JVC TH-A75R Schematic

21189200302

TH-A75R

SERVICE MANUAL

DVD DIGITAL CINEMA SYSTEM

TH-A75R

Area Suffix

B ---------------------- U.K. E ---- Continentl Europe EN --- Northern Europe EV ----- Eastern Europe

SP-XSA75 and SP-XCA75

DVD DIGITAL CINEMA SYSTEM

XV-THA75R

RGB

VOLUME

SOURCE

PHONES

SP-WA75

VIDEO/

FM/AM

TV SOUND

AUDIO

ANGLE

TOP MENU

MENU

DSP

SURROUND

CONTROL

VCR

123

+

S.WFR

Ð

TV

456

SLEEP

789

+

SURR-L

SETTING

Ð

10

TV RETURN

ADJUST

TA/NEWS/INFO

ON

SCREEN

PTY PTY

ENTER

CHOICE

RDS DISPLAY

CHANNEL/ZOOM

TV/VIDEO MUTING

/REW

PLAY

TUNING

DOWN UP

O.T.

STOP

REPLAY

REC

MEMORY

DIMMER

RMÐSTHA75R

DVD CINEMA SYSTEM

TV AUDIO

DVD

SUBTITLE

RETURN DIGEST

OFF

CENTER

S-BACK

0

FM MODE

PTY SEARCH

VCR 1

VCR

DECODE

SOUND

EFFECT

+

TEST

Ð

+

SURR-R

Ð

+10

100+

DVD

RDS

VFP

VOLUMETV VOL

FF/

PAUSE

STROBE

STANDBY

COMPACT

DIGITAL¥EX

SUPER VIDEO

PRO LOGIC

TABLE OF CONTENTS

1 Important Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

2 Disassembly method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

3 Adjustment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

4 Description of major ICs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

No.21189

2003/02

TH-A75R

Important Safety Precautions

1.1 Safety Precautions

(1) This design of this product contains special hardware and

many circuits and components specially for safety purposes. For continued protection, no changes should be made to the original design unless authorized in writing by the manufacturer. Replacement parts must be identical to those used in the original circuits. Services should be performed by qualified personnel only.

(2) Alterations of the design or circuitry of the product should

not be made. Any design alterations of the product should not be made. Any design alterations or additions will void the manufacturers warranty and will further relieve the manufacture of responsibility for personal injury or property damage resulting therefrom.

(3) Many electrical and mechanical parts in the products have

special safety-related characteristics. These characteristics are often not evident from visual inspection nor can the protection afforded by them necessarily be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts which have these special safety characteristics are identified in the Parts List of Service Manual. Electrical components having such features are identified by shading on the schematics and by ( ) on the Parts List in the Service Manual. The use of a substitute replacement which does not have the same safety characteristics as the recommended replacement parts shown in the Parts List of Service Manual may create shock, fire, or other hazards.

(4) The leads in the products are routed and dressed with ties,

clamps, tubings, barriers and the like to be separated from live parts, high temperature parts, moving parts and/or sharp edges for the prevention of electric shock and fire hazard. When service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been returned to normal, after reassembling.

(5) Leakage shock hazard testing)

After reassembling the product, always perform an isolation check on the exposed metal parts of the product (antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control shafts, etc.) to be sure the product is safe to operate without danger of electrical shock. Do not use a line isolation transformer during this check.

• Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure the leakage current from each exposed metal parts of the cabinet, particularly any exposed metal part having a return path to the chassis, to a known good earth ground. Any leakage current must not exceed 0.5mA AC (r.m.s.).

• Alternate check method Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms per volt or more sensitivity in the following manner. Connect a 1,500 ohm 10W resistor paralleled by a 0.15 µF AC-type capacitor between an

SECTION 1

exposed metal part and a known good earth ground. Measure the AC voltage across the resistor with the AC voltmeter. Move the resistor connection to each exposed metal part, particularly any exposed metal part having a return path to the chassis, and measure the AC voltage across the resistor. Now, reverse the plug in the AC outlet and repeat each measurement. Voltage measured any must not exceed 0.75 V AC (r.m.s.). This corresponds to 0.5 mA AC (r.m.s.).

1.2 Warning

(1) This equipment has been designed and manufactured to

meet international safety standards.

(2) It is the legal responsibility of the repairer to ensure that

these safety standards are maintained.

(3) Repairs must be made in accordance with the relevant

safety standards.

(4) It is essential that safety critical components are replaced

by approved parts.

(5) If mains voltage selector is provided, check setting for local

voltage.

1.3 Caution

Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.

1.4 Critical parts for safety

In regard with component parts appearing on the silk-screen printed side (parts side) of the PWB diagrams, the parts that are printed over with black such as the resistor ( ), diode ( ) and ICP ( ) or identified by the " " mark nearby are critical for safety. When replacing them, be sure to use the parts of the same type and rating as specified by the manufacturer. (Except the JC version)

1-2 (No.21189)

1.5 Safety Precautions (U.K only)

(1) This design of this product contains special hardware and many circuits and components specially for safety purposes. For con-

tinued protection, no changes should be made to the original design unless authorized in writing by the manufacturer. Replacement parts must be identical to those used in the original circuits.

(2) Any unauthorised design alterations or additions will void the manufacturer's guarantee; furthermore the manufacturer cannot

accept responsibility for personal injury or property damage resulting therefrom.

(3) Essential safety critical components are identified by ( ) on the Parts List and by shading on the schematics, and must never

be replaced by parts other than those listed in the manual. Please note however that many electrical and mechanical parts in the product have special safety related characteristics. These characteristics are often not evident from visual inspection. Parts other than specified by the manufacturer may not have the same safety characteristics as the recommended replacement parts shown in the Parts List of the Service Manual and may create shock, fire, or other hazards.

(4) The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be separated from live parts,

high temperature parts, moving parts and/or sharp edges for the prevention of electric shock and fire hazard. When service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been returned to normal, after re-assembling.

1.5.1 Warning

(1) Service should be performed by qualified personnel only. (2) This equipment has been designed and manufactured to meet international safety standards. (3) It is the legal responsibility of the repairer to ensure that these safety standards are maintained. (4) Repairs must be made in accordance with the relevant safety standards. (5) It is essential that safety critical components are replaced by approved parts. (6) If mains voltage selector is provided, check setting for local voltage.

TH-A75R

Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.

(No.21189)1-3

TH-A75R

1.6 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.6.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as DVD players. Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.

1.7 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit. (2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the replace-

ment procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a time

when attaching it to the connector. (3) Handle the flexible cable carefully as it may break when subjected to strong force. (4) I t is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.8 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the DVD pickup unit.

• Apply solder to the short land sections before the flexible wire is disconnected from the connector CN101 on the DVD servo board. (If the flexible wire is disconnected without applying solder, the DVD pickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land sections after connecting the flexible wire.

1-4 (No.21189)

Flexible wire

Short land sections

DVD mechanism assembly

CN101

DVD servo board

1.9 Important for laser products

(1) CLASS 1 LASER PRODUCT (2) DANGER : Invisible laser radiation when open and inter

lock failed or defeated. Avoid direct exposure to beam.

(3) CAUTION : There are no serviceable parts inside the

Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunctions.

(4) CAUTION : The compact disc player uses invisible laser

radiation and is equipped with safety switches which prevent emission of radiation when the drawer is open and the safety interlocks have failed or are de feated. It is dangerous to defeat the safety switches.

TH-A75R

(5) CAUTION : If safety switches malfunction, the laser is able

to function.

(6) CAUTION : Use of controls, adjustments or performance of

procedures other than those specified herein may result in hazardous radiation exposure.

CAUTION Please use enough caution not to see the beam directly or touch it in case of anadjustment or operation check.

