JVC GZ-MC200EK, GZ-MC200EX, GZ-MC200EY, GZ-MC200EZ Service Manual

YF061200411

SERVICE MANUAL

DIGITAL MEDIA CAMERA

GZ-MC200EK, GZ-MC200EX,
GZ-MC200EY, GZ-MC200EZ

GZ-MC200EK, GZ-MC200EX,
GZ-MC200EY, GZ-MC200EZ [M4S527]

TABLE OF CONTENTS

1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-35

5 TROUBLE SHOOTING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-37

COPYRIGHT © 2004 Victor Company of Japan, Limited

No.YF061

2004/11

SPECIFICATION

1-2 (No.YF061)

SECTION 1

r

e

PRECAUTIONS

1.1 SAFTY PRECAUTIONS

Prior to shipment from the factory, JVC products are strictly
inspected to conform with the recognized product safety and
electrical codes of the countries in which they are to be
sold.However,in order to maintain such compliance, it is equally
important to implement the following precautions when a set is
being serviced.

1.1.1 Precautions during Servicing

(1) Locations requiring special caution are denoted by labels

and inscriptions on the cabinet, chassis and certain parts of
the product.When performing service, be sure to read and
comply with these and other cautionary notices appearing
in the operation and service manuals.

(2) Parts identified by the symbol and shaded ( ) parts

are critical for safety.
Replace only with specified part numbers.

NOTE :

Parts in this category also include those specified to
comply with X-ray emission standards for products
using cathode ray tubes and those specified for
compliance with various regulations regarding
spurious radiation emission.

(3) Fuse replacement caution notice.

Caution for continued protection against fire hazard.
Replace only with same type and rated fuse(s) as
specified.

(4) Use specified internal wiring. Note especially:

• Wires covered with PVC tubing

• Double insulated wires

• High voltage leads

(5) Use specified insulating materials for hazardous live parts.

Note especially:

• Insulation Tape

• PVC tubing

•Spacers

• Insulation sheets for transistors

•Barrier

(6) When replacing AC primary side components (transformers,

power cords, noise blocking capacitors, etc.) wrap ends of
wires securely about the terminals before soldering.

emission. Consequently, when servicing these products,
replace the cathode ray tubes and other parts with only the
specified parts. Under no circumstances attempt to modify
these circuits.Unauthorized modification can increase the
high voltage value and cause X-ray emission from the
cathode ray tube.

(12) Crimp type wire connectorIn such cases as when replacing

the power transformer in sets where the connections
between the power cord and power trans former primary
lead wires are performed using crimp type connectors, if
replacing the connectors is unavoidable, in order to prevent
safety hazards, perform carefully and precisely according
to the following steps.

• Connector part number :E03830-001

• Required tool : Connector crimping tool of the proper
type which will not damage insulated parts.

• Replacement procedure

a) Remove the old connector by cutting the wires at a

point close to the connector.Important : Do not
reuse a connector (discard it).

cut close to connector

Fig.1-1-3

b) Strip about 15 mm of the insulation from the ends

of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.

15 mm

Fig.1-1-4

c) Align the lengths of the wires to be connected.

Insert the wires fully into the connector.

Metal sleeve

Fig.1-1-1

(7) Observe that wires do not contact heat producing parts

(heatsinks, oxide metal film resistors, fusible resistors, etc.)

(8) Check that replaced wires do not contact sharp edged or

pointed parts.

(9) When a power cord has been replaced, check that 10-15

kg of force in any direction will not loosen it.

Power cord

Fig.1-1-2
(10) Also check areas surrounding repaired locations.
(11) Products using cathode ray tubes (CRTs)In regard to such

products, the cathode ray tubes themselves, the high
voltage circuits, and related circuits are specified for
compliance with recognized codes pertaining to X-ray

Connector

Fig.1-1-5

d) As shown in Fig.1-1-6, use the crimping tool to crimp

the metal sleeve at the center position. Be sure to
crimp fully to the complete closure of the tool.

1.2
5

2

.0

5.5

Crimping tool

Fig.1-1-6

e) Check the four points noted in Fig.1-1-7.

Not easily pulled free

Wire insulation recessed

more than 4 mm

Crimped at approx. cente

of metal sleev

Conductors extended

Fig.1-1-7

(No.YF061)1-3

1.1.2 Safety Check after Servicing

Examine the area surrounding the repaired location for damage
or deterioration. Observe that screws, parts and wires have been
returned to original positions, Afterwards, perform the following
tests and confirm the specified values in order to verify
compliance with safety standards.

(1) Insulation resistance test

Confirm the specified insulation resistance or greater
between power cord plug prongs and externally exposed
parts of the set (RF terminals, antenna terminals, video and
audio input and output terminals, microphone jacks,
earphone jacks, etc.).See table 1 below.

(2) Dielectric strength test

Confirm specified dielectric strength or greater between
power cord plug prongs and exposed accessible parts of
the set (RF terminals, antenna terminals, video and audio
input and output terminals, microphone jacks, earphone
jacks, etc.). See Fig.1-1-11 below.

(3) Clearance distance

When replacing primary circuit components, confirm
specified clearance distance (d), (d') between soldered
terminals, and between terminals and surrounding metallic
parts. See Fig.1-1-11 below.

d

Chassis

d'

Power cord
primary wire

Fig.1-1-8

(4) Leakage current test

Confirm specified or lower leakage current between earth
ground/power cord plug prongs and externally exposed
accessible parts (RF terminals, antenna terminals, video
and audio input and output terminals, microphone jacks,
earphone jacks, etc.).
Measuring Method : (Power ON)Insert load Z between
earth ground/power cord plug prongs and externally
exposed accessible parts. Use an AC voltmeter to
measure across both terminals of load Z. See Fig.1-1-9
and following Fig.1-1-12.

ab

Externally
exposed
accessible part

Z

V

c

A

Fig.1-1-9

(5) Grounding (Class 1 model only)

Confirm specified or lower grounding impedance between
earth pin in AC inlet and externally exposed accessible
parts (Video in, Video out, Audio in, Audio out or Fixing
screw etc.).Measuring Method:
Connect milli ohm meter between earth pin in AC inlet and
exposed accessible parts. See Fig.1-1-10 and grounding
specifications.

AC inlet

Earth pin

Exposed accessible part

MIlli ohm meter

Grounding Specifications

Region

USA & Canada

Europe & Australia

Grounding Impedance (Z

Z 0.1 ohm

Z 0.5 ohm

)

Fig.1-1-10

AC Line Voltage

100 V

100 to 240 V

110 to 130 V

110 to 130 V

200 to 240 V

Region

Japan

USA & Canada

Europe & Australia

Insulation Resistance (R

R 1 M /500 V DC

1 M R 12 M /500 V DC

R 10 M /500 V DC

)

Dielectric Strength

AC 1 kV 1 minute

AC 1.5 kV 1 minute

AC 1 kV 1 minute
AC 3 kV 1 minute

AC 1.5 kV 1 minute

(

Class

(

Class

Clearance Distance (d), (d'

d, d' 3 mm

d, d' 4 mm

d, d' 3.2 mm

d 4 m m

)

d' 8 m m (Power cord
d' 6 m m (Primary wire

)

Fig.1-1-11

AC Line Voltage

100 V

110 to 130 V

110 to 130 V

220 to 240 V

Region

Japan

USA & Canada

Europe & Australia

Load Z

1

0.15

1.5

2

50

Leakage Current (i)

i 1 mA rms

i 0.5 mA rms

i 0.7 mA peak
i 2 mA dc

i 0.7 mA peak
i 2 mA dc

a, b, c

Exposed accessible parts

Exposed accessible parts

Antenna earth terminals

Other terminals

Fig.1-1-12

NOTE :

These tables are unofficial and for reference only. Be sure to confirm the precise values for your particular country and locality.

)

)

)

1-4 (No.YF061)

SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

2.1 Handling Microdrives

Microdrives are used in GZ-MC100 and GZ-MC200. Although the appearance is different, a Microdrive is exactly the same as a hard
disc that is used in a PC. Therefore, unlike handling conventional tapes, caution must be paid in handling Microdrives.
The handling of Microdrives is explained in this section.

2.1.1 The structure of Microdrives

The detailed inside structure of Microdrives is not disclosed as it is treated as trade secrets. However, it is essential to have knowledge
of the structure of Microdrives in order to carry out service properly. Some information about Microdrives is given here.

A Microdrive is mainly consisted of the following parts.

• A magnetic recording disk that is coated with magnetic ma­terial. (Disk)

• A reading/ writing head. (Head)

• A motor that turns the disk.

• A circuit board that is loaded with electrical circuit which con­trols the motor, the head positioning, and input/ output of the
signal.

1 head type Microdrives use one side of the disk, and 2 head type
Microdrives use both sides of the disk with heads on each side
of the disk.The disk and the head do not contact and there is
certain space kept between them. The head reads the pre
recorded servo information to control the head itself. When the
head is not in access to the disk, it is kept in a shelter to avoid
damaging the disk with shocks from outside.

The difference between a 2GB Microdrive and a 4GB Microdrive
is only whether it has one head or two heads and there is no
difference in performance, as shown in the specification list. A

2.5 inch hard disk that is used in a note PC is shown as a
reference. As a 2.5 inch hard disk is bigger than a Microdrive, it
has more disks and heads resulting in more capacity. On the
contrary, it seems impossible to increase the disks for a
Microdrive because of size restriction. High capacity will be
achieved by improving the areal density and rotation speed of the
future products.

Microdrive

Model name Microdrive 3K4-2 Microdrive 3K4-4 Travelstar 4K80-80
Model number HMS360402D5CF00 HMS360404D5CF00 HTS428080F9AT00
Capacity 2 GB 4 GB 80 GB
Interface
Form factor 1inch 1inch 2.5inch
System type Consumer electronics Consumer electronics Laptop
Cache buffer 128 KB 128 KB 8 MB
Disks / Heads 1/1 1/2 2/4
Rotational speed (RPM) 3,600 (RPM) 3,600 (RPM) 4,200 (RPM)
Media transfer rate 97.9 Mb/sec max 97.9 Mb/sec max 351 Mb/sec max
Interface transfer rate
Average seek (ms) 12 (ms) 12 (ms) 13 (ms)
Average latency (ms) 8.33 (ms) 8.33 (ms) 7.1 (ms)
Areal density 56.5 Gb/sq. inch 56.5 Gb/sq. inch 68.5 Gb/sq. inch
Typical idle acoustic (Bels) 㧙㧙2.4B
Operating shock (G) 200 G (2ms) 200 G (2ms) 250 (2ms)
Non-operating shock (G) 2000 G (1ms) 2000 G (1ms) 800 (1ms)
Operating ambient temperature ()0 㨪 70 ()0 㨪 70 ()5 㨪 55 ()
Non-operating ambient temperature ()

2GB 4GB 80GB

CompactFlash TypeΤCompactFlash Type

33 MB/sec max 33 MB/sec max 100 MB/sec max

-40 㨪 70 () -40 㨪 70 () -40 㨪 70 ()

hard disk

Τ ATA ATA- 6

Shock tolerance during non-operation is remarkably high. Micro­drives are designed to tolerate shock during non-operation as
they are removed or carried out more often than other hard disks.
However, Microdrives are vulnerable to falls and shocks just like
other precision instruments.
Microdrives are made in conformity with the standard of Com­pactFlash Type II. The thickness of the drive is less than 5.5mm,
thus failures can occur by folding or twisting the disks. The stan­dard for torsional stress is 6kg approx. and for flexing stress is
4kg approx. Be sure to carry Microdrives in protection cases on
the service sites, and strongly recommend the customers to do
so, too.

