ISSI IS62WV51216ALL, IS62WV51216BLL User Manual

IS62WV51216ALL
®
IS62WV51216BLL
512K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access time: 45ns, 55ns
• CMOS low power operation – 36 mW (typical) operating – 12 µW (typical) CMOS standby
• TTL compatible interface levels
• Single power supply – 1.65V--2.2V V – 2.5V--3.6V V
• Fully static operation: no clock or refresh required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Lead-free available
DD (62WV51216ALL)
DD (62WV51216BLL)
DESCRIPTION
The ISSI IS62WV51216ALL/ IS62WV51216BLL are high- speed, 8M bit static RAMs organized as 512K words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high­performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW (deselected) or when CS1 is LOW, CS2 is HIGH and both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable and Output Enable inputs. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IS62WV51216ALL and IS62WV51216BLL are packaged in the JEDEC standard 48-pin mini BGA (7.2mm x 8.7mm) and 44-Pin TSOP (TYPE II).
ISSI
FEBRUARY 2005
FUNCTIONAL BLOCK DIAGRAM
A0-A18
VDD GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CS2
CS1
OE
WE
UB
LB
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
512K x 16
MEMORY ARRAY
COLUMN I/O
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
02/24/05
1-800-379-4774
1
IS62WV51216ALL, IS62WV51216BLL ISSI
®
PIN CONFIGURATIONS 48-Pin mini BGA (7.2mm x 8.7mm)
1 2 3 4 5 6
A1
A B C D E F G H
LB
I/O
I/O
GND
V
I/O
I/O
A18
8
9
DD
14
15
A0
OE
UB A3
I/O10A5
A17
I/O
11
I/O12GND
A14
I/O
13
A12
NC
A9
A8
A6
A7
A16
A15
A13
A10
A4
A2
CS1 I/O
I/O1I/O
I/O
3
I/O
GND
4
I/O
5
WE
A11 NC
CS2
V
I/O
I/O
DD`
PIN DESCRIPTIONS
A0-A18 Address Inputs I/O0-I/O15 Data Inputs/Outputs
CS1, CS2 Chip Enable Input OE Output Enable Input WE Write Enable Input LB Lower-byte Control (I/O0-I/O7)
0
2
6
7
UB Upper-byte Control (I/O8-I/O15) N C No Connection VDD Power GND Ground
44-Pin TSOP (Type II)
1
A4
2
A3
3
A2
4
A1
5
A0
6
CS1
7
I/O0
8
I/O1
9
I/O2
10
I/O3
11
V
DD
12
GND
13
I/O4
14
I/O5
15
I/O6
16
I/O7
17
WE
18
A16
19
A15
20
A14
21
A13
22
A12
44
A5
43
A6
42
A7
41
OE
40
UB
39
LB
38
I/O15
37
I/O14
36
I/O13
35
I/O12
34
GND
33
V
DD
32
I/O11
31
I/O10
30
I/O9
29
I/O8
28
A18
27
A8
26
A9
25
A10
24
A11
23
A17
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
02/24/05
IS62WV51216ALL, IS62WV51216BLL ISSI
TRUTH TABLE
I/O PIN
Mode
WEWE
WE
WEWE
Not Selected X H X X X X High-Z High-Z I
Output Disabled H L H H L X High-Z High-Z ICC
Read H L H L L H DOUT High-Z ICC
Write L L H X L H DIN High-Z ICC
CS1CS1
CS1 CS2
CS1CS1
OEOE
OE
OEOE
LBLB
LB
LBLB
UBUB
UB I/O0-I/O7 I/O8-I/O15 VDD Current
UBUB
SB1, ISB2
X X L X X X High-Z High-Z ISB1, ISB2 XXXXHH High-Z High-Z ISB1, ISB2
H L H H X L High-Z High-Z ICC
H L H L H L High-Z DOUT HLHLLL DOUT DOUT
L L H X H L High-Z DIN LLHXLL DIN DIN
®
OPERATING RANGE (VDD)
Range Ambient Temperature IS62WV51216ALL (70ns) IS62WV51216BLL (55ns, 70ns) IS62WV51216BLL (45ns)
Commercial 0°C to +70°C 1.65V - 2.2V 2.5V - 3.6V 3.0 - 3.6V Industrial –40°C to +85°C 1.65V - 2.2V 2.5V - 3.6V
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
02/24/05
1-800-379-4774
3
IS62WV51216ALL, IS62WV51216BLL ISSI
®
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.2 to VDD+0.3 V TBIAS Temperature Under Bias –40 to +85 °C VDD VDD Related to GND –0.2 to +3.8 V TSTG Storage Temperature –65 to +150 ° C PT Power Dissipation 1.0 W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions VDD Min. Max. Unit
VOH Output HIGH Voltage IOH = -0.1 mA 1.65-2.2V 1.4 V
IOH = -1 mA 2.5-3.6V 2.2 V
VOL Output LOW Voltage IOL = 0.1 mA 1.65-2.2V 0.2 V
IOL = 2.1 mA 2.5-3.6V 0.4 V
VIH Input HIGH Voltage 1.65-2.2V 1.4 VDD + 0.2 V
2.5-3.6V 2.2 VDD + 0.3 V
(1)
VIL
Input LOW Voltage 1.65-2.2V – 0. 2 0 .4 V
2.5-3.6V –0.2 0.6 V ILI Input Leakage GND VIN VDD –1 1 µA ILO Output Leakage GND VOUT VDD, Outputs Disabled – 1 1 µA
Notes:
1. VIL (min.) = –1.0V for pulse width less than 10 ns.
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
02/24/05
IS62WV51216ALL, IS62WV51216BLL ISSI
®
CAPACITANCE
(1)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 8 pF COUT Input/Output Capacitance VOUT = 0V 10 pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter 62WV51216ALL 62WV51216BLL
(Unit) (Unit)
Input Pulse Level 0.4V to VDD-0.2 0.4V to VDD-0.3V Input Rise and Fall Times 5 ns 5ns Input and Output Timing VREF VREF
and Reference Level Output Load See Figures 1 and 2 See Figures 1 and 2
62WV51216ALL 62WV51216BLL
(1.65V - 2.2V) (2.5V - 3.6V)
R1(Ω) 3070 1029 R2(Ω) 3150 1728 VREF 0.9V 1.5V VTM 1.8V 2.8V
AC TEST LOADS
R1
VTM
OUTPUT
30 pF
Including
jig and
scope
R2
VTM
OUTPUT
5 pF
Including
jig and
scope
R1
R2
Figure 1
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
02/24/05
1-800-379-4774
Figure 2
5
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