Intersil ISL6262CRZ, ISL6262IRZ Schematics

®
ISL6262
Data Sheet May 15, 2006
Two-Phase Core Regulator for IMVP-6 Mobile CPUs
The ISL6262 is a two-phase buck converter regulator implementing Intel® IMVP-6 protocol, with embedded gate drivers. The two-phase buck converter uses two interleaved channels to effectively double the output voltage ripple frequency and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller real estate area.
The heart of the ISL6262 is R Robust Ripple Regulator modulator. Compared with the traditional multiphase buck regulator, the R has the fastest transient response. This is due to the R modulator commanding variable switching frequency during a load transient.
Intel Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology, which ef fectively reduces power dissipation in Intel Pentium processors. To boost battery life, the ISL6262 supports DPRSLRVR (deeper sleep), DPRSTP# and PSI# functions and maximizes the efficiency via automatically enabling different phase operation modes. At heavy load operation of the active mode, the regulator commands the two phase continuous conduction mode (CCM) operation. While the PSI# is asserted at the medium load in the active mode, the ISL6262 smoothly disables one phase and operates in a one-phase CCM. When the CPU enters deeper sleep mode, the ISL6262 enables diode emulation to maximize the efficiency at the light load.
A 7-bit digital-to-analog converter (DAC) allows dynamic adjustment of the core output voltage from 0.300V to 1.500V . A 0.5% system accuracy of the core output voltage over temperature is achieved by the ISL6262.
A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately measured and regulated per Intel IMVP-6 specifications. Current sensing can be realized using either lossless inductor DCR sensing or precision resistor sensing. A single NTC thermistor network thermally compensates the gain and the time constant of the DCR variations.
3
Technology™, Intersil’s
3
Technology™
3
FN9199.2
Features
• Precision Two-phase CORE Voltage Regulator
- 0.5% System Accuracy Over Temperature
- Enhanced load line accuracy
• Internal Gate Driver with 2A Driving Capability
• Dynamic Phase Adding/Dropping
• Microprocessor Voltage Identification Input
- 7-Bit VID Input
- 0.300V to 1.500V in 12.5mV Steps
- Support VID Change on-the-fly
• Multiple Current Sensing Schemes Supported
- Lossless Inductor DCR Current Sensing
- Precision Resistive Current Sensing
• Thermal Monitor
• User Programmable Switching Frequency
• Differential Remote CPU Die Voltage Sensing
• Static and Dynamic Current Sharing
• Overvoltage, Undervoltage, and Overcurrent Protection
• Pb-Free Plus Anneal Available (RoHS Compliant)
Ordering Information
PART
NUMBER
ISL6262CRZ (Note)
ISL6262CRZ-T (Note)
ISL6262IRZ (Note)
ISL6262IRZ-T (Note)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PART
MARKING
ISL6262CRZ -10 to 100 48 Ld 7x7 QFN
ISL6262CRZ -10 to 100 48 Ld 7x7 QFN
ISL6262IRZ -40 to 100 48 Ld 7x7 QFN
ISL6262IRZ -40 to 100 48 Ld 7x7 QFN
TEMP.
(°C) PACKAGE
(Pb-free)
(Pb-free)
(Pb-free)
(Pb-free)
PKG.
DWG. #
L48.7x7
L48.7x7
L48.7x7
L48.7x7
1
Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved. R
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
3
Pinout
ISL6262
ISL6262 (7x7 QFN)
TOP VIEW
3V3
CLK_EN#
DPRSTP#
DPRSLPVR
VR_ON
VID6
VID5
VID4
VID3
VID2
VID1
48 47 46 45 44 43 42 41 40 39 38 37
VID0
PGOOD
PSI#
PGD_IN
RBIAS
VR_TT#
NTC
SOFT
OCSET
VW
COMP
FB
FB2
1
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
RTN
VSEN
VDIFF
DFB
DROOP
GND PAD
(BOTTOM)
VO
VIN
VSUM
GND
VDD
36
BOOT1
35
UGATE1
34
PHASE1
33
PGND1
LGATE1
32
31
PVCC
30
LGATE2
29
PGND2
PHASE2
28
UGATE2
27
BOOT2
26
NC
25
ISEN2
ISEN1
2
FN9199.2
May 15, 2006
ISL6262
Absolute Maximum Ratings Thermal Information
Supply Voltage, VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 -+7V
Battery Voltage, VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25V
Boot1,2 and UGATE1,2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +30V
ALL Other Pins. . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VDD +0.3V)
Open Drain Outputs, PGOOD, VR_TT# . . . . . . . . . . . . . . -0.3 -+7V
Recommended Operating Conditions
Supply Voltage, VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
Battery Voltage, VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to 21V
Ambient Temperature. . . . . . . . . . . . . . . . . . . . . . . . -10°C to 100°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . -10°C to 125°C
Ambient Temperature, Industrial . . . . . . . . . . . . . . . -40°C to 100°C
Junction Temperature, Industrial . . . . . . . . . . . . . . . -40°C to 125°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
1. θ
JA
Tech Brief TB379.
