Keithley Keithley Instruments 7035 Manual

I

l

Test Equipment Depot - 800.517.8431 - 99 Washington Street Melrose, MA 02176 - TestEquipmentDepot.com

nstruction Manua

Model 7035

9-Bank, 1×4 Multiplexer Card

Contains Operating and Servicing Information

7035-901-01 Rev. A / 5-97

WARRANTY

Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year from date of
shipment.

Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries,
diskettes, and documentation.

During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.

To exercise this warranty, write or call your local Keithley representative, or contact Keithley headquarters in Cleveland, Ohio. You will
be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility. Repairs
will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the origi­nal warranty period, or at least 90 days.

LIMITATION OF W

ARRANTY

This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or misuse of
any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from battery leakage, or
problems arising from normal wear or failure to follow instructions.

THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED
WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE
BUYER’S SOLE AND EXCLUSIVE REMEDIES.

NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDI­RECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND
SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF
SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL
AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.

CHINA: Keithley Instruments China • Yuan Chen Xin Building, Room 705 • 12 Yumin Road, Dewai, Madian • Beijing 100029 • 8610-62022886 • Fax: [phone]
FRANCE: Keithley Instruments SARL • BP 60 • 3 Allée des Garays • 91122 Palaiseau Cédex • 33-1-60-11-51-55 • Fax: [phone]
GERMANY: Keithley Instruments GmbH • Landsberger Strasse 65 • D-82110 Germering, Munich • 49-89-8493070 • Fax: [phone]
GREAT BRITAIN: Keithley Instruments, Ltd. • The Minster • 58 Portman Road • Reading, Berkshire RG30 1EA • 44-118-9575666 • Fax: [phone]
ITALY: Keithley Instruments SRL • Viale S. Gimignano 38 • 20146 Milano • 39-2-48303008 • Fax: [phone]
NETHERLANDS: Keithley Instruments BV • Avelingen West 49 • 4202 MS Gorinchem • 31-(0)183-635333 • Fax: [phone]
SWITZERLAND: Keithley Instruments SA • Kriesbachstrasse 4 • 8600 Dübendorf • 41-1-8219444 • Fax: [phone]
TAIWAN: Keithley Instruments Taiwan • 1FL., 1, Min Yu First Street • Hsinchu, Taiwan, R.O.C. • 886-35-778462 • Fax: [phone]

Model 7035 9-Bank, 1

Instruction Manual

×

4 Multiplexer Card

©1997, Keithley Instruments, Inc.

All rights reserved.
Cleveland, Ohio, U.S.A.
First Printing, May 1997

Document Number: 7035-901-01 Rev. A

Manual Print History

The print history shown below lists the printing dates of all Revisions and Addenda created for this manual. The Revision
Level letter increases alphabetically as the manual undergoes subsequent updates. Addenda, which are released between Revi­sions, contain important change information that the user should incorporate immediately into the manual. Addenda are num­bered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are
incorporated into the new Revision of the manual. Each new Revision includes a revised copy of this print history page.

Many product updates and revisions do not require manual changes and, conversely, manual corrections may be done without
accompanying product changes. Therefore, it is recommended that you review the Manual Update History.

Revision A (Document Number 7035-901-01)......................................................................................... May 1997

All Keithley product names are trademarks or registered trademarks of Keithley Instruments, Inc.
Other brand and product names are trademarks or registered trademarks of their respective holders.

Safety Precautions

The following safety precautions should be observed before using
this product and any associated instrumentation. Although some in­struments and accessories would normally be used with non-haz­ardous voltages, there are situations where hazardous conditions
may be present.

This product is intended for use by qualified personnel who recog­nize shock hazards and are familiar with the safety precautions re­quired to avoid possible injury. Read the operating information
carefully before using the product.

The types of product users are:

Responsible body is the individual or group responsible for the use

and maintenance of equipment, and for ensuring that operators are
adequately trained.

Operators use the product for its intended function. They must be

trained in electrical safety procedures and proper use of the instru­ment. They must be protected from electric shock and contact with
hazardous live circuits.

Maintenance personnel perform routine procedures on the product

to keep it operating, for example, setting the line voltage or replac­ing consumable materials. Maintenance procedures are described in
the manual. The procedures explicitly state if the operator may per­form them. Otherwise, they should be performed only by service
personnel.

Service personnel are trained to work on live circuits, and perform

safe installations and repairs of products. Only properly trained ser­vice personnel may perform installation and service procedures.

Exercise extreme caution when a shock hazard is present. Lethal
voltage may be present on cable connector jacks or test fixtures.The
American National Standards Institute (ANSI) states that a shock
hazard exists when voltage levels greater than 30V RMS, 42.4V
peak, or 60VDC are present.

pect that hazardous voltage is present in any un­known circuit before measuring.

A good safety practice is to ex-

Users of this product must be protected from electric shock at all
times. The responsible body must ensure that users are prevented
access and/or insulated from every connection point. In some cases,
connections must be exposed to potential human contact. Product
users in these circumstances must be trained to protect themselves
from the risk of electric shock. If the circuit is capable of operating
at or above 1000 volts,

exposed.

As described in the International Electrotechnical Commission
(IEC) Standard IEC 664, digital multimeter measuring circuits
(e.g., Keithley Models 175A, 199, 2000, 2001, 2002, and 2010)
measuring circuits are Installation Category II. All other instru­ments’ signal terminals are Installation Category I and must not be
connected to mains.

Do not connect switching cards directly to unlimited power circuits.
They are intended to be used with impedance limited sources.
NEVER connect switching cards directly to AC mains. When con­necting sources to switching cards, install protective devices to lim­it fault current and voltage to the card.

Before operating an instrument, make sure the line cord is connect­ed to a properly grounded power receptacle. Inspect the connecting
cables, test leads, and jumpers for possible wear, cracks, or breaks
before each use.

For maximum safety, do not touch the product, test cables, or any
other instruments while power is applied to the circuit under test.
ALWAYS remove power from the entire test system and discharge
any capacitors before: connecting or disconnecting cables or jump­ers, installing or removing switching cards, or making internal
changes, such as installing or removing jumpers.

Do not touch any object that could provide a current path to the
common side of the circuit under test or power line (earth) ground.
Always make measurements with dry hands while standing on a
dry, insulated surface capable of withstanding the voltage being
measured.

no conductive part of the circuit may be

Do not exceed the maximum signal levels of the instruments and ac­cessories, as defined in the specifications and operating informa­tion, and as shown on the instrument or test fixture panels, or
switching card.

When fuses are used in a product, replace with same type and rating
for continued protection against fire hazard

Chassis connections must only be used as shield connections for
measuring circuits, NOT as safety earth ground connections.

If you are using a test fixture, keep the lid closed while power is ap­plied to the device under test. Safe operation requires the use of a
lid interlock.

If a screw is present, connect it to safety earth ground using the
wire recommended in the user documentation.

!

The symbol on an instrument indicates that the user should re­fer to the operating instructions located in the manual.

The symbol on an instrument shows that it can source or mea­sure 1000 volts or more, including the combined effect of normal
and common mode voltages. Use standard safety precautions to
avoid personal contact with these voltages.

The

WARNING heading in a manual explains dangers that might

result in personal injury or death. Always read the associated infor­mation very carefully before performing the indicated procedure.

Instrumentation and accessories shall not be connected to humans.

Before performing any maintenance, disconnect the line cord and
all test cables.

To maintain protection from electric shock and fire, replacement
components in mains circuits, including the power transformer, test
leads, and input jacks, must be purchased from Keithley Instru­ments. Standard fuses, with applicable national safety approvals,
may be used if the rating and type are the same. Other components
that are not safety related may be purchased from other suppliers as
long as they are equivalent to the original component. (Note that se­lected parts should be purchased only through Keithley Instruments
to maintain accuracy and functionality of the product.) If you are
unsure about the applicability of a replacement component, call a
Keithley Instruments office for information

To clean the instrument, use a damp cloth or mild, water based
cleaner. Clean the exterior of the instrument only. Do not apply
cleaner directly to the instrument or allow liquids to enter or spill
on the instrument.

The

CAUTION heading in a manual explains hazards that could

damage the instrument. Such damage may invalidate the warranty.

M

ODEL

7035 S

PECIFICATIONS

MULTIPLEX CONFIGURATION: Nine independent 1×4 2-pole

multiplex banks.

CONTACT CONFIGURATION: 2-pole Form A (Hi, Lo).
CONNECTOR TYPE: 96-pin male DIN connector.
MAXIMUM SIGNAL LEVEL: 60VDC, 30V rms, 42V peak betwen any

two inputs or chassis, 1A switched. 30VA (resistive load).

CONTACT LIFE: Cold Switching: 10

8

closures.

At Maximum Signal Levels: 10

5

closures.

CHANNEL RESISTANCE (per conductor): <1Ω.
CONTACT POTENTIAL: <1µV per channel contact pair

<3µV typical per single contact.

OFFSET CURRENT: <100pA.
ACTUATION TIME: 3ms.
ISOLATION: Bank: >10

9

Ω, <25 pF.

Channel to Channel: >10

9

Ω, <50 pF.

Differential: >10

9

Ω, <100pF.

Common Mode: >10

9

Ω, <200pF.

CROSSTALK (1MHz,50Ω Load): Bank: <–40dB.

Channel: <–40dB.

INSERTION LOSS (50Ω Source, 50 Load): <0.25dB below 1MHz,

<3dB below 10MHz.

RELAY DRIVE CURRENT (per relay): 16mA.
ENVIRONMENT: Operating: 0° to 50°C, up to 35°C <80% RH.

Storage: –25°C to 65°C.

EMC: Conforms with European Union Directive 89/336/EEC

EN 55011, EN 50082-1, EN 61000-3-2 and 61000-3-3, FCC part 15
class B.

SAFETY: Conforms with European Union Directive 73/23/EEC

EN 61010-1, UL 3111-1.

Channel 1

HI

LO

Bank A

Channels 2–3

HI

LO

Channel 4

HI

Output

LO

Channel 1

HI

LO

Bank I

Channels 2–3

HI

LO

Channel 4

HI

Output

LO

Specifications are subject to change without notice.

Table of Contents

1 General Information

Introduction......................................................................................................................................................... 1-1

Features ............................................................................................................................................................... 1-1

Warranty information.......................................................................................................................................... 1-1

Manual addenda .................................................................................................................................................. 1-2

Safety symbols and terms ................................................................................................................................... 1-2

Specifications ...................................................................................................................................................... 1-2

Unpacking and inspection................................................................................................................................... 1-2

Inspection for damage................................................................................................................................. 1-2

Handling precautions ................................................................................................................................. 1-2

Shipping contents........................................................................................................................................ 1-2

Instruction manual....................................................................................................................................... 1-2

Repacking for shipment ...................................................................................................................................... 1-3

Optional accessories............................................................................................................................................ 1-3

2 Multiplexer Configuration

Introduction......................................................................................................................................................... 2-1

Basic multiplexer configuration.......................................................................................................................... 2-1

Typical multiplexer switching schemes.............................................................................................................. 2-2

Single-ended switching ............................................................................................................................... 2-2

Differential switching ................................................................................................................................. 2-2

Sensing ........................................................................................................................................................ 2-3

SMU connections........................................................................................................................................ 2-3

Multiplexer expansion......................................................................................................................................... 2-4

i

3 Card Connections and Installation

Introduction ......................................................................................................................................................... 3-1

Handling precautions........................................................................................................................................... 3-1

Multi-pin (mass termination) connections........................................................................................................... 3-1

Typical connection technique...................................................................................................................... 3-4

Typical connection scheme ......................................................................................................................... 3-6

Model 7035 installation and removal .................................................................................................................. 3-8

Card installation........................................................................................................................................... 3-8

Card removal ............................................................................................................................................... 3-8

4 Operation

Introduction ......................................................................................................................................................... 4-1

Power limits......................................................................................................................................................... 4-1

Maximum signal levels................................................................................................................................ 4-1

Mainframe control of card................................................................................................................................... 4-1

Channel assignments ................................................................................................................................... 4-2

Closing and opening channels ..................................................................................................................... 4-4

Scanning channels ....................................................................................................................................... 4-4

IEEE-488 bus operation .............................................................................................................................. 4-5

Multiplexer switching examples.......................................................................................................................... 4-6

Two-wire resistance tests ............................................................................................................................ 4-6

Four-wire resistance tests ............................................................................................................................ 4-7

Measurement considerations ............................................................................................................................... 4-7

Path isolation ............................................................................................................................................... 4-7

Magnetic fields ............................................................................................................................................ 4-8

Radio frequency interference ...................................................................................................................... 4-8

Ground loops ............................................................................................................................................... 4-9

Keeping connectors clean............................................................................................................................ 4-9

AC frequency response................................................................................................................................ 4-9

5 Service Information

Introduction ......................................................................................................................................................... 5-1

Handling and cleaning precautions ..................................................................................................................... 5-1

Performance verification ..................................................................................................................................... 5-2

Environmental conditions............................................................................................................................ 5-2

Recommended equipment ........................................................................................................................... 5-2

Multiplexer connections .............................................................................................................................. 5-2

Channel resistance tests............................................................................................................................... 5-3

Offset current tests....................................................................................................................................... 5-4

Contact potential tests.................................................................................................................................. 5-6

Bank and channel-to-channel isolation tests ............................................................................................... 5-8

Differential and common-mode isolation tests.......................................................................................... 5-12

Special handling of static-sensitive devices ...................................................................................................... 5-16

