Jvc TH-A30 Service Manual

SERVICE MANUAL
DVD DIGITAL CINEMA SYSTEM
Area suffix
TH-A30
US -------------- Singapore UB ------------- Hong Kong UW -- Brazil,Mexico,Peru UG - Turkey,South Africa,
Egypt
A ------------------ Australia
TH-A30
SP-XSA30 2
STANDBY/ON
AUDIO
VCR
TV
TV/VIDEO PROGRESSIVE
TV CHANNEL
DISPLAY
STEP
AUDIO/
SUBTITLE
TV VOLUME
FM MODE
VCR
DVD FM/AM AUX
CONTROL
TUNER PRESET
DOWN UP
FF
REW
VCR CHANNEL
TUNING
B.SEARCH F.SEARCH
ENTER
VOLUME
MUTING
TOP MENU
MENU
RETURN
STANDB
RM-STHA30U
DVD CINEMA SYSTEM
Y
STANDBY/ON
AUDIO/FM MOD
D
SP
Contents
Safety precautions Preventing static electricity Important for laser products
SP-XA30 3
E
V
OLUME
SOURCE
DVD DIGITAL CINEMA
SYSTEM TH-A
30
DIGITAL
XV-THA30 SP-WA30
1-2 1-3 1-4
1-5 1-12 1-13~28
COPYRIGHT 2002 VICTOR COMPANY OF JAPAN, LTD.
No.21172
Dec. 2002
TH-A30
1. This design of this product contains special hardware and many circuits and components specially for safety purposes. For continued protection, no changes should be made to the original design unless authorized in writing by the manufacturer. Replacement parts must be identical to those used in the original circuits. Services should be performed by qualified personnel only.
2. Alterations of the design or circuitry of the product should not be made. Any design alterations of the product should not be made. Any design alterations or additions will void the manufacturer`s warranty and will further relieve the manufacture of responsibility for personal injury or property damage resulting therefrom.
3. Many electrical and mechanical parts in the products have special safety-related characteristics. These
characteristics are often not evident from visual inspection nor can the protection afforded by them necessarily be obtained by using replacement components rated for higher voltage, wattage, etc. Replacement parts which have these special safety characteristics are identified in the Parts List of Service Manual. Electrical components having such features are identified by shading on the schematics and by ( ) on the Parts List in the Service Manual. The use of a substitute replacement which does not have the same safety characteristics as the recommended replacement parts shown in the Parts List of Service Manual may create shock, fire, or other hazards.
4. The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be separated from live parts, high temperature parts, moving parts and/or sharp edges for the prevention of electric shock and fire hazard. When service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been returned to normal, after re-assembling.
5. Leakage currnet check (Electrical shock hazard testing) After re-assembling the product, always perform an isolation check on the exposed metal parts of the product (antenna terminals, knobs, metal cabinet, screw heads, headphone jack, control shafts, etc.) to be sure the product is safe to operate without danger of electrical shock. Do not use a line isolation transformer during this check.
Plug the AC line cord directly into the AC outlet. Using a "Leakage Current Tester", measure the leakage current from each exposed metal parts of the cabinet, particularly any exposed metal part having a return path to the chassis, to a known good earth ground. Any leakage current must not exceed 0.5mA AC (r.m.s.).
Alternate check method Plug the AC line cord directly into the AC outlet. Use an AC voltmeter having, 1,000 ohms per volt or more sensitivity in the following manner. Connect a 1,500 10W resistor paralleled by a 0.15 F AC-type capacitor between an exposed metal part and a known good earth ground. Measure the AC voltage across the resistor with the AC voltmeter. Move the resistor connection to each exposed metal part, particularly any exposed metal part having a return path to the chassis, and meausre the AC voltage across the resistor. Now, reverse the plug in the AC outlet and repeat each measurement. Voltage measured any must not exceed 0.75 V AC (r.m.s.). This corresponds to 0.5 mA AC (r.m.s.).
0.15 F AC TYPE
1500 10W
Good earth ground
AC VOLTMETER (Having 1000 ohms/volts, or more sensitivity)
Place this probe on each exposed metal part.
!
1. This equipment has been designed and manufactured to meet international safety standards.
2. It is the legal responsibility of the repairer to ensure that these safety standards are maintained.
3. Repairs m ust be made in accordance with the relevant safety standards.
4. It is essential that safety critical components are replaced by approved parts.
5. If mains voltage selector is provided, check setting for local voltage.
Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.
In regard with component parts appearing on the silk-screen pr inted side (parts side) of the PWB diagrams, the parts that are printed over with black such as the resistor ( ), diode ( ) and ICP ( ) or identified by the " " mark nearby are critical for safety.
(This regulation does not correspond to J and C version.)
1-2

Preventing static electricity

TH-A30
1.Grounding to prevent damage by static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
2.About the earth processing for the destruction prevention by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players. Be careful to use proper grounding in the area where repairs are being performed.
2-1 Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.
2-2 Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption) Anti-static wrist strap
Conductive material (conductive sheet) or iron plate
3. Handling the optical pickup
1. In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.)
2. Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.
4.Handling the traverse unit (optical pickup)
1. Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.
2. Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a time when attaching it to the connector.
3. Handle the flexible cable carefully as it may break when subjected to strong force.
4. It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.
Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for pick-up and how to detach the substrate.
Solder is put up before the card
1. wire is removed from connector on the pick up board as shown in Figure. (When the wire is removed without putting up solder, the CD pick-up assembly might destroy.) Please remove solder after
2. connecting the card wire with when you install picking up in the substrate.
DVD mechanism assembly (bottom side)
DVD loading mechanism
Pick up board
Card wire
Short land
(These two points are soldered respectively, and are made to short-circuit)
Connector
DVD loader board
1-3
TH-A30

Important for laser products

1.CLASS 1 LASER PRODUCT
2.DANGER : Invisible laser radiation when open and inter
lock failed or defeated. Avoid direct exposure to beam.