(No.YF061)1-5

2.1.2 Precautions on handling Microdrives

Shock

Main causes of failures in hard disks including Microdrives are
listed as follows.

(1) Failures caused by shocks
(2) Failures caused by static electricity
(3) Failures caused by power cut during the operation

NOTE:

The shock of 200G(G:Gravity), a maximum impact value in
operation, is equivalent of the impact of dropping from 20­30cm above the hard floor. The shock of 2000G, a maximum
impact value in non-operation, is equivalent of the impact of
dropping from 75 - 100cm above the hard floor.

2.1.2.1 Failures caused by shock

One of the causes of the Microdrive failures is a crash between
the disk and the head caused by falls or shocks. The results of
the crash are listed as follows.

• The scratch on the surface of the disk (crash scar) disables
reading/ writing of the damaged part.

• The magnetic material that came off by the crash (disk frag­ment) causes head reading failure.

• The head distortion deteriorates the read/ write attribute.

• The change in the space between the head and the disk dis­ables the normal read/ write.

Stronger shocks result in the motor axis distortion, causing axial
runout and deterioration in performance such as disabling the
trace of normally recorded signal.
Pay extra caution not to drop or give shocks to the Microdrive
while servicing, and make sure to store the Microdrive in a pro­vided plastic case.

Head

Head

Crash scar

2000

2000

300

Disk

Disk

Impact value (G)

(G):Gravity

Microdrive

2.5 inch HDD

3.5 inch HDD

2500

2000

1500

1000

500

Disk fragment

㧔0.03um㧕
Head floating height

0

Operation Non-operation

200

200

55

2.1.2.2 Failures caused by static electricity

Microdrives are designed to tolerate static electricity up to 15kV
approx. However, head destruction or boot failure will occur as a
result of high static electricity given to the magnetic head of a Mi­crodrive that is very vulnerable to static electricity.
As same as handling other electronic parts, make sure not to
take charge of static electricity before touching a Microdrive for
checking or repairing.
In addition, make sure to store the Microdrive in a provided plas­tic case when it is not in use.
The voltage of 15kV has enough power to break Microdrives de­stroying heads etc. Errors in Microdrives may occur with lower
voltage. Asking the customers about the recording condition:
whether it was inside the car in winter, right after getting off the
car or in the carpeted area of a hotel etc., is recommended to in­vestigate failures with poor reproducibility.

2.1.2.3 Failures caused by power cut during the operation

When the power is cut off while writing the data on the Micro­drive, writing failure occurs in the writing sector (512 byte). As a
result, an error will occur while reading the data.
The effects on the system, given by the bad writing sector, de­pend on the types of the written files on the sector.
If it is user data, the recorded movie may not be replayed.
To prevent failure in writing, do not insert/ remove the Microdrive
or cut off the power unless otherwise indicated or needed.
"Read Sequential Error" may be detected if Full Check of the Mi­crodrive is performed with the DDD.

NOTE:

"Read Sequential error" may be detected as a result of defec­tive Microdrive disables the reading. Abnormal reading may
also occur when the user removes the power plug or the bat­tery while the Microdrive is in operation; the writing is not com­pleted and the reading cannot be performed normally.
In the latter case, the failure will be corrected by running the
Full Check after the DDD Clean Disk has been performed.
Running the Clean Disk is recommended when the recorded
movies cannot be read or the Read Sequential Error occurs.
If an error is detected even after running the Full Check, other
causes of the failures are considered.

Shock

Crash
between
the head
and the
disk

Operation

Excessive
power is
generated
in the
mechanism

Operation/ Non-operation

1-6 (No.YF061)

Disk
fragment

Crash scar
on the disk

Disk࡮
shift

50 100 150 200 250 300 350

Read
error

1400 1600 1800 2000 2200 2400 2600

Performance
deterioration

(G):Gravity

Shocks(G)

Shocks(G)

Read error

Performance
deterioration

Normal

Normal

Model:HMS360404D5CF00SERIES

2.1.3 Microdrive backup

Unlike the information on tapes, customers' information on
Microdrives can become unreadable in an instant. Backing up
users' record is strongly recommended to avoid any accident.

File Transfer Time Measurement

Recording detail

(Recording Capacity)

FAT32

Normal format

FAT32

Quick format

15m(1GB)

30m(2GB)

45m(3GB)

60m(4GB)

Detection detail

via PCMCIA card

via USB2.0 reade

via PCMCIA card

via USB2.0 reade

transmitted by PCMCIA card

transmitted by USB2.0 reader

transmitted by PCMCIA card

transmitted by USB2.0 reader

transmitted by PCMCIA card

transmitted by USB2.0 reader

transmitted by PCMCIA card

transmitted by USB2.0 reader

Microdrive 1 Microdrive 㧞

N2B12JRA N2HNY1VA

12m31s 12m36s

00m37s 00m40s

00m18s 00m19s

00m10s 00m09s

16m16s 15m46s

07m25s 07m57s

29m30s 29m47s

14m08s 14m49s

41m23s 42m48s

22m47s 23m23s

56m15s 56m34s

30m02s 29m53s

The above data shows: the elapsed time of copying the recorded
information on a Microdrive to a PC and the elapsed time of
formatting the Microdrive with the PC.
From the results of the measurement, it is clear that the data
transfer with a commercial USB2.0 Reader/ Writer is about twice
as quick as transfer with a PCMCIA card.
Using USB2.0 Reader/ Writer is recommended when frequent
data backup or data re-writing on the Microdrive is required.
Backup should be performed all the recorded files on the Micro­drive.
Formatting must be done with the main unit that operates nor­mally.
If a Microdrive that is more than 2 GB is formatted with the main
unit, it is formatted as FAT (FAT16), and a drive that is more than
2GB is formatted FAT32.

2.1.4 Checking the main unit/ Microdrive good or bad

In order to repair or check MC100 - 200, judging the cause of the
failures, whether it is the main unit or the Microdrive, is essential.
The product failures that are brought into repair/ check fall into
the following categories.

(1) Microdrive failures caused by the users handling such as

fall, shocks, and submergence.

(2) Main unit operation failures caused by the Microdrive fail-

ures.

(3) Microdrive operation failures caused by the main unit fail-

ures.

NOTE:

Unlike DVC tapes, the Microdrives of MC100 - 200 are recog­nized as parts of the main unit. It is essential that the main unit
and the Microdrive are brought in as a pair for service. Basical­ly, do not accept the main unit alone for repair or check.

2.1.4.1 Separations of the parts failures

The procedure to identify the causes of the failures whether it is
in the main unit or in the Microdrive is explained in this section.

Start

Check the Water Exposure Seal
Check the appearance

Troubles?

YES

Go to

2.1.4.2

Perform a general operation check
such as record/ replay.

Check whether there is an emergency
record in the main unit, and check the
details of the record.

The failure caused by the user's PC or
by the supplied software is considered.

Check the Water Exposure Seal,
significant scratches on the
exterior, bends, and dents.

Perform a general operation check

NO

using a MD other than the user drive.

Troubles?

YES

YES

Go to

2.1.4.4

Check whether it is a Microdrive failure
or a main unit failure by using the user's
Microdrive. Be sure to make a backup in
case of an accident.

NO

Operate a general operation check
using the user Microdrive.

Troubles?

NO

Check whether there is an emergency
record in the main unit, and check the
details of the record.

With an emergency record?

NO

Recheck the details of
the failure with the user.

YES

Go to 2.1.4.3

End

2.1.4.2 Microdrive failures caused by user handling

As previously explained, Microdrive failures may possibly be
caused by falls or shocks. Further more, dropping Microdrives in
the water causes crucial failures to Microdrives.
Supplied Microdrives (not all the commercial Microdrives) have
the same type of Water Exposure Seal that are used in cellular
phones.
Before checking the failures, check whether there is a Water Ex­posure Seal display appeared.
In addition, check whether there are any significant scratches,
bends, or dents that shows the sign of falls or shocks.
Other check items are as follows.

(1) Check whether there are any letters written with a pencil or

a pen on the label of the Microdrive. The pen pressure
gives distortion on the Microdrive, resulting in an operation
failure. It is noted in the Instruction Book.

(2) Check whether there are any stickers affixed on the Micro-

drive. The space between the Microdrive and the housing
is very little. Affixing unnecessary stickers may lead load­ing the Microdrive in a wrong position, resulting in contact
failure or remove disk failure. There is a hole on the reverse
side of the Microdrive for ventilation through special filter.
Sealing the holes gives effect on the operation.

(3) Check whether the Microdrive label is peeled or turned. If

there are peel or turn in the label, the loading failure may
occur. Peels or turns will not occur under normal condi­tions, thus storage or usage under hot and humid condi­tion, near organic solvent, or exposure to the direct sunlight
are considered.

(No.YF061)1-7

When it is submerged, the white
Water Exposure Seal turns to red.
As the center part of the seal turns
to pink, the color seen from the
hole is pink. The 1mm hole
diameter prevents the seal from
getting affected by wet hands
under normal conditions. It is not
affected by the humidity of normal
storage or operational conditions.

Normal condition

Water Exposure Seal
display is appeared
(changes from white to red)

Displays of Water Exposure Seal

6mm

1mm

2mm

1.5mm 1.5mm

4mm

Air is taken into inside
the Microdrive from this
hole through special
filter for ventilation. DO
NOT SEAL THIS HOLE
is displayed.

Location of a Water
Exposure Seal (inside)

2.1.4.3

Main unit operation failures caused by the main unit/

Reverse side of the Microdrive

Microdrive failures.

2.1.4.2 There is a possibility of a Microdrive being damaged even

though there is no notable failure in appearance.
Main unit failures also result in abnormal operation in a Micro­drive.
Identifying the causes of the failures in the main unit is explained
in this section.
In the diagram, MD stands for a Microdrive, CG for a compact
flash card, and SD for a SD card.

2.1.4.3

MD Diagnosis

Backup the record
of the user MD

Can it be

back upped?

YES

Perform the DDD Full Check

Troubles?

YES

Format the MD
with the main unit

Perform the DDD Clean Disk

Perform the DDD Full Check

Return the user backup data.

Troubles?

YES

MD failure

2.1.4.4 Operation failures caused by main unit failures

2.1.4.3 Judging from the separation of the main unit and MD, the

operation failure is more likely to be caused by the main unit fail­ure. However, the main unit failure has not been determined yet,
as there is a possibility of the user MD failure causing the main
unit damage. The following procedure shows how to determine
the main unit failure.

Backup by connecting to the PC via USB or PCMCIA adapter

Read/ write by other

NO

devices is impossible

Go to 2.1.4.5

Check the emergency

NO

record of the main unit

Any record?

Format the MD with the main unit

Perform the DDD Clean Disk

Return the user backup data

Perform a detailed operation

NO

check by using the user MD

Troubles?

Main unit failure

NO

YES

YES

Either the bad data file or the
damaged MD causes the disabled
read/ write is not yet determined
at this point.

Go to 2.1.4.4

Although main unit failure is generally
speculated, the cause of the failure is
not determined whether the main unit/
MD at this point

Perform an operation check on
all items including MD and SD

The failure is resolved by
performing the formatting

NO

and the Clean Disk.

End

2.1.4.4

Main unit
diagnosis

An operation check
with other MD

Troubles?

NO

YES

An operation check
with CF and SD

Troubles in both

SD and CF?

YES

NO

Troubles
only in CF?

