The ISL6112 targets the PCI-Express add-in card hot plug
application. Together with two each of N-Channel and
P-Channel MOSFETs, four current sense resistors and
several external passive components the ISL6112 provides
a compliant hot plug power control solution to any
combination of two PCI-Express X1, X4, X8 or X16 slots.
The ISL6112 features the ability to program a maximum
current regulated level for each of the MAIN outputs for a
common programmable duration so that both fault isolation
protection and imperviousness to electrical transients (OC
and soft-start protection) are provided to each system
supply. For each 12VMAIN supply, the curre nt regulated
(CR) level is set by a resistor value dependant on the size of
the PCI-Express connector (X1, X4/X8 or X16) to be
powered. This resistor is a sub ohm standard value current
sense resistor one each for each of the 3VMAIN and
12VMAIN supplies. The voltage across this resistor is
compared to a 50mV reference providing a nominal CR
protection level which would be set above the maximum
specified slot limits. The 3.3V supply can use a 15mΩ sense
resistor compared to a 50mV reference to provide a nominal
regulated current limit of 3.3A to all connector sizes. A
shutdown without a CR duration delay is invoked if R
voltage is >100mV. The VAUX is internally monitored and
controlled to provide nominal limiting to 1A of load current.
The ISL6112 is System Management Interface (SMI)
capable with an integrated SMBus link for communication,
control, monitoring and reporting of IC and slot conditions.
Information such as UV, OC, STATUS, power level etc. are
available. Additionally the IC has a minimum of I/O for
implementations where Hot-Plug Hardware Interface (HPI) is
implemented.
SENSE
FN6456.0
Features
• Supports Two Independent PCI Express Slots
• Highest Available Accuracy External RSENSE Current
Monitoring on Main Supplies
• Programmable Current Regulation Pr otect ion F unction for
X1, X4, X8, X16 Connectors
• 12V, 3.3V, and 3.3VAUX Supplies Supported per PCI
Express Specification V1.0A
• Voltage Tolerant I/O SMBus Interface for Slot Power
Control and Status, compatible with SMBus 2.0 Systems
• Programmable Current Regulation D urati on
• Programmable In-rush Current Limiting
• Dual Level Fault Detection for Quick Fault Response
without Nuisance Tripping
• Slot to Slot Electrical and Thermal Isolation
• Two General Purpose Input Pins Suitable for Interface to
Logic and Switches.
• TQFP or QFN Pb-Free Package Options
- TQFP is pin for pin equivalent to MIC2592B-2YTQ and
is compatible with the TPS2363 pinout
- The QFN package is 40% smaller and has lower die to
case thermal impedance than the TQFP
• Pb-Free (RoHS Compliant)
Applications
• PCI Express V1.0A hot-plug power control
• PCI-Express Servers
• Power Supply Distribution and Control
Ordering Information
PART NUMBER
(Note)PART MARKINGTEMP RANGE (°C)
ISL6112IRZAISL6112 IRZ -40 to +8548 Ld 7x7 QFNL48.7x7
ISL61 12I RZA-T*ISL6112 IRZ -40 to +8548 Ld 7x7 QFN Tape and Reel L48.7x7
ISL6112INZAISL6112 INZ -40 to +8548 Ld 7x7 TQFPQ48.7x7
ISL6112INZA-T*ISL6112 INZ -40 to +8548 Ld 7x7 TQFP T ape and Reel Q48.7x7
ISL6112EVAL1ZEvaluation Platform
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
PACKAGE
(Pb-Free)PKG. DWG. #
Copyright Intersil Americas Inc. 2007. All Rights Reserved
Functional Block Diagram (1 Channel)
www.BDTIC.com/Intersil
ISL6112
12VSENSE
12VIN
3VSENSE
3VIN
CFILTER
50mV
50mV
100mV*
100mV*
VSTBY
I
REF
1.25V
ONAUXEN
ON/OFF
/OFF
ON
12V
UVLO
ON/OFF
POWER-ON
RESET
250µs
3V
UVLO
ON/
OFF
VSTBY
UVLO
LOGIC CIRCUITS
DIGITAL CORE/SERIAL INTERFACE
VSTBY
VSTBY
VAUX CHARGE
PUMP AND
MOSFET
VAUX
OVERCURRENT
THERMAL
SHUTDOWN
VAUX
PWRGD
12VIN
3VIN
12V BIAS
ON/OFF
12VPWRGD
3VPWRGD
10.5V
2.8V
12VGATE
VAUX
3VGATE
PWRGD
FAULT
12VOUT
3VOUT
INT
FORCE
_ON
GPI
BOTH A AND B SLOTS SHARE THE SCL, SDA, A0, A1, A2, INT PINS.
