deferred shutdown facilities provided may result in damage to the module, and possibly other severe consequences.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Confidential / Released
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