JVC XID8600-DS Service Manual
SERVICE MANUAL
CARD PRINTER
XID8600-DS
No.HD017 <Rev.001>
2014/11
SPECIFICATION
XID8600
Specifications
Recording system Dye sublimation retransfer
Paper feed mode Automatic
Recording density 600 dpi
Reproduction gradation 256 levels each for Y, M and C
2 levels for Resin K
Interface USB 2.0 (Hi-Speed/Full-Speed)
Ethernet (100BASE-TX/10BASE-T)
Operating environment conditions Temperature: 15°C to 30°C
(When peel-off ink, UV ink is used: 17 °C to 28 °C)
Humidity: 35 % to 70 % No condensation
(When peel-off ink, UV ink is used: 35 % to 60 %)
Storage environment co nditions <Printer unit>
Temperature: -15°C to 55°C
Humidity: 20 % to 80 %
<Printing media (retransfer film or ink ribbon) /card>
Temperature: 5 °C to 25 °C
Humidity: 40 % to 60 %
Power supply AC 100 V - 120 V, 50 Hz/60 Hz
AC 220 V - 240 V, 50 Hz/60 Hz
Current consumption 3.5 A (100 V system)
1.6 A (200 V system)
Power consumption 310 W (maximum power when all options are installed)
Mass approx. 14.6 kg (excluding optional built-in items)
Dimensions 343 mm x 360 mm x 322 mm (W x H x D)
Accessories
Please check to ensure that the printer accessories are in place when unpacking the product package.
• CD-ROM× 1
• Getting started guide× 1
• Read Me First × 1
• Power Cord (2 m)× 2
• Cleaning Card× 1
• Card Stacker× 1
• USB 2.0 Cable (2 m) × 1
•Gloves× 1
• Card Pickup× 1
Products Sold Separately
To purchase these items, please consult our authorized dealers.
YMCK (1000 frames/roll) Set Model: DIC10216
YMCK-PO(750 frames/roll) Set Model: DIC10218
Ink Ribbon (YMCKK) 750 frames/roll Model: DIC10217
Ink Ribbon (YMCK-UV) 750 frames/roll Model: DIC10313
Retransfer Film 1000 frames/roll Model: DIC10319
Cleaning Kit Model: DIK10044
Set incl. 10 print head cl eaning swab s, 10 cleaning tissues for rolle rs and 10 special cleaning cards
Magnetic Stripe Encoder Head Cleaning Cards Model: DIC10311
Box of 10 cards
1-2 (No.HD017<Rev.001>)
SECTION 1
r
PRECAUTION
1.1 SAFETY PRECAUTIONS
Prior to shipment from the factory, JVC products are strictly inspected to conform w ith th e rec og niz ed pro duc t s afe ty and electrical codes of the countries in which they are to be
sold.However,in order to maintain such compliance, it is equally
important to implement the following precautions when a set is
being serviced.
1.1.1 Precautions during Servicing
(1) Locations requiring special caution are denoted by labels
and inscriptions o n the cab inet, chassis and certa in parts of
the product.When performing service, be sure to read and
comply with these and other cautionary notices appearing
in the operation and service manuals.
(2) Parts identif ied by the symbol and shade d ( ) parts
are critical for safety.
Replace only with specified part numbers.
NOTE :
Parts in this category also include those specifi ed to
comply with X-ray emission standards for products
using cathode ray tubes and those specified for
compliance with various regulations regarding spurious radiation emission.
(3) Fuse replacement caution notice.
Caution for continued protection against fire hazard.
Replace only with same type and rated fuse(s) as specified.
(4) Use specified internal wiring. Note especially:
• Wires covered with PVC tubing
• Double insulated wires
• High voltage leads
(5) Use sp ec ifie d i n su la ting materials for hazardous live parts.
Note especially:
• Insulation Tape
• PVC tubing
•Spacers
• Insulation sheets for transistors
• Barrier
(6) When replacing AC primary side components (transformers,
power cords, noise blocking capacito rs, etc.) wrap ends of
wires securely about the terminals before soldering.
Fig.1-1-1
(7) Observe that wires do not contact heat producing parts
(heatsinks, oxi de metal film resi stors, fu sible re sistors, etc.)
(8) Check that replaced wires do not contact sharp edged or
pointed parts.
(9) When a power cord has been replaced, check that 10-15
kg of force in any direction will not loosen it.