YES

NO

Main unit failure

The user MD/ FC may bend the
main unit socket pin(s). Using
defective MD/ FC results in
repeated failures, as they bend the
main unit connector every time
they are used. User MD/ CF should
be checked when abnormal main
unit socket is found.
Ask how many MDs/ CFs the user
has, then check all user MDs/ CFs.

2.1.4.5 Disabled read/ write with other devices

When read/ write cannot be done with the main unit, the main
unit failure is considered in most cases. Recognition failure
caused by the main unit writing bad data can be considered.
The causes of read/ write failures are as listed below.

(1) Damaged mechanism parts or electric parts inside the MD.

(Hardware failure)

(2) Damaged information in the MD. (Software failure)
In the case (1), it seems very difficult to recover, but there is a
possibility of recovery in the case (2) by using commercial software.
The following procedure shows how to figure out whether the
damage is in the hardware or in the software, and whether it is
recoverable or not.

2.1.4.5

Recoverability
diagnosis

An operation check
with other MD

Troubles?

NO

Main unit failure

2.1.4.5.1 Microdrive hardware failure

Although no failure was found in the MD appearance at the time
of the separation of 2.1.4.1, actually there is considerable dam­age disabling the operation. In this case, "Shipping Damage"
(damage caused by the transportation) is displayed as a result of
DDD diagnosis. Surely, a possibility of the products damaged on
route from the production plants to the shops and then to the con­sumers cannot be denied.
However, MDs are stored in protection cases or in main units and
the transportation shock that damages only the MDs is unrealis­tic. A failure cause by the user handling is more likely considered.

YES

Perform an operation check with CF and SD.
Use SD with theoretical value of 10MB/s or more.
Use CF with 40x high speed or more.
For details, refer to 5.
The Combinations of media and the main unit

Main unit failure

Check bend or break
in the socket pin(s).

Check the MD socket
of the main unit.

Troubles?

NO

YES

Check the connector part of
the main unit housing and
user MD/ CF

Carry out the servic

End

A failure caused by the user handling
is considered, and no more recovery

Perform the DDD

Full Check

Troubles?

YES

MD Hardware failure

is expected.
Please explain the user that it is a
MD failure.

NO

The main unit operation failure may be
caused by an unrecognizable MD after
user's editing works such as formatting
and adding/ deleting files or
maintenance works such as
defragmentation and check disk done
with a device other than the main unit.

Main unit failure

MD software failure

1-8 (No.YF061)

Recovery method

Asking a data recovery company (a data salvage company)
seems the only way.
Even if the MD is not recognized a drive, a transmission may be
possible with the MD (light hardware failure). In this case, system
recovery software such as Norton Utilities in Norton System­Works 2004 (NOTE1: ) may help drive recognition.
Once the drive recognition is recovered, the record may be re­covered by the method mentioned in 4.5.2 MD software failure.
However, if it is a hardware failure, banning the use of the MD is
strongly recommended.

2.1.4.5.2 Microdrive software failure

Most of the software failures are caused by the unrecognizable
MD after user's editing works such as formatting and adding/ de­leting files or maintenance works such as defragmentation and
check disk done with a device other than the main unit.
Many cases under this condition, recovery can be done by using
recovery software, which can recover MPEG2 data, such as Final
Data 2.0 Premium. It enables the drive recognition and the data
reading. Once the data is recovered, follow the below procedure.

2.1.4.5.2

Countermeasure for
the software failure

Start the data

recovery software

Is the data
recognized

NO

Recommend a data
recovery company

Perform an operation check on
all items including MD and SD.

YES

Backup the user MD record

Format the MD with the main unit

Perform the DDD Clean Disk

Perform the DDD Full Check again

Troubles?

NO

Return the user backup data

Perform a detailed operation
check by using the user MD

Troubles?

YES

Main unit failure

If backup is impossible,
do not proceed to the further works.

Further recovery is not expected.
Please explain the user that it is
a MD failure.

MD failure

YES

Explain the user that the possible cause
of the failure may be the users PC works.
Check again whether the user did a
prohibited or not guaranteed operation
by the Instruction Book.

Performing formatting

NO

and Clean Disk resolve
the failure

End

NOTE1:

Norton SystemWorks 2004 (Latest version on 2004/ 9/ 29)
It is Symantec's data recovery software.
For system requirements and other details, please check their
web site.http://www.symantec.com/region/jp/products/

NOTE2:

Final Data 2.0 Premium Office (Latest version on 2004/9/29)
It is AOS Technologies' data recovery software.
Although there are some kinds of recovery software as FINAL­DATA series from this company, this is the cheapest one that
can recover MPEG2.
For system requirements and other details, please check their
web site.http://www.finaldata.ne.jp/

2.1.4.5.3 Reusing Microdrives

If a Microdrive of a user is reused for another user, normal data
deletion may not completely erase the previous user's informa­tion (images) and the previous user's information may come
back. Unlike hard disks of PCs, most of the recorded contents of
Microdrives are images and audio data, thus there is a little pos­sibility of recorded personal information in Microdrives. However,
proper handling in reusing Microdrives is required as a business
organization.

There are levels in erasing data in disks.

• Level 1: Zero Write method (once)

• Level 2: Random Write method (once)

• Level 3: Random/ Zero Write method (twice)

• Level 4: US Department of Defense (DoD5220.22-M)

• Level 5: US Department of Defense (DoD5220.22-Expanded)

• Level 6: Guttmann method
At least level 3 data erasure is recommended.
Data erasure software is commercially available from software
companies. It seems convenient to use Final Data 2.0 Premium
as there is a data erasing function in it.

2.1.5 Combinations of media and a main unit

MC100 - 200 can record movies, pictures, and audio on compact
flash cards, SD cards in addition to Microdrives. Recording mov­ies is partially limited. Characteristics of each medium, available
or limited operation items, and available operation time are ex­plained in this section.

2.1.5.1 Types of media

Microdrive

Type

Capacity

Price

Unit price per 1MB

Commercially available
maximum capacity

15yen/㧬MB 52yen/㧬MB58yen/㧬MB

Available media for MC100-200

Compact Flash card

2GB 1GB1GB1GB

33000yen 52000yen58000yen

4GB 1GB1GB1GB

38000yen

38yen/㧬MB

SD card

Data for comparison

Memory stick

Commercially available maximum capacity
MC100 - 200 are basically designed to record movies by using
Microdrives.
MC100 - 200 have 2 types of slots, one for a Microdrive or a
Compact Flash card, and the other for a SD card.
From the menu, movies/ pictures/ audio can be selected for a
medium in either one of the slots.

Recording mode

Movies

Pictures

Audio

Factory setting

MD/CF

SD

SD

As movies, pictures, and audio can separately select the slots,
using one slot for all recording mode is possible. However, as
movies require large capacity and high transmission speed, the
available recording mode (image quality) is limited.
(Refer to 5.2.3 Image quality and support media.)
Recording movies in Microdrive setting is recommended.

2.1.5.2 Movies

Movies are recorded SD-VIDEO1.1 standard, (images) MPEG­2-PS (with RDI),(audio) Dolby Digital AC-3, PAL 50 frame aspect
4:3
Movie recording is explained as follows.

2.1.5.2.1 Recording rate

Image Audio

Image quality mode

㧔Image size㧕

Ultra fine

㧔720480㧕

Fine

㧔720480㧕

Normal

㧔720480㧕

Economy

㧔325240㧕

Image quality
(Sensitivity comparison)

Equivalent
to DVC
Equivalent
to DVD cam

Equivalent
to VHS

Equivalent
to video CD

Bit
rate

8.5Mbps

5.5Mbps

4.2Mbps

1.5Mbps

CBR/

VBR

CBR

CBR

VBR

VBR

Sampling
frequency

48 kHz

48 kHz

48 kHz

48 kHz

Bit
rate

384kbps

384kbps

256kbps

128kbps

CBR/

VBR

CBR

CBR

VBR

VBR

RDI

32.768kbps

32.768kbps

32.768kbps

32.768kbps

Total bit rate

8.92 Mbps

5.92 Mbps

4.49 Mbps

1.66 Mbps

(No.YF061)1-9

2.1.5.2.2 Recording time (approximately minutes)

Ultra fine

㧔720480㧕

SD㧛CFޓ128MB

SD㧛CFޓ256MB

SD㧛CFޓ512MB

SD㧛CFޓ1GB

MDޓ2GB

MDޓ4GB 60 minutes 90 minutes 120 minutes 300 minutes

2 minutes

4 minutes 6 minutes

8 minutes 12 minutes

16 minutes 24 minutes

30 minutes 45 minutes

Fine

㧔720480㧕

3 minutes

Normal

㧔720480㧕

4 minutes

7 minutes

15 minutes

31 minutes

60 minutes

Economy

㧔352240㧕

10 minutes

21 minutes

43 minutes

86 minutes

150 minutes

2.1.5.2.3 Image quality and support media

Image quality mode

Ultra fine

Fine

Normal

Economy

Microdrive

1GB or less 1GB or more







٤

Not for high speed
transmission

٤

٤

٤

٤

Compact Flash card

For high speed
transmission







٤

٤

٤

٤

٤

SD card







٤

For high speed
transmission

Not for high speed
transmission

٤

٤

٤

٤

As shown above, Microdrives of 1GB or less, Compact Flash
cards, and SD cards that are not for high transmission speed
cannot record movies except in the economy mode.
If a recording mode other than economy mode is selected and
the recording is started, " Recording cannot be done with this
Medium speed" is displayed.
Microdrives can be judged by the capacity whether they are for/
or not for the movie recording. However, Compact Flash cards
and SD cards are difficult to judge from the appearances.
A Toshiba SD card and a LEXAR Compact Flash card are com­pared below.

On the package of the product,
it is noted as high-speed type.
The transmission speed of this
product is 10MB/S is written.

There is no description on
this product as a high-speed type

Package of the product for high data
transmission speed

It can be judged whether it is a
high-speed type or not by the
appearance as the color is
different.
As there is no description on the
product, a consumer does not
recognize the product of high
speed or normal speed, if he/ she
has no product to compare.

Appearance of the product for
high data transmission speed

Package of the product not for
high data transmission speed

Appearance of the product not for
high data transmission speed

SD card that is operation checked as a high-speed type has
transmission speed of 10MB/s or more. High-speed products
with less capacity (9MB/s etc.) may operate, but operation can­not be guaranteed.

On the package of the product,
it is noted as high-speed type.

There is no prescription of high-speed
type on this product package

Description of the transmission
speed as 40x

Package of the product not for
high data transmission speed

It can be judged whether it is a high­speed type or not by the appearance
as the color and the design are
different. The consumers can see
whether it is a high-speed type or not
as a description of 40x speed is
written on the product.

Appearance of the product for
high data transmission speed

Package of the product not for
high data transmission speed

Package of the product not for
high data transmission speed

Compact flash card that is operation checked as a high-speed
type has transmission speed of 40x or more. High-speed
products with less capacity may operate, but operation cannot be
guaranteed.

2.1.5.3 Pictures

Pictures are recorded as JPEG compression picture Exif2..2,
DCF2.0, PictBridge, DPOF standard conformity. There is no re­striction of picture recording media or spec, but equivalent trans­mission speed as for movies is required for rapid shooting.
Picture recording is explained as follows.

