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Cinterion® PLS8-X/PLS8-V
Hardware Interface Description
Version: 03.016 DocId: PLS8-X_PLS8-V_HD_v03.016
M2M.GEMALTO.COM
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Document Name: Version:
Date: DocId: Status
Cinterion® PLS8-X/PLS8-V Hardware Interface Description
03.016 2015-12-09 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released
GENERAL NOTE
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con­tents and communication thereof to others without ex press autho rization are prohib ited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved.
Copyright © 2015, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Win dows are e ither regis tered trademarks or trademarks of Microsoft Corpora­tion in the United States and/or other countries. All other register ed trademarks or trademarks mention ed in this document are property of their respective owners.
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Contents

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Contents
0 Document History.......................................................................................................8
1 Introduction.................................................................................................................9
1.1 Supported Products...........................................................................................9
1.2 Related Documents ...........................................................................................9
1.3 Terms and Abbreviations............ ........... .......... ........... ........... ............................9
1.4 Regulatory and Type Approval Information .....................................................12
1.4.1 Directives and Standards....................................................................12
1.4.2 SAR requirements specific to portable mobiles..................................14
1.4.3 SELV Requirements ...........................................................................15
1.4.4 Safety Precautions..............................................................................15
2 Product Concept.......................................................................................................16
2.1 Key Features at a Glance................................................................................16
2.2 PLS8-X/PLS8-V System Overview..................................................................19
2.3 Circuit Concept ................................................................................................20
3 Application Interface.................................................................................................21
3.1 Operating Modes .............................................................................................22
3.2 Power Supply...................................................................................................23
3.2.1 Minimizing Power Losses ...................................................................24
3.2.2 Monitoring Power Supply by AT Command........................................24
3.3 Power-Up / Power-Down Scenarios ................................................................25
3.3.1 Turn on PLS8-X/PLS8-V.....................................................................25
3.3.2 Signal States after Startup..................................................................26
3.3.3 Turn off PLS8-X/PLS8-V Using AT Command ...................................27
3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line............................................28
3.3.5 Automatic Shutdown...........................................................................29
3.3.5.1 Thermal Shutdown..............................................................29
3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions.... 30
3.3.5.3 Undervoltage Shutdown......................................................31
3.3.5.4 Overvoltage Shutdown........................................................31
3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency ................................ 32
3.4 Power Saving...................................................................................................33
3.4.1 Wake-up via RTS0..............................................................................34
3.5 RTC Backup.....................................................................................................35
3.6 USB Interface...................................................................................................36
3.6.1 Reducing Power Consumption (TBD.)................................................37
3.7 Serial Interface ASC0 ......................................................................................38
3.8 UICC/SIM/USIM Interface................................................................................40
3.8.1 Enhanced ESD Protection for SIM Interface.......................................42
3.9 Digital Audio Interface......................................................................................43
3.9.1 Pulse Code Modulation Interface (PCM) ............................................43
3.10 Inter IC Sound Interface (I
3.11 Analog-to-Digital Converter (ADC)...................................................................44
3.12 GPIO Interface.................................................................................................44
2
S)...........................................................................43
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3.13 Control Signals.................................................................................................45
3.13.1 PWR_IND Signal ...................... .......... ................................................45
3.13.2 Behavior of the RING0 Line................................................................45
3.13.3 Remote Wakeup.................................................................................46
3.13.4 Low Current Indicator (LCI).................................................................47
3.13.5 Network Connectivity and Technology Status Signals........................48
3.13.6 700MHz Antenna Switch Control........................................................49
4 GNSS Receiver..........................................................................................................50
5 Antenna Interfaces....................................................................................................51
5.1 GSM/UMTS/LTE Antenna Interface.................................................................51
5.1.1 Antenna Installation ............................................................................52
5.1.2 RF Line Routing Design......................................................................53
5.1.2.1 Line Arrangement Examples...............................................53
5.1.2.2 Routing Example.................................................................55
5.2 GNSS Antenna Interface ................................................................................. 56
6 Electrical, Reliability and Radio Characteristics.................................................... 58
6.1 Absolute Maximum Ratings.............................................................................58
6.2 Operating Temperatures..................................................................................59
6.2.1 Temperature Allocation Model............................................................60
6.3 Storage Conditions ..........................................................................................60
6.4 Reliability Characteristics.................................................................................61
6.4.1 Bending Tests.....................................................................................62
6.5 Pad Assignment and Signal Description..........................................................63
6.6 Power Supply Ratings......................................................................................72
6.7 RF Antenna Interface Characteristics..............................................................76
6.8 GNSS Interface Characteristics.......................................................................80
6.9 Electrostatic Discharge....................................................................................81
7 Mechanics, Mounting and Packaging.....................................................................82
7.1 Mechanical Dimensions of PLS8-X/PLS8-V....................................................82
7.2 Mounting PLS8-X/PLS8-V onto the Application Platform ................................ 84
7.2.1 SMT PCB Assembly ...........................................................................84
7.2.1.1 Land Pattern and Stencil.....................................................84
7.2.1.2 Board Level Characterization..............................................86
7.2.2 Moisture Sensitivity Level ...................................................................86
7.2.3 Soldering Conditions and Temperature..............................................87
7.2.3.1 Reflow Profile......................................................................87
7.2.3.2 Maximum Temperature and Duration..................................88
7.2.4 Durability and Mechanical Handling....................................................89
7.2.4.1 Storage Life.........................................................................89
7.2.4.2 Processing Life....................................................................89
7.2.4.3 Baking.................................................................................89
7.2.4.4 Electrostatic Discharge........................................................89
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7.3 Packaging........................................................................................................90
7.3.1 Tape and Reel .......................... .......... ........... .....................................90
7.3.1.1 Orientation...........................................................................90
7.3.1.2 Barcode Label.....................................................................91
7.3.2 Shipping Materials ..............................................................................92
7.3.2.1 Moisture Barrier Bag...........................................................92
7.3.2.2 Transportation Box..............................................................94
8 Sample Application...................................................................................................95
8.1 Sample Level Conversion Circuit.....................................................................97
9 Reference Approval..................................................................................................98
9.1 Reference Equipment for Type Approval.........................................................98
9.2 Compliance with FCC and IC Rules and Regulations ..................................... 99
10 Appendix..................................................................................................................101
10.1 List of Parts and Accessories.........................................................................101
10.2 Mounting Advice Sheet..................................................................................103
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Tables

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Tables
Table 1: Directives ....................................................................................................... 12
Table 2: Standards of North American type approval.................................................. 12
Table 3: Requirements of quality ................................................................................. 12
Table 4: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 13
Table 5: Toxic or hazardous substances or elements with defined concentration
limits............................................................................................................... 13
Table 6: Overview of operating modes ........................................................................ 22
Table 7: Signal states................................................................................................... 26
Table 8: Temperature dependent behavior.................................................................. 29
Table 9: DCE-DTE wiring of ASC0 .............................................................................. 39
Table 10: Signals of the SIM interface (SMT application interface)............................... 40
Table 11: Overview of PCM pin functions...................................................................... 43
Table 12: Overview of I
Table 13: Host wakeup lines.......................................................................................... 46
Table 14: Low current indicator line............................................................................... 47
Table 15: Return loss in the active band........................................................................ 51
Table 16: Absolute maximum ratings............................................................................. 58
Table 17: Board temperature......................................................................................... 59
Table 18: Temperature allocation model........................................................................ 60
Table 19: Storage conditions ......................................................................................... 60
Table 20: Summary of reliability test conditions............................................................. 61
Table 21: Overview: Pad assignments........................................................................... 64
Table 22: Signal description........................................................................................... 67
Table 23: Voltage supply ratings.................................................................................... 72
Table 24: Current consumption ratings.......................................................................... 72
Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range).. 76
Table 26: GNSS properties............................................................................................ 80
Table 27: Power supply for active GNSS antenna......................................................... 80
Table 28: Electrostatic values........................................................................................ 81
Table 29: Reflow temperature ratings............................................................................ 87
Table 30: Antenna gain limits for FCC and IC................................................................ 99
Table 31: List of parts and accessories........................................................................ 101
Table 32: Molex sales contacts (subject to change).................................................... 102
Table 33: Hirose sales contacts (subject to change)................................................... 102
2
S pin functions......................................................................... 43
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Figures

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Figures
Figure 1: PLS8-X/PLS8-V system overview.................................................................. 19
Figure 2: PLS8-X/PLS8-V block diagram...................................................................... 20
Figure 3: Decoupling capacitor(s) for BATT+................................................................ 23
Figure 4: Power supply limits during transmit burst....................................................... 24
Figure 5: Power-on with IGT......................................................................................... 25
Figure 6: Signal states during turn-off procedure .......................................................... 27
Figure 7: Timing of IGT if used as ON/OFF switch....................................................... 28
Figure 8: Shutdown by EMERG_OFF signal................................................................. 32
Figure 9: Wake-up via RTS0......................................................................................... 34
Figure 10: RTC supply variants....................................................................................... 35
Figure 11: USB circuit..................................................................................................... 36
Figure 12: Serial interface ASC0..................................................................................... 38
Figure 13: First UICC/SIM/USIM interface...................................................................... 41
Figure 14: Second UICC/SIM/USIM interface................................................................. 41
Figure 15: SIM interface - enhanced ESD protection...................................................... 42
Figure 16: PWR_IND signal............................................................................................ 45
Figure 17: Low current indication timing (still to be confirmed)....................................... 47
Figure 18: LED circuit (example)..................................................................................... 48
Figure 19: Antenna pads (bottom view).......................................................................... 52
Figure 20: Embedded Stripline line arrangement............................................................ 53
Figure 21: Micro-Stripline line arrangement samples...................................................... 54
Figure 22: Routing to application‘s RF connector........................................................... 55
Figure 23: PLS8-X/PLS8-V evaluation board layer table................................................ 55
Figure 24: Supply voltage for active GNSS antenna....................................................... 56
Figure 25: ESD protection for passive GNSS antenna................................................... 57
Figure 26: Board and ambient temperature differences.................................................. 59
Figure 27: Bending test setup......................................................................................... 62
Figure 28: PLS8-X/PLS8-V bottom view: Pad assignments............................................ 65
Figure 29: PLS8-X/PLS8-V top view: Pad assignments.................................................. 66
Figure 30: PLS8-X/PLS8-V – top and bottom view......................................................... 82
Figure 31: Dimensions of PLS8-X/PLS8-V (all dimensions in mm)................................. 83
Figure 32: Land pattern (top layer).................................................................................. 84
Figure 33: Recommended design for 110 micron thick stencil (top layer) ...................... 85
Figure 34: Recommended design for 150 micron thick stencil (top layer) ...................... 85
Figure 35: Reflow Profile................................................................................................. 87
Figure 36: Carrier tape.................................................................................................... 90
Figure 37: Roll direction.................................................................................................. 90
Figure 38: Barcode label on tape reel............................................................................. 91
Figure 39: Moisture barrier bag (MBB) with imprint......................................................... 92
Figure 40: Moisture Sensitivity Label.............................................................................. 93
Figure 41: Humidity Indicator Card - HIC........................................................................ 94
Figure 42: PLS8-X/PLS8-V sample application............................................................... 96
Figure 43: Sample level conversion circuit...................................................................... 97
Figure 44: Reference equipment for type approval......................................................... 98
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0 Document History

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0 Document History
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Preceding document: "Cinterion® PLS8-X/PLS8-V Hardware Interface Description" v02.510
®
New document: "Cinterion
Chapter What is new
Throughout document
1.4 Removed ECE-R 10 directive from Table 1.
2.1 Added USAT as supported feature.
3.3.4 Revised section including Figure 7.
3.4 Revised description of power save mode and removed previous sections 3.4.1, 3.4.2,
3.9 Shortened section, because PLS8-X and PLS8-V are data on ly modules, an d the mod-
3.13.1 Revised section to mention VCC µC in PWR_IND circuit.
3.13.3 Revised description of remote host wakeup functionality.
3.13.6 New section 700MHz Antenna Switch Control.
5.2 Revised ratings for VGNSS in Figure 24.
6.2.1 Revised temperature allocation model given in Table 18.
Added information on dead reckoning syn ch ro niz at ion line.
Updated NAPRD version in Table 2.
and 3.4.2.
ule’s digital audio interface therefore on ly sup por ts local tones.
Updated other sections accordingly.
PLS8-X/PLS8-V Hardware Interface Description" Version 03.016
6.5 Host wakeup functionality added for GPIOs in Table 22.
7.2.3.1 Revised ramp down rate given in Table 29.
9.2 Revised maximum antenna gain limits - added Table 30.
Preceding document: "Cinterion New document: "Cinterion
Chapter What is new
Throughout document
2.3 Revised Figure 2 to differentiate between PLS8-X and PLS8-V.
3.5 New section RTC Backup.
6.5 Added characteristics for VDDLP line (RTC backup) in Table 22.
6.6 Revised current consumption ratings for IDLE mode in Table 24.
7.2.3.1 Revised description for average ramp up and ramp down rates in Table 29.
Added real time clock (RTC) information. Added VDDLP line information.
Added current consumption rating for GPRS data transfer (4Tx/1Rx @ total mismatch). Revised average GSM/UMTS/LTE current consumption ratings while GNSS is ON.
New document: "Cinterion
Chapter What is new
®
®
®
PLS8-X/PLS8-V Hardware Interface Description" v02.502
PLS8-X/PLS8-V Hardware Interface Description" Version 02.510
PLS8-X/PLS8-V Hardware Interface Description" Version 02.502
-- Initial document setup.
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1 Introduction

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1 Introduction
The document1 describes the hardware of the two Cinterion® modules variants PLS8-V and PLS8-X, designed to connect to a cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
The product variants differ in their radio access technology support:
• PLS8-X is available for operation in LTE, UMTS and GSM radio networks - for supported
frequency bands please refer to Section 2.1. Connected to this, the module has two sepa­rate firmware images on board that can be activated based on the used (U)SIM card. Employing the module’s two (U)SIM interfaces, it is thus possible to switch between firm­ware images on the fly - making PLS8-X a multi carrier/provider module.
• PLS8-V in contrast is available for operation in LTE radio networks only - for supported fre-
quency bands please refer to Section 2.1. It has only a single firmware image on board that can be activated by (U)SIM card - making it a single carrier/provider module.
If not otherwise mentioned, this document applies to both product variants. Where necessary a note is made to differentiate between the variants.