Principles of operation....................................................................................................................................... 5-16

Block diagram ........................................................................................................................................... 5-16

ID data circuits .......................................................................................................................................... 5-17

Relay control ............................................................................................................................................. 5-17

Relay power control .................................................................................................................................. 5-17

ii

Power-on safeguard................................................................................................................................... 5-18

Troubleshooting ................................................................................................................................................ 5-18

Troubleshooting equipment ...................................................................................................................... 5-18

Troubleshooting access ............................................................................................................................. 5-18

Troubleshooting procedure ....................................................................................................................... 5-18

6 Replaceable Parts

Introduction......................................................................................................................................................... 6-1

Parts lists ..............................................................................................................................................................6-1

Ordering information .......................................................................................................................................... 6-1

Factory service .................................................................................................................................................... 6-1

Component layouts and schematic diagrams ...................................................................................................... 6-1

Index

iii

List of Illustrations

2 Multiplexer Configuration

Figure 2-1 Model 7035 simplified schematic ............................................................................................................... 2-1

Figure 2-2 Single-ended switching example................................................................................................................. 2-2

Figure 2-3 Differential switching example ................................................................................................................... 2-2

Figure 2-4 Sensing example ......................................................................................................................................... 2-3

Figure 2-5 SMU connections ........................................................................................................................................ 2-3

Figure 2-6 Multiplexer expansion example .................................................................................................................. 2-4

3 Card Connections and Installation

Figure 3-1 Multi-pin connector card terminal identification ........................................................................................ 3-2

Figure 3-2 Typical round cable connection techniques ................................................................................................ 3-4

Figure 3-3 Model 7011-MTR connector pinout ........................................................................................................... 3-5

Figure 3-4 Model 7011-KIT-R (cable) assembly ......................................................................................................... 3-5

Figure 3-5 Typical connection scheme for Model 7035 ............................................................................................... 3-7

Figure 3-6 Model 7035 card installation in Model 7001 .............................................................................................. 3-8

4 Operation

Figure 4-1 Model 7001 channel status display ............................................................................................................. 4-2

Figure 4-2 Model 7002 channel status display (slot 1)................................................................................................. 4-2

Figure 4-3 Display organization for multiplexer channels ........................................................................................... 4-3

Figure 4-4 Channel assignments ................................................................................................................................... 4-3

Figure 4-5 Two-wire resistance testing......................................................................................................................... 4-6

Figure 4-6 1x36 multiplex bank.................................................................................................................................... 4-6

Figure 4-7 Four-wire resistance testing ........................................................................................................................ 4-7

Figure 4-8 Path isolation resistance .............................................................................................................................. 4-8

Figure 4-9 Voltage attenuation by path isolation resistance ......................................................................................... 4-8

Figure 4-10 Power line ground loops ............................................................................................................................. 4-9

Figure 4-11 Eliminating ground loops............................................................................................................................ 4-9

v

5 Service Information

Figure 5-1 Path resistance test connections................................................................................................................... 5-3

Figure 5-2 Differential offset current test connections ................................................................................................. 5-5

Figure 5-3 Contact potential test connections ............................................................................................................... 5-7

Figure 5-4 Bank isolation test connections ................................................................................................................... 5-8

Figure 5-5 Channel-to-channel isolation test connections .......................................................................................... 5-10

Figure 5-6 Differential isolation test connections ....................................................................................................... 5-13

Figure 5-7 Common-mode isolation test connections................................................................................................. 5-15

Figure 5-8 Model 7035 block diagram........................................................................................................................ 5-16

Figure 5-9 Start and stop sequences ............................................................................................................................ 5-17

Figure 5-10 Transmit and acknowledge sequence ........................................................................................................ 5-17

vi

List of Tables

3 Card Connections and Installation

Table 3-1 Multi-pin connector card terminal designation cross-reference.................................................................. 3-3

Table 3-2 Mass termination accessories...................................................................................................................... 3-3

4 Operation

Table 4-1 Paired channels in four-wire resistance example ........................................................................................ 4-7

5 Service Information

Table 5-1 Verification equipment ............................................................................................................................... 5-2

Table 5-2 Bank isolation test summary ....................................................................................................................... 5-9

Table 5-3 Channel-to-channel isolation test summary.............................................................................................. 5-11

Table 5-4 Differential and common-mode isolation testing...................................................................................... 5-14

Table 5-5 Recommended troubleshooting equipment............................................................................................... 5-18

Table 5-6 Troubleshooting procedure ....................................................................................................................... 5-19

6 Replaceable Parts

Table 6-1 Relay board for Model 7035 parts list ........................................................................................................ 6-2

Table 6-2 Mass-terminated connector board for Model 7035 parts list ...................................................................... 6-3

Table 6-3 Model 7011-KIT-R 96-pin female DIN connector kit parts list .................................................................. 6-3

vii

1

General Information

Introduction

This section contains general information about the Model
7035 9-Bank, 1 × 4 Multiplexer Card.

The Model 7035 assembly consists of a multi-pin (mass ter­mination) connector card and a relay card. External test cir­cuit connections to the Model 7035 are made via the 96-pin
male DIN connector on the connector card. Keithley offers a
variety of optional accessories that can be used to make con­nections to the connector card. See the available optional
accessories at the end of this section.

The rest of Section 1 is arranged in the following manner:

• Features

• Warranty information

• Manual addenda

• Safety symbols and terms

• Specifications

• Unpacking and inspection

• Repacking for shipment

• Optional accessories

Features

The Model 7035 is a general purpose multiplexer card with
nine independent, 1 × 4, two-pole, multiplex banks. Some of
the key features include:

• Low contact potential and offset current for minimal
effects on low-level signals.

• High isolation resistance (>1G Ω ) for minimal load
effects.

• Model 7011-KIT-R connector kit that includes a 96-pin
female DIN connector that will mate directly to the con­nector on the Model 7035 or to a standard 96-pin male
DIN bulkhead connector (see Model 7011-MTR). This
connector uses solder cups for connections to external
circuitry and includes an adapter for a round cable and
the housing.

Warranty information

Warranty information is located at the front of this instruc­tion manual. Should your Model 7035 require warranty ser­vice, contact the Keithley representative or authorized repair
facility in your area for further information. When returning
the card for repair, be sure to fill out and include the service
form at the back of this manual in order to provide the repair
facility with the necessary information.

1-1

General Information

Manual addenda

Any improvements or changes concerning the card or man­ual will be explained in an addendum included with the card.
Addenda are provided in a page-replacement format.
Replace the obsolete pages with the new pages.

Safety symbols and terms

The following symbols and terms may be found on an instru­ment or used in this manual.

The symbol on an instrument indicates that you
should refer to the operating instructions located in the
instruction manual.

The symbol on an instrument shows that high voltage
may be present on the terminal(s). Use standard safety pre­cautions to avoid personal contact with these voltages.

The WARNING heading used in this manual explains dan­gers that might result in personal injury or death. Always
read the associated information very carefully before per­forming the indicated procedure.

The CAUTION heading used in this manual explains haz­ards that could damage the card. Such damage may invali­date the warranty.

!

contamination that could degrade its performance. Before
removing the card from the bag, observe the following pre­cautions on handling.

Handling precautions

1. Always grasp the card by the side edges and shields. Do
not touch the board surfaces or components.

2. When not installed in a Model 7001/7002 mainframe,
keep the card in the anti-static bag and store it in the
original packing carton.

After removing the card from its anti-static bag, inspect it for
any obvious signs of physical damage. Report any such dam­age to the shipping agent immediately.

Shipping contents

The following items are included with every Model 7035
order:

• Model 7035 9-Bank, 1 × 4 Multiplexer Card

• Model 7011-KIT-R 96-pin Female DIN Connector Kit

• Model 7035 Instruction Manual

• Additional accessories as ordered

Instruction manual

Specifications

Model 7035 specifications may be found at the front of this
manual. These specifications are exclusive of the Model
7001/7002 mainframe specifications

Unpacking and inspection

Inspection for damage

The Model 7035 is packaged in a resealable, anti-static bag
to protect it from damage due to static discharge and from

The Model 7035 Instruction Manual is three-hole drilled so
it can be added to the three-ring binder of the Model 7001 or
Model 7002 Instruction Manual. After removing the plastic
wrapping, place the manual in the binder following the main­frame instruction manual. Note that a manual identificatio
tab is included and should precede the multiplexer card
instruction manual.

If an additional instruction manual is required, order the
manual package, Keithley part number 7035-901-00. The
manual package includes an instruction manual and any per­tinent addenda.

1-2

General Information

Repacking for shipment

Should it become necessary to return the Model 7035 for
repair, carefully pack the unit in its original packing carton,
or the equivalent, and include the following information:

• Advise as to the warranty status of the card.

• Write ATTENTION REPAIR DEPARTMENT on the
shipping label.

• Fill out and include the service form located at the back
of this manual.

Optional accessories

The following accessories are available for use with the
Model 7035:

Model 7011-MTC-2 — This two-meter round cable assem-

bly is terminated with a 96-pin female DIN connector on
each end. It will mate directly to the connector on the
Model 7035 and to a standard 96-pin male DIN bulkhead
connector (see Model 7011-MTR).

Model 7011-MTR  This 96-pin male DIN bulkhead con-

nector uses solder cups for connections to external circuitry.
It will mate to the Model 7011-KIT-R connector and Model
7011-MTC-2 cable assembly.

1-3

2

Multiplexer Configuration

Introduction

This section covers the basics for multiplexer switching and
is arranged as follows:

• Basic multiplexer configuration — Covers the basic
multiplexer configuration

• Typical multiplexer switching schemes — Explains
some of the basic ways a multiplexer can be used to
source or measure. Covers single-ended switching, dif­ferential (floating) switching, sensing, and SMU
connections.

• Multiplexer expansion — Discusses how to configur
a larger multiplexer configuration

Basic multiplexer configuration

A simplified schematic of the Model 7035 multiplex banks is
shown in Figure 2-1. It is organized as nine independent
1 × 4 banks. Each bank has four inputs and one output. Two­pole switching is provided for each multiplexer input, with
HI and LO switched.

Bank A

Bank B

Bank C

Bank D

Bank E

Bank F

Bank G

Bank H

Bank I

Model 7035

1

1

1

1

1

1

1

1

1

4

4

4

4

4

4

4

4

4

Input (1 of 36)

HI
LO

Switching Topology

for all Channels

Figure 2-1

Model 7035 simplified schemati

HI

LO

Bank

2-1

Multiplexer Configuration

Bank A-I

HI

Out In

LO

Source or

Measure

Figure 2-2

Single-ended switching example

Typical multiplexer switching schemes

The following paragraphs describe some basic switching
schemes that are possible with a two-pole switching multi­plexer. These switching schemes include some various
shielding configurations to help minimize noise pick-up in
sensitive measurement applications. These shields are shown
connected to chassis ground. For some test configurations
shielding may prove to be more effective connected to circuit
common. Chassis ground is accessible at the rear panel of the
Model 7001/7002 mainframe.

Input 1-4

H

DUT

Optional

L

7035

single pathway as shown in Figure 2-2. The instrument is
connected to the output of one of the banks, and the DUT is
shown connected to one of the inputs for that bank.

Differential switching

The differential or floating switching configuration is shown
in Figure 2-3. The advantage of using this configuration is
that the terminals of the source or measure instrument are not
confined to the same pathway. Each terminal of the instru­ment can be switched to any available input in the test
system.

Shield

Single-ended switching

In the single-ended switching configuration, the source or
measure instrument is connected to the DUT through a

Bank A

HI

Out

LO

Out

Bank B

Source or

Measure

Figure 2-3

Differential switching example

Input 1-4

H

L

H

L

7035

In

DUT

In

Input 5-8

2-2

Source HI
Sense HI

Sense LO
Source LO

Bank A

Bank B

Out

Out

Multiplexer Configuration

Input 1-4

H
L

H
L

In

DUT

In

Source or

Measure

Figure 2-4

Sensing example

Sensing

Figure 2-4 shows how the multiplexer can be configured to
use instruments that have sensing capability. The main
advantage of using sensing is to cancel the effects of switch
card path resistance (<1 Ω ) and the resistance of external
cabling. Whenever path resistance is a consideration, sensing
should be used.

Output HI

Guard

Sense HI

Guard

7035

Input 5-8

SMU connections

Figure 2-5 shows how to connect a Keithley Model 236, 237,
or 238 Source Measure Unit to the multiplexer. By using
triax cables that are unterminated at one end, the driven
guard and chassis ground are physically extended all the way
to the card.

Bank A

Out

Out

Bank B

H
L

H
L

Input 1-4

In

DUT

In

Figure 2-5

SMU connections

Sense LO

Output LO

Output LO

236/237/238

7035

Input 5-8

WARNING: Hazardous voltages may be present on
GUARD. Make sure all cable shields are
properly insulated before applying power.

Triax

Cables (3)

2-3

Multiplexer Configuration

Multiplexer expansion

Larger multiplexers can be conf gured by externally connect­ing the individual Model 7035 multiplex banks using cus­tomer-supplied external jumpers. You can conf gure a
multiplexer as large as 1 × 36 (Figure 2-6).

