A ------------------ Australia
US -------------- Singapore
UB ------------- Hong Kong
UW -- Brazil,Mexico,Peru
UY --------------- Argentina
UJ ------------- U.S.Military
UG ------------------ Turkey,
South Africa,Egypt
TH-A5
STANDBY/ON
AUDIO
VCR
CONTROL
ON
VCR
TV
OFF
TV CHANNEL
MENU
TOP MENU
AUDIO/
SUBTITLE
TV VOLUME
FM MODE
STEP
TV/VIDEO
DISPLAY
RETURN
TUNER PRESET
DOWNUP
REWFF
VCR CHANNEL
TUNING
B.SEARCHF.SEARCH
ENTER
VOLUME
DVD FM/AM AUX MUTING
RM-STHA5U
DVD CINEMA SYSTEM
SP-XSA5 2
COMPACT
DIGITAL VIDEO
STANDBY
STANDBY/ON
AUDIO/FM MODE
DSP
Contents
Safety precautions
Important for laser products
Preventing static electricity
Disassembly method
VOLUMESOURCE
SP-XCA5SP-XSA5 2
DIGITAL
DVD DIGITAL CINEMA SYSTEM TH-A5
SURROUND
DIGITAL
XV-THA5SP-WA5
1-2
1-3
1-4
Wiring connection
Adjustment method
Description of major ICs
1-5
1-12
1-13
1-15~33
COPYRIGHT 2002 VICTOR COMPANY OF JAPAN, LTD.
No.21062
Jan. 2002
TH-A5
1. This design of this product contains special hardware and many circuits and components specially for safety
purposes. For continued protection, no changes should be made to the original design unless authorized in
writing by the manufacturer. Replacement parts must be identical to those used in the original circuits. Services
should be performed by qualified personnel only.
2. Alterations of the design or circuitry of the product should not be made. Any design alterations of the product
should not be made. Any design alterations or additions will void the manufacturer`s warranty and will further
relieve the manufacture of responsibility for personal injury or property damage resulting therefrom.
3. Many electrical and mechanical parts in the products have special safety-related characteristics. These
characteristics are often not evident from visual inspection nor can the protection afforded by them necessarily
be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts which
have these special safety characteristics are identified in the Parts List of Service Manual. Electrical
components having such features are identified by shading on the schematics and by ( ) on the Parts List in
the Service Manual. The use of a substitute replacement which does not have the same safety characteristics
as the recommended replacement parts shown in the Parts List of Service Manual may create shock, fire, or
other hazards.
4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be
separated from live parts, high temperature parts, moving parts and/or sharp edges for the prevention of
electric shock and fire hazard. When service is required, the original lead routing and dress should be
observed, and it should be confirmed that they have been returned to normal, after re-assembling.
5. Leakage currnet check (Electrical shock hazard testing)
After re-assembling the product, always perform an isolation check on the exposed metal parts of the product
(antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control shafts, etc.) to be sure the
product is safe to operate without danger of electrical shock.
Do not use a line isolation transformer during this check.
Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure the leakage
current from each exposed metal parts of the cabinet, particularly any exposed metal part having a return
path to the chassis, to a known good earth ground. Any leakage current must not exceed 0.5mA AC (r.m.s.).
Alternate check method
Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms per volt or more
sensitivity in the following manner. Connect a 1,500 10W resistor paralleled by a 0.15 F AC-type capacitor
between an exposed metal part and a known good earth ground.
Measure the AC voltage across the resistor with the AC
voltmeter.
Move the resistor connection to each exposed metal part,
particularly any exposed metal part having a return path to
the chassis, and meausre the AC voltage across the resistor.
Now, reverse the plug in the AC outlet and repeat each
measurement. Voltage measured any must not exceed 0.75 V
AC (r.m.s.). This corresponds to 0.5 mA AC (r.m.s.).
0.15 F AC TYPE
1500 10W
Good earth ground
AC VOLTMETER
(Having 1000
ohms/volts,
or more sensitivity)
Place this
probe on
each exposed
metal part.
!
1. This equipment has been designed and manufactured to meet international safety standards.
2. It is the legal responsibility of the repairer to ensure that these safety standards are maintained.
3. Repairs m ust be made in accordance with the relevant safety standards .
4. It is essential that safety critical components are replaced by approved parts.
5. If mains voltage selector is provided, check setting for local voltage.
Burrs formed during molding may
be left over on some parts of the
chassis. Therefore, pay attention to
such burrs in the case of
preforming repair of this system.
In regard with component parts appearing on the silk-screen pr inted side (parts side) of the PWB diagrams, the
parts that are printed over with black such as the resistor ( ), diode ( ) and ICP ( ) or identified by the " "
mark nearby are critical for safety.
(This regulation does not correspond to J and C version.)