1.1 Supported Products

This document applies to the following Gemalto M2M products:
•Cinterion
•Cinterion
®
PLS8-V module
®
PLS8-X module

1.2 Related Documents

[1] AT Command Set for your Gemalto M2M product [2] Release Notes for your Gemalto M2M product [3] Application Note 48: SMT Module Integration [4] Universal Serial Bus Specification Revision 2.0, April 27, 2000

1.3 Terms and Abbreviations

Abbreviation Description
ANSI American National Standards Institute ARP Antenna Reference Point CE Conformité Européene (European Conformity) CS Coding Scheme CS Circuit Switched CSD Circuit Switched Data DCS Digital Cellular System
1.
The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
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Abbreviation Description
DL Download dnu Do not use DRX Discontinuous Reception DSB Development Support Board DTX Discontinuous Transmission EDGE Enhanced Data rates for GSM Evolution EGSM Extended GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard ETSI European Telecommunications Standards Institute FCC Federal Communications Commission (U.S.)
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FDD Frequency Division Duplex GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HSDPA High Speed Downlink Packet Access I/O Input/Output IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LCI Low Current Indicator LED Light Emitting Diode LGA Land Grid Array LTE Long term evolution MBB Moist ur e ba rr ier bag Mbps Mbits per second MCS Modulation and Coding Scheme MIMO Multiple Input Multiple Output MLCC Multi Layer Ceramic Capacitor MO Mobile Originated MS Mobile Station, also referred to as TE MSL Moisture Sensitivity Level MT Mobile Terminated nc Not connected
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Abbreviation Description
NTC Negative Temperature Coefficient PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication System, also referred to as GSM 1900 PD Pull Down resistor PDU Protocol Data Unit PS Packet Switched PSK Phase Shift Keying PU Pull Up resistor QAM Quadrature Amplitude Modulation R&TTE Radio and Telecommunication Terminal Equipment RF Radio Frequency
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rfu Reserved for future use ROPR Radio Output Power Reduction RTC Real Time Clock Rx Receive Direction SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMD Surface Mount Device SMS Short Message Service SMT Surface Mount Technology SRAM Static Random Access Memory SRB Signalling Radio Bearer TE Terminal Equipment TPC Transmit Power Control TS Technical Specification Tx Transmit Direction UL Upload UMTS Universal Mobile Telecommunications System URC Unsolicited Result Code USB Universal Serial Bus UICC USIM Integrated Circuit Card USIM UMTS Subscriber Identification Module WB-AMR Wideband Adaptive Multirate WCDMA Wideband Code Division Multiple Access
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1.4 Regulatory and Type Approval Information

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1.4 Regulatory and Type Approval Information

1.4.1 Directives and Standards

PLS8-X/PLS8-V has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical spec­ifications provided in the "PLS8-X/PLS8-V Hardware Interface Description".
Table 1: Directives
1
2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2)
Table 2: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22, Part 24 and Part 27; US Equipmen t
OET Bulletin 65 (Edition 97-01)
UL 60 950-1 Product Safety Certification (Safety requirements)
NAPRD.03 V5.23 Overview of PCS Type certification review board Mobile Equipment Type
RSS132, RSS133, RSS139
Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)
Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to Radio-
frequency Electromagnetic Fields
Certification and IMEI control PCS Type Certification Review board (PTCRB)
Canadian Standard
Table 3: Requirements of quality
IEC 60068 Environmental testing DIN EN 60529 IP codes
1.
Manufacturers of applications which can be used in the US shall en sure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances
in Electronic Information Products” (2006-06).
SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06). According to the “Chinese Administration on th e Control of
Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description.
Please see Table 5 for an overview of toxic or hazardous substances or ele­ments that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006.
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Table 5: Toxic or hazardous substances or elements with defined concentration limits
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1.4.2 SAR requirements specific to portable mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLS8-X/ PLS8-V based applications to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic
fields (EMFs) from mobile telecommunication equipment (MTE) in the frequency range 30MHz - 6GHz
IMPORTANT: Manufacturers of portable applications based on PLS8-X/PLS8-V modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Cer­tificate related to the specific portable mobile.
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1.4.3 SELV Requirements

The power supply connected to the PLS8-X/PLS8-V module shall be in compliance with the SELV requirements defined in EN 60950-1.

1.4.4 Safety Precautions

The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLS8-X/PLS8-V. Manufactur­ers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manu­facture and intended use of the product. Gemalto M2M assumes no liability for customer’s fail­ure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide­lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted med ical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac­turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make su re it can­not be switched on inadvertently. The operation of wirele ss appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel d epots, chemical plants or where blasting operations are in progress. Oper ation of any electri­cal equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special re gulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.
IMPORTANT! Cellular terminals or mobiles operate using radio signals an d cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com­munications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellu lar termi­nal or mobile.
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2 Product Concept

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2 Product Concept

2.1 Key Features at a Glance

Feature Implementation
General Frequency bands PLS8-X:
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII) LTE: Five band, 700 (Bd13) / 700 (Bd17) / 850 (Bd5) / AWS (Bd4) / 1900MHz (Bd2)
PLS8-V: LTE: Triple band, 700 (Bd13) / AWS (Bd4) / 1900MHz (Bd2)
GSM class Small MS
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Output power (according to Release 99)
Output power (according to Release 8)
Power supply 3.3V < Operating temperature
(board temperature)
Physical Dimensions: 33mm x 29mm x 2.95mm
Class 4 (+33dBm ±2dB) for EGSM850 Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSM1800 Class 1 (+30dBm ±2dB) for GSM1900 Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm +-2dB) for LTE AWS, LTE FDD Bd4 Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd17
V
Normal operation: -30°C to +85°C Extended operation: -40°C to +95°C
Weight: approx. 4.5g
BATT+
< 4.2V
RoHS All hardware components fully compliant with EU RoHS Directive LTE features 3GPP Release 9 UE CAT 3 supported
DL 100Mbps, UL 50Mbps
2x2 MIMO in DL direction HSPA features 3GPP Release 8 UE CAT. 14, 24
DC-HSPA+ – DL 42Mbps
HSUPA – UL 5.76Mbps
Compressed mode (CM) supported according to 3GPP TS25.212
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
2.1 Key Features at a Glance
20
Feature Implementation
UMTS features 3GPP Release 8 PS data rate – 384 kbps DL / 384 kbps UL
GSM / GPRS / EGPRS features Data transfer GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• 1 phase/2 phase access proce d ur es
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
Page 17 of 105
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Software AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprie tary Gemalto M2M com-
mands Firmware update Generic update from host application over USB and ASC0
U/SIM application toolkit USAT letter c; with BIP
GNSS Features
Protocol NMEA Modes Standalone GNSS
Assisted GNSS
- Control plane - E911
- User plane - gpsOneXTRA™
General Power saving modes
Power supply for active antenna Interfaces Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development
equipment. Antenna 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO
antenna, (active/passive) GNSS antenna
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2.1 Key Features at a Glance
20
Feature Implementation
USB USB 2.0 High Speed (480Mbit/s) device interface Serial interface ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Adjustable baud rate of 115,200bps to 921,600bps
• Supports RTS0/CTS0 hardware flow control
UICC interface 2 UICC interfaces (switchable)
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Audio 1 digital interface (PCM or I
Status Signal line to indicate network connectivity state
2
S)
Page 18 of 105
RING0 Signal line to indicate incoming calls and other types of
Power on/off, Reset Power on/off Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO) or IGT Automatic switch-off in case of critical temperature or voltage conditions
Reset Orderly shutdown and reset by AT command
Emergency-off Emergency-off by hardware signal EMERG_OFF if IGT is not active
Special Features Antenna SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance) Rx Diversity (receiver type 3i - 64-QAM) / MIMO
GPIO 10 I/O pins of the application interface programmable as GPIO.
GPIOs can be configured as low current indicator (LCI). GPIO1 can be configured as dead reckoning synchronization signal. GPIO2 can be configured as 700MHz antenna switch control signal. GPIOs can be configured as remote host wakeup lines. Programming is done via AT commands.
URCs
ADC inputs Analog-to-Digital Converter with three unbalanced analog inputs. Evaluation kit Evaluation module PLS8-X/PLS8-V module soldered onto a dedicated PCB tha t can be con-
nected to an adapter in order to be mounted onto the DSB75.
DSB75 DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for applica­tion engineering. A special adapter is required to connect the PLS8-X/ PLS8-V evaluation module to the DSB75.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
USB
Serial ASC0
UICC
Power supply
IGT,
Emergency Off
SIM card
Host applic a tio n
On/Off
Module
Applica t ion
GSM/UMTS/LTE Antenna diversity
Power for application
(VEXT)
Power indication
(PWR_IND)
Modem interface
Digital
audio
PCM or I2S
codec
GSM/UMTS/LTE
12
GNSS
GNSS antenna
GPIO
Power supply
GNSS active
antenna supply,
current limiter
ADC
Net state/
status
SIM card
RTC
or

2.2 PLS8-X/PLS8-V System Overview

20
2.2 PLS8-X/PLS8-V System Overview
Page 19 of 105
Figure 1: PLS8-X/PLS8-V system overview
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
Power management
IC
32.768kHz
Flash /
DDR RAM
VEXT
USB GPIO 1..10 DAI/PCM/I2 S 2x USIM Serial (A S C 0)
VDDLP PWR_IND EMERG_OFF STATUS 3xADC IGT VGNSS GND
BATT+_RF BATT+ ANT_GNSS_DC
19.2MHz
32.768kHz
19.2MHz
X-tals:
Power supply
Control interface
Reset
USB supply
Temp.
Sensor
NTC
HW-
ID’s
GPIO’s
D/A/C
Flash
GNSS
GSM/
UMTS/
LTE
UMTS/
LTE
Diversity/MIMO
Antenna pads
LGA Pads
GNSS
RF
GSM/UMTS/LTE
* Baseband controller * RF transceiver
GNSS * receiver
ADC
Power supply
Power Supply
BATT+
BATT+_RF
SP10T
SP5T
2x 2x
5x
3x
5x
3x
5x
3x
GSM-TX GSM-RX
LTE/UMTS-RX
LTE/
UMTS-TX
MIMO
RF Part
HDET
RF
D/A/C
RAM
Interrupt
BATT+_RF
2 2
DC
DC
RF
Control
Blue: PLS8-X only
Red: PLS8-V only
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2.3 Circuit Concept

20
2.3 Circuit Concept
Figure 2 shows a block diagram of the PLS8-X/PLS8-V module and illustrates the major func-
tional components: Baseband block:
• GSM/UMTS/LTE controller/transceiver/power supply
• Stacked Flash/RAM memory with multiplexed address data bus
• Application interface (SMT with connecting pads) RF section:
• RF transceiver
• RF power amplifier/frontend
• RF filter
• GNSS re ceiver/Front end
• Antenna pad
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Figure 2: PLS8-X/PLS8-V block diagram
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3 Application Interface

50
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3 Application Interface
PLS8-X/PLS8-V is equipped with an SMT application interface (LGA pads) that connects to the external application. The host interface incorporates several sub-interfaces described in the fol­lowing sections:
• Operating modes - see Section 3.1
• Power supply - see Section 3.2
• RTC backup - see Section 3.5
• Serial interface USB - see Section 3.6
• Serial interface ASC0 - Section 3.7
• UICC/SIM/USIM interface - see Section 3.8
• Digital audio interface (PCM or I
• ADC interface - Section 3.11
• GPIO interface - Section 3.12
• Control and status lines: PWR_IND, STATUS, RING0, STATUS, LCI - see Section 3.13
2
S) - see Section 3.9
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3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following chapters.
Table 6: Overview of operating modes
Mode Function
Normal operation
Power Down
Airplane mode
GSM / GPRS / UMTS / HSPA / LTE SLEEP
GSM / GPRS / UMTS / HSPA / LTE IDLE
GPRS DATA GPRS data transfer in progress. Power consumption depends on net-
EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-
UMTS DATA UMTS data transfer in progress. Power consumption depends on net-
HSPA DATA HSPA data transfer in progress. Power consumption depends on net-
LTE DATA LTE data transfer in progress. Power consumption depends on network
Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating volt­age (connected to BATT+) remains applied.
Airplane mode shuts down the radio part of the module , causes th e module to log off from the GSM/GPRS network and disables all AT commands whose execution r equires a rad io connection. Airplane mode can be controlled by AT command (see [1]).
Power saving set automatically when no call is in progress and the USB connection is detached and no active communication via ASC0. Also, the GNSS active antenna mode has to be turned off or set to "auto".
Power saving disabled or an USB connection active , but no da ta tra ns­fer in progress.
work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).
work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings).
work settings (e.g. TPC Pattern) and data transfer rate.
work settings (e.g. TPC Pattern) and data transfer rate.
settings (e.g. TPC Pattern) and data transfer rate.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
BATT+
2 2
Decoupling capacitors
e.g. 47µF X5R MLCC
4x
GND
BATT+
BATT+_RF
Module
SMT interface
1x

3.2 Power Supply

50
Page 23 of 105
3.2 Power Supply
PLS8-X/PLS8-V needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:
• BATT+_RF with 2 lines for the RF power amplifier supply
• BATT+ with 2 lines for the general power management. The main power supply from an external application has to be a single voltage source and has
to be expanded to two sub paths (star structure). Each voltage domain must be deco upled by application with low ESR capacitors ( as close as possible to LGA pads. Figure 3 shows a sample circuit for decoupling capacitors for BATT+.
> 47µF MLCC @ BATT+; > 4x47µF MLCC @ BATT+_RF)
Figure 3: Decoupling capacitor(s) for BATT+
In addition, the VDDLP pad may be connected to an external capacito r or a battery to backup the RTC (see Section 3.5). Please note that for proper module startup the voltage at BATT+ should be higher than at VDDLP.
The power supply of PLS8-X/PLS8-V must be able to provide the peak current during the uplink transmission.
All key functions for supplying power to the device are handled by the power managemen t IC. It provides the following features:
• Stabilizes the supply voltages for the baseband using switching regulators and low drop lin­ear voltage regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• Delivers, across the VEXT line, a regulated voltage for an external application.
• LDO to provide SIM power supply.
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3.2 Power Supply
50
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3.2.1 Minimizing Power Losses

When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage V board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that PLS8-X/PLS8-V switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV to ensure the expected RF performance in 2G networks.
never drops below 3.3V on the PLS8-X/PLS8-V
BATT+
The module switches off if the minimum battery voltage (V Example:
VImin = 3.3V Dmax = 0.4V
V
min = VImin + Dmax
BATT
V
min = 3.3V + 0.4V = 3.7V
BATT
Figure 4: Power supply limits during transmit burst
min) is reached.
BATT

3.2.2 Monitoring Power Supply by AT Command

To monitor the supply voltage you can use the AT^SBV command which returns the averaged value related to BATT+ and GND at the SMT application interface.
The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5 seconds in DATA mode to 50 seconds when PLS8-X/PLS8-V is in Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
BATT+
IGT
Power supply
active
EMERG_OFF
Function
active
PWR_IND
IGT
Module
Firmware start up, command interface initialization
USB*
Undefined state
0ms ~60ms
~5s
>100ms
* USB interface may take up to 12s to reach its active state
VEXT
~36ms
ASC0
Initial state Intermediate state
Page 25 of 105

3.3 Power-Up / Power-Down Scenarios

50
3.3 Power-Up / Power-Down Scenarios
In general, be sure not to turn on PLS8-X/PLS8-V while it is beyond the safety limits of voltage and temperature stated in Section 6.1. PLS8-X/PLS8-V immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause perma­nent damage to the module.