Power cord
cathode ray tubes and other parts with only the specified
parts. Under no circumsta nces atte mpt to m odify these circuits.Unauthorized modification can increase the high voltage value and cause X-ray emission from the cathode ray
tube.
(12) Crimp type wire connector In such cases as when replac-
ing the power transformer in sets where the connections
between the power cord and power trans former primary
lead wires are performed using crimp type connectors, if
replacing the connec tors is unavoidabl e, in order to p revent
safety hazards, perform carefully and precisely according
to the following steps.
• Connector part number :E03830-001
• Required tool : Connector crimping tool of the proper
type which will not damage insula ted part s.
• Replacement procedure
a) Remove the ol d conn ector b y cutting t he wi res at a
point close to the connector.Important : Do not reuse a connector (discard it).
cut close to connector
Fig.1-1-3
b) Strip about 15 mm of the in sulat ion fr om the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
15 mm
Fig.1-1-4
c) Align the lengths of the wires to be connected. In-
sert the wires fully into the connector.
Metal sleeve
Connector
Fig.1-1-5
d) As shown in Fig.1-1-6, use the crimping tool to
crimp the me tal sleeve at t he center posit ion. Be
sure to crimp fully to the complete closure of the
tool.
1.25
2.0
5.5
Crimping tool
Fig.1-1-6
e) Check the four points noted in Fig.1-1-7.
Not easily pulled free
Crimped at approx. cente
of metal sleeve
Fig.1-1-2
(10) Also check areas surrounding repaired locations.
(11) Products us ing cathod e ray tubes (CRTs) In regard to such
products, the cathode ray tubes themselves, the high voltage circuits, and related circuits are specified for compliance with recognized codes pertaining to X-ray emission.
Consequently, when servicing these products, replace the
Conductors extended
Wire insulation recessed
more than 4 mm
Fig.1-1-7
(13) Battery replacement caution notice.
CAUTION RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECTIVE TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE
INSTRUCTIONS.
(No.HD017<Rev.001>)1-3
1.1.2 Safety Check after Servicing
Examine the area surrounding the repaired location for damage
or deterioration. Observe th at screws, parts and wires have been
returned to original positions, Afterwards, perform the following
tests and confirm the specified values in order to verify compliance with safety standards.
(1) Insulation res is tanc e test
Confirm the sp ecified insul ation resistance or greater between power cord plug prongs and externally exposed
parts of the set (RF term inals, antenna termi nals, video and
audio input and output terminals, microphone jacks, earphone jacks, etc.).See table 1 below.
(2) Dielectric strength test
Confirm specified dielectric strength or greater between
power cord plug prongs and exposed accessible parts of
the set (RF terminals, antenna terminals, video and audio
input and output terminals, microphone jacks, earphone
jacks, etc.). See Fig.1-1-11 below.
(3) Clearance distance
When replacing primary circuit components, confirm specified clearance distance (d), (d') between soldered terminals, and between terminals and surrounding metallic
parts. See Fig.1-1-11 below.
d
Chassis
d'
Power cord
primary wire
Fig.1-1-8
(4) Leakage current test
Confirm specified or lower leakage current between earth
ground/power cord plug prongs and externally exposed accessible parts (RF t erminals, antenna terminals, vi deo and
audio input and output terminals, microphone jacks, earphone jacks, etc.).
Measuring Method : (Power ON) Insert load Z between
earth ground/power cord plug prongs and externally exposed accessible parts. Use an AC voltmeter to measure
across both terminals of load Z. See Fig.1-1-9 and following Fig.1-1-12.
ab
Externally
exposed
accessible part
Z
V
c
A
Fig.1-1-9
(5) Grounding (Clas s 1 mode l only )
Confirm specified or lower grounding impedance between
earth pin in AC inlet and externally exposed accessible
parts (Video in, Video out, Audio in, Audio out or Fixing
screw etc.).Measuring Metho d:
Connect milli ohm meter between earth pin in AC inlet and
exposed accessible parts. See Fig.1-1-10 and grounding
specifications.