3.CAUTION : There are no serviceable parts inside the Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunctions.
4.CAUTION : The compact disc player uses invisible laser radiation and is equipped with safety switches which prevent emission of radiation when the drawer is open and the safety interlocks have failed or are de feated. It is dangerous to defeat the safety switches.
5.CAUTION : If safety switches malfunction, the laser is able to function.
6.CAUTION : Use of controls, adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
!
Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.
REPRODUCTION AND POSITION OF LABELS
CLASS 1 LASER PRODUCT
1-4
TH-A30

Disassembly method

Removing the top cover (See Fig.1)
1.
Remove the four screws A attaching the top cover on both sides of the body.
2.
Remove the three screws B on back of the body.
3.
Remove the top cover from behind in the direction of the arrow while pulling both sides outward.
Removing the front panel assembly
(See Fig.2A, 2B and 3)
Prior to performing the following procedure, remove the top cover.
1.
Remove the three screws C attaching the front panel assembly on bottom of the body.
2.
Remove the two screws D attaching the front panel assembly on both sides of the body.
3.
Remove the claw1, claw2 and claw3, and detach the front panel assembly toward the front.
Top cover
Claw1
(bottom side)
B
A
(both sides)
Front panel assembly
Fig.1
CC
Fig.2A
Front panel assembly
Claw3
4.
Disconnect the card wire from the connector FCW1 and FCW2 on the display board.
Removing the power cord (See Fig.4)
Prior to performing the following procedure, remove the top cover.
1.
Cut off the tie band fixing the power cord.
2.
Disconnect the power cord from the connector ACW1 on the main board and pull up the cord stopper upward.
Notes : The power cord is exchangeable.
Power cord
ACW1
Claw2
(both sides)
D
(both sides)
Display board
Front panel assembly
(Inner side)
Fig.2B
FCW1FCW2
Rear panel
Fig.4
Tie band
Power cord
stopper
Fig.3
1-5
TH-A30
Removing the DVD mechanism assembly (See Fig.5 and 6)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector J14 and J21 on the DVD MPEG board.
2.
Remove the two screws E attaching the DVD mechanism assembly and pull up with drawing out.
3.
Disconnect the harness from the connector DJ6 on the DVD loader board.
Removing the rear panel (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover and power cord stopper.
1.
Disconnect the harness from the connector J9 on the DSP board.
2.
Remove the two screws F, four screws G, one screw I and five screws J attaching the each board to the rear panel.
Rear panel
DVD mechanism assembly
Fig.5
DVD mechanism assembly
DVD MPEG board
J14
E
J21
3.
Remove the three screws K attaching the rear panel on back of the body.
Removing the tuner pack (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector CON01 on the tuner pack.
2.
Remove the two screws F attaching the tuner pack to the rear panel.
Removing the jack board (See Fig.7 and 8)
Prior to performing the following procedure, remove the top cover.
1.
Disconnect the card wire from the connector VW2 on the jack board.
2.
Disconnect the harness from the connector J10 on the DSP board.
3.
Remove the four screws G attaching the jack board to the rear panel.
Fan motor
DSP board)
DJ6
J10 (on the
Fig.6
Fig.7
DSP board
DVD loader board
Rear panel
GHI
KKK
FJ
Removing the fan motor (See Fig.7 and 8)
Prior to performing the following procedures, remove the top cover .
1.
Disconnect the harness from the connector J9 on the DSP board .
2.
Removing the two screws H attaching the fan motor to the rear panel.
1-6
Rear panel
J9(on the
DSP board)
Fig.8
VW2
CON01
Tuner pack
Jack board
TH-A30
Removing the DSP board (See Fig.9)
Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly and jack board.
1.
Remove the harness band fixing the harness.
2.
Disconnect the harness from the connector J9 and J10 on the DSP board.
3.
Disconnect the card wire from the connector J1 and J3 on the DSP board.
4.
Remove the one screw L attaching the DSP board.
5.
Remove the screw M1 and remove the earth wire.
6.
Remove the one screw I attaching the DSP board to the rear panel (see fig.7).
7.
Pull up the DSP board from the front side upwards disconnecting the connector J2, J5, J6 and J7.
Removing the main board (See Fig.10)
Prior to performing the following procedure, remove the top cover, front panel assembly, power cord, DVD mechanism assembly, jack board and DSP board.
1.
Disconnect the card wire from the connector CW8 on the main board.
2.
Disconnect the harness from the connector ACW2, ACW3, ACW4 and ACW5 on the main board.
Harness band
J10
J9
(Rear panel side)
Main board
ACW2
CW8
M2
J6
M1
(fixing the earth wire)
DSP board
J5 J7
Fig.9
M2
J2
J1J3
L
(Front panel side)
Heat sink1
M2
Heat sink2
ACW3
M2
3.
Remove the five screws J attaching the speaker terminals and jack to the rear panel (see fig.7).
4.
Remove the nine screws M2 attaching the main board.
5.
When the rear panel is not removed, pull up the main board from front side.
Removing the power transistor & power IC (See Fig.10 to 12)
Prior to performing the following procedure, remove the top cover, front panel assembly, DVD mechanism assembly, jack board, DSP board and main board.
1.
After removing the solder part 1 soldered to the main board, remove each screw and remove the heat sink from the power transistor.
2.
After removing the solder part 2 soldered to the main board, remove each screw and remove the heat sink from the power IC.
Heat sink3
Fig.10
(Each power transistor is fixed)
Solder part 1
Solder part 3
Solder part 2 (Power IC is fixed)
(Power IC is fixed)
Fig.11
ACW5
ACW4
Main board (Reverse side )
1-7
TH-A30
3.
The power ICs fixed to the heat sink 3 can be removed individually that it is easy to remove screws (in meaning that a screw driver reaches). It is not necessary to remove whole like above­mentioned 1. and 2. . After removing each screw which is fixing each power IC to the heat sink 3, the solder part 3 to which it corresponds on the main board is removed.