1-2
Important for laser products
TH-A5
1.CLASS 1 LASER PRODUCT
2.DANGER : Invisible laser radiation when open and inter
lock failed or defeated. Avoid direct exposure to beam.
3.CAUTION : There are no serviceable parts inside the
Laser Unit. Do not disassemble the Laser Unit. Replace
the complete Laser Unit if it malfunctions.
4.CAUTION : The compact disc player uses invisible
laserradiation and is equipped with safety switches
whichprevent emission of radiation when the drawer is
open and the safety interlocks have failed or are de
feated. It is dangerous to defeat the safety switches.
REPRODUCTION AND POSITION OF LABELS
5.CAUTION : If safety switches malfunction, the laser is able
to function.
6.CAUTION : Use of controls, adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.
!
Please use enough caution not to
see the beam directly or touch it
in case of an adjustment or operation
check.
CLASS 1
LASER PRODUCT
1-3
TH-A5
Preventing static electricity
1.Grounding to prevent damage by static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged,
can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
2.About the earth processing for the destruction prevention by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.
Be careful to use proper grounding in the area where repairs are being performed.
2-1 Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over
it before placing the traverse unit (optical pickup) on it.
2-2 Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption)
Anti-static wrist strap
Conductive material
(conductive sheet) or iron plate
3. Handling the optical pickup
1. In order to maintain quality during transport and before installation, both sides of the laser diode on the
replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition.
(Refer to the text.)
2. Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power
source can easily destroy the laser diode.
4.Handling the traverse unit (optical pickup)
1. Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.
2. Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific
details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse
unit. Be careful not to take too long a time when attaching it to the connector.
3. Handle the flexible cable carefully as it may break when subjected to strong force.
4. It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.
Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for pick-up and how to detach the substrate.
Solder is put up before the card
1.
wire is removed from connector
on the pick up board as shown in
Figure.
(When the wire is removed
without putting up solder, the CD
pick-up assembly might destroy.)
Please remove solder after
2.
connecting the card wire with
when you install picking up
in the substrate.
DVD mechanism assembly (bottom side)
DVD loading
mechanism
Pick up board
Card wire
Short land
(These two points are
soldered respectively,
and are made to
short-circuit)
Connector
1-4
DVD loader board
TH-A5
Disassembly method
Removing the top cover (See Fig.1)
1.
Remove the four screws A attaching the top cover
on the both sides of the body.
2.
Remove the two screws B on the back of the body.
3.
Remove the top cover from behind in the direction of
the arrow while pulling both sides outward.
Removing the front panel assembly
(See Fig.2A, 2B and 3)
Prior to performing the following procedure, remove
the top cover.
1.
Remove the one screw a and remove the earth wier.
2.
Remove the three screws C attaching the front panel
assembly on the bottom of the body.
3.
Remove the two screws D attaching the front panel
assembly on the both sides of the body.
4.
Remove the claw1, claw2 and claw3, and detach the
front panel assembly toward the front.
5.
Disconnect the card wire from the connector DW20
on the DSP board.
Top cover
Claw1
(bottom side)
Claw2 (both side)
B
A
2
Fig.1
Front panel assembly
CC
Fig.2A
Front panel
assembly
Claw3
Removing the power cord (See Fig.4)
Prior to performing the following procedure, remove
the top cover.
1.
Disconnect the power cord from the connector CW1
on the main board and pull up the cord stopper
upward.
Notes : The power cord is exchangeable.
Power cord
CW1
Tie band
D
(both side)
a
(fixing the earth wire)
Fig.2B
DSP board
DW20
Rear panel
Fig.4
Power cord
stopper
Front panel assembly
(Inner side)
Display board
Fig.3
1-5
TH-A5
Removing the DVD mechanism assembly
(See Fig.5 and 6)
Prior to performing the following procedure, remove
the top cover.
1.
Disconnect the card wire from the connector J14 and
J21 on the DVD MPEG board.
2.
Remove the two screws E attaching the DVD
mechanism assembly and pull up with drawing out.
3.
Disconnect the harness from the connector J2 on the
DVD loader board.
Removing the rear panel (See Fig.7 and 8)
Prior to performing the following procedure, remove
the top cover and power cord.
1.
Disconnect the harness from the connector NW11 on
the DSP board.
2.
Remove the two screws F, four screws G, five
screws I attaching the each boards to the rear panel.
Rear panel
DVD mechanism assembly
DVD
MPEG
board
J14
E
J21
Fig.5
DVD mechanism
assembly
3.
Remove the three screws J attaching the rear panel
on the back of the body.
Removing the tuner pack (See Fig.7 and 8)
Prior to performing the following procedure, remove
the top cover.
1.
Disconnect the card wire from the connector CON01
on the tuner pack.