3.3.1 Turn on PLS8-X/PLS8-V

When the PLS8-X/PLS8-V module is in Power Down mode, it can be started to Normal mode by driving the IGT (ignition) line to ground. it is recommended to use an open drain/collector driver to avoid current flowing into this signal line. Pulling this signal low triggers a power-on sequence. To turn on PLS8-X/PLS8-V, IGT has to be kept active at least 100 milliseconds. After turning on PLS8-X/PLS8-V, IGT should be set inactive to prevent the module from turning on again after a shut down by AT command or EMERG_OFF. For details on signal states dur­ing startup see also Section 3.3.2.
Figure 5: Power-on with IGT
Note: After power up IGT should remain high. Also note that with a USB connection the USB host may take up to 12 seconds to set up the virtual COM port connection.
After startup or mode change the following URCs are sent to every port able to receive AT com­mands indicating the module’s ready state:
• "^SYSSTART" indicates that the module has entered Normal mode.
• "^SYSSTART AIRPLANE MODE" indicates that the module has entered Airplane mode.
These URCs notify the external application that the first AT command can be sent to the mod­ule. If these URCs are not used to detect then the only way of checking the module’s ready state is polling. To do so, try to send characters (e.g. “at”) until the module is responding.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
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3.3 Power-Up / Power-Down Scenarios
50

3.3.2 Signal States after Startup

Table 7 describes the various states each interface signal passes through after startup and dur-
ing operation. Signals are in an initial state while the module is initializing. Once the startup initialization has
completed, i.e. when the software is running, all signals are in defined state. The state of sev­eral signals will change again once the respective interface is activated or configured by AT command.
Table 7: Signal states
Signal name Power on reset
Duration appr. 60ms
CCINx PD and PU (24k) PU(24k) I, PU(24k) CCRSTx Not driven (similar PD) Not driven (similar PD) O, L
CCIOx PD(10k) PD(10k) PD(10k)
CCCLKx Not driven (similar PD) Not driven (similar PD) O, L
CCVCCx Off Off Off
RXD0 PD PU PU TXD0 PD PD PD CTS0 PD PD PD RTS0 PU and PD PD PD DTR0 PD PD PD DCD0 PD PU DSR0 PD PD PD RING0 PD O, H O, H PCM_I2S_IN PU PD PD PCM_I2S_CLK PD PD PD PCM_I2S_FSC PD PD PD PCM_I2S_OUT PD PD PD I2S_MCLKOUT PD PD PD PWR_IND Z O, L O, L STATUS PD PD PD EMERG_OFF PU I, PU I, PU IGT I, PU I, PU I, PU GPIO1...10
1.
2.
3.
4.
4
If CCINx = High level If CCINx = Low level No external pull down allowed during this phase. Please note that during its startup phase the GPIO8 signal will be in an active low state for appr. 80ms.
PD PD PD
Startup phase Duration appr. 4s
3
State after first firmware initialization After 4-5s
1
2
O, H
PU(10k)
Clock
1.8V/3V
1 2
1
2
1
2
PD
L = Low level H = High level I = Input O = Output
1.
Internal pulls are implemented using JFETs; strengths vary between devices, possible range: 55k…390k
PD = Pull down resistor with appr. 100k PD(…k) = Pull down resistor with ...k PU = Pull up resistor with appr. 100k PU(…k) = Pull up resistor with ...k, Z = High impedance
1
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
PWR_IND
Digital outputs Reset state
VEXT
Inputs driven by
application
BATT+ driven by
application
AT^SMSO
3s...25s
Deregister from network, system
shut down
Prepare to
reset
50...90µs
Reset state,
power down procedure
appr. 12ms >6ms
See
Note 1
See
Note 2
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3.3 Power-Up / Power-Down Scenarios
50

3.3.3 Turn off PLS8-X/PLS8-V Using AT Command

The best and safest approach to powering down PLS8-X/PLS8-V is to issue the AT^SMSO command. This procedure lets PLS8-X/PLS8-V log off from the network and allows the soft­ware to enter into a secure state and save data before disconnecting the power supply. The mode is referred to as Power Down mode. In this mode, only the RTC stays active. After send­ing AT^SMSO do not enter any other AT commands. While powering down the module may still send some URCs. To verify that the module turned off it is possible to monitor the PWR_IND signal. A high state of the PWR_IND signal line indicates that the module is being switched off as shown in Figure 6.
Be sure not to disconnect the supply voltage V
before the module’s switch off procedure
BATT+
has been completed and the VEXT signal has gone low. Otherwise you run the risk of losing data. Signal states during switch off are shown in Figure 6.
While PLS8-X/PLS8-V is in Power Down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital signal lines of the application interface. No special care is re­quired for the USB interface which is protected from reverse current.
Note 1: Depending on capacitance load from host application Note 2: The power supply voltage (BATT+) may be disconnected or switched off only after
the VEXT went low.
Note 3: After module shutdown by means of AT command is completed, please allow for a
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time period of at least 1 second before restarting the module.
Figure 6: Signal states during turn-off procedure
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
1 2
>
5s
>
100ms >2.1s
1–TriggersswitchONroutine 2–TriggersswitchOFFroutine
IGT
3.3 Power-Up / Power-Down Scenarios
50
Page 28 of 105

3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line

The IGT line can be configured for use in two different switching modes: You can set the IGT line to switch on the module only, or to switch it on and off. The switching mode is determined by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. This approach is use­ful for external application manufacturers who wish to have an ON/OFF switch installed on the host device.
By factory default, the ON/OFF switch mode of IGT is disabled:
at^scfg=meshutdown/onignition ^SCFG: "MEShutdown/OnIgnition","off" OK
# Query the current status of IGT. # IGT can be used only to switch on PLS8-X/ PLS8-V. IGT works as described in Section 3.3.1.
To configure IGT for use as ON/OFF switch:
at^scfg=meshutdown/onignition ^SCFG: "MEShutdown/OnIgnition","on" OK
# Enable the ON/OFF switch mode of IGT. # IGT can be used to switch on and off PLS8-X/ PLS8-V.
Take great care before changing the switching mode of the IGT line. To ensure that the IGT line works properly as ON/OFF switch it is of vital importance that the following conditions are met:
Switch-on condition: If the PLS8-X/PLS8-V is off, the IGT line must be asserted for at least 100
milliseconds before being released.
Switch-off condition: If the PLS8-X/PLS8-V is on, the IGT line must be asserted for at least 2.1
seconds before being released. The module switches off after the line is released. The switch-off routine is identical with the procedure initiated by AT^SMSO, i.e. the software performs an orderly shutdown as described in Section 3.3.3. Before switching off the module wait at least 12 seconds after startup.
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Figure 7: Timing of IGT if used as ON/OFF switch
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3.3.5 Automatic Shutdown

Automatic shutdown takes effect if:
• The PLS8-X/PLS8-V board is exceeding the critical limits of overtemperature or undertem­perature
• Undervoltage or overvoltage is detected
The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO command, i.e. PLS8-X/PLS8-V logs off from the network and the software en ters a secure state avoiding loss of data.
Alert messages transmitted before the device switches off are implemented as Unsolicited Re­sult Codes (URCs). The presentation of the temperature URCs can be enabled or disabled with the AT commands AT^SCTM. The URC presentation mode varies with the condition, please see Section 3.3.5.1 to Section 3.3.5.4 for details. For further instructions o n AT commands refer to [1].

3.3.5.1 Thermal Shutdown

The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and the refore, are not fully identical with the ambient temperature.
Each time the board temperature goes out of range or back to normal, PLS8-X/PLS8-V instant­ly displays an alert (if enabled).
• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command: AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minutes guard period after start-up of PLS8-X/PLS8-V. After expiry of the 2 minutes guard period, the presenta­tion will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.
• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre­sentation of these URCs is always enabled, i.e. they will be outp ut even though the factory setting AT^SCTM=0 was never changed.
The maximum temperature ratings are stated in Section 6.2. Refer to Table 8 for the associated URCs.
Table 8: Temperature dependent behavior
Sending temperature alert (2 minutes after PLS8-X/PLS8-V start-up, otherwise only if URC presenta­tion enabled)
^SCTM_B: 1 Caution: Board close to overtemperatur e limit, i.e., boar d is 5° C below over tem-
perature limit.
^SCTM_B: -1 Caution: Board close to undertemperature limit, i.e., board is 5°C above under-
temperature limit.
^SCTM_B: 0 Board back to uncritical temperature range, i.e., board is 6°C below its over- or
above its undertemperature limit.
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50
Table 8: Temperature dependent behavior
Automatic shutdown (URC appears no matter whether or not presentation was enabled) ^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. PLS8-X/PLS8-V switche s
off.
^SCTM_B: -2 Alert: Board equal or below undertemperature limit. PLS8-X/PLS8-V switches
off.
Page 30 of 105
The AT^SCTM command can also be used to check the present status of the board. Depending on the selected mode, the read command returns the current board temperature in degrees Celsius or only a value that indicates whether the board is within the safe or critical temperature range. See [1] for further instructions.

3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions

In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex­ceeded:
• While an emergency call is in progress.
• During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be termi­nated by shutdown upon expiry of the guard time.
While in a "deferred shutdown" situation, PLS8-X/PLS8-V continues to measure the tempera­ture and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 min­ute guard period is expired or the call is terminated, full temperature control will be resumed. If the temperature is still out of range, PLS8-X/PLS8-V switches off immediately (without another alert message).
CAUTION! Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the mod­ule, and possibly other severe consequences.
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3.3 Power-Up / Power-Down Scenarios
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3.3.5.3 Undervoltage Shutdown

If the measured battery voltage is no more sufficient to set up a call the following URC will be presented:
^SBC: Undervoltage.
The URC indicates that the module is close to the undervoltage threshold. If undervoltage per­sists the module keeps sending the URC several times before switching off automatically.
This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur.

3.3.5.4 Overvoltage Shutdown

The overvoltage shutdown threshold is 100mV above the maximum supply voltage V
BATT+
specified in Table 22. When the supply voltage approaches the overvoltage shutdown threshold the module will send
the following URC:
^SBC: Overvoltage warning
This alert is sent once. When the overvoltage shutdown threshold is exceeded the module will send the following URC
^SBC: Overvoltage shutdown
before it shuts down cleanly. This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur. Keep in mind that several PLS8-X/PLS8-V components are directly linked to BATT+ and , there-
fore, the supply voltage remains applied at major parts of PLS8-X/PLS8-V, even if the module is switched off. Especially the power amplifier is very sensitive to high voltage and might even be destroyed.
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PWR_IND
EMERG_OFF
VEXT
>40ms
Shut Down
536ms
BATT+
3.3 Power-Up / Power-Down Scenarios
50
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3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency

Caution: Use the EMERG_OFF line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_OFF line causes the loss of all infor­mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PLS8-X/PLS8-V does not respond, if reset or shutdown via AT command fails.
The EMERG_OFF line is available on the application interface and can be used to switch off the module. To control the EMERG_OFF line it is recommended to use an open drain / collector driver.
To switch off, the EMERG_OFF line must be pulled to ground for longer than 4 0 milliseconds. After the 40 milliseconds and an additional delay period of 500 millise conds t he module shuts down as shown in Figure 8.
Figure 8: Shutdown by EMERG_OFF signal
Note: The power supply voltage (BATT+) may be disconnected or switched off only after having reached Shut Down as indicated by the PWR_IND signal going high. The power supply has to be available (again) before the module is restarted.
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3.4 Power Saving

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3.4 Power Saving
PLS8-X/PLS8-V is able to reduce its functionality to a minimum (during the so-called SLEEP mode) in order to minimize its current consumption. This behavior is configurable by AT com­mand:
• AT^SCFG= "MEopMode/PwrSave": The power save mode is by default disabled. If enabled, the module will switch into a power saving (SLEEP) state while inactive, waking up only after one of the following events: Cyclically after expiry of a specified power saving period, sending a URC (incl. for incoming calls), toggling the RTS0 line (falling edge only), toggling the DTR0 line (both edges). See Section 3.4.1 for a description on how to immedi­ately wake up PLS8-X/PLS8-V from SLEEP mode again using RTS0.
• AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans­mission data pending on any port. The expect DTR AT command ensures that data becom­ing pending on any port before an external application has signalled its readiness to receive the data is discarded. By default this behavior is enabled for all ports. For this feature to work the external application should be able to trigger and control the DTR line.
• AT^SCFG="Radio/OutputPowerReduction": Output power reduction is possible for the module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005 section.
Please refer to [1] for more information on the above AT commands used to configure the mod­ule’s power saving behavior.
The implementation of the USB host interface also influences the module’s power saving behavior and therefore its current consumption. For more information see Section 3.6. Another feature influencing the current consumption is the configuration of the GNSS antenna interface. For details see Section 6.8.
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RTS0
CTS0
TXD0
RXD0
AT command
Reply URC
RTS assertion (falling edge)
W ake up from SLEEP mode
Return to SLEEP mode
RTS back
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3.4 Power Saving
50

3.4.1 Wake-up via RTS0

RTS0 can be used to wake up PLS8-X/PLS8-V from SLEEP mode. Assertion of RTS0 (i.e., tog­gle from inactive high to active low) serves as wake up event, thus allowing an external appli­cation to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is therefore recom­mended to enable RTS/CTS flow control (default setting).
Figure 9 shows the described RTS0 wake up mechanism.
Figure 9: Wake-up via RTS0
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Capacitor
Chargeable battery
Non chargeable battery
VDDLP
or or
GSM processor and power management
RTC
SMT interface
BATT+
Module
1k
GND
LDO RC
0.8k3.2V

3.5 RTC Backup

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3.5 RTC Backup
The internal Real Time Clock of PLS8-X/PLS8-V is supplied from a separate voltage regulator in the power supply component which is also active when PLS8-X/PLS8-V is in Power Down mode and BATT+ is available. An alarm function is provided that allows to wake up PLS8-X/ PLS8-V. When the alarm time is reached the module wakes up to the functionality level (AT+CFUN) that was valid before power down. For example, if the module was in Airplane mode before power down, the module will wake up without logging on to the GSM/UMTS net­work.
In addition, you can use the VDDLP pad on the SMT interface to backup the RTC from an ex­ternal capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged from the internal LDO of PLS8-X/PLS8-V. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of bu ffering when no voltage is applied to PLS8-X/PLS8-V, i.e. the greater the capacitor the longer PLS8­X/PLS8-V will save the date and time. It limits the output current of an empty capacitor or bat­tery.
Figure 10 show various sample configurations.
Figure 10: RTC supply variants
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DP DN
VREG (3V075)
BATT+
USB_DP
3)
lin. reg.
GND
Module
Detection only
VUSB_IN
2)
USB part
1)
1)
All serial (including RS) and pull-up resistors for data lines are implemented.
USB_DN
3)
3)
If the USB interface is operated in High S peed mode (48 0 MHz), it is recomm e nded to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case impleme nt a differential impeda nc e of 90 ohms for proper signal integrity.
R
S
R
S
VBUS
1µF
2)
Since VUSB_IN is used for detection only it is recomm ende d not to add an y further blocking capacitors on the VUS B_IN line.
Host wakeup
RING0
SMT
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3.6 USB Interface

50
3.6 USB Interface
PLS8-X/PLS8-V supports a USB 2.0 High Speed (480Mbps) device interface. The USB inter­face is primarily intended for use as command and data interface and for downloading firm­ware.
The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLS8-X/PLS8-V is designed as a self-powered device compliant with the “Universal Ser ial Bus Specification Revision 2.0”
1
.
Figure 11: USB circuit
To properly connect the module's USB interface to the external application, a USB 2.0 compat­ible connector and cable or hardware design is required. For more information on the USB re­lated signals see Table 22. Furthermore, the USB modem driver distribute d with PLS8-X/PLS8­V needs to be installed.
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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3.6.1 Reducing Power Consumption (TBD.)

