JVC TH-A5UW Schematic

SERVICE MANUAL
DVD DIGITAL CINEMA SYSTEM
Area suffix
TH-A5
A ------------------ Australia US -------------- Singapore UB ------------- Hong Kong UW -- Brazil,Mexico,Peru UY --------------- Argentina UJ ------------- U.S.Military UG ------------------ Turkey, South Africa,Egypt
TH-A5
STANDBY/ON
AUDIO
VCR
CONTROL
ON
VCR
TV
OFF
TV CHANNEL
MENU
TOP MENU
AUDIO/
SUBTITLE
TV VOLUME
FM MODE
STEP
TV/VIDEO
DISPLAY
RETURN
TUNER PRESET
DOWN UP
REW FF
VCR CHANNEL
TUNING
B.SEARCH F.SEARCH
ENTER
VOLUME
DVD FM/AM AUX MUTING
RM-STHA5U
DVD CINEMA SYSTEM
SP-XSA5 2
COMPACT
DIGITAL VIDEO
STANDBY
STANDBY/ON
AUDIO/FM MODE
DSP
Contents
Safety precautions Important for laser products Preventing static electricity Disassembly method
VOLUME SOURCE
SP-XCA5 SP-XSA5 2
DIGITAL
DVD DIGITAL CINEMA SYSTEM TH-A5
SURROUND
DIGITAL
XV-THA5 SP-WA5
Wiring connection Adjustment method Description of major ICs
1-12 1-13 1-15~33
COPYRIGHT 2002 VICTOR COMPANY OF JAPAN, LTD.
No.21062
Jan. 2002
TH-A5
1. This design of this product contains special hardware and many circuits and components specially for safety purposes. For continued protection, no changes should be made to the original design unless authorized in writing by the manufacturer. Replacement parts must be identical to those used in the original circuits. Services should be performed by qualified personnel only.
2. Alterations of the design or circuitry of the product should not be made. Any design alterations of the product should not be made. Any design alterations or additions will void the manufacturer`s warranty and will further relieve the manufacture of responsibility for personal injury or property damage resulting therefrom.
3. Many electrical and mechanical parts in the products have special safety-related characteristics. These
characteristics are often not evident from visual inspection nor can the protection afforded by them necessarily be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts which have these special safety characteristics are identified in the Parts List of Service Manual. Electrical components having such features are identified by shading on the schematics and by ( ) on the Parts List in the Service Manual. The use of a substitute replacement which does not have the same safety characteristics as the recommended replacement parts shown in the Parts List of Service Manual may create shock, fire, or other hazards.
4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be separated from live parts, high temperature parts, moving parts and/or sharp edges for the prevention of electric shock and fire hazard. When service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been returned to normal, after re-assembling.
5. Leakage currnet check (Electrical shock hazard testing) After re-assembling the product, always perform an isolation check on the exposed metal parts of the product (antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control shafts, etc.) to be sure the product is safe to operate without danger of electrical shock. Do not use a line isolation transformer during this check.
Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure the leakage current from each exposed metal parts of the cabinet, particularly any exposed metal part having a return path to the chassis, to a known good earth ground. Any leakage current must not exceed 0.5mA AC (r.m.s.).
Alternate check method Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms per volt or more sensitivity in the following manner. Connect a 1,500 10W resistor paralleled by a 0.15 F AC-type capacitor between an exposed metal part and a known good earth ground. Measure the AC voltage across the resistor with the AC voltmeter. Move the resistor connection to each exposed metal part, particularly any exposed metal part having a return path to the chassis, and meausre the AC voltage across the resistor. Now, reverse the plug in the AC outlet and repeat each measurement. Voltage measured any must not exceed 0.75 V AC (r.m.s.). This corresponds to 0.5 mA AC (r.m.s.).
0.15 F AC TYPE
1500 10W
Good earth ground
AC VOLTMETER (Having 1000 ohms/volts, or more sensitivity)
Place this probe on each exposed metal part.
!
1. This equipment has been designed and manufactured to meet international safety standards.
2. It is the legal responsibility of the repairer to ensure that these safety standards are maintained.
3. Repairs m ust be made in accordance with the relevant safety standards .
4. It is essential that safety critical components are replaced by approved parts.
5. If mains voltage selector is provided, check setting for local voltage.
Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.
In regard with component parts appearing on the silk-screen pr inted side (parts side) of the PWB diagrams, the parts that are printed over with black such as the resistor ( ), diode ( ) and ICP ( ) or identified by the " " mark nearby are critical for safety.
(This regulation does not correspond to J and C version.)
1-2

Important for laser products

TH-A5
1.CLASS 1 LASER PRODUCT
2.DANGER : Invisible laser radiation when open and inter
lock failed or defeated. Avoid direct exposure to beam.
3.CAUTION : There are no serviceable parts inside the Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunctions.
4.CAUTION : The compact disc player uses invisible laserradiation and is equipped with safety switches whichprevent emission of radiation when the drawer is open and the safety interlocks have failed or are de feated. It is dangerous to defeat the safety switches.
REPRODUCTION AND POSITION OF LABELS
5.CAUTION : If safety switches malfunction, the laser is able
to function.
6.CAUTION : Use of controls, adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
!
Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.
CLASS 1 LASER PRODUCT
1-3
TH-A5

Preventing static electricity

1.Grounding to prevent damage by static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
2.About the earth processing for the destruction prevention by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players. Be careful to use proper grounding in the area where repairs are being performed.
2-1 Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.
2-2 Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption) Anti-static wrist strap
Conductive material (conductive sheet) or iron plate
3. Handling the optical pickup
1. In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.)
2. Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.
4.Handling the traverse unit (optical pickup)
1. Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.
2. Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a time when attaching it to the connector.
3. Handle the flexible cable carefully as it may break when subjected to strong force.
4. It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.
Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for pick-up and how to detach the substrate.
Solder is put up before the card
1. wire is removed from connector on the pick up board as shown in Figure. (When the wire is removed without putting up solder, the CD pick-up assembly might destroy.) Please remove solder after
2. connecting the card wire with when you install picking up in the substrate.
DVD mechanism assembly (bottom side)
DVD loading mechanism
Pick up board
Card wire
Short land
(These two points are soldered respectively, and are made to short-circuit)
Connector
1-4
DVD loader board
TH-A5

Disassembly method

Removing the top cover (See Fig.1)
1.
Remove the four screws A attaching the top cover on the both sides of the body.
2.
Remove the two screws B on the back of the body.
3.
Remove the top cover from behind in the direction of the arrow while pulling both sides outward.
Removing the front panel assembly
(See Fig.2A, 2B and 3)
Prior to performing the following procedure, remove the top cover.
1.
Remove the one screw a and remove the earth wier.
2.
Remove the three screws C attaching the front panel assembly on the bottom of the body.
3.
Remove the two screws D attaching the front panel assembly on the both sides of the body.
4.
Remove the claw1, claw2 and claw3, and detach the front panel assembly toward the front.
5.
Disconnect the card wire from the connector DW20 on the DSP board.