2. For θ
, the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Thermal Resistance (Typical)
θJA
°C/W θJC°C/W
QFN Package (Notes 1, 2). . . . . . . . . . 29 4.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
Electrical Specifications V
= 5V, TA = -40°C to 100°C, Unless Otherwise Specified.
DD
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
INPUT POWER SUPPLY
+5V Supply Current I
VDD
VR_ON = 3.3V - 3.1 3.6 mA
VR_ON = 0V - - 1 µA +3.3V Supply Current I Battery Supply Current at VIN pin I
3V3 VIN
POR (Power-On Reset) Threshold POR
POR
No load on CLK_EN# - - 1 µA
VR_ON = 0V, VIN = 25V, - - 1 µA
VDD Rising - 4.35 4.5 V
r
VDD Falling 3.9 4.1 - V
f
SYSTEM AND REFERENCES
System Accuracy %Error
(V
cc_core
ISL6262CRZ
No load, closed loop, active mode,
)
TA = 0°C to 100°C, VID = 0.75-1.5V -0.5 - 0.5 %
VID = 0.5-0.7375V -8 - 8 mV
VID = 0.3-0.4875V -15 - 15 mV
%Error
(V
cc_core
ISL6262IRZ
)
= -40°C to 100°C, VID = 0.75-1.5V -0.8 - 0.8 %
T
A
VID = 0.5-0.7375V -10 - 10 mV
VID = 0.3-0.4875V -18 - 18 mV RBIAS Voltage R Boot Voltage V Maximum Output Voltage V
V
RBIAS BOOT
CC_CORE
(max)
CC_CORE
(min)
R
= 147kΩ 1.45 1.47 1.49 V
RBIAS
1.188 1.2 1.212 V
VID = [0000000] - 1.5 - V
VID = [1100000] - 0.3 - V
VID Off State VID = [1111111] - 0 - V
CHANNEL FREQUENCY
Nominal Channel Frequency f
SW
R
= 3.9kΩ, 2 channel operation,
FSET
V
= 2V
comp
-300-kHz
Adjustment Range 200 - 500 kHz
3
FN9199.2
May 15, 2006
ISL6262
Electrical Specifications V
= 5V, TA = -40°C to 100°C, Unless Otherwise Specified. (Continued)
DD
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
AMPLIFIERS
Droop Amplifier Offset -0.3 - 0.3 mV Error Amp DC Gain A
V0
Error Amp Gain-Bandwidth Product GBW C Error Amp Slew Rate SR C FB Input Current I
IN(FB)
= 20pF - 18 - MHz
L
= 20pF - 5 - V/µs
L
-90-dB
- 10 150 nA
ISEN
Imbalance Voltage --1mV Input Bias Current -20-nA
SOFT-START CURRENT
Soft-Start Current I Soft Geyserville Current I Soft Deeper Sleep Entry Current I Soft Deeper Sleep Exit Current I Soft Deeper Sleep Exit Current I
SS
GV
C4 C4EA C4EB
|SOFT - REF|>100mV ±170 ±200 ±230 µA DPRSLPVR = 3.3V -47 -41 -35 µA DPRSLPVR = 3.3V 35 41 47 µA DPRSLPVR = 0V 170 200 230 µA
-47 -41 -35 µA
GATE DRIVER DRIVING CAPABILITY
UGATE Source Resistance R UGATE Source Current I UGATE Sink Resistance R UGATE Sink Current I LGATE Source Resistance R LGATE Source Current I LGATE Sink Resistance R LGATE Sink Current I UGATE to PHASE Resistance R
SRC(UGATE)
SRC(UGATE)VUGATE_PHASE
SNK(UGATE)
SNK(UGATE)VUGATE_PHASE
SRC(LGATE)
SRC(LGATE)VLGATE
SNK(LGATE)
SNK(LGATE)VLGATE
p(UGATE)
500mA Source Current - 1 1.5 Ω
= 2.5V - 2 - A
500mA Sink Current - 1 1.5 Ω
= 2.5V - 2 - A
500mA Source Current - 1 1.5 Ω
= 2.5V - 2 - A
500mA Sink Current - 0.5 0.9 Ω
= 2.5V - 4 - A
-1.1-kΩ GATE DRIVER SWITCHING TIMING (refer to timing diagram) UGATE Turn-On Propagation Delay t
ISL6262CRZ
PDHU
t
PDHU
T
= -10°C to 100°C
A
PV
= 5V, Outputs Unloaded
CC
PV
= 5V, Outputs Unloaded 18 30 44 ns