2.1.5.3.1 Image size and recording numbers

%CRCEKV[

32MB

64MB

128MB

256MB

512MB

1GB

2GB

4GB

2KEVWTG
OQFG

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

(KPG

5VCPFCTF

UXGA

(16001200㧕

34

50

65

110

145

245

290

490

699

2285

1398

2797

9142

5595

9999

+OCIGUK\G

SXGA

(1280960㧕

60

120

125

250

280

560

145

245

1094

3555

2188

71104570

4376

9999

8752

9999

(1024768㧕

XGA

95

185

200

375

430

865

865

1735

1706

5565

3412

9999

9999

9999

9999

(Approx. numbers)

VGA

(640480㧕

205

375

425

755

2210

5200

7756

9999

3878

9999

7756

9999

99996826

9999

9999

9999

The value varies slightly according on each medium, Microdrive,
Compact flash card, and SD card. In addition, these values are
theoretical values, and it does not guarantee the recording num­bers.

1-10 (No.YF061)

2.1.5.4 Audio (Voice memo)

Audio is recorded linear PCM digital recording system (WAV),
stereo.There is no restriction of audio recording media or spec.
Audio recording is explained as follows.

2.1.5.4.1 Recording mode and sampling frequency

Recording mode

Fine

Standard

Economy

Sampling

Frequency Data

48 KHz

16 KHz

8 KHz

16 bit

16 bit

16 bit

Audio mode

Stereo

Stereo

Stereo

Recording
bit rate

1.536 Mbps

512 Kbps

256 Kbps

Data capacity
per minute

11.52 MB

3.84 MB

1.92 MB

2.1.5.4.2 Recording time

(Approx. hours, minutes)

Standard Economy

2h10m

8h40m

17h21m

4h25m

17h21m

34h43m

SD

㧛CFޓ512MB

MDޓ2GB

MDޓ4GB

Fine

44m

2h50m

5h47m

The value varies slightly according to each medium, Microdrive,
Compact flash card, and SD card. In addition, these values are
theoretical values, and it does not guarantee the recording time.

2.1.6 About DDD

CF II compliant 1-inch small hard disk (Microdrive) is used as re­cording media of this model. For operation check and mainte­nance of this Microdrive, drive fitness test software: Drive
Diagnostics &Disposition (DDD) is provided from Hitachi Global
Storage Technologies (HGST) with a license agreement. HGST
supplies the Microdrive's parts to JVC.
The handling of this software is explained as follows.

Notice

This software is developed to confirm, analyze, and restore the
various kinds of hard disks. However, JVC is allowed to use
DDD software only to test, confirm, and restore the Microdrive
to the factory setting.
Thus, the use of other functions is prohibited.
Using software other than DDD may damage the installed hard
disk of the PC or may disable the reading of the stored data.
Please understand that we do not at all compensate any dam­age caused by the usage other than instructed, and that we
cannot accept any inquiry.
If you have any questions or requests, please do not contact
HGST that is displayed when installing the software, but do
contact Camcorder CS Group, AV & Multimedia Company.

2.1.6.1 Platform Requirements

DDD operation requires the following platform requirements. Al­though it may operate on lower specification platforms, we do not
guarantee the operation under such platforms.

PC/AT compatible models ( It cannot be used with Macintosh)
CPU :Pentium 600 MHz or faster
OS:Windows 98/NT4.0(SP4 minimum)
RAM with 192MB or more (NOET1)
Memory: 100MB or more empty hard disk space
PCMCIA card (PC card) TYPE II slot (NOTE2)
Monitor / graphics: 256 colours or more, 800 x 600 minimum,

(1024 x 768 or more is suggested)

NOTE1:

When DDD is installed to a PC with less RAM capacity, the fol­lowing symptoms may occur.

• An error occurs during the installation, and the installation
does not complete.

• The operation becomes unstable while starting up the soft­ware.

NOTE 2:

There must be PCMCIA card (PC card) TYPE II slot: equipped
to note PCs and some desktop PCs.
DDD cannot be used with CF / Microdrive reader with USB, or
CF direct insert drives.

2.1.6.2 How to get DDD

(1) DDD (DDD.EXE) can be downloaded from JS-NET. After

download, execute DDD.EXE to create DDD SETUP folder.

2.1.6.3 Installation procedure

(1) Double click the SISetup.exe in the DDD SETUP folder to

start up.

Double click this program.

(2) Press Next button to proceed the installation.

Press Next button

(3) Select the PC's start up system for installation.

• IDE, Primary Controller, Master HDD

• IDE, Secondary Controller, Master HDD

• SCSI, First Controller, ID 0

• SCSI, Secondary Controller, ID 0

(No.YF061)1-11

Usually IDE, Primary
Controller, Master HDD will
be selected.

(4) Although the error massage on the right may appear on cer-

tain PCs, continue the installation by pressing OK button.

Press OK button

(5) When "Registration Info:" is displayed press Next button to

proceed the installation.

will DESTROY ALL DATA on the drives which are tested.
Do you still want to continue?" is displayed. When you fully
understand the description, press Yes (Y).

Press Yes (Y) button.

(8) When "License Agreement" is displayed. When you fully

understand the description, press YES.

Press YES button

Press Next button

NOTE:

Although Registration Info requires ID registration, there
is no need to register, as it has nothing to do with JVC­VICTOR.

(6) Press Next button, to continue the installation.

Press Next button

(9) When "User Information" is displayed, input any letters in

the Company box. Next button is displayed after input,
press Next button.

In the Company box,
input any letters such
as JVC etc.

Next button is displayed after some letters
are input in the Company box.
When Next button is displayed, press the
button.

(10) Select the folder for installation, then press Next button.

Use default folder. (NOTE)

NOTE:

"It is strongly recommended that you quit all Windows
program before running this Setup program" is dis­played. Finish all other programs that are running, and
then press Next button to continue the installation.

(7) The caution, "Please understand that this tool is for

Resellers only. The default tests are DESTRUCTIVE and

1-12 (No.YF061)

Press Next button

(11) Select the program folder, then press Next button.

Use default folder. (NOTE)

Press Next button

NOTE:

For installation folder name and drive, use default ad­dress and drive as long as there is no problem with the
PC. If the default settings are changed, programs follow­ing this installation do not operate properly.

(12) When a confirmation "Yes, I want to launch Hitachi DDD-SI

now" is displayed, press Finish button.
(DDD will not be started until the starting up preparation in
4 is completed.)

(3) Double click the My Computer icon, then select Properties.

(4) 4.Click the Hardware tab in System Properties, and then

click Device Manager.

Click the Hardware tab

Press the Device Manager button.

(5) 5.Click IDE ATA/ATAPI controllers in Device Manager.

Do not check (click)

Press finish button

2.1.6.4 Preparation for start up

(1) On the desktop, icons (4 kinds) shown below are created.

Delete those icons, as they are not to be used.

(2) From the DDD SETUP folder, copy the shortcut icons (2

kinds) shown below to the desktop.
(These are the links for the program exclusive to JVC.)

NOTE:

The names of icons, display contents and display parts
differ according to the types of installed OS, their ver­sions, and each PC's settings. The following procedure
is explained using Windows2000 as an example.

Click IDE ATA/ATAPI controllers

(6) Open the PCMCIA IDE ATA/ATAPI controller property,

then click the Resources tab.

Click the Resources tab

(No.YF061)1-13

(7) Take notes of the I/O range, then press Cancel button to

close the Property Setting window.

Take notes of the I/O
range shown here

(8) Open the folder where DDD is installed in Explorer etc

(Usually the folder is C:\Program Files\ Hitachi DDD- SI )

(10) Select all the files in the input folder and delete them all.

Select all the files the folder
and delete

NOTE:

These files are used for other hard disks. If they are start­ed up carelessly, it may cause serious impact on the
hard disk or other connected devices.
Therefore, prevent any operation mistakes by deleting all
the files except the one which is used with Microdrive.

(11) From the DDD SETUP folder, copy the two files

"FullCheckMicrodrive__jvc.pid" and "CleanDisk..pif" in the
input folder.

Inside the DDD SETUP folder

(9) Open the input folder in Hitachi DDD- SI.

Open the input folder

1-14 (No.YF061)

Input folder located under the DDD installed folder

(12) Double click the copied icon "FullCheckMicrodrive_jvc" on

the desktop to start DDD.

(13) Click File to open Menu, then select "Program Settings

Alt+P" from the Menu and click.

(16) Finish the program either by pressing X button or press Exit

in the File menu.

Click File

Select "Program Settings
Alt+P" from the open Menu

(14) Input the previously noted and partially devised I/O range

into PCI/PCMCIA ATA Addresses item on the DDD
Program Options screen.

Input the original address
which exceeds the I/O range.

Input the address which takes away
1 from the original address
that exceeds the I/O range.

(e.g.) Noted I/O range
FEF0 - FEFF
Input FEF0 in the first column.
Input FEFE, which is -1 from FEFF.

Press OK button

(15) When the PCI/PCMCIA ATA Addresses input is

completed, press OK button.

Press X button

(17) When the reconfirmation "Are you sure you want to end the

application?" is displayed, press Yes (Y) button to finish the
application.

Press Yes (Y) button

2.1.6.5 Uninstall

(1) ninstall the Hitachi DDD- - SI from Add/ Remove Programs

on the Windows.

2.1.6.6 How to use DDD

NOTE:

Before starting DDD, be sure to back up users' all information
on the Microdrive.
Executing DDD may destroy all the user information, and re­covery may become impossible.

In DDD there are two definition files (pid files) that have the
information which determines the operation of DDD.
Two pid files are exclusively prepared for JVC.
They are: FullCheckMicrodrive_jvc.pid, CleanDisk.pif

2.1.6.6.1 FullCheckMicrodrive_jvc.pid (FullCheck)

FullCheckMicrodrive_jvc.pid is the confirmation pid file to confirm
the Microdrive. (FullCheck)
It is used to confirm the drive fitness when repair or check is car­ried out.

(1) Load the PCMCIA card adapter with the Microdrive and in-

sert it into the card slot of the PC.
* If there are two card slots, use the first slot.

CF readers/ writers using USB or drives that can be di­rectly connected CF cards to the PC can be recognized
as drives on the PC.
However, they cannot to be recognized as media on DDD.
Therefore, please use the PCMCIA card adapter.

(2) Click My Computer to check whether the drive is newly rec-

ognized.

Usually when recognized on the PC,a new drive letter is
given.

(3) Double click the FullCheckMicrodrive_jvc.pid icon that has

been copied on the desktop to start up DDD.

(4) Take a check out at the next of SCSI.

(No.YF061)1-15

(5) Press the Media Recognition button (shown above) to rec-

ognize the medium.

Click to take off the check
at the next of SCSI

Press the Media
Recognition button
(shown above) to
recognize the medium.

(6) It will take about 20 - 30 seconds to recognize the medium.

NOTE:

Detected and displayed here is the name of Microdrive.

When the recognition is completed
normally, the detected medium is displayed.

NOTE:

Although the usual checking time is about 15-20 min­utes, it varies depending on the each PC's performance.
If it takes too long (more than 30 minutes), there may be
a failure in checking. Finish the checking by pressing
Abort button and start the checking again.

(10) Press either Print button or View button to print or display

the checking result.
When confirming the checking is finished, press Exit
button.

Exit button

Print button

(7) Click the recognized media display (Model name) to the

select status (Highlighted) and press go button.

Click the selected media

Press go button

(8) The Window is open to start the checking.

To finish during the procedure, press abort button.

(9) When "Drive Explorer completed successfully." is

displayed here, the checking is finished.
At the same time Print, View, Exit buttons are displayed.

(11) The checking result will be output if the Print button is

pressed.
The checking result will be displayed if the View button is
pressed.
Pressing the Print button located in the bottom right can do
the printing.
When the confirmation is done, press Exit button to finish
the result display.

Print button

Exit button

(12) Press either X button or Exit in the File menu to finish the

program.