Top cover
Claw1
(bottom side)
Claw2 (both side)
B
A
2
Fig.1
Front panel assembly
CC
Fig.2A
Front panel
assembly
Claw3
Removing the power cord (See Fig.4)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the power cord from the connector CW1 on the main board and pull up the cord stopper upward.
Notes : The power cord is exchangeable.
Power cord
CW1
Tie band
D
(both side)
a
(fixing the earth wire)
Fig.2B
DSP board
DW20
Rear panel
Fig.4
Power cord
stopper
Front panel assembly
(Inner side)
Display board
Fig.3
1-5
TH-A5
Removing the DVD mechanism assembly (See Fig.5 and 6)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector J14 and J21 on the DVD MPEG board.
2.
Remove the two screws E attaching the DVD mechanism assembly and pull up with drawing out.
3.
Disconnect the harness from the connector J2 on the DVD loader board.
Removing the rear panel (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover and power cord.
1.
Disconnect the harness from the connector NW11 on the DSP board.
2.
Remove the two screws F, four screws G, five screws I attaching the each boards to the rear panel.
Rear panel
DVD mechanism assembly
DVD MPEG board
J14
E
J21
Fig.5
DVD mechanism assembly
3.
Remove the three screws J attaching the rear panel on the back of the body.
Removing the tuner pack (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector CON01 on the tuner pack.
2.
Remove the two screws F attaching the tuner pack to the rear panel.
Removing the jack board (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector VW2 on the jack board.
2.
Remove the four screws G attaching the jack board to the rear panel.
3.
Disconnect the connector VW1 on the jack board and pull up the jack board.
DVD loader board
J2
Fig.6
Rear panel
Fan motor
JJJ
DSP board
H
I
Fig.7
G
F
CON01
Removing the fan motor (See Fig.7 and 8)
Prior to performing the following procedures, remove the top cover .
1.
Disconnect the harness from the connector NW11 on the DSP board .
2.
Removing the two screws H attaching the fan motor on the rear panel.
1-6
Rear panel
NW11 (on the DSP board)
VW1
Fig.8
VW2
Tuner pack
Jack board
TH-A5
Removing the DSP board (See Fig.9)
Prior to performing the following procedure, remove the top cover, the front panel assembly and jack board.
1.
Untied the harness band and disconnect the harness from the connector CW2 on the main board.
2.
Disconnect the harness from the connector NW11 on the DSP board.
3.
Disconnect the card wire from the connector VW12 on the DSP board.
4.
Pull up the DSP board from the front side upwards disconnecting the connector DW10, DW13, DW14 and DW15.
Removing the main board (See Fig.10)
Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly, jack board and DSP board.
1.
Disconnect the card wire from the connector CW4 and CW8 on the main board.
2.
Disconnect the harness from the connector CW3 on the main board.
DSP board
(Front panel side)
Main board
CW8
K2
VW12
DW14DW15
Harness band
Fig.9
K1
Main board
CW2
NW11
(Rear panel side)
DW10DW13
Heat sink
(to which
power
transistor
is attached)
K1
3.
Remove the five screws I attaching the speaker terminals and jack to the rear panel (see fig.7).
4.
Remove the six screws K1 (short) and one screw K2 (long) attaching the main board.
5.
When the rear panel is not removed, pull up the main board from front side.
Removing the power transistor & power IC (See Fig.10 and 11)
Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly, jack board, DSP board and main board.
1.
After removing the solder part soldered to the main board, remove each screw and remove the heat sink from Power transistor.
2.
After removing the solder part soldered to the main board, remove each screw and remove the heat sink from Power IC.
CW4
Fig.10
(Each power transistor is fixed)
Solder part
Solder part Solder part
Heat sink (to which power IC is attached)
Fig.11
CW3
Power ICs
Main board
(Reverse side )
Solder part (Power IC is fixed)
1-7
TH-A5
Removing the DVD power board (See Fig.12)
Prior to performing the following procedure, remove the top cover, front panel assembly and DSP board.
1.
Disconnect the harness and card wire from the connector PW1, PW2 and PW5 on the DVD power board.
2.
Remove the one screw L1 (short) and two screws L2 (long) attaching the DVD power board.
L1
PW5 PW2
DVD
power
board
Removing the power transformer (See Fig.12)
Prior to performing the following procedure, remove the top cover.
1.
Cut off the tie band fixing the harness, if needed.
2.
Disconnect the harness from the connector CW2 on the main board (see fig.9) and PW1, PW2 on the DVD power board.
3.
Remove the four screws M attaching the power transformer.
PW1
Tie band
L2
Power transformer
M
Fig.12
<Front panel assembly section>
Removing the display board & switch board (See Fig.1 and 2)
Prior to performing the following procedure, remove the top cover and the front panel assembly.
1.
Disconnect the card wire from the connector FW1 on the display board.
2.
Remove the five screws A attaching the display board on the inner of the front panel assembly.
3.
Remove the four screws B attaching the switch board on the inner of the front panel assembly.
4.
Disconnect the harness from connector FW2 on the display board, if needed.
Removing the front window (See Fig.2 and 3)
Prior to performing the following procedure, remove the top cover, front panel assembly, display board and switch board.
FW1
Display board
A
Switch button
Front panel assembly
Switch board
FW2
Fig.1
(inner side)
B
CCC
Claw
Fig.2
Front panel assembly (front side)
Remove the switch buttons, if needed.
1. Remove the three screws C attaching the front
2. window on the front panel.
Remove the eight claws fixing the front window on
3. the front panel.
1-8
Front window
Fig.3
TH-A5
<DVD mechanism assembly section>
Removing the DVD loader board (See Fig.1 to 3)
Prior to performing the following procedure, remove the top cover and DVD mechanism assembly.
1.
Disconnect the card wire from the connector J6 on the DVD MPEG board.
2.
Disconnect the harness from the connector on the motor board.
3.
Disconnect the harness from the connector J5 on the DVD loader board.
4.
Remove the four screws A attaching the DVD loader board to DVD mechanism assembly.
CAUTION!! (see fig.3) Before removing the card wire which
connects the pickup board and DVD loader board, solder the two soldering parts and make it short-circuit. Moreover, while having removed the card wire, don't remove these solder.
DVD MPEG board
DVD loader board
A
U9
J5
DVD mechanism assembly
(top side)
J6
Fig.1
DVD mechanism assembly
(bottom side)
Motor board
Connector
Fig.2
5.
Disconnect the card wire from the connector U9 on the DVD loader board.
ONE POINT
How to eject the DVD tray manually (see fig.2)
The white lever of the mark is moved in the direction of the arrow. Then, the tray will be opened. Moreover, the tray is separable from a DVD mechanism assembly by removing two screws of the mark (see fig.1) and drawing out the tray.
Removing the DVD loading mechanism (See Fig.4)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board.
1.
Remove the two screws B and remove the bracket.
2.
Remove the one screw C fixing the DVD loading mechanism.
