Intersil ISL6208BCRZ, ISL6208BIRZ, ISL6208CBZ, ISL6208CRZ, ISL6208IBZ Schematic [ru]

High Voltage Synchronous Rectified Buck MOSFET
Drivers

ISL6208, ISL6208B

The ISL6208 and ISL6208B are high frequency, dual MOSFET
drivers, optimized to drive two N-Channel power MOSFETs in a
synchronous-rectified buck converter topology. They are
especially suited for mobile computing applications that
require high efficiency and excellent thermal performance.
These drivers, combined with an Intersil multiphase Buck
PWM controller, form a complete single-stage core-voltage
regulator solution for advanced mobile microprocessors.

ISL6208 and ISL6208B have the same function but different
packages. The descriptions in this datasheet are based on
ISL6208 and also apply to ISL6208B.

The ISL6208 features 4A typical sinking current for the lower
gate driver. This current is capable of holding the lower
MOSFET gate off during the rising edge of the Phase node. This
prevents shoot-through power loss caused by the high dv/dt of
phase voltages. The operating voltage matches the 30V
breakdown voltage of the MOSFETs commonly used in mobile
computer power supplies.

The ISL6208 also features a three-state PWM input that,
working together with Intersil’s multiphase PWM controllers,
will prevent negative voltage output during CPU shutdown. This
feature eliminates a protective Schottky diode usually seen in
a microprocessor power systems.

MOSFET gates can be efficiently switched up to 2MHz using
the ISL6208. Each driver is capable of driving a 3000pF load
with propagation delays of 8ns and transition times under
10ns. Bootstrapping is implemented with an internal Schottky
diode. This reduces system cost and complexity, while allowing
the use of higher performance MOSFETs. Adaptive
shoot-through protection is integrated to prevent both
MOSFETs from conducting simultaneously.

A diode emulation feature is integrated in the ISL6208 to
enhance converter efficiency at light load conditions. This
feature also allows for monotonic start-up into pre-biased
outputs. When diode emulation is enabled, the driver will allow
discontinuous conduction mode by detecting when the
inductor current reaches zero and subsequently turning off the
low side MOSFET gate.

Features

• Dual MOSFET drives for synchronous rectified bridge

• Adaptive shoot-through protection

•0.5 On-resistance and 4A sink current capability

• Supports high switching frequency up to 2MHz

- Fast output rise and fall time

- Low propagation delay

• Three-state PWM input for power stage shutdown

• Internal bootstrap schottky diode

• Low bias supply current (5V, 80µA)

• Diode emulation for enhanced light load efficiency and pre­biased start-up applications

• VCC POR (power-on-reset) feature integrated

• Low three-state shutdown holdoff time (typical 160ns)

• Pin-to-pin compatible with ISL6207

• QFN and DFN package:

- Compliant to JEDEC PUB95 MO-220

QFN - Quad flat no leads - package outline
DFN - Dual flat no leads - package outline

- Near chip scale package footprint, which improves PCB

efficiency and has a thinner profile

• Pb-free (RoHS compliant)

Applications

• Core voltage supplies for Intel® and AMD® mobile
microprocessors

• High frequency low profile DC/DC converters

• High current low output voltage DC/DC converters

• High input voltage DC/DC converters

Related Literature

•Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”

•Technical Brief TB389
Surface Mount Guidelines for MLFP Packages”

•Technical Brief TB447
Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs”

“PCB Land Pattern Design and

“Guidelines for Preventing

July 14, 2014
FN9115.7

1

1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2004-2008, 2011, 2012, 2014. All Rights Reserved

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.

All other trademarks mentioned are the property of their respective owners.

Ordering Information

UGATE

BOOT

PWM

GND

1
2
3
4

8
7
6
5

PHASE
FCCM
VCC
LGATE

7

UGATE

PHASE

8

43

1

2

6

GND

LGATE

FCCM

VCC

BOOT

PWM

5

6

1

6

VCC

LGATE

PWM

GND

5

6

6

PHASE

FCCM

7

8

UGATE

BOOT

2
3

4

VCC

PWM

10k

CONTROL

LOGIC

SHOOT-

THROUGH

PROTECTION

BOOT

UGATE

PHASE

LGATE

GND

VCC

FCCM

THERMAL PAD (FOR QFN AND DFN PACKAGE ONLY)

FIGURE 1. BLOCK DIAGRAM

ISL6208, ISL6208B

PART NUMBER

(Notes 3

, 4)

ISL6208CBZ (Note 1

ISL6208CRZ (Note 1

) ISL62 08CBZ -10 to +100 8 Ld SOIC M8.15

) 208Z -10 to +100 8 Ld 3x3 QFN L8.3x3

ISL6208BCRZ-T (Note 2

ISL6208IBZ (Note 1

ISL6208IRZ (Note 1

) ISL62 08IBZ -40 to +100 8 Ld SOIC M8.15

) 8IRZ -40 to +100 8 Ld 3x3 QFN L8.3x3

ISL6208BIRZ-T (Note 2

) 8BC -10 to +100 8 Ld 2x2 DFN L8.2x2D

) 8BI -40 to +100 8 Ld 2x2 DFN L8.2x2D

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347

2. Please refer to TB347

for details on reel specifications.

for details on reel specifications.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

4. For Moisture Sensitivity Level (MSL), please see device information page for ISL6208

TB363

.