1-16 (No.YF061)

Press X button

When "Drive Explorer completed
successfully." is displayed here,
the checking is finished.

(13) When " Are you sure you want to end the application?" is

displayed, press Yes (Y) to finish the application.

Press Yes (Y) button

2.1.6.6.2 Test results and countermeasure

1.2.6.6.1Reviewing the test results of FullCheckMicrodrive_jvc.
pid (FullCheck) and the countermeasure are explained here.

drive, model name of the drive and the production place are
also written.

Drive model
name

Production
place

Serial
number

The first 8 digits are serial number.

ԚThis is a serial
number of the
Microdrive and it
is exclusive to
each product.

ԙThe time and date
of the test results
output is recorded here

㨩

ԞThe time and date of the start

and end the testing are displayed here.

ԟThe results are recorded.

ԘThe Microdrive model

name is displayed here.
It shows that the
Microdrive is
HITACHImade 4GB type.

ԘThis is also the
Microdrive model name.

ԛThe capacity of the
disk is displayed here.

ԜThe testing detail is
displayed here.

ԝThe comment
on the testing
results are
displayed here.

As there is more
information
below, check it
with the scroll
bar.

Be careful, as the information
within the dotted line is not shown
in the above display.

1. Drive model name

The HITACHI Microdrive model name is displayed here.
HMS360402D5CF00 :HITACHI(IBM) 2GB type Microdrive
HMS360404D5CF00 :HITACHI(IBM ) 4GB type Microdrive

2. Time and date of the output date

The time and date of the test results output is displayed here.
(e.g.) If it was output at 4:30 p.m. on Monday, September 13th,
2004, it will be shown as below.
File created on Monday ,13 .09.2004 at 14 :30 :09

3.Serial number

The serial number is exclusive to each product. It is the eight
digit numbers of the serial number part (bar code) on the re­verse side of the Microdrive. On the reverse side of the Micro-

Reverse side of the Microdrive

4. Disk capacity

The recordable disk capacity is displayed here.
It is shown as below.
2GB type Microdrive: 1952 MB
4GB type Microdrive: 3905 MB
In the actual display, 2GB and 4GB are converted to Byte. So
it is displayed under the Microdrive display of 2G or 4G with
MB.

5. Testing details

When FullCheckMicrodrive_jvc.pid is carried out, the six kinds
of testing are performed.

(1) Drive Initialization

The test checks whether the drive can recognize or not.
Errors will be detected if it cannot recognize at all as a re­sult of fall, shock, or submersion. It is more likely to have
a failure in electrical circuit than a mechanical one (mo­tor).
Checking items:Submersion mark, scratch on the exteri­or, dent, and bend.

(2) Check Servo Data (DFT)

The test checks whether the disk is decentered or not.
If the motor shaft is decentered as a result of fall or
shock, the interior head cannot pick up the recorded sig­nal on the disk.
Checking items:Scratch on the exterior, dent, and bend.

(3) Check for Scratches on Media

When a cluster error occurred, an alternative area is cre­ated to avoid the use of the damaged cluster. This test
checks the distribution of the alternative area. It does not
detect scratches of the user data area caused by fall or
vibration.
Checking items:None

(4) Check Product Internal Error Logs

This test collects the error information that was recorded
at the time of production.
It carries two tasks, checking the Error Logs and the
numbers of the alternative sectors.
Checking items:None

(5) Check GMR Head Amplitude

This test checks the output of the head. Read and write
errors by electrostatic, by shock that changes the dis­tance between the head and the disk may cause errors
on writing or reading.
Checking items:scratch on the exterior, dent, and bend

(6) Media Test(s)

This test checks whether the written information can be
correctly read or not by comparing writing data and read-

(No.YF061)1-17

ing data. Randomly select about 300 parts from the user
data area. Read the data and write in other data in that ar­ea, then read the data again to check if the correct read/
write can be performed. Two tests, CSO Read- Write­Compare and Read Sequential Test that checks all the
sector including the red\cording area, are performed.
Checking items:scratch on the exterior, dent, and bend.

6. Comment on the results of the test

The comment is displayed by totally judging from the six test
on 5. results, and by speculating the cause of the Microdrive
failure.
If there is no problem at all, a comment "DO NOT RETURN TO
YOUR SUPPLIER" is displayed.
If any failure is found on the Microdrive, a comment "RETURN
THIS DRIVE TO YOUR SUPPLIER" is displayed. In the early
stage, the defected parts are analyzed for modification. Please
follow the instruction from JVC.

7. The time and date of the start and end the testing are dis­played here.

The time and date of the start and the end of the test, and the
testing time are displayed here.
(e.g.) If it was started at 4:30:09 p.m. on Monday, September
13th, 2004, and finished at 4:45:23, and the testing time is 15
minutes and 14seconds, it will be shown as below.
Explorer Start : 16:30:09 on Monday, 13.09.2004
End : 16:45:23
Delta :00:15:14

8. Test results

The test results of the six test on 5. are displayed.
If there is no problem at all, "Drive passed Explorer WITHOUT
a problem." Is displayed.
If any failure is found, "READ SEQUENTIAL TEST ERROR" is
displayed to show where the errors are found. Decide the
countermeasure not by this comment but by the comment
sown on 6.

2.1.6.6.3 CleanDisk.pif

The CleanDisk.pif (CleanDisk) is a file which restores the Micro­drive to its factory settings. It is use to restore the Microdrive to
its factory settings when it does not operate properly as a result
of a failure in format etc. It can also be used to completely delete
the user information on the Microdrive.

(1) Load the PCMCIA card adapter with the Microdrive to be

clean disked, and insert it into the PC card slot of the PC.
*If there are two PC card slots, use the first slot.

CF readers/ writers using USB or drives that can be di­rectly connected CF cards to the PC can be recognized
as drives on the PC.
However, they cannot to be recognized as media on DDD.
Therefore, please use the PCMCIA card adapter.

(2) Click My Computer to check if the drive is newly recog-

nized.

Usually when recognized on the PC, a new drive letter is
given.

(3) Double click the copied CleanDisk.pif icon on the desktop to

start DDD.

(5) Press the media recognition button ( shown above) to rec-

ognize the medium.

Click to take off the check
at the next of SCSI

Press the Media
Recognition button
(shown above) to
recognize the medium.

(6) It will take for about 20 - 30 seconds to recognize the

medium.

NOTE:

The detected and displayed is the Microdrive model name

When the recognition is completed
normally, the detected medium is displayed.

(7) Click the recognized media display (Model name) for the

selected status ( Highlighted), then press go button.

Click the selected media

Press go button

(8) The window is open to start DiskClean.

To finish during the procedure, press abort button.

(9) The test is completed when "Drive Explorer completed

successfully." is displayed here. Print, View, Exit buttons
are displayed at the same time.

(4) Take off the check at the next of SCSI.

1-18 (No.YF061)

When "Drive Explorer completed
successfully." is displayed here,
the checking is finished.

NOTE:

Although the usual checking time is about 15 - 30 min­utes. If it takes too long (more than 45 minutes), there
may be a failure in checking. Finish the checking by
pressing Abort button and start the checking again.

(10) Press either the Print button or the View button to print or

display the test results.
When the test results are checked, press Exit button.

Press X button

(13) When asked to finish the program, press Yes button.

Exit button

(11) When the Print button is pressed the test results are output

to the printer, and the View button is pressed the results are
shown as below. Pressing the Print button in the down right
can also print the results. When the checking the result is
finished, press Exit button to finish the display of the test
results.

ԘThe Microdrive model
name is displayed here.
It shows that the
Microdrive is
HITACHImade 4GB type.

ԘThis is also the
Microdrive model name.

ԛThe capacity of the
disk is displayed here.

ԜThe testing detail is
displayed here.

ԞThe time and
date of the start
and end the
testing are
displayed here.

Print button

Exit button

ԚThis is a serial
number of the
Microdrive and it
is exclusive to
each product.

ԙThe time and date
of the test results
output is recorded here.

㨩

ԟThe results are recorded.

When CleanDisk is executed, it performs the following tasks.

Test items Outline

(1) Drive Initialization Test whether the drive recognizes of not.

(2) Set Features Initialize the internal function of the

(3)

Cleanup and/or un-clip
Entire Disk

(4) Media Test(s)

Microdrive.

The following tasks are carried out

1.Delete all data

2.Restore to the original capacity

3.Formatting (Deleting the lacked
information)

4.Clear the error information

5.Deleting other OS settings

Final test in writing/ reading

Press Yes (Y) button

NOTE:

Performing CleanDisk will not change the disk name given by
the user.
If the PC will be returned to the same user, there will be no
problem.
If the user is changed, change the disk name to MICRO­DRIVE.

This is the status that
the user changes the
disk name to Travel 1.

If the user is changed,
change the disk name to
MICRODRIVE.

(12) Press X button or press Exit in the File menu to finish the

program.

(No.YF061)1-19

2.2 WIRING DIAGRAM

T

W

ZOOM SW

MENU

LCD

MODULE

24

CN7801

7
0

LCD SUB

OPE3

TRIG

CURSOR KEY

DET SW(OPEN/CLOSE)

2

30

CN306

CN7802

61211

CN305

CN304CN209CN202

OPE2

HEAD PHONE

CN310

REG

4
0

CN301

10

CN206

BATTERY

DC JACK

MULTI

REG

V OUT

REG IF

CN302CN305

25

CN207CN208

BATT_TERM

6

CN307

20

CN309

CN308

HINGE

30

CF

6
0

CN9904

MICRO DRIVE

CN9901

25

CN9801

TEMP.SENS

SOCKET

CN9902

25

CN9802

MODE SW

SPEAKER

MIC

STROBE

STROBE

STRB

OPE1

10

SENSOR

WB

13

8
0

CF SUB

CN9803

USB

P.PRCS

MPEG2

NUCORE

DIGITAL

1

DIGI IF

MEMORY

CN203

110

CN102

30

CN5201

0

CN5101

CDS

3
0

JIG CONN

SD/MMC

SOCKET

CN101

51

CN5102

GYRO2

TG V.DR

CDS

24

V I/O

AUDIO

GYRO1

CN201

SUB CPU

LCD DRV

ANALOG

CN205

2
0

33

ANA IF

CN204

TALLY

LITHIUM BATTERY

AC97 OP DRV

CCD

5

CCD

0

CN103

30

CN104

SD/MMC CARD

CN5103

MAIN_IF

51

7

4

OP

1-20 (No.YF061)

SECTION 3

DISASSEMBLY

3.1 BEFORE ASSEMBLY AND DISASSEMBLY

3.1.1 Precautions

• Be sure to disconnect the power supply unit prior to mounting
and soldering of parts.

• Prior to removing a component part that needs to disconnect
its connector(s) and its screw(s), first disconnect the wire(s)
from the connector(s), and then remove the screw(s).

• When connecting/disconnecting wires, pay enough attention
not to damage the connectors.

• When inserting the flat wire to the connector, pay attention to
the direction of the flat wire.

• Be careful in removing the parts to which some spacer or
shield is attached for reinforcement or insulation.

• When replacing chip parts (especially IC parts), first remove
the solder completely to prevent peeling of the pattern.

• Tighten screws properly during the procedures. Unless
otherwise specified, tighten screws at a torque of 0.118N

·cm). However, as this is a required value at the time of

(1.2kgf
production, use the value as a measuring stick when
proceeding repair services. (See "SERVICE NOTE" as for
tightening torque.)

3.1.2 Destination of connectors

Two kinds of double-arrows in connection tables respectively

show kinds of connector/wires.