Pick up
board
Lever
Soldering parts
X
Motor board
Fig.3
DVD mechanism assembly
B
Bracket
DVD loading
mechanism
(bottom side)
DVD loading
mechanism
3.
Move the lever in the direction of the arrow X.
4.
Remove the DVD loading mechanism from the DVD mechanism assembly by moving it in the direction of the arrow Y.
Y
C
Fig.4
1-9
TH-A5
m
)
Removing the DVD traverse mechanism
(See Fig.5)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly, DVD loader board and DVD loading mechanism.
1.
Remove the four screws D attaching the DVD traverse mechanism to DVD loading mechanism.
Removing the holder & DVD MPEG board (See Fig.6 and 7)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board.
1.
Remove the two claws1, and remove the holder from the DVD mechanism assembly as it is pushed down.
DVD traverse
mechanism
Claw1
D
Holder
DVD loading mechanis
(top side
D
Fig.5
Note: When removing only the DVD MPEG board, it is not necessary to remove this holder.
2.
Remove the four claws2 and remove the DVD MPEG board from the holder.
ONE POINT
When inserting DVD MPEG board in holder. (see fig.8)
Holder
Holder
DVD mechanism assembly
Fig.6
DVD MPEG board
Fig.7
DVD MPEG board
(bottom side)
Claw2
1-10
Insert in after uniting with a lower claws, when inserting DVD MPEG board in holder.
Fig.8
<Speaker section> [SP-XSA5 / Satellite speaker]
It is exchange in a unit.
[SP-XCA5 / Center speaker]
It is exchange in a unit.
[SP-WA5 / Woofer]
Removing the front panel (See Fig.1 and 2)
1.
Remove the six bosses and remove the front panel.
TH-A5
Front panel
The tool with
a flat tip
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
2.
The packing separates. It removes if needed.
Removing the speaker unit (See Fig.3 to 5)
1.
Remove the four bosses and remove the net assembly.
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
2.
Remove the eight screws A attaching the speaker unit to cabinet.
3.
Disconnect the code from the two terminals of the speaker unit.
Packing
Fig.1
Fig.2
Net assembly
Front panel (inner side)
Boss
Boss
Terminals
red
Speaker unit (reverse side)
Fig.5
Fig.3
Code
Speaker unit
black
A
A
Cabinet
Fig.4
1-11
TH-A5

Wiring connection

J6
J14
2
0
J21
3809-001273
DVD MPEG
BOARD
3809-001295
9
AH39-00368A
0
J3
J4
0
9
3809-001294
DVD LOADER BOARD
U9
J5
J2
0
9
Color codes are shown below. 1 Brown 2 Red 3 Orange 4 Yellow 5 Green
3809-001274
3809-001224
CON01
VW2
VW1
6 Blue 7 Violet 8Gray 9 White 0 Black
TUNER PACK
JACK BOARD (V-OUT)
0
9
SWITCH BOARD
FW3
AH39-00176A
0
9
FW2
DISPLAY BOARD
3809-001296
6
1
AH39-50001K
0
9
DW20
PW1
PW3
BOARD
3
DW15
0
DVD
POWER
4
9
5
PW4
0
6
PW5
PW2
1
VW11
9
2
AH39-00104A
AH39-00291A
DSP1 BOARD
9
4
2
8
0
3
DW14
DW32
0
2
DW12
DW23
DW13
DSP2 BOARD
3809-001283
9 2 4
DW10
DW31
8
3
0
NW11
DW11
CW4
0
2
CW7
RE3
RE4
CW6
CW8
0
2
CW1
CW2
1 C
FU1
FU2
FU4
FU3
PT1
CW5
1-12
FW1
0
POWER TRANCE
6
1
2
6
3
5
1
4
0
9
2
0
CW3
MAIN BOARD

Adjustment method

1. Tuner
TH-A5
*Adjustment Location of Tuner PCB
ITEM
Received FREQ.
Adjustment point
Output 1~7.0V
AM(MW) OSC Adjustment
: 522~1629KHz (9k step)
A
US/UB/
UW/UJ
: 531~1602KHz (9k step) 530~1600KHz (10k step)
MAIN PCB
MO
VT GND
AM(MW) RF Adjustment
603 KHz
MA
Maximum Output(Fig1-1)
TESTER
Fig 1-1 OSC Voltage
1-13
TH-A5
FM THD Adjustment
SSG FREQ. Adjustment
point (FD)
Output Minimum Distortion (0.4% below)
(Figure 1-2)
FM Search Level Adjustment
SSG FREQ.
FM DETECTOR COIL
60 dB
98 MHz
98 MHz
Output
Output
Output
Output GND
GND
GND
GND
FM S.S.G
FM Antenna Terminal
Te
T
Speaker Terminal
Te
T
SET
SET
SET
SET
Input
output
output
output
output
Distortion Meter
Figure1-2 IF CENTER and THD Adjustment
28 dB
FM Antenna
Oscilloscope
Input
Input
Input
Input
Adjustment point
(SVR3)
Output
BEACON SENSITIVITY SEMI-VR(20K )
28 dB(
dB)
Adjust SVR1 so that “TUNED” of FL T is lighted (Figure 1-3)
*Adjust FM S.S.G level to 28dB
AM(MW) I.F Adjustment
SSG FREQ. Frequency
450 kHz 522 kHz
Adjustment point
AA
Maximum output (Figure 1-4)
SET
GND
GND
GND
FM S.S.G
GND
FM IN
Figure1-3 FM Auto Search Level Adjustment
60cm
OUTPUT
AM SSG 450KHZ
INPUT
AM ANT IN
Speaker Terminal
OUTPUT
20 k
AM IF
VTVM Oscilloscope
Figure1-4 AM I.F Adjustment
Notes: This set is a non-adjusted set fundamentally. It is adjusted when the tuner pack is exchanged.
1-14

Description of major ICs

BA5983FM (U6) : 4CH driver
1.Block diagram
TH-A5
27
28
Vcc
1
2
25
26
10k
10k
3
20k
10k
4
24
5
23 22
10k
10k
6
20k
10k
7
2.Pin function
Pin No. Pin No.