In addition, probably, the way after removing the whole will be safe when a screw driver does not reach too.
Removing the power transformer (See Fig.13)
Prior to performing the following procedure, remove the top cover.
1.
Cut off the tie band fixing the harness, if needed.
2.
Disconnect the harness from the connector ACW2 (see fig.10), ACW3, ACW4 and ACW5 on the main board.
3.
Remove the four screws N attaching the power transformer.
<Front panel assembly section>
Removing the display board & switch board (See Fig.1 and 2)
Prior to performing the following procedure, remove the top cover and the front panel assembly.
Heat sink 3 (to which power IC is attached)
Heat sink 2 (to which power IC is attached)
Heat sink 1 (to which power transistor is attached)
Tie band
Display board
FCW2
N
Screws
FCW1
Fig.12
ACW4 ACW3
ACW5
Power transformer
Fig.13
Front panel assembly
(inner side)
Switch board
1.
Disconnect the card wire from the connector FCW1 and FCW2 on the display board.
2.
Remove the five screws A attaching the display board on the inner of the front panel assembly.
3.
Remove the four screws B attaching the switch board on the inner of the front panel assembly.
4.
Disconnect the harness from connector FW2 on the display board, if needed.
Removing the front window (See Fig.2 and 3)
Prior to performing the following procedure, remove the top cover, front panel assembly, display board and switch board.
Remove the switch buttons, if needed.
1. Remove the three screws C attaching the front
2. window on the front panel.
Remove the eight claws fixing the front window on
3. the front panel.
1-8
A
FW2
B
Fig.1
Front panel assembly
(inner side)
Switch button
CCC
Claw
Fig.2
Front panel assembly
Front window
Fig.3
(front side)
TH-A30
y
y
)
y
<DVD mechanism assembly section>
Removing the DVD loader board (See Fig.1 to 3)
Prior to performing the following procedure, remove the top cover and DVD mechanism assembly.
1.
Disconnect the card wire from the connector J6 on the DVD MPEG board.
2.
Disconnect the harness from the connector on the motor board.
3.
Disconnect the harness from the connector MJ5 on the DVD loader board.
4.
Remove the four screws A attaching the DVD loader board to DVD mechanism assembly.
CAUTION!! (see fig.3) Before removing the card wire which
connects the pickup board and DVD loader board, solder the two soldering parts and make it short-circuit. Moreover, while having removed the card wire, don't remove these solder.
DVD MPEG board
DVD loader board
A
RCN1
J6
MJ5
DVD mechanism assembl
Fig.1
DVD mechanism assembl
Motor board
Connector
Fig.2
(top side)
(bottom side
5.
Disconnect the card wire from the connector RCN1 on the DVD loader board.
ONE POINT
How to eject the DVD tray manually (see fig.2)
The white lever of the mark is moved in the direction of the arrow. Then, the tray will be opened. Moreover, the tray is separable from a DVD mechanism assembly by removing two screws of the mark (see fig.1) and drawing out the tray.
Removing the DVD loading mechanism (See Fig.4)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board.
1.
Remove the two screws B and remove the bracket.
2.
Remove the one screw C fixing the DVD loading mechanism.
Pick up
board
Lever
Soldering parts
X
Motor board
Fig.3
DVD mechanism assembl
B
DVD loading
mechanism
(bottom side)
Bracket
DVD loading
mechanism
3.
Move the lever in the direction of the arrow X.
4.
Remove the DVD loading mechanism from the DVD mechanism assembly by moving it in the direction of the arrow Y.
Y
C
Fig.4
1-9
TH-A30
m
)
Removing the DVD traverse mechanism
(See Fig.5)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly, DVD loader board and DVD loading mechanism.
1.
Remove the four screws D attaching the DVD traverse mechanism to DVD loading mechanism.
Removing the holder & DVD MPEG board (See Fig.6 to 8)
Prior to performing the following procedure, remove the top cover, DVD mechanism assembly and DVD loader board.
1.
Remove the two claws1, and remove the holder from the DVD mechanism assembly as it is pushed down.
DVD traverse
mechanism
Claw1
D
Holder
DVD loading mechanis
(top side
D
Fig.5
2.
Remove the shield cover from the holder.
3.
Remove the four claws2 and remove the DVD MPEG board from the holder.
ONE POINT
When inserting DVD MPEG board in holder. (see fig.9)
Insert in after uniting with a lower claws, when inserting DVD MPEG board in holder.
DVD MPEG board
Holder
Shield cover
adhesive couple-face tape
Holder
DVD mechanism assembly
Fig.6
Holder (reverse side)
(bottom side)
Fig.7
DVD MPEG board
1-10
Fig.9
Claw2
Fig.8
TH-A30
<Speaker section> [SP-XA30 / Satellite speaker]
It is exchange in a unit.
[SP-XSA30 / Rear satellite speaker]
It is exchange in a unit.
[SP-WA30 / Subwoofer]
Removing the front panel (See Fig.1 and 2)
1.
Remove the six bosses and remove the front panel.
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
Removing the speaker unit (See Fig.3 to 5)
1.
Remove the four bosses and remove the net assembly.
Notes: It will be good to use the tool with a flat tip, since it is hard to remove. Please take care not to damage the cabinet at this time.
Front panel
One point These slots are used.
Fig.1
Fig.2
Net assembly
Woofer (Bottom side)
The tool with
a flat tip
Front panel (inner side)
Boss
2.
Remove the six screws A attaching the speaker unit to the cabinet.
3.
Disconnect the code from the two terminals of the speaker unit.