: Wire: Flat wire : Board to board (B-B)

: The connector of the side to remove

CONN. No. PIN No.CONNECTOR

CN2a

CN2b

MAIN CN101

MAIN CN103

MONI BW CN761

MINI BW CN762

3.1.3 Disconnection of connectors (Wires)

Wire

· Pull both ends of the connector in the arrow
direction, remove the lock and disconnect the flat
wire.

B-B Connector

B-B Connector

· Pull the both ends of the board in the direction of the arrow, and remove the B-B Connector.

FPC Connector

· Extend the locks in the direction of the arrow for
unlocking and then pull out the wire. After
removing the wire, immediately restore the locks
to their original positions because the locks are
apt to come off the connector.

Wire

FPC Connector

Lock

B-B Connector

Fig.3-1-1

3.1.4 Tools required for disassembly and assembly

Torque driver

YTU94088

Bit

YTU94088-003

Tweezers

P-895

·m

40

10

• Torque driver

Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.

• Bit

This bit is slightly longer than those set in conventional torque
drivers.

• Tweezers

To be used for removing and installing parts and wires.

• Chip IC replacement jig

To be used for replacement of IC.

• Cleaning cloth

Recommended cleaning cloth to wipe down the video heads,
mechanism (tape transport system), optical lens surface.

3.2 ASSEMBLY AND DISASSEMBLY OF MAIN PARTS

3.2.1 Assembly and disassembly

When reassembling, perform the step(s) in reverse order.

STEP

No.

[1]
[2]

[8]

PART

TOP COVER ASSY
UPPER ASSY
(Inc. VF ASSY,
SPEAKER/MONITOR)
E.VF UNIT(B/W)

(*1) Order of steps in Procedure

When reassembling, preform the step(s) in the reverseorder.
These numbers are also used as the identification (location)

No. of parts Figures.
(*2) Part to be removed or installed.
(*3) Fig. No. showing Procedure or Part Location.

C = CABINET

(*4) Identification of part to be removed, unhooked, unlocked,

released, unplugged, unclamped or unsoldered.

S = Screw
L = Lock, Release, Hook
SD = Solder
CN = Connector

[Example]

• 4 (S1a) = Remove 4 S1a screws.

• 3 (L1a) = Disengage 3 L1a hooks.

• 2 (SD1a) = Unsolder 2 SD1a points.

• CN1a = Remove a CN1a connector.

(*5) Adjustment information for installation.

Fig.
No.

4(S1a), 3(L1a),CN1a

C1

(S2a),2(S2b),3(S2c)

C2-1

2(SD1a),
L2,CN2a,b
2(S8),L8,CN8a

C2-2

POINT

(*4) (*5)(*2) (*3)(*1)

NOTE

-

-

NOTE 8

Chip IC replacement jig

PTS40844-2

Cleaning cloth

KSMM-01

Fig.3-1-2

(No.YF061)1-21

3.2.2 ASSEMBLY/DISASSEMBLY OF CABINET PARTS AND ELECTRICAL PARTS

zDisassembly procedure

STEP

PART NAME

No.

[1]

GRIP LOWER ASSY

[2]

COVER(FR.) ASSY

[1]

GRIP LOWER ASSY

[3]

COVER(TOP)

[4]

REG PWB ASSY

[5]

CF ASSY

[6]

PLATE(ROTALY)

[7]

MONITOR ASSY

Fig.
No.

FA1
FA2
FA3

FA4
FA5-1
FA5-2
FA5-3

FA6
FA7-1
FA7-2

FA8

POINT NOTE

2(S1a),2(S1b)
S2a,S2b,S2c,S2b
L1a, L1b,2(S1c),CN1a,b
S3a,S3b,3(S3a)
CN4a,b,2(S4),CN4c,d,e,f,g,h

-

­CN5a,b,2(S5a),S5b
3(S6)

­4(S7)

NOTE1a

NOTE2a,b

NOTE1b,c

NOTE4a

NOTE4b,c

NOTE4d

NOTE5a,b,c,d

NOTE6
NOTE6
NOTE7

NOTE1a:

When removing, remove the four SCREWS (1-4) first to
avoid damage or deformation of the ARM (COVER) AS­SEMBLY and the STAY (COVER) ASSEMBLY.
During the procedure, be careful with opening and closing of
the BATTERY/ CF CARD COVER.
Also, be careful not to damage the parts with the ARM
(COVER) ASSEMBLY or the STAY (COVER) ASSEMBLY.

NOTE1b:

Be careful in handling the SPACER.
Attach the SPACER to adjust the edge of CN302.

NOTE1c:

When attaching, be careful not to pinch the WIRE.
Pay special attention on the inside of the TRIPOD and the
BATTERY wiring.

-

NOTE5d:

When attaching, connect the SPACER to the CONNECTOR
(CN5a, b), and place the SPACER inside by folding it.

NOTE6:

When attaching, be careful with the wiring,

NOTE7:

When removing, turn the CAMERA ASSEMBLY and re­move the total of four SCREWS, two SCREWS at a time.

zDestination of connectors

CN.NO.

CN1a REG CN305 OPE3 - 6

CN1b REG CN307 BATT_TERM - 6

CN4a REG CN301 ANALOG CN206 10

CN4b REG CN302 ANALOG CN207 27

CN4c REG CN306 LCD SUB CN7802 30

CN4d REG CN309 CF CN9904 20

CN4e REG CN303 ANALOG CN208 30

CN4f REG CN310 CF SW - 2

CN4g REG CN304 OPE2 - 12

CN4h REG CN308 CDS, DIGITAL CN5103,103 11

CN5a CF CN9901 CF SUB CN9801 27

CN5b CF CN9902 CF SUB CN9802 27

NOTE2a:

When removing the COVER(FR.)ASSEMBLY, remove the
SCREW (No.8) first for the smooth removal of other parts.

NOTE2b:

When removing, be careful not to lose the part (SHAFT).

NOTE4a:

During the procedure, be careful not to damage the CON­NECTOR or cut/break the WIRE.

NOTE4b:

When removing, be careful in handling the SPACER.

NOTE4c:

Be careful with the wiring and the affixing the SPACER.

NOTE4d:

When attaching, be sure to place the FPC WIRE inside.

NOTE4e:

When attaching, lift the part (ARM) upward.

NOTE4f:

During the procedure, be careful not to deform the part
(ARM) or damage other parts.

NOTE5a:

Peel off the SPACER before removing the WIRE (GREEN)
of CN5b.

NOTE5b:

Be careful with the positions of the SCREWS that are to be
removed.

NOTE5c:

During the procedure, be careful with the grease.

CONNECTOR

PIN
NO.

1-22 (No.YF061)

3

(S1b)

1

(S1a)

BATTERY/
CFCARD COVER

2

(S1a)

ARM(COVER)
ASSY

NOTE1a

STAY(COVER)
ASSY

0.059N࡮m (0.6kgf࡮cm)

Fig.FA1

JIG CONNECTOR

[1]

4

(S1b)

[1]

E

NOTE1c

BOTTOM VIEW

9

(S1c)

D

WIRE(BATT)

10

CN1a

E

D

10

(S1c)

TRIPOD

Fig.FA3

L1a

L1b

CN1b

NOTE1c

SPACER

NOTE1b

0.039N࡮m (0.4kgf࡮cm)

[1]

(S2a)

13

12

(S3c)

11

(S3a)

(S3b)

14

(S3c)

15

(S3c)

[3]

8
7

BOTTOM VIEW

A

5

C

B

8

(S2b)

6

(S2b)

A

C

B

[2]

NOTE2a

NOTE2b

0.039N࡮m (0.4kgf࡮cm)

Fig.FA2

7

(S2c)

0.078N࡮m (0.8kgf࡮cm)

Fig.FA4

(No.YF061)1-23

CN4b

DRAWING FOR
SPACER ATTACHING

SPACER

16

(S4)

CN4g

CN4h

CN4f

CN4c

17

(S4)

CN4h

(CN308)

CN4c

(CN306)

CN4b

(CN302)

CN4a

(CN301)

g

h

c

CN4e

CN4d

CN4a

FOIL SIDE(B)

gg

hh

ee

ff

e

d

cc

L4

CN4b

CN4b

d

b

bb

a

COMPONENT SIDE(A)

a

[4]

NOTE4a

CN4f

(CN310)

CN4g

(CN304)

CN4e

(CN303)

CN4d

(CN309)

Fig.FA5-1 Fig.FA5-2

WIRE
(BLACK)

WIRE
(BLUE)

REG PWB

WIRE
(BLUE)

CONECTOR
(CN301)

NOTE4b,c

DRAWING FOR WIRE ARRANGEMENT

REG BOARD ASSY

L4

d

e

DIGITAL BOARD ASSY
(11Pin WIRE)

YELLOW WIRE

30Pin WIRE is
between CF ASSY BKT
and GRIP BASE

CF BOARD ASSY
(20Pin WIRE)

SW BOARD
ASSY WIRE

REAR UNIT FPC

CF SUB

ANALOG BOARD ASSY(30Pin WIRE)

CF SUB PW(27Pin RED WIRE)

CF SUB BOARD ASSY

e

(27Pin GREEN WIRE)

d

NOTE4d

MONITOR BOARD ASSY
(30Pin WIRE)

ANALOG BOARD ASSY
(10Pin WIRE)

1Pin RED WIRE

ANALOG BOARD ASSY
(27Pin BLUE WIRE)

1-24 (No.YF061)

Fig.FA5-3

NOTE5b

[5]

L5a

19

20

NOTE5c

20

(S5b)

L5b

19

(S5a)

DRAWING FOR WIRE ARRANGEMENT
<NOTE6>

TO CF SUB

TO DIGITAL
(11Pin WIRE)

YELLOW

(27Pin GREEN WIRE)

TO CF SUB

(27Pin RED WIRE)

18

(S5a)

CN5a

RED WIRE
(INSIDE)

21

(S6)

22

(S6)

SPACER

CN5b

GREEN WIRE
(OUTSIDE)

23

(S6)

NOTE5d

Fig.FA6

[6]

SPACER

NOTE5a

RED WIRE
GREEN WIRE

RED

TO MONITOR
(30Pin WIRE)

TO ANALOG
(10Pin WIRE)

Fig.FA7-2

NOTE7

CAMERA ASSY

TO ANALOG
(27Pin BLUE WIRE)

24

(S7)

25

(S7)

26

(S7)

27

(S7)

<NOTE6>

TO DIGITAL
(11Pin WIRE)

TO MONITOR
(30Pin WIRE)

[6]

Fig.FA7-1

TO CF SUB
(27Pin GREEN WIRE)

TO CF SUB

(27Pin RED WIRE)

TO ANALOG
(27Pin
BLUE WIRE)

TO ANALOG
(10Pin WIRE)

[7]

Fig.FA8

(No.YF061)1-25

3.2.3 ASSEMBLY of [1]GRIP LOWER ASSEMBLY

zDisassembly procedure

STEP

PART NAME

No.

[1]

TRIPOD

[2]

BATT CASE ASSY

Fig.

No.

2(S1)

GL1

SPACER1, 4(S3),SPACER2

GL2

POINT NOTE

NOTE2a:

When attaching, be careful with the position of the FPC.

NOTE2b:

When removing, peel off the SPACER1, and remove the two
SCREWS (No.3, 4).

NOTE2c:

During the procedure, be careful in handling the WIRE.

-

NOTE2a,b,c

GRIP LOWER ASSY

[1]

b

b

a

a

1

(S1)

2

(S1)

NOTE2a

FPC

SPACER1

Fig.GL1

3

(S2)

NOTE2b

SPACER1

4

(S2)

5

(S2)

6

(S2)

[2]

1-26 (No.YF061)

NOTE2c

SPACER2

Fig.GL2

3.2.4 ASSEMBLY of [7]MONITOR ASSEMBLY

zDisassembly procedure

STEP

PART NAME

No.