VARNING

Osynlig laserstrålning är denna del är öppnad och spårren är urkopplad. Betrakta ej strålen.

VARO

Avattaessa ja suojalukitus ohitettaessa olet alttiina näkymättömälle lasersäteilylle. Älä katso säteeseen.

REPRODUCTION AND POSITION OF LABELS

CLASS 1 LASER PRODUCT

ADVARSEL

Usynlig laserstråling ved åbning, når sikkerhedsafbrydere er ude af funktion. Undgå udsasttelse for stråling.

ADVARSEL

Usynlig laserstråling ved åpning, når sikkerhetsbryteren er avslott. unngå utsettelse for stråling.

WARNING LABEL

(No.21189)1-5

TH-A75R

r

2.1 Main body section

2.1.1 Removing the top cover (See Figs.1 to 4.)

(1) From the right and left sides of the main body, remove the

four screws A attaching the top cover. (See Figs.1 and 2.)

(2) From the back side of the main body, remove the two

screws B attaching the top cover. (See Fig.3.)

(3) Lift the rear section of the top cover, slide the top cover

slightly in the direction of the arrow. (See Fig.4.)

(4) Disengage the engagement sections a of the top cover

from the main body. (See Fig.4.)

Top cover

SECTION 2

Disassembly method

B

Top cove

Rear panel

Fig.3

a

A

Fig.1

Top cover

Fig.4

Fig.2

1-6 (No.21189)

2.1.2 Removing the front panel assembly (See Figs.5 to 8.)

• Remove the top cover. (1) From the left side of the main body, push the section b of

the slide cam using the screw driver, etc. (See Fig.5.) (2) Pull out the tray. (See Fig.5.) (3) Push the tray fitting assembly of the tray in the direction of

the arrow and then remove the tray fitting assembly. (See

Fig.6.) (4) Return the tray into the DVD mechanism assembly. (5) From the bottom side of the main body, remove the four

screws C attaching the front panel assembly. (See Fig.7.) (6) From the top side of the main body, remove the two screws

D attaching the front panel assembly. (See Fig.8.) (7) Disconnect the card wires from the connectors CN206 and

CN207 on the main board. (See Fig.8.) (8) Remove the screw E attaching the lug wire. (See Fig.8.) (9) While opening the hooks c to the right and left sides of the

front panel assembly in the direction of the arrow 1, remove

the front panel assembly in the direction of the arrow 2.

(See Fig.8.)

Reference:

then hold the card wire to the sections d of the barrier. (See Fig.8.)

Front panel assembly

Tray

C

Barrier

TH-A75R

Chassis base

Front panel assembly

Fig.7

Main board

CN207

Slide cam

Front panel assembly

Tray

Fig.5

Fig.6

b

Tray fitting assembly

CN206

d

1

Hook c

Front panel assembly

2

Fig.8

Lug wire

1

Hook c

D E

(No.21189)1-7

TH-A75R

2.1.3 Removing the DVD mechanism assembly (See Fig.9.)

• Remove the top cover.

• Remove the front panel assembly. (1) From the top side of the main body, remove the barrier. (2) Disconnect the card wires from the connectors CN208 and

CN209 on the main board.

(3) Remove the three screws F attaching the DVD mechanism

assembly.

(4) Take out the DVD mechanism assembly from the chassis

base.

Main board

Card wire

F

CN209 CN208

Card wire

Barrier

DVD mechanism assembly

F

Chassis base

Fig.9

2.1.4 Removing the DSP board (See Figs.10 and 11.)

• Remove the top cover. (1) From the top side of the main body, disconnect the card

wires from the connectors CN591 and CN592 on the DSP board. (See Fig.10.)

(2) From the back side of the main body, remove the three

screws G attaching the DSP board. (See Fig.11.)

(3) Remove the DSP board from the section e of the barrier,

take out the DSP board. (See Fig.10.)

Reference:

When attaching the DSP board, hang the DSP board to the section e of the barrier. (See Fig.10.)

2.1.5 Removing the tuner (See Figs.10 and 11.)

• Remove the top cover. (1) From the top side of the main body, disconnect the card

wire from the connector CN1 on the tuner. (See Fig.10.)

(2) From the back side of the main body, remove the two

screws H attaching the tuner. (See Fig.11.)

CN592

DSP board

e

Barrier

Card wires

Card wire

Rear panel

CN591

Fig.10

Fig.11

CN1

Tuner

H

G

1-8 (No.21189)

TH-A75R

2.1.6 Removing the main board (See Figs.12 and 13.)

• Remove the top cover.

• Remove the DSP board.

• Remove the tuner. (1) From the top side of the main body, disconnect the card

wires from the connectors (CN201, CN202, CN204, CN206-CN209) on the main board. (See Fig.12.)

(2) Remove the screw J and two screws K attaching the main

board. (See Fig.12.)

(3) From the back side of the main body, remove the five

screws L attaching the main board. (See Fig.13.)

Card wires

J

CN207 CN202 CN201 CN204

CN208

CN209

K

Card wires

Main board

Fig.12

CN206

2.1.7 Removing the amplifier board (See Figs.13 to 16.)

• Remove the top cover. (1) From the top side of the main body, disconnect the card

wires from the connectors CN701 and CN702 on the amplifier board (See Fig.14.)

(2) Remove the three screws M attaching the amplifier board.

(See Fig.13.)

(3) From the back side of the main body, remove the four

screws N attaching the amplifier board. (See Fig.15.)

(4) Disconnect the connector CN703 on the amplifier board,

take out the amplifier board. (See Fig.14.)

(5) Remove the six screws P attaching the heat sink to the am-

plifier board. (See Fig.16.)

M

Amplifier board

CN703

M

Rear panel

Fig.13

L

N

P

CN702CN701

Fig.14

Rear panel

Fig.15

Heat sink

PP

Amplifier board

Fig.16

(No.21189)1-9

TH-A75R

t

2.1.8 Removing the fan motor (See Figs.17 and 18.)

• Remove the top cover.

• Remove the amplifier board. (1) From the top side of the main body, remove the fan cover.

(See Fig.17.)

(2) Remove the tie band banding the fan motor wire and then

disconnect the fan motor wire from the connector CN174 on the power board. (See Fig.17.)

(3) Remove the screw Q and screw R attaching the fan brack-

et. (See Fig.17.)

(4) Remove the two screws S attaching the fan motor to the

fan bracket. (See Fig.18.)

Reference:

When attaching the screw Q, attach the lug wire of the front panel assembly at the same time.

Fan motor

Front panel assembly

Fan bracket

Q

Lug wire

Fan cover

R

2.1.9 Removing the power board (See Fig.19.)

• Remove the top cover.

• Remove the amplifier board. (1) From the top side of the main body, disconnect the card

wires from the connectors CN172 and CN173 on the power board.

(2) Remove the tie band banding the fan motor wire and then

disconnect the fan motor wire from the connector CN174 on the power board.

(3) Disconnect the power cord from the connector CN101 on

the power board.

(4) Remove the screw T and three screws U attaching the

power board.

Fan motor wire

Tie band

CN174

CN173

CN172

T

Power board

U

Fan motor wire

Tie band

CN174

Power board

Fig.17

S

Fig.18

Fan motor

Fan bracke

CN101

Power cord

Fig.19

Card wires

1-10 (No.21189)

TH-A75R

V

2.2 Front panel assembly section

• Remove the top cover.

• Remove the front panel assembly.

2.2.1 Removing the jack board (See Fig.1.)

(1) From the inside of the front panel assembly, disconnect the

wire from the connector CN403 on the switch board.

(2) Remove the two screws V attaching the jack holder, take

out the jack board together the jack holder.