Symbol Symbol
1
BLAS IN
2
OPIN1(+)
3
OPIN1(-)
4
OPOUT1
5
OPIN2(+)
6
OPIN2(-)
7
OPOUT2
8
9 10 11 12 13 14
GND
STBY1
PowVcc1
VO2(-)
VO2(+)
VO1(-)
VO1(+)
I/O I/O
Input for Bias-amplifier
I
Non inverting input for CH1 OP-AMP
I
Inverting input for CH1 OP-AMP
I
Output for CH1 OP-AMP
O
Non inverting input for CH2 OP-AMP
I
Inverting input for CH2 OP-AMP
I
Output for CH2 OP-AMP
O
Substrate ground
­Input for CH1/2/3 stand by control
I
Vcc for CH1/2 power block
­Inverted output of CH2
O
Non inverted output of CH2
O
Inverted output of CH1
O
Non inverted output of CH1
O
Function
15 16 17 18 19 20 21 22 23 24 25 26 27 28
21
20
STAND BY CH4
STAND BY CH1/2/3
89
VO4(+)
VO4(-)
VO3(+)
VO3(-)
PowVcc2
STBY2
GND OPOUT3 OPIN3(-)
OPIN3(+)
OPOUT4 OPIN4(-)
OPIN4(+)
PreVcc
17 16
18
19
Vcc
Vcc
10
10k
10k
10k
10k
11
Level Shift
Level Shift
10k
10k
10k
10k
Level Shift
Level Shift
10k
10k
10k
10k
12
13
Function
O
Non inverted output of CH4
O
Inverted output of CH4
O
Non inverted output of CH3
O
Inverted output of CH3
-
Vcc for CH3/4 power block
I
Input for Ch4 stand by control
-
Substrate ground
O
Output for CH3 OP-AMP
I
Inverting input for CH3 OP-AMP
I
Non inverting input for CH3 OP-AMP
O
Output for CH4 OP-AMP
I
Inverting input for CH4 OP-AMP
I
Non inverting input for CH4 OP-AMP
-
Vcc for pre block
15
10k
10k
10k
10k
14
74VHC574 (DIC16, DIC17) : Flip flop
OE
D0 D1 D2 D3 D4 D5 D6 D7
GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
Vcc O0 O1 O2 O3 O4 O5 O6 O7 CP
Symbol
D0-D7
CP OE
O0-O7
Function
Data Inputs Clock Pulse Input 3-STATE Output Enable Input 3-STATE Outputs
3. Truth table2. Pin function1. Pin layout
Inputs Outputs
Dn
CP
H
L
X
H:HIGH Voltage Level L:LOW Voltage Level X:Immaterial Z:High Impedance :HIGH to LOW transition
X
OE
L L
H
On
H
L
Z
1-15
TH-A5
ZiVA-5 (U8) : DVD controller
1. Pin layout
DA-IEC958
DA-DATA3
DA-DATA2
VSS
156
155
154
153
DAI-DATA
DAI-BCK/SYSCLKBP
DAI-LRCK/IEC958BP
2
C_CL
I I
2
C_DA RTS1 RXD1 TXD1 CTS1
VSS
VDD_3.3 SD-DATA7 SD-DATA6 SD-DATA5 SD-DATA4
VSS
VDDC SD-DATA3 SD-DATA2 SD-DATA1 SD-DATA0
SD-REQ
SD-EN
VSS
VDD_3.3
SD-ERROR
SD-CLK
VSYNC/HIRQ1
RTS2/SPI_CLK RXD2/SPI_MISO TXD2/SPI_MOSI
CTS2/SPI_CS
VDD_5
HCS4 HCS3 HCS2 HCS1 HCS0
VSS
VDD_3.3
TRST
TDO TMS
TCK
RESET
ALE VSS
VDDC
HAD3 HAD2
VSS
157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199
TDI
200 201 202 203 204 205 206 207 208
152
123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051
VDD_3.3
DA-DATA1
DA-DATA0
151
150
DA-BCK
DA-LRCK
149
148
DA-XCK
VSS
147
146
VDDC
145
A_VSS1
A_VDD1
144
143
A_VDD2
A_VSS2
142
141
XVDD
140
XTAL/VCLK216BP
XTAL
XVSS
VSS_RREF
VDAC_RREF
VDD_RREF
139
138
137
136
135
134
VDAC_DVDD
VDAC_DVSS
VDAC_0
VDAC_VDD0
133
132
131
130
VDAC_0B
VDAC_1
VDAC_VDD1
129
128
127
VDAC_1B
VDAC_2
VDAC_VDD2
126
125
124
VDAC_2B
VDAC_3
VDAC_VDD3
123
122
121
VDAC_3B
VDAC_4
VDAC_VDD4
120
119
118
VDAC_4B
HSYNC/IRQ2
VDATA0
117
116
115
VDATA1
VDATA2
114
113
VSS
VDD_3.3
112
111
VDATA3
VDATA4
110
109
VDATA5
VDATA6
VDATA7
108
107
106
VCLK
105
104 103 102 101 100
52
VDD_3.3 VSS MDATA31 MDATA30 MDATA29 MDATA28
99
VDD_3.3
98
MDQM3
97
VSS
96
MDATA27
95
MDATA26
94
MDATA25
93
MDATA24
92
MDATA23
91
MDATA22
90
MDATA21
89
MDATA20
88
VDD_3.3
87
MDQM2
86
VSS
85
MDATA19
84
MDATA18
83
MDATA17
82
MDATA16
81
VDDC
80
VSS
79
MDATA15
78
MDATA14
77
MDATA13
76
MDATA12
75
VDD_3.3
74
MDQM1
73
VSS
72
MDATA11
71
MDATA10
70
MDATA9
69
MDATA8
68
MDATA7
67
MDATA6
66
MDATA5
65
MDATA4
64
VDD_3.3
63
MDQM0
62
VSS
61
MDATA3
60
MDATA2
59
MDATA1
58
MDATA0
57
MCLK
56
VDD_3.3
55
VSS
54
MWE
53
BA1
HA1
VDD_3.3
HAD15
HAD14
HAD13
HAD12
HAD11
HAD10
HAD9
HAD8
HAD7
VDD_3.3
VSS
HAD6
HAD5
HAD4
HAD3
HAD2
HAD1
VDD_3.3
VSS
HAD0
HDTACK/WAIT
HIRQ0
UDS/UWE
R/W
IRRX1
LDS/LWE
VSS
VDDC
VSS
VDD_3.3
MADDR9
MADDR8
MADDR7
MADDR6
MADDR5
MADDR4
MADDR3
MADDR2
MADDR1
MADDR0
VSS
VDD_3.3
MADDR10
MADDR11
BA0
MCS0
MCS1
MRAS
MCAS
2. Pin function (1/4)
1
Name
RESET
Pin No.
202
Description
Type
Active Low Reset. Assert for at least 5-milliseconds in the presence of
I
clock to reset the entire chip.
VCLK XOUT
105 138
Video clock that outputs 27 MHz.
I/O
Crystal output. When the internal DCXO is used, a 13.5 MHz crystal
O
should be con-nected between this pin and the XIN pin.
XIN/bypass clk_216
139
Crystal input. When the internal DCXO is used, a 13.5 MHz crystal should
I
be con-nected between this pin and the XOUT pin. When an external oscillator or VCXO is used, its output should be connected to this pin.
System Services
When configured for an external bypass clock, a 216 MHz clock should be connected to this pin. The frequency of an external VCXO can be either 27 or 13.5 MHz.