[1]

GRIP BASE

[2]

COVER(MONI) ASSY

[3]

LCD MODULE &
LCD SUB BOARD ASSY

Fig.
No.

SPACER,3(S1)

MO1

SPACER, 2(S2)

MO2

2(S3a)

MO3-1

SPACER, S3a,3(S3b)

MO3-2

CN3,SD3a,SD3b

MO3-3

POINT NOTE

NOTE1a:

During the procedure, be careful not to damage the parts.

NOTE1b:

When removing, be careful not to cut or break the wire.

NOTE2:

Be careful in handling the SPACER.

NOTE3a:

When attaching, be careful with the FPC wiring.

NOTE3b:

When removing, peel off the SPACER and lift the FPC to
make space.

NOTE3c:

Remove the LCD MODULE with the LCD SUB BOARD as
they are soldered together.

NOTE3d:

Refer to the Fig. MO3-4 for the wiring and the SPACER affix
position.

NOTE3e:

Refer to the Fig. MO3-3 for attaching the LCD MODULE and
LCD SUB BOARD ASSEMBLY.

NOTE1a,b

NOTE2

NOTE3a
NOTE3b,c
NOTE3d,e

STAY(COVER)ASSY

NOTE1a

ARM(COVER)ASSY

SPACER

[1]

Fig.MO1

SPACER

CF SW
BOARD ASSY

WIRE

NOTE1b

WIRE

3

(S1)

1

(S1)

2

(S1)

zDestination of connectors

CN.NO.

CONNECTOR

PIN
NO.

CN3 LCD SUB CN7801 LCD MODULE - 24

4

(S2)

[2]

SPACER

NOTE2

5

(S2)

Fig.MO2

(No.YF061)1-27

6

(S3a)

7

(S3a)

LCD SUB PWB

FPC

BRACKET(LCD)

[3]

NOTE3a

NOTE3e

<LCD MODULE>

CN3

LCD SUB BOARD ASSY

WIRE

(PINK)

WIRE

(WHITE)

[3]

NOTE3c

9

(S3b)

Fig.MO3-1

10

(S3b)

11

(S3b)

BRACKET

(LCD)

B.LIGHT(+)

WIRE

(PINK)

SD3a SD3b

NOTE3e

WIRE

B.LIGHT(-)

WIRE

(WHITE)

Fig.MO3-3

SPACER

NOTE3b,d

FPC

1-28 (No.YF061)

Fig.MO3-2

SPACER

REAR UNIT

8

(S3a)

Fig.MO3-4

3.2.5 ASSEMBLY of [8]CAMERA ASSEMBLY

zDisassembly procedure

STEP

PART NAME

No.

[1]

ROTARY UNIT

[2]

JOINT CASE ASSY

[3]

RING

[4]

POWER UNIT

[5]

LOWER CASE (OP) ASSY

[6]

UPPER CASE (OP) ASSY

[7]

DIGITAL BOARD ASSY

[8]

ANALOG BOARD ASSY

[9]

CF SUB BOARD ASSY

Fig.
No.

3(S1)

C1

3(S2)

­CN4,S4a,S4b,2(L4)

C2

3(S5),L5

C3

CN6a,3(S6),CN6b,c

C4

SPACER, CN7a,b,S7,CN7c,d

C5

SPACER,3(S8),CN8

C6

2(S9)

OPF1

POINT NOTE

NOTE1:

When removing, be careful not to damage the CONNEC­TOR or cut/break the WIRE.
When taking out the WIRES, follow the order in the Figure.
When attaching, pay attention in the position of each WIRE.

NOTE2:

When removing, be careful not to damage the CONNEC­TOR or cut/break the WIRE.

NOTE4a:

When removing, be careful as the COVER (USB) ASSEM­BLY comes off together.

NOTE4b:

When attaching, be sure to place the FPC WIRE between
the CF SUB BOARD ASSEMBLY and the CABINET
PARTS.

NOTE5a:

Remove the SD Card prior to other removing procedure.

NOTE5b:

When attaching, open the SD COVER, and place the
PLATE into the space between the FPC and the OP
FRAME.

NOTE6a:

Remove the SCREW that tightens the PT. UNIT.

NOTE6b:

When removing, be careful not to cut or break the WIRE.

NOTE6c:

Be careful with the electric shock caused by the CAPACI­TOR for STROBE.

NOTE6d:

When attaching, be careful with the positions of the PT.
UNIT and the CABINET hole.

NOTE7a:

When removing, peel off the SPACER first, then take out the
CONNECTOR.

NOTE7b:

When removing, take out the WIRE while peeling off the
SPACER.

NOTE7c:

When attaching, be careful with the wiring.

NOTE7d:

When attaching, firmly insert the FPC WIRE of CN7d, and
place the loosened part in the space between the OP
FRAME ASSEMBLY and the DIGITAL BOARD ASSEM­BLY.

N

OTE1

NOTE2

­NOTE4a,b
NOTE5a,b

NOTE6a,b,c,d
NOTE7a,b,c,d

NOTE8a,b,c
NOTE9a,b

NOTE8a:

When removing, be careful not to damage the CONNEC­TOR or cut/break the WIRE.

NOTE8b:

When attaching, refer to the NOTE7b for the handling of the
SPACER, and hold the WIRES with the SPACER.

NOTE8c:

When attaching, place the loosened FPC in the space be­tween ANALOG BOARD ASSEMBLY and OP BLOCK AS­SEMBLY.

NOTE9a:

When removing, take out the WIRES prior to other proce­dure.

NOTE9b:

When attaching, be careful with the wiring.

zDestination of connectors

CN.NO.

CONNECTOR

PIN
NO.

CN4 ANALOG CN209 OPE1 - 11

CN6a ANALOG CN205 STROBE UNIT - 10

CN6b ANALOG CN201 MIC - 4

CN6c ANALOG CN202 SPEAKER - 2

CN7a CF SUB CN9803 DIGITAL CN104 51

CN7b CDS CN5103 REG CN308 4/11

CN7c ANALOG CN203 DIGITAL CN102 110

CN7d DIGITAL CN101 CDS CN5102 51

CN8 ANALOG CN204 OP BLOCK - 33

(No.YF061)1-29

6

(S2)

1

(S1)

2

(S1)

3

(S1)

<NOTE1>

2

NOTE2

[2]

5

(S2)

[1]

NOTE1

CLOSE

LOOSEN

4

(S2)

0.098N࡮m (1.0kgf࡮cm)

4(GREEN)

5(RED)

[3]

(S5)

10

(S5)

SD COVER

NOTE5a

PLATE

9

[5]

11

(S5)

L5

0.098N࡮m (1.0kgf࡮cm)

<NOTE5b>

OP BLOCK
ASSY

OP FRAME

CDS
BOARD
ASSY

YELLOW

RED

1

NOTE4b

CN4

7

(S4a)

Fig.C1

3

[4]

6(BLUE)

L4

8

(S4b)

COVER(USB)
ASSY

NOTE4a

BOTTOM VIEW

NOTE6b

NOTE6c

NOTE6a

PT.UNIT

CN6c

CN6a

Fig.C3

c

NOTE6d

14

(S6)

CN6b

b

c

FPC

DIGITAL PWB

SIDE VIEW

b

a

12

(S6)

PLATE

[6]

1-30 (No.YF061)

0.098N࡮m (1.0kgf࡮cm)

Fig.C2

13

(S6)

0.098N࡮m (1.0kgf࡮cm)

Fig.C4

CN7b

NOTE7a

b

d

CN7a

a

a

CF SUB
BOARD
ASSY

CN7c

FPC

CN7d

[7]

NOTE7b

FPC

FPC

NOTE7d

SPACER

SIDE VIEW

<WIRING>

d

b

NOTE7c

CONVEX
PART

15

(S7)

NOTE7b

SPACER

0.098N࡮m(1.0kgf࡮cm)

Fig.C5

[10]

NOTE8a

[8]

16

(S8)

17

(S8)

CN8

NOTE8b

18

(S8)

SPACER

NOTE8c

L9a

L9b

NOTE9b

[9]

0.098N࡮m(1.0kgf࡮cm)

Fig.C6 Fig.OPF1

0.098N࡮m(1.0kgf࡮cm)

NOTE9a,b

WIRE

19

(S9)

SPACER

20

(S9)

(No.YF061)1-31

3.2.6 ASSEMBLY of [6]UPPER CASE(OP) ASSEMBLY

zDisassembly procedure

STEP

PART NAME

No.

[1]

STROBE UNIT

[2]

SPEAKER

[3]

MIC

NOTE1a:

Be careful with an electric shock.

NOTE1b:

When attaching, be sure to place the STROBE UNIT within
the UPPER CASE.

NOTE1c:

Replace the entire STROBE UNIT as it is not a subject of
service.
Do not touch or turn the ADJUSTING VOLUME on the
STROBE BOARD.

NOTE1d:

Be careful in wiring.

NOTE2:

Be careful in wiring.

NOTE3a:

Do not disassemble the MIC ASSEMBLY if it is not neces­sary, as MIC ASSEMBLY is not designed to be assembled/
disassembled easily.
Pay special attention in handling the COVER (MIC).

NOTE3b:

Be careful in wiring.

Fig.
No.

2(S1a),S1b

U1

S2, PLATE(SPK),L2
SPACER, S3,COVER(MIC)

POINT NOTE

NOTE1a,b,c,d

NOTE3a,b

NOTE2

<NOTE1d, NOTE2, NOTE3b>

DRAWING FOR SPACER ATTACHING
& WIRE ARRANGEMENT

SPACER

SPACER

SPACER

20r5mm

Fig.U2

SPACER

2 㨪7mm

5 㨪10m

WIRE

NOTE3a

[3]

COVER(MIC)

NOTE3b

[1]

NOTE1c

NOTE1b

SPACER

1

(S1a)

2

(S1a)

(S3)

3

(S1b)

5

UPPER CASE(OP)

Fig.U1

NOTE1a

NOTE1d

SPACER

4

(S2)

PLATE(SPK)

NOTE2

[2]

L2

L2b

0.098N࡮m(1.0kgf࡮cm)

1-32 (No.YF061)

3.2.7 DISASSEMBLY of [10] OP BLOCK ASSY/CCD BOARD ASSY

zCAUTIONS

(1) Since the OP BLOCK on this model is more complicated

in structure than previous OP BLOCKS, pay extra
attention to external shocks and vibrations.

(2) During the procedure, be careful in handling the CCD

IMAGE SENSOR, OP LPF and the LENS etc. Pay extra
attention to the soil, dust and scratch on the surface.
If fingerprints are left on the screen, wipe them with clean
chamois leather or a cleaning cloth.

(3) CCD IMAGE SENSORS may sometimes be shipped

from the factory with the protection seal applied on the
transparent glass. After the replacement, do not remove
the protection seal until right before assembling the CCD
IMAGE SENSOR to the OP BLOCK ASSEMBLY.

zDisassembly procedure of OP BLOCK ASSEMBLY/CCD

BOARD ASSEMBLY

(1) Remove the HOOD and the BRACKET (OP)

ASSEMBLY first, before disassembling the OP BLOCK
ASSEMBLY.

(2) Remove the two screws (1 and 2), HOOD, and the two

screws (3 and 4), and then remove the BRACKET (OP)
ASSEMBLY.