AC inlet
Earth pin
Exposed accessible part
MIlli ohm meter
Grounding Specifications
Region
USA & Canada
Europe & Australia
Grounding Impedance (Z
Z 0.1 ohm
Z 0.5 ohm
)
Fig.1-1-10
AC Line Voltage
100 V
100 to 240 V
110 to 130 V
110 to 130 V
200 to 240 V
Region
Japan
USA & Canada
Europe & Australia
Insulation Resistance (R
R 1 M /500 V DC
1 M R 12 M /500 V DC
R 10 M /500 V DC
)
Dielectric Strength
AC 1 kV 1 minute
AC 1.5 kV 1 minute
AC 1 kV 1 minute
AC 3 kV 1 minute
AC 1.5 kV 1 minute
(
Class
(
Class
Clearance Distance (d), (d'
d, d' 3 mm
d, d' 4 mm
d, d' 3.2 mm
d 4 mm
)
d' 8 mm (Power cord
d' 6 mm (Primary wire
)
Fig.1-1-11
AC Line Voltage
100 V
110 to 130 V
110 to 130 V
220 to 240 V
Region
Japan
USA & Canada
Europe & Australia
Load Z Leakage Current (i)
1
0.15
1.5
2
50
i 1 mA rms
i 0.5 mA rms
i 0.7 mA peak
i 2 mA dc
i 0.7 mA peak
i 2 mA dc
a, b, c
Exposed accessible parts
Exposed accessible parts
Antenna earth terminals
Other terminals
Fig.1-1-12
NOTE :
These tables are unofficial and for reference only. Be sure to confirm the precise values for your particular country and locality.
)
)
)
1-4 (No.HD017<Rev.001>)
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
2.1 MODEL NAME
Model name of printers
XID8600-DS : Dual Side Model
Basic Struct ure
Model Name Convey Unit
XID8600-DS Dual Side
2.2 Model name of built in option units. (Sell separately)
Product name Description Remarks Appended goods
CF-7BR Bend Remedy Unit Remedy the bend of card after retransfer • Pressurized spring
ASSY
•Fixed screw
• Model label
CF-7MGS MG Encoding Unit (ISO) In accordance with ISO7810, 7811/2 MG stripe card
Only for dual side model (built in flip unit)
CF-7CRW Standard Contact IC R/W In accordance with ISO7816 IC card PC/SC, USB connect R/W
When it is installed to the printer, USB or Ethernet is selectable
CF-7CCS ISO Contact IC Case In accordance with ISO7816 IC card Coupled with the ISO MG
encoding unit.
• Connection wire
•Fixed screw
• Model label
• IC contact cable
• USB Cable
•Fixed screw
• Model label
• Option bracket
• GND wire
•Drive board
• Contact label
•Fixed screw
• Model label
2.3 Life time of each p arts
2.3.1 About thermal head
120,000 passes
(Approximately equivalent to 30,000 prints by using 4 colors, YMCK ink ribbon)
The life time of th ermal head is de fined a s the time period when th e heat ing elem ent of the the rmal h ea d is br oken caus ed by wearing
off the surface protective material.
2.3.2 Life time
• Durable parts
1) Heater : 2,000 Hours
2) Thermal Head : 120,000 passes
3) Motor (DC motor ) : 100,000 panels
4) Heat Roller : 100,000 pan els
5) Belt : 100,000 panels
• Consumable parts
Life time to exchange is estimated based on enforcing daily maintenance.
1) Fan Filter : about 1 year
2) Cleaning Roller : about 1 year
• Life time for mechanism
100,000 cards printing for dual side printing with standard maintenance
• MTBF exclude life time parts is more than 12,000 hours
Life time to exchange
Life time to exchange
(No.HD017<Rev.001>)1-5
2.4 Name and functions of parts
2.4.1 Exterior
Display Panel
Printer door
Power Switch
2.4.2 Internal mechanism
Retransfer heating roller
Bend Remedy
Heat Roller
Card Hopper
NG Card Exit
Preliminary screw hole
Space for input
out put connectors
Security Slot
Cooling Fan
Contactless IC Encoder install space
Card Convey
Section
AC Inlet
Host Interface
Mag Encoder Unit
Card Exit
Card stacker
Communication Port for Laminator
Card hopper
Card stacker
Re-Transfer
Film Cassette
JOG Dial
Retransfer Film
Thermal head
Cleaning Roller
Card Convey Unit for
Single Sided or Dual Sided
IC Contact
Ink Ribbon
Ink Cassette
JOG Dial
RF-ID Antenna
1-6 (No.HD017<Rev.001>)
2.5 ATTACHING THE SEPARATELY SOLD PARTS
r
2.5.1 Preparation
Before connecting the sep arately sol d parts, remove th e top c over unit and the rear cover to pull open the MAIN Board.