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1-16
2. Pin function (2/4)
Name
VNW VDDP VDD25 XVDD VDD VDD_VDAC[4:0] VDAC_DVDD A_VDD[2:1] VDAC_REFVDD GNDP GND
Power and GroundHost Interface
GND25 VDAC_DVSS AVSS[2:1] VDAC_REFVSS XVSS HCS[4:2]/GPIO[41:43]
HCS[1:0]
HA[3:1]
HA[15:0]
HDTACK/WAIT HIRQ0
HUDS/UWE
HLDS/LWE
HREAD ALE MCS[1:0] MCAS MRAS MDQM[3:0]
MA[11:0] MD[31:0]
MWE
SDRAM Interface
MCLK BA[1:0] HSYNC/HIRQ2/ GPIO1[9]
VCLK
VDATA[7:0]/GPIO[1:7]
VSYNC/HIRQ1/ GPIO36
Digital Video Input/Output
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
12, 20, 111, 152, 167, 181, 196
32, 44, 55, 63, 74, 87, 98, 104
13, 21, 112, 153, 166, 180, 195, 208
31, 43, 54, 61, 72, 85, 96, 103
Pin No.
189
140
30, 80, 145, 173, 205
118, 121, 124, 127, 130
133
142, 143
134
29, 79, 146, 172, 204
132
141, 144
136 137
190-192
193, 192
206, 207, 2
3-11, 14-19, 22
23 24
25
26
27
203
50, 49
52 51
97, 86, 73, 62
46, 45, 33-42
102-99, 95-88, 84-81,
78-75, 71-64, 60-57
53
56
47, 48
116
105
106-110, 113-115
184
Type
Power Power Power Power Power Power
Power Ground Ground Ground Ground Ground Ground Ground
O
I
I/O
I/O
I/OD
I/O
I/O
I/O
I/O I/O
O O O O
O
I/O
O
O O
I/O
I/O
I/O
I/O
1
Description
5-V supply voltage for 5V-tolerant I/O signals.
3.3-V supply voltage for I/O signals
3.3-V supply voltage for SDRAM I/O signals
3.3V Crystal interface power
1.8-V supply voltage for core logic Analog Video DAC Power
3.3V Digital supply for 5 DACs
3.3-V Analog PLL Power
3.3V Analog Video Reference Voltage Ground for I/O signals Ground for core logic Ground for SDRAM I/O signals Digital VSS for DACs Analog PLL Ground Video Analog Ground Crystal interface ground Host chip select. Host asserts HCS to select the controller for a read or write operation. The falling edge of this signal triggers the read or write operation. General Purpose I/Os 41, 42, and 43, respectively. Host chip select. Host asserts HCS to select the contr ol le r fo r a re ad or write operation. The falling edge of this signal triggers the read or write operation. Host (muxed address) address bus. 3-bit address bus selects one of eight host inter-face registers. These signals are not muxed in ATAPI master mode. HA[15:0] is the 16-bit (muxed address and data) bi-directional host data bus through which the host writes data to the decoder Code FIFO. MSB of the 32-bit word is writ-ten first. The host also reads and writes the decoder internal registers and local SDRAM/ROM via HA[7:0]. These signals are not muxed for ATAPI master mode. Host Data Transfer Acknowledge. Host interrupt. Open drain signal, must be pulled-up via 4.7k to 3.3 volts. Driven high for 10 ns before tristate. Host Upper Data Strobe. Host high byte data, HA[15:8], is valid when this pin is active. Host Lower Data Strobe. Host low byte data, HA[7:0], is valid when this pin is active. Read/write strobe Address latch enable Memory chip select. Active LOW SDRAM Column Address Strobe. Active LOW SDRAM Row Address Strobe. These pins are the bytes masks corresponding to MD[7:0], [15:8], [23:16] and [31:24]. They allow for byte reads/writes to SDRAM. SDRAM Address SDRAM Data
SDRAM Write Enable. Specifies transaction to SDRAM: read (=1) or write (=0) SDRAM Clock SDRAM bank select Horizontal sync. The decoder begins outputting pixel data for a new horizontal line after the falling (active) edge of HSYNC. Host Interrupt Request 2 General Purpose I/O 9 Video clock. Clocks out data on input. VDATA[7:0]. Clock is typically 27 MHz. Video data bus. Byte serial CbYCrY data synchronous with VCLK. At powerup, the decoder does not drive VDATA. During boot-up, the decoder uses configuration parameters to drive or 3-state VDATA. General Purpose I/Os [1:7] Vertical sync. Bi-directional, the decoder outputs the top border of a new field on the first HSYNC after the falling edge of VSYNC. VSYNC can accept vertical synchroni-zation or top/bottom field notification from an external source. (VSYNC HIGH = bot-tom field. VSYNC LOW = Top field) Active Low Host Interrupt Pin General Purpose I/O 36
TH-A5
1-17
TH-A5
2. Pin function (3/4)
Name
SDDATA[7]/VDATA2[7] /HDMARQ/GPIO24
SDDATA6/VDATA2[6] /HXCVR_EN/GPIO25
SDDATA5/VDATA2[5] HDMACK/GPIO26
SDDATA4/VDATA2[4]/ GPIO27
SDDATA3/ VDATA2[3]/GPIO28
SDDATA2/ VDATA2[2]/GPIO29
SDDATA1/
Parallel DVD/CD or Serial CD Interface
VDATA2[1]/GPIO30
SDDATA0/ VDATA2[0]/GPIO31
SDCLK
SDERROR
SDEN/GPIO33
SDREQ/GPIO32
VDAC_[4B:0B] VDAC_4 VDAC_3V DAC_2 VDAC_1 VDAC_0 VDAC_REF
VCLK
Analog Video OutputAudio InterfaceDigital Mic In
ADATA[3:0]/GPIO[4:1]
BCK LRCK
XCK
IEC958/GPIO14
DAI_DATA/GPIO15
DAI_BCK/ BYPASS_SYSCLK/ GPIO16 DAI_LRCK/ IEC958BP/GPIO17
Pin No.
168
169
170
171
174
175
176
177
183
182
179
178
117, 120, 123, 126, 129
119 122 125 128 131 135
105
155, 154, 151, 150
149
148 147
156
157
158
159
Type
I
I
I
I
O
Analog O Analog O Analog O Analog O Analog O Analog O
Analog I
I/O
O
O
O
I/O
O
I
I
I
1
Description
Compressed data from DVD DSP. Bit 7. In parallel mode, bit 7 is the first
(earliest in time) bit in the bitstream, while bit 0 is the last bit.
Video Data Bus 2, Bit 7
Host DMA Request
General Purpose I/O 24
Compressed data from DVD DSP. Bit 6.
Video Data Bus 2, Bit 6
ATAPI Transceiver Enable
General Purpose I/O 25
Compressed data from DVD DSP. Bit 5.
Video Data Bus 2, Bit 5
Host DMA Acknowledge
General Purpose I/O 26
Compressed data from DVD DSP. Bit 4.
Video Data Bus 2, Bit 4
General Purpose I/O 27
Compressed data from DVD DSP. Bit 3.
Video Data Bus 2, Bit 3
General Purpose I/O 28
Compressed data from DVD DSP. Bit 2.
Video Data Bus 2, Bit 2
General Purpose I/O 29
Compressed data from DVD DSP. Bit 1.
Video Data Bus 2, Bit 1
General Purpose I/O 30
In serial mode, bit 0 should be used as the input, with the unused bits
either used as GPIOs or tied to ground.