Jack board

Wire

Jack holder

2.2.2 Removing the switch board (See Figs.2 and 3.)

(1) From the inside of the front panel assembly, disconnect the

wire from the connector CN403 on the switch board. (See Fig.2.)

(2) Remove the eight screws W attaching the switch board,

take out the switch board. (See Fig.2.)

Reference:

In the assembly, attach the switch board after attaching the push buttons and light lens as before. (See Fig.3.)

CN403

W

Switch board

Front panel assembly

Fig.1

Switch board

2.3 DVD mechanism section

• Remove the top cover.

• Remove the DVD mechanism assembly.

2.3.1 Removing the tray (See Figs.1 and 2.)

(1) From the left side of the DVD mechanism assembly, push

the slide cam in the direction of the arrow 1 and then pull out the tray in the direction of the arrow 2. (See Fig.1.)

(2) Push the tray stoppers a in the direction of the arrow 3, pull

out the tray in the direction of the arrow 4. (See Fig.2.)

2.3.2 Attaching the tray (See Fig.2.)

When attaching the tray, insert the tray to the rail of the DVD mechanism assembly and then push the tray in the DVD mechanism assembly.

Tray

2

1

Slide cam

Fig.1

Tray stoppers a

3

4

Wire

CN403

Front panel assembly

W

Fig.2

Push button Push button

Light lens

Fig.3

2.2.3 Removing the standby board (See Fig.4.)

From the inside of the front panel assembly, remove the two screws X attaching the standby board.

X

Front panel assembly

Tray

DVD mechanism assembly

Fig.2

Standby board

Fig.4

(No.21189)1-11

TH-A75R

2.3.3 Removing the tray (See Fig.3.)

(1) From the bottom side of the DVD mechanism assembly,

disconnect the card wires from the connectors CN201 and CN202 on the DVD servo board.

Caution:

Be sure to solder the short land sections b on the flexible wire before disconnecting the flexible wire from connector CN101 on the DVD servo board. If the flexible wire is disconnected without attaching solder, the DVD pickup unit may be destroyed by static electricity.

(2) Release the locks of the connector CN101 (in the direction

of the arrow 1) on the DVD servo board, disconnect the flexible wire.

(3) Release the locks of the connector CN101 on the DVD ser-

vo board in the direction of the arrow 1, disconnect the flexible wire.

Caution:

In the assembly, be sure to remove solders from the short land sections b after connecting the flexible wire to the connector CN101 on the DVD servo board.

(4) While pushing the claw c of the DVD mechanism assembly

in the direction of the arrow 2, remove the DVD servo board in an upward direction.

Flexible wire

Short land sections b

DVD mechanism assembly

Card wire

2.3.4 Removing the clamper base (See Fig.4.)

(1) From the top side of the DVD mechanism assembly, re-

move the four screws A attaching the clamper base.

(2) Remove the clamper base from the bosses d of the loading

base in an upward direction, remove the clamper base from the sections e while sliding it in the direction of the arrow.

DVD mechanism assembly

Boss d

2.3.5 Removing the tray drive board (See Fig.5.)

• Remove the clamper base. (1) From the bottom side of the DVD mechanism assembly, re-

move the solders from the soldered sections f on the tray drive board.

(2) Remove the screw B attaching the tray drive board to the

DVD mechanism assembly.

Soldered sections f

Clamper base

AA

A A

Fig.4

Tray drive board

Section e

Loading base

Section e

CN201

Claw c

DVD servo board

2 22

11

CN101

Fig.3

Card wire

CN202

Claw c

Motor

B

DVD mechanism assembly

Fig.5

1-12 (No.21189)

TH-A75R

2.3.6 Removing the motor (See Fig.6.)

• Remove the clamper base.

• Remove the tray drive board. (1) From the top side of the DVD mechanism assembly, re-

move the belt of the pulley gear.

Note:

Take care not to attach grease on the belt.

(2) Remove the screw C attaching the motor to the DVD mech-

anism assembly.

DVD mechanism assembly

Pulley gear

Belt

C

Motor

Fig.6

2.3.7 Removing the DVD traverse mechanism assembly

(See Figs.7.)

• Remove the DVD servo board.

• Remove the clamper base. (1) From the top side of the DVD mechanism assembly, re-

move the four screws D attaching the DVD traverse mechanism assembly to the loading base.

(2) Take out the DVD traverse mechanism assembly from the

loading base.

DVD traverse mechanism assembly

2.3.8 Removing the DVD pickup unit (See Figs.8 to 10.)

• Remove the DVD servo board.

• Remove the clamper base.

• Remove the DVD traverse mechanism assembly. (1) From the top side of the DVD traverse mechanism assem-

bly, remove the screw E attaching the plate and torsion spring. (See Fig.8.)

(2) Remove the shaft from the section g and then remove the

shaft from the section h. (See Fig.9.)

(3) Disengage the section i of the DVD pickup unit and then re-

move the DVD pickup unit with the shaft. (4) Pull the shaft out of the DVD pickup unit. (5) Remove the two screws F attaching the SW. actuator.

2.3.9 Attaching the DVD pickup unit (See Figs.8,10 to 12)

Reference:

Refer to the explanation of "Removing the DVD pickup unit" on the preceding page. (1) Attach the SW. actuator and shaft to the DVD pickup unit.

(See Fig.10.) (2) Engage the section i of the DVD pickup unit to the shaft of

the DVD traverse mechanism assembly first, and set the

both ends of the shaft of the DVD pickup unit in the sections

g and h of the DVD traverse mechanism assembly. (See

Fig.11.) (3) Slide the DVD pickup unit all the way in the direction of the

arrow. (See Fig.12.) (4) Mesh the lead screw to the section j of DVD pickup unit and

then set the end of the lead screw to the section k. (See

Fig.12.) (5) Attach the torsion spring. (See Fig.8.) (6) Attach the plate. (See Fig.8.)

E

Plate

Torsion spring

DVD pickup unit

D D

DD

Fig.7

Loading base

DVD traverse mechanism assembly

Fig.8

(No.21189)1-13

TH-A75R

t

w

DVD pickup unit

Section i

SW. actuator

Shaft

Fig.9

Section h

Section g

F

DVD pickup unit

Shaf

Section

Shaft

Section

i

Section h

DVD traverse mechanism assembly

Fig.11

Section k

Fig.10

Section j

Lead scre

DVD pickup unit

Fig.12

1-14 (No.21189)

TH-A75R

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2.3.10 Removing the spindle motor board (See Figs.13 and

14.)

• Remove the DVD servo board.

• Remove the clamper base.

• Remove the DVD traverse mechanism assembly. (1) From the top side of the DVD traverse mechanism assem-

bly, remove the feed motor wire that is soldered to the spindle motor board. (See Fig.13.)

(2) From the bottom side of the DVD traverse mechanism as-

sembly, remove the three screws G attaching the spindle motor board. (See Fig.14.)

Spindle motor board

Remove the solders.

Feed moto wire

2.3.11 Removing the feed motor (See Figs.15 to 17.)

• Remove the DVD servo board.

• Remove the clamper base.

• Remove the DVD traverse mechanism assembly. (1) From the top side of the DVD traverse mechanism assem-

bly, remove the feed motor wire that is soldered to the spindle motor board. (See Fig.15.)

(2) Remove the screws H attaching the feed holder assembly

and then take out the feed holder assembly. (See Fig.15.)

(3) Remove the screw J attaching the thrust spring. (See

Fig.16.)

(4) Remove the feed gear and lead screw in the direction of the

arrow. (See Fig.16.)

(5) Remove the two screws K attaching the feed motor. (See

Fig.17.)