Terminals
Cabinet
Code
Speaker unit (reverse side)
Fig.5
A
Boss
Fig.3
Speaker unit
A
Cabinet
Fig.4
1-11
TH-A30

Wiring connection

J6
J14
2
0
0
9
SWITCH BOARD
0
9
J1
J21
J3
3809-001273
DVD MPEG
BOARD
DSP BOARD
J2
3809-001295
9
AH39-00368A
J7
DJ3
0
J5
3809-001305
DVD LOADER BOARD
MJ5
MJ4
9
0
4
J8
J10
J6
RCN1
DJ6
0
0
2
0
J9
Color codes are shown below. 1 Brown 2 Red 3 Orange 4 Yellow 5 Green
CON01
3809-001234
9
3809-001274
0
2
AH39-00291A
6 Blue 7 Violet 8 Gray 9 White 0 Black
TUNER PACK
VW2
J10-1
4
0
JACK BOARD (V-OUT)
1-12
FW3
AH39-00176A
0
FW2
DISPLAY BOARD
1 6
AFU1
3809-001335
9
3809-001334
FCW1
0
3
FCW2
8
2
9
POWER TRANCE
1
62305
4
6
4
1
1
6
0
5 32
4
2
9
0
1
0
9
2
6
9 2 4
PW3
ACW4
ACW3
ACW5
8 30
9
0
PW4
CW8
FCW1-1
CW7
MAIN BOARD
ACW1
ACW2
CW6
AFU2
AFU4
AFU3
PT1
CW5

Description of major ICs

BA5954 (MU9) : Motor driver
1. Block diagram
TH-A30
STAND
SHUT DOWN
2. Pin function
Pin No.
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
-BY
THERMAL
-
+
28 2227 26
+
-
+
-
20k
7.5k
10k
1
Symbol
VINFC CFCerr1 CFCerr2
VinSL +
VinSL -
VOSL
VNFFC
VCC PVcc1 PGND
VOSL -
VOSL +
VOFC ­VOFC + VOTK +
VOTK ­VOLD +
VOLD -
PGND
VNFTK
PVcc2
PreGND
VinLD CTKerr2 CTKerr1
VinTK
BIAS
STBY
10k
20k
+
-
7.5k
3
25 24 23
7.5k
7.5k
DET.AMP.
-
+
4 5 6
PreGND
DET.AMP.
2
72
10k
2
10k 25k
21 1520 19
PVCC2
15k
+
-
V
CC
8 149 10
-
+
PVCC1
PGND
PGND
18 17 16
LOADING
DRIVER
SLED
DRIVER
11 12 13
ACTUATOR
DRIVER
ACTUATOR
DRIVER
Function Focus driver input Capacitor connection terminal for error amplifier filter Capacitor connection terminal for error amplifier filter Operational amplifier input for thread driver (+) Operational amplifier input for thread driver (-) Operational amplifier output for thread driver Focal driver return terminal Pre VCC, thread driver part power VCC Power Loading driver part power VCC Thread driver part output (-) Thread driver part output (+) Focus driver part output (-) Focus driver part output (+) Tracking driver output (+) Tracking driver output (-) Loading driver output (+) Loading driver output (-) Power GND Tracking driver return terminal Actuator driver part power VCC Pre GND Loading driver input Capacitor connection terminal for error amplifer filter Capacitor connection terminal for error amplifer filter Tracking driver input Bias input Standby terminal
PVCC1 PV
CC
V
CC
2
1-13
TH-A30
ZiVA-5 (U8) : DVD controller
1. Pin layout
DA-IEC958
DA-DATA3
DA-DATA2
156
155
154
2
C_CL
I I
2
C_DA
RTS1
RXD1
TXD1 CTS1
VSS
VSS
VDDC
SD-EN
VSS
VDD_5
HCS4 HCS3 HCS2 HCS1 HCS0
VSS
TRST
TDO TMS
TCK
RESET
ALE
VSS
VDDC
HAD3 HAD2
VSS
157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199
TDI
200 201 202 203 204 205 206 207 208
123456789101112131415161718192021222324252627282930313233343536373839404142434445464748495051
DAI-DATA
DAI-BCK/SYSCLKBP
DAI-LRCK/IEC958BP
VDD_3.3 SD-DATA7 SD-DATA6 SD-DATA5 SD-DATA4
SD-DATA3 SD-DATA2 SD-DATA1 SD-DATA0
SD-REQ
VDD_3.3
SD-ERROR
SD-CLK VSYNC/HIRQ1 RTS2/SPI_CLK
RXD2/SPI_MISO TXD2/SPI_MOSI
CTS2/SPI_CS
VDD_3.3
VSS
153
VDD_3.3
DA-DATA1
152
151
DA-DATA0
DA-BCK
DA-LRCK
150
149
148
DA-XCK
VSS
147
146
VDDC
145
A_VSS1
A_VDD1
144
143
A_VDD2
A_VSS2
142
141
XVDD
140
XTAL/VCLK216BP
XTAL
XVSS
VSS_RREF
VDAC_RREF
VDD_RREF
139
138
137
136
135
134
VDAC_DVDD
VDAC_DVSS
VDAC_0
VDAC_VDD0
133
132
131
130
VDAC_0B
VDAC_1
VDAC_VDD1
129
128
127
VDAC_1B
VDAC_2
VDAC_VDD2
126
125
124
VDAC_2B
VDAC_3
VDAC_VDD3
123
122
121
VDAC_3B
VDAC_4
VDAC_VDD4
120
119
118
VDAC_4B
HSYNC/IRQ2
VDATA0
117
116
115
VDATA1
VDATA2
114
113
VSS
112
VDD_3.3
VDATA3
111
110
109
VDATA4
VDATA5
VDATA6
108
107
VDATA7
VCLK
106
105
104 103 102 101 100
52
VDD_3.3 VSS MDATA31 MDATA30 MDATA29 MDATA28
99
VDD_3.3
98
MDQM3
97
VSS
96
MDATA27
95
MDATA26
94
MDATA25
93
MDATA24
92
MDATA23
91
MDATA22
90
MDATA21
89
MDATA20
88
VDD_3.3
87
MDQM2
86
VSS
85
MDATA19
84
MDATA18
83
MDATA17
82
MDATA16
81
VDDC
80
VSS
79
MDATA15
78
MDATA14
77
MDATA13
76
MDATA12
75
VDD_3.3
74
MDQM1
73
VSS
72
MDATA11
71
MDATA10
70
MDATA9
69
MDATA8
68
MDATA7
67
MDATA6
66
MDATA5
65
MDATA4
64
VDD_3.3
63
MDQM0
62
VSS
61
MDATA3
60
MDATA2
59
MDATA1
58
MDATA0
57
MCLK
56
VDD_3.3
55
VSS
54
MWE
53
BA1
HA1
HAD15
VDD_3.3
HAD14
HAD13
HAD12
HAD11
HAD9
HAD10
HAD8
HAD7
VDD_3.3
VSS
HAD6
HAD5
HAD4
HAD3
HAD2
HAD1
VDD_3.3
VSS
HAD0
HDTACK/WAIT
HIRQ0
UDS/UWE
R/W
IRRX1
LDS/LWE
VSS
VDDC
VSS
VDD_3.3
MADDR9
MADDR8
MADDR7
MADDR6
MADDR5
MADDR4
MADDR3
MADDR2
MADDR1
MADDR0
VSS
VDD_3.3
MADDR10
MADDR11
BA0
MCS0
MCS1
MRAS
MCAS
2. Pin function (1/4)
1
Name
RESET
Pin No.