2
SCL
40kΩ x 3
GND
A0A1A2SDA
FN6456.0
September 28, 2007
Pinouts
www.BDTIC.com/Intersil
(48 LD 7X7 TQFP)
GND
SCL
SDA
ISL6112
ISL6112
TOP VIEW
ONA
AUXENA
ONB
AUXENB
A0
A1A2GPI_B0
INT
FAULTA
CFILTERA
12VGATEA
GPI_A0
12VINA
PWRGD
12VSENSEA
FORCE_ON
12VOUTA
VSTBYA
3VINA
NC
48 4745 4442 41
1
2
3
4
5
A
6
7
8
A
9
10
11
12
131720
14 15 1618 1923 24
GND
VAUXA
3VOUTA
3VGATEA
3VSENSEA
NCNCNC
40 3937464338
21 22
VAUXB
3VOUTB
B
FAULT
36
35
CFILTERB
34
12VGATEB
GND
33
12VINB
32
PWRGD
31
30
29
28
27
26
25
3VGATEB
3VSENSEB
B
NC
12VSENSEB
FORCE_ON
12VOUTB
VSTBYB
3VINB
B
ISL6112
(48 LD 7X7 QFN)
TOP VIEW
12VGATEA
12VSENSEA
FORCE_ON
3
FAULT
CFILTERA
GPI_A0
12VINA
PWRGD
NC
12VOUTA
VSTBYA
3VINA
ONB
SCL
GND
SDA
48 47 46 45 44 43 42 41 40 39 38 37
1
A
2
3
4
5
6
A
7
8
9
A
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
3VSENSEA
AUXENA
(EXPOSED BOTTOM PAD)
VAUXA
3VOUTA
3VGATEA
ONA
GND
GND
NC
AUXENB
NC
A0
A1A2GPI_B0
NC
3VOUTB
INT
36
FAULTB
35
CFILTERB
34
12VGATEB
33
GND
32
12VINB
31
PWRGD
B
30
NC
29
12VSENSEB
28
FORCE_ON
27
12VOUTB
26
VSTBYB
25
3VINB
VAUXB
3VGATEB
3VSENSEB
B
FN6456.0
September 28, 2007
ISL6112
www.BDTIC.com/Intersil
Pin Descriptions (Pin Numbers and Names are Related)
PIN NUMBERPIN NAMEPIN FUNCTION
5, 32 12VINA, 12VINBProvides 12VMAIN power supply and the high side of the sense resistor inputs. This must be a Kelvin
connection between IC and sense resistor. An undervoltage lockout circuit (UVLO) prevents the switches
from turning on while this input is less than its lockout threshold.
12, 25 3VINA, 3VINBProvides 3.3VMAIN power supply and the high side of the sense resistor inputs. This must be a Kelvin
connection between IC and sense resistor. An undervoltage lockout circuit (UVLO) prevents the switches
from turning on while this input is less than its lockout threshold.
16, 21 3VOUTA, 3VOUTB 3.3VOUT. Connected to 3.3V FET source. These are used to monitor the 3.3V output voltages for Power
Good status.