Spindle motor board

Remove the solders.

Feed holder assembly

H

Feed motor wire

Feed motor

DVD traverse mechanism assembly

Fig.13

G

DVD traverse mechanism assembly

Fig.14

H

DVD traverse mechanism assembly

Fig.15

G

Feed holder assembly

Lead screw

Feed motor

Feed gear

Thrust spring

J

Fig.16

Feed holder assembly

K

Fig.17

(No.21189)1-15

TH-A75R

SECTION 3

Adjustment

3.1 Test mode

(1) The AC cord is connected after pushing the STOP key and the EJECT key of a main body. (2) Change to test mode, FL indicate "TEST ??". (?? is version)

At this time, TV monitor indicate the firm number " ".

(3) Press PAUSE key of the main body, EEPROM initialize is start.

FL indicate "RDS", EEPROM initialize is complete.

(4) Release the test mode by power to off.

3.2 Up grade

3.2.1 How to UPGRADE

(1) Power to on then mode to DVD. (2) Set the recorded disc.

(Down loaded the up grade program "TH-A75 -Firmware Update Procedure" from Audio Products DIV.

Technological Material of JS-Net .) (3) FL indicate "UPGRADE", press cursol key of the remote controller. (4) TV monitor indication the UPGRADE condition. (5) Upgrade is complete, disc is automatically eject then finish the upgrade.

3.2.2 After UPGRADE

After upgrade, it is should done the EEPROM initialize and confirm the firm number.

(1) Tray close then release the AC cord. (2) The AC cord is connected after pushing the STOP key and the EJECT key of a main body. (3) Change to test mode, FL indicate "TEST ??". (?? is version)

In this time, confrim the TV monitor indicate the firm number "114". (4) EEPROM initialize start by press the PAUSE key of main body.

FL indicate "RDS", EEPROM initialize is complete. (5) Release the test mode by power to off.

1-16 (No.21189)

4.1 UPD784215AGC194 (IC531) : CPU

• Pin layout

75 ~ 51

TH-A75R

SECTION 4

Description of major ICs

76

~

100

1 ~ 25

• Pin function Pin No. Symbol I/O Function

1~8 - - Not use

9VDD-+3.0V 10 X2 I Main system clock input 11 X1 I Main system clock input 12 VSS - GND 13 XT2 - OPEN 14 XT1 I Connect to VSS 15 RESET I Reset for Flash write 16 - - Not use 17 INT0 I Error input0 (detect UNLOCK) 18 INT1 I Error input1 (detect Non Audio) 19 DZF I GND

20~22 - - Not use

23 AVDD - The same potential as VDD 24 AV REF0 - The same potential as VSS 25 - - Not use 26 CS1 I Chip select input port 27 CS2 I Chip select input port 28 CS3 I Chip select input port 29 CS4 I Chip select input port

30~32 - - Not use

33 AVSS - The same potential as VSS

34, 35 - - Not use

36 AV REF1 - The same potential as VDD 37 RX O For flash write 38 TX O For flash write 39 - - Not use 40 DSP_COM I Command (serial 1) 41 DSP_STS O Status (Serial 1) 42 DSP_CLK I Clock (Serial 1) 43 DSP_RDY I Ready 44 - - Not use 45 MIDIO_IN I Data in (Serial 0) 46 MIDIO_OUT O Data out (Serial 0) 47 MICK O Clock (Serial 0)

50

~

26

Pin No. Symbol I/O Function

48 HREQ I HREQ 49 SS O Slave select

50,51 - - Not use

52 DSP_RST O DSP RESET 53 - - Not use 54 DA_CS O Chip select output 55 - - Not use 56 PD/DA O Power down output (RESET) 57 PD O Power down output (RESET)

58~63 - - Not use

64 CODEC_D-OUT O Data out 65 CODEC_D-IN I Data in 66 CODEC_CLK O Clock 67 CODEC_CS O Chip select output 68 DEBUG1 O Debug out port 69 DEBUG2 O Debug out port 70 DEBUG3 O Debug out port 71 GEBUG4 O Debug out port 72 GND - GND

73~75 - - Not use

76 EQ O EQ 77 CTR_TONE O Center tone 78 3D O 3D-Phonic

79, 80 - - Not use

81 VDD - +3.0V

82, 83 - - Not use

84 ANA/T.TUNE O ANALOG./T.TONE 85 LFE.MIX O LFE MIX CONTROL 86 LEF_OUT O LFE OUT CONTROL 87 - - Not use 88 S.MUTE O S.MUTE

89~93 - - Not use

94 TEST O Usual "VSS"

95~100 - - Not use

(No.21189)1-17

TH-A75R

4.2 39VF0207CWHQ01 (IC524) : 2 Mbit multi-purpose flash memory

• Pin layout • Block diagram

A11

A9

A8 A13 A14 A17

WE#

V

DD

NC A16 A15 A12

A7 A6 A5 A4

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Top view

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

OE# A10 CE# DQ7 DQ6 DQ5 DQ4 DQ3 V

SS

DQ2 DQ1 DQ0 A0 A1 A2 A3

Memory Address

• Pin function

Pin No. Symbol Function

1 - 6 A11,A9,A8

Address inputs

A13,A14,A17 7 WE# Write enable 8 VDD Power supply 9 NC Not connect

10 - 20 A16,A15,A12

Address inputs

A7 - A0

21 - 23 DQ0 - DQ2 Data inputs/outputs

24 VSS Ground

25 - 29 DQ3 - DQ7 Data inputs/outputs

30 CE# Chip enable 31 A10 Address input 32 OE# Output enable

CE#

OE#

WE#

X-Decoder

Address Buffers

and

Latches

Control Logic

SuperFlash

Memory

Y-Decoder

I/O Buffers

and

Data Latches

DQ7 - DQ0

1-18 (No.21189)

4.3 MM74HCT32MTC-X (IC521) : Quad 2 input OR gate

• Pin layout & Block diagram

• Truth table

11A 21B 31Y 42A 52B 62Y 7

(TOP VIEW)

14 13 12 11 10 9 8GND

V 4B 4A 4Y 3B 3A 3Y

CC

INPUTS OUTPUT ABY LLL LHH HLH HHH

4.4 74LCX373MTC-X (IC512,IC513) : Octal D-type latch

• Pin layout • Truth table

20 19 18 17 16 15 14D2 13 12 11

VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 LE

OE

HXXZ

LLXQn LHLL LHHH

X: Don't care Z: High impedance Qn: Q outputs are latched at the time when the LE input is tak-

1OE 2Q0 3D0 4D1 5Q1 6Q2 7 8D3 9Q3

10GND

(TOP VIEW)

en to a low logic level.