202
Description
Type
Active Low Reset. Assert for at least 5-milliseconds in the presence of
I
clock to reset the entire chip.
VCLK XOUT
105 138
Video clock that outputs 27 MHz.
I/O
Crystal output. When the internal DCXO is used, a 13.5 MHz crystal
O
should be con-nected between this pin and the XIN pin.
XIN/bypass clk_216
139
Crystal input. When the internal DCXO is used, a 13.5 MHz crystal should
I
be con-nected between this pin and the XOUT pin. When an external oscillator or VCXO is used, its output should be connected to this pin.
System Services
When configured for an external bypass clock, a 216 MHz clock should be connected to this pin. The frequency of an external VCXO can be either 27 or 13.5 MHz.
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1-14
2. Pin function (2/4)
Name
VNW VDDP VDD25 XVDD VDD VDD_VDAC[4:0] VDAC_DVDD A_VDD[2:1] VDAC_REFVDD GNDP GND
Power and GroundHost Interface
GND25 VDAC_DVSS AVSS[2:1] VDAC_REFVSS XVSS HCS[4:2]/GPIO[41:43]
HCS[1:0]
HA[3:1]
HA[15:0]
HDTACK/WAIT HIRQ0
HUDS/UWE
HLDS/LWE
HREAD ALE MCS[1:0] MCAS MRAS MDQM[3:0]
MA[11:0] MD[31:0]
MWE
SDRAM Interface
MCLK BA[1:0] HSYNC/HIRQ2/ GPIO1[9]
VCLK
VDATA[7:0]/GPIO[1:7]
VSYNC/HIRQ1/ GPIO36
Digital Video Input/Output
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
12, 20, 111, 152, 167, 181, 196
32, 44, 55, 63, 74, 87, 98, 104
13, 21, 112, 153, 166, 180, 195, 208
31, 43, 54, 61, 72, 85, 96, 103
Pin No.
189
140
30, 80, 145, 173, 205
118, 121, 124, 127, 130
133
142, 143
134
29, 79, 146, 172, 204
132
141, 144
136 137
190-192
193, 192
206, 207, 2
3-11, 14-19, 22
23 24
25
26
27
203
50, 49
52 51
97, 86, 73, 62
46, 45, 33-42
102-99, 95-88, 84-81,
78-75, 71-64, 60-57
53
56
47, 48
116
105
106-110, 113-115
184
Type
Power Power Power Power Power Power
Power Ground Ground Ground Ground Ground Ground Ground
O
I
I/O
I/O
I/OD
I/O
I/O
I/O
I/O I/O
O O O O
O
I/O
O
O O
I/O
I/O
I/O
I/O
1
Description
5-V supply voltage for 5V-tolerant I/O signals.
3.3-V supply voltage for I/O signals
3.3-V supply voltage for SDRAM I/O signals
3.3V Crystal interface power
1.8-V supply voltage for core logic Analog Video DAC Power
3.3V Digital supply for 5 DACs
3.3-V Analog PLL Power
3.3V Analog Video Reference Voltage Ground for I/O signals Ground for core logic Ground for SDRAM I/O signals Digital VSS for DACs Analog PLL Ground Video Analog Ground Crystal interface ground Host chip select. Host asserts HCS to select the controller for a read or write operation. The falling edge of this signal triggers the read or write operation. General Purpose I/Os 41, 42, and 43, respectively. Host chip select. Host asserts HCS to select the controller for a read or write operation. The falling edge of this signal triggers the read or write operation. Host (muxed address) address bus. 3-bit address bus selects one of eight host inter-face registers. These signals are not muxed in ATAPI master mode. HA[15:0] is the 16-bit (muxed address and data) bi-directional host data bus through which the host writes data to the decoder Code FIFO. MSB of the 32-bit word is writ-ten first. The host also reads and writes the decoder internal registers and local SDRAM/ROM via HA[7:0]. These signals are not muxed for ATAPI master mode. Host Data Transfer Acknowledge. Host interrupt. Open drain signal, must be pulled-up via 4.7k to 3.3 volts. Driven high for 10 ns before tristate. Host Upper Data Strobe. Host high byte data, HA[15:8], is valid when this pin is active. Host Lower Data Strobe. Host low byte data, HA[7:0], is valid when this pin is active. Read/write strobe Address latch enable Memory chip select. Active LOW SDRAM Column Address Strobe. Active LOW SDRAM Row Address Strobe. These pins are the bytes masks corresponding to MD[7:0], [15:8], [23:16] and [31:24]. They allow for byte reads/writes to SDRAM. SDRAM Address SDRAM Data
SDRAM Write Enable. Specifies transaction to SDRAM: read (=1) or write (=0) SDRAM Clock SDRAM bank select Horizontal sync. The decoder begins outputting pixel data for a new horizontal line after the falling (active) edge of HSYNC. Host Interrupt Request 2 General Purpose I/O 9 Video clock. Clocks out data on input. VDATA[7:0]. Clock is typically 27 MHz. Video data bus. Byte serial CbYCrY data synchronous with VCLK. At powerup, the decoder does not drive VDATA. During boot-up, the decoder uses configuration parameters to drive or 3-state VDATA. General Purpose I/Os [1:7] Vertical sync. Bi-directional, the decoder outputs the top border of a new field on the first HSYNC after the falling edge of VSYNC. VSYNC can accept vertical synchroni-zation or top/bottom field notification from an external source. (VSYNC HIGH = bot-tom field. VSYNC LOW = Top field) Active Low Host Interrupt Pin General Purpose I/O 36