2.
Remove the two screws F attaching the tuner pack
to the rear panel.
Removing the jack board (See Fig.7 and 8)
Prior to performing the following procedure, remove
the top cover.
1.
Disconnect the card wire from the connector VW2 on
the jack board.
2.
Remove the four screws G attaching the jack board
to the rear panel.
3.
Disconnect the connector VW1 on the jack board
and pull up the jack board.
DVD loader board
J2
Fig.6
Rear panel
Fan motor
JJJ
DSP board
H
I
Fig.7
G
F
CON01
Removing the fan motor (See Fig.7 and 8)
Prior to performing the following procedures, remove
the top cover .
1.
Disconnect the harness from the connector NW11 on
the DSP board .
2.
Removing the two screws H attaching the fan motor
on the rear panel.
1-6
Rear panel
NW11
(on the
DSP board)
VW1
Fig.8
VW2
Tuner pack
Jack board
TH-A5
Removing the DSP board (See Fig.9)
Prior to performing the following procedure, remove
the top cover, the front panel assembly and jack
board.
1.
Untied the harness band and disconnect the harness
from the connector CW2 on the main board.
2.
Disconnect the harness from the connector NW11 on
the DSP board.
3.
Disconnect the card wire from the connector VW12
on the DSP board.
4.
Pull up the DSP board from the front side upwards
disconnecting the connector DW10, DW13, DW14
and DW15.
Removing the main board (See Fig.10)
Prior to performing the following procedure, remove
the top cover, front panel assembly, DVD
mechanism assembly, jack board and DSP board.
1.
Disconnect the card wire from the connector CW4
and CW8 on the main board.
2.
Disconnect the harness from the connector CW3 on
the main board.
DSP board
(Front panel side)
Main board
CW8
K2
VW12
DW14DW15
Harness band
Fig.9
K1
Main board
CW2
NW11
(Rear panel side)
DW10DW13
Heat sink
(to which
power
transistor
is attached)
K1
3.
Remove the five screws I attaching the speaker
terminals and jack to the rear panel (see fig.7).
4.
Remove the six screws K1 (short) and one screw K2
(long) attaching the main board.
5.
When the rear panel is not removed, pull up the
main board from front side.
Removing the power transistor & power IC
(See Fig.10 and 11)
Prior to performing the following procedure, remove
the top cover, front panel assembly, DVD
mechanism assembly, jack board, DSP board and
main board.
1.
After removing the solder part soldered to the main
board, remove each screw and remove the heat sink
from Power transistor.
2.
After removing the solder part soldered to the main
board, remove each screw and remove the heat sink
from Power IC.
CW4
Fig.10
(Each power transistor is fixed)
Solder part
Solder part Solder part
Heat sink
(to which power IC is attached)
Fig.11
CW3
Power ICs
Main board
(Reverse side )
Solder part
(Power IC is fixed)
1-7
TH-A5
Removing the DVD power board
(See Fig.12)
Prior to performing the following procedure, remove
the top cover, front panel assembly and DSP board.
1.
Disconnect the harness and card wire from the
connector PW1, PW2 and PW5 on the DVD power
board.
2.
Remove the one screw L1 (short) and two screws L2
(long) attaching the DVD power board.
L1
PW5
PW2
DVD
power
board
Removing the power transformer
(See Fig.12)
Prior to performing the following procedure, remove
the top cover.
1.
Cut off the tie band fixing the harness, if needed.
2.
Disconnect the harness from the connector CW2 on
the main board (see fig.9) and PW1, PW2 on the
DVD power board.
3.
Remove the four screws M attaching the power
transformer.
PW1
Tie band
L2
Power
transformer
M
Fig.12
<Front panel assembly section>
Removing the display board & switch
board (See Fig.1 and 2)
Prior to performing the following procedure, remove
the top cover and the front panel assembly.
1.
Disconnect the card wire from the connector FW1 on
the display board.
2.
Remove the five screws A attaching the display
board on the inner of the front panel assembly.
3.
Remove the four screws B attaching the switch
board on the inner of the front panel assembly.
4.
Disconnect the harness from connector FW2 on the
display board, if needed.
Removing the front window
(See Fig.2 and 3)
Prior to performing the following procedure, remove
the top cover, front panel assembly, display board
and switch board.
FW1
Display board
A
Switch button
Front panel assembly
Switch board
FW2
Fig.1
(inner side)
B
CCC
Claw
Fig.2
Front panel assembly (front side)
Remove the switch buttons, if needed.
1.
Remove the three screws C attaching the front
2.
window on the front panel.
Remove the eight claws fixing the front window on
3.
the front panel.
1-8
Front window
Fig.3
TH-A5
<DVD mechanism assembly section>
Removing the DVD loader board
(See Fig.1 to 3)
Prior to performing the following procedure, remove
the top cover and DVD mechanism assembly.