CC
20 30 44 ns
ISL6262IRZ
T
LGATE Turn-On Propagation Delay t
ISL6262CRZ
PDHL
t
PDHL
= -10°C to 100°C
A
PV
= 5V, Outputs Unloaded
CC
PV
= 5V, Outputs Unloaded 5 15 30 ns
CC
71530ns
ISL6262IRZ
BOOTSTRAP DIODE
Forward Voltage V Leakage V
= 5V, Forward Bias Current = 2mA 0.43 0.58 0.72 V
DDP
= 16V - - 1 µA
R
POWER GOOD and PROTECTION MONITOR
PGOOD Low Voltage V PGOOD Leakage Current I
OL
OH
I
= 4mA - 0.11 0.4 V
PGOOD
P
= 3.3V -1 - 1 µA
GOOD
4
FN9199.2
May 15, 2006
ISL6262
Electrical Specifications V
= 5V, TA = -40°C to 100°C, Unless Otherwise Specified. (Continued)
DD
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
PGOOD Delay t
ISL6262CRZ
pgd
t
pgd
T
= -10°C to 100°C
A
5.5 6.8 8.1 ms
CLK_EN# Low to PGOOD High CLK_EN# Low to PGOOD High 5.3 6.8 8.1 ms
ISL6262IRZ Overvoltage Threshold O Severe Overvoltage Threshold O
VH
VHS
VO rising above setpoint > 1ms 160 200 240 mV
VO rising above setpoint > 0.5µs 1.675 1.7 1.725 V OCSET Reference Current I(Rbias) = 10µA 9.8 10 10.2 µA OC Threshold Offset DROOP rising above OCSET > 120µs -3.5 - 3.5 mV Current Imbalance Threshold Difference between ISEN1 and ISEN2 > 1ms - 7.5 - mV Undervoltage Threshold
UV
f
VO falling below setpoint for > 1ms -365 -300 -240 mV (VDIFF-SOFT)
LOGIC INPUTS
VR_ON, DPRSLPVR and PGD_IN
V
IL
--1V
Input Low VR_ON, DPRSLPVR and PGD_IN
Input High Leakage Current of VR_ON and
PGD_IN
Leakage Current of DPRSLPVR I
DAC(VID0-VID6), PSI# and DPRSTP# Input Low
DAC(VID0-VID6), PSI# and
V
IH
I
IL
I
IH
IL_DPRSLP
I
IH_DPRSLP
V
IL
V
IH
2.3 - - V
Logic input is low -1 0 - µA
Logic input is high at 3.3V - 0 1 µA
DPRSLPVR input is low -1 0 - µA
DPRSLPVR input is high at 3.3V - 0.45 1 µA
--0.3V
0.7 - - V
DPRSTP# Input High Leakage Current of DAC(VID0-
VID6), PSI# and DPRSTP#
I
IL
I
IH
Logic input is low -1 0 - µA
Logic input is high at 1V - 0.45 1 µA
THERMAL MONITOR
NTC Source Current NTC = 1.3 V 53 60 68 µA Over-Temperature Threshold V(NTC) falling 1.165 1.18 1.205 V VR_TT# Low Output Resistance R
TT
I = 20mA - 5 9 Ω
CLK_EN# OUTPUT LEVELS
CLK_EN# High Output Voltage V CLK_EN# Low Output Voltage V
OH OL
3V3 = 3.3V, I = -4mA 2.9 3.1 - V
I
CLK_EN#
= 4mA - 0.18 0.4 V
5
FN9199.2
May 15, 2006
ISL6262 Gate Driver Timing Diagram
PWM
t
PDHU
UGATE
t
RU
ISL6262
t
FU
1V
LGATE
t
FL
1V
Functional Pin Description
PSI#
RBIAS
NTC
SOFT
VW
1
2
3
4
5
6
7
8
9
PGOOD
PGD_IN
VR_TT#
OCSET
t
t
PDHL
3V3
CLK_EN#
DPRSTP#
DPRSLPVR
VR_ON
VID6
VID5
48 47 46 45 44 43 42 41 40 39 38 37
GND PAD
(BOTTOM)
RL
VID4
VID3
VID2
VID1
VID0
36
BOOT1
35
UGATE1
34
PHASE1
33
PGND1
LGATE1
32
31
PVCC
30
LGATE2
29
PGND2
PHASE2
28
COMP
10
FB
11
FB2
12
13 14 15 16 17 18 19 20 21 22 23 24
RTN
VSEN
VDIFF
DROOP
PGOOD - Power good open-drain output. Will be pulled up
externally by a 680Ω resistor to VCCP or 1.9kΩ to 3.3V . PSI# - Low load current indicator input. When asserted low,
indicates a reduced load-current condition, and product goes into single phase operation.