10, 27 12VOUTA,
12VOUTB
8, 29 12VSENSEA,
12VSENSEB
13, 24 3VSENSEA,
3VSENSEB
3, 34 12VGATEA
12VGATEB
14, 23 3VGATEA
3VGATEB
11, 26 VSTBYA, VSTBYB 3.3V Standby Input V oltage: Required to support PCI Express V AUX output. Additionally , the SMBus logic
15, 22 VAUXA, VAUXB 3.3VAUX Output s to PCI Express Card Slots: These outputs connect the 3.3AUX pin of the PCI Express
44, 43 ONA, ONB Enable Inputs: Rising-edge triggered. Used to enable or disable the MAINA and MAINB (+3.3V and +12V)
45, 42 AUXENA, AUXENB Level sensitive auxiliary enable Inputs. Used to enable or disable the VAUX outputs. Taking AUXEN low
2, 35 CFILTERA,
CFILTERB
6, 31 PWRGDA
PWRGD
12VOUT. Connected to 12V FET drain. These are used to monitor the 3.3V output voltages for Power
Good status.
12VMAIN low side of sense resistor connection. When either current limit threshold of the load current
across the sense resistor = 50mV is reached, the related 12VGATE pin is modulated to maintain a
constant voltage across the sense resistor and thus a constant current into the load. If the 50mV threshold
is exceeded for tFLT, the isolation protection is tripped and the GATE pin for the affected supply’s external
MOSFET is immediately pulled high. This must be a Kelvin connection between IC and sense resistor.
3.3VMAIN low side of sense resistor connection. When either current limit threshold of the load current
across the sense resistor = 50mV is reached, the related 3V GATE pin is modulated to maintain a constant
voltage across the sense resistor and thus a constant current into the load. If the 50mV threshold is
exceeded for tFLT, the isolation protection is tripped and the GATE pin for the affected supply’s external
MOSFET is immediately pulled low. This must be a Kelvin connection between IC and sense resistor.
12V Gate Drive Outputs: Each pin connects to the gate of an external P-Channel MOSFET. During
power-up, the CGATE and the CGS of the MOSFETs are connected to a 25µA current sink. This controls
the value of dv/dt seen at the source of the MOSFETs. During current limit events, the voltage at this pin
is adjusted to maintain constant current through the switch for a period of tFLT. Whenever an overcurrent,
thermal shutdown, or input undervoltage fault condition occurs, the GATE pin for the affected slot is
immediately brought high. These pins are charged by an internal current source during power-down.
3V Gate Drive Outputs: Each pin connects to the gate of an external N-Channel MOSFET. During powerup, the CGATE and the CGS of the MOSFETs are connected to a 25µA current source. This controls the
value of dv/dt seen at the source of the MOSFET s, and hence the current flowing into the load capacitance.
During current limit events, the voltage at this pin is adjusted to maintain constant current through the
switch for a period of tFLT. Whenever an overcurrent, thermal shutdown, or input undervoltage fault
condition occurs, the GATE pin for the af fected slot is immediately brought low . During power-down, these
pins are discharged by an internal current source.
and internal registers run off of VSTBY to ensure that the chip is accessible during standby modes. A
UVLO circuit prevents turn-on of this supply until VSTBY rises above its UVLO threshold. Both pins must
be externally connected together at the ISL6112 controller.
connectors to VSTBY via internal 400mΩ MOSFETs. These outputs are 1A current limited and protected
against short-circuit faults.
outputs. Taking ON low after a fault resets the +12V and/or +3.3V fault latches for the affected slot. Tie
these pins to GND if using SMI power control. Also, see pin description for FAULT
after a fault resets the respective slot’s Aux Output Fault Latch. Tie these pins to GND if using SMI power
control. Also, see pin description for FAULT
Overcurrent Timers: Capacitors connected between these pins and GND set the duration of CR
is the amount of time for which a slot remains in current limit before its isolation protection is
CR
TIM
invoked.