While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power reduction mechanisms:
• Recommended implementation of USB Suspend/Resume/Remote Wakeup:
The USB host should be able to bring its USB interface into the Suspended state as described in the “Universal Serial Bus Specification Revision 2.0“ work, the VUSB_IN line should always be kept enabled. On incoming calls and other events PLS8-X/PLS8-V will then generate a Remote Wakeup request to resume the USB host con­troller.
See also [4] (USB Specification Revision 2.0, Section 10.2.7, p.282): "If USB System wishes to place the bus in the Suspended state, it commands the Host Con­troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus­pended state. In this state, the USB System may enable the Host Controller to respond to bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to restart the host system."
1
. There are two possibilities to enable power
2
. For this functionality to
• Implementation for legacy USB applications not supporting USB Suspend/Resume:
As an alternative to the regular USB suspend and resume mechanism it is possible to employ a remote wakeup line (e.g., the RING0 line) to wake up the host applica tion in case of incoming calls or events signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every wakeup event will force a new USB enumeration. Therefore, the external application has to carefully consider the enumeration timings to avoid loosing any signalled events. For details on this host wakeup functionality see Section 3.13.3. To pre­vent existing data call connections from being disconnected while the USB interface is in detached state (i.e., VUSB_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]).
1.
Please note that if the USB interface is employed, and a USB cable is connected, there should also be a terminal programm linked to the USB port in order to receive and process the initial SYSSTART URC after module startup. Otherwise, the SYSSTART URC remains pending in the USB driver's output buffer and this unprocessed data prevents the module from power saving.
2.
The specification is ready for download on http://www.usb.org/developers/docs/
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3.7 Serial Interface ASC0

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3.7 Serial Interface ASC0
PLS8-X/PLS8-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 conform­ing to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU­T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 22.
PLS8-X/PLS8-V is designed for use as a DCE. Based on the conventions for DCE-DTE con­nections it communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 12: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on h ow to configure the RING0 line by AT^SCFG.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 115,200bps up to 921,600bps.
• Supports RTS0/CTS0 hardware flow control.
• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.4.1).
Note: If the ASC0 serial interface is the application’s only interface, it is suggested to connect test points on the USB signal lines as a potential tracing possibility.
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3.7 Serial Interface ASC0
50
Table 9: DCE-DTE wiring of ASC0
V.24 circuit DCE DTE
Line function Signal direction Line function Signal direction
103 TXD0 Input TXD Output 104 RXD0 Output RXD Input 105 RTS0 Input RTS Output 106 CTS0 Output CTS Input 108/2 DTR0 Input DTR Output 107 DSR0 Output DSR Input 109 DCD0 Output DCD Input 125 RING0 Output RING Input
Page 39 of 105
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3.8 UICC/SIM/USIM Interface

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3.8 UICC/SIM/USIM Interface
PLS8-X/PLS8-V has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces.
The UICC/SIM/USIM interfaces support 3V and 1.8V SIM cards. Please refer to Table 22 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or
1.8V SIM card is used.
The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLS8-X/PLS8-V and is part of the Gemalto M2M reference equipment submitted for type approval. See Chapter 10 for Molex ordering numbers.
Table 10: Signals of the SIM interface (SMT application interface)
Signal Description
GND Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g.,
pad N11 may be used to improve EMC.
CCCLK1 CCCLK2
CCVCC1 CCVCC2
CCIO1 CCIO2
CCRS1 CCRS2
CCIN1 CCIN2
Chipcard clock lines for 1
SIM supply voltage lines for 1
Serial data lines for 1
Chipcard reset lines for 1
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc­tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may inva lidate the type approval of PLS8-X/PLS8-V.
st
and 2nd SIM interface.
st
and 2nd SIM interface.
st
and 2nd SIM interface, input and output.
st
and 2nd SIM interface
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ­ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLS8-X/PLS8-V.
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Module
open: Card removed closed: Card inserted
CCRST1
CCVCC1
CCIO1
CCCLK1
CCIN1
SIM / UICC
1n
220n
SMT application interface
GND
Module
O p e n : Card removed Closed: Card inserted
CCRST2
CCVCC2
CCIO2
CCCLK2
CCIN2
SIM / UICC
1nF
220nF
SMT application interface
GND
VEXT
100pF*
22k*
2k2
10k
*Should be placed as close as possible to SMT application interface
3.8 UICC/SIM/USIM Interface
50
Figure 13: First UICC/SIM/USIM interface
Page 41 of 105
The total cable length between the SMT application interface pads on PLS8-X/PLS8-V and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifica­tions of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line.
An example for an optimized ESD protection for the SIM interface is shown in Section 3.8.1. Note: Figure 13 shows how to connect a SIM card holder to the first SIM interface. With the
second SIM interface some internally integrated components on the SIM circuit will have to be externally integrated as shown for the second SIM interface in Figure 14.
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Figure 14: Second UICC/SIM/USIM interface
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CCRSTx
CCCLKx
CCIOx
CCVCCx
CCINx
51R
51R
51R
123
654
SIM_RST
SIM_CLK
SIM_IO
SIM_VCC
SIM_DET
Module
GND SIM_GND
5-line transient voltage supressor array, e.g., NUP5120X6 or ESDA6V1-5P6
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3.8 UICC/SIM/USIM Interface
50

3.8.1 Enhanced ESD Protection for SIM Interface

To optimize ESD protection for the SIM interfaces it is possible to add ESD diodes to the inter­face lines of the first and second SIM interface as shown in the example given in Figure 15.
The example was designed to meet ESD protection according ETSI EN 301 489-1/ 7: Contact discharge: ± 4kV, air discharge: ± 8kV.
Figure 15: SIM interface - enhanced ESD protection
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3.9 Digital Audio Interface

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3.9 Digital Audio Interface
PLS8-X/PLS8-V has a digital audio interface that can be employed either as pulse code mod­ulation interface (see Section 3.9.1) or as inter IC sound interface (see Section 3.10). Operation can be configured by AT command (see [1]). Default setting is pulse code modulation.
Note: As PLS8-X/PLS8-V is a data only module, the module’s digital audio interface supports local tones only and is otherwise reserved for future use.

3.9.1 Pulse Code Modulation Interface (PCM)

PLS8-X/PLS8-V's PCM interface can be used to connect audio devices capable of pulse code modulation. For the PCM interface configuration the parameters <clock>, <mode>, <frame_mode>, <ext_clk_mode> and <sample_rate> of the AT^SAIC command can be con­figured in any combination (for details on AT^SAIC see [1]). Table 11 lists the available PCM interface signals.
Table 11: Overview of PCM pin functions
Signal name on SMT application interface
PCM_I2S_OUT PD O O PCM_I2S_IN PD I I PCM_I2S_FSC PD O I PCM_I2S_CLK PD O I
Signal configuration inactive Signal
direction: Master
Signal direction: Slave
Characteristics of Audio Modes
PLS8-X/PLS8-V has various audio modes selectable with AT^SNFS (for details see [1]).

3.10 Inter IC Sound Interface (I2S)

The I2S Interface is a standardized bidirectional I2S ("Inter-IC Sound Interface") based digital audio interface for transmission of mono audio signals. The I configured using the AT command AT^SAIC (see [1]). An activation is possible only out of tone presentation. The I
2
S properties and capabilities comply with the requirements layed out in the
Phillips I2S Bus Specifications, revised June 5, 1996. The digital audio interface pads available
2
for the PCM interface are also available for the I
S interface. In I2S mode they have the same electrical characteristics. For the master clock option there is a separate line (see Section 6.5 for more information on these lines). Table 12 lists the available I
2
S interface can be enabled and
2
S interface signals.
Table 12: Overview of I2S pin functions
Signal name on SMT application interface
PCM_I2S_OUT PD O PCM_I2S_IN PD I PCM_I2S_FSC PD O PCM_I2S_CLK PD O I2S_MCLKOUT PD O
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Signal configuration inactive Signal direction: Master
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3.11 Analog-to-Digital Converter (ADC)

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3.11 Analog-to-Digital Converter (ADC)
PLS8-X/PLS8-V provides three unbalanced ADC input lines: ADC1_IN, ADC2_IN and ADC3_IN. They can be used to measure three independent, externally connected DC volta ges in the range of 0.3V to 3.075V.
The AT^SRADC command can be employed to select the ADC line, set the measurement mode and read out the measurment results.

3.12 GPIO Interface

PLS8-X/PLS8-V has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled.
The IO port driver has to be open before using and configuring GPIOs. Before changing the configuration of a GPIO pin (e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to input, the pin has high-Z without pull resistor.
GPIO1 can be configured as dead reckoning synchronization line (see Chapter 4), GPIO2 can be configured as 700MHz antenna switch control signal (see Section 3.13.6), GPIO6 may be configured as low current indicator signal (see Section 3.13.4), and GPIOs may be set as re­mote host wakeup lines (see Section 3.13.3).
If the PLS8-X/PLS8-V stays in power save (SLEEP) mode a level state transition at GPIO1, GPIO3, GPIO4, GPIO5 and GPIO9 will wake up the module. To query the level state the AT^SCPOL command may be used.
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
Power supply
On/Off
PWR_IND
For example:
VCC µC or
BATT+
Module
SMT interface
(open drain
driver)
Pull-up
R1

3.13 Control Signals

50
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3.13 Control Signals

3.13.1 PWR_IND Signal

PWR_IND notifies the on/off state of the module. For state detection an external p ull-up resistor is required (cp. R1 in below Figure 16). As long as the feeding voltage is applied at the pull-up resistor, a high state of PWR_IND indicates that the module is switched off.
Figure 16: PWR_IND signal

3.13.2 Behavior of the RING0 Line

The RING0 line serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).
Although not mandatory for use in a host application, it is strongly suggested that you connect the RING0 line to an interrupt line of your application. In this case, the application can be de­signed to receive an interrupt when a falling edge on RING0 occurs. This solution is most ef­fective, particularly, for waking up an application from power saving. Therefore, utilizing the RING0 line provides an option to significantly reduce the overall current consumption of your application.
The RING0 line behavior and usage can be configured by AT command. For details see [1]: AT^SCFG.
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3.13.3 Remote Wakeup

If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are all GPIO signals as well as the RING0 line. Please refer to [1]: AT^SCFG: "Re­moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. Possible states are listed in Table 13.
If no line is specifically configured as remote wakeup signal, the remote USB suspend and re­sume mechanism as specified in the “Universal Serial Bus Specification Revision 2.0“
1
applies for the USB interface (see Section 3.6), or the RING0 line may be employed with USB applica­tions not supporting this mechanism (see also Section 3.6.1). This legacy behaviour of the RING0 line as remote host wakeup line has to be enabled and con figured by AT command (see
[1]: AT^SCFG: "URC/Ringline"). Possible states are listed in Table 13.
Table 13: Host wakeup lines
Signal I/O/P Description
RING0 O Inactive to active low transition:
0 = The host shall wake up 1 = No wake up request
GPIOx O Inactive to active high transition:
0 = No wake up request 1 = The host shall wake up
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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tLCru>
300µs
tLCpk<100µs
ILCmax <100mA
t
t
I
BATT+
GPIOx
ILCpk<150mA
0
1
tLC
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3.13 Control Signals
50

3.13.4 Low Current Indicator (LCI)

A low current indication is optionally available over a GPIO line. By default, low current indica­tion is disabled and the GPIO pads can be configured and employed as usual.
For a GPIO pad to work as a low current indicator the feature has to be enabled by AT com­mand (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). By default, the GPIO6 pad is config­ured as LCI signal.
If enabled, the GPIOx/LCI signal is high when the module is sleeping . During its sleep the mod­ule will for the most part be slow clocked with 32kHz RTC.
Table 14: Low current indicator line
Signal I/O/P Description
GPIOx/LCI O Inactive to actice high transition:
0 = High current consumption
The module draws its power via BATT+
1 = Low current consumption (only reached during SLEEP mode)
The module draws only a low current via BATT+
Figure 17: Low current indication timing (still to be confirmed)
tLC Time for the I tLCpk Max. time duration for the inrush current peak at the end of the low current period. tLCru When the GPIOx signal becomes inactive (low) the current ramps up to the
current consumption: ILCmax<100mA.
BATT+
maximum low current value within tLCru.
ILCpk When the module turns from sleep to normal operation some internal supply
voltages will be switched on. That causes a small inrush current peak.
ILCmax During the low current period tLC the current consumption does not exceed
the ILCmax value.
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VCC
STATUS
LED
GND
0 = LED off 1 = LED on
3.13 Control Signals
50
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3.13.5 Network Connectivity and Technology Status Signals

The STATUS line serves to indicate the module’s network connectivity state or the underlying network technology (2G or 3G/4G) and can be used to control an externally connected LED as shown in Figure 18. To operate the LED a buffer, e.g. a transistor or gate, must be included in the external application.
Figure 18: LED circuit (example)
For electrical characteristics of the STATUS line see Table 22. The network connectivity and technology signal function is volatile and has to be activated after module startup with AT^SLED. For details on the command as well as status and mode indications through blinking intervals see [1].
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3.13 Control Signals
50
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3.13.6 700MHz Antenna Switch Control