(1) Remove the tw o s crews a ttac hi ng f rom the rear side of the
main unit.
Top cover unit
(4) Remove the rear cover by pulling it open to the rear side.
Rear cove
Screw:
QYSDSP4012NA x 2
Rear cover
(2) Open the case cover,then remove the one screw.
Case cover
Screw
(3) Remove th e top cover unit by sliding it to the direction of the
arrow.
Top cover unit
22
(5) Disconnect the wire connected to the MAIN Board.
Release the wires from the wire clamp.
Disconnect the connector from the turn unit.
(Only the models with turn unit)
(6) Remove the four screws attaching the brackets that fix the
MAIN Board.
Screw : QYSDST3006 x 4
MAIN Board
1
Slide the top cover unit
to the rear side about
10 mm, and then pull it up.
(7) Pull open the MAIN Board, and hook the two brackets at
the bottom of the MAIN Board to the f rame of the main unit.
Main board
• Be careful not to catch wires in between.
(No.HD017<Rev.001>)1-7
2.5.2 Attaching the reform H unit
r
A
Note:
After mounting the reform H unit, be su re to ch eck th e relevant item referring to "2.6 Check details after mounting
separately sold parts".
(1) Insert the reform H unit, and fix it with a screw.
(2) Fix the bracket with an attaching screw.
Reform H unit
* When attaching the reform H unit,
be careful not to damage the heat
roller with the bracket.
Bracket
2.5.3 Attaching the IC contact unit
Note:
After mounting the IC contact unit, be sure to check the
relevant item referring to "2.6 Check details after mounting separately sold parts".
(1) Remove the screw attaching the turn unit from the front
side of the main unit.
Screw :
QYSDST3006NA
Screw :
QYSDST3006NA
Screw :
QYSDST3006NA
Insert the tip of the
shaft into the front
plate.
(3) Remove the dummy connector connected to the CN3 on
the MAIN Board. (Only when attaching the reform H unit)
MAIN
Board
CN3
Dummy
connecto
(4) Guide the wires from the reform H unit through the wire
clamps as shown in the drawing, and then connect the
wires to the MAIN Board.
(2) Remove the wires , which come fro m the turn unit, fro m the
wire clamp.
Wire clamp
(3) Remove the three screws attaching the turn unit, and then
pull out the turn unit. (Only the models with turn unit)
Turn unit
Screw :
QYSDST3006NA x 3
Wire clamp
MAIN Board
CN2
s the reform H unit moves up and down during operation,
be sure to allow about 1 to 2 cm wire slack.
1-8 (No.HD017<Rev.001>)
CN3
(4) Mount the IC contact unit.
(6) Connect the wire from the IC contact unit following the
drawing below.
B
A
IC Contact unit
Screw :
QYSDST2604NA x 2
Slide the IC contact unit into the
hook of the bracket on the main unit.
Hook
IC Contact
unit
Align the screw holes, make sure that
the IC contact unit does not move, and
then fix the IC contact unit with the screws.
(5) Attach the IC CONTACTIFC Board.
Screw : QYSDST3006NA x 2
IC CONTACTIFC Board
Insert the IC CONTACTIFC
Board into the bracket
on the main unit.
CN4 CN1 CN3
IC CONTACTIFC
Board
Run the wires from the IC contact
unit through this wire clamp.
CN4
CN3
View A
Run the wires through
this wire clamp.
Fix the wires with the two
wire clamps. (Tighten the
wire clampsas shown in the
picture below.)
Be careful to prevent wires from
touching nearby rotating objects
such as belts/gears.
CN2
Connect the free PH10-pin
connector of the jump wire.
Jump wire
IC CONTACTIFC Board
Fold back, and then run the
excess of the wire (red),
connected to the CN4, through
the wire clamp as shown in the
drawing.
View B
(No.HD017<Rev.001>)1-9
(7) Reattach the turn unit.
A
(c)
fter attaching this screw, attach
another two screws.
Screw : QYSDST3006NA x 3
Turn unit
2.5.4 Attaching the MG unit
Note:
After mounting the MG unit, be sure to check the relevant
item referring to "2.6 Check details after mounting separately sold parts".
(1) Mount the MG unit.
Make sure that the wires do not
run over the brackets.
If the wires run over the brackets,
release the wires.
Bearing fitting hole
Make sure that the turn unit bearing
securely fits the hole on the main unit,
and the screw holes align.
