JETWAY NF591 Technical Manual
Technical Manu al
Of
Intel Braswell Series CPU
Based Mini-ITX M/B
NO.G03-NF591-F
Revision: 2.0
Release date: Octob er 1, 2019
Trademark:
* Specifications and Information contained in t his docu ment ation ar e furnish ed for i nfo r mation u se only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Prote cti on Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protect ion of mother earth, please recyc l e.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION ........................................................................... iv
USER’S NOTICE ....................................................................................................................... v
MANUAL REVISION INFORMATION ....................................................................................... v
ITEM CHECKLIST ..................................................................................................................... v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................ 1
1-2 SPECIFICATION ......................................................................................................... 2
1-3 LAYOUT DIAGRAM .................................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING ..................................................................................................... 8
2-2 CONNECTORS AND HEADERS ................................................................................ 15
2-2-1 CONNECTORS ............................................................................................. 15
2-2-2 HEADERS ..................................................................................................... 18
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP ..................................................................................................... 26
3-2 BIOS MENU SCREEN ................................................................................................ 27
3-3 FUNCTION KEYS ....................................................................................................... 27
3-4 GETTING HELP .......................................................................................................... 28
3-5 MEMU BARS ............................................................................................................... 28
3-6 MAIN MENU ................................................................................................................ 29
3-7 ADVANCED MENU ..................................................................................................... 30
3-8 CHIPSET MENU .......................................................................................................... 40
3-9 SECURITY MENU ....................................................................................................... 43
3-10 BOOT MENU ............................................................................................................... 44
3-11 SAVE & EXIT MENU ................................................................................................... 45
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is th e suitabl e tem perat ure. (The fig ure c omes from the r eques t
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor a s computer instabi lity resulted fr om corrosio n and oxi dation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPROD UCED, TR ANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION RE QU IRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition October 1, 2019
Item Checklist
Motherboard
Cable(s)
v
1
Chapter 1
Introduction of the Motherboard
1-1 Fea ture of Motherboard
Onboard Intel® Braswell series SoC Processor, with low power consumption
never denies high performance
Support 2* DDR3L 1600 MHz SO-DIMM, up to 8GB
Onboard 2 * RJ-45 gigabit Ether net LAN port
Support 2 * SATAIII device
Support USB 3.0 data transport demand
Support DVI-D, VGA & LVDS multi-display
Onboard 1* full-size Mini-PCIE slot
Onboard 1* M.2 slot (M key-2242/2260/2280 SATA interface for SSD device)
1* SIM card slot
Support CPU Over-Temperature protection
Support CPU Over-Current/Under Voltage prot ecti o n
Support DRAM Over-Current/Under Voltage protection
Amplifier implement to support 3W Speaker
Support Smart FAN
Compliance with ErP standard
Support Watchdog function
2
Spec
Description
Design
6 layers; PCB size: 17x 17 cm
Intel® Braswell *SoC CPU
dealer for more information of onboard CPU.
2 * DDR3L SODIMM Slot for un-buffered *DDR3L 1600 MHz
Dual-channel functio n supp or t ed
1* Full-size Mini-PCIE slot
1* PCIE x1 slot
Integrated with 2* Realtek RTL8111G PCI-E Gigabi t LAN chip
10/100/1000Mbps Ethernet data transfer rate
2* SATAI II port (SATA1/2)
1*M.2 M-key 2242/2260/2280 slot (*share with SATA2 port)
AMI 64MB Flash ROM
1* 12V DC-in system power Jack
2* RJ-45 LAN port
1* 2-Pin Internal 12V DC-in power connector
2* LAN LED activity header
1-2 Specification
Embedded CPU
Memory Slot
*CPU model varies from different IPC options. Please consult your
SDRAM, expandable to 8GB
Expansion Slot
Support Fast Ethernet LAN func ti on of prov i ding
LAN Chip
Storage
BIOS
4* USB 3.0 port
1* DVI-D port
Rear I/O
1* RS232/422/485 serial port (COM1)
1* SATA Power-out connector
1* CPUFAN header
2* SYSFAN header
Internal I/O
1* Front panel audio header
1* SPEAK_CON header
3
1* 4-pin USB 2.0 header (Expansible to 1* USB 2.0 port)
1* Front panel VGA header
USB 3.0 Ports
RJ-45 LAN Ports
USB 3.0 Ports
DVI-D Port
COM1
Serial Port
DC-in 12V
1* 9-pin USB 2.0 header (Expansible to 2* USB 2.0 ports)
1* Front panel header
1* Power LED & speaker header
1* PS/2 keyboard & mouse header
1* SMBUS header
1* GPIO_CON header
5* RS232 serial port header(COM2/3/4/5/6)
1* LVDS header
1* LVDS inverter header
* Note: 1. Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher USB
speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within platforms.