1.
Disconnect the card wire from the connector J6 on
the DVD MPEG board.
2.
Disconnect the harness from the connector on the
motor board.
3.
Disconnect the harness from the connector J5 on the
DVD loader board.
4.
Remove the four screws A attaching the DVD loader
board to DVD mechanism assembly.
CAUTION!! (see fig.3)
Before removing the card wire which
connects the pickup board and DVD loader
board, solder the two soldering parts and
make it short-circuit.
Moreover, while having removed the card
wire, don't remove these solder.
DVD MPEG board
DVD loader board
A
U9
J5
DVD mechanism assembly
(top side)
J6
Fig.1
DVD mechanism assembly
(bottom side)
Motor board
Connector
Fig.2
5.
Disconnect the card wire from the connector U9 on
the DVD loader board.
ONE POINT
How to eject the DVD tray manually
(see fig.2)
The white lever of the mark is moved in
the direction of the arrow. Then, the tray will
be opened.
Moreover, the tray is separable from a DVD
mechanism assembly by removing two
screws of the mark (see fig.1) and drawing
out the tray.
Removing the DVD loading mechanism
(See Fig.4)
Prior to performing the following procedure, remove
the top cover, DVD mechanism assembly and DVD
loader board.
1.
Remove the two screws B and remove the bracket.
2.
Remove the one screw C fixing the DVD loading
mechanism.
Pick up
board
Lever
Soldering parts
X
Motor board
Fig.3
DVD mechanism assembly
B
Bracket
DVD loading
mechanism
(bottom side)
DVD loading
mechanism
3.
Move the lever in the direction of the arrow X.
4.
Remove the DVD loading mechanism from the DVD
mechanism assembly by moving it in the direction of
the arrow Y.
Y
C
Fig.4
1-9
TH-A5
m
)
Removing the DVD traverse mechanism
(See Fig.5)
Prior to performing the following procedure, remove
the top cover, DVD mechanism assembly, DVD
loader board and DVD loading mechanism.
1.
Remove the four screws D attaching the DVD
traverse mechanism to DVD loading mechanism.
Removing the holder & DVD MPEG board
(See Fig.6 and 7)
Prior to performing the following procedure, remove
the top cover, DVD mechanism assembly and DVD
loader board.
1.
Remove the two claws1, and remove the holder from
the DVD mechanism assembly as it is pushed down.
DVD traverse
mechanism
Claw1
D
Holder
DVD loading mechanis
(top side
D
Fig.5
Note: When removing only the DVD MPEG board, it is not
necessary to remove this holder.
2.
Remove the four claws2 and remove the DVD
MPEG board from the holder.
ONE POINT
When inserting DVD MPEG board in
holder. (see fig.8)
Holder
Holder
DVD mechanism assembly
Fig.6
DVD MPEG board
Fig.7
DVD MPEG board
(bottom side)
Claw2
1-10
Insert in after uniting with a lower claws,
when inserting DVD MPEG board in holder.
Fig.8
<Speaker section>
[SP-XSA5 / Satellite speaker]
It is exchange in a unit.
[SP-XCA5 / Center speaker]
It is exchange in a unit.
[SP-WA5 / Woofer]
Removing the front panel
(See Fig.1 and 2)
1.
Remove the six bosses and remove the front panel.
TH-A5
Front panel
The tool with
a flat tip
Notes: It will be good to use the tool with a flat tip, since it
is hard to remove. Please take care not to damage the
cabinet at this time.
2.
The packing separates. It removes if needed.
Removing the speaker unit
(See Fig.3 to 5)
1.
Remove the four bosses and remove the net
assembly.
Notes: It will be good to use the tool with a flat tip, since it
is hard to remove. Please take care not to damage the
cabinet at this time.
2.
Remove the eight screws A attaching the speaker
unit to cabinet.
3.
Disconnect the code from the two terminals of the
speaker unit.
Packing
Fig.1
Fig.2
Net assembly
Front panel
(inner side)
Boss
Boss
Terminals
red
Speaker unit (reverse side)
Fig.5
Fig.3
Code
Speaker unit
black
A
A
Cabinet
Fig.4
1-11
TH-A5
Wiring connection
J6
J14
2
0
J21
3809-001273
DVD MPEG
BOARD
3809-001295
9
AH39-00368A
0
J3
J4
0
9
3809-001294
DVD LOADER BOARD
U9
J5
J2
0
9
Color codes are shown below.