Inputs

1

Bank A

4

1

Bank B

4

1

Bank C

4

1

Bank D

4

1

Bank E

4

1

Bank F

4

1

Bank G

4

1

Bank H

4

1

Bank I

4

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

Output A

2

Customer-supplied
external jumpers

2

2

Customer-supplied
external jumpers

2

2

Customer-supplied
external jumpers

2

2

Customer-supplied
external jumpers

2

2-4

Figure 2-6

Multiplexer expansion example

3

Card Connections

and Installation

Introduction

WARNING

The procedures in this section are in­tended only for qualified service person­nel. Do not perform these procedures
unless qualified to do so. Failure to rec­ognize and observe normal safety pre­cautions could result in personal injury
or death.

The information in this section is arranged as follows:

• Handling precautions  Explains precautions that
must be followed to prevent contamination to the card
assembly. Contamination could degrade the perfor­mance of the card.

• Multi-pin (mass termination) connections  Covers
the basics for connecting external circuitry to the con­nector card.

• Model 7035 installation and removal  Provides the
procedure to install and remove the card assembly from
the Model 7001/7002 mainframe.

Handling precautions

To maintain high impedance isolation, take care when
handling the card to avoid contamination from such foreign
materials as body oils. Such contamination can substantially
lower leakage resistances and degrade performance.

To avoid possible contamination, always grasp the relay card
and the connector card by the side edges or shields. Do not
touch the board surfaces or components. On connectors, do
not touch areas adjacent to the electrical contacts. Dirt
buildup over a period of time is another possible source of
contamination. To avoid this problem, operate the mainframe
and card assembly in a clean environment.

If a card becomes contaminated, it should be thoroughly
cleaned as explained in Section 5.

Multi-pin (mass termination) connections

Since connections to external circuitry are made at the 96-pin
male DIN bulkhead connector, there is no need to separate
the connector card from the relay card. If the connector card
is separated from the relay card, carefully mate them
together and install the supplied 4-40 screw to secure the
cards. Make sure to handle the cards by the edges and shields
to avoid contamination.

The connector will mate to a 96-pin female DIN connector.
Terminal identification for the DIN connector of the multi­pin connector card is provided by Figure 3-1 and Table 3-1
and can be identified in one of three ways:

1. Mux terminal consisting of banks A-I, channels 1-36.

2. Connector description consisting of rows a-c, pins 1-32.

3. Schematic and component layout designation consisting
of pins 1-96.

3-1

Card Connections and Installation

323130292827262524232221201918171615141312111098765432 1

c
b
a

View pin side
of connector

10
10a

34
2b

35
3b

36
4b

37
5b

38
6b

39
7b

40
8b

42
10b

Bank A

2

HI

2a

Channel 1

3
3a

LO

4

HI

4a

Channel 2

5
5a

LO

6

HI

6a

Channel 3

7
7a

LO

8

HI

8a

Channel 4

LO

HI

Output A

LO

11
11a

12
12a

Bank D

HI

Channel 13

LO

HI

Channel 14

LO

HI

Channel 15

LO

HI

Channel 16

LO

HI

Output D

LO

43
11b

44
12b

13
13a

14
14a

15
15a

16
16a

17
17a

18
18a

19
19a

20
20a

45
13b

46
14b

47
15b

48
16b

49
17b

50
18b

51
19b

52
20b

HI

LO

HI

LO

HI

LO

HI

LO

HI

LO

HI

LO

HI

LO

HI

LO

Bank B

Channel 5

Channel 6

Channel 7

Channel 8

Bank E

Channel 17

Channel 18

Channel 19

Channel 20

HI

Output B

LO

HI

Output E

LO

21
21a

22
22a

53
21b

54
22b

23
23a

24
24a

25
25a

26
26a

27
27a

28
28a

29
29a

30
30a

55
23b

56
24b

57
25b

58
26b

59
27b

60
28b

61
29b

62
30b

Bank C

HI

LO

HI

LO

HI

LO

HI

LO

Bank F

HI

LO

HI

LO

HI

LO

HI

LO

Channel 9

Channel 10

Channel 11

Channel 12

Channel 21

Channel 22

Channel 23

Channel 24

HI

Output C

LO

HI

Output F

LO

31
31a

32
32a

63
31b

64
32b

Bank G

65
1c

HI

Channel 25

66
2c

LO

67
3c

HI

Channel 26

68

LO

4c
69

HI

5c

Channel 27

70
6c

LO

71

HI

7c

Channel 28

72

LO

8c

1
1a

33
1b

HI

Output G

LO

73
9c

74
10c

95
31c

96
32c

75
11c

76
12c

77
13c

78
14c

79
15c

80
16c

81
17c

82
18c

Figure 3-1

Multi-pin connector card terminal identificatio

3-2

HI

LO

HI

LO

HI

LO

HI

LO

Bank H

Channel 29

Channel 30

Channel 31

Channel 32

41
9b

9
9a

HI

Output H

LO

83
19c

84
20c

85
21c

86
22c

87
23c

88
24c

89
25c

90
26c

91
27c

92
28c

Bank I

HI

LO

HI

LO

HI

LO

HI

LO

Channel 33

Channel 34

Channel 35

Channel 36

Output I

HI

LO

93
29c

94
30c

Table 3-1

Multi-pin connector card terminal designation cross-reference

Card Connections and Installation

Conn.
Mux
terminal

Bank A Chan 1, HI 2a 2 Bank B Chan 5, HI 13a 13 Bank C Chan 9, HI 23a 23

Chan 1, LO 3a 3 Chan 5, LO 14a 14 Chan 9, LO 24a 24
Chan 2, HI 4a 4 Chan 6, HI 15a 15 Chan 10, HI 25a 25
Chan 2, LO 5a 5 Chan 6, LO 16a 16 Chan 10, LO 26a 26
Chan 3, HI 6a 6 Chan 7, HI 17a 17 Chan 11, HI 27a 27
Chan 3, LO 7a 7 Chan 7, LO 18a 18 Chan 11, LO 28a 28
Chan 4, HI 8a 8 Chan 8, HI 19a 19 Chan 12, HI 29a 29
Chan 4, LO 10a 10 Chan 8, LO 20a 20 Chan 12, LO 30a 30
Output A, HI 11a 11 Output B, HI 21a 21 Output C, HI 31a 31
Output A, LO 12a 12 Output B, LO 22a 22 Output C, LO 32a 32

Bank D Chan 13, HI 2b 34 Bank E Chan 17, HI 13b 45 Bank F Chan 21, HI 23b 55

Chan 13, LO 3b 35 Chan 17, LO 14b 46 Chan 21, LO 24b 56
Chan 14, HI 4b 36 Chan 18, HI 15b 47 Chan 22, HI 25b 57
Chan 14, LO 5b 37 Chan 18, LO 16b 48 Chan 22, LO 26b 58
Chan 15, HI 6b 38 Chan 19, HI 17b 49 Chan 23, HI 27b 59
Chan 15, LO 7b 39 Chan 19, LO 18b 50 Chan 23, LO 28b 60
Chan 16, HI 8b 40 Chan 20, HI 19b 51 Chan 24, HI 29b 61
Chan 16, LO 10b 42 Chan 20, LO 20b 52 Chan 24, LO 30b 62
Output D, HI 11b 43 Output E, HI 21b 53 Output F, HI 31b 63
Output D, LO 12b 44 Output E, LO 22b 54 Output F, LO 32b 64

Bank G Chan 25, HI 1c 65 Bank H Chan 29, HI 11c 75 Bank I Chan 33, HI 21c 85

Chan 25, LO 2c 66 Chan 29, LO 12c 76 Chan 33, LO 22c 86
Chan 26, HI 3c 67 Chan 30, HI 13c 77 Chan 34, HI 23c 87
Chan 26, LO 4c 68 Chan 30, LO 14c 78 Chan 34, LO 24c 88
Chan 27, HI 5c 69 Chan 31, HI 15c 79 Chan 35, HI 25c 89
Chan 27, LO 6c 70 Chan 31, LO 16c 80 Chan 35, LO 26c 90
Chan 28, HI 7c 71 Chan 32, HI 17c 81 Chan 36, HI 27c 91
Chan 28, LO 8c 72 Chan 32, LO 18c 82 Chan 36, LO 28c 92
Output G, HI 9c 73 Output H, HI 19c 83 Output I, HI 29c 93

Output G, LO 10c 74 Output H, LO 20c 84 Output I, LO 30c 94
Shield 9a 9 Not Used 1a 1 Not Used 31c 95
Shield 9b 41 Not Used 1b 33 Not Used 32c 96

desig.
1a-32c

Schem.
desig.
1-96

Mux
terminal

Conn.
desig.
1a-32c

Schem.
desig.
1-96

Mux
terminal

Conn.
desig.
1a-32c

Schem.
desig.
1-96

Keithley has a variety of cable and connector accessories
available to accommodate connections from the connector
card to test instrumentation and DUTs (devices under test).
In general, these accessories, which are summarized in
Table 3-2, utilize a round cable assembly for connections.

Table 3-2

Mass termination accessories

Model Description

7011-KIT-R 96-pin female DIN connector and hous-

ing for round cable (provided with the
Model 7035 card).

7011-MTC-2 Two-meter round cable assembly termi-

nated with a 96-pin female DIN con­nector on each end.

7011-MTR 96-pin male DIN bulkhead connector.

3-3

Card Connections and Installation

Typical connection technique

All external circuitry, such as instrumentation and DUTs,
that you want to connect to the card must be terminated with
a single 96-pin female DIN connector. The following con­nection techniques provide some guidelines and suggestions
for wiring your circuitry.

WARNING

Before beginning any wiring proce­dures, make sure all power is off and
stored energy in external circuitry is dis­charged.

WARNING

When wiring a connector and device un­der test, do not leave any exposed wires
or connections. No conductive part of
the circuit may be exposed. Properly
cover the conductive parts and ensure
maximum signal levels are not exceeded
or death by electric shock may occur.

NOTE

It is recommended that external circuitry
be connected (plugged in) after the Model
7035 assembly is installed in the Model
7001/7002 mainframe. Installation is cov­ered at the end of this section.

Round cable assemblies — shows typical round cable con-

nection techniques using accessories available from
Keithley.

In Figure 3-2A, connections are accomplished using a Model
7011-MTC-2 cable and a Model 7011-MTR bulkhead con­nector. The two-meter round cable is terminated with a 96­pin female DIN connector at each end. This cable mates
directly to the multi-pin connector card and to the bulkhead
connector. The bulkhead connector has solder cups to allow
direct connection to the instrumentation and DUT.
Figure 3-3 provides the pinout for the bulkhead connector.

A)

B)

C)

Multi-Pin

Connector

Card

Multi-Pin

Connector

Card

Multi-Pin

Connector

Card

7011-MTC-2

cable

assembly

7011-MTC-2
(Cut in Half)

7011-Kit-R

Connector Kit

Notes: Figure 3-4 provides an exploded view showing
how the connector (with cable) is assembled.

Cable Hitachi p/n N2807-P/D-50TAB is a

50-conductor cable. Two of these cables
can be used to supply 100 conductors.

7011-MTR

bulkhead connector

Wire directly to
instrumentation

Cable

Wire instrumentation
and DUT to bulkhead
connector (See Table 3-1
and Figures 3-1 and 3-3
for terminal identification)

and DUT

Wire directly to
instrumentation

and DUT

Figure 3-2

Typical round cable connection techniques

3-4

Note: See Figure 3-1 and Table 3-1 for terminal identification.

Figure 3-3

Model 7011-MTR connector pinout

In Figure 3-2B, connections are accomplished using a
Model 7011-MTC-2 cable assembly that is cut in half. The
96-pin female DIN connector on one end of the cable mates
directly to the multi-pin connector card. The unterminated
end of the cable is wired directly to the instrumentation and
DUT. The other half of the cable assembly could be used for
a second card.

In Figure 3-2C, connections are accomplished using
a custom-built cable assembly that consists of a
Model 7011-KIT-R connector and a suitable round cable.
Hitachi cable part number N2807-P/D-50TAB is a 50-con­ductor cable. Two of these cables can be used to supply 100
conductors. The connector has solder cups to accommodate
the individual wires of the unterminated cable. Figure 3-4 pro­vides an exploded view of the connector assembly and shows
how the cable is connected. For further Model 7011-KIT-R
assembly information, refer to the packing list provided with
the kit. The connector end of the resultant cable assembly
mates directly to the multi-pin connector card. The untermi­nated end of the cable assembly is wired directly to the instru­mentation and DUT.

Card Connections and Installation

3231302928272625242322212019181716151413121110987654321

c
b
a

View from solder
cup side of
connector

Figure 3-4

Model 7011-KIT-R (cable) assembly

3-5

Card Connections and Installation

Typical connection scheme

The following information provides a typical connection
scheme for the Model 7035. Keep in mind that this is only an
example to demonstrate wiring a test system.

Figure 3-5 shows how external connections can be made to
the system. Instrumentation and DUTs are hard-wired to the
Model 7011-MTR male bulkhead connector. This connector
has solder cups that will accept wire size up to #24 AWG.
The test system is connected to the Model 7035 multiplexer

using the Model 7011-MTC-2 round cable assembly. This
cable mates directly to both the external bulkhead connector
and the Model 7035 card. Notice that the bulkhead connector
is shown mounted to a fixture to help keep the cabling stable
during the test. Connection details are provided in the Multi­pin (mass termination) connections paragraph.

If adding more Model 7035 cards to a system, simply wire
them in the same manner as the first. Remember that Model
7035 cards installed in the same mainframe are electrically
isolated from each other.