, ISL6208B. For more information on MSL please see techbrief

Pin Configurations

ISL6208CBZ, ISL6208IBZ

(8 LD SOIC)

TOP VIEW

ISL6208CRZ, ISL6208IRZ

(8 LD 3x3 QFN)

TOP VIEW

ISL6208BCRZ, ISL6208BIRZ

(8 LD 2x2 DFN)

TOP VIEW

Block Diagram

ti

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ISL6208, ISL6208B

ti

Absolute Maximum Ratings Thermal Information

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V

Input Voltage (V
BOOT Voltage (V
BOOT To PHASE Voltage (V

, V

FCCM

BOOT-GND

) . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V

PWM

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 33V

BOOT-PHASE

). . . . . . . . . . . . . . . . -0.3V to 7V (DC)

-0.3V to 9V (<10ns)

PHASE Voltage (Note 5

) . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V

GND - 10V (<20ns Pulse Width, 10µJ)

UGATE Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . V

V

- 5V (<20ns Pulse Width, 10µJ) to V

LGATE Voltage . . . . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V (DC) to VCC + 0.3V

PHASE

- 0.3V (DC) to V

PHASE

BOOT
BOOT

GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V

Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.

NOTES:

5. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.

6. 

is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

JA

is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech

7. 

JA

Brief TB379

8. For 

9. For 

.

, the “case temp” location is the center of the exposed metal pad on the package underside.

JC

, the “case temp” location is taken at the package top center.

JC

Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. Boldface limits apply across the operating

temperature range.

PARAMETER SYMBOL TEST CONDITIONS

Thermal Resistance (Typical) 

8 Ld SOIC Package (Notes 6
8 Ld 3x3 QFN Package (Notes 7
8 Ld 2x2 DFN Package (Notes 7

, 9) . . . . . . . . . 110 67

, 8) . . . . . . 80 15

, 8) . . . . . . 89 24

(°C/W) JC (°C/W)

JA

Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C

Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493

Recommended Operating Conditions

Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-10°C to +100°C

Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . . +125°C

Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%

MIN

(Note 11

)TYP

MAX

(Note 11)UNITS

V

SUPPLY CURRENT

CC

Bias Supply Current I

VCC

PWM pin floating, V

= 5V - 80 - µA

FCCM

POR

V

Rising -3.403.90 V

CC

V

Falling 2.40 2.90 - V

CC

Hysteresis - 500 - mV

BOOTSTRAP DIODE

Forward Voltage V

V

F

= 5V, forward bias current = 2mA 0.50 0.55 0.65 V

VCC

PWM INPUT

Input Current I

PWM

PWM Three-State Rising Threshold V

PWM Three-State Falling Threshold V

Three-State Shutdown Hold-off Time t

TSSHD

V

= 5V - 250 - µA

PWM

V

= 0V - -250 - µA

PWM

= 5V 0.70 1.00 1.30 V

VCC

= 5V 3.5 3.8 4.1 V

VCC

V

= 5V, temperature = +25°C 100 175 250 ns

VCC

FCCM INPUT

FCCM LOW Threshold 0.50 --V

FCCM HIGH Threshold --2.0 V

SWITCHING TIME

UGATE Rise Time (Note 10

LGATE Rise Time (Note 10

)t

)t

UGATE Fall Time (Note 10) t

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RU

RL

FU

V

= 5V, 3nF load - 8.0 - ns

VCC

V

= 5V, 3nF load - 8.0 - ns

VCC

V

= 5V, 3nF load - 8.0 - ns

VCC

FN9115.7

July 14, 2014

ISL6208, ISL6208B

Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. Boldface limits apply across the operating

temperature range.

PARAMETER SYMBOL TEST CONDITIONS

MIN

(Note 11

)TYP

MAX

(Note 11)UNITS

LGATE Fall Time (Note 10) t

UGATE Turn-Off Propagation Delay t

LGATE Turn-Off Propagation Delay t

UGATE Turn-On Propagation Delay t

LGATE Turn-On Propagation Delay t

UG/LG Three-State Propagation Delay t

Minimum LG ON-TIME in DCM (Note 10

)t

FL

PDLU

PDLL

PDHU

PDHL

PTS

LGMIN

V

= 5V, 3nF load - 4.0 - ns

VCC

V

= 5V, outputs unloaded - 18 - ns

VCC

V

= 5V, outputs unloaded - 25 - ns

VCC

V

= 5V, outputs unloaded 10 20 30 ns

VCC

V

= 5V, outputs unloaded 10 20 30 ns

VCC

V

= 5V, outputs unloaded - 35 - ns

VCC

- 400 - ns

OUTPUT

Upper Drive Source Resistance R

Upper Driver Source Current (Note 10

)I

Upper Drive Sink Resistance R

Upper Driver Sink Current (Note 10

)I

Lower Drive Source Resistance R

Lower Driver Source Current (Note 10

)I

Lower Drive Sink Resistance R

Lower Driver Sink Current (Note 10

)I

500mA source current - 1 2.5 

U

V

U

U

U

L

L

L

L

UGATE-PHASE

500mA sink current - 1 2.5 

V

UGATE-PHASE

500mA source current - 1 2.5 

V

LGATE

500mA sink current - 0.5 1.0 

V

LGATE

= 2.5V - 2.00 - A

= 2.5V - 2.00 - A

= 2.5V - 2.00 - A

= 2.5V - 4.00 - A

NOTES:

10. Limits established by characterization and are not production tested.

11. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.

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ISL6208, ISL6208B

+5V

BOOT

UGATE

PHASE

LGATE

PWM

FCCM

VCC

DRIVE

V

BAT

+5V

BOOT

UGATE

PHASE

LGATE

PWM

V

BAT

+V

CORE

PGOOD

VID

FS

GND

ISEN2

ISEN1

PWM2

PWM1

VSEN

MAIN

FB

VCC

+5V

COMP

ISL6208

CONTROL

VCC

DRIVE

ISL6208

+5V

DACOUT

FCCM

FCCM

THERMAL
PAD

THERMAL
PAD

Typical Application with 2-Phase Converter

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FN9115.7

July 14, 2014

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