1 Brown
2Red
3Orange
4Yellow
5Green
3809-001274
3809-001224
CON01
VW2
VW1
6Blue
7Violet
8Gray
9White
0Black
TUNER PACK
JACK BOARD (V-OUT)
0
9
SWITCH BOARD
FW3
AH39-00176A
0
9
FW2
DISPLAY BOARD
3809-001296
6
1
AH39-50001K
0
9
DW20
PW1
PW3
BOARD
3
DW15
0
DVD
POWER
4
9
5
PW4
0
6
PW5
PW2
1
VW11
9
2
AH39-00104A
AH39-00291A
DSP1 BOARD
9
4
2
8
0
3
DW14
DW32
0
2
DW12
DW23
DW13
DSP2 BOARD
3809-001283
9
2
4
DW10
DW31
8
3
0
NW11
DW11
CW4
0
2
CW7
RE3
RE4
CW6
CW8
0
2
CW1
CW2
1
C
FU1
FU2
FU4
FU3
PT1
CW5
1-12
FW1
0
POWER TRANCE
6
1
2
6
3
5
1
4
0
9
2
0
CW3
MAIN BOARD
Adjustment method
1. Tuner
TH-A5
*Adjustment Location of Tuner PCB
ITEM
Received FREQ.
Adjustment
point
Output1~7.0V
AM(MW) OSC Adjustment
: 522~1629KHz (9k step)
A
US/UB/
UW/UJ
: 531~1602KHz (9k step)
530~1600KHz (10k step)
MAIN
PCB
MO
VTGND
AM(MW) RF
Adjustment
603 KHz
MA
Maximum
Output(Fig1-1)
TESTER
Fig 1-1 OSC Voltage
1-13
TH-A5
FM THD Adjustment
SSG FREQ.
Adjustment
point
(FD)
Output
Minimum Distortion (0.4% below)
(Figure 1-2)
FM Search Level Adjustment
SSG FREQ.
FM DETECTOR COIL
60 dB
98 MHz
98 MHz
Output
Output
Output
Output
GND
GND
GND
GND
FM S.S.G
FM
Antenna
Terminal
Te
T
Speaker
Terminal
Te
T
SET
SET
SET
SET
Input
output
output
output
output
Distortion Meter
Figure1-2 IF CENTER and THD Adjustment
28 dB
FM Antenna
Oscilloscope
Input
Input
Input
Input
Adjustment
point
(SVR3)
Output
BEACON
SENSITIVITY
SEMI-VR(20K )
28 dB(
dB)
Adjust SVR1 so that “TUNED” of FL T
is lighted (Figure 1-3)
*Adjust FM S.S.G level to 28dB
AM(MW) I.F Adjustment
SSG FREQ.
Frequency
450 kHz
522 kHz
Adjustment
point
AA
Maximum output (Figure 1-4)
SET
GND
GND
GND
FM S.S.G
GND
FM IN
Figure1-3 FM Auto Search Level Adjustment
60cm
OUTPUT
AM SSG
450KHZ
INPUT
AM ANT
IN
Speaker Terminal
OUTPUT
20 k
AM IF
VTVMOscilloscope
Figure1-4 AM I.F Adjustment
Notes: This set is a non-adjusted set fundamentally. It is adjusted when the tuner pack is exchanged.
Active Low Reset. Assert for at least 5-milliseconds in the presence of
I
clock to reset the entire chip.
VCLK
XOUT
105
138
Video clock that outputs 27 MHz.
I/O
Crystal output. When the internal DCXO is used, a 13.5 MHz crystal
O
should be con-nected between this pin and the XIN pin.
XIN/bypass clk_216
139
Crystal input. When the internal DCXO is used, a 13.5 MHz crystal should
I
be con-nected between this pin and the XOUT pin. When an external
oscillator or VCXO is used, its output should be connected to this pin.
System Services
When configured for an external bypass clock, a 216 MHz clock should be
connected to this pin. The frequency of an external VCXO can be either 27
or 13.5 MHz.
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
12, 20, 111, 152, 167, 181, 196
32, 44, 55, 63, 74, 87, 98, 104
13, 21, 112, 153, 166, 180, 195, 208
31, 43, 54, 61, 72, 85, 96, 103
Pin No.
189
140
30, 80, 145, 173, 205
118, 121, 124, 127, 130
133
142, 143
134
29, 79, 146, 172, 204
132
141, 144
136
137
190-192
193, 192
206, 207, 2
3-11, 14-19, 22
23
24
25
26
27
203
50, 49
52
51
97, 86, 73, 62
46, 45, 33-42
102-99, 95-88, 84-81,
78-75, 71-64, 60-57
53
56
47, 48
116
105
106-110, 113-115
184
Type
Power
Power
Power
Power
Power
Power
Power
Ground
Ground
Ground
Ground
Ground
Ground
Ground
O
I
I/O
I/O
I/OD
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
I/O
O
O
O
I/O
I/O
I/O
I/O
1
Description
5-V supply voltage for 5V-tolerant I/O signals.
