3.5X3.5mm SMD LED WITH CERAMIC
SUBSTRATE
PRELIMINARY SPEC
Part Number: KT-3535SY9ZS-RV Super Bright Yellow
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Absolute Maximum Ratings at TA = 25°C
Parameter Symbol Value Unit
DC Forward Current [1] IF 350 mA
Peak Forward Current [2] IFM 500 mA
Power dissipation Pt 0.98 W
Operating Temperature Top -40 To + 1 0 0 °C
Storage Temperature Ts tg -40 To + 12 0 °C
Junction temperature[1] TJ 120 °C
Thermal resistance [1] (Junction/ambient) Rth j-a 105 °C/W
Thermal resistance [1] (Junction/solder point) Rth j-s 31 °C/W
Notes:
1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend
for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at T
A = 25°C
Parameter Symbol Value Unit
Forward Voltage IF = 350mA [Min.]
Forward Voltage IF = 350mA [Typ.] 2.3
Forward Voltage IF = 350mA [Max.] 2.8
Luminous Flux IF = 350mA [Typ.] Φv 13 lm
Wavelength at peak emission IF = 350mA [Typ.]
Dominant Wavelength IF = 350mA [Typ.]
Spectral bandwidth at 50% ΦREL MAX IF = 350mA [Typ.]
Temperature coefficient of λpeak
I
F = 350mA, - 10°C ≤ T ≤ 100°C [Typ.]
Temperature coefficient of λdom
I
F = 350mA, - 10°C ≤ T ≤ 100°C [Typ.]
Temperature coefficient of VF
IF = 350mA, - 10°C ≤ T≤ 100°C [Typ.]
Notes:
1.Wavelength : + / -1nm.
2. Forward Voltage : + / - 0.1V.
1.8
VF [2]
λpeak
λ dom [1]
Δλ
598 nm
591 nm
23 nm
V
TCλpeak 0.12 nm/°C
TCλdom 0.07 nm/ °C
TCV -3.0 mV/°C
SPEC NO: DSAI6709 REV NO: V.3 DATE: JAN/04/2009 PAGE: 1 OF 12
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1212000013
Selection Guide
V
Part No.
Dice
3.5X3.5mm SMD LED WITH CERAMIC
SUBSTRATE
@ 350mA
Φv (lm) [2]
Code. Min. Max.
CB-L 5 10
iewing
Angle [1]
2θ1/2
KT-3535SY9ZS-RV Super Bright Yellow (InGaAlP)
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2. Luminous intensity / luminous flux: +/-15%.
CC-L 10 15
CD-L 15 20
CE-L 20 25
Package Dimension And Materials
For package dimension please refer to page 10
Material as follows: Package : Ceramics
Encapsulating resin : Silicone resin
Electrodes : Ag plating
Features
1.Dimensions : 3.5mm X 3.5mm X 0.8mm.
2.Higher brightness .
3.Small package with high efficiency .
4.Surface mount technology .
5.ESD protection .
6.Moisture sensitivity level : level 2a.
7.Soldering methods: IR reflow soldering.
8.RoHS compliant.
120°
Packaging:
1.The LEDs are packed in cardboard boxes after taping.
2.The label on the minimum packing unit shows: Part Number, Lot Number, Ranking, Quantity.
3.In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
4.The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions
must be taken to prevent any damage.
5.The boxes are not water resistant and therefore must be kept away from water and moisture.
6.When the LEDs are transported, we recommend that you use the same packing methods as Kingbright’s.