Video Data Bus 2, Bit 0
General Purpose I/O 31
Data clock. The maximum frequency is 25 MHz for parallel mode, and
???? MHz for serial mode. The polarity of this signal is programmable.
Error in input data. This signal carries the error bit associated with the
channel data type (if set, the byte is corrupted).
Data enable. Assertion indicates that data on SDDATA[7:0] is valid.
The polarity of this signal is programmable.
General Purpose I/O [33]
Bitstream request. controller asserts SDREQ to indicate that the bitstream
input buffer has available space.
General Purpose I/O 32
Video DAC Bias Bits[4:0]
DAC video output format: R, V, C, or CVBS. Macrovision encoded.
DAC video output format: B, U, C, or CVBS. Macrovision encoded.
DAC video output format: G or Y. Macrovision encoded.
DAC video output format: C. Macrovision encoded.
DAC video output format: CVBS or Y. Macrovision encoded.
Video DACs Reference Resistor. Connecting to pin 136 through
a 1.18K+/- 1% resis-tor is required.
System clock that drives internal PLLs. ZiVA-5 27-MHz TTL oscillator.
(See descrip-tion of VCLK for Digital Video Output.) Also optional video
clock for internal PLLs or external encoder.
PCM Data Out. Eight channels. Serial audio samples relative to BCK
and LRCK. General Purpose I/Os [4:1]
PCM Bit Clock. BCK can be either 48 or 32 times the sampling frequency
PCM Left Clock. Identifies the channel for each sample. The polarity is
programma-ble.
Audio External Frequency clock input or output. BCK and LRCK are
derived from this clock.
PCM data out (IEC-958 format ) or compressed data out
(IEC-1937 format). General Purpose I/O [14]
PCM data input.
General Purpose I/O [15]
PCM input bit clock.
BYPASS_SYSCLK: Alternate function TBS.
General Purpose I/O [16]
PCM left/right clock.
IEC958 input bypass
General Purpose I/O [17]
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1-18
2. Pin function (4/4)
1
Name
IRRX1/GPIO0
IR
IDC_CL/GPIO18
IDC
IDC_DA/GPIO19
RTS1/GPIO20
RXD1/GPIO21
TXD1/GPIO22
UART1UART2JTAG
CTS1/GPIO23
RTS2/SPI_CLK/ GPIO37
RXD2/SPI_MISO/ GPIO38
TXD2/SPI_MOSI/ GPIO39
CTS2/SPI_CS/ GPIO40
TRST
TDO TDI/GPI0
TMS/GPI1
TCK
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
Pin No.
28
160
161
162
163
164
165
185
186
187
188
197
198 199
200
201
Description
Type
IR Remote Receive. This input connects to an integrated (photo diode,
I
band pass, demodulator) IR receiver. General Purpose I/O 0 Serial clock signal for IDC data transfer. It should be pulled up to the
I/O
positive supply voltage, depending on the device) using an external pull-up resistor. General Purpose I/O [18] Serial data signal for IDC data transfer. It should be pulled up to the supply voltage using an external pull-up resistor. General Purpose I/O [19] Ready to send, UART1
O
General Purpose I/O [20] Receive data, UART1
I
General Purpose I/O [21] Transmit data, UART1
O
General Purpose I/O [22] Clear to send, UART1
I
General Purpose I/O [23] Ready to send, UART2
O
Serial Peripheral Interface Clock General Purpose I/O [37] Receive data, UART2
I
Serial Peripheral Interface - Master Input/Slave Output General Purpose I/O [38] Transmit data, UART2
O
Serial Peripheral Interface - Master Output/Slave Input General Purpose I/O [39] Clear to send, UART2
I
Serial Peripheral Interface ???? General Purpose I/O [40] Test reset. BST reset - resets the TAP controller.
I
This signal must be pulled low. Test data Out. BST serial data output.
O
Test data In. BST serial data chain input.
I
General Purpose Input pin 0. Test mode select. Controls state of test access port (TAP) controller.
I
General Purpose Input pin 1. Test clock. Boundary scan test (BST) serial data clock.
I
TH-A5
3. Block diagram
Parallel/serial DVD Interface
I2S Stereo In
32-128Mbit
SDRAM
SDRAM Controller
Track Buffer
Processor
Audio
Decryption
ZiVA
A/V Core
Graphics
Engine
Input Unit
System Control Bus
Bus Interface Unit
IR GPIO SPI UART1&2ASYNC BUS IDC
ATAPI
Interlaced/
Progressive
Encoder
SPARC
Microprocessor
Phase
Lock
Loop
Video
JTAG Interface
Five 10-bit
Audio
Output
Unit
Video DACs
CCIR 656 Digital Video
Composite Y/R C Cr/Pr/G Cb/Pb/B
IEC 958/1937
Downmix Left/right Center/subwoofer Left/ right/surround
Remote Control
13.5 MHz Crystal
1-19
TH-A5
CS493292 (DIC11) : Audio decoder
1. Pin layout
A1,SCDIN
RD,R/W,EMOE,GPIO11
WR,DS,EMWR,GPIO10
AUDATA3,XMT958
DGND1
VD1
MCLK
SCLK
LRCLK
AUDATA0
AUDATA1
A0,SCCLK
DATA7,EMAD7,GPIO7
DATA6,ENAD6,GPIO6 DATA5,EMAD5,GPIO5 DATA4,EMAD4,GPIO4
VD2
DGND2 DATA3,EMAD3,GPIO3 DATA2,EMAD2,GPIO2 DATA1,EMAD1,GPIO1 DATA0,EMAD0,GPIO0
2. Block diagram
65432144 43 42 41 40
7 8 9 10 11 12 13 14 15 16 17
18 19 20 21 22 23 24 25 26 27 28
CS
VD3
DGND3
SDATAN1
ABOOT,INTERQ
EXTMEM,GPIO8
SCLKN1,STCCLK2
SCDIO,SCDOUT,PSEL,GPIO9
AUDATA2
39
DC
38
DD
37
RESET
36
AGND
35
VA
34
FILT1
33
FILT2
32
CLKSEL
31
CLKIN
30
CMPREQ,LRCLKN2
29
LRCLKN1
CMPCLK,SCLKN2
CMPDAT,SDATAN2,RCV958
1-20
CMPDAT
SDATAN2
CMPCLK
SCLKN2
CMPREQ
LRCLKN2
SCLKN1
STCCLK2 LRCLKN1
SDATAN1
CLKIN
CLKSEL
RESET
Compressed
Data Input
Interface
Digital
Audio
Input
Interface
PLL
Clock Manager
DATA7:0
EMAD7:0
GPIO7:0
Framer
Shifter
Input
Buffer
Controller
RAM Input
Buffer
CS
RD
R/W
EMOE
GPIO11
SCDIO
WR
SCDOUT
DS
EMWR
GPIO10
Parallel or Serial Host Interface
DPS Processing
RAM
Program
Memory
ROM
Program
Memory
PSEL
GPIO9A0SCCLKA1SCDIN
24-Bit
RAM
Data
Memory
ROM
Data
Memory
STC
VD[3:1]DGND[3:1]AGNDVAFILT1 FILT2