3.3-V supply voltage for I/O signals
3.3-V supply voltage for SDRAM I/O signals
3.3V Crystal interface power
1.8-V supply voltage for core logic
Analog Video DAC Power
3.3V Digital supply for 5 DACs
3.3-V Analog PLL Power
3.3V Analog Video Reference Voltage
Ground for I/O signals
Ground for core logic
Ground for SDRAM I/O signals
Digital VSS for DACs
Analog PLL Ground
Video Analog Ground
Crystal interface ground
Host chip select. Host asserts HCS to select the controller for a read or
write operation. The falling edge of this signal triggers the read or write
operation. General Purpose I/Os 41, 42, and 43, respectively.
Host chip select. Host asserts HCS to select the contr ol le r fo r a re ad or
write operation. The falling edge of this signal triggers the read or write
operation.
Host (muxed address) address bus. 3-bit address bus selects one of eight
host inter-face registers. These signals are not muxed in ATAPI master
mode.
HA[15:0] is the 16-bit (muxed address and data) bi-directional host data
bus through which the host writes data to the decoder Code FIFO. MSB of
the 32-bit word is writ-ten first. The host also reads and writes the decoder
internal registers and local SDRAM/ROM via HA[7:0]. These signals are
not muxed for ATAPI master mode.
Host Data Transfer Acknowledge.
Host interrupt. Open drain signal, must be pulled-up via 4.7k to 3.3 volts.
Driven high for 10 ns before tristate.
Host Upper Data Strobe. Host high byte data, HA[15:8], is valid when this
pin is active.
Host Lower Data Strobe. Host low byte data, HA[7:0], is valid when this pin
is active.
Read/write strobe
Address latch enable
Memory chip select.
Active LOW SDRAM Column Address Strobe.
Active LOW SDRAM Row Address Strobe.
These pins are the bytes masks corresponding to MD[7:0], [15:8], [23:16]
and [31:24]. They allow for byte reads/writes to SDRAM.
SDRAM Address
SDRAM Data
SDRAM Write Enable. Specifies transaction to SDRAM: read (=1) or
write (=0)
SDRAM Clock
SDRAM bank select
Horizontal sync. The decoder begins outputting pixel data for a new
horizontal line after the falling (active) edge of HSYNC.
Host Interrupt Request 2
General Purpose I/O 9
Video clock. Clocks out data on input. VDATA[7:0].
Clock is typically 27 MHz.
Video data bus. Byte serial CbYCrY data synchronous with VCLK. At
powerup, the decoder does not drive VDATA. During boot-up, the
decoder uses configuration parameters to drive or 3-state VDATA.
General Purpose I/Os [1:7]
Vertical sync. Bi-directional, the decoder outputs the top border of a new
field on the first HSYNC after the falling edge of VSYNC. VSYNC can
accept vertical synchroni-zation or top/bottom field notification from an
external source. (VSYNC HIGH = bot-tom field. VSYNC LOW = Top field)
Active Low Host Interrupt Pin
General Purpose I/O 36
Analog O
Analog O
Analog O
Analog O
Analog O
Analog O
Analog I
I/O
O
O
O
I/O
O
I
I
I
1
Description
Compressed data from DVD DSP. Bit 7. In parallel mode, bit 7 is the first
(earliest in time) bit in the bitstream, while bit 0 is the last bit.
Video Data Bus 2, Bit 7
Host DMA Request
General Purpose I/O 24
Compressed data from DVD DSP. Bit 6.
Video Data Bus 2, Bit 6
ATAPI Transceiver Enable
General Purpose I/O 25
Compressed data from DVD DSP. Bit 5.
Video Data Bus 2, Bit 5
Host DMA Acknowledge
General Purpose I/O 26
Compressed data from DVD DSP. Bit 4.
Video Data Bus 2, Bit 4
General Purpose I/O 27
Compressed data from DVD DSP. Bit 3.
Video Data Bus 2, Bit 3
General Purpose I/O 28
Compressed data from DVD DSP. Bit 2.
Video Data Bus 2, Bit 2
General Purpose I/O 29
Compressed data from DVD DSP. Bit 1.
Video Data Bus 2, Bit 1
General Purpose I/O 30
In serial mode, bit 0 should be used as the input, with the unused bits
either used as GPIOs or tied to ground.
Video Data Bus 2, Bit 0
General Purpose I/O 31
Data clock. The maximum frequency is 25 MHz for parallel mode, and
???? MHz for serial mode. The polarity of this signal is programmable.
Error in input data. This signal carries the error bit associated with the
channel data type (if set, the byte is corrupted).
Data enable. Assertion indicates that data on SDDATA[7:0] is valid.
The polarity of this signal is programmable.
