IXYS IXDN409SI, IXDN409CI, IXDD409YI, IXDD409PI, IXDD409CI Datasheet

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Features
• Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes.
• Latch Up Protected
• High Peak Output Current: 9A Peak
• Operates from 4.5V to 25V
• High Capacitive Load Drive Capability: 2500pF in <15ns
• Matched Rise And Fall Times
• Low Propagation Delay Time
• Low Output Impedance
• Low Supply Current
Applications
• Driving MOSFETs and IGBTs
• Motor Controls
• Line Drivers
• Pulse Generators
• Local Power ON/OFF Switch
• Switch Mode Power Supplies (SMPS)
• DC to DC Converters
• Pulse Transformer Driver
• Limiting di/dt under Short Circuit
• Class D Switching Amplifiers
First Release
Copyright © IXYS CORPORATION 2002 Patent Pending
General Description
The IXDD409/IXDI409/IXDN409 are high speed high current gate drivers specifically designed to drive the largest MOSFETs and IGBTs to their minimum switching time and maximum practical frequency limits. The IXDD409/IXDI409/ IXDN409 can source and sink 9A of peak current while producing voltage rise and fall times of less than 30ns. The input of the drivers are compatible with TTL or CMOS and are fully immune to latch up over the entire operating range. Designed with small internal delays, cross conduction/ current shoot-through is virtually eliminated in the IXDD409/ IXDI409/IXDN409. Their features and wide safety margin in operating voltage and power make the drivers unmatched in performance and value.
The IXDD409 incorporates a unique ability to disable the output under fault conditions. When a logical low is forced into the Enable input, both final output stage MOSFETs (NMOS and PMOS) are turned off. As a result, the output of the IXDD409 enters a tristate mode and achieves a Soft Turn­Off of the MOSFET/IGBT when a short circuit is detected. This helps prevent damage that could occur to the MOSFET/ IGBT if it were to be switched off abruptly due to a dv/dt over­voltage transient.
The IXDN409 is configured as a non-inverting gate driver, and the IXDI409 is an inverting gate driver.
The IXDD409/IXDI409/IXDN409 are available in the standard 8­pin P-DIP (PI), SOP-8 (SI), 5-pin TO-220 (CI) and in the TO-263 (YI) surface-mount packages.
Figure 1A - IXDD409 Functional Diagram
IXDD409PI / 409SI / 409YI / 409CI IXDI409PI / 409SI / 409YI / 409CI IXDN409PI / 409SI / 409YI / 409CI 9 Amp Low-Side Ultrafast MOSFET Driver
Figure 1B - IXDN409 Functional Diagram
Figure 1C - IXDI409 Functional Diagram
Part Number Package Type Temp. Range Configuration
IXDD409PI 8-Pin PDIP IXDD409SI 8-Pin SOIC IXDD409YI 5-Pin TO-263 IXDD409CI 5-Pin TO-220
-40°C to +85°C
Non Inverting With Enable Line
IXDI409PI 8-Pin PDIP IXDI409SI 8-Pin SOIC IXDI409YI 5-Pin TO-263 IXDI409CI 5-Pin TO-220
-40°C to +85°C
Inverting
IXDN409PI 8-Pin PDIP IXDN409SI 8-Pin SOIC IXDN409YI 5-Pin TO-263 IXDN409CI 5-Pin TO-220
-40°C to +85°C
Non Inverting
Ordering Information
2
IXDD409PI / 409SI / 409YI / 409CI IXDI409PI / 409SI / 409YI / 409CI IXDN409PI / 409SI / 409YI / 409CI
Unless otherwise noted, TA = 25 oC, 4.5V ≤ V
CC
25V .
All voltage measurements with respect to GND. IXDD409 configured as described in Test Conditions.