RAM
Output
Buffer
ABOOT
INTERQ
EXTMEM
GPIO8
Output
Formatter
DC DD
MCLK
SCLK
LRCLK
AUDATA[2.0]
XMT958 /AUDATA3
3. Pin function
TH-A5
Pin No. 1,12,23 2,13,24
3 4
5 6
7 8
9 10 11 14 15 16 17 18 19 20 21 22 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
Symbol
VD1,VD2,VD3
DGND1,DGND2,DGND3
AUDATA3,XMT958
WR,DS,EMWR,GPIO10
RD,R/W,EMOE,GPIO11
A1,SCDIN
A0,SCCLK
DATA7,EMAD7,GPIO7
DATA6,ENAD6,GPIO6 DATA5,EMAD5,GPIO5 DATA4,EMAD4,GPIO4 DATA3,EMAD3,GPIO3 DATA2,EMAD2,GPIO2 DATA1,EMAD1,GPIO1 DATA0,EMAD0,GPIO0
CS
SCDIO,SCDOUT,PSEL,GPIO9
ABOOT,INTERQ
EXTMEM,GPIO8
SDATAN1
SCLKN1,STCCLK2
LRCLKN1
CMPDAT,SDATAN2
CMPCLK,SCLKN2
CMPREQ,LRCLKM2
CLKIN
CLKSEL
FILT1 TILT2
VA
AGND
RESET
DC
DD AUDATA2 AUDATA1 AUDATA0
LRCLK
SCLK MCLK
Function Digital Positive Supply Digital Supply Ground SPDIF Transmitter Output, Digital Audio Output 3 Host write strobe or Host data strobe or External Memory write enable or General purpose input& output Number 10 Host Parallel Output Enable or Host Parallel R/W or External Memory Output Enable or General Purpose Input & Output Number11 Host Address Bit One or SPI Serial Control Data Input Host Parallel Address Bit Zero or Serial Control Port Clock Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Data Bus Host Parallel Chip Select, Host Serial SPI Chip Select Serial Control Port Data Input and Output, Parallel Port Type Select Control Port Interrupt Request, Automatic Boot Enable External Memory Chip Select or General Purpose Input & Output Number 8 PCM Audio Data Input Number One PCM Audio Input Bit Clock PCM Audio Input Sample Rata Clock PCM Audio Data Input Number Tow PCM Audio Input bit Clock PCM Audio Input Sample Rate Clock Master Clock Input DSP Clock Select Phase Locked Loop Filter Phase-Locked Loop Filter Analog Positive Supply Analog Supply Ground Master Reset Input Reserved Reserved Digital Audio Output 2 Digital Audio Output 1 Digital Audio Output 0 Audio Output Sample Rate Clock Audio Output Bit Clock Audio Master Clock
BA4560 (IC2, IC5, IC6, IC7, CIC11, CIC13, FIC2, FIC4, FIC5, FIC6, FIC11, RIC11, RIC13)
: Dual op amp.
1.Pin layout
V
OUT1
– IN1
+ IN1
V
1
2
1ch
+
3
EE
4
2ch
+
CC
8
OUT2
7
– IN2
6
+ IN2
5
1-21
TH-A5
SP3721A (U7) : DVD driver
1.Pin layout
1
16
2.Pin function (1/2)
Pin No.
2
3,4
5~6
7~ 8
11~14
15~16
Symbol I/O Function
1
DVDRFP DVDRFN
PD1,PD2
A2,B2 C2,D2
9
10
17 18 19 20 21 22 23 24 25
26
27 28 29 30
31
32
33
CP
CN
A,B,C,D
E,F
CDTE
VCI2
NC
VNB DVDPD DVDLD
CDPD CDLD
LDON#
VC
VCI
VPB
MIRR
MP
MB
FDCHG#
MLPF
I/O
I/O
64 ~ 49
48
~
17 ~ 32
RF Signal Inputs. Differential RF signal attenuator input pins.
I
CD Photo detector Interface Inputs. Inputs from the CD photo detector error outputs.
I
Photo Detector Interface Inputs. AC coupled inputs for the DPD from
I
the main beam Photo detector matrix outputs. Differential Phase tracking LPF pin. An external capacitance is connected between this pin and the CN pin. Differential Phase tracking LPF pin. An external capacitance is connected between this pin and the CP pin. Photo Detector Interface Inputs. Inputs from the main beam Photo
I
detector matrix outputs. CD tracking Error Inputs. Inputs from the CD photo detector error outputs.
I
CD Tracking. E-F Opamp output for feedback.
­Reference Voltage input. DC bias voltage input for the servo input reference.
­No Connect.
­Ground. Ground pin for the servo block.
­APC Input. DVD APC input pin from the monitor photo diode.
I
APC output. DVD APC output pin to control the laser power.
O
APC Input. DVD APC input pin from the monitor photo diode.
I
APC output. DVD APC output pin to control the laser power.
O
APC output. on/off. APC output control pin. A low level activates the
I
LD output. (open high) Reference Voltage output. This pin provides the internal DC bias
­reference voltage (+2.5+ fix). Output impedance is less than 50 ohms. Reference Voltage input. DC bias voltage input for the servo input reference.
­Power. Power supply pin for the servo block.
­Mirror Detect Output. Mirror Detect comparator output. Pseudo CMOS output.
O
MIRR signal Peak hold pin. An external capacitance is connected to
­between this pin and VPB. MIRR signal Bottom hold pin. An external capacitance is connected to
­between this pin and VPB. Low Impedance Enable. A TTL compatible input pin that activates the FDCHG switches.
I
A low level activates the switches and the falling edge of the internal FDCHG triggers the fast decay for the NIRR bottom hold circuit. (open high) MIRR signal LPF pin. An external capacitance is connected between this pin and VPB.
-
~
33
1-22
2.Pin function (2/2)
Pin No.
34 35
36
37
38 39
40 41 42 43 44
45
46
47
48
49
50 51 52 53
54
55
56
57 58 59 60 61 62 63 64
Symbol
MEVO
MIN
PI
DFT
TPH
MEV
MEI
TE FE
CE
LCN
LCP
SCLK
SDATA
SDEN
HOLD1
VNA FNN FNP
DIP
DIN
RX
BYP
SIGO
VPA
AIP
AIN ATON ATOP CDRF
CDRFDC
I/O
SIGO Bottom Envelope Output. Bottom envelope for Mirror detection.
O
RF signal Input for Mirror. AC coupled inputs for the mirror detection
I
circuit from the pull-in signal output. (PI) Pull-in Signal Output. The summing signal output of A,B,C,D or PD1,
O
PD2 for mirror detection. Reference to VCI. Defect Output. Pseudo CMOS output. When a defect is detected, the
O
DFT output goes high. Also the servo AGC output can be monitored at this pin, When CAR bits 7-4 are '0011'. PI Top Hold pin. An external capacitance is connected between this pin and VPB.