SPEC NO: DSAI6709 REV NO: V.3 DATE: JAN/04/2009 PAGE: 2 OF 12
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1212000013
3.5X3.5mm SMD LED WITH CERAMIC
SUBSTRATE
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Test Conditions
= 25 °C , IF = 350 mA
T
a
1 Continuous Operating Test
2 High Temperature Operating Test
3 Low Temperature Operating Test
4
High Temperature and Humidity
Storage Operating Test
5 Temperature Cycling Test
Tested with standard circuit
= 100 °C , IF = 50 mA
T
a
board
﹡
(note)
= -40 °C , IF = 350 mA
T
a
Tested with standard circuit
= 85 °C , RH = 85% , IF =
T
a
board
﹡
100 mA (note)
High temp: +100 °C 30 mins
∫
R.T: 5 mins
∫
Low temp: -40 °C 30 mins
∫
R.T: 5 mins
Test Times /
Cycles
1000 hrs 0/22
1000 hrs 0/22
1000 hrs 0/22
1000 hrs 0/22
10 cycles 0/22
Number of Damaged
High temp: +100 °C 5 mins
6
Thermal Shock Test
∫
1000 cycles 0/22
Low temp: -40 °C 5 mins
7 Soldering resistance Test T
Note: Thermal resistance of LED with Kingbright circuit board : R
= 260 °C , 10 secs 10 secs 0/22
sld
thj-a =105°C/W
Failure Criteria
Item
Symbol Test Conditions
Forward Voltage VF IF = 350mA - Initial Level x 1.1
Luminous Flux Φv IF = 350mA Initial Level x 0.7 -
Note: The test is performed after the board is cooled down to the room temperature.
Criteria for Judgement
Min. Max.
SPEC NO: DSAI6709 REV NO: V.3 DATE: JAN/04/2009 PAGE: 3 OF 12
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1212000013
JEDEC Moisture Sensitivity:
3.5X3.5mm SMD LED WITH CERAMIC
SUBSTRATE
Level
Time Conditions
2a 4 weeks
Floor Life
≤ 30 °C / 60% RH
Standard Accelerated Equivalent
Time (hours) Conditions Time (hours) Conditions
6962
+ 5 / - 0
30 °C / 60% RH
Soak Requirements
120
+ 1 / - 0
60 °C / 60% RH
Moisture Sensitivity Levels
Level
Time Conditions
1 Unlimited
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Time on Label (TOL)
Notes:
1.CAUTION - The ‘‘accelerated equivalent’’ soak requirements shall not be used until correlation of damage response, including electrical, after
soak and reflow is established with the ‘‘standard’’ soak requirements or if the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated
soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for
determining the diffusion coefficient.
2.The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
If the actual MET is less than 24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH the soak time is reduced by one hour
For each hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by one hour for each five hours the
MET is less than 24 hours.
If the actual MET is greater than 24 hours the soak time must be increased. If soak conditions are 30 °C/60% RH, the soak time is increased one
Hour for each hour that the actual MET exceeds 24 hours. If soak conditions are 60 °C/60% RH, the soak time is increased one hour for each five
Hours that the actual MET exceeds 24 hours.
3.Supplier may extend the soak times at their own risk.
Floor Life
≤ 30 °C / 85% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
≤ 30 °C / 60% RH
Standard Accelerated Equivalent1
Time (hours) Conditions Time (hours) Conditions
168
+ 5 / - 0
168
+ 5 / - 0
6962
+ 5 / - 0
1922
+ 5 / - 0
962
+ 2 / - 0
722
+ 2 / - 0
482
+ 2 / - 0
TOL 30 °C / 60% RH
85 °C / 85% RH
85 °C / 60% RH
30 °C / 60% RH
30 °C / 60% RH
30 °C / 60% RH
30 °C / 60% RH
30 °C / 60% RH
Soak Requirements
120
+ 1 / - 0
40
+ 1 / - 0
20
+ 0.5 / - 0
15
+ 0.5 / - 0
10
+ 0.5 / - 0
60 °C / 60% RH
60 °C / 60% RH
60 °C / 60% RH
60 °C / 60% RH
60 °C / 60% RH
ESD Protection During Production
Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors.
The following procedures may decrease the possibility of ESD damage:
1.Minimize friction between the product and surroundings to avoid static buildup.
2.All production machinery and test instruments must be electrically grounded.
3.Operators must wear anti-static bracelets.
4.Wear anti-static suit when entering work areas with conductive machinery.
5.Set up ESD protection areas using grounded metal plating for component handling.
6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.
7.Maintain a humidity level of 50% or higher in production areas.
8.Use anti-static packaging for transport and storage.
9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.
SPEC NO: DSAI6709 REV NO: V.3 DATE: JAN/04/2009 PAGE: 4 OF 12
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: D.M.Su ERP: 1212000013
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