To provide for an antenna optimization over a wide frequency range, the GPIO2 (ANT_SWITCH) line can be configured as a control signal for a possible external antenna switch that is able to change between an antenna covering the 700MHz band and an a ntenna covering all other bands - depending on the frequency band currently being used by the mod­ule.
If the control switch functionality is enabled, GPIO2 is set to "high" (1) if the module is employ­ing frequencies in the 700 MHz range (i.e., LTE band 17) and "low" (0) for all other frequencies, including the 800/850 MHz frequency bands.
A GPIO2 signal switch is triggered by all module internal activities involving a change of the used frequency, even if only temporary (e.g., inter-band scanning using compressed mode). The maximum delay/deviation between internal usage ch ange of the frequency ban d, and the GPIO2 signal change is 10 microseconds.
For electrical characteristics of the GPIO2 (ANT_SWITCH) line see Table 22. The antenna switch control is non-volatile and has to be activated after module startup with AT^SCFG="GPIO/ Mode/Antenna". For details on the command see [1].
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4 GNSS Receiver

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4 GNSS Receiver
PLS8-X/PLS8-V integrates a GNSS receiver that offers the full performance of GPS/ GLONASS technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data.
The integrated GNSS receiver supports the NMEA protocol via USB or ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) electronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org.
Depending on the receiver’s knowledge of last position, current time and ephemeris data, th e receiver’s startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl­edge of its last position or time, a startup takes considerably longer than if the receiver has still knowledge of its last position, time and almanac or has still access to valid ephimeris data and the precise time. For more information see Section 6.8.
By default, the GNSS receiver is switched off. It has to be switched on and configured using AT commands. For more information on how to control the GNSS interface via the AT commands see [1].
Dead Reckoning Sync Line:
Dead reckoning solutions are used in (automotive) platforms to determine the (vehicles) loca­tion even when there is no GPS signal available (e.g. in tunnels, basement garages or even between high buildings in cities).
In addition to dead reckoning related NMEA sentences (for details see [1]: GNSS sentences), PLS8-X/PLS8-V provides a dead reckoning synchronization line (DR_SYNC line) to be employed in external dead reckoning applications. DR_SYNC is derived from the GPS signal clock as 1 pulse per second (1PPS) signal, with a frequency of 1Hz, an accuracy of +/-5 ms, and a high state pulse of 1ms. The DR_SYNC signal is provided as long as synchronized with the GPS satellite clock, and continues for approximately 6 minutes after GPS signal loss. DR_SYNC can be configured for the GPIO1 pad.
DR_SYNC can be activated using the AT command AT^SGPSC. For more information on the command please refer to [1], for electrical characteristics see Table 22.
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5 Antenna Interfaces

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5 Antenna Interfaces

5.1 GSM/UMTS/LTE Antenna Interface

The PLS8-X/PLS8-V GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality total mismatch at the antenna interface without any damage, even when transmitting at maxi­mum RF power.
The external antennas must be matched properly to achieve best performance regarding radi­ated power, modulation accuracy and harmonic suppression. Matching networks are not in­cluded on the PLS8-X/PLS8-V PCB and should be placed in the host application, if the a ntenna does not have an impedance of 50
Regarding the return loss PLS8-X/PLS8-V provides the following values in the active band:
Table 15: Return loss in the active band
1
. The interface has an impedance of 50. PLS8-X/PLS8-V is capable of sustaining a
.
State of module Return loss of module Recommended return loss of application
Receive > Transmit not applicable > Idle <
8dB > 12dB
12dB
5dB not applicable
1.
By delivery default the UMTS/LTE Rx diversity/MIMO antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.
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12345678910111213141516
P
N
M
L
GND
K
ANT_ MAIN
J
GND
H
G
F
GND
E
ANT_ GNSS
D
GND
C
B
A
GND
ANT_ DRX_ MIMO
GND
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5.1 GSM/UMTS/LTE Antenna Interface
57

5.1.1 Antenna Installation

The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and their neighboring ground pads directly to the application’s PCB.
The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these
Figure 19: Antenna pads (bottom view)
pads on the application’ PCB. The wiring of the antenna connection, starting from the antenna p ad to the application’s ante n-
na should result in a 50 be optimized with regard to the PCB’s layer stack. Some examples are given in Section 5.1.2.
To prevent receiver desensitization due to interferences generated by fast transients like high
line impedance. Line width and distance to the GND plane need to
speed clocks on the external application PCB, it is recommended to realize the antenna con­nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-
tion 5.1.2 for examples of how to design the antenna connection in order to achieve the
required 50 For type approval purposes, the use of a 50
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
line impedance.
coaxial antenna connector (U.FL-R-SMT) might
to PLS8-X/PLS8-V‘s antenna pad.
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5.1 GSM/UMTS/LTE Antenna Interface
57
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5.1.2 RF Line Routing Design

5.1.2.1 Line Arrangement Examples

Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Embedded Stripline
This below figure shows line arrangement examples for embedded stripline.
Figure 20: Embedded Stripline line arrangement
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5.1 GSM/UMTS/LTE Antenna Interface
57
Micro-Stripline
This section gives two line arrangement examples for micro-stripline.
Page 54 of 105
Figure 21: Micro-Stripline line arrangement samples
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e.g. ANT_ MAIN
G N D
G N D
Edge of module PCB
Stripline (50 ohms) on top
layer of evaluation board from
antenna pad to module edge
Width = 0.33 mm
E.g., U.FL antenna
connector
50 ohms microstrip line
G N D G N D
Ground connection
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5.1 GSM/UMTS/LTE Antenna Interface
57

5.1.2.2 Routing Example

Interface to RF Connector
Figure 22 shows a sample connection of a module‘s antenna pad at the bottom layer of the
module PCB with an application PCB‘s coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm is recommended for an application with a PCB layer stack resembling the one of the PLS8-X/PLS8-V evaluation board shown in Figure 23. For different layer stacks the stripline width will have to be adapted accordingly.
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Figure 22: Routing to application‘s RF connector
Figure 23: PLS8-X/PLS8-V evaluation board layer table
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Short circuit
protection
(Imax=50mA)
VGNSS
ANT_GNSS
Active GNSS
antenna
10nH
100nF
To GNSS
receiver
Module
SMT interface
ANT_GNSS_DC
typ 3.05V max. 50mA
Not short circuit protected!
1uF
(Optional)
ESD
protection
10k
Supply with short circuit protection
LDO
VGNSS
ANT_GNSS
Active
GNSS
antenna
10nH
100nF
To GNSS
receiver
Module
SMT interface
ANT_GNSS_DC
1uF
(Optional)
ESD
protection
10k
Enable
External
voltage
Supply with external LDO employed
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5.2 GNSS Antenna Interface

57
5.2 GNSS Antenna Interface
In addition to the RF antenna interface PLS8-X/PLS8-V also has a GNSS antenna interface. See Section 6.5 to find out where the GNSS antenna pad is located. The GNSS pad itself is the same as for the RF antenna interface (see Section 5.1.1).
It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM and GNSS is implemented. For electrical characteristics see Section 6.8.
PLS8-X/PLS8-V provides the supply voltage VGNSS for the GNSS active antenna (3.05V). It has to be enabled by software when the GNSS receiver becomes active, otherwise VGNSS should be off (power saving). VGNSS is not short circuit protected. This will have to be provided for by an external application. The DC voltage should be fed back via ANT_GNSS_DC for cou­pling into the GNSS antenna path. Figure 24 shows the flexibility in realizing the power supply for an active GNSS antenna by giving two sample circuits realizing the supply voltage for an active GNSS antenna - one with short circuit protection and one with an external LDO employed.
Figure 24: Supply voltage for active GNSS antenna
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VGNSS
ANT_GNSS
Passive
GNSS
antenna
10nH
100nF
To GNSS
receiver
Module
SMT interface
ANT_GNSS_DC
(Optional)
ESD
protection
0R
Not used
Page 57 of 105
5.2 GNSS Antenna Interface
57
Figure 25 shows sample circuits realizing ESD protection for a passive GNSS antenna.
Figure 25: ESD protection for passive GNSS antenna
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6 Electrical, Reliability and Radio Characteristics

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6 Electrical, Reliability and Radio Characteristics

6.1 Absolute Maximum Ratings

The absolute maximum ratings stated in Table 16 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PLS8-X/PLS8-V.
Table 16: Absolute maximum ratings
Parameter Min Max Unit
Supply voltage BATT+ -0.5 +6.0 V Voltage at all digital lines in Power Down mode -0.5 +0.5 V Voltage at digital lines in normal operation -0.5 +2.3 V Voltage at SIM/USIM interface, CCVCC 1.8V in normal operation -0.5 +2.3 V Voltage at SIM/USIM interface, CCVCC 3.0V in normal operation -0.5 +3.4 V VDDLP input voltage -0.3 +3.5 V Voltage at ADC lines if the module is powered by BATT+ -0.5 +3.5 V Voltage at ADC lines if the module is not powered -0.5 +0.5 V VEXT maximum current shorted to GND -300 mA VUSB_IN, USB_DN, USB_DP -0.3 5.75 V Voltage at PWR_IND line -0.5 5.5 V PWR_IND input current if PWR_IND= low 2 mA Voltage at following signals:
IGT, EMERG_OFF GNSS antenna supply VGNSS 300 mA
-0.5 2.5 V
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Module PCB
Thermal conducting
gap filler
Heat
source
Module Shielding
Component LGA mounting
Air gap
Reference point PCB temperature
Application
PCB
Heat dissipation
Reference point ambient temperature
LGA mounting
Heat sink
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6.2 Operating Temperatures

81
6.2 Operating Te mperatures
Table 17: Board temperature
Parameter Min Typ Max Unit
Operating temperature range
Normal temperature range
Extreme temperature range Extended temperature range Automatic shutdown
3
Temperature measured on PLS8-X/PLS8-V board
1.
Operating temperature range according to 3GPP type approval specification.
2.
Extended operation allows normal mode data transmissions for limited time until automatic thermal shut­down takes effect. Within the extended temperature range (outside the operating temperature range) there should not be any unrecoverable malfunctioning. General performance parameters like Pout or RX sensitivity however may be reduced in their values. The module’s life time may also be affected, if deviating from a general temperature allocation model (for details see Section 6.2.1).
3.
Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of ± 2°C at the overtemperature and undertemperature limit.
1
+15
-30
2
-40 +95 °C
+25 +55
+85
°C °C
<-40 --- >+95 °C
See also Section 3.3.5 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages.
Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. Note also the differences and dependencies that usually exist between board (PCB) temperature and ambient temperature as shown in the following Figure 26. The possible ambient temperature range depends on the mechanical application design including the module and the PCB with its size and layout. A thermal solution will have to take t hese dif­ferences into account and should therefore be an integral part of application design.
Figure 26: Board and ambient temperature differences
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6.3 Storage Conditions

81

6.2.1 Temperature Allocation Model

The temperature allocation model shown in Table 18 assumes shares of a module’s average lifetime of 10 years (given in %) during which the module is operated at certain temperatures.
Table 18: Temperature allocation model
Module lifetime share (in %)
1
11553353 11
Module Temperature (in °C) -40 -30 -10 20 40 70 85 95
1.
Based on an assumed average module lifetime of 10 years (=100%).
Any deviations from the above temperature allocation model may reduce the module’s life span, for example if the module is operated close to the maximum automatic shutdown tem­perature not only for 1% but for 20% of its product life.
6.3 Storage Conditions
The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. The modules will be delivered in a packaging that meets the requirements according "IPD/JEDEC J-STD-033B.1" for Low Temperature Carriers.
Table 19: Storage conditions
Type Condition Unit Reference
Humidity relative: Low
High
Air pressure: Low
High Movement of surrounding air 1.0 m/s I EC TR 60 27 1 -3 -1 : 1K4 Water: rain, dripping, icing
and frosting Radiation: Solar
Heat Chemically active substances Not recom-
Mechanically active sub­stances
Vibration sinusoidal:
Displacement Acceleration Frequency range
10
% CbIPC/JEDEC J-STD-033A
90 at 40°C 70
106
kPa IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
Not allowed --- ---
1120 600
W/m
2
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
IEC TR 60271-3-1: 1C1L
mended Not recom-
IEC TR 60271-3-1: 1S1
mended
IEC TR 60271-3-1: 1M2
1.5 5 2-9 9-200
mm m/s Hz
2
Shocks:
Shock spectrum Duration Acceleration
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Semi-sinusoidal 1 50
ms m/s
IEC 60068-2-27 Ea
2
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6.4 Reliability Characteristics

81
6.4 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 20: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10- 20Hz; acceleration: 5g
Frequency range: 20-500Hz; acceleration: 20g Duration: 20hper axis; 3 axes
DIN IEC 60068-2-6
1
Shock half-sinus Acceleration: 500g
DIN IEC 60068-2-27 Shock duration: 1ms 1 shock per axis 6 positions (± x, y and z)
Dry heat Temperature: +70 ±2×C
Test duration: 16h
EN 60068-2-2 Bb
ETS 300 019-2-7 Humidity in the test chamber: < 50%
Temperature change (shock)
Low temperature: -40×C ±2×C High temperature: +85×C ±2×C Changeover time: < 30s (dual chamber system)
DIN IEC 60068-2-14 Na
ETS 300 019-2-7 Test duration: 1h Number of repetitions: 100
Damp heat cyclic High temperature: +55×C ±2×C
DIN IEC 60068-2-30 Db Low temperature: +25×C ±2×C Humidity: 93% ±3%
ETS 300 019-2-5 Number of repetitions: 6 Test duration: 12h + 12h
Cold (constant exposure)
1.
For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was inc­reased to 20g.
Temperature: -40 ±2×C Test duration: 16h
DIN IEC 60068-2-1
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6.4 Reliability Characteristics
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6.4.1 Bending Tests

From experience with other modules an elongation of up to 200µm/m is acceptable for PLS8-X/ PLS8-V modules as a result of bending strains.
Tests (based on EN 60068-2-21) showed that if applying a force of 10N at the middle of the module, i.e., the evaluation module with the actual PLS8-X/PLS8-V module soldered onto the evaluation PCB as shown in Figure 27, the possible elongation is clearly below the value of 200µm/m. Therefore, a force of 10N is recommended as maximum force.
Please note that these values only apply for a one-off short stress. The module will have to be mounted free of any strains and without being exposed to dynamic pressures.
Figure 27: Bending test setup
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6.5 Pad Assignment and Signal Description