3-6

Card Connections and Installation

Instrument

Instrument

Instrument

Instrument

Instrument

Instrument

Instrument

Instrument

Instrument

1 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4

HI and LO to Bank A

HI and LO to Bank B

HI and LO to Bank C

HI and LO to Bank D

HI and LO to Bank E

HI and LO to Bank F

HI and LO to Bank G

HI and LO to Bank H

HI and LO to Bank I

90 Individual Conductors

DUT Test Fixture

Fixture for

Bulkhead

Connector

7011-MTR

Bulkhead

Connector

Model 7011-MTC-2

Cable Assembly

1

1

4

4
1

1

4

4
1

1

4

4
1

1

7035

Figure 3-5

Typical connection scheme for Model 7035

DUTs

4

4
1

1

4

4
1

1

4

4
1

1

4

4
1

1

4

4
1

1

4

4

7035

Simplified Equivalent Circuit

Instruments

3-7

Card Connections and Installation

Model 7035 installation and removal

The following paragraphs explain how to install and remove
the Model 7035 card from the Model 7001/7002 mainframe.

WARNING

Installation or removal of the Model
7035 is to be performed by qualified ser­vice personnel. Failure to recognize and
observe standard safety precautions
could result in personal injury or death.

CAUTION

To prevent contamination to the card
that could degrade performance, only
handle the card by the edges and
shields.

Card installation

Perform the following steps to install the Model 7035 card in
the Model 7001/7002 mainframe:

WARNING

1. Mate the connector card to the relay card if they are sep­arated. Install the supplied 4-40 screw to secure the
assembly. Make sure to handle the cards by the edges
and shields to prevent contamination.

2. Facing the rear panel of the Model 7001/7002, select the
slot that you wish to install the Model 7035 card in.

3. Referring to Figure 3-6, feed the Model 7035 card into
the desired slot so the edges of the relay card ride in the
rails.

4. With the ejector arms in the unlocked position, push the
Model 7035 card all the way into the mainframe until
the arms engage into the ejector cups. Then push both
arms inward to lock the card into the mainframe.

WARNING

To avoid electric shock that could result
in injury or death, make sure to
properly install and tighten the safety
ground screw shown in Figure 3-6.

5. Install the screw shown in Figure 3-6.

Card removal

Turn off power from all instrumentation
(including the Model 7001/7002 main­frame) and disconnect their line cords.
Make sure all power is removed and any
stored energy in external circuitry is dis­charged.

Screw

Figure 3-6

Model 7035 card installation in Model 7001

Unlock card

To remove the Model 7035 card, first unloosen the safety
ground screw, unlock the card by pulling the latches out­ward, and pull the card out of the mainframe. Remember to
handle the card by the edges and shields to avoid contami­nation that could degrade performance.

Ejector
Arms (2)

Screw

Lock card

3-8

4

Operation

Introduction

The information in this section is formatted as follows:

• Power limits — Summarizes the maximum power lim­its of the Model 7035 card.

• Mainframe control of card — Summarizes the pro­gramming steps to control the card from the
Model 7001/7002 mainframe.

• Multiplexer switching examples — Provides some
typical applications for using the Model 7035.

• Measurement considerations — Reviews a number of
considerations when using the Model 7035 to make
measurements.

Power limits

CAUTION

To prevent damage to the card, do not
exceed the maximum signal level speci­fications of the card.

Maximum signal levels

To prevent overheating or damage to the relays, never exceed
the following maximum signal levels:

60V DC, 30V rms, 42V peak between any two inputs or
chassis, 1A switched, 30VA (resistive load).

Mainframe control of card

The following information pertains to the Model 7035. It
assumes that you are familiar with the operation of the
Model 7001 or Model 7002 mainframe—whichever is used.

If you are not familiar with the operation of the mainframe in
use, proceed to Getting Started (Section 3) of the
Model 7001 or Model 7002 Instruction Manual after reading
the following information.

4-1

Operation

7001 Display

CARD 1 CARD 2

1 23456 78910123456 78910

= Open Channel

= Closed Channel

Figure 4-1

Model 7001 channel status display

Channel assignments

The Model 7001 has a channel status display (Figure 4-1)
that provides the real-time state of each available channel.
The left portion of the display is for slot 1 (card 1), and the
right portion is for slot 2 (card 2). For the Model 7002, chan­nel status LED grids are used for the ten slots. The LED grid
for slot 1 is shown in Figure 4-2.

7002 LED Display

COLUMN

SLOT 1

ROW

Figure 4-2

Model 7002 channel status display (slot 1)

1234 6785 910

1
2

3

4

= Open Channel
= Closed Channel

To control the card from the mainframe, each multiplexer
input must have a unique channel assignment that includes
the slot number that the card is installed in. The channel
assignments for the card are provided in Figure 4-4. Each
channel assignment is made up of the slot designator (1 or 2)
and the channel (1 to 36). For the Model 7002, the slot des­ignator can be from 1 to 10 since there are 10 slots. To be
consistent with Model 7001/7002 operation, the slot desig­nator and channel are separated by an exclamation point (!).
Some examples of channel assignments are as follows:

CHANNEL 1!1 = Slot 1, Channel 1 (Input 1 of Bank A)

CHANNEL 1!36 = Slot 1, Channel 36 (Input 36 of Bank I)

CHANNEL 2!23 = Slot 2, Channel 23 (Input 23 of Bank F)

CHANNEL 2!36 = Slot 2, Channel 36 (Input 36 of Bank I)

These channels are displayed and controlled from the normal
display state of the mainframe. If currently in the menu
structure, return to the normal display state.

Organization of the channel status display for each slot is
shown in Figure 4-3. The card contains 36 channels and is
made up of nine multiplex banks (banks A through I) totaling
36 channels as shown in the illustration.

4-2

Bank

Operation

Channel

A
1

CCDDDD E E E E

11 12 13 14 15 16 17 18 19 20

FFFFGGGGHH

21 22 23 24 25 26 27 28 29

H

31 32 33 34 35 36

A

2

HIIII

A
3

Figure 4-3

Display organization for multiplexer channels

12345678910

1!1 1!2 1!3 1!4 1!5 1!6 1!7 1!8 1!9 1!10

A
4

B
56

BBBCC

7

Not

Used

8

Not

Used

910

30

Not

Used

Not

Used

A. Slot 1

(Card 1)

B. Slot 2

(Card 2)

Figure 4-4

Channel assignments

1!11 1!12 1!13 1!14 1!15 1!16 1!17 1!18 1!19 1!20

1!21 1!22 1!23 1!24 1!25 1!26 1!27 1!28 1!29 1!30

1!31 1!32 1!33 1!34 1!35 1!36

12345678910

2!1 2!2 2!3 2!4 2!5 2!6 2!7 2!8 2!9 2!10

2!11 2!12 2!13 2!14 2!15 2!16 2!17 2!18 2!19 2!20

2!21 2!22 2!23 2!24 2!25 2!26 2!27 2!28 2!29 2!30

2!31 2!32 2!33 2!34 2!35 2!36

Examples: 1!18 = Slot 1, Channel 18 (Input 18 of Bank E)

2!36 = Slot 2, Channel 36 (Input 36 of Bank I)

4-3

Operation

Closing and opening channels

A channel is closed from the front panel by simply keying in
the channel assignment and pressing CLOSE. For example,
to close channel 6 (input 6 of bank B) of a multiplexer card
installed in slot 2, key in the following channel list and press
CLOSE:

SELECT CHANNELS 2!6

The above closed channel can be opened by pressing OPEN
or OPEN ALL. The OPEN key opens only the channels spec­ified in the channel list, and OPEN ALL turns off (opens) all
channels.

NOTE

For the Model 7002 mainframe, you can
use the light pen to turn output channels on
and off.

The following display is an example of a channel list that
consists of several channels:

SELECT CHANNELS 2!1, 2!3, 2!22-2!25

Notice that channel entries are separated by commas (,). A
comma is inserted by pressing ENTER or the right cursor
key (  ). The channel range is specified by using the hyphen
(-) key to separate the range limits. Pressing CLOSE will
close all the channels specified in the channel list. Pressing
OPEN (or OPEN ALL) will open the channels.

Channel patterns can also be used in a channel list. This
allows you to control unique relay patterns. Example:

SELECT CHANNELS 2!1, M1

Scanning channels

Multiplexer channels are scanned by creating a scan list and
configuring the Model 7001/7002 to perform a scan. The
scan list is created in the same manner as a channel list (See
the previous Closing and opening channels paragraph).
However, the scan list is specified from the SCAN CHAN­NELS display mode. (The SCAN LIST key toggles between
the channel list and the scan list.) The following shows an
example of a scan list:

SCAN CHANNELS 2!1, 2!3, 2!21-2!25

When a scan is performed, the channels specified in the scan
list will be scanned in the order that they are presented in the
scan list.

Channel patterns can also be used in a scan list. This allows
you to scan unique relay patterns. Example:

SCAN CHANNELS M1, M2, M3, M4

When M1 is scanned, the channels that make up channel pat­tern M1 will close. When M2 is scanned, the M1 channels
will open and the channels that make up M2 will close. M3
and M4 are scanned in a similar manner. Refer to the instruc­tion manual for the mainframe for information on definin
channel patterns.

A manual scan can be performed by using the RESET
default conditions of the Model 7001/7002. RESET is
selected from the SAVESETUP menu of the main MENU.
When RESET is performed, the mainframe is configured for
an infinite number of manual scans. The first press of STEP
takes the mainframe out of the idle state. The next press of
STEP will close the first channel specified in the scan list.
Each subsequent press of STEP will select the next channel
in the scan list.

Pressing CLOSE will close channel 2!1 and the channels that
make up channel pattern M1. Refer to the mainframe instruc­tion manual for information on defining channel patterns

4-4

Operation

IEEE-488 bus operation

Bus operation is demonstrated using Microsoft QuickBASIC

4.5, the Keithley KPC-488.2 (or Capital Equipment Corpo-

ration) IEEE interface, and the HP-style Universal Language
Driver (CECHP). Refer to “QuickBASIC 4.5 Programming”
in the mainframe manual for details on installing the Univer­sal Language Driver, opening driver files, and setting the
input terminal. Program statements assume that the primary
address of the mainframe is 07.

Closing and opening channels

The following SCPI commands are used to close and open
multiplexer channels:

:CLOSe <list>
:OPEN <list>|ALL

The following program statement closes channels 1!1, 1!4
through 1!6 and the channels that make up channel pattern
M1.

PRINT #1, "output 07; clos (@ 1!1, 1!4:1!6, M1)"

Notice that the colon (:) is used to separate the range limits.

Either of the following statements opens channels 1!1, 1!4
through 1!6 and the channels of M1:

PRINT #1, "output 07; open (@ 1!1, 1!4:1!6, M1)"
PRINT #1, "output 07; open all"

Scanning channels

There are many commands associated with scanning. How­ever, it is possible to configure a scan using as little as four
commands. These commands are listed as follows:

*RST
:TRIGger:COUNt:AUTo ON
:ROUTe:SCAN <list>
:INIT

Closes specified channels

Opens specified (or all) channels.

The first command resets the mainframe to a default scan
configuration. The second command automatically sets the
channel count to the number of channels in the scan list, the
third command defines the scan list, and the fourth command
takes the Model 7001/7002 out of the idle state.

The following program fragment will perform a single scan
of channels 1 through 4 of slot 1, and the channels that make
up channel pattern M1:

PRINT #1, "output 07; *rst"
PRINT #1, "output 07; trig:coun:auto on"
PRINT #1, "output 07; scan (@ 1!1:1!4, M1)"
PRINT #1, "output 07; init"

The first statement selects the *RST default configurationfor
the scan. The second statement sets channel count to the
scan-list-length (5). The third statement defines the scan list,
and the last statement takes the mainframe out of the idle
state. The scan is configured to start as soon as the :INIT
command is executed.

When the above program fragment is run, the scan will be
completed in approximately 216 milliseconds (3msec delay
for channel closures and 3msec delay for each open), which
is too fast to view from the front panel. An additional relay
delay can be added to the program to slow down the scan for
viewing. The program is modified by adding a statement to
slow down the scan. Also, a statement is added to the begin­ning of the program to ensure that all channels are open
before the scan is started. The two additional statements are
indicated in bold typeface.

PRINT #1, "output 07; open all"

PRINT #1, "output 07; *rst"
PRINT #1, "output 07; trig:coun:auto on"

PRINT #1, "output 07; trig:del 0.5"

PRINT #1, "output 07; scan (@ 1!1:1!4, M1)"
PRINT #1, "output 07; init"

The first statement opens all channels, and the fourth state­ment sets a 1/2 second delay after each channel closes.

4-5

Operation

Multiplexer switching examples

This paragraph presents some typical applications for the
Model 7035. These include two-wire and four-wire resis­tance tests.

The Model 7035 can be used to test a large number of resis­tors using only one test instrument or group of instruments.
Such tests include two-wire and four-wire resistance mea­surements using a DMM as discussed in the following para­graphs.

Two-wire resistance tests

Figure 4-5 shows a typical test setup for making two-wire
resistance measurements using one of the nine Model 7035
multiplex banks. The Model 7035 provides the switching
function, while the resistance measurements are made by a
Model 2000 DMM.

7035

1

1

HI

LO

POWER

MODEL 2000 DMM

Single 1×4 MUX

A. Test Configuration

4

4

DUTs

(4)

Since only two-pole switching is required for two-wire resis­tance testing, one Model 7035 card can be used to switch up
to 36 resistors by externally connecting the bank outputs
using customer-supplied jumpers (Figure 4-6). Figure 4-6 is
a simplified schematic, and each input contains two-pole
switching.