Screw : QYSDST3006NA
Push the turn unit from the rear side to
attach the screw.
(8) Connect the wires from the turn unit following the picture
below.
Wire clamp
Be careful to prevent wires from
touching nearby rotating objects
such as belts/gears.
(Tighten the wire clamp
as shown in the picture
above.)
Turn unit
CN1
Align the front end of the
MG unit to the grooves
(a) and (b) of the front
MG Unit
While aligning the
grooves of the MG unit
bracket and the main unit
bracket, lower the back
end of the MG unit.
bracket.
(c)
(a)
(b)
(a)
(c)
(c)
(2) Fix the MG unit with the three screws.
Screw : QYSDST3006NA
Attention of there is
(b)
groove also under (a).
1-10 (No.HD017<Rev.001>)
MG unit
Screw : QYSDST3006NA x 2
(3) Close back the MAIN Board to its original position, and fix
r
MAIN Board
the MAIN Board with the four screws.
Securely hook the two brackets, fixing the
MAIN Board, to the frame of the main unit.
(4) Connect the wires from the MG unit an d the turn unit follow-
ing the drawing below.
Connect the MG unit and the board bracket, and fix them with screws.
Wire : QUB030-05HMHM-E
Screw : QYSDST3006NA x 2
Wire from the turn unit CN1
View A
MAIN Board
Coaxial connector
Make sure that the coaxial
connector is not loose.
Allow about 5 mm slack to
enable the cable to move.
A
B
The cam gear and the wire should be parted.
MG UNIT
Run the wires from the turn
unit and the MG unit togethe
through this wire clamp, and
fix them.
CN19
CN15
MAIN Board
MG Unit
MG unit accessories
Wire from the
turn unit CN1
Wire clamp
MAIN Board
MAIN Board
CN19CN15
2.5.5 Attaching the IC R/W unit
Note:
After mounting the IC R/W unit, be sure to check the relevant item referring to "2.6 Check details after mounting
separately sold parts".
(1) Attach the IC R/W unit to the plate.
QYSPSPH3006NA x 3
Organize the head wire so that it does not
touch the rotating parts such as belts/gears,
and then fix the head wire with the wire clamp.
Make sure that the wires do not touch the encoder.
View B
Opened MAIN Board
IC R/W Unit
QZW0326-002 x 3
(No.HD017<Rev.001>)1-11
(2) Mount the IC R/W unit.
Run the earth wire under
the wires from the FRONT Board.
Screw :
Screw :
QYSDST3006NA
Wire :
QUB340-07DMDM-E
QYSDSF3008NA x 2
IC R/W Unit
(3) Connect th e wires f rom the IC R/W un it foll owin g the dra w-
ing below.
Connect the supplied USB cable
and the connector J1 on the MAIN Board.
Wire clamp
IC R/W Unit
Connect the supplied wire (10-pin)
to the connector CN5 on the
IC CONTACTIFC Board.
Wire clamp
CN5 J1
J3
For direct connectio n of the IC R/ W unit and a PC, conn ect
to J3, not to J1.
Note that the IC R/W unit c annot be recogn ized o n the sta tus monitor in the J3 connection.
2.5.6 Attaching the top cover and the rear cover
(1) Attach the to p cover a nd the rear c over in th e reverse r pro-
cedure of disassembly.
1-12 (No.HD017<Rev.001>)
2.6 Check details after mounting separately sold parts
Item Check details Required tools
1 Reform H unit The warpage of the printed card should be within the specs (1.5
mm).
2 IC Contact unit Check the IC contact position mark using a blank card and a
contact label.
• Service mode > Offline Test > Test the IC (Contact).
• If the position is out of sp ecs, Ma inte nance > Off setConta ct to
adjust the positi on. (See 2.6.1 IC contac t position adjustmen t)
The card written with an a pplic ation s hould b e read by the reader.
(Check in the USB and Ethernet connections)
3 MG Unit Service mode > Offline Test > test the MG.
• The test should be finished normally.
The card written with an a pplic ation s hould b e read by the reader.
• There is no adjustm ent for an MG un it after mounti ng because
MG units are shipp ed after being position adjust ed. C hec k for
normal operation only.