NOTE10a:

When assembling, check that the OP BLOCK
ASSEMBLY is firmly placed on the right position.

(3) Remove the SCREW (5), and remove the CDS BOARD

ASSEMBLY by removing the CONNECTOR (CN10).
(4) Remove the SPACER RUBBER.
(5) Take out the OP LPF.

NOTE10b:

When replacing the CCD IMAGE SENSOR, unsolder
the sixteen soldered parts (SD10a), and remove the
CCD BASE ASSEMBLY from the CCD BOARD
ASSEMBLY.
Replace the CCD IMAGE SENSOR as a CCD BASE
ASSEMBLY, not as a single part replacement.

NOTE10c:

When attaching the OP LOPF, be careful to attach in
the correct direction.

zReplacing service repair parts

The service repair parts of the OP BLOCK ASSEMBLY are as
follows.
When replacing the parts, pay special attention not to break
the FPC, or not to damage the parts by soldering (overheat).

(1) FOCUS MOTOR
(2) ZOOM MOTOR
(3) IRIS MOTOR UNIT

NOTE10d:

When replacing the FOCUS MOTOR or the ZOOM
MOTOR, space the FPC approximately 1 mm above
from the jack and then solder it (SD10b).

NOTE10e:

When assembling, make sure to interlock the slide
part of the OP BLOCK properly to the axis of the
ZOOM MOTOR.

NOTE10f:

When removing the IRIS MOTOR UNIT, fully pull the
slide part which is interlocked to the axis of the
FOCUS MOTOR to the CCD side.

NOTE10g:

IRIS MOTOR UNIT includes the FPC ASSEMBLY and
the SENSOR x 2.

[10]

NOTE10a

HOOD ASSY

1

(S10a)

OP FRAME
ASSY

L10a

(S10b)

2

(S10b)

Fig.3-2-7-1

3

4

(S10b)

0.147N࡮m (1.5kgf࡮cm)

(No.YF061)1-33

L10b

NOTE10b

CCD BASE

NOTE10c

OP

side

Blue

CCD

side

OP LPF

CCD BASE
ASSY

CCD BOARD
ASSY

SPACER
RUBBER

Fig.3-2-7-2

SD10a

CCD

6

(S10b)

7

(S10b)

CN10a

CDS BOARD
ASSY

5

(S10a)

0.078N࡮m (0.8kgf࡮cm)

11

(S10c)

10

(S10c)

ZOOM MOTOR

NOTE10d,e

(S10d)

SENSOR

OP BLOCK

(S10e)

12

Fig.3-2-7-3

14

13

(S10d)

SD10b

IRIS MOTOR UNIT

NOTE10f,g

FOCUS MOTOR

NOTE10d,e

9

(S10c)

8

(S10c)

: 0.078N࡮m (0.8kgf࡮cm)
: 0.088N࡮m (0.9kgf࡮cm)

1-34 (No.YF061)

SECTION 4

ADJUSTMENT

4.1 PREPARATION

4.1.1 Precaution

Camera system and deck system of this model are specially
adjusted by using PC.
However, if parts such as the following are replaced, an
adjustment is required. The adjustment must be performed in a
Service Center equipped with the concerned facilities.

• OP BLOCK ASSEMBLY

• MONITOR ASSEMBLY

• EEP ROM (IC4502 of DIGITAL board)

In the event of malfunction with electrical circuits, first find a
defective portion with the aid of proper test instruments as shown
in the following electrical adjustment procedure, and then
commence necessary repair/ replacement/adjustment.

• In observing chip TP, use IC clips, etc. to avoid any stress.
Prior to replacement of chip parts (especially IC), remove the
solder completely to prevent peeling of the pattern.

• Use a patch cord if necessary. As for a patch cord, see the
BOARD INTERCONNECTIONS.

• Since connectors are fragile, carefully handle them in
disconnecting and connecting the FPC.

4.1.2 REQUIRED TEST EQUIPMENT

• Personal computer (for Windows)

• Color TV monitor

• Oscilloscope (dual-trace type, observable 100MHz or higher
frequency). The one observable 300 MHz or higher frequency
is recommended.

• Digital voltmeter

• DC power supply or AC adapter

• Frequency counter (with threshold level adjuster)

4.1.3 TOOLS REQUIRED FOR ADJUSTMENT

Torque Driver

YTU94088

Chip IC Replacement Jig

PTS40844-2

INF Adjustment Lens Holder

YTU94087

Gray Scale Chart

YTU94133A

PC Cable

QAM0099-005

Bit

YTU94088-003

Cleaning Cloth

KSMM-01

Camera Stand

YTU93079

Color Bar Chart

YTU94133C

Communication Cable

YTU93107A

INF Adjustment Lens

YTU92001B

Light box Assembly

YTU93096A

QAL0665-001

Service Support System

YTU94057-84

Tweezers

P-895

HDD

Jig Connector Cable

YTU93106A

Extension Connector

YTU94145B-30

• Torque driver

Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.

• Bit

This bit is slightly longer than those set in conventional torque
drivers.

• Tweezers

To be used for removing and installing parts and wires.

• Chip IC replacement jig

To be used for adjustment of the camera system.

• Cleaning cloth

Recommended the Cleaning cloth to wipe down the video
heads, mechanism (tape transport system), optical lens sur­face.

(No.YF061)1-35

• INF adjustment lens

To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.

• INF adjustment lens holder

To be used together with the Camera stand for operating the
Videocamera in the stripped-down condition such as the sta­tus without the exterior parts or for using commodities that are
not yet conformable to the interchangeable ring. For the usage
of the INF lens holder, refer to the Service Bulletin No. YA-SB-

10035.

• Camera stand

To be used together with the INF adjustment lens holder. For
the usage of the Camera stand, refer to the Service Bulletin
No. YA-SB-10035.

• Light box assembly

To be used for adjustment of the camera system. For the
usage of the Light box assembly, refer to the Service Bulletin
No. YA-SB-10035.

• Gray scale chart

To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.

4.2 JIG CONNECTOR CABLE CONNECTION

 Connection procedure

NOTE

Be sure to turn the power "OFF", when connecting the JIG
CONNECTOR CABLE.
If the JIG CONNECTOR CABLE is connected with the pow­er "ON", communication error may occur.

JIG CONNECTOR

EXTENSION
CONNECTOR

JIG CONNECTOR
CABLE

COMMUNICATION CABLE

TO GND

RED

WHITE

BLACK

TO NU_RX

TO NU_TX

COMMUNICATION CABLEJIG CONNECTOR OSCILLOSCOPEJIG CONNECTOR

COVER(JIG)

SCREW

RS232C
COM PORT

PC CABLE

FOR
COMMUNICATION CABLE

TO ENV_OUT

TO HID1

SERVICE SUPPORT SYSTEM

MENU

PERSONAL COMPUTER

• Color bar chart

To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.

• HDD(1-inch hard disk)

To use for operation check.

• PC cable

To be used to connect the Videocamera and a personal computer
with each other when a personal computer issued for adjustment.

• Communication cable

Connect the Communication cable between the PC cable and
Jig connector cable when performing a PC adjustment.

• Service support system

To be used for adjustment with a personal computer. Software
can be downloaded also from JS-net.

• Jig connector cable

Connected to JIG CONNECTOR of the main board and used
for electrical adjustment, etc.

• Extension connector

Connect this extension connector to the connector of the Jig
connector cable for extending the cable connector.

 Jig connector diagrams

JIG CONNECTOR CABLE (YTU93106A)

DIGITAL CN105

ARMTDO

ARMTCK

ARMTMS

ARMTDI

nARMTRST

nJRESET

REG_3.1V

NU_RX
NU_TX

AL_3.3V
SJIG_TX
SJIG_RX

MOD0

SJIG_RST

VPP
GND

MON_B

VCOM

MON_R

GND

MON_G

MON_RPD

NC
NC
NC
NC
NC
NC
NC
NC

1

16

2

17

3

18

4

19

5

20

6

21

7

22

8

23

9

24

10

25

11

26

12

27

13

28

14

29

15

30

Fig.4-2-2

JIG CONN. BOARD

(PIN NO.)

ARMTDO

1

ARMTMS

2

nARMTRST

3

REG_3.1V

4

NU_TX

5

SJIG_TX

6

MOD0

7

VPP

8

MON_B

9

MON_R

10

MON_G

11

NC

12

NC

13

NC

14

NC

15

ARMTCK

16

ARMTDI

17

nJRESET

18

NU_RX

19

AL_3.3V

20

SJIG_RX

21

SJIG_RST

22

GND

23

VCOM

24

GND

25

MON_RPD

26

NC

27

NC

28

NC

29

NC

30

1-36 (No.YF061)

Fig.4-2-1

5.1 SERVICE NOTE

[6] [7]

[4] [5]

26 27

25

FA5-1 FA6 FA8FA7-1

SECTION 5

TROUBLE SHOOTING

b

e

15 16 17 18 19 20

b

1 2 3 4 5 6 7 8 9 10 11

a

MO2 MO3-2MO3-1MO1

7 8 9 1011121314

GL2GL1

c

[1] [2] [3] [4] [5] [6] [7] [8] [9]

123456-

CAMERA ASSY

[3]

[1]

[1] [2] [3][2]

[7]MONITOR ASSY

[2]

FA2 FA3 FA4FA1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

fgagaba a

[1]

123456

[1]GRIP LOWER ASSY

[1]

CABINET PARTS AND ELECTRICAL PARTS

-

8 9 10 11 12 13 14

[10]

b

c

d

C2 C3 C4C1 C5 C6 OPF1

3-2-4-1 3-2-4-2 3-2-4-3

aa

1234567

[10]OP BLOCK ASSY &CCD ASSY

c

U2

[1] [2] [3]

12345

[6]UPPER CASE(OP) ASSY

Symbol No.

Place to stick screw

Screw tightening torque

Removing order of screw

Reference drawing (Fig.No.)

Symbol No.

Place to stick screw

Screw tightening torque

Removing order of screw

Reference drawing (Fig.No.)

Symbol No.

Place to stick screw

Screw tightening torque

Removing order of screw

Reference drawing (Fig.No.)

Symbol No.

Place to stick screw

Screw tightening torque

Removing order of screw

Reference drawing (Fig.No.)

and tighten the screw manually.

࡮The specified torque value is a recommended value of the initial assembly. Therefore, set the value below the specified torque value in the assembling procedure.

Be careful not to break either the screws or the screw holes.

NOTE:

㧝㧖 (This mark shows where to attach the screws) : Do not reuse the screws because the screw lock bond was applied to prevent the screws from loosening.

Prepare the specified screws and use them in place of the removed screws.

㧞Tightening torque for the screws

࡮There are setting limits of the torque value for the torque driver. If the value exceeds the setting value, take it as a rough measurement (reference value),

ޓa㧦 0.118N㨯m (1.2kgf㨯cm)ޓޓb㧦 0.078N㨯m (0.8kgf㨯cm) ޓޓc㧦 0.098N㨯m (1.0kgf㨯cm)ޓޓd㧦 0.147N㨯m (1.5kgf㨯cm)ޓޓe㧦 0.088N㨯m (0.9kgf㨯cm)

ޓf 㧦 0.059N㨯m (0.6kgf㨯cm)ޓޓg㧦 0.039N㨯m (0.4kgf㨯cm) ޓޓ

(No.YF061)1-37

Victor Company of Japan, Limited
AV & MULTIMEDIA COMPANY CAMCORDER CATEGORY 12, 3-chome, Moriya-cho, kanagawa-ku, Yokohama, kanagawa-prefecture, 221-8528, Japan

(No.YF061)

Printed in Japan

VPT