Accuracy of measurements can be optimized by minimizing
stray resistance.

Make connecting wires as short as possible to minimize path
resistance. Another technique is to short one of the multi­plexer inputs, close the shorted channel and then enable the
DMM zero feature to cancel path resistance. Leave zero
enabled for the entire test.

Bank A (1×4)

1

1

Instruments

Customer-supplied
external bank
connections

DUTs

4

Bank B (1×4)

1

Bank I (1×4)

1

4

4

5

84

32

36

Ω

Model 2000

DMM

B. Simplified Equivalent Circuit

Figure 4-5

Two-wire resistance testing

4-6

7035

DUT

Single 1×36 Multiplexer

Figure 4-6

R

1

×

36 multiplex bank

Operation

Four-wire resistance tests

More precise measurements over a wider range of system
and DUT conditions can be obtained by using the four-wire
measurement scheme shown in Figure 4-7. Here, separate
sense leads from the Model 2000 DMM are routed through
the multiplexer to the resistor under test. The extra set of
sense leads minimizes the effects of voltage drops across the
test leads. Note, however, that an extra two poles of switch­ing are required for each resistor tested. For this reason, only
16 resistors per card can be tested using this configuratio
because two channels must close at the same time.

The example shown in Figure 4-7 tests four devices using
banks A and B. The appropriate channel pairs to close for the
example are shown in Table 4-1.

7035

POWER

Model 2000

DMM

Input HI

Sense

Ω 4

Wire HI

HI

LO

Input LO

1

4

5

DUTs

(4)

1

4

Table 4-1

Paired channels in four-wire resistance example

Device
under test
(DUT)

Channel
pair

Connection
designations

1 1 and 5 Bank A, IN 1 and

Bank B, IN 5

2 2 and 6 Bank A, IN 2 and

Bank B, IN 6

3 3 and 7 Bank A, IN 3 and

Bank B, IN 7

4 4 and 8 Bank A, IN 4 and

Bank B, IN 8

Note that banks A and B must be electrically isolated. Like­wise, if you were to configure a dual 1 × 8 four-wire resistance
test by externally connecting the outputs of banks A and B
and banks C and D using customer-supplied jumpers, you
must electrically isolate banks A and B from banks C and D.

Although the four-wire connection scheme minimizes prob­lems caused by voltage drops, there is one other potentially
troublesome area associated with low resistance measure­ments: thermal EMFs caused by the relay contacts. In order
to compensate for thermal EMFs, the offset-compensated
ohms feature of the Model 2000 DMM should be used.

Sense

Ω 4 Wire

LO

A. Test Configuration

Input HI

Sense Ω 4 Wire HI

Ω

Sense Ω 4 Wire LO

Input LO

Model 2000

DMM

B. Simplified Equivalent Circuit

Figure 4-7

Four-wire resistance testing

8

Dual 1×4 MUX

7035

DUT

Measurement considerations

Many measurements made with the Model 7035 are subject
to various effects that can seriously affect low-level measure­ment accuracy. The following paragraphs discuss these
effects and ways to minimize them.

Path isolation

R

The path isolation is simply the equivalent impedance
between any two test paths in a measurement system. Ideally,
the path isolation should be infinite, but the actual resistance
and distributed capacitance of cables and connectors results
in less than infinite path isolation values for these devices.

4-7

Operation

Any differential isolation capacitance affects DC measure­ment settling time as well as AC measurement accuracy.
Thus, it is often important that such capacitance be kept as

R

DUT

R

PATH

R

IN

V

low as possible. Although the distributed capacitance of the
multiplexer card is generally fi ed by design, there is one
area where you do have control over the capacitance in your
system: the connecting cables. To minimize capacitance,

E

DUT

keep all cables as short as possible.

DUT

R

= Source Resistance of DUT

DUT

E

= Source EMF of DUT

DUT

R

= Path Isolation Resistance

PATH

R

= Input Resistance of Measuring Instrument

IN

7035 Mux

Card

Measure

Instrument

Figure 4-8

Path isolation resistance

Path isolation resistance forms a signal path that is in parallel
with the equivalent resistance of the DUT, as shown in Fig­ure 4-8. For low-to-medium device resistance values, path
isolation resistance is seldom a consideration; however, it
can seriously degrade measurement accuracy when testing
high-impedance devices. The voltage measured across such
a device, for example, can be substantially attenuated by the
voltage divider action of the device source resistance and
path isolation resistance, as shown in Figure 4-9. Also, leak­age currents can be generated through these resistances by
voltage sources in the system.

R

DUT

Magnetic fields

When a conductor cuts through magnetic lines of force, a
very small current is generated. This phenomenon will fre­quently cause unwanted signals to occur in the test leads of a
switching multiplexer system. If the conductor has sufficien
length, even weak magnetic fields like those of the earth can
create sufficient signals to affect low-level measurements.

Two ways to reduce these effects are: (1) reduce the lengths
of the test leads, and (2) minimize the exposed circuit area.
In extreme cases, magnetic shielding may be required. Spe­cial metal with high permeability at low flux densities (such
as mu metal) is effective at reducing these effects.

Even when the conductor is stationary, magnetically induced
signals may still be a problem. Fields can be produced by
various signals such as the AC power line voltage. Large
inductors such as power transformers can generate substan­tial magnetic fields, so care must be taken to keep the switch­ing and measuring circuits a good distance away from these
potential noise sources.

At high current levels, even a single conductor can generate
significant fields. These effects can be minimized by using
twisted pairs, which will cancel out most of the resulting
fields

DUT

DUT

R

PATH

R

PATH

+

R

PATH

E

DUT

E

=

E

OUT

R

Figure 4-9

Voltage attenuation by path isolation resistance

4-8

Radio frequency interference

Radio Frequency Interference (RFI) is a general term used to
describe electromagnetic interference over a wide range of
frequencies across the spectrum. Such RFI can be particu­larly troublesome at low signal levels, but it can also affect
measurements at high levels if the problem is of sufficien
severity.

Operation

RFI can be caused by steady-state sources such as radio or
TV signals or some types of electronic equipment (micropro­cessors, high speed digital circuits, etc.), or it can result from
impulse sources, as in the case of arcing in high-voltage envi­ronments. In either case, the effect on the measurement can
be considerable if enough of the unwanted signal is present.

RFI can be minimized in several ways. The most obvious
method is to keep the equipment and signal leads as far away
from the RFI source as possible. Shielding the card, signal
leads, sources, and measuring instruments will often reduce
RFI to an acceptable level. In extreme cases, a specially con­structed screen room may be required to sufficiently attenu­ate the troublesome signal.

Many instruments incorporate internal filtering that may
help to reduce RFI effects in some situations. In some cases,
additional external filtering may also be required. Keep in
mind, however, that filtering may have detrimental effects on
the desired signal.

Ground loops

When two or more instruments are connected together, care
must be taken to avoid unwanted signals caused by ground
loops. Ground loops usually occur when sensitive instru­mentation is connected to other instrumentation with more
than one signal return path such as power line ground. As
shown in Figure 4-10, the resulting ground loop causes cur­rent to fl w through the instrument LO signal leads and then
back through power line ground. This circulating current
develops a small but undesirable voltage between the LO ter­minals of the two instruments. This voltage will be added to
the source voltage, affecting the accuracy of the measure­ment.

Signal Leads

Instrument 1 Instrument 2 Instrument 3

Ground Loop

Current

Power Line Ground

Figure 4-11 shows how to connect several instruments to­gether to eliminate this type of ground loop problem. Here,
only one instrument is connected to power line ground.

Instrument 1

Instrument 2 Instrument 3

Power Line Ground

Figure 4-11

Eliminating ground loops

Ground loops are not normally a problem with instruments
having isolated LO terminals. However, all instruments in
the test setup may not be designed in this manner. When in
doubt, consult the manual for each instrument in the test
setup.

Keeping connectors clean

As is the case with any high-resistance device, the integrity
of the connectors can be damaged if they are not handled
properly. If connector insulation becomes contaminated, the
insulation resistance will be substantially reduced, affecting
high-impedance measurement paths.

Oils and salts from the skin can contaminate connector insu­lators, reducing their resistance. Also, contaminants present
in the air can be deposited on the insulator surface. To avoid
these problems, never touch the connector insulating
material. In addition, the multiplexer card should be used
only in clean, dry environments to avoid contamination.

If the connector insulators should become contaminated,
either by inadvertent touching or from airborne deposits,
they can be cleaned with a cotton swab dipped in clean meth­anol. After thoroughly cleaning, they should be allowed to
dry for several hours in a low-humidity environment before
use, or they can be dried more quickly using dry nitrogen.

AC frequency response

Figure 4-10

Power line ground loops

The AC frequency response of the Model 7035 is important
in test systems that switch AC signals. Refer to the specifica
tions at the front of this manual.

4-9

Operation

4-10

5

Service Information

WARNING

The information in this section is
intended only for qualified service per­sonnel. Some of the procedures may
expose you to hazardous voltages that
could result in personal injury or death.
Do not attempt to perform these proce­dures unless you are qualified to do so.

Introduction

This section contains information necessary to service the
Model 7035 multiplexer card and is arranged as follows:

• Handling and cleaning precautions — Discusses han­dling precautions and methods to clean the card should
it become contaminated.

• Performance verification — Covers the procedures
necessary to determine if the multiplexer card meets
stated specifications

• Special handling of static-sensitive devices —
Reviews precautions necessary when handling static­sensitive devices.

• Principles of operation — Briefly discusses circuit
operation.

• Troubleshooting — Presents some troubleshooting tips
for the Model 7035 including relay replacement precau­tions.

Handling and cleaning precautions

Because of the high-impedance areas on the Model 7035,
care should be taken when handling or servicing the card to
prevent possible contamination. The following precautions
should be taken when handling the card.

Handle the card only by the edges and shields. Do not touch
any board surfaces, connectors, or components not associ­ated with the repair. Do not touch areas adjacent to electrical
contacts. When servicing the card, wear clean cotton gloves.

Do not store or operate the card in an environment where
dust could settle on the circuit board. Use dry nitrogen gas to
clean dust off the board if necessary.

Should it become necessary to use solder on the circuit
board, use an OA-based (organic activated) flux. Remove the
flux from the work areas when the repair has been com­pleted. Use pure water along with clean cotton swabs or a
clean soft brush to remove the flux. Take care not to spread
the flux to other areas of the circuit board. Once the flux has
been removed, swab only the repaired area with methanol,
and then blowdry the board with dry nitrogen gas.

After cleaning, the card should be placed in a 50 ° C low
humidity environment for several hours before use.

5-1

Service Information

Performance verification

The following paragraphs discuss the performance verifica
tion procedures for the Model 7035, including path resis­tance, offset current, contact potential, and isolation.

CAUTION

Contamination will degrade the perfor­mance of the card. To avoid contamina­tion, always grasp the card by the side
edges or shields. Do not touch the con­nectors and do not touch the board sur­faces or components. On plugs and
receptacles, do not touch areas adjacent
to the electrical contacts.

NOTE

Failure of any performance verificatio
test may indicate that the card is contami­nated. See the Handling and cleaning pre­cautions paragraph to clean the card.

Multiplexer connections

The following information summarizes methods that can be
used to connect test instrumentation to the card. Detailed
connection information is provided in Section 3.

One method to make instrument connections to the multi­plexer card is by hard-wiring a 96-pin female DIN connector
then mating it to the connector on the Model 7035. Input and
output shorting connections can also be done at the connec­tor. The connector in the Model 7011-KIT-R connection kit
(Table 3-2) can be used for this purpose. Pin identificatio
for the connector is provided by Figure 3-1 and Table 3-1.

WARNING

When wiring a connector and device
under test, do not leave any exposed
wires or connections. No conductive
part of the circuit may be exposed. Prop­erly cover the conductive parts, or death
by electric shock may occur.

CAUTION

Environmental conditions

All verification measurements should be made at an ambient
temperature between 18 ° and 28 ° C and at a relative humidity
of less than 70%.

Recommended equipment

Table 5-1 summarizes the equipment necessary for perfor­mance verification along with an application for each unit.

Table 5-1

Verification equipmen

Description Model Specifications Applications

DMM Keithley Model 2000 100 Ω ; 0.01% Path resistance

Electrometer w/voltage source Keithley Model

6517A

Sensitive Digital Voltmeter Keithley Model 182 3mV; 60ppm Contact potential

Before pre-wiring any connectors or plugs, study the follow­ing test procedures to fully understand the connection
requirements.

20pA, 200pA; 1%
100V source; 0.15%

After making solder connections to a
connector, remove solder flux as
explained in the Handling and cleaning
precautions paragraph. Failure to clean
the solder connections could result in
degraded performance and prevent the
card from passing verification tests.

Offset current, path isolation

Triax cable (unterminated) Keithley Model 7025 

Low thermal cable
(unterminated)

5-2

Keithley Model 1484 

Offset current

Contact potential

Service Information

Channel resistance tests

Perform the following steps to verify that each contact of
every relay is closing properly and that the resistance is
within specification

1. Turn off the Model 7001/7002 mainframe if it is on.

2. Turn on the Model 2000 and allow it to warm up for one
hour before making measurements.

3. Connect all input terminals of bank A together to form
one common terminal, as shown in Figure 5-1.

4. Set the Model 2000 to the 100 Ω range and connect the
four test leads to the INPUT and INPUT Ω 4 WIRE
jacks.

5. Short the four test leads together and zero the Model

2000. Leave zero enabled for the entire test.

6. Connect INPUT HI and INPUT Ω 4 WIRE HI of the
Model 2000 to the common terminal (jumper on bank A
inputs). It is recommended that the physical connections
be made at inputs 1 and 4 of bank A, as shown in
Figure 5-1.