PGD_IN - Digital Input. When asserted high, indicates VCCP and VCC_MCH voltages are within regulation.
6
UGATE2
27
BOOT2
26
NC
25
VO
DFB
VSUM
VIN
VDD
GND
ISEN2
ISEN1
RBIAS - 147K resistor to VSS sets internal current
reference. VR_TT# - Thermal overload output indicator with open-drain
output. Over temperature pull-down resistance is 10Ω. NTC - Thermistor input to VRTT# circuit and a 60µA current
source is connected internally to this pin.
FN9199.2
May 15, 2006
ISL6262
SOFT - A capacitor from this pin to GND pin sets the maximum slew rate of the output voltage. The SOFT pin is the non-inverting input of the error amplifier.
OCSET - Overcurrent set input. A resistor from this pin to VO sets DROOP voltage limit for OC trip. A 10µA current source is connected internally to this pin.
VW - A resistor from this pin to COMP programs the switching frequency (exa. 4.42kΩ ≅ 300kHz).
COMP - This pin is the output of the error amplifier. FB - This pin is the inverting input of error amplifier. FB2 - There is a switch between FB2 pin and the FB pin.
The switch is closed in single-phase operation and is opened in two phase operation. The components connecting to FB2 is to adjust the compensation in single phase operation to achieve optimum performance.
VDIFF - This pin is the output of the differential amplifier. VSEN - Remote core voltage sense input. RTN - Remote core voltage sense return. DROOP - Output of the droop amplifier. The voltage level on
this pin is the sum of Vo and the programmed droop voltage by the external resistors.
DFB - Inverting input to droop amplifier. VO - An input to the IC that reports the local output voltage.
LGATE1 - Lower-side MOSFET gate signal for phase 1. PGND1 - The return path of the lower gate driver for
phase 1. PHASE1 - The phase node of phase 1. This pin should
connect to the source of upper MOSFET.
UGATE1 - Upper MOSFET gate signal for phase 1. BOOT1 - This pin is the upper gate driver supply voltage for
phase 1. An internal boot strap diode is connected to the PVCC pin.
VID0, VID1, VID2, VID3, VID4, VID5, VID6 - VID input with VID0 is the least significant bit (LSB) and VID6 is the most significant bit (MSB).
VR_ON - Digital input enable. A high level logic signal on this pin enables the regulator.
DPRSLPVR - Deeper sleep enable signal. A high level logic indicates the micro-processor is in Deeper Sleep Mode and also indicates a slow C4 entry or exit rate with 41µA discharging or charging the SOFT cap.
DPRSTP# - Deeper sleep slow wake up signal. A low level logic signal on this pin indicates the micro-processor is in deeper sleep mode.
CLK_EN# - Digital output for system PLL clock. Goes active 10µs after PGD_IN is active and Vcore is within 10% of Boot voltage.
VSUM - This pin is connected to the summation junction of channel current sensing.
VIN - Battery supply voltage. It is used for input voltage feedforward to improve the input line transient performance.
VSS - Signal ground. Connect to local controller ground. VDD - 5V control power supply. ISEN2 - Individual current sharing sensing for channel 2. ISEN1 - Individual current sharing sensing for channel 1. N/C - Not connected. Grounding this pin to signal ground in
the practical layout. BOOT2 - This pin is the upper gate driver supply voltage for
phase 2. An internal boot strap diode is connected to the PVCC pin.