TH-A75R

INPUTS OUTPUT

LE D Y

• Block diagram

D0

3

D

Q

L

OE

11

LE

1

D1

4

2

Q0

D2 7

D

Q

L

5 Q1

D3

8

D

Q

L

6

Q2

D4

13

D

Q

L

9

Q3

D5

14

D

Q

L

12

Q4

D6

17

D

Q

L

15

Q5

D7

18

D

Q

L

16

Q

L

19

Q6

Q7

(No.21189)1-19

TH-A75R

4.5 AK4586VQ (IC511) : A/D, D/A Converter

• Pin layout

44 - 34

11 - 1

12 - 22

23 - 33

• Pin function

Pin No. Symbol I/O Function

1 XTO O X'tal output pin 2 XTI I X'tal input pin

EXTCLK I External master clock input pin 3 TVDD - Output buffer power supply pin, 2.7V~5.5V 4 VDSS - Digital Ground pin, 0V 5 DVDD - Digital power supply pin, 4.5V~5.5V 6 TX O Transmit channel (through data) output pin 7 MCKO O Master clock output pin 8 LRCK I/O Input/Output channel clock pin 9 BICK I/O Audio serial data clock pin

10 SDTO O Audio serial data output pin 11 SDTI1 I DAC1 audio serial data input pin 12 SDTI2 I DAC2 audio serial data input pin 13 SDTI3 I DAC3 audio serial data input pin 14 INT0 O Interrupt 0 pin 15 INT2 O Interrupt 1 pin 16 CDTO O Control data output pin in 4-wire serial control mode

CAD1 I Chip address 1 pin in I2C bus control mode

17 CDTI I Control data input pin in 4-wire serial control mode

SDA I/O Control data input/output pin in I2C bus control mode

18 CCLK I Control data clock pin in 4-wire serial control mode

SCL I Control data clock pin in I2C bus control mode

19 CSN I Chip select pin in 4-wire serial control mode

CAD0 I Chip address 0 pin in I2C bus control mode

20 DZF2 O Zero input detect 2 pin

OVF O Analog input overflow detect pin 21 AVSS - Analog ground pin, 0V 22 AVDD - Analog power supply pin, 4.5V~5.5V 23 VREFH I Positive voltage reference input pin, AVDD 24 VCOM O Common voltage output pin, AVDD/2 25 DZF1 O Zero input detect 1 pin 26 LOUT3 O DAC3 Lch analog output pin 27 ROUT3 O DAC3 Rch analog output pin 28 LOUT2 O DAC2 Lch analog output 29 ROUT2 O DAC2 Rch analog output pin 30 LOUT1 O DAC1 Lch analog output pin 31 ROUT1 O DAC1 Rch analog output pin 32 LIN I Lch analog input pin 33 RIN I Rch analog input pin 34 PCDD - PLL power supply pin, 4.5V~5.5V 35 R - External resistor pin 36 PVSS - Pll ground pin, 0V 37 RX4 I Receiver channel 4 pin (internal biased pin) 38 SLAVE I Slave mode pin 39 RX3 I Receiver channel 3 pin (internal biased pin) 40 TST I Test pin 41 RX2 I Receiver channel 2 pin (internal biased pin) 42 I2C I Control mode select pin 43 RX1 I Receiver channel 1 pin (internal biased pin) 44 PDN I Power-Down & Reset pin

1-20 (No.21189)

• Block diagram

CSN

CCLK

CDTI

TH-A75R

CDTO

LIN

RIN

LOUT1

ROUT1

LOUT2

ROUT2

LOUT3

ROUT3

ADC HPF

DAC DATTLPF

Audio

I/F

MCLK

SDOUT

BICK

LRCK

SDIN1 SDIN2 SDIN3

uP I/F

Clock

Recovery

DAIF

Decoder

DEM

X'tal

Oscillator

Clock

Generator

Input

Selector

XTI

XTO

MCKO

TX

RX1 RX2 RX3 RX4

SDOUT

BICK LRCK

SDIN1 SDIN2 SDIN3

(No.21189)1-21

TH-A75R

4.6 AK4382AVT-X (IC512) : D/A Converter

• Pin layout

1 2 3 4 5 6 7 8

•Block diagram

CSN

CCLK

Interface

CDTI

uP

16 15 14 13 12 11 10 9

De-empahsis

Control

MCLK

Clock

Divider

VDD

VSS

DZFL

DZFR

8X

LRCK

BICK

SDTI

Audio

Data

Interface

Interpolator

8X

Interpolator

Modulator

PDN

• Pin function

Pin No. Symbol I/O Function

1 MCLK I Master Clock Input Pin 2 BICK I Audio Serial Data Clock Pin 3 SDTI I Audio Serial Data Input Pin 4 LRCK I L/R Clock Pin 5 PDN I Power-Down Mode Pin 6 CSN I Chip Select Pin 7 CCLK I Control Data Input Pin 8 CDTI I Control Data Input Pin

9 AOUTR- O Rch Negative Analog Output Pin 10 AOUTR+ O Rch Positive Analog Output Pin 11 AOUTL- O Lch Negative Analog Output Pin 12 AOUTL+ O Lch Positive Analog Output Pin 13 VSS - Ground Pin 14 VDD - Power Supply Pin 15 DZFR O Rch Data Zero Input Detect Pin 16 DZFL O Lch Data Zero Input Detect Pin

SCF

AOUTL+

AOUTL-

AOUTR+

AOUTR-

1-22 (No.21189)

4.7 AK93C65AF-X (IC510) : EEPROM

• Pin layout

TH-A75R

• Block diagram

DI

CS

PE

VCC

CS

SK

1

2

3

4

8 PIN SOP

INSTRUCTION

REGISTER

NC

8

GND

7

DO

6

DI

5

INSTRUCTION

DECODE,

CONTROL

AND

CLOCK

GENERATION

DATA

REGISTER

ADD.

BUFFERS

16

R/W AMPS

AND

AUTO ERASE

DECODER

DO

16

EEPROM

4096bit

256 x 16

SK

PE

• Pin function

Pin no. Symbol Function

1 PE Program enable (With built-in pull-up resistor) 2 VCC Power supply 3 CS Chip selection 4 SK Cereal clock input 5 DI Cereal data input 6 DO Cereal data output 7 GND Ground 8 NC No connection

NOTE :

The pull-up resistor of the PE pin is about 2.5Mohm (VCC=5V)

VREF

VPP SW

VPP

GENERATOR

(No.21189)1-23

TH-A75R

4.8 AN8703FH-V (IC101) : Frontend processor for DVD

• Pin layout

64 49

1

48

16

33

17 32

• Pin function

Pin No.

Symbol I/O Description 1 LPC1 I Laser input terminal (DVD) 2 LPC01 O Laser drive signal output terminal (DVD) 3 LPC2 I Laser input terminal (CD) 4 LPC02 O Laser drive signal output terminal (CD) 5

VFOSHORT 6 TBAL I Tracking balance control terminal 7 FBAL I Focus balance control terminal 8 POFLT O Track detection threshold level terminal 9 DTRD I Data slice part data read signal input ter-

10 IDGT I Data slice part address part gate signal

11 STANDBY I Standby mode control terminal 12 SEN I SEN(Serial data input terminal) 13 SCK I SCK(Serial data input terminal) 14 STDI I STDI(Serial data input terminal) 15 RSCL I Standard electric current terminal 16 JLINE I Electric current setting terminal of JLine 17 TEN I Reversing input terminal of tracking error

18 TEOUT O Tracking error signal output terminal 19 AGCBAL I Offset adjusting terminal 1 20 ASOUT O Full adder signal output terminal 21 FEN I Focus error output amplifier reversing in-

22 FEOUT O Focus error signal output terminal 23 AGCOFST I Offset adjusting terminal 2 24 MON - Non connect 25 AGCLVL O Output amplitude adjustment for DRC 26 GND2 - Connect to GND 27 VREF2 O VREF2 voltage output terminal 28 VCC2 - Power supply terminal 5V 29 VHALF O VHALF voltage output terminal 30 DFLTON O Reversing output terminal of filter AMP. 31 DFLTOP O Filter AMP. output terminal 32 DCFLT I Capacity connection terminal for filter

I VFOSHORT control terminal

minal(For RAM)

input terminal( For RAM)

output AMP.

put terminal

output

Pin No.