Power-is-Good Outputs: Open-drain, active-low. Asserted when a slot has been commanded to turn on
B
and has successfully begun delivering power to its respective +12V, +3.3V, and VAUX outputs. Each pin
requires an external pull-up resistor to V
A and FAULTB.
.
STBY
A and FAULTB.
TIM
.
4
FN6456.0
September 28, 2007
ISL6112
www.BDTIC.com/Intersil
Pin Descriptions (Pin Numbers and Names are Related) (Continued)
PIN NUMBERPIN NAMEPIN FUNCTION
1, 36 FAULTA, FAULTB Fault Outputs: Open-drain, active-low. Asserted whenever the isolation protection trips due to a fault
9, 28 FORCE_ONA
FORCE_ON
4, 38 GPI_A0, GPI_B0 General Purpose Inputs: The states of these two inputs are available by reading the Common Status
39, 40, 41 A2, A1, A0 SMBus Address Select Pins. Connect to ground or leave open in order to program device SMBus base
48 SDA Bidirectional SMBus data line.
47 SCL SMBus Clock Input.
37 INT
17, 33, 46 GND IC Reference pins. Connect together and tie directly to the system’s analog GND plane directly at the
7, 18, 19, 20, 30 NC Reserved: Make no external connections to these pins.
Interrupt Output. Open-drain, active-low. output. Asserted whenever a power fault is detected if the
condition (overcurrent, input undervoltage, over-temperature). Each pin requires an external pull-up
resistor to V
fault condition on one of the slot’s MAIN outputs (+12V or +3.3V). FAULT
AUXEN pin low if FAULT
condition occurred on both the MAIN and VAUX output s of the same slot, then both ON and AUXEN must
be brought low to de-assert the FAULT
Enable Inputs: Active-low, level-sensitive. Asserting a FORCE_ON
B
respective slot’s outputs (+12V, +3.3V, and VAUX), while specifically defeating all protections on those
supplies. This explicitly includes all overcurrent and short circuit protections, and on-chip thermal
protection for the VAUX supplies. Additionally included are the UVLO protections for the +3.3V and
+12VMAIN supplies. The FORCE_ON
input pins are intended for diagnostic purposes only. Asserting FORCE_ON
PWRGD
reflect the actual state of each slot’s supplies. There is a pair of register bits, accessible via the SMBus,
which can be set to disable (unconditionally de-assert) either or both of the FORCE_ON
CNTRL Register Bit D[2].
Register, Bits [4:5]. If not used, connect each pin to GND.
address. These inputs have internal pull-up resistors to VSTBY. Address programmed on rising VSTBY.
INTMSK bit (CS Register Bit D[3]) is a logical “0”. This output is cleared by performing an “echo reset” to
the appropriate fault bit(s) in the STAT and/or CS registers. This pin requires an external pull-up resistor
to VSTBY.
device.
. Bringing the slot’s ON pin low resets FAULT if FAULT was asserted in response to a
STBY
was asserted in response to a fault condition on the slot’s VAUX output. If a fault
output.
pins do not disable UVLO protection for the VAUX supplies. These
and FAUL T pins to enter their open-drain state. Note that the SMBus register set will continue to
is reset by bringing the slot’s
input will turn on all three of the
will cause the respective slot’s
pins -- See
5
FN6456.0
September 28, 2007
ISL6112
www.BDTIC.com/Intersil
Absolute Maximum Ratings (Note 4)Thermal Information
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
2. θ
JA
Tech Brief TB379.
3. For θ
4. All voltages are relative to GND, unless otherwise specified.
, the “case temp” location is the center of the exposed metal pad on the package underside.