4 Running after mounting the
separately sold parts
Test for normal printing on about 10 cards
• Service mode > Offline Test > print
(For all separately sold parts)
Item Item Conditions & specs Test point
5 Safety test (for
all separately
sold parts)
Withstand
voltage test
Insulation resistance test
Grounding
continuity test
Timer Leak current Test voltage (With the POWER SW: ON)
2 to 3 sec. 30mA AC1600±50V
Test voltage Insulation resistance value
DC 500V 100MΩ and over
Timer Test current Spec value (With the POWER SW: ON)
3 to 4 sec. AC25A 0.1Ω or under
(Without power cord)
Blank card
Blank card, Contact label
Contact IC card
Contact IC reader
MG card
MG reader
Evaluation card
GND C on the AC inlet in the
drawing below
|
Bipolar B on the po wer cor d in
the drawing below
Screw A on the top left of the
rear panel in the drawing belo w
|
GND C on the AC inlet in the
drawing below
A
C
B
(No.HD017<Rev.001>)1-13
2.6.1 IC contact position adjustment
Apply a contact label (part number: KXL46372-001) on the IC
chip of a contact IC card.
Select the IC contact test from “off line test” in the service mode
to perform the test.
After the test, measure the IC contact position mark on the contact label using a vernier caliper to check if the position stays
within the specs.
If the position does not stay wi thin the spec s, correct the po sition
in the “OffsetContact” mode in the service mode.
When the position is corrected, turn off the power and turn it on
again before testing the IC contact.
(Specs)
direction
IC contact
position specs
direction
a
b
Contact label
(part number:KXL46372-001)
c
d e f
a : 10.25 ~ 12.25 mm
b : 17.87 ~ 19.87 mm
c : 19.23 ~ 20.93 mm
d : 21.77 ~ 23.47 mm
e : 24.31 ~ 26.01 mm
f : 26.85 ~ 28.55 mm
2.6.2 Optional installed label
When installing opt ional unit after ship ping from JVC, mark c orresponding col umn of option built- in label and stick model label attac hed
with optional unit to secure traceability.
Model label attached with option
Optional installed label
(ex. CF-7MGS)
NOTE)This option must be installed, following procedures
in the Service Manual , by a trained and skilled installer in
a facility. Stick the small label on the printer rear after
installation of this option unit.
CF-7MGS
Magnetic Encoder (ISO)
Rear side
Mark corresponding
CF-7MGS
xxxxxxxx
CF-7MGS
xxxxxxxx
Stick model label
For CF-7BR
For CF-7MGS
column
For CF-7CCS
For CF-7CRW
Installed option label
1-14 (No.HD017<Rev.001>)
SECTION 3
DISASSEMBLY
Before disassembly, be sure to turn OFF the power and unplug
the power cord.
3.1 Removing the covers (See figure 1 to figure 5)
(1) Remove the two screws A attaching the top cover unit.
Top cover unit
(3) Slide the top cover unit to the rear side, then remove the
top cover unit.
Top cover unit
A
Fig.1
(2) Open the case cover, then remove the one screw B.
Case cover
B
Fig.2
A
Fig.3
(4) Pull the rear cover unit open to the rear side, then remove
the rear c over unit.
Rear cover unit
Fig.4
(No.HD017<Rev.001>)1-15
(5) Remove the two screws C attaching the side cover U-R
and side cover U-L, then remove the side cover U-R and
side cover U-L.
(2) Remove the two screws D attaching the cover, then re-
move the cover.
C
Side cover U-R
Side cover U-L
C
Fig.5
3.2 Removing the front panel unit (See figure 6 to figure
13)
(1) Remove the Media F CA un it, the Ink F CA u nit, and the CL
Roller unit.
CL Roller unit
D
Cover
Head unit
Fig.7
(3) Remove the four screws E attaching the front panel unit.
• Be careful not to break the cable.
E
Front panel unit
E
Media F CA unit
Ink F CA unit
Fig.6
1-16 (No.HD017<Rev.001>)
E
Cable
E
Fig.8
(4) Disconne ct the two c ables fro m the con nectors o n the front
Tab
Tab
board, then remove the one screw F.
F
Connectors
(6) Front panel unit with the co ver removed.
Front panel unit
Fig.9
(5) Press the two tabs, pull up the cover at the point marked
with an arrow, and then remove the cover.
Tab
Tab Tab
Tab
Cover
Fig.11
(7) Disconnecting the cable from the RFID1 board detaches
the front panel unit from the main unit.
Cable
RFID1 board
Fig.12
(8) Main unit with the front panel unit removed.
Fig.10
Cover
Fig.13
(No.HD017<Rev.001>)1-17
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