General Purpose I/O [33]
Bitstream request. controller asserts SDREQ to indicate that the bitstream
input buffer has available space.
General Purpose I/O 32
Video DAC Bias Bits[4:0]
DAC video output format: R, V, C, or CVBS. Macrovision encoded.
DAC video output format: B, U, C, or CVBS. Macrovision encoded.
DAC video output format: G or Y. Macrovision encoded.
DAC video output format: C. Macrovision encoded.
DAC video output format: CVBS or Y. Macrovision encoded.
Video DACs Reference Resistor. Connecting to pin 136 through
a 1.18K+/- 1% resis-tor is required.
System clock that drives internal PLLs. ZiVA-5 27-MHz TTL oscillator.
(See descrip-tion of VCLK for Digital Video Output.) Also optional video
clock for internal PLLs or external encoder.
PCM Data Out. Eight channels. Serial audio samples relative to BCK
and LRCK. General Purpose I/Os [4:1]
PCM Bit Clock. BCK can be either 48 or 32 times the sampling frequency
PCM Left Clock. Identifies the channel for each sample. The polarity is
programma-ble.
Audio External Frequency clock input or output. BCK and LRCK are
derived from this clock.
PCM data out (IEC-958 format ) or compressed data out
(IEC-1937 format). General Purpose I/O [14]
PCM data input.
General Purpose I/O [15]
PCM input bit clock.
BYPASS_SYSCLK: Alternate function TBS.
General Purpose I/O [16]
PCM left/right clock.
IEC958 input bypass
General Purpose I/O [17]
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1-18
2. Pin function (4/4)
1
Name
IRRX1/GPIO0
IR
IDC_CL/GPIO18
IDC
IDC_DA/GPIO19
RTS1/GPIO20
RXD1/GPIO21
TXD1/GPIO22
UART1UART2JTAG
CTS1/GPIO23
RTS2/SPI_CLK/
GPIO37
RXD2/SPI_MISO/
GPIO38
TXD2/SPI_MOSI/
GPIO39
CTS2/SPI_CS/
GPIO40
TRST
TDO
TDI/GPI0
TMS/GPI1
TCK
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
Pin No.
28
160
161
162
163
164
165
185
186
187
188
197
198
199
200
201
Description
Type
IR Remote Receive. This input connects to an integrated (photo diode,
I
band pass, demodulator) IR receiver. General Purpose I/O 0
Serial clock signal for IDC data transfer. It should be pulled up to the
I/O
positive supply voltage, depending on the device) using an external
pull-up resistor. General Purpose I/O [18]
Serial data signal for IDC data transfer. It should be pulled up to the supply
voltage using an external pull-up resistor. General Purpose I/O [19]
Ready to send, UART1
O
General Purpose I/O [20]
Receive data, UART1
I
General Purpose I/O [21]
Transmit data, UART1
O
General Purpose I/O [22]
Clear to send, UART1
I
General Purpose I/O [23]
Ready to send, UART2
O
Serial Peripheral Interface Clock
General Purpose I/O [37]
Receive data, UART2
I
Serial Peripheral Interface - Master Input/Slave Output
General Purpose I/O [38]
Transmit data, UART2
O
Serial Peripheral Interface - Master Output/Slave Input
General Purpose I/O [39]
Clear to send, UART2
I
Serial Peripheral Interface ????
General Purpose I/O [40]
Test reset. BST reset - resets the TAP controller.
I
This signal must be pulled low.
Test data Out. BST serial data output.
O
Test data In. BST serial data chain input.
I
General Purpose Input pin 0.
Test mode select. Controls state of test access port (TAP) controller.
I
General Purpose Input pin 1.
Test clock. Boundary scan test (BST) serial data clock.
Function
Digital Positive Supply
Digital Supply Ground
SPDIF Transmitter Output, Digital Audio Output 3
Host write strobe or Host data strobe or External Memory write enable or
General purpose input& output Number 10
Host Parallel Output Enable or Host Parallel R/W or External Memory Output
Enable or General Purpose Input & Output Number11
Host Address Bit One or SPI Serial Control Data Input
Host Parallel Address Bit Zero or Serial Control Port Clock
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Host Parallel Chip Select, Host Serial SPI Chip Select
Serial Control Port Data Input and Output, Parallel Port Type Select
Control Port Interrupt Request, Automatic Boot Enable
External Memory Chip Select or General Purpose Input & Output Number 8
PCM Audio Data Input Number One
PCM Audio Input Bit Clock
PCM Audio Input Sample Rata Clock
PCM Audio Data Input Number Tow
PCM Audio Input bit Clock
PCM Audio Input Sample Rate Clock
Master Clock Input
DSP Clock Select
Phase Locked Loop Filter
Phase-Locked Loop Filter
Analog Positive Supply
Analog Supply Ground
Master Reset Input
Reserved
Reserved
Digital Audio Output 2
Digital Audio Output 1
Digital Audio Output 0
Audio Output Sample Rate Clock
Audio Output Bit Clock
Audio Master Clock
RF Signal Inputs. Differential RF signal attenuator input pins.