UGATE2 - Upper MOSFET gate signal for phase 2. PHASE2 - The phase node of phase 2. This pin should
connect to the source of upper MOSFET. PGND2 - The return path of the lower gate driver for
phase 2.
LGATE2 - Lower-side MOSFET gate signal for phase 2.
3V3 - 3.3V supply voltage for CLK_EN#.
PVCC - 5V power supply for gate drivers.
7
FN9199.2
May 15, 2006
Functional Block Diagram
ISL6262
PVCC
VDD
VIN
ISEN2
ISEN1
3V3
PGOOD
CLK_EN#
PGD_IN
6µA
54µA
PVCC
VIN
NTC
VR_TT#
1.18V
CURRENT BALANCE
PGOOD
MONITOR
AND LOGIC
P
FLT
FAULT AND
PGOOD
LOGIC
-
I_BALF
GOOD
+
1.2V
BOOT1
PVCC
VSOFT
VIN
OC
CH1
CH1 CH2
CONTROL
UGATE1
FLT
PHASE
LOGIC
VO
PHASE1
PVCC
DRIVER
LOGIC
MODULATOR
SINGLE PHASE
SOFT
LGATE1
PGND1
PVCC
ULTRA-
SONIC TIMER
VSOFT
CH2
PHASE
SEQUENCER
SINGLE PHASE
BOOT2
VIN
OC
-
PHASE2
UGATE2
DRIVER
LOGIC
FLT
MODULATOR
Vw
VO VIN
OC
+
PVCC
VSOFT
LGATE2
E/A
+
PGND2
SINGLE
PHASE
-
+
GND
VW
Vw
COMP
FB2
FB SOFT
VDIFF
+
RBIAS
DPRSLPVR
0.5
10µA
DPRSTP#
DROOP
OCSET
VID0
VID1
DAC
VID2
DACOUT
VID3
VID4
VID5
REQUEST
MODE CHANGE
VID6
MODE
CONTROL
PSI#
VR_ON
FIGURE 1. SIMPLIFIED FUNCTION BLOCK DIAGRAM OF ISL6262
8
1 +
-
+
DFB
VSUM
DROOP
1
VO
-
+
RTN
VSEN
VO
FN9199.2
May 15, 2006
-
ISL6262
Typical Performance Curves 300kHz, DCR Sense, 2xIRF7821/2xIRF7832 Per Phase
100
VIN = 8.0V
90 80 70 60 50 40
EFFICIENCY (%)
30 20 10
0
0 5 10 15 20 25 30 35 40 45 50
VIN = 12.6V
V
= 19.0V
IN
I
OUT
(A)
FIGURE 2. ACTIVE MODE EFFICIENCY , 2 PHASE, CCM,
PSI# = HIGH, VID = 1.15V
100
VIN = 8.0V
90 80 70 60 50 40
EFFICIENCY (%)
30 20 10
0
02468101214161820
VIN = 12.6V
VIN = 19.0V
I
OUT
(A)
FIGURE 4. ACTIVE MODE EFFICIENCY , 1 PHASE, CCM,
PSI# = LOW, VID = 1.15V
1.16
VIN = 8.0V
VIN = 12.6V
= 19.0V
V
IN
01020304050
I
(A)
OUT
(V)
OUT
V
1.14
1.12
1.10
1.08
1.06
1.04
1.02
FIGURE 3. ACTIVE MODE LOAD LINE, 2 PHASE, CCM,
PSI# = HIGH, VID = 1.15V
1.16
1.15
1.14
(V)
1.13
OUT
V
1.12
1.11
1.10
0 4 6 8 10 20
2 12141618
VIN = 12.6V
VIN = 19.0V
I
OUT
VIN = 8.0V
(A)
FIGURE 5. ACTIVE MODE LOAD LINE, 1 PHASE, CCM,
PSI# = LOW, VID = 1.15V
100
90
80
70
EFFICIENCY (%)
60
50
0.1 1 10
VIN = 8.0V
VIN = 19.0V
VIN = 12.6V
I
(A)
OUT
FIGURE 6. DEEPER SLEEP MODE EFFICIENCY , 1 PHASE,
DCM MODE, VID = 0.7625V
9
0.765
0.76
0.755
(V)
0.75
OUT
V
0.745
0.74
0.735 0246810
I
OUT
VIN = 8.0V
VIN = 19.0V
VIN = 12.6V
(A)
FIGURE 7. DEEPER SLEEP MODE LOAD LINE, 1 PHASE,
DCM MODE, VID = 0.7625V
FN9199.2
May 15, 2006
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