Electrical Characteristics
Symbol Parameter Test Conditions Min Typ Max Units
V
IH
High input voltage 3.5 V VIL Low input voltage 0.8 V VIN Input voltage range -5 V
CC
+ 0.3 V
IIN Input current
0V V
IN
V
CC
-10 10
µA
VOH High output voltage V
CC
- 0.025 V VOL Low output voltage 0.025 V ROH Output resistance
@ Output high
I
OUT
= 10mA, V
CC
= 18V
0.8 1.5
ROL Output resistance
@ Output Low
I
OUT
= 10mA, V
CC
= 18V 0.8 1.5
I
PEAK
Peak output current VCC is 18V
9 A
I
DC
Continuous output
current
Limited by package power dissipation
2 A
V
EN
Enable voltage range IXDD409 Only - .3 Vcc + 0.3 V
V
ENH
High En Input Voltage IXDD409 Only 2/3 Vcc V
V
ENL
Low En Input Voltage IXDD409 Only 1/3 Vcc V tR Rise time CL=2500pF Vcc=18V 8 10 15 ns tF Fall time CL=2500pF Vcc=18V 8 10 15 ns t
ONDLY
On-time propagation
delay
CL=2500pF Vcc=18V 33 36 40 ns
t
OFFDLY
Off-time propagation
delay
CL=2500pF Vcc=18V 31 33 36 ns
t
ENOH
Enable to output high
delay time
IXDD409 Only, Vcc=18V 52 ns
t
DOLD
Disable to output low
Disable delay time
IXDD409 Only, Vcc=18V 30 ns
VCC Power supply voltage 4.5 18 25 V ICC Power supply current V
IN
= 3.5V
V
IN
= 0V
V
IN
= + VCC
1 0 3
10 10
mA
µA µA
Absolute Maximum Ratings (Note 1)
Parameter Value
Supply Voltage 25 V All Other Pins -0.3 V to VCC + 0.3 V
Power Dissipation, T
AMBIENT
25 oC 8 Pin PDIP (PI) 975mW 8 Pin SOIC (SI) 1055mW TO220 (CI), TO263 (YI) 17W
Derating Factors (to Ambient)
8 Pin PDIP (PI)
7.6mW/oC
8 Pin SOIC (SI)
8.2mW/oC
TO220 (CI), TO263 (YI)
0.14W/oC
Storage Temperature
-65 oC to 150 oC
Lead Temperature (10 sec)
300 oC
Operating Ratings
Parameter Value
Maximum Junction Temperature
150 oC
Operating Temperature Range
-40 oC to 85 oC Thermal Impedance (Junction To Case) TO220 (CI), TO263 (YI) (θJC)
0.95 oC/W
Specifications Subject To Change Without Notice
3
IXDD409PI / 409SI / 409YI / 409CI IXDI409PI / 409SI / 409YI / 409CI IXDN409PI / 409SI / 409YI / 409CI
Pin Description
SYMBOL FUNCTION DESCRIPTION
VCC Supply Voltage
Positive power-s upply voltage inp ut. This pin provides power to the entire chip. The range for this voltage is from 4.5V to 25V.
IN Input Input signal-TTL or CMOS compatible.
EN * Enable
The system ena ble pin. T his pin, when dri ven lo w, disabl es the c hip, forcing high impedance state to the output (IXDD409 Only).
OUT Output
Driver Output. For application purposes, this pin is connected, through a resistor, to Gate of a MOSFET/IGBT.
GND Ground
The system ground pin. Internally connec ted to all circuitry, this pin provides ground reference for the entire chip. This pin should be connected to a low noise analog ground plane for optimum performance.
Figure 2 - Characteristics Test Diagram
* This pin is used only on the IXDD409, and is N/C on the IXDI409 and IXDN409. Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling this component.
V
IN
8 PIN DIP (PI)
SO8 (SI)
TO220 (CI) TO263 (YI)
Vcc OUT GND IN EN *
1 2 3 4 5
Pin Configurations
VCC
IN
EN *
GND
VCC
OUT
GND
OUT
1
2
3
4
8
7
6
5
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