I
CD Photo detector Interface Inputs. Inputs from the CD photo detector error outputs.
I
Photo Detector Interface Inputs. AC coupled inputs for the DPD from
I
the main beam Photo detector matrix outputs.
Differential Phase tracking LPF pin. An external capacitance is
connected between this pin and the CN pin.
Differential Phase tracking LPF pin. An external capacitance is
connected between this pin and the CP pin.
Photo Detector Interface Inputs. Inputs from the main beam Photo
I
detector matrix outputs.
CD tracking Error Inputs. Inputs from the CD photo detector error outputs.
I
CD Tracking. E-F Opamp output for feedback.
Reference Voltage input. DC bias voltage input for the servo input reference.
No Connect.
Ground. Ground pin for the servo block.
APC Input. DVD APC input pin from the monitor photo diode.
I
APC output. DVD APC output pin to control the laser power.
O
APC Input. DVD APC input pin from the monitor photo diode.
I
APC output. DVD APC output pin to control the laser power.
O
APC output. on/off. APC output control pin. A low level activates the
I
LD output. (open high)
Reference Voltage output. This pin provides the internal DC bias
reference voltage (+2.5+ fix). Output impedance is less than 50 ohms.
Reference Voltage input. DC bias voltage input for the servo input reference.
MIRR signal Peak hold pin. An external capacitance is connected to
between this pin and VPB.
MIRR signal Bottom hold pin. An external capacitance is connected to
between this pin and VPB.
Low Impedance Enable. A TTL compatible input pin that activates the FDCHG switches.
I
A low level activates the switches and the falling edge of the internal FDCHG triggers
the fast decay for the NIRR bottom hold circuit. (open high)
MIRR signal LPF pin. An external capacitance is connected between this pin and VPB.
-
~
33
1-22
2.Pin function (2/2)
Pin No.
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Symbol
MEVO
MIN
PI
DFT
TPH
MEV
MEI
TE
FE
CE
LCN
LCP
SCLK
SDATA
SDEN
HOLD1
VNA
FNN
FNP
DIP
DIN
RX
BYP
SIGO
VPA
AIP
AIN
ATON
ATOP
CDRF
CDRFDC
I/O
SIGO Bottom Envelope Output. Bottom envelope for Mirror detection.
O
RF signal Input for Mirror. AC coupled inputs for the mirror detection
I
circuit from the pull-in signal output. (PI)
Pull-in Signal Output. The summing signal output of A,B,C,D or PD1,
O
PD2 for mirror detection. Reference to VCI.
Defect Output. Pseudo CMOS output. When a defect is detected, the
O
DFT output goes high. Also the servo AGC output can be monitored at
this pin, When CAR bits 7-4 are '0011'.
PI Top Hold pin. An external capacitance is connected between this pin and VPB.
SIGO Bottom Envelope pin. An external capacitance is connected
between this pin and VPB.
Mirror Envelope Input. The SIGO envelope input pin.
I
Tracking Error Signal Output. Tracking error output reference to VCI.
O
Focusing Error Signal Output. Focus error output reference to VCI.
O
Center Error Signal Output. Center error out put reference to VCI.
O
Center Error LPF pin. An external capacitance is connected between
this pin and the LCP pin.
Center Error LPF pin. An external capacitance is connected between
this pin and the LCN pin.
Serial Clock. Serial Clock CMOS input. The clock applied to this pin
I
is synchronized with the data applied to SDATA. (Not to be left open).
Serial Data. Serial data bi-directional CMOS pin. NRZ programming
I/O
data for the internal registers is applied to this input. (Not to be left open)
Serial Data Enable. Serial enable CMOS input. A high level input
I
enables the serial port. (Not to be left open)
Hold Control. ATTL compatible control pin which, when pulled high, disables the RF AFC
I
charge pump and holds the RE AGC amplifier gain at its present value. (open high)
Ground. Ground pin for the RF block and serial port.
Differential Normal Output. Filter normal outputs.
O
Differential Normal Output. Filter normal outputs.
O
Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended
I
output buffer and full wave rectifier.
Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended
I
output buffer and full wave rectifier.
Reference Resistor Input. An external 8.2 kohm, 1% resistor is
connected from this pin to ground to establish a precise PTAT
(proportional to absolute temperature) reference current for the filter.
The RF AGC integration capacitor CBYP, is connected between BYP and VPA.
I/O
Single Ended Normal Output. SIngle-ended RF output.
O
Power. Power supply pin for the RF block and serial port.