Supply Current ICC12HPI Enabled or SMI enabled with no load0.91.5mA
ICC3.3 0.10.2mA
ICCSTBY56mA
Undervoltage Lockout Thresholds VUVLO(12V) 12VIN increasing8 9 10 V
VUVLO(3V)3VIN increasing2.12.5 2.75V
VUVLO(STBY) VSTBY increasing2.82.92.96V
Undervoltage Lockout Hysteresis
12VIN, 3VIN
Undervoltage Lockout Hysteresis
VSTBY
Power-Good Undervoltage
Thresholds
Power-Good Detect Hysteresis VHYSPG 30 mV
12VGATE Voltage VGATE (12V) Max. Gate Voltage when Enabled0 0.40.55 V
12VGATE Sink Current IGATE(12VSINK) Start Cycle 172535µA
12VGATE Pull-up Current (Fault Off) IGATE
3VGATE Voltage VGATE(3V) Minimum Gate Voltage when Enabled12VIN – 0.3 12VIN – 0.2 12VIN V
3VGATE Charge Current IGATE
3VGATE Sink Current (Fault Off) IGATE(3VSINK) Any fault condition
CFILTER OVERCURRENT DELAY TIME PINS 2 AND 35 FLOATING
CFILTER Threshold Voltage VFILTER 1.20 1.25 1.30 V
CFILTER Charging Current
Nominal Current Limit Duration =
C
CFILTER
Current Limit Threshold Voltages VTHILIMIT VXIN – VXVSENSE 47.55052.5mV
Fast-Trip Threshold Voltages VTHFAST VXVIN – VXVSENSE85100115mV
XVSENSE Input Current ISENSE 0.1µA
LOW-Level Input Voltage ON,
AUXEN, GPI, FORCE_ON
Output LOW Voltage FAULT
PWRGD
HIGH-Level Input Voltage ON,
AUXEN, GPI, FORCE_ON
Internal Pull-ups to VSTBY (Note 5)RPULL-UP4050kΩ
12VIN, 3VIN Input Leakage Current ILKG,OFF XVIN VSTBY = +3.3V, 12VIN = OFF; 3VIN = OFF 0.51µA
Input Leakage Current, ON, AUXEN,
FORCE_ON
Off-State Leakage Current FAULT
PWRGD
Over-temperature Shutdown and
Reset Thresholds, with Overcurrent
On Slot
Over-temperature Shutdown and
Reset Thresholds, All Other
Conditions (All Outputs Will Latch Off)
Output MOSFET Resistance VAUX
MOSFET
Off-St ate Output Offset Voltage V AUX VOFF(V AUX) VAUX = Off2540mV
Regulated Current LevelILIM(AUX) 0.811.2A
Output Discharge ResistanceRDIS(12V)12VOUT = 6.0V 14001850Ω
12V Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
3.3V Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
VAUX Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
Delay from MAIN Overcurrent to
FAULT
Delay from VAUX Overcurrent to
FAULT
ON, AUXEN, PRSNT
Width
Power-On Reset Time after VSTBY
Becomes Valid
x 550k
, PRSNT
,
,
, GPI
Output
Output
Minimum Pulse
IFILTER VXVIN – VXSENSE > VTHILIMIT2 2.5 3µA
tFILTER CFILTER Open10µs
VIL 0.8V
VOL IOL = 3mA 0.4V
VIH 2.1.5V
IIL -2 2µA
ILKG(OFF) GPI ILKG for these two pins measured with
TOV T
(AUX) IDS = 375mA350mΩ
r
DS
RDIS(3V)3VOUT = 1.65V 140180Ω
RDIS(VAUX)3VAUX = 1.65V350400Ω
tOFF(12V) CGATE = 25pF
tOFF(3V) CGATE = 25pF
tSC VAUX = 0V, VSTBY = +3.3V 2.5 µs
tPROP
(12V FAUL T or 3V
FAULT)
tPROP
(VAUXFAULT)
tW (Note 5)100 ns
tPOR (Note 5)250 µs
VAUX OFF
increasing, each slot (Note 5) 140°C
J
decreasing, each slot (Note 5)130°C
T
J
increasing, each slot (Note 5)160°C
T
J
T
decreasing, each slot (Note 5) 150°C
J
VIN – VSENSE = 140mV
VIN – VSENSE = 140mV
CFILTER = 0
VIN – VSENSE = 140mV
I
LIM(AUX)
VAUX Output Grounded
to FAULT output CFILTER = 0
= TJ = -40°C to +85°C, Unless Otherwise Noted. (Continued)
SCL (clock) period t1 (Note 5)2.5 µs
Data In setup time to SCL HIGH t2 (Note 5)100 ns
Data Out stable after SCL LOW t3 (Note 5)300 ns
Data LOW setup time to SCL LOW t4 (Note 5)100 ns
Data HIGH hold time after SCL HIGH t5 (Note 5)100 ns
NOTE:
5. Limits established by design and are not production tested.
= TJ = -40°C to +85°C, Unless Otherwise Noted. (Continued)
A
8
FN6456.0
September 28, 2007
Typical Application Diagram
www.BDTIC.com/Intersil
ISL6112
FORCE_ONA
FORCE_ON
GPI_A0
GPI_B0
SMBUS I/O
100k100k100k100k
B
AUXENA
AUXENB
HOT-PLUG
CONTROLLER
PWRGDA
PWRGDB
SMBUS
BASE
ADDRESS
SYSTEM
POWER
SUPPLY
V
ONA
ONB
FAULTA
FAULTB
10k x 3
SDA
SCL
INT
STBY
+12V
+3.3V
VSTBY
V
V
VSTBY
C1
STBY
STBY
C2
10k x 4
10k x 4
0.1µF
2
CFILTERA
35
CFILTERB
9
FORCE_ON
28
FORCE_ON
4
GPI_A0
38
GPI_B0
45
AUXENA
42
AUXENB
44
ONA
43
ONB
6
PWRGD
31
PWRGD
1
FAULT
36
FAULTB
41
A0
40
A1
39
A2
37
INT
47
SCL
48
SDA
SDA
SCL
INT
1126
VSTBYBVSTBYAVAUXA
12VSENSEA
12VGATEA
A
B
3VSENSEA
ISL6112
12VSENSEB
12VGATEB
A
B
A
MANAGEMENT
CONTROLLER
3VSENSEB
0.1µF
12VINA
12VOUTA
3VINA
3VGATEA
3VOUTA
12VINB
12VOUTB
3VINB
3VGATEB
3VOUTB
VAUXB
GND
GND
GND
PCI-EXPRESS CONNECTOR
15
0.1µF
5
8
#CGS
*R12VGATEA
22nF
3
#CGD
6800pF
10
12
13
14
16
#
C
GATE
22nF
32
29
#CGS
22nF
34
27
25
24
23
21
22
17
33
46
* Values for R
depending upon the C
# These components are not required for ISL6112
operation but can be implemented for GATE output
slew rate control (application specific)
• Bold lines indicate high current paths
^ R
15Ω
0.1µF
*R3VGATEA
15Ω
0.1µF
*R12VGATEB
15Ω
#
CGD
6800pF
0.1µF
*R3VGATEB
15Ω
#CGATE
22nF
12VGATE
value is application specific
SENSE
RSENSE^
RSENSE^
0.015Ω
RSENSE^
RSENSE^
0.015Ω
PCI-EXPRESS CONNECTOR
and R
GS
may vary
3VGATE
of the external MOSFETs.
PCI
EXPRESS
BUS
3.3AUX
375mA
12V
2.1A (x4/x8)
3.3V
3.0A
12V
2.1A (x4/x8)
3.3V
3.0A
3.3AUX
375mA
PCI
EXPRESS
DATA BUS
9
FN6456.0
September 28, 2007
ISL6112
www.BDTIC.com/Intersil
Functional Description
The ISL6112 protects the power supplies in PCI-Express
systems that utilize hot-pluggable add-in cards. This IC
together with two each of N-Channel and P-Channel
MOSFETs, four current sense resistors and a few external
passive components, provide a compliant hot plug power
control solution to any combination of two PCI-Express X1,
X4, X8 or X16 slots.