TH-A30
1-15
TH-A30
2. Pin function (3/4)
Name
SDDATA[7]/VDATA2[7] /HDMARQ/GPIO24
SDDATA6/VDATA2[6] /HXCVR_EN/GPIO25
SDDATA5/VDATA2[5] HDMACK/GPIO26
SDDATA4/VDATA2[4]/ GPIO27
SDDATA3/ VDATA2[3]/GPIO28
SDDATA2/ VDATA2[2]/GPIO29
SDDATA1/
Parallel DVD/CD or Serial CD Interface
VDATA2[1]/GPIO30
SDDATA0/ VDATA2[0]/GPIO31
SDCLK
SDERROR
SDEN/GPIO33
SDREQ/GPIO32
VDAC_[4B:0B] VDAC_4 VDAC_3V DAC_2 VDAC_1 VDAC_0 VDAC_REF
VCLK
Analog Video OutputAudio InterfaceDigital Mic In
ADATA[3:0]/GPIO[4:1]
BCK LRCK
XCK
IEC958/GPIO14
DAI_DATA/GPIO15
DAI_BCK/ BYPASS_SYSCLK/ GPIO16 DAI_LRCK/ IEC958BP/GPIO17
Pin No.
168
169
170
171
174
175
176
177
183
182
179
178
117, 120, 123, 126, 129
119 122 125 128 131 135
105
155, 154, 151, 150
149
148 147
156
157
158
159
Type
I
I
I
I
O
Analog O Analog O Analog O Analog O Analog O Analog O
Analog I
I/O
O
O
O
I/O
O
I
I
I
1
Description
Compressed data from DVD DSP. Bit 7. In parallel mode, bit 7 is the first (earliest in time) bit in the bitstream, while bit 0 is the last bit. Video Data Bus 2, Bit 7 Host DMA Request General Purpose I/O 24 Compressed data from DVD DSP. Bit 6. Video Data Bus 2, Bit 6 ATAPI Transceiver Enable General Purpose I/O 25 Compressed data from DVD DSP. Bit 5. Video Data Bus 2, Bit 5 Host DMA Acknowledge General Purpose I/O 26 Compressed data from DVD DSP. Bit 4. Video Data Bus 2, Bit 4 General Purpose I/O 27 Compressed data from DVD DSP. Bit 3. Video Data Bus 2, Bit 3 General Purpose I/O 28 Compressed data from DVD DSP. Bit 2. Video Data Bus 2, Bit 2 General Purpose I/O 29 Compressed data from DVD DSP. Bit 1. Video Data Bus 2, Bit 1 General Purpose I/O 30 In serial mode, bit 0 should be used as the input, with the unused bits either used as GPIOs or tied to ground. Video Data Bus 2, Bit 0 General Purpose I/O 31 Data clock. The maximum frequency is 25 MHz for parallel mode, and ???? MHz for serial mode. The polarity of this signal is programmable. Error in input data. This signal carries the error bit associated with the channel data type (if set, the byte is corrupted). Data enable. Assertion indicates that data on SDDATA[7:0] is valid. The polarity of this signal is programmable. General Purpose I/O [33] Bitstream request. controller asserts SDREQ to indicate that the bitstream input buffer has available space. General Purpose I/O 32 Video DAC Bias Bits[4:0] DAC video output format: R, V, C, or CVBS. Macrovision encoded. DAC video output format: B, U, C, or CVBS. Macrovision encoded. DAC video output format: G or Y. Macrovision encoded. DAC video output format: C. Macrovision encoded. DAC video output format: CVBS or Y. Macrovision encoded. Video DACs Reference Resistor. Connecting to pin 136 through a 1.18K+/- 1% resis-tor is required. System clock that drives internal PLLs. ZiVA-5 27-MHz TTL oscillator. (See descrip-tion of VCLK for Digital Video Output.) Also optional video clock for internal PLLs or external encoder. PCM Data Out. Eight channels. Serial audio samples relative to BCK and LRCK. General Purpose I/Os [4:1] PCM Bit Clock. BCK can be either 48 or 32 times the sampling frequency PCM Left Clock. Identifies the channel for each sample. The polarity is programma-ble. Audio External Frequency clock input or output. BCK and LRCK are derived from this clock. PCM data out (IEC-958 format ) or compressed data out (IEC-1937 format). General Purpose I/O [14] PCM data input. General Purpose I/O [15] PCM input bit clock. BYPASS_SYSCLK: Alternate function TBS. General Purpose I/O [16] PCM left/right clock. IEC958 input bypass General Purpose I/O [17]
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
1-16
2. Pin function (4/4)
Name
IRRX1/GPIO0
IR
IDC_CL/GPIO18
IDC
IDC_DA/GPIO19
RTS1/GPIO20
RXD1/GPIO21
TXD1/GPIO22
UART1UART2JTAG
CTS1/GPIO23
RTS2/SPI_CLK/ GPIO37
RXD2/SPI_MISO/ GPIO38
TXD2/SPI_MOSI/ GPIO39
CTS2/SPI_CS/ GPIO40
TRST
TDO TDI/GPI0
TMS/GPI1
TCK
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
Pin No.