­SIGO Bottom Envelope pin. An external capacitance is connected
­between this pin and VPB.
Mirror Envelope Input. The SIGO envelope input pin.
I
Tracking Error Signal Output. Tracking error output reference to VCI.
O
Focusing Error Signal Output. Focus error output reference to VCI.
O
Center Error Signal Output. Center error out put reference to VCI.
O
Center Error LPF pin. An external capacitance is connected between
­this pin and the LCP pin.
Center Error LPF pin. An external capacitance is connected between
­this pin and the LCN pin.
Serial Clock. Serial Clock CMOS input. The clock applied to this pin
I
is synchronized with the data applied to SDATA. (Not to be left open). Serial Data. Serial data bi-directional CMOS pin. NRZ programming
I/O
data for the internal registers is applied to this input. (Not to be left open) Serial Data Enable. Serial enable CMOS input. A high level input
I
enables the serial port. (Not to be left open) Hold Control. ATTL compatible control pin which, when pulled high, disables the RF AFC
I
charge pump and holds the RE AGC amplifier gain at its present value. (open high) Ground. Ground pin for the RF block and serial port.
­Differential Normal Output. Filter normal outputs.
O
Differential Normal Output. Filter normal outputs.
O
Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended
I
output buffer and full wave rectifier. Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended
I
output buffer and full wave rectifier. Reference Resistor Input. An external 8.2 kohm, 1% resistor is
­connected from this pin to ground to establish a precise PTAT
(proportional to absolute temperature) reference current for the filter. The RF AGC integration capacitor CBYP, is connected between BYP and VPA.
I/O
Single Ended Normal Output. SIngle-ended RF output.
O
Power. Power supply pin for the RF block and serial port.
­AGC Amplifier Inputs. Differential AGC amplifier input pins.
I
AGC Amplifier Inputs. Differential AGC amplifier input pins.
I
Differential Attenuator Output. Attenuator outputs.
O
Differential Attenuator Output. Attenuator outputs.
O
RF Signal Input. Single-ended RF signal attenuator input pin.
I
CD RF Signal Output. Single ended CD RF summing output.
O
Function
TH-A5
1-23
TH-A5
W986432DH (U5) : SDRAM
1. Pin layout
Q CC
DQ12
VssDQ15
VSSQDQ14
86858483828180797877767574737271706968676665646362616059585756555453525150494847464544
12345678910111213141516171819202122232425262728293031323334353637383940414243
Q
DQ0
DQ1
VCC
CC V
DQ13
DQ2
V
Q SS
V
DQ3
DQ11
DQ4
Q SS
V
Q CC
V
DQ10
DQ5
DQ9
DQ6
Q CC
DQ8NCV
V
VSSQ
DQ7
NC
SS
DQM1NCNC
VCC
WE
DQM0
CLK
CKEA9A8A7A6A5A4A3DQM3
CAS
RAS
CS
NC
BS0
BS1
A0A1A2
A10/AP
VSSNC
CC V
DQM2
NC
DQ31
DQ16
Q CC
V
Q SS
V
DQ30
DQ17
DQ29
DQ18
Q SS
V
Q CC
V
DQ28
DQ19
DQ27
DQ20
Q CC
V
Q SS
V
DQ26
DQ21
DQ25
DQ22
Q SS
V
Q CC
V
DQ24
DQ23
2. Block diagram
CLK
CKE
CS
RAS
CAS
WE
CLOCK
BUFFER
COMMAND
DECODER
CONTROL
SIGNAL
GENERATOR
COLUMN DECODER
COLUMN DECODER
SS V
CC V
3. Pin function
Symbol A0-A10
BS0, BS1
DQ0-DQ31
CS RAS CAS
WE
DQM0-DQM3
CLK CKE VCC VSS
VCCQ VSSQ
NC
A10
A0
ADDRESS
BS0 BS1
A9
REFRESH
COUNTER
BUFFER
Function Address Bank Select Data Input/Output Chip Select Row Address Strobe Column Address Strobe Write Enable Input/output mask Clock Inputs Clock Enable Power(+3.3V) Ground Power(+3.3V) for I/O buffer Ground for I/O buffer No Connection
MODE REGISTER
COLUMN
COUNTER
CELL ARRAY
BANK #0
ROW DECODER
SENSE AMPLIFIER
COLUMN DECODER
CELL ARRAY
BANK #2
ROW DECODER
SENSE AMPLIFIER
DATA CONTROL
CIRCUIT
CELL ARRAY
BANK #1
ROW DECODERROW DECODER
SENSE AMPLIFIER
COLUMN DECODER
CELL ARRAY
BANK #3
SENSE AMPLIFIER
DQ BUFFER
DQ0
DQ31
DQM0~3
1-24
LC86P6548 (UIC1) : Microcontroller
1.Pin layout
S47/PF7
S46/PF6
S45/PF5
S44/PF4
S43/PF3
S42/PF2
S41/PF1
S40/PF0
VDD4
S39/PE7
S38/PE6
S37/PE5
S36/PE4
S35/PE3
S34/PE2
S33/PE1
S32/PE0
S31/PD7
S30/PD6
S29/PD5
S28/PD4
S27/PD3
S26/PD2
S25/PD1
S24/PD0
S23/PC7
S22/PC6
S21/PC5
S20/PC4
VP
TH-A5
2.Block diagram
S48/PG0 S49/PG1 S50/PG2 S51/PG3
P00 P01 P02 P03
VSS2
VDD2
P04 P05 P06 P07
P10/SO0
P11/SI0/SB0
P12/SCK0
P13/SO1
P14/SI1/SB1
P15/SCK1
81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
Interrupt Control
Standby Control
CF
RC
Xtal
8079787776757473727170696867666564636261605958575655545352
1234567891011121314151617181920212223242526272829
P30
P31
P32
P33
P34
P35
P36
P16/BUZ
P17/PWM0
Clock
Generator
P37
P70/INT0
RES
XT1/P74
CF1
VSS1
XT2/P75
CF2
VDD1
P80/AN0
P81/AN1
P82/AN2
IR PLA
PROM Control
PROM(48KB)
PC
P83/AN3
P84/AN4
P85/AN5
A15-A0 D7-D0 TA CE OE DASEC
P86/AN6
P87/AN7
P71/INT1
P72/INT2/T0I
51
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
30
S0/T0
P72/INT3/T0I
S19/PC3 S18/PC2 S17/PC1 S16/PC0 VDD3 S15/T15 S14/T14 S13/T13 S12/T12 S11/T11 S10/T10 S9/T9 S8/T8 S7/T7 S6/T6 S5/T5 S4/T4 S3/T3 S2/T2 S1/T1
Base Time
r
SIO0
SIO1
Timer 0
er 1
Tim
ADC
INT0-3
Noise Filter
SIO Auto
matic
transmission
RAM
128 by
s
te
VFD
Controller
High voltage Output
Bus Interface
Port 1
Port 3
Port 7
Port 8
ACC
B Register
C Register
A
PSW
RAR
RAM
Stack Poi nter
Port 0
Watchdog Timer
1-25
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