However, legacy operating systems (OS) may not natively recognize XHCI controllers. You might need to
pre-install XHCI driver while desiring to install a non-xHCI OS (ex.Windows* 7) on Intel platforms which do not
include EHCI controllers. Please contact your representative for more details. 2. Braswell SOC will support
memory speed at 1600 MHz and 1066 MHz only. If 1333 MHz DIMM is installed, it will run at 1066 MHz. It is not
validated while installing 1066MHz DIMM with this SOC.
1-3 Layout Diagram
Rear IO Panel Diagram:
Power
Connector
Warning!
The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V
(ATX2P) power connector. User can only connect one type of compatible power supp l y to one
of them to power the system.
4
12V DC -in
Power Conne c t or
DVI-D Port
COM1
Serial Port
RJ-45 LAN Ports
USB 3.0 Ports
USB 3.0 Ports
PCI Express x1 Slot
Intel CPU
SYSFAN1 Header
*DDR3L SODIMM Slot
(SODIMM1)
Internal 12V DC-in
Power connector
SMBUS Header
*DDR3L SODIMM Slot
(SODIMM2)
CPUFAN Header
SYSFAN2 Header
VGA Port
Header
PS2KBMS Header
Speaker Header
Front Panel
Audio Header
GPIO Header
SATAIII Ports
(SATA1/2)
M Key-2242/2260/2280
Full-size
*SIM Card Slot
Serial Port Headers
(COM5/6)
USB 2.0 Headers
Serial Port Headers
LVDS Inverter
LVDS Header
SATA Hard Disk
Front Panel
Header
LANLED Headers
Power LED Header &
Motherboard Internal Diagram
Connector (*M2)
Mini-PCIE
Slot (MPE)
Power-Out Connector
(COM2/3/4)
Speaker Header
Note: 1. SODIMM1 must be used for single DIMM use case; the module should be 1.35V DDRIII
SODIMM and not exceeding 8GB total capacity. 2. M2 slot shares function with SATA2 port; i.e. only
one can function at a ti me; M2 slot functions as M K ey interface and can only support SATA SSD
device, not PCI-E NAND device.
5
JP1
JBAT
JP6
JP7
JP8
JP9
JP5
COPEN
AT_MODE
RTC_RST
JP3
JP4
Jumper Position:
6
Jumper
Name
Description
JP1
COM1 Port Pin9 Function Select
4-Pin Block
JP3
COM2 Header Pin9 Function Sel ec t
4-Pin Block
JP6
COM3 Header Pin9 Function Sel ec t
4-Pin Block
JP7
COM4 Header Pin9 Functi on Sel ect
4-Pin Block
JP8
COM5 Header Pin9 Function Select
4-Pin Block
JP9
COM6 Header Pin9 Function Sel ec t
4-Pin Block
JP5
LVDS Panel VCC 3.3V /5V/12V Select
4-Pin Block
JP4
INVERTER Back Light 5V/12V Select
3-Pin Block
COPEN
Case Open Message Display Function
2-Pin Block
AT_MODE
ATX Mode / AT Mode Select
2-Pin Block
RTC_RST
Reset all RTC register bits
2-Pin Block
JBAT
Pin (1&2): Flash Descriptor Security Override
Pin (5&6): ODD Present Setting
6-Pin Block
Connector
Name
DCIN