Symbol I/O Description 33 GND3 - Connect to GND 34 RFDIFO - Non connect 35 RFOUT - Connect to TP103 36 VCC3 - Power supply terminal 3.3V 37 RFC O Filter for RF delay correction AMP. 38 DCRF O All addition amplifier capacitor terminal 39 OFTR O OFTR output terminal 40 BDO O BDO output terminal 41 RFENV O RF envelope output terminal 42 BOTTOM O Bottom envelope detection filter terminal 43 PEAK O Peak envelope detection filter terminal 44 AGCG O AGC amplifier gain control terminal 45 AGCO O AGC amplifier level control terminal 46 TESTSG I TEST signal input terminal 47 RFINP I RF signal positive input terminal 48 RFINN I RF signal negative input terminal 49 VIN5 I Internal four-partition (CD) RF input 1 50 VIN6 I Internal four-partition (CD) RF input 2 51 VIN7 - Internal four-partition (CD) RF input 3 52 VIN8 - Internal four-partition (CD) RF input 4 53 VIN9 I External two-partition (DVD) RF input 2 54 VIN10 I External two-partition (DVD) RF input 1 55 VCC1 - Power supply terminal 5V 56 VREF1 O VREF1 voltage output terminal 57 VIN1 I Internal four-partition (DVD) RF input 1

58 VIN2 I Internal four-partition (DVD) RF input 2

59 VIN3 I Internal four-partition (DVD) RF input 3

60 VIN4 I Internal four-partition (DVD) RF input 4

61 GND1 - Connect to GND 62 VIN11 I 3 beam sub input terminal 2 (CD) 63 VIN12 I 3 beam sub input terminal 1 (CD) 64 HDTYPE O HD Type selection

1-24 (No.21189)

TH-A75R

4.9 BA15218F-XE (IC251/IC540/IC544/IC546/IC548/IC557/IC560/IC562/IC564/IC566/IC711/IC712) : Dual operational amplifier

• Pin layout

OUT1 1

-IN1 2

+IN1 3

VEE 4

• Block diagram

Vcc

-IN

+IN

1

2

R1

Q5

Q1

Q2

D1

Q3 Q4

8 Vcc

7 OUT2

6 -IN2

5 +IN2

C2

R5

Q6

Q9

Q8

Q10

Q7

R7

Q11

R6

Q12

R8

Q18Q13

OTHER

CH

Q19

Q17Q16

VEE

C1

R3R2

R4

Q14 Q15Q114

R9

OUTPUT

(No.21189)1-25

TH-A75R

4.10 BA6664FM-X (IC251) : Motor driver

• Pin layout

1

NC

2

A3

3

NC

4

A2

5

NC

6

NC

7

A1

29 30

8

GND

9

H1+

10

H1-

11

H2+

12

H2-

13

H3+

14

H3-

•Block diagram

RNF

28

VM

27

GSW

26

Vcc

25

FG

24

PS

23

EC

22

ECR

21

FR

20

FG2

19

SB

18

CNF

17

BR

16

VH-

15

GND

H1+

H1-

H2+

H2-

H3+

H3-

R

NF

28

VM

VCC

27

26

25

24

23

22

21

20

19

18

17

16

15

GSW

VCC

FG

PS

EC

ECR

FR

FG2

SB

CNF

BR

VH

A3

2

A2

DRIVER

GAIN

CONTROL

TSD

GAIN

SWITCH

4

CURRENT

A1

TL

SENSE AMP

+ -

7

8

9

10

11

12

13

HALL AMP

+

-

+

-

+

-

+

-

+

-

+

-

R

D Q

CK Q

PS

TOROUE

SENSE AMP

+

-

VCC

SHORT BRAKE

BRAKE MODE

14

Hall Bias

1-26 (No.21189)

• Pin function Pin No. Symbol I/O Description

1 NC - Non connect 2 A3 O Output 3 for spindle motor 3 NC - Non connect 4 A2 O Output 2 for spindle motor 5 NC - Non connect 6 NC - Non connect 7 A1 O Output 1 for spindle motor 8 GND - Connect to ground

9 H1+ I Positive input for hall input AMP 1 10 H1- I Negative input for hall input AMP 1 11 H2+ I Positive input for hall input AMP 2 12 H2- I Negative input for hall input AMP 2 13 H3+ I Positive input for hall input AMP 3 14 H3- I Negative input for hall input AMP 3 15 VH I Hall bias terminal 16 BR - Non connect 17 CNF - Capacitor connection pin for phase compensation 18 SB I Short brake terminal 19 FG2 - Non connect 20 FR - Non connect 21 ECR I Torque control standard voltage input terminal 22 EC I Torque control voltage input terminal 23 PS O Start/stop switch (power save terminal) 24 FG O FG signal output terminal 25 VCC - Power supply for signal division 26 GSW O Gain switch 27 VM - Power supply for driver division 28 RNF O Resistance connection pin for output current sense 29 - Connect to ground 30 - Connect to ground

TH-A75R

(No.21189)1-27

TH-A75R

4.11BA5983FM-X (IC201) : 4-channel driver

•Block diagram

27

28

Vcc

26

10k

25

20k

23 22 30

24

10k

20k

21

STAND BY CH4

20

Vcc

19

18

10k

17 16

10k

Level Shift

10k

15

10k

Level Shift

10k

1

2

3

5

4

10k

6

• Pin function

Pin No. Symbol I/O Description

1 BIAS IN I Input for Bias-amplifier 2 OPIN1(+) I Non inverting input for CH1 OP-AMP 3 OPIN1(-) I Inverting input for CH1 OP-AMP 4 OPOUT1 O Output for CH1 OP-AMP 5 OPIN2(+) I Non inverting input for CH2 OP-AMP 6 OPIN2(-) I Inverting input for CH2 OP-AMP 7 OPOUT2 O Output for CH2 OP-AMP 8 GND - Substrate ground

9 STBY1 I Input for CH1/2/3 stand by control 10 PowVcc1 - Vcc for CH1/2 power block 11 VO2(-) O Inverted output of CH2 12 VO2(+) O Non inverted output of CH2 13 VO1(-) O Inverted output of CH1 14 VO1(+) O Non inverted output of CH1 15 VO4(+) O Non inverted output of CH4

Level Shift

10k

Level Shift

10k

STAND BY CH1/2/3

729 891011121314

Vcc

Pin No. Symbol I/O Description

16 VO4(-) O Inverted output of CH4 17 VO3(+) O Non inverted output of CH3 18 VO3(-) O Inverted output of CH3 19 PowVcc2 - Vcc for CH3/4 power block 20 STBY2 I Input for Ch4 stand by control 21 GND - Substrate ground 22 OPOUT3 O Output for CH3 OP-AMP 23 OPIN3(-) I Inverting input for CH3 OP-AMP 24 OPIN3(+) I Non inverting input for CH3 OP-AMP 25 OPOUT4 O Output for CH4 OP-AMP 26 OPIN4(-) I Inverting input for CH4 OP-AMP 27 OPIN4(+) I Non inverting input for CH4 OP-AMP 28 PreVcc - Vcc for pre block 29 - Connect to ground 30 - Connect to ground

1-28 (No.21189)

4.12BA7603F-X (IC211/IC221) : Video signal switcher

• Pin layout & Block diagram

IN1a

GND

IN2b

Vcc

OUTb

IN1b

GND

IN1c

16 15 14 13 12 11 10 9

SWa

SWb

12345678

SWc

TH-A75R

CTL OUTPUT

HIN2 LIN1

SWa,SWb,SWc: Clamp inputs

IN2a

CTLa

GND

OUTa

OUTb

OUTc

CTLc

IN2c

4.13 BD4740G-W (IC272) : Reset

• Pin layout • Block diagram

54

Vcc Vout

NC SUB GND

123

Vref

Vcc

5

3

GND

4

Vout

(No.21189)1-29

TH-A75R

4.14 DSPC56367PV150 (IC521) : DSP

• Pin layout

144 109~

1~36

37 72~

•Block diagram

1

TRIPLE

TMER

(SPDIF Tx)