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6.5 Pad Assignment and Signal Description
The SMT application interface on the PLS8-X/PLS8-V provides connecting pads to integrate the module into external applications. Table 21 lists the pads’ assignments. Figure 28 (bottom view) and Figure 29 (top view) show the connecting pads’ numbering plan.
Please note that pads marked "rfu" (reserved for future use) and further qualified as "dnu" (do not use) may be soldered but should not be connected to an external application. Pads marked "rfu" and qualified as "GND" (ground) are assigned to ground with PLS8-X/PLS8-V modules, but may have different assignments with future Gemalto M2M products using the same pad lay­out.
Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation.
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Table 21: Overview: Pad assignments
Pad
Signal Name Pad
No.
A4 nc E2 GND L2 GND A5 A6 A7 A8 A9 A10 A11 A12 A13 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 C2 C3 C4 C5 C6 C7 C8 GND H4 GND M15 VDDLP C9 GND H13 rfu (dnu) N3 BATT+_RF C10 GND H14 GPIO4 N4 BATT+_RF C11 GND H15 GPIO5 N5 VUSB_IN C12 rfu (dnu) H16 GPIO6 N6 rfu (dnu) C13 rfu (dnu) J1 GND N7 rfu (dnu) C14 rfu (dnu) J2 GND N8 CTS0 C15 rfu (dnu) J3 GND N9 DCD0 D1 GND J4 GND N10 RTS0 D2 GND J13 GND N11 GND D3 GND J14 GPIO1 N12 rfu (dnu) D4 GND J15 GPIO2 N13 BATT+ D5 ANT_GNSS_DC J16 GPIO3 N14 EMERG_OFF D6 GND K1 ANT_MAIN P4 USB_DP D7 GND K2 GND P5 USB_DN D8 GND K3 GND P6 I2S_MCLKOUT D9 GND K4 GND P7 rfu (dnu) D10 GND K5 GND P8 DTR0 D11 GND K12 rfu (dnu) P9 DSR0 D12 CCIN2 K13 rfu (dnu) P10 RING0 D13 rfu (dnu) K14 CCIO1 P11 RXD0 D14 CCCLK2 K15 CCVCC1 P12 TXD0 D15 rfu (dnu) K16 VGNSS P13 BATT+ D16 rfu (dnu) L1 GND E1 ANT_GNSS
GND E3 GND L3 GND GND E4 GND L4 GND rfu (dnu) E5 GND L5 rfu (dnu) GND E12 CCIO2 L6 CCVCC2 GND E13 CCRST2 L7 rfu (dnu) GND E14 rfu (dnu) L8 rfu (dnu) GND E15 rfu (dnu) L9 rfu (dnu) ANT_DRX_MIMO E16 rfu (dnu) L10 rfu (dnu) GND F1 GND L11 rfu (dnu) nc F2 GND L12 rfu (dnu) GND F3 GND L13 rfu (dnu) GND F4 GND L14 CCRST1 GND F13 rfu (dnu) L15 CCCLK1 GND F14 rfu (dnu) L16 IGT GND F15 rfu (dnu) M2 GND GND F16 GPIO10 M3 GND GND G1 GND M4 PWR_IND GND G2 GND M5 VEXT GND G3 GND M6 GND GND G4 rfu (dnu) M7 PCM_I2S_IN STATUS G13 rfu (dnu) M8 PCM_I2S_CLK GND G14 GPIO7 M9 PCM_I2S_FSC GND G15 GPIO8 M10 PCM_I2S_OUT GND G16 GPIO9 M11 ADC3_IN GND H1 GND M12 ADC2_IN GND H2 GND M13 ADC1_IN GND H3 GND M14 CCIN1
1.
nc = not connected; rfu = reserved for future use; dnu = do not use
1
Signal Name Pad
No.
Signal Name
No.
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12 3 4 5 6 7 8910111213141516
P
USB_DP USB_DNI2S_
MCLK-
OUT
rfu
(dnu)
DTR0 DSR0 RING0 RXD0 TXD0 BATT+
N
BATT+_RFBATT+_RFVUSB_
IN
rfu
(dnu)
rfu
(dnu)
CTS0 DCD0 RTS0 GND rfu
(dnu)
BATT+ EMERG_
OFF
M
GND GND PWR_IND VEXT GND PCM_
I2S_
IN
PCM_
I2S_
CLK
PCM_
I2S_ FSC
PCM_
I2S_
OUT
ADC3_INADC2_INADC1_INCCIN1 VDDLP
L
GND GND GND GND rfu
(dnu)
CCVCC2 rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu (dnu) CCRST1 CCCLK1 IGT
K
ANT_ MAIN
GND GND GND GND rfu
(dnu)
rfu (dnu) CCIO1 CCVCC1 VGNSS
J
GND GND GND GND GND GPIO1 GPIO2 GPIO3
H
GND GND GND GND rfu
(dnu)
GPIO4 GPIO5 GPIO6
G
GND GND GND rfu
(dnu)
rfu
(dnu)
GPIO7 GPIO8 GPIO9
F
GND GND GND GND rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
GPIO10
E
ANT_ GNSS
GND GND GND GND CCIO2 CCRST2 rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
D
GND GND GND GND ANT_
GNSS_
DC
GND GND GND GND GND GND CCIN2 rfu
(dnu)
CCCLK2 rfu
(dnu)
rfu
(dnu)
C
GND GND GND GND GND GND GND GND GND GND rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
B
nc GND GND GND GND GND GND GND GND GND GND STATUS
A
nc GND GND rfu
(dnu)
GND GND GND GND ANT_
DRX_ MIMO
GND
Position marker
For internal use: Not to be soldered
rfu: Reserved for future use (should not be connected to external application) nc: Internally not connected (may be arbi­trarily connected to external application) (dnu): Do not use
6.5 Pad Assignment and Signal Description
81
Page 65 of 105
Figure 28: PLS8-X/PLS8-V bottom view: Pad assignments
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16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
P
BATT+ TXD0 RXD0 RING0 DSR0 DTR0 rfu
(dnu)
I2S_
MCLK-
OUT
USB_DNUSB_DP
N
EMERG_
OFF
BATT+ rfu
(dnu)
GND RTS0 DCD0 CTS0 rfu
(dnu)
rfu
(dnu)
VUSB_INBATT+_RFBATT+_
RF
M
VDDLP CCIN1 ADC1_INADC2_INADC3_INPCM_
I2S_ OUT
PCM_
I2S_ FSC
PCM_
I2S_
CLK
PCM_
I2S_
IN
GND VEXT PWR_IND GND GND
L
IGT CCCLK1 CCRST1 rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
CCVCC2 rfu
(dnu)
GND GND GND GND
K
VGNSS CCVCC1 CCIO1 rfu
(dnu)
rfu
(dnu)
GND GND GND GND ANT_
MAIN
J
GPIO3 GPIO2 GPIO1 GND GND GND GND GND
H
GPIO6 GPIO5 GPIO4 rfu
(dnu)
GND GND GND GND
G
GPIO9 GPIO8 GPIO7 rfu
(dnu)
rfu
(dnu)
GND GND GND
F
GPIO10 rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
GND GND GND GND
E
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
CCRST2 CCIO2 GND GND GND GND ANT_
GNSS
D
rfu
(dnu)
rfu
(dnu)
CCCLK2 rfu
(dnu)
CCIN2 GND GND GND GND GND GND ANT_
GNSS_
DC
GND GND GND GND
C
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
GND GND GND GND GND GND GND GND GND GND
B
STATUS GND GND GND GND GND GND GND GND GND GND nc
A
GND ANT_
DRX_ MIMO
GND GND GND GND rfu
(dnu)
GND GND nc
For internal
Position marker
use: Not to
be soldered
rfu: Reserved for future use (should not be connected to external application) nc: Internally not connected (may be arbi­trarily connected to external application) (dnu): Do not use
6.5 Pad Assignment and Signal Description
81
Page 66 of 105
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6.5 Pad Assignment and Signal Description
81
Please note that the reference voltages listed in Table 22 are the values measured directly on the PLS8-X/PLS8-V module. They do not apply to the accessories connected.
Table 22: Signal description
Function Signal name IO Signal form and level Comment
Power sup­ply
Power sup­ply
External supply volt­age
BATT+_RF I V
max = 4.2V
I
V
norm = 3.8V
I
V
min = 3.3V during Tx burst on board
I
Imax
2A, during Tx burst (GSM)
Lines of BATT+ and GND must be connected in paral­lel for supply purposes because higher peak cur­rents may occur.
Minimum voltage must not fall below 3.3V including drop, ripple, spikes.
For proper module power up the voltage at BATT+ must be greater than at VDDLP.
BATT+ I V
n Tx = n x 577µs peak current every
4.615ms max = 4.2V
I
V
norm = 3.8V
I
V
min = 3.3V during Tx burst on board
I
Imax = 350mA
GND Ground Application Ground
VEXT O CLmax = 1µF
VEXT may be used for appli­cation circuits.
= 1.80V +1% -5%
V
O
I
max = -50mA
O
If unused keep line open. The external digital logic
must not cause any spikes or glitches on voltage VEXT.
Do not exeed IOmax
Supply volt-
VGNSS O CLmax = 2.2µ age for active GNSS antenna (Output)
Supply volt-
ANT_GNSS_DCIV age for active GNSS antenna (Input)
Ignition IGT I R
Emer­gency off
EMERG_
OFF
IR
V
= 3.05V ±1%
O
@I
= -20mA
O
I
max = -50mA
O
max = 6V
I
The input curren has to be limited at 50mA (antenna short circuit protec­tion)
200k
PU
VOHmax=1.8V VIHmax =2.1V V
min = 1.17V
IH
VILmax = 300mV Low impulse width > 100ms
40k
PU
V
max=1.8V
OH
VIHmax =2.1V V
min = 1.17V
IH
VILmax = 300mV ~~|___|~~ low impulse width > 40ms
Available if GNSS antenna DC power is enabled (con­figurable by AT command; see Section 6.8).
If unused connect to GND.
This signal switches the module ON.
It is recommended to drive this line low by an open drain or open collector driver con­nected to GND.
It is recommended to drive this line low by an open drain or open collector driver con­nected to GND.
If unused keep line open.
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81
Table 22: Signal description
Function Signal name IO Signal form and level Comment
Page 68 of 105
RTC backup
Connectiv­ity status
SIM card detection (2x)
3V SIM card inter­face
VDDLP O V
IV
STATUS O V
CCIN1 I R
CCIN2 I V
CCRST1
OV
CCRST2
CCIO1
I/O R
CCIO2
max = 3.20V while BATT+ =>3.3V
O
R
= 1.8k
I
= 1.5V…3.25V at I
I
= 10µA while
max
BATT+ = 0V
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
24.2k
PU
VOHmax=1.9V V
min = 1.15V
IH
V
max= 1.9V
IH
V
max = 0.4V
IL
min = 1.15V
IH
V
max= 2.1V
IH
V
max = 0.63V
IL
I
= 27.5µA...97.5µA
IHPD
max = 0.45V at I = 2mA
OL
V
min = 2.57V at I = -2mA
OH
V
max = 3.08V
OH
4.8...9.5k
PU
VILmax = 0.76V V
min = -0.3V
IL
V
min = 1.98V
IH
V
max = 3.35V
IH
If unused keep line open.
Status signalling e.g. with ext. LED circuit
CCINx = Low, SIM card inserted.
If unused connect to GND. CCIN2: External pull-up
required - for details please refer to Section 3.8.
Maximum cable length or copper track should be not longer than 100mm to SIM card holder.
CCIO2: External 10k
pull-
up required - for details please refer to Section 3.8.
CCCLK1
CCCLK2
CCVCC1
CCVCC2
V
OL
V
OH
V
OH
OV
OL
V
OH
V
OH
OV
O
V
O
V
O
I
max = -50mA
O
max = 0.45V at I = 2mA
min = 2.57V at I = -0.05mA max = 3.08V
max = 0.45V at I = 2mA
min = 2.57V at I = -2mA max = 3.08V
min = 3.0V typ =3.05V max = 3.08V
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81
Table 22: Signal description
Function Signal name IO Signal form and level Comment
Page 69 of 105
1.8V SIM card inter­face
Serial Modem Interface ASC0
CCRST1
OV
CCRST2
CCIO1
I/O R
CCIO2
CCCLK1
OV
CCCLK2
CCVCC1
OV
CCVCC2
RXD0 O V
CTS0 O
DSR0 O
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
4.8...9.5k
I
VILmax = 0.62V V
min = -0.3V
IL
V
min = 1.20V
IH
V
max = 2.1V
IH
V
max = 0.45V at I = 2mA
OL
V
min = 1.32V at I = -0.05mA
OH
V
max = 1.82V
OH
max = 0.45V at I = 2mA
OL
V
min = 1.32V at I = -2mA
OH
V
max = 1.82V
OH
min = 1.75V
O
V
typ = 1.80V
O
V
max = 1.82V
O
I
max = -50mA
O
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
Maximum cable length or copper track should be not longer than 100mm to SIM card holder.
CCIO2: External 10k
pull-
up required - for details please refer to Section 3.8.
If unused keep line open.
Power indi­cator
DCD0 O
RING0 O
TXD0 I V
RTS0 I
DTR0 I
PWR_IND O V
max = 0.6V at 30µA
IL
V
min = 1.20V at -30µA
IH
V
max = 2V
IH
max = 5.5V
IH
V
max = 0.4V at Imax = 1mA
OL
PWR_IND (Power Indicator) notifies the module’s on/off state.
PWR_IND is an open collec­tor that needs to be con­nected to an external pull-up resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Power Down mode.
Therefore, signal may be used to enable external vol­tage regulators that supply an external logic for commu­nication with the module, e.g. level converters.
Host wakeup
RING0 O V
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
If unused keep line open.
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81
Table 22: Signal description
Function Signal name IO Signal form and level Comment
Page 70 of 105
USB VUSB_IN I V
USB_DN I/O All electrical characteristics according
USB_DP I/O
Digital audio inter­face (PCM or
2
I
S)
PCM_I2S_IN I V
PCM_I2S_
I/O
CLK
PCM_I2S_
I/O
FSC
PCM_I2S_
O
OUT
min = 3.0V
IN
V
max = 5.25V
IN
I
typ = 150µA
I
I
max = 200µA
I
Cin=1µF In case of Vripple >
10mVpp (with f>300kHz), and VBUS_IN driven in the voltage range 4.08V...4.11V, use of an RC filter 1k
/100nF is required.
to USB Implementers’ Forum, USB
2.0 High Speed Specification.
max = 0.6V at 30µA
IL
V
min = 1.20V at -30µA
IH
V
max = 2V
IH
V
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
If the USB interface is not used please connect this line to GND.
Since VUSB_IN is used for detection only it is recom­mended not to add any fur­ther blocking capacitors on the VUSB_IN line.
Keep lines open if VUSB_IN connects to GND.
USB High Speed mode operation requires a differ­ential impedance of 90
PCM Master/Slave mode.
2
I
S Master mode.

