IOR IRF7321D2PbF User Manual

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D
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查询IRF7321D2PBF供应商
l Co-packaged HEXFET® Power
MOSFET and Schottky Diode
l Ideal For Buck Regulator Applications l P-Channel HEXFET® l Low V l Generation 5 Technology l SO-8 Footprint l Lead-Free
Description
The FETKYTM family of Co-packaged HEXFETs and Schottky diodes offer the designer an innovative board space saving solution for switching regulator and power management applications. Generation 5 HEXFETs utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. Combinining this technology with International Rectifier's low forward drop Schottky rectifiers results in an extremely efficient device suitable for use in a wide variety of portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics. The SO-8 package is designed for vapor phase, infrared or wave soldering techniques.
Schottky Rectifier
F
PD - 95297
IRF7321D2PbF
FETKY MOSFET & Schottky Diode
A
A
S
G
TM
1
2
3
4
Top View
8
7
6
5
V
= -30V
DSS
R
DS(on)
= 0.062
Schottky Vf = 0.52V
SO-8
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)
Parameter Maximum Units
ID @ TA = 25°C Continuous Drain Current, VGS @ -10V -4.7 A ID @ TA = 70°C -3.8 I
DM
PD @TA = 25°C Power Dissipation 2.0 W PD @TA = 70°C 1.3
V
GS
dv/dt Peak Diode Recovery dv/dt Á -5.0 V/ns T
J, TSTG
Pulsed Drain Current À -38
Linear Derating Factor 16 mW/°C Gate-to-Source Voltage ± 20 V
Junction and Storage Temperature Range -55 to +150 °C
Thermal Resistance Ratings
Parameter Maximum Units
R
θJA
Notes:
Junction-to-Ambient à 62.5 °C/W
Repetitive rating – pulse width limited by max. junction temperature (see fig. 11)I
-2.9A, di/dt -77A/µs, V
SD
DD
V
(BR)DSS
, TJ ≤ 150°C
Pulse width 300µs – duty cycle2% Surface mounted on FR-4 board, t 10sec.
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10/12/04
IRF7321D2PbF
MOSFET Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
MOSFET Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Schottky Diode Maximum Ratings
If (av) Max. Average Forward Current 3.2 50% Duty Cycle. Rectangular Wave, Tc = 25°C
I
SM
Schottky Diode Electrical Specifications
Vfm Max. Forward voltage drop 0.57 If = 3.0, Tj = 25°C
Irm Max. Reverse Leakage current 0.30 Vr = 30V Tj = 25°C
Ct Max. Junction Capacitance 310 pF Vr = 5Vdc ( 100kHz to 1 MHz) 25°C dv/dt Max. Voltage Rate of Charge 4900 V/µs Rated Vr
( HEXFET is the reg. TM for International Rectifier Power MOSFET's )
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Drain-to-Source Breakdown Voltage -30 ––– ––– V VGS = 0V, ID = -250µA
Static Drain-to-Source On-Resistance
––– 0.042 0.062 VGS = -10V, ID = -4.9A ––– 0.076 0.098 V
= -4.5V, ID = -3.6A
GS
Gate Threshold Voltage -1.0 ––– ––– V VDS = VGS, ID = -250µA Forward Transconductance ––– 7.7 ––– S VDS = -15V, ID = -4.9A
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage ––– ––– 100 VGS = -20V Gate-to-Source Reverse Leakage ––– ––– -100 VGS = 20V
––– ––– -1.0 V ––– ––– -25 VDS = -24V, VGS = 0V, TJ = 55°C
µA
nA
= -24V, VGS = 0V
DS
Total Gate Charge ––– 23 34 ID = -4.9A Gate-to-Source Charge ––– 3.8 5.7 nC VDS = -15V Gate-to-Drain ("Miller") Charge ––– 5.9 8.9 VGS = -10V, See Fig. 6 Turn-On Delay Time ––– 13 19 VDD = -15V Rise Time ––– 13 20 ID = -1.0A Turn-Off Delay Time ––– 34 51 RG = 6.0
ns
Fall Time ––– 32 48 RD = 15, Input Capacitance ––– 710 ––– VGS = 0V Output Capacitance ––– 380 ––– pF VDS = -25V Reverse Transfer Capacitance ––– 180 ––– ƒ = 1.0MHz, See Fig. 5
Parameter Min. Typ. Max. Units Conditions Continuous Source Current(Body Diode) ––– ––– -2.5 Pulsed Source Current (Body Diode) ––– ––– -30
A
Body Diode Forward Voltage ––– -0.78 -1.0 V TJ = 25°C, IS = -1.7A, VGS = 0V Reverse Recovery Time (Body Diode) ––– 44 66 ns TJ = 25°C, IF = -1.7A Reverse Recovery Charge ––– 42 63 nC di/dt = 100A/µs 
Parameter Max. Units Conditions
A
2.0 See Fig.14 Tc = 70°C Max. peak one cycle Non-repetitive 200 5µs sine or 3µs Rect. pulse Following any rated Surge current 20 10ms sine or 6ms Rect. pulse load condition &
A
with Vrrm applied
Parameter Max. Units Conditions
0.77 If = 6.0, Tj = 25°C
V
0.52 If = 3.0, Tj = 125°C
0.79 If = 6.0, Tj = 125°C .
mA
37 Tj = 125°C
A
A
A
Power Mosfet Characteristics
IRF7321D2PbF
100
VGS TOP - 15V
- 10V
- 7.0V
- 5.5V
- 4.5V
- 4.0V
- 3.5V BOTTOM - 3.0V
10
-3.0V
D
-I , Drain-to-Source Current (A)
20µs PULSE WIDTH T = 25°C
1
0.1 1 10
-V , Drain-to-Source Voltage (V) DS
100
J
100
VGS TOP - 15V
- 10V
- 7.0V
- 5.5V
- 4.5V
- 4.0V
- 3.5V BOTTOM - 3.0V
10
-3.0V
D
-I , Drain-to-Source Current (A)
20µs PULSE WIDTH T = 150°C
1
0.1 1 10
-V , Drain-to-Source Voltage (V) DS
J
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
2.0
---4.9A
4.9A
I =
D
1.5
T = 25°C
J
T = 150°C
10
J
1.0
(Normalized)
0.5
D
-I , Drain-to-Source Current (A)
1
3.0 3.5 4.0 4.5 5.0 5.5 6.0
-V , Gate-to-Source Voltage (V)
GS
V = -10V
DS
20µs PULSE WIDTH
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature ( C)
J
V =
GS
°
-10V
10V
Fig 4. Normalized On-Resistance
Fig 3. Typical Transfer Characteristics
Vs. Temperature
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