Input Ω 4 Wire

HI

Input HI

LO

POWER

Model 2000

(Measure 4-Wire Ohms)

Note: Connections are set
up to test Bank A HI.

Input LO

Input Ω

4 Wire LO

7. Connect INPUT LO and INPUT Ω 4 WIRE LO to the HI
(H) terminal of bank A.

8. Install the Model 7035 in slot 1 (CARD 1) of the Model
7001/7002.

9. Turn on the Model 7001/7002 and program it to close
channel 1!1 (bank A, input 1). Verify that the resistance
of this path is <1 Ω .

10. Open channel 1!1 and close channel 1!2 (bank A,
input 2). Verify that the resistance of this path is <1 Ω .

11. Using the basic procedure in steps 9 and 10, check the
resistance of bank A HI (H) terminal paths for inputs 3
and 4 (channels 1!3 and 1!4).

12. Turn off the Model 7001/7002 and move the INPUT LO
and INPUT Ω 4 WIRE LO test leads to the LO (L) ter­minal of bank A.

13. Repeat steps 9 and 10 to check the LO (L) terminal paths
of bank A (channels 1!1 through 1!4).

14. Repeat the basic procedure in steps 1 through 13 for
bank B through I (channels 1!5 through 1!36).

Customer-supplied

jumpers

1

A

B

C

3

2

4

H

L

H

L

H

L

Figure 5-1

Path resistance test connections

Bank
Outputs

D

E

F

G

H

I

HL HL HL HL

Bank Inputs

Model 7035

H

L

H

L

H

L

H

L

H

L

H

L

5-3

Service Information

Offset current tests

These tests check for leakage current between HI (H) and LO
(L) (differential offset current) and from HI (H) and LO (L)
to chassis (common-mode offset current) of each pathway. In
general, these tests are performed by measuring the leakage
current with an electrometer. In the following procedure, the
Model 6517A is used to measure the leakage current. Test
connections are shown in Figure 5-2.

Perform the following procedure to check offset current:

1. Turn off the Model 7001/7002 mainframe if it is on, and
remove any jumpers or wires connected to the card.

2. Connect the triax cable to the Model 6517A, but do not
connect it to the card at this time.

3. Turn on the Model 6517A and allow the unit to warm up
for two hours before testing.

4. After warm up, select the 200pA range, and enable zero
check and zero correct the instrument. Leave zero cor­rect enabled for the entire procedure.

5. Connect the triax cable to bank A HI and LO, as shown
in A.

6. Install the Model 7035 in slot 1 (CARD 1) of the main­frame.

7. Turn on the mainframe.

8. Program the unit to close channel 1!1 (bank A, input 1).

9. On the Model 6517A, disable zero check and allow the
reading to settle. Verify that the reading is <100pA. This
specification is the offset (leakage) current of the path­way.

10. Enable zero check on the Model 6517A and open chan­nel 1!1 from the front panel of the mainframe.

11. Repeat the basic procedure in steps 8 through 10 to
check the rest of the pathways (inputs 2 through 4) of
bank A (channels 1!2 through 1!4).

12. Turn off the mainframe and change the electrometer
connections to the next bank.

13. Repeat the basic procedure in steps 7 through 12 to
check bank B through I, (channels 1!5 through 1!36).

14. Turn off the Model 7001/7002 and change the electrom­eter connections as shown in B. Note that electrometer
HI is connected to HI and LO of the bank A output,
which are jumpered together. Electrometer LO is con­nected to chassis.

15. Repeat steps 7 through 13 to check that the common
mode offset current is <100pA.

5-4

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

!

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

Model 6517A

(Measure Current)

Model 7025
Unterminated
Triax Cable

90-110V

180-220V

105-125V

210-250V

115V

!

HI (Red)

LO (Black)

Note: Setup shown is configured
to test Bank A pathways for
offset current.

Bank Outputs

Bank Inputs

1342

A

B

C

D

E

F

G

H

I

HL HL HL HL

Service Information

H
L

H

L

H

L

H
L

H

L

H
L

H
L

H

L

H
L

!

Model 6517A

(Measure Current)

Model 7025
Unterminated
Triax Cable

90-110V

180-220V

105-125V

210-250V

115V

!

HI (Red)

LO
(Black)

Short

Note: Setup shown is configured
to test Bank A pathways for
offset current.

Bank Outputs

Model 7035

A) Differential

Bank Inputs

1342

A

B

C

D

E

F

G

H

I

HL HL HL HL

Model 7035

B) Common-Mode

H
L

H

L

H

L

H
L

H

L

H
L

H
L

H

L

H
L

Figure 5-2

Differential offset current test connections

5-5

Service Information

Contact potential tests

These tests check the EMF generated by each relay contact
pair (H and L) for each pathway. The tests simply consist of
using a sensitive digital voltmeter (Model 182) to measure
the contact potential (Figure 5-3).

Perform the following procedure to check the contact poten­tial of each path:

1. Turn off the Model 7001/7002 mainframe if it is on.

2. Place jumpers between banks A-B, B-C, C-D, D-E, E-F,
F-G, G-H, and H-I.

3. Turn on the Model 182 and allow the unit to warm up to
achieve rated accuracy.

4. Place a short between HI to LO on each input (channels
1-36).

5. Place a short between HI to LO on output bank I (long
enough to cut with wire cutters).

6. Connect the Model 182 input leads to HI and LO output
bank A using copper wires.

7. Install the Model 7035 in the Model 7001/7002 slot 1
and turn on the mainframe.

8. Allow Models 7001/7002, 7035, and 182 to warm up for
two hours.

9. Select the 3mV range on the Model 182.

10. Press REL READING (on the Model 182) to null out
internal offsets. Leave REL READING enabled for the
entire procedure.

11. Turn off the mainframe. Remove the Model 7035 from
slot 1. Cut the short on bank I output HI to LO.

12. Install the Model 7035 in mainframe slot 1, and turn on
power.

13. Wait 15 minutes.

14. Program the mainframe to close channel 1!1.

15. After settling, verify that reading on the Model 182 is
<1 µ V.

16. From the mainframe, open channel 1!1.

17. Repeat steps 14 through 16 for all 36 channels.

5-6

KEITHLEY

182 SENSITIVE DIGITAL VOLTMETER

Model 1484

Low Thermal Cable
(Unterminated)

TRG
SRQ
REM
TALK

LSTN

Model 182

HI

LO

Service Information

Low thermal short.
Clean, high purity
copper (1 of 36)

H

L

H

L

A

B

Bank Inputs

1342

Note: Setup shown is configured
to test Banks A through I
relays for contact potential.

Customer-supplied
jumpers

Figure 5-3

Contact potential test connections

Low thermal short.
Clean, high purity
copper (1 of 1)

Bank

Outputs

C

D

E

F

G

H

I

HL HL HL HL

Model 7035

H

L

H

L

H

L

H

L

H

L

H

L

H

L

5-7

Service Information

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

Bank and channel-to-channel isolation tests

Bank isolation tests check the leakage resistance between
adjacent banks. Channel-to-channel isolation tests check the
leakage resistance between a bank output connection and a
bank input connection with an adjacent bank input relay
closed. In general, the tests are performed by applying a volt­age (60V) across the leakage resistance and then measuring
the current. The isolation resistance is then calculated as
R = V/I. In the following procedure, the Model 6517A func­tions as both a voltage source and an ammeter. In the R func­tion, the Model 6517A internally calculates the resistance
from the known voltage and current levels and displays the
resistive value.

Perform the following steps to check bank and channel-to­channel isolation:

Ground Link
Removed

!

Source V and
Measure V/I

Banana to
Banana Cable

!

Model 6517A

Note: Setup shown is configured
to test isolation between
Bank A and Bank B.

90-110V

180-220V

105-125V

210-250V

115V

Unterminated
Banana Cables

1. Turn off the Model 7001/7002 mainframe if it is on, and

2. Turn on the Model 6517A and allow the unit to warm up

3. Connect the electrometer to the Model 7035 as shown in

4. Install the Model 7035 in slot 1 (CARD 1) and turn on

5. Place the Model 6517A in the R measurement function.

Model 7025
Unterminated
Triax Cable

(Red)

Bank

Outputs

remove any jumpers or test leads connected to the mul­tiplexer.

for two hours before testing.

Figure 5-4.

the mainframe.

WARNING

The following steps use a 60V source. Be
sure to remove power from the circuit
before making connection changes.

Bank Inputs

HI

A

B

C

D

E

F

G

H

I

1342

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

HLHLHLHL

Figure 5-4

Bank isolation test connections

5-8

Model 7035

Ω

Service Information

6. Turn on the Model 7001/7002 and program it to close
channels 1!1 and 1!6 (bank A, input 1 and bank B,
input 2).

7. On the Model 6517A, source +60V.

8. After allowing the reading on the Model 6517A to settle,
verify that it is >1G Ω (10

9

). This measurement is the

9. Turn off the Model 6517A voltage source and the Model
7001/7002.

10. Move the electrometer connections to banks B and C.

11. Using Table5-2 as a guide, repeat the basic procedure of
steps 6 through 10 for the rest of the path pairs (test
numbers 2 through 9 in the table).

leakage resistance (bank isolation) between bank A,
input 1 and bank B, input 2.

Table 5-2

Bank isolation test summary

Test
number Bank isolation Test equipment location Channels closed*

1 Bank A, Input 1 to Bank B, Input 2 Bank A and Bank B 1!1 and 1!6

2 Bank B, Input 2 to Bank C, Input 3 Bank B and Bank C 1!6 and 1!11

3 Bank C, Input 3 to Bank D, Input 4 Bank C and Bank D 1!11 and 1!16

4 Bank D, Input 1 to Bank E, Input 2 Bank D and Bank E 1!13 and 1!18

5 Bank E, Input 2 to Bank F, Input 3 Bank E and Bank F 1!18 and 1!23

6 Bank F, Input 3 to Bank G, Input 4 Bank F and Bank G 1!23 and 1!28

7 Bank G, Input 1 to Bank H, Input 2 Bank G and Bank H 1!25 and 1!30

8 Bank H, Input 2 to Bank I, Input 3 Bank H and Bank I 1!30 and 1!35

9 Bank H, Input 3 to Bank I, Input 4 Bank H and Bank I 1!31 and 1!36

*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.

5-9

Service Information

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

Ω

12. Turn off the Model 6517A voltage source and the Model
7001/7002.

NOTE

Refer to the following procedure to check
channel-to-channel isolation.

13. Connect the Model 6517A to the card as shown in
Figure 5-5.

14. Install the Model 7035 in slot 1 and turn on the main­frame.

15. Program the mainframe to close channel 1!2 (bank A,
input 2). Make sure all other channels are open.

Model 7025

Ground Link
Removed

!

Source V and
Measure V/I

Banana to
Banana Cable

!

Model 6517A

90-110V

180-220V

105-125V

210-250V

115V

Unterminated

Banana Cables

Note: Setup shown is configured
to test isolation between
path 1!1 and 1!2.

Unterminated
Triax Cable

16. On the Model 6517A, source +60V.

17. After allowing the reading on the Model 6517A to settle,
verify that it is >1G Ω (10

9

).

18. Turn off the Model 6517A voltage source and the Model
7001/7002.

19. Using Table 5-3 as a guide, perform tests 2 and 3 using
steps 13 through 18 for the remaining bank A inputs.
Remember to move bank input connections as indicated
in the table.

20. Use Table 5-3 (test numbers 4 through 29) and steps 6
through 19 to test banks B through I inputs. Move the
electrometer connections shown in Figure 5-5 to the
appropriate bank and move the bank input connections
as indicated in the table.

Customer-supplied
Jumper

Bank Inputs

1342

HI

(Red)

Bank

Outputs

A

B

C

D

E

F

G

H

I

HL HL HL HL

Model 7035

H

L

H
L

H
L

H
L

H
L

H
L

H
L

H
L

H
L

Figure 5-5

Channel-to-channel isolation test connections

5-10

Table 5-3

Channel-to-channel isolation test summary

Service Information

Test
number Channel-to-channel isolation Test equipment location

1
2
3

5
6
7

9
10
11

12
13
14

15
16
17

18
19
20

Bank A, Input 1 to Bank A, Input 2
Bank A, Input 2 to Bank A, Input 3
Bank A, Input 3 to Bank A, Input 4

Bank B, Input 5 to Bank B, Input 6
Bank B, Input 6 to Bank B, Input 7
Bank B, Input 7 to Bank B, Input 8

Bank C, Input 9 to Bank C, Input 10
Bank C, Input 10 to Bank C, Input 11
Bank C, Input 11 to Bank C, Input 12

Bank D, Input 13 to Bank D, Input 14
Bank D, Input 14 to Bank D, Input 15
Bank D, Input 15 to Bank D, Input 16

Bank E, Input 17 to Bank E, Input 18
Bank E, Input 18 to Bank E, Input 19
Bank E, Input 19 to Bank E, Input 20

Bank F, Input 21 to Bank F, Input 22
Bank F, Input 22 to Bank F, Input 23
Bank F, Input 23 to Bank F, Input 24

Bank A and Input 1
Bank A and Input 2
Bank A and Input 3

Bank B and Input 5
Bank B and Input 6
Bank B and Input 7

Bank C and Input 9
Bank C and Input 10
Bank C and Input 11

Bank D and Input 13
Bank D and Input 14
Bank D and Input 15

Bank E and Input 17
Bank E and Input 18
Bank E and Input 19

Bank F and Input 21
Bank F and Input 22
Bank F and Input 23

Channel
closed*

1!2
1!3
1!4

1!6
1!7
1!8

1!10
1!11
1!12

1!14
1!15
1!16

1!18
1!19
1!20

1!22
1!23
1!24

21
22
23

24
25
26

27
28
29

*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.