The ISL6112 primarily features start-up in-rush current
protection, maximum current regulated (CR) levels for each
of the MAIN and AUX outputs, programmable CR duration
so that both fault isolation protection and imperviousness to
electrical transients are provided. The ISL6112 also offers
input and output voltage supervisory functions and two
operational system interfaces for implementation flexibility.
In-Rush Current Protection
When any electronic circuitry is powered up, there is an
in-rush of current due to the charging of bulk capacitance
that resides across the circuit board’s supply pins. This
transient in-rush current may cause the systems supply
voltages to temporarily droop out of regulation, causing data
loss or system lock-up. The ISL6112 addresses these iss ues
by limiting the in-rush currents to the PCI-Express add-in
cards, and thereby controlling the rate at which the loads
circuits turn-on. See Figures 2, 3, 4, 5, 6 and 7 for AUX and
MAIN turn-on examples illustrating the current limiting
capabilities across a variety of compensation component
values.
MAIN Supply Overcurrent Protection
For each of the 3VMAIN and 12VMAIN supplies, the current
regulated (CR) levels are set by a sub ohm value sense
resistor. The value for the 12VMAIN is dependant on the size
of the PCI-Express connector (X1, X4/X8 or X16) to be
powered. The voltage across this resistor is compared to a
50mV internal reference providing a nominal CR protection
level which would be set above the maximum specified slot
limits. The 3.3VMAIN supply can use a 15mΩ sense resistor
compared to a 50mV reference to provide a nominal
regulated current limit of 3.3A, as this supply has a common
3A maximum across all slot sizes. For both MAIN supplies,
there is a Way Overcurrent (WOC) shutdown protocol that is
without a CR duration. WOC is invoked if the load current
causes the RSENSE voltage to be >100mV. See Figures 10
and 11.
VAUX Supply Overcurrent Protection
The VAUX load current is internally monitored and controlled
via an internal power FET. This FET has a typical r
320mW at a VAUX current of 375mA to minimize distribution
losses to typically <100mV through the IC. Using active
monitoring and control, the ISL6112 provides nominal
limiting to ~1000mA of load current across the temperature
range and for various loading conditions. See Figures 2, 12
and 13 for examples of this performance.
DS(ON)
of
Current Regulation (CR) Duration
The CR duration for each slot is set by an external capacitor
between the associated CFILTER pin and ground. This
feature masks current transients and overcurrents prior to
supply turn-off. Once the CR duration has expired, the IC
then quickly turns-off the associated MAIN outputs via its
external FET s or the failed AUX output, unloading the faulted
load card from the supply voltage rails.
UVLO, Power Good and FAULT
The ISL6112 incorporates undervoltage lock out (UVLO)
protections on each of the four MAIN VIN and two VSTBY
supplies to prevent operation during a ‘brown out’ condition.
Likewise on the outputs are minimum voltage compliances
that must be satisfied for the Power Good output, PWRGD to
be asserted. There is some hysteresis on the UVLO levels
as the voltage on VIN decreases to ensure IC operation
below the minimum operating supply standards. The FAULT
output is asserted (low) whenever there is an OC, OT or UV
condition. The FAUL T
is deasserted.
is cleared once the appropriate enable
Operational System Interfaces
The ISL6112 employs two system interfaces: the hardware
Hot-Plug Interface (HPI) and the System Management
Interface (SMI). The HPI I/O includes ON, AUXEN, FAULT
and PWRGD
whose signals conform to the levels and timing of the SMBus
specification; see “SMI only Control Applications” on
page 17 The ISL6112 can be operated exclusively from
either the SMI or HPI, or