INTER-FA

INTERNAL

2

DAX

CE

ADDRESS

GENERATION

SIX CHANNELS

DATA

BUS

UNIT

DMA UNIT

HOST

INTER-

FACE

108 ~ 73

8

16

ESAI

INTER-

FACE

ESAI_1

EXPANSION AREA

PIO_EB

4

6

INTER-

PERIPHERAL

24-BIT

DSP56300

Core

SHI

FACE

5

MEMORY EXPANSION AREA

PROGRAM

RAM /INSTR. CACHE 3K x 24

PROGRAM

ROM

40K x 24

Bootstrap

DDB

YDB

XDB

PDB

GDB

PM_EB

YAB XAB PAB

DAB

X MEMORY

RAM

13K x 24

ROM

32K x 24

XM_EB

Y MEMORY

RAM

7K x 24

ROM

8K x 24

YM_EB

EXTERNAL

ADDRESS

SWITCH

DRAM &

SRAM BUS

INTERFACE

I-CACHE

EXTERNAL DATA BUS

SWITCH

BUS

&

18

ADDRESS

10

CONTROL

24

DATA

1-30 (No.21189)

PLL

CLOCL

GENERAT

EXTAL

RESET

PINT/NMT

PROGRAM

INTERRUPT

CONTOROLLER

PROGRAM

DECODE

CONTOROLLE

MODA/IRQA

MODB/IRQB MODC/IRQC MODD/IRQD

PROGRAM

ADDRESS

GEBERATOR

DATA ALU

24X24+56>56BIBT MAC

TWO 56BIT ACCUMULATORS

BARREL SHIFTER

24 BITS BUS

POWER

GNGMNT

JTAG

OnCE

4

TW

• Pin function

Pin No Symbol I/O Function

1 SCK/SCL I/O SPI serial clock / I2C serial clock 2SS 3 HREQ 4 SDO0/SDO0_1 O Serial data output 0 5 SDO1/SDO1_1 O Serial data output 1 6 SDO2/SDI3/SDO2_1/SDI3_1 O Serial data output 2 / Serial data input 3 7 SDO3/SDI2/SDO3_1/SDI2_1 O Serial data output 3 / Serial data input 2 8 VCCS - SHI,ESAI,ESAI_1,DAX and Timer power

9 GNDS - SHI,ESAI,ESAI_1,DAX and Timer ground 10 SDO4/SDI1 O Serial data output 4 / Serial data input 1 11 SDO5/SDI0 O Serial data output 5 / Serial data input 0 12 FST I/O Frame sync for transmitter 13 FSR I/O Frame sync for receiver 14 SCKT I/O Transmitter serial clock 15 SCKR I/O Receiver serial clock 16 HCKT I/O High frequency clock for transmitter 17 HCKR I/O High frequency clock for receiver 18 VCCQL - Quite core (Low) power 19 GNDQ - Quite ground 20 VCCQH - Quite external (High) power 21 HDS/HWR I Host data strobe / Host write data 22 HRW/HRD I Host read write / Host read data 23 HACK/HRRQ I Host acknowledge / Receive host request 24 HOREQ/HTRQ O Host request / Transmit host request 25 VCCS - SHI,ESAI,ESAI_1,DAX and Timer power 26 GNDS - SHI,ESAI,ESAI_1,DAX and Timer ground 27 ADO O Digital audio data output 28 ACI I Audio clock input 29 TIO0 I/O Timer 0 schmitt-trigger input/output 30 HCS/HA10 I Host chip select / Host address 10 31 HA9/HA2 I Host address 9 / Host address input 2 32 HA8/HA1 I Host address 8 / Host address input 1 33 HAS/HA0 I Host address strobe / Host address input 0

34~37 HAD7~HAD4 I/O Host address/Data

38 VCCH - Host power 39 GNDH - Host ground

40~43 HAD3~HAD0 I/O Host address/Data

44 RESET 45 VCCP - PLL power 46 PCAP I PLL capacitor 47 GNDP - PLL ground 48 SDO5_1/SDI0_1 I/O Serial data output 5_1 / Serial data input 0_1 49 VCCQH - Quite external (High) power 50 FST_1 I/O Frame sync for transmitter 51 AA2 O Address attribute or Row address strobe 52 CAS 53 SCKT_1 I/O Transmitter serial clock_1 54 GNDQ - Quite ground 55 EXTAL I External clock input 56 VCCQL - Quite core (Low) power 57 VCCC - Bus control power 58 GNDC - Bus control ground

/HA2 I SPI slave select / I2C slave address 2

I/O Host request

I Reset

O Column address strobe

TH-A75R

(No.21189)1-31

TH-A75R

Pin No Symbol I/O Function

59 FSR_1 I/O Frame sync for receiver 60 SCKR_1 I/O Receiver serial clock_1 61 PINIT/NMI 62 TA 63 BR 64 BB 65 VCCC - Bus control power 66 GNDC - Bus control ground 67 WR O Write enable 68 RD

69,70 AA1,AA0 O Address attribute or row address strobe

71 BG

72,73 A0,A1 O Data bus

74 VCCA - Address bus power 75 GNDA - Address bus ground

76~79 A2~A5 O Data bus

80 VCCA - Address bus power 81 GNDA - Address bus ground

82~85 A6~A9 O Data bus

86 VCCA - Address bus power 87 GNDA - Address bus ground

88,89 A10,A11 O Data bus

90 GNDQ - Quite ground 91 VCCQL - Quite core (Low) power

92~94 A12~A14 O Data bus

95 VCCQH - Quite core (High) power 96 GNDA - Address bus ground

97~99 A15~A17 O Data bus

100~102 D0~D2 I/O Data bus

103 VCCD - Data bus power 104 GNDD - Data bus ground

105~110 D3,D8 I/O Data bus

111 VCCD - Data bus power 112 GNDD - Data bus ground

113~118 D9~D14 I/O Data bus

119 VCCD - Data bus power 120 GNDD - Data bus ground

121~125 D15~D19 I/O Data bus

126 VCCQL - Quite core (Low) power 127 GNDQL - Quite core (Low) ground 128 D20 I/O Data bus 129 VCCD - Data bus power 130 GNDD - Data bus ground

131~133 D21~D23 I/O Data bus

134 MODD/IRQD 135 MODC/IRQC 136 MODB/IRQB 137 MODA/IRQA 138 SDO4_1/SDI1_1 I/O Serial data output 4_1 / Serial data input 1_1

139~142 TDO,TDI,TCK,TMS O/I Test data output,Test data input,Test clock,Test mode select

143 MOSI/HA0 I/O SPI master-out-sleve-in / I2C slave address 0 144 MISO/SDA I/O SPI master-in-slave-out / I2C data and acknowkedge

I PLL initial / Nonmaskable interrupt I Transfer acknowledge

O Bus request

I/O Bus busy

O Read enable

I Bus grant

I Mode select D / External interrupt request D I Mode select C / External interrupt request C I Mode select B / External interrupt request B I Mode select A / External interrupt request A

1-32 (No.21189)