28
160
161
162
163
164
165
185
186
187
188
197
198 199
200
201
1
Type
Description
I
IR Remote Receive. This input connects to an integrated (photo diode, band pass, demodulator) IR receiver. General Purpose I/O 0
I/O
Serial clock signal for IDC data transfer. It should be pulled up to the positive supply voltage, depending on the device) using an external pull-up resistor. General Purpose I/O [18] Serial data signal for IDC data transfer. It should be pulled up to the supply voltage using an external pull-up resistor. General Purpose I/O [19]
O
Ready to send, UART1 General Purpose I/O [20]
I
Receive data, UART1 General Purpose I/O [21]
O
Transmit data, UART1 General Purpose I/O [22]
I
Clear to send, UART1 General Purpose I/O [23]
O
Ready to send, UART2 Serial Peripheral Interface Clock General Purpose I/O [37]
I
Receive data, UART2 Serial Peripheral Interface - Master Input/Slave Output General Purpose I/O [38]
O
Transmit data, UART2 Serial Peripheral Interface - Master Output/Slave Input General Purpose I/O [39]
I
Clear to send, UART2 Serial Peripheral Interface ???? General Purpose I/O [40]
I
Test reset. BST reset - resets the TAP controller. This signal must be pulled low.
O
Test data Out. BST serial data output.
I
Test data In. BST serial data chain input. General Purpose Input pin 0.
I
Test mode select. Controls state of test access port (TAP) controller. General Purpose Input pin 1.
I
Test clock. Boundary scan test (BST) serial data clock.
TH-A30
3. Block diagram
Parallel/serial DVD Interface
I2S Stereo In
32-128Mbit
SDRAM
SDRAM Controller
Track Buffer
Processor
Audio
Decryption
ZiVA
A/V Core
Graphics
Engine
Input Unit
System Control Bus
Bus Interface Unit
IR GPIO SPI UART1&2ASYNC BUS IDC
ATAPI
Interlaced/
Progressive
SPARC
Microprocessor
Phase
Lock
Loop
Video
Encoder
JTAG Interface
Five 10-bit
Audio
Output
Unit
Video DACs
CCIR 656 Digital Video
Composite Y/R C Cr/Pr/G Cb/Pb/B
IEC 958/1937
Downmix Left/right Center/subwoofer Left/ right/surround
Remote Control
13.5 MHz Crystal
1-17
TH-A30
LC86P6548 (UIC1) : Microcontroller
1.Pin layout
S47/PF7
S46/PF6
S45/PF5
S44/PF4
S43/PF3
S42/PF2
S41/PF1
S40/PF0
VDD4
S39/PE7
S38/PE6
S37/PE5
S36/PE4
S35/PE3
S34/PE2
S33/PE1
S32/PE0
S31/PD7
S30/PD6
S29/PD5
S28/PD4
S27/PD3
S26/PD2
S25/PD1
S24/PD0
S23/PC7
S22/PC6
S21/PC5
S20/PC4
VP
2.Block diagram
S48/PG0 S49/PG1 S50/PG2 S51/PG3
P00 P01 P02
P03 VSS2 VDD2
P04
P05
P06
P07
P10/SO0
P11/SI0/SB0
P12/SCK0
P13/SO1
P14/SI1/SB1
P15/SCK1
81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
Interrupt Control
Standby Control
CF
RC
X’ta
l
8079787776757473727170696867666564636261605958575655545352
1234567891011121314151617181920212223242526272829
P30
P31
P32
P33
P34
P35
P36
P16/BUZ
P17/PWM0
Clock
Generator
P37
P70/INT0
RES
XT1/P74
CF1
VSS1
XT2/P75
CF2
VDD1
P80/AN0
IR
PLA
PROM Control
PROM(48KB)
P81/AN1
P82/AN2
P83/AN3
PC
P84/AN4
P85/AN5
P86/AN6
A15-A0 D7-D0 TA CE OE DAS
P87/AN7
P71/INT1
EC
P72/INT2/T0I
51
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
30
S0/T0
P72/INT3/T0I
S19/PC3 S18/PC2 S17/PC1 S16/PC0 VDD3 S15/T15 S14/T14 S13/T13 S12/T12 S11/T11 S10/T10 S9/T9 S8/T8 S7/T7 S6/T6 S5/T5 S4/T4 S3/T3 S2/T2 S1/T1