If unused keep lines open. Available for local tones only
- see Section 3.9.
GPIO interface
Dead reckoning synchroni­zation
700MHz antenna control switch
I2S_ MCLKOUT
GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10
GPIO1 (DR_SYNC)
GPIO2 (ANT_SWIT CH)
OV
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
F=2048KHz (at 8KHz sample rate) F=4096KHz (at 16KHz sample rate)
I/O V
OV
OV
max = 0.6V at 30µA
IL
V
min = 1.20V at -30µA
IH
V
max = 2V
IH
V
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
Master clock option for audio codecs without PLL.
If unused keep line open.
If unused keep lines open. Following functions can be
configured for GPIOs using AT commands: GPIO1 --> Dead reckoning synchronization GPIO2 --> 700MHz antenna control switch Any GPIO --> Low current indication. By default GPIO6 is configured as LCI line. Any GPIO --> Remote host wakeup line
1 pulse per second dead reckoning synchronization signal for usage in external dead reckoning applications (see Chapter 4).
Line can be configured as a control signal for a possible external 700MHz antenna switch (see Section 3.13.6).
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81
Table 22: Signal description
Function Signal name IO Signal form and level Comment
Page 71 of 105
Low Current Indication
Remote host wakeup
ADC interface
GPIOx O V
IV
GPIOx O V
ADC1_IN,
I Full specification compliance range ADC2_IN, ADC3_IN
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
max = 2V
IH
R
= appr. 100k
PD
max = 0.45V at I = 2mA
OL
V
min = 1.35V at I = -2mA
OH
V
max = 1.85V
OH
>=0.3V
V
Imin
V
<=3.075V
Imax
Degraded accuracy range V
0.05V ... 0.3V
Imin
Ridc>1M
Resolution: 12 Bit Offset error: <+-10mV Gain error: <1% analog bandwidth: <16kHz conversation time: 853µs
If the feature is enabled (see
Section 3.13.4).
If the feature is disabled (see Section 3.13.4).
If feature is enabled (see
Section 3.13.3).
If unused keep line open.
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6.6 Power Supply Ratings

81
6.6 Power Supply Ratings
Table 23 and Table 24 assemble various voltage supply and curren t consumption ratings of the
module.
Table 23: Voltage supply ratings
Description Conditions Min Typ Max Unit
BATT+ Supply voltage Directly measured at Module.
Voltage must stay within the min/max values,
including voltage drop, ripple, spikes
Maximum allowed voltage drop dur-
Normal condition, power control level for
Pout max
ing transmit burst Voltage ripple Normal condition, power control level for
Pout max
@ f <= 250 kHz
@ f > 250 kHz
3.3 3.8 4.2 V
400 mV
120 90mV
mV
pp pp
Table 24: Current consumption ratings
Description Conditions Typical rating Unit
I
VDDLP
@ 3V I
BATT+
OFF State supply current
2
OFF State supply
Power down 4 µA
Power Down 40 µA
current Average GSM /
GPRS supply cur­rent (GNSS off)
SLEEP
(no communication via
UART)
SLEEP
(no communication via
UART)
SLEEP
(no communication via
UART)
IDLE @ DRX=2 UART
active, but no communica-
tion
Voice call GSM850/900;
PCL=5
GPRS Data transfer
GSM850/900; PCL=5; 1Tx/
4Rx
GPRS Data transfer
GSM850/900; PCL=5; 2Tx/
3Rx
GPRS Data transfer
GSM850/900; PCL=5; 4Tx/
1Rx
1
3
@ DRX=9
3
@ DRX=5
3
@ DRX=2
USB disconnected
USB disconnected
USB disconnected
USB disconnected USB active
@50
ROPR=8
2.0 mA
2.5 mA
3.7 mA
40 mA 50 mA
330 mA
320 mA
(max. reduction) ROPR=4
(no reduction) ROPR=8
430 mA
(max. reduction) ROPR=4
540
(no reduction) ROPR=8
600 mA
(max. reduction) ROPR=4
930
(no reduction) @ total mismatch 990
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81
Page 73 of 105
Table 24: Current consumption ratings
Description Conditions Typical rating Unit
I
BATT+
2
Average GSM / GPRS supply cur­rent
EDGE Data transfer
GSM850/900; PCL=5; 1Tx/
4Rx
(GNSS off)
EDGE Data transfer
GSM850/900; PCL=5; 2Tx/
3Rx
EDGE Data transfer
GSM850/900; PCL=5; 4Tx/
1Rx
Voice call GSM1800/1900;
PCL=0
GPRS Data transfer
GSM1800/1900; PCL=0;
1Tx/4Rx
GPRS Data transfer
GSM1800/1900; PCL=0;
2Tx/3Rx
GPRS Data transfer
GSM1800/1900; PCL=0;
4Tx/1Rx
EDGE Data transfer
GSM1800/1900; PCL=0;
1Tx/4Rx
EDGE Data transfer
GSM1800/1900; PCL=0;
2Tx/3Rx
EDGE Data transfer
GSM1800/1900; PCL=0;
4Tx/1Rx
Peak current dur­ing GSM transmit
Voice call GSM850/900;
PCL=5
burst
Voice call GSM1800/1900;
PCL=0
2
I
BATT+
Average GSM / GNSS supply cur­rent (GNSS on)
GSM active (UART/USB active); @DRX=2 &
GNSS NMEA output off
GSM active (UART/USB active); @DRX=2 &
GNSS NMEA output on
1
ROPR=8
220 mA
(max. reduction) ROPR=4
(no reduction) ROPR=8
300 mA
(max. reduction) ROPR=4
340
(no reduction) ROPR=8
490 mA
(max. reduction) ROPR=4
570
(no reduction) @50
240 mA
ROPR=8
230 mA
(max. reduction) ROPR=4
(no reduction) ROPR=8
300 mA
(max. reduction) ROPR=4
360
(no reduction) ROPR=8
410 mA
(max. reduction) ROPR=4
590
(no reduction) ROPR=8
190 mA
(max. reduction) ROPR=4
(no reduction) ROPR=8
250 mA
(max. reduction) ROPR=4
290
(no reduction) ROPR=8
380 mA
(max. reduction) ROPR=4
460
(no reduction)
2.1 A
@50 @total mismatch 2.4
1.3 A
@50 @total mismatch 1.6
65 mA
4
85 mA
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Page 74 of 105
Table 24: Current consumption ratings
Description Conditions Typical rating Unit
I
BATT+
2
Average UMTS supply current (GNSS off)
SLEEP
SLEEP
SLEEP
Voice calls and Data transfers
IDLE @ DRX=6
measured @maximum Pout
Voice call Band II
Voice call Band IV Voice call Band V
UMTS Data transfer Band II 580 mA
UMTS Data transfer Band IV 520 mA
UMTS Data transfer Band V 490 mA
HSPA Data transfer Band II 590 mA
HSPA Data transfer Band IV 540 mA
HSPA Data transfer Band V 510 mA
Average UMTS / GNSS supply cur­rent (GNSS on)
WCDMA active (UART / USB active); @DRX=6
& GNSS NMEA output off
WCDMA active (UART / USB active); @DRX=6
& GNSS NMEA output on
Average LTE sup­ply current
5
(GNSS off) Data transfers
measured @maximum Pout
SLEEP
sions" = 256
SLEEP
sions" = 128
SLEEP
sions" = 64
SLEEP
sions" = 32
IDLE
LTE Data transfer Band 2
LTE Data transfer Band 4 540 mA
LTE Data transfer Band 5 550 mA
LTE Data transfer Band 13 570 mA
LTE Data transfer Band 17 550 mA
1
3
@ DRX=9
3
@ DRX=8
3
@ DRX=6
3
@ "Paging Occa-
3
@ "Paging Occa-
3
@ "Paging Occa-
3
@ "Paging Occa-
USB disconnected USB disconnected USB disconnected USB disconnected USB active
@50
580 mA
@total mismatch 700
4
USB disconnected
USB disconnected
USB disconnected
USB disconnected
USB disconnected USB active
@ 50
@ total mismatch
1.8 mA
2.1 mA
3.3 mA 30 mA 40 mA
490 mA 470 mA
65 mA
85 mA
2.3 mA
2.7 mA
3.5 mA
5.4 mA
35 mA 45 mA
620 mA 740 mA
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Page 75 of 105
Table 24: Current consumption ratings
1
Description Conditions Typical rating Unit
2
I
BATT+
Average LTE / GNSS supply cur­rent (GNSS on)
I
VUSB_IN
USB typical and maximum ratings are mentioned in Table 22: VUSB_IN.
1.
Please note that the listed frequency bands apply as follows: PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; UMTS/HSPA+ Bd II. IV and V; GSM 850/900/1800/1900MHz PLS8-V: LTE: Bd 2, 4 and 13
2.
With an impedance of Z Down ratings that were measured at 3.4V.
3.
Measurements start 6 minutes after switching ON the module, Averaging times: SLEEP mode - 3 minutes, transfer modes - 1.5 minutes Communication tester settings:no neighbour cells, no cell reselection etc, RMC (Reference Measurement Channel)
4.
One fix per second.
5.
Communication tester settings:
- Channel Bandwidth: 5MHz
- Number of Resource Blocks: 25 (DL), 1 (UL)
- Modulation: QPSK
LTE active (UART / USB active); @DRX=6 & GNSS NMEA output off
LTE active (UART / USB active); @DRX=6 & GNSS NMEA output on
=50 at the antenna pads. Measured at 25°C and 4.2V - except for Power
LOAD
4
65 mA
85 mA
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81
6.7 RF Antenna Interface Characteristics
Page 76 of 105
Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)
2
Parameter Conditions Min. Typical Max. Unit
LTE connectivity Receiver Input Sensitivity @
ARP (ch. bandwidth 5MHz)
3
Band 2, 4, 5, 13 and 17 LTE 700 Band 17 -97 -102 dBm LTE 700 Band 13 TBD. TBD. dBm LTE 850 Band 5 -98 -104 dBm LTE AWS Band 4 -100 -103 dBm LTE 1900 Band 2 -98 -103 dBm
RF Power @ ARP
Load
with 50
LTE 700 Band 17 +21 +23 +25 dBm LTE 700 Band 13 +21 +23 +25 dBm LTE 850 Band 5 +21 +23 +25 dBm LTE AWS Band 4 +21 +23 + 25 dBm
LTE 1900 Band 2 +21 +23 +25 dBm UMTS/HSPA connectivity Receiver Input Sensitivity @
3
Band II, IV, V
UMTS 850 Band V -104.7 -110 dBm ARP
UMTS AWS Band IV -106.7 -110 dBm
UMTS 1900 Band II -104.7 -109 dBm RF Power @ ARP
Load
with 50
UMTS 850 Band V +21 +24 +25 dBm
UMTS AWS Band IV +21 +24 +25 dBm
UMTS 1900 Band II +21 +24 +25 dBm Tx noise @ ARP with max.
GNSS band -170 dBm/Hz RF power for UMTS: Band 1 channel 9777 Band 2 channel 9477
GPRS coding schemes Class 12, CS1 to CS4 EGPRS Class 12, MCS1 to MCS9 GSM Class Small MS Static Receiver input Sensi-
tivity @ ARP
RF Power @ ARP with 50
Load
GSM
GSM 850 / E-GSM 900 -102 -111 dBm
GSM 1800 / GSM 1900 -102 -110 dBm
GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
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Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)
2
Parameter Conditions Min. Typical Max. Unit
RF Power @ ARP with 50
Load (ROPR=4, i.e., no reduction)
GPRS, 1 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 1 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 2 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 2 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 3 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 3 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 4 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
RF Power @ ARP with 50
Load (ROPR=5)
EDGE, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 1 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 1 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 2 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 2 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 3 TX GSM 850 / E-GSM 900 32.2 dBm
GSM 1800 / GSM 1900 29.2 dBm
EDGE, 3 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 4 TX GSM 850 / E-GSM 900 31 dBm
GSM 1800 / GSM 1900 28 dBm
EDGE, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
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Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)
2
Parameter Conditions Min. Typical Max. Unit
RF Power @ ARP with 50
Load (ROPR=6)
GPRS, 1 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 1 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 2 TX GSM 850 / E-GSM 900 31 dBm
GSM 1800 / GSM 1900 28 dBm
EDGE, 2 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 3 TX GSM 850 / E-GSM 900 30.2 dBm
GSM 1800 / GSM 1900 27.2 dBm
EDGE, 3 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 4 TX GSM 850 / E-GSM 900 29 dBm
GSM 1800 / GSM 1900 26 dBm
RF Power @ ARP with 50
Load (ROPR=7)
EDGE, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 1 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 1 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 2 TX GSM 850 / E-GSM 900 30 dBm
GSM 1800 / GSM 1900 27 dBm
EDGE, 2 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 3 TX GSM 850 / E-GSM 900 28.2 dBm
GSM 1800 / GSM 1900 25.2 dBm
EDGE, 3 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 24 dBm
EDGE, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
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Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range
1)2
Parameter Conditions Min. Typical Max. Unit
RF Power @ ARP with 50
Load (ROPR=8, i.e., max. reduction)
GPRS, 1 TX GSM 850 / E-GSM 900 33 dBm
GSM 1800 / GSM 1900 30 dBm
EDGE, 1 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 26 dBm
GPRS, 2 TX GSM 850 / E-GSM 900 30 dBm
GSM 1800 / GSM 1900 27 dBm
EDGE, 2 TX GSM 850 / E-GSM 900 24 dBm
GSM 1800 / GSM 1900 23 dBm
GPRS, 3 TX GSM 850 / E-GSM 900 28.2 dBm
GSM 1800 / GSM 1900 25.2 dBm
EDGE, 3 TX GSM 850 / E-GSM 900 22.2 dBm
GSM 1800 / GSM 1900 21.2 dBm
GPRS, 4 TX GSM 850 / E-GSM 900 27 dBm
GSM 1800 / GSM 1900 24 dBm
EDGE, 4 TX GSM 850 / E-GSM 900 21 dBm
GSM 1800 / GSM 1900 20 dBm
1.
At extended temperature range no active power reduction is implemented - any deviations are hardware related.
2.
Please note that the listed frequency bands apply as follows: PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; UMTS/HSPA+ Bd II. IV and V; GSM 850/900/1800/1900MHz PLS8-V: LTE: Bd 2, 4 and 13
3.
Applies also to UMTS/LTE Rx diversity/MIMO antenna.
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GNSS supply voltage level
GN SS s u p ply v o lta g e lev e l
GNSS supply voltage level
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6.8 GNSS Interface Characteristics