4.15 GP1FA351RZ (J5521) : Fiber optic receiver

• Pin layout

4.16 GP1UM271XK (IC402) : IR detecting unit for remote control

• Block diagram

AMP

Comp & Output circuit

R

TH-A75R

V

CC

V

OUT

GND

L

Amp

B.P.FLimiter

Demodulator

4.17 IS63LV102410K-X (IC525/IC526/IC527) : SRAM

• Pin layout • Block diagram

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

A16

A15

A14

A13

OE

I/O7

I/O6

GND

Vcc

I/O5

I/O4

A12

A11

A10

A9

A8

A0-A16

VCC

GND

I/O0-I/O7

CE

OE

WE

A0

A1

A2

A3

CE

I/O0

I/O1

Vcc

GND

I/O2

I/O3

WE

A4

A5

A6

A7

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

• Pin function

Pin No. Symbol I/O Function

1-4 A0-A3 I Address inputs

5CE

I Chip enable input

6,7 I/O0,I/O1 I/O Bidirectional ports

8Vcc-Power 9GND-Ground

10,11 I/O2,I/O3 I/O Bidirectional ports

12 WE

I Write enable input

Pin No. Symbol I/O Function

13-21 A4-A12 I Address inputs 22,23 I/O4,I/O5 I/O Bidirectional ports

24 Vcc - Power 25 GND - Ground

26,27 I/O6,I/O7 I/O Bidirectional ports

28 OE

29-32 A13-A16 I Address inputs

Integrator

Comparator

GND Vcc Vout

DECODER

I/O

DATA

CIRCUIT

CONTROL

CIRCUIT

128K X 8

MEMORY ARRAY

COLUMN I/O

I Output enable input

(No.21189)1-33

TH-A75R

A

4.18 K4S643232E-TC60 (IC505) : 512K x 32 bit x 4 banks synchronous DRAM

• Pin layout

1

86

•Block diagram

43

CLK

DD

Address Register

LCKE

44

Bank Select

Row Buffer

Refresh Counter

LRAS

LCBR

LRAS LCBR LWE

CLK CKE CS

LCAS

Row Decoder

Col. Buffer

Timing Register

RAS CAS

Data Input Register

512K x 32

Column Decoder

Latency & Burst Length

Programming Register

LWCBR

WE DQM

Sense AMP

LDQM

LWE

LDQM

I/O Control

DQi

Output Buffer

1-34 (No.21189)

• Pin function

Pin No. Symbol Function

1 VDD Power for the input buffers and core logic. 2 DQ0 Data input/output are multiplexed on the same pin. 3 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

4,5 DQ1,DQ2 Data inputs/outputs are multiplexed on the same pins.

6 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

7,8 DQ3,DQ4 Data inputs/outputs are multiplexed on the same pins.

9 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

10,11 DQ5,DQ6 Data inputs/outputs are multiplexed on the same pins.

12 VSSQ Isolated ground for the output buffers to provide improved noise immunity. 13 DQ7 Data input/output are multiplexed on the same pin. 14 N.C This pin is recommended to be left no connection on the device. 15 VDD Power for the input buffers and core logic. 16 DQM0 Makes data output Hi-Z, tSHZ after the clock and masks the output.

Blocks data input when DQM active.

17 WE

18 CAS

19 RAS

20 CS 21 N.C This pin is recommended to be left no connection on the device.

22,23 BA0,BA1 Selects bank to be activated during row address latch time.

24,25~27 A10,A0 - A2 Row/column addresses are multiplexed on the same pins.

28 DQM2 Makes data output Hi-Z, tSHZ after the clock and masks the output.

29 VDD Power for the input buffers and core logic. 30 N.C This pin is recommended to be left no connection on the device. 31 DQ16 Data input/output are multiplexed on the same pin. 32 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

33,34 DQ17,DQ18 Data inputs/outputs are multiplexed on the same pins.

35 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

36,37 DQ19,DQ20 Data inputs/outputs are multiplexed on the same pins.

38 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

39,40 DQ21,DQ22 Data inputs/outputs are multiplexed on the same pins.

41 VDDQ Isolated power supply for the output buffers to provide improved noise immunity. 42 DQ23 Data input/output are multiplexed on the same pin. 43 VDD Power for the input buffers and core logic. 44 VSS Ground for the input buffers and core logic. 45 DQ24 Data input/output are multiplexed on the same pin. 46 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

47,48 DQ25,DQ26 Data inputs/outputs are multiplexed on the same pins.

49 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

50,51 DQ27,DQ28 Data inputs/outputs are multiplexed on the same pins.

52 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

Enables write operation and row precharge. Latches data in starting from CAS, WE active.

Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access.

Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge.

Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQM.

Selects bank for read/write during column address latch time.

Row address : RA0 ~ RA10, Column address : CA0 ~ CA7

Blocks data input when DQM active.

TH-A75R

(No.21189)1-35

TH-A75R

Pin No. Symbol Function

53,54 DQ29,DQ30 Data inputs/outputs are multiplexed on the same pins.

55 VDDQ Isolated power supply for the output buffers to provide improved noise immunity. 56 DQ31 Data input/output are multiplexed on the same pin. 57 N.C This pin is recommended to be left no connection on the device. 58 VSS Ground for the input buffers and core logic. 59 DQM3 Makes data output Hi-Z, tSHZ after the clock and masks the output.

Blocks data input when DQM active.

60~66 A3 - A9 Row/column addresses are multiplexed on the same pins.

Row address : RA0 - RA10, Column address : CA0 - CA7

67 CKE Masks system clock to freeze operation from the next clock cycle.

CKE should be enabled at least one cycle prior to new command. Disables input buffers for power down mode.

68 CLK Active on the positive going edge to sample all inputs.

69,70 N.C This pin is recommended to be left no connection on the device.

71 DQM1 Makes data output Hi-Z, tSHZ after the clock and masks the output.

Blocks data input when DQM active. 72 VSS Ground for the input buffers and core logic. 73 N.C This pin is recommended to be left no connection on the device. 74 DQ8 Data input/output are multiplexed on the same pin. 75 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

76,77 DQ9,DQ10 Data inputs/outputs are multiplexed on the same pins.

78 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

79,80 DQ11,DQ12 Data inputs/outputs are multiplexed on the same pins.

81 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

82,83 DQ13,DQ14 Data inputs/outputs are multiplexed on the same pins.

84 VSSQ Isolated ground for the output buffers to provide improved noise immunity. 85 DQ15 Data input/output are multiplexed on the same pin. 86 VSS Ground for the input buffers and core logic.

1-36 (No.21189)

4.19 K4S643232E-TC70 (IC505) : 512K x 32 bit x 4 banks synchronous DRAM

A

• Pin layout

1

86

TH-A75R

• Block diagram

43

CLK

DD

Address Register

LCKE

44

Bank Select

Row Buffer

Refresh Counter

LRAS

LCBR

LRAS LCBR LWE

CLK CKE CS

LCAS

Row Decoder

Col. Buffer

Timing Register

RAS CAS

Data Input Register

512K x 32

Column Decoder

Latency & Burst Length

Programming Register

LWCBR

WE DQM

Sense AMP

LDQM

LWE

LDQM

I/O Control

DQi

Output Buffer

(No.21189)1-37

TH-A75R

• Pin function

Pin No. Symbol Function

1 VDD Power for the input buffers and core logic. 2 DQ0 Data input/output are multiplexed on the same pin. 3 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

4,5 DQ1,DQ2 Data inputs/outputs are multiplexed on the same pins.

6 VSSQ Isolated ground for the output buffers to provide improved noise immunity.

7,8 DQ3,DQ4 Data inputs/outputs are multiplexed on the same pins.

9 VDDQ Isolated power supply for the output buffers to provide improved noise immunity.

10,11 DQ5,DQ6 Data inputs/outputs are multiplexed on the same pins.

12 VSSQ Isolated ground for the output buffers to provide improved noise immunity. 13 DQ7 Data input/output are multiplexed on the same pin. 14 N.C This pin is recommended to be left no connection on the device. 15 VDD Power for the input buffers and core logic. 16 DQM0 Makes data output Hi-Z, tSHZ after the clock and masks the output.

Blocks data input when DQM active. 17 WE