Base Time
SI
O0
O1
SI
Timer 0
er 1
Tim
ADC
INT0-3
Noise Filter
SIO Auto
transmissio
RAM
128 by
VFD
Controller
High voltage O
r
matic
s
te
utput
Bus Interface
n
Port 1
Port 3
Port 7
Port 8
ACC
B Register
C Register
PSW
RAR
RAM
Stack Poi nter
Port 0
Watchdog Timer
1-18
3. Pin function Pin No.
1 2 3
to
10 11 12 13 14 15 16 17 18 19
to
22 23
to
26 27 28 29 30
to
36 37
to
45 46 47
to
50 51 52
to
63 64
to
71 72 73
to
80 81
to
84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99
100
P16/BUZ
P17/PWM0
P70/INT0
XT1/P74 XT2/P75
P80/AN0 P83/AN3
P84/AN4 P87/AN7
P71/INT1 P72/INT2/T0I P72/INT3/T0I
S15/T15
S16/PC0 P19/PC3
S20/PC4 S31/PD7
S32/PE0 S39/PE7
S40/PF0 S47/PF7
S48/PG0 S51/PG3
P10/SO0
P11/SI0/SB0
P12/SCK0
P13/SO1
P14/SI1/SB1
P15/SCK1
Symbol
P30
to
P37
RES
VSS1
CF1 CF2
VDD1
to
to
S0/T0
to
S6/T6 S7/T7
to
VDD3
to
VP
to
to
VDD4
to
to
P00 P01 P02 P03
VSS2
VDD2
P04 P05 P06 P07
Function
I/O
Buzzer output
I/O
Timer 1 output (PWM0 output)
I/O
8bit input/output port
I/O
Input/output in bit unit 15V withstand at N-channel open drain output
INT0 input /HOLD release/N-channel Tr. ouptput forwatchdog timer
I/O
Reset pin
I
32.768kHz crystal oscillation terminal XT1
I
32.768kHz crystal oscillation terminal XT2
I
Power pin (-)
­Input pin for the ceramic resonator oscillation
I
Output pin for the ceramic resonator oscillation
O
Power pin (+)
­4-bit input port
I
Input /output in bit unit
O
INT1 input/HOLD release input
I
INT2 input/timer 0 event input
I
Output for VFD display controller segment/timing incommon
O
Output for VFD dis;lay controller segment/timing withinternal pull-down
O
resistor in common Internal pull-down resistor output
Power pin (+)
­Output for VFD display controller
I/O
High voltage input port PC0 to PC3 Power pin (+) for the VFD output pull-down resist
­Output for VFD display controller
I/O
High voltage input port PC4 to PC7, PD0 to PD7 Output for VFD displaya controller segment
I/O
High voltage input port PE0 to PE7 Power pin (+)
­Output for VFD displaya controller segment
I/O
High voltage input port PF0 to PF7 Output for VFD displaya controller segment
I/O
High voltage I/O port PG0 to PG3 8-bit input/output port. Input for port0 interrupt.
I/O
Input/output in nibble unit Input for HOLD release 15V withstand at N-channel open drain output Power pin (-)
­Power pin (+)
­8-bit input/output port. Input for port0 interrupt.
I/O
Input/output in nibble unit Input for HOLD release 15V withstand at N-channel open drain output SIO0 data output
I/O
SIO0 data input/bus input/output SIO0 clock input/output SIO1 data output SIO1 data input/bus input/output SIO1 clock input/output
8-bit input/output port Input/output can be specified in a bit unit
TH-A30
1-19
TH-A30
SST39VF800A (U6) : 8M Flash memory
1. Pin layout
A15 A14 A13 A12 A11 A10
A9
A8 NC NC
WE#
NC NC NC NC
A18 A17
A7
A6
A5
A4
A3
A2
A1
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
2. Block diagram
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
X-Decoder
A16 NC Vss DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VDD DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# Vss CE# A0
EEPROM Cell Array
Memory Address
3. Pin function Symbol
AMS- A0
DQ15- DQ0
Data Input/Output
CE# OE#
WE#
VDD
Vss
NC
Address Buffer & Latches
CE# OE#
WE#
Pin name
Address Inputs
Chip Enable
Output Enable
Write Enable
Power Supply
Ground
No Connection
Y-Decoder
Control Logic
I/O Buffers & Data Latches
DQ15-DQ0
Function
To provide memory addresses. During Sector-Erase AMS-A11 address lines will select the sector. During Block-Erase AMS-A15 address lines will select the block. To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a Write cycle. The outputs are in tri-state when OE# or CE# is high. To activate the device when CE# is low. To gate the data output buffers. To control the Write operations. To provide power supply voltage: 2.7-3.6V
Unconnected pins.
1-20
AK4355 (U6) : DAC
3
1.Pin layout 2.Block diagram
TH-A30
1 2 3 4 5 6 7
8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
DZF LOUT1+ LOUT1-
ROUT1+ ROUT1-
LOUT2+ LOUT2-
ROUT2+ ROUT2-
LOUT3+ LOUT3-
ROUT3+ ROUT3-
SCF
SCF
SCF
SCF
SCF DAC
SCF DAC
3.Pin function
Pin No. Symbol I/O Function
1 VREF I Positive Voltage Reference Input Pin 2DZF OZ 3 PDN I Power-Down Mode Pin
4 MCLK I Master Clock Input Pin 5 BICK I
6 SDTI1 I 7 SDTI2 I 8 SDTI3 I
9 LRCK I 10 CSN I C 11 CCLK I 12 CDTI I 13 DVDD - D 14 DVSS - D 15 ROUT3- O 16 ROUT3+ O 17 LOUT3- O 18 LOUT3+ O 19 ROUT2- O 20 ROUT2+ O 21 LOUT2- O 22 LOUT2+ O 23 ROUT1- O 24 ROUT1+ O 25 LOUT1- O 26 LOUT1+ O 27 AVSS ­28 AVDD -
Note: All input pins should not be left floating.
ero Input Detect Pin
When at “L”, the AK4355 is in the power-down mode and is held in reset. The AK4355 should always be reset upon power-up.
An external TTL clock should be input on this pin. Audio Serial Data Clock Pin DAC1 Audio Serial Data Input Pin DAC2 Audio Serial Data Input Pin DAC3 Audio Serial Data Input Pin L/R Clock Pin
hip Select Pin Control Clock Pin Control Data Input Pin
igital Power Supply Pin
igital Ground Pin DAC3 Rch Negative Analog Output Pin DAC3 Rch Positive Analog Output Pin DAC3 Lch Negative Analog Output Pin DAC3 Lch Positive Analog Output Pin DAC2 Rch Negative Analog Output Pin DAC2 Rch Positive Analog Output Pin DAC2 Lch Negative Analog Output Pin DAC2 Lch Positive Analog Output Pin DAC1 Rch Negative Analog Output Pin DAC1 Rch Positive Analog Output Pin DAC1 Lch Negative Analog Output Pin DAC1 Lch Positive Analog Output Pin Analog Ground Pin Analog Power Supply Pin
DAC
DAC
DAC
DAC
DATT
DATT
DATT
DATT
DATT
DATT
Audio
I/F
Control
Register
MCLK LRCK BICK
CSN CCLK CDTI
SDTI1 SDTI2 SDTI
1-21
Loading...
+ 46 hidden pages