Bank G, Input 25 to Bank G, Input 26
Bank G, Input 26 to Bank G, Input 27
Bank G, Input 27 to Bank G, Input 28

Bank H, Input 29 to Bank H, Input 30
Bank H, Input 30 to Bank H, Input 31
Bank H, Input 31 to Bank H, Input 32

Bank I, Input 33 to Bank I, Input 34
Bank I, Input 34 to Bank I, Input 35
Bank I, Input 35 to Bank I, Input 36

Bank G and Input 25
Bank G and Input 26
Bank G and Input 27

Bank H and Input 29
Bank H and Input 30
Bank H and Input 31

Bank I and Input 33
Bank I and Input 34
Bank I and Input 35

1!26
1!27
1!28

1!30
1!31
1!32

1!34
1!35
1!36

5-11

Service Information

Ω

Differential and common-mode isolation tests

These tests check the leakage resistance (isolation) between
HI (H) and LO (L) (differential) and from HI (H) and LO (L)
to chassis (common-mode) of every bank and channel. In
general, the test is performed by applying a voltage (60V)
across the terminals and then measuring the leakage current.
The isolation resistance is then calculated as R = V/I. In the
following procedure, the Model 6517A functions as a volt­age source and an ammeter. In the R function, the Model
6517A internally calculates the resistance from the known
voltage and current levels and displays the resistance value.

Perform the following steps to check differential and com­mon mode isolation:

1. Turn off the Model 7001/7002 mainframe if it is on, and
remove any jumpers and test leads connected to the
card.

2. Turn on the Model 6517A and allow the unit to warm up
for two hours for rated accuracy.

WARNING

The following steps use a 60V source. Be
sure to remove power from the circuit
before making connection changes.

3. On the Model 6517A, set the voltage source for +60V.
Make sure the voltage source is off.

4. Place the Model 6517A in the R measurement function.

5. With the Model 6517A off, connect the electrometer to
bank A as shown in Figure 5-6.

6. Install the Model 7035 in slot 1 (CARD 1), and turn on
the mainframe.

7. Make sure all the relays are open.

8. On the Model 6517A, source +60V.

9. After allowing the reading on the Model 6517A to settle,
verify that it is >1G Ω (10
differential leakage resistance (isolation) of bank A.

9

). This measurement is the

5-12

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

Ground Link
Removed

!

Source V and
Measure V/I

Banana to
Banana Cable

!

Model 6517A

90-110V

180-220V

105-125V

210-250V

115V

Unterminated

Banana Cable

Model 7025
Unterminated
Triax Cable

HI

(Red)

A

B

C

D

1342

Bank Inputs

Service Information

H

L

H

L

H

L

H

L

Note: Setup shown is configured to
test isolation between HI and
LO of Bank A.

Figure 5-6

Differential isolation test connections

Bank

Outputs

E

F

G

H

I

HL HL HL HL

Model 7035

H

L

H

L

H

L

H

L

H

L

5-13

Service Information

Ω

Ω ).

10. Turn off the Model 6517A voltage source.

11. Program the mainframe to close channel 1!1 (bank A,
input 1).

12. On the Model 6517A, source +60V.

13. After allowing the reading on the Model 6517A to settle,
verify that it is also >1G Ω (10

9

). This measurement

checks the differential isolation of input 1.

14. Using Table 5-4 as a guide, repeat the basic procedure in
steps 10 through 13 to test inputs 2 through 4 of bank A
(test numbers 3 through 5 of the table).

15. Using Table 5-4 (test numbers 6 through 45), repeat the
basic procedure in steps 5 through 14 to test banks B
through I.

Table 5-4

Differential and common-mode isolation testing

Test
number

1
2
3
4
5

Differential or com­mon mode isolation

Bank A
Bank A, Input 1
Bank A, Input 2
Bank A, Input 3
Bank A, Input 4

Channel
closed*

None

1!1
1!2
1!3
1!4

16. Turn off the Model 6517A voltage source.

NOTE

Refer to the following procedure to check
common-mode isolation.

17. Turn off the mainframe and connect the electrometer to
the Model 7035 as shown in Figure 5-7.

18. Repeat steps 3 through 15 to check common mode iso­lation. Verify that each reading is >1G Ω (10

Test
number

26
27
28
29
30

Differential or com­mon mode isolation

Bank F
Bank F, Input 21
Bank F, Input 22
Bank F, Input 23
Bank F, Input 24

9

Channel
closed*

None

1!21
1!22
1!23
1!24

6
7
8
9

10

11
12
13
14
15

16
17
18
19
20

21
22
23
24
25

*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.

Bank B
Bank B, Input 5
Bank B, Input 6
Bank B, Input 7
Bank B, Input 8

Bank C
Bank C, Input 9
Bank C, Input 10
Bank C, Input 11
Bank C, Input 12

Bank D
Bank D, Input 13
Bank D, Input 14
Bank D, Input 15
Bank D, Input 16

Bank E
Bank E, Input 17
Bank E, Input 18
Bank E, Input 19
Bank E, Input 20

None

1!5
1!6
1!7
1!8

None

1!9
1!10
1!11
1!12

None

1!13
1!14
1!15
1!16

None

1!17
1!18
1!19
1!20

31
32
33
34
35

36
37
38
39
40

41
42
43
44
45

Bank G
Bank G, Input 25
Bank G, Input 26
Bank G, Input 27
Bank G, Input 28

Bank H
Bank H, Input 29
Bank H, Input 30
Bank H, Input 31
Bank H, Input 32

Bank I
Bank I, Input 33
Bank I, Input 34
Bank I, Input 35
Bank I, Input 36

None

1!25
1!26
1!27
1!28

None

1!29
1!30
1!31
1!32

None

1!33
1!34
1!35
1!36

5-14

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.

Ground Link
Removed

!

Banana to
Banana Cable

!

90-110V

180-220V

105-125V

210-250V

115V

Model 7025
Unterminated
Triax Cable

Customer-supplied
Jumper

HI

(Red)

A

1342

Bank Inputs

Service Information

H

L

Source V and
Measure V/I

Note: Setup shown is configured
to test isolation between
Bank A and chassis ground.

Model 6517A

Unterminated

Banana Cable

Bank

Outputs

B

C

D

E

F

G

H

I

HL HL HL HL

H

L

H

L

H

L

H

L

H

L

H

L

H

L

H

L

Figure 5-7

Common-mode isolation test connections

Model 7035

5-15

Service Information

Special handling of static-sensitive devices

CMOS and other high-impedance devices are subject to pos­sible static discharge damage because of the high-impedance
levels involved. The following precautions pertain specifi
cally to static-sensitive devices. However, since many
devices in the Model 7035 are static-sensitive, it is recom­mended that they all be treated as static-sensitive.

1. Such devices should be transported and handled only in
containers specially designed to prevent or dissipate
static buildup. Typically, these devices will be received
in anti-static containers made of plastic or foam. Keep
these parts in their original containers until ready for
installation.

2. Remove the devices from their protective containers
only at a properly grounded work station. Also, ground
yourself with a suitable wrist strap while working with
these devices.

3. Handle the devices only by the body; do not touch the
pins.

4. Any printed circuit board into which the device is to be
inserted must first be grounded to the bench or table

5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.

Principles of operation

The paragraphs below discuss the basic operating principles
for the Model 7035 and can be used as an aid in troubleshoot­ing the card. The schematic drawings of the Model 7035 card
are shown on drawing numbers 7035-106 and 7035-176 at
the end of Section 6.

Block diagram

Figure 5-8 shows a simplified block diagram of the
Model 7035. Key elements include the relay drivers and
relays, as well as the ROM, which contains card ID and con­figuration information. These various elements are discussed
in the following paragraphs.

To Mainframe

To Mainframe

Figure 5-8

Model 7035 block diagram

CLK

Data

Strobe

Enable

ID CLK

ID DATA

+6V,

+15V

Relay

Drivers

U101­U105

ROM

U107

Relays

User connections

+3.5V (Steady State)
+5.7 (≈ 100 msec during
relay actuation)

Relay

Power

Control

Q101, Q102
U106, U108

5-16

Service Information

ID data circuits

Upon power-up, card identification information from each
card is read by the mainframe. This ID data includes such
information as card ID, hardware settling time, and relay
configuration information.

ID data is contained within an on-card EEPROM (U107). In
order to read this information, the sequence described below
is performed on power-up.

1. The IDDATA line (pin 5 of U107) is set from high to low
while the IDCLK line (pin 6 of U107) is held high. This
action initiates a start command to the ROM to transmit
data serially to the mainframe (Figure 5-9).

ID CLK

ID DATA

Start Bit Stop Bit

Figure 5-9

Start and stop sequences

4. Once all data is received, the mainframe sends a stop
command, which is a low-to-high transition of the
IDDATA line with the IDCLK line held high
(Figure 5-9).

Relay control

Card relays are controlled by serial data transmitted via the
relay DATA line. A total of fi e bytes for each card are
shifted in serial fashion into latches located in the card relay
driver ICs. The serial data is clocked in by the CLK line. As
data overfl ws one register, it is fed out the Q’s line of the
register down the chain.

Once all fi e bytes have shifted into the card, the STROBE
line is set high to latch the relay information into the Q out­puts of the relay drivers, and the appropriate relays are ener­gized (assuming the driver outputs are enabled, as discussed
below). Note that a relay driver output goes low to energize
the corresponding relay.

Relay power control

A relay power control circuit, made up of Q101, Q102,
U106, U108, and associated components, keeps power dissi­pated in relay coils at a minimum, thus reducing possible
problems caused by thermal EMFs.

2. The mainframe sends the ROM address location to be
read over the IDDATA line. The ROM then transmits an
acknowledge signal back to the mainframe, and it then
transmits data at that location back to the mainframe
(Figure 5-10).

3. The mainframe then transmits an acknowledge signal,
indicating that it requires more data. The ROM will then
sequentially transmit data after each acknowledge sig­nal it receives.

ID CLK

189

IDDATA
(Data output
from mainframe
or ROM)

IDDAT
(Data output
from mainframe
or ROM)

Start

Figure 5-10

Transmit and acknowledge sequence

During steady-state operation, the relay supply voltage, +V,
is regulated to +3.5V to minimize coil power dissipation.
When a relay is first closed, the STROBE pulse applied to
U106 changes the parameters of the relay supply voltage reg­ulator, Q101, allowing the relay supply voltage, +V, to rise to
+5.7V for about 100msec. This brief voltage rise ensures that
relays close as quickly as possible. After the 100msec period
has elapsed, the relay supply voltage (+V) drops back down
to its nominal steady-state value of +3.5V.

Acknowledge

5-17

Service Information

Power-on safeguard

NOTE

The power-on safeguard circuit is actually
located on the digital board in the Model
7001/7002 mainframe.

A power-on safeguard circuit, made up of U114 (a D-type
flip-flop and associated components, ensures that relays do
not randomly energize on power-up and power-down. This
circuit disables all relays (all relays are open) during power­up and power-down periods.

The PRESET line on the D-type flip-flo is controlled by the
68302 microprocessor, while the CLK line of the D-type
flip-flo is controlled by a port line on the 68302 processor.
The Q output of the flip-flo drives each card relay driver IC
enable pin (U101-U105, pin 8).

When the 68302 microprocessor is in the reset mode, the
flip-flo PRESET line is held low, and Q out immediately
goes high, disabling all relays (relay driver IC enable pins are
high, disabling the relays.) After the reset condition elapses
(≈200msec), PRESET goes high while Q out stays high.
When the first valid STROBE pulse occurs, a low logic level
is clocked into the D-type flip-flop setting Q out low and
enabling all relay drivers simultaneously. Note that Q out
stays low, (enabling relay drivers) until the 68302 processor
goes into a reset condition.

Troubleshooting access

In order to gain access to the relay card top surface to mea­sure voltages under actual operation conditions, perform the
following steps:

1. Disconnect the connector card from the relay card.

2. Remove the Model 7001/7002 cover.

3. Install the relay card in the CARD 1 slot location.

4. Turn on Model 7001/7002 power to measure voltages
(see the following Troubleshooting procedure
paragraph).

Troubleshooting procedure

Table 5-6 summarizes card troubleshooting.

WARNING

Lethal voltages are present within the
Model 7001/7002 mainframe. Some of
the procedures may expose you to haz­ardous voltages. Observe standard
safety precautions for dealing with live
circuits. Failure to do so could result in
personal injury or death.

CAUTION

Observe the following precautions when
troubleshooting or repairing the card:

Troubleshooting

Troubleshooting equipment

Table 5-5 summarizes recommended equipment for trouble­shooting the Model 7035.

Table 5-5

Recommended troubleshooting equipment

Manufacturer

Description

Multimeter Keithley 2000 Measure DC voltages

Oscilloscope TEK 2243 View logic waveforms

5-18

and model Application

To avoid contamination, which could
degrade card performance, always han­dle the card only by the handle and side
edges. Do not touch edge connectors,
board surfaces, or components on the
card. Also, do not touch areas adjacent
to electrical contacts on connectors.