81
6.8 GNSS Interface Characteristics
The following tables list general characteristics of the GNSS interface.
Table 26: GNSS properties
Parameter Conditions Min. Typical Max. Unit
Frequency
GPS GLONASS 1597.551
Tracking Sensitivity Open sky
Active antenna or LNA Passive antenna
Acquisition Sensitivity Open sky
Active antenna or LNA Passive antenna
Cold Start sensitivity
Time-to-First-Fix (TTFF)
1.
Test condition: Assumes 300 seconds timeout, QoS=1000m, and 50% yield.
2.
Test condition: TTFF is defined for an open sky environment, i.e., with a clear view to the sky and a minimum signal level of -130dBm at the antenna for at least 3…4 satellites. This signal level represents C/No=42dB in an NMEA $GPGSV message.
3.
For test purposes a cold start may be triggered by AT command: AT^SBNW="agps",-1 - see also [1].
4.
To optimize GPS start-up behavior, it is recommended to backup the module’s internal real time clock via VDDLP line as described in Section 3.5.
1
2
Cold Warm
3
4
1575.42
MHz
1605.886
-159
dBm
-156
-149
dBm
-145
-145 dBm 25 32 s 10 29 s
Through the external GNSS antenna DC feeding the module is able to supply an active GNSS antenna. The supply voltage level at the GNSS antenna interface depends on the GNSS con­figuration done with AT command as shown in Table 27.
Table 27: Power supply for active GNSS antenna
Function Setting samples IO Signal form and level
GNSS active antenna supply Supply voltage with:
GNSS receiver off Active antenna off
Supply voltage with: GNSS receiver on Active antenna on SLEEP mode
Supply voltage with: GNSS receiver on Active antenna auto
O
O
O
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6.9 Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PLS8-X/PLS8-V module.
Special ESD protection provided on PLS8-X/PLS8-V: BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is shown in Section 3.8.1.
The remaining interfaces of PLS8-X/PLS8-V with the exception of the antenna interface are not accessible to the user of the final product (since they are installed within the device) and are therefore only protected according to the ANSI/ESDA/JEDEC JS-001-2011 requirements.
PLS8-X/PLS8-V has been tested according to the following standards. Electrostatic values can be gathered from the following table.
Table 28: Electrostatic values
Specification / Requirements Contact discharge Air discharge ANSI/ESDA/JEDEC JS-001-2011
All SMT interfaces ± 1kV Human Body Model n.a.
JESD22-A114-F
All SMT interfaces ± 500V Charge Device Model (CDM) n.a.
ETSI EN 301 489-1/7
BATT+ ± 4kV ± 8kV
Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Gemalto M2M reference application described in Chapter 9.
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Top view
Bottom view

7 Mechanics, Mounting and Packaging

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7 Mechanics, Mounting and Packaging

7.1 Mechanical Dimensions of PLS8-X/PLS8-V

Figure 30 shows a 3D view1 of PLS8-X/PLS8-V and provides an overview of the board's me-
chanical dimensions. For further details see Figure 31. Length: 33mm Width: 29mm Height: 2.95mm
Figure 30: PLS8-X/PLS8-V – top and bottom view
1.
The coloring of the 3D view does not reflect the module’s real color.
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Internal use; Not to be soldered
7.1 Mechanical Dimensions of PLS8-X/PLS8-V
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Figure 31: Dimensions of PLS8-X/PLS8-V (all dimensions in mm)
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7.2 Mounting PLS8-X/PLS8-V onto the Application Platform

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7.2 Mounting PLS8-X/PLS8-V onto the Application Platform
This section describes how to mount PLS8-X/PLS8-V onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechani­cal handling. For more information on issues related to SMT module integration see also [3].
Note: Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. Not only must all supply pads and signals be connected appropriately, but all pads denoted as “Do not use“ should also be soldered (but not electrically connected). Note also that in order to avoid short circuits between signal tracks on an exte rnal application's PCB and various markings at the bottom side of the module, it is recommended not to route the sig­nal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist.

7.2.1 SMT PCB Assembly

7.2.1.1 Land Pattern and Stencil

The land pattern and stencil design as shown below is based on Gemalto M2M characteriza­tions for lead-free solder paste on a four-layer test PCB and a 110 as well as a 150 micron-thick stencil.
The land pattern given in Figure 32 reflects the module‘s pad layout, including signal pads and ground pads (for pad assignment see Section 6.5). Besides these pads there are ground areas on the module's bottom side that must not be soldered, e.g., the po sition marker . To p revent short circuits, it has to be ensured that there are no wires on the external application side that may connect to these module ground areas.
Figure 32: Land pattern (top layer)
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The stencil design illustrated in Figure 33 and Figure 34 is recommended by Gemalto M2M as a result of extensive tests with Gemalto M2M Daisy Chain modules.
Figure 33: Recommended design for 110 micron thick stencil (top layer)
Figure 34: Recommended design for 150 micron thick stencil (top layer)
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7.2.1.2 Board Level Characterization

Board level characterization issues should also be taken into account if devising an SMT pro­cess.
Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [3].
It is recommended to characterize land patterns before an actual PCB production, taking indi­vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 7.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol­der voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to [3]. Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in Section
7.2.3.

7.2.2 Moisture Sensitivity Level

PLS8-X/PLS8-V comprises components that are susceptible to damage induced by absorbed moisture.
Gemalto M2M’s PLS8-X/PLS8-V module complies with the latest revision of the IPC/JEDEC J­STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional moisture sensitivity level (MSL) related information see Section 7.2.4 and Sec-
tion 7.3.2.
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7.2.3 Soldering Conditions and Temperature

7.2.3.1 Reflow Profile

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Figure 35: Reflow Profile
Table 29: Reflow temperature ratings
1
Profile Feature Pb-Free Assembly
Preheat & Soak Temperature Minimum (T Temperature Maximum (T Time (t
Smin
to t
Smax
) (tS) Average ramp up rate (T Liquidous temperature (T
Time at liquidous (t
)
L
Peak package body temperature (T Time (t
temperature (T
) within 5 °C of the peak package body
P
)
P
Average ramp-down rate (T
Smin
Smax
)
)
150°C 200°C 60-120 seconds
to TP) 3K/second max.
Smax
)
L
217°C 60-90 seconds
)245°C +0/-5°C
P
30 seconds max.
to T
P
)TBD.
Smax
Time 25°C to maximum temperature 8 minutes max.
1.
Please note that the reflow profile features and ratings listed above are based on the joint industry standard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more informa­tion on reflow profiles and their optimization please refer to [3].
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7.2.3.2 Maximum Temperature and Duration

The following limits are recommended for the SMT board-level soldering process to attach the module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at the module’s top side.
• A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded.
PLS8-X/PLS8-V is specified for one soldering cycle only. Once PLS8-X/PLS8-V is removed from the application, the module will very likely be destroyed and cannot be soldered onto an­other application.
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7.2.4 Durability and Mechanical Handling

7.2.4.1 Storage Life

PLS8-X/PLS8-V modules, as delivered in tape and reel carriers, must be stored in sealed, mois­ture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 months. However, such a life span requires a non-condensing atmospheric environment, ambient tem­peratures below 40°C and a relative humidity below 90%. Additional storage conditions are list­ed in Table 22.

7.2.4.2 Processing Life

PLS8-X/PLS8-V must be soldered to an application within 72 hours after opening the moistu re barrier bag (MBB) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%.

7.2.4.3 Baking

Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 40 for details):
• It is not necessary to bake PLS8-X/PLS8-V, if the conditions specified in Section 7.2.4.1 and Section 7.2.4.2 were not exceeded.
• It is necessary to bake PLS8-X/PLS8-V, if any condition specified in Section 7.2.4.1 and
Section 7.2.4.2 was exceeded.
If baking is necessary, the modules must be put into trays that can be b aked to at least 125°C. Devices should not be baked in tape and reel carriers at any temperature.

7.2.4.4 Electrostatic Discharge

Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites.
Please refer to Section 6.9 for further information on electrostatic discharge.
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7.3 Packaging

7.3.1 Tape and Reel

The single-feed tape carrier for PLS8-X/PLS8-V is illustrated in Figure 36. The figure also shows the proper part orientation. The tape width is 44mm and the PLS8-X/PLS8-V modules are placed on the tape with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 500 modules.

7.3.1.1 Orientation

Figure 36: Carrier tape
Figure 37: Roll direction
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7.3.1.2 Barcode Label

A barcode label provides detailed information on the tape and its contents. I t is attached to the reel.
Figure 38: Barcode label on tape reel
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7.3.2 Shipping Materials

PLS8-X/PLS8-V is distributed in tape and reel carriers. The tape and reel carriers used to dis­tribute PLS8-X/PLS8-V are packed as described below, including the following required ship­ping materials:
• Moisture barrier bag, including desiccant and humidity indicator card
• Transportation bag

7.3.2.1 Moisture Barrier Bag

The tape reels are stored inside a moisture barrier bag (MBB), t ogether with a humidity in dica­tor card and desiccant pouches - see Figure 39. The bag is ESD protected and delimits mois- ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the PLS8-X/PLS8-V modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application.
Figure 39: Moisture barrier bag (MBB) with imprint
The label shown in Figure 40 summarizes requirements regarding moisture sensitivity, includ­ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.
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Figure 40: Moisture Sensitivity Label
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MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture.
The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-
proximate relative humidity level within the bag. A sample humidity card is shown in Figure 41. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked.
Figure 41: Humidity Indicator Card - HIC
A baking is required if the humidity indicator inside the bag indicates 10% RH or more.

7.3.2.2 Transportation Box

Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains 2 reels with 500 modules each.
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8 Sample Application
Figure 42 shows a typical example of how to integrate an PLS8-X/PLS8-V module wit h a n a p-
plication. The PWR_IND line is an open collector that needs an external pull-up resistor which connects
to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLS8-X/PLS8-V module is active, high level n otifies the Power Down mode.
If the module is in Power Down mode avoid current flowing from any other source into the mod­ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow.
While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po­sition of components.
Some LGA pads are connected to clocks or high speed data streams that might interfere with the module’s antenna. The RF receiver would then be blocked at certain frequencies (self in­terference). The external application’s PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/ SIM interfaces.
Depending on the micro controller used by an external application PLS8-X/PLS8-V‘s digital in­put and output lines may require level conversion. Section 8.1 shows a possible sample level conversion circuit.
Disclaimer: No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 42 and the information detailed in this section. As functionality and compliance with na-
tional regulations depend to a great amount on the used electronic components and the indi­vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLS8-X/PLS8-V modules.
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PLS8x
Current
limiter
<60mA
VGNSS
VDDLP
10µF
** See Section 3.8.1 for details on enhanced ESD protection
8 Sample Application
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Figure 42: PLS8-X/PLS8-V sample application
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5V tolerarant
Low level input
Low level input
Low level input
VCC
5V tolerant
VCC
E.g., 74VHC1GT50 74LV1T34
E.g.,
74LVC2G34
NC7WZ16
External application
Micro controller
VLOGIC
(3.0V...3.6V)
Input lines,
e.g., µRXD, µCTS
Output lines,
e.g., µTXD, µRTS
VEXT (1.8V)
Digital output lines, e.g., RXDx, CTSx
Wireless module
Digital input lines, e.g., TXDx, RTSx
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8.1 Sample Level Conversion Circuit

97
8.1 Sample Level Conversion Circuit
Depending on the micro controller used by an external application PLS8-X/PLS8-V‘s digital in­put and output lines (i.e., ASC0 lines) may require level conversion. The following Figure 43 shows a sample circuit with recommended level shifters for an external application‘s micro con­troller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with V
max=1.85V or VIHmax =1.85V.
OH
Figure 43: Sample level conversion circuit
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DSB75
Standard
80 polig Flex
PC
GSM/UMTS /LTE
test equipment
GSM/UMTS/LTE
USB
cable
Power supply
Power
GND
USB
ANT3
ANT2
ANT1
Audio
Uranus
Audio
DSB75 adapter
SIM card
holder
Evaluation
module
Edge mount SMA connectors
manually soldered to antenna pads
Deta il:
S
M
A
t
o
H
i
r
o
s
e
U
.
F
L
c
a
b
l
e
UMTS/LTE Rx Diversity/
MIMO
Evaluation
module
GNSS
test equipment
COM1 (ASC0 )
Audio
test equipment
Votronic handset
I
f
u
s
i
n
g
a
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Page 98 of 105

9 Reference Approval

100
9 Reference Approval

9.1 Reference Equipment for Ty pe Approval

The Gemalto M2M reference setup submitted to type approve PLS8-X/PLS8-V is shown in Fig-
ure 44. The module (i.e., the evaluation module) is connected to t he DSB75 by means of a flex
cable and a special DSB75 adapter. The GSM/UMTS/LTE test equipment is connected via edge mount SMA connectors soldered to the module’s antenna pads.
For ESD tests and evaluation purposes, it is also possible connect the module to the GSM/ UMTS/LTE test equipment through an SMA-to-Hirose-U.FL antenna cable and the SMA ante n­na connectors of the DSB75 adapter.
A further option is to mount the evaluation module directly onto the DSB75 adapter’s 80-pin board-to-board connector and to connect the test equipment as shown below.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Figure 44: Reference equipment for type approval
Confidential / Released
Page 99
Cinterion® PLS8-X/PLS8-V Hardware Interface Description

9.2 Compliance with FCC and IC Rules and Regulations

100
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9.2 Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Gemalto M2M modules refere nce application described in Section 9.1 will be registered under the following identifiers:
•PLS8-X:
FCC Identifier 2ALQBKC220 Industry Canada Certification Number: 4228A-KC220 Granted to KONE CORPORATION
Manufacturers of mobile or fixed devices incorporating PLS8-X/PLS8-V modules are autho­rized to use the FCC Grants and Industry for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: 2ALQBKC220" and accordingly “Contains IC: 4228A-KC220“. The integration is limited to fixed or mobile categorised host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions.
Canada Certificates of the PLS8-X/PLS8-V modules
For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 30 for FCC and IC.
Table 30: Antenna gain limits for FCC and IC
Operational band
Maximum gain in lower operational bands with f< 1GHz (GSM850, WCDMA BdV, LTE Bd5 / Bd13 / Bd17
Maximum gain in higher operational bands with f=1700MHz (WCDMA BdIV, LTE Bd4)
Maximum gain in higher operational bands with f=1900MHz (GSM1900, WCDMA BdII, LTE Band 2)
1.
Please note that the listed frequency bands apply as follows: PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; WCDMA Bd II, IV and V; GSM 850/1900MHz PLS8-V: LTE: Bd 2, 4 and 13
1
FCC limit IC limit Unit
3.25 0.16 dBi
5.5 5.5 dBi
2.51 2.51 dBi
IMPORTANT: Manufacturers of portable applications incorporating PLS8-X/PLS8-V modules ar e required to have their final product certified and apply for their own FCC Grant and Industry Canada Cer­tificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 1.4 for detail).
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
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Cinterion® PLS8-X/PLS8-V Hardware Interface Description
9.2 Compliance with FCC and IC Rules and Regulations
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Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter­ference in a residential installation. This equipment generates, uses and can radiate radio fre­quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating PLS8-X/PLS8-V modules the
above note will have to be provided in the English and French language in the final user docu­mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.
PLS8-X_PLS8-V_HD_v03.016 2015-12-09
Confidential / Released
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