DC 12V System Power–in Connector
ATX2P
Internal DC 12V System Power–in Connector
USB30/USB31
USB 3.0 Port Connector X2
DVI
DVI-D Port Connector
COM1
Serial Port Connector
LAN1/LAN2
RJ-45 LAN Port Connector X2
SATA1/2
SATAIII Port Connector X2
SATAPW
SATA Power out Connector
CPUFAN
CPUFAN Connector
SYSFAN1/SYSFAN2
SYSFAN Connector X2
Jumper
Pin (3&4): Clear CMOS RAM Function Setting
Connectors
7
Header
Name
Description
FP_AUDIO
Front Panel Audio Header
9-pin Block
SPEAK_CON
Speaker Header
4-pin Block
LAN1_LED/LAN2LED
LAN Activity LED Header
2-pin Block
FP_USB21
USB 2.0 Header
4-pin Block
FP_USB20
USB 2.0 Header
9-pin Block
JW_FP
Front Panel Header(PWR LED/
9-pin Block
SPK-LED
Power LED & Speaker Header
7-pin Block
PS2KBMS
PS/2 Keyboard & Mouse Header
6-pin Block
SMBUS
SMBUS Header
5-pin Block
GPIO_CON
GPIO Header
10-pin Block
COM2/3/4/5/6
Serial Port Header X5
9-pin Block
LVDS
LVDS Header
30-pin Block
INVERTER
LVDS Inverter
8-pin Block
FP_VGA
Front Panel VGA Header
15-pin Block
Headers
HDD LED/Power Button /Reset)
8
JP
1→COM1 Port Pin-9
6 4 2
3
1
5
2-4 Closed:
RI=RS232(Default);
3-4 Closed:
RI= 5V;
4-6 Closed:
RI= 12V.
1 3 5
2
4
6
1
3
5
2
4
6
JP3→COM2 Header Pin-9
4-6 Closed:
RI= +12V.
1
3
5
3-4 Closed:
RI= +5V;
2-4 Closed:
RI=RS232;
4
6
2
6
5
3
1
4
2
5
3
1
6
4
2
Chapter 2
Hardware Installation
2-1 Jumper Setting
JP1 (4-pin): COM1 Port Pin9 Function Select
JP3 (4-pin): COM2 Header Pin9 Function Select
9
JP6→COM3 Header Pin-9
4-6 Closed:
RI= +12V.
1
3
5
3-
4 Closed:
RI= +5V;
2-4 Closed:
RI=RS232;
4
6
2
6
5
3
1
4
2
5
3
1
6
4
2
JP7→COM4 Header Pin-9
4-6 C
losed:
RI= +12V.
1
3
5
3-4 Closed
:
RI= +5V;
2-4 Closed:
RI=RS232;
4
6
2 6 5
3
1
4
2
5
3
1
6
4
2
JP6 (4-pin): COM3 Header Pin9 Function Select
JP7 (4-pin): COM4 Header Pin9 Function Select
10
JP8→COM5 Header Pin-9
4-6 Closed:
RI= +12V.
1
3
5
3-
4 Closed:
RI= +5V;
2-4 Closed:
RI=RS232;
4
6
2
6
5
3
1
4
2
5
3
1
6
4
2
JP9→COM6 Header Pin-9
4-6 C
losed:
RI= +12V.
1
3
5
3-4 Closed
:
RI= +5V;
2-4 Closed:
RI=RS232;
4
6
2 6 5
3
1
4
2
5
3
1
6
4
2
JP8 (4-pin): COM5 Header Pin9 Function Select
JP9 (4-pin): COM6 Header Pin9 Function Select
11
JP5→LVDS Panel VCC
1
3
5
4
6
2
6
5
3
1
4
2
5
3 1 6
4
2
2-4 Closed:
VCC=3.3V;
3-4 Closed:
VCC= 5V
(Default);
4-6 Closed:
VCC= 12V.
2-3 Close: INVERTER Back Light 12V Selected(Default).
JP4→INVERTER Back Light VCC
1-2 Close: INVERTER Back Light 5V Selected;
1
3
JP5 (4-pin): LVDS Panel VCC 3.3V/5V/12V Select
JP4 (3-pin): INVERTER Back Light VCC 5V/12V Select
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