Use care when removing relays from the
PC board to avoid pulling traces away
from the circuit board. Before attempt­ing to remove a relay, use an appropri­ate de-soldering tool such as a solder
sucker to clear each mounting hole com­pletely free of solder. Each relay pin
must be free to move in its mounting
hole before removal. Also, make certain
that no burrs are present on the ends of
the relay pins.

Service Information

Table 5-6

Troubleshooting procedure

Step Item/component Required condition Comments

1 GND test point (C114) All voltages referenced to digital ground

(GND pad).

2 +6V pad (Q101, pin 2) +6VDC Relay voltage.

3 +5V pad (C103) +5VDC Logic voltage.

4 +15V pad (R101) +15VDC Relay bias voltage.

5 +V pad (C114) +3.5VDC* Regulated relay voltage.

6 U107, pin 6 ID CLK pulses During power-up only.

7 U107, pin 5 ID DATA pulses During power-up only.

8 U101, pin 7 STROBE pulse End of re lay update sequence.

9 U101, pin 2 CLK pulses During relay update sequence only.

10 U101, pin 3 DATA pulses During relay update sequence only.

11 U101-U105, pins 10-18 Low with relay energized; high

Relay driver outputs.

with relay de-energized.

*+3.5VDC present at +V pad under steady-state conditions. This voltage rises to +5.7VDC for about 100msec when relay configurat on is changed.

5-19

Service Information

5-20

6

Replaceable Parts

Introduction

This section contains replacement parts information, sche­matic diagrams, and component layout drawings for the
Model 7035.

Parts lists

Parts lists for the various circuit boards are included in tables
integrated with schematic diagrams and component layout
drawings for the boards. Parts are listed alphabetically in
order of circuit designation.

Ordering information

To place an order, or to obtain information concerning
replacement parts, contact your Keithley representative or
the factory (see inside front cover for addresses). When
ordering parts, be sure to include the following information:

1. Card model number 7035

2. Card serial number

3. Part description

4. Circuit description, if applicable

5. Keithley part number

Factory service

If the card is to be returned to Keithley Instruments for repair,
perform the following:

1. Complete the service form at the back of this manual
and include it with the card.

2. Carefully pack the card in the original packing carton or
the equivalent.

3. Write ATTENTION REPAIR DEPT on the shipping
label.

NOTE

It is not necessary to return the mainframe
with the card.

Component layouts and schematic
diagrams

Component layout drawings and schematic diagrams are
included on the following pages integrated with the parts
lists:

Table 6-1 — Parts List, Relay Card for Model 7035.

7035-100 — Component Layout, Relay Card for Model

C7035.

7035-106 — Schematic, Relay Card for Model 7035.

Table 6-2 — Parts List, Mass-Terminated Connector Card

for Model 7035.

7035-170 — Component Layout, Mass-Terminated Con-

nector Card for Model 7035.

7035-176 — Schematic, Mass-Terminated Connector Card

for Model 7035.

Table 6-3 — Parts List, Model 7011-KIT-R 96-pin Female

DIN Connector Kit.

6-1

Replaceable Parts

Table 6-1

Relay card for Model 7035 parts list

Circuit
designation Description

2-56 × 3/16 PHILLIPS PAN HEAD SCREW
(RELAY BOARD TO SHIELD)
2-56 × 5/8 PHILLIPS PAN HEAD FASTENER FA-245-1
2-56 × 5/16 PHILLIPS PAN HEAD SEMS SCREW
(CONNECTOR TO SHIELD)
4-40 × 3/16 PHILLIPS PAN HEAD SEMS SCREW 4-40 × 3/16PPHSEM
4-40 PEM NUT FA-131
EJECTOR ARM 7011-301B
IC, SERIAL EPROM, 24C01P IC-737
ROLL PIN (FOR EJECTOR ARMS) DP-6-1
SHIELD 7011-305C
STANDOFF, 2 CLEARANCE ST-204-1

C101-107, 112,
114,116,123,125
C108,113,115 CAP, 150pF, 10%, 1000V, CERAMIC C-64-150P
C109,111 CAP, 1mF, 20% 50V, CERAMIC C-237-1
C110 CAP, 0.001mF, 20%, 500V, CERAMIC C-22-.001
C122,124 CAP, 10mF, -20+100% 25V, ALUM ELEC C-314-10

J1002,1003 CONN, 48-PIN, 3-ROW CS-736-2

K101-136 RELAY, ULTRA-SMALL POLARIZED, TF2E-5V RL-149

CAP, 0.1mF, 20% 50V, CERAMIC C-365-.1

Keithley
part no.

2-56 × 3/16PPH

2-56 × 5/16PPHSEM

P2001 CONN, 32-PIN, 2-ROW CS-775-1

Q101 TRANS, NPN PWR, TIP31 (T0-220AB) TG-253
Q102 TRANS, N CHAN MOSPOW FET, 2N7000 (T0-92) TG-195

R101,102 RES, 560, 10%, 1/2W, COMPOSITION R-1-560
R103 RES, 1K, 1%, 1/8W, METAL FILM R-88-1K
R104 RES, 2.49K, 1%, 1/8W, METAL FILM R-88-2.49K
R105 RES, 1.15K, 1%, 1/8W, METAL FILM R-88-1.15K
R106 RES, 10K, 5%, 1/4W, COMPOSITION OR FILM R-76-10K
R107 RES, 220K, 5%, 1/4W, COMPOSITION OR FILM R-76-220K

S107 SOCKET S0-72

ST101 4-40 ×

U101-105 IC, 8-BIT SERIAL-IN LATCH DRIVER, 5841A IC-536
U106 IC, RETRIG MONO MULTIVIB, 74HC123 IC-492
U107 PROGRAM 7035-800A01
U108 IC, AJD SHUNT REGULATOR, TL431CLP IC-677

0.812 STANDOFF ST-137-20

6-2

Table 6-2

Mass-terminated connector card for Model 7035 parts list

Replaceable Parts

Circuit
designation Description

2-56 × 3/16 PHILLIPS PAN HEAD SCREW (FOR SHIELD) 2-56 × 3/16PPH
2-56 × 3/8 PHILLIPS PAN HEAD SCREW (FOR BRACKET) 2-56 × 3/8PPH
2-56 × 7/16 PHILLIPS PAN HEAD SCREW
(FOR SHIELD AND SHIMS)
4-40 × 1/4 PHILLIPS PAN HEAD SEMS SCREW
(RELAY BOARD TO CONNECTOR BOARD)
BRACKET 7011-307
CONNECTOR SHIM 7011-309A
SHIELD 7011-311A
STANDOFF ST-203-1

J1004 CONN, 96-PIN, 3-ROW CS-514

P1002,1003 CONN, 48-PIN, 3-ROW CS-748-3

Table 6-3

Model 7011-KIT-R 96-pin female DIN connector kit parts list

Keithley

Description

96-PIN FEMALE DIN CONNECTOR CS-787-1
BUSHING, STRAIN RELIEF BU-27
CABLE ADAPTER, REAR EXIT (INCLUDES TWO CABLE
CLAMPS)
CONNECTOR HOUSING CS-788

part no.

CC-64

Keithley
part no.

2-56 × 7/16PPH

4-40 × 1/4PPHSEM

6-3

43 2

7035-170

NO.

A

1

DATEENG.REVISIONECA NO.LTR.

D

D

WARNING: USER SUPPLIED

C

J1004

P1003

LETHAL VOLTAGE MAY BE
PRESENT ON CONNECTORS
OR P.C. BOARD.

!

REFER TO MANUAL FOR
MAXIMUM VOLTAGE
RATING OF CONNECTORS.

P1002

C

B

NOTE: FOR COMPONENT INFORMATION, PLEASE REFER TO PRODUCT STRUCTURE.

B

A

A

QTY.NEXT ASSEMBLYMODEL

1 OF 1

SCALEDATE

KEITHLEY

KEITHLEY INSTRUMENTS INC.

CLEVELAND, OHIO 44139

DIM ARE IN IN. UNLESS OTHERWISE NOTED

DIM. TOL. UNLESS OTHERWISE SPECIFIED

XX=+.01
XXX=+.005

ANG.=+1
FRAC.=+1/64

2/18/97

CAB

DO NOT SCALE THIS DRAWING

1:1

APPR.DRN

TITLE

C

NO.

43 2

USED ON

COMPONENT LAYOUT

CONNECTOR BOARD

7035-170

1

PG

Index

A

AC frequency response 5-14
Analog matrix maximum signal

levels 5-1

B

Backplane jumpers 2-1
Backplane row jumpers 4-2
Basic matrix configuration (5 × 6) 2-1
Block diagram 6-11

C

Card connections and installation 4-1
Card installation 4-18
Card removal 4-18
Channel assignments 5-2
Channel functionality test 6-10
Channel resistance tests 6-3
Closing and opening channels 5-4
Common-emitter characteristics

curves 5-12

Component layouts and schematic dia-

grams 7-1

Configuring digital I/O input pull-up

resistance 4-4

Configuring digital I/O output

logic 4-4
Contact potential tests 6-6
Controlling devices using pull-up

resistors 3-2
Controlling pull-up devices 3-1

D

DC parameter checks 5-11
Differential and common-mode

isolation test 6-8
Differential switching 2-3
Digital I/O configuration 3-1
Digital I/O connections 4-2
Digital I/O input channel control 6-13
Digital I/O maximum signal

levels 5-1
Digital I/O output channel

controls 6-13
Digital inputs 3-3
Dgital outputs 3-1

E

Environmental conditions 6-2

i-1

F

Factory service 7-1
Features 1-1
Four-terminal ohms measurements 5-8

G

General information 1-1
Ground loops 5-14

H

Handling and cleaning

precautions 6-1

Handling precautions 1-2, 4-1

I

ID data circuits 6-12
IEEE-488 bus operation 5-5
Input channels 5-1
Input connection scheme 4-17
Inspection for damage 1-2
Instruction manual 1-2

J

Jumper installation 4-2
Jumper removal 4-2

K

Keeping connectors clean 5-14

M

Magnetic fields 5-13
Mainframe control of the card 5-1
Mainframe matrix expansion 2-8
Manual addenda 1-2
Matrix configuration 2-1
Matrix connections 4-2, 6-2
Matrix expansion 2-5
Matrix relay control 6-13
Matrix relay power control 6-13
Matrix switching examples 5-7
Measurement considerations 5-12
Mixing card types 2-8
Model 7022 installation and

removal 4-18

Multi-pin (mass termination)

connector card 4-5

N

Narrow matrix expansion (4 × 12

matrix) 2-6

O

Offset current tests 6-4
Operation 5-1
Optional accessories 1-3
Ordering information 7-1
Output channels 5-1
Output connection schemes 4-16

P

Partial matrix implementation 2-9
Parts lists 7-1
Path isolation 5-12
Path isolation tests 6-7
Performance verification 6-2
Power-on safeguard 6-13
Power limits 5-1
Principles of operation 6-11
Pull-up resistors 4-3

R

Radio frequency interference 5-13
Reading digital I/O input channels 5-6
Reading input channels 5-5
Recommended equipment 6-2
Repacking for shipment 1-3
Replaceable parts 7-1

S

Safety symbols and terms 1-2
Scanning channels 5-4
Scanning output channels 5-5
Sensing 2-4
Separate switching systems 2-5
Service information 6-1
Shipping contents 1-2
Single-card system 4-11
Single-ended switching 2-3
Special handling of static-sensitive

devices 6-11
SMU connections 2-4
Specifications 1-2

i-2

T

Thick film resistor network testing 5-7
Transistor testing 5-10
Troubleshooting 6-14
Troubleshooting access 6-14
Troubleshooting equipment 6-14
Troubleshooting procedure 6-14
Turning channels on and off 5-5
Two-card switching systems 2-5
Two-card system 4-12
Two-mainframe system 4-14
Typical connection techniques 4-8
Typical digital I/O connection

schemes 4-16

Typical matrix connection

schemes 4-11

Typical matrix switching schemes 2-2

U

Unpacking and inspection 1-2

V

Voltage divider checks 5-8
Voltage source jumper 4-2

W

Warranty information 1-2
Wide matrix expansion (10 × 6

matrix) 2-7

i-3

Service Form

Model No. Serial No. Date

Name and Telephone No.

Company

List all control settings, describe problem and check boxes that apply to problem.

Intermittent

❏

❏

IEEE failure
Front panel operational

❏

Display or output (check one)

Drifts

❏
❏

Unstable

❏

Overload

❏

Calibration only

❏

Data required

(attach any additional sheets as necessary)

Show a block diagram of your measurement system including all instruments connected (whether power is turned on or not).
Also, describe signal source.

Analog output follows display

❏

❏

Obvious problem on power-up
All ranges or functions are bad

❏

Unable to zero

❏
❏

Will not read applied input

❏

CertiÞcate of calibration required

Particular range or function bad; specify

❏

❏

Batteries and fuses are OK
Checked all cables

❏

Where is the measurement being performed? (factory, controlled laboratory, out-of-doors, etc.)

What power line voltage is used? Ambient temperature? °F

Relative humidity? Other?

Any additional information. (If special modiÞcations have been made by the user, please describe.)

Be sure to include your name and phone number on this service form

.

Keithley Instruments, Inc.

28775 Aurora Road
Cleveland, Ohio 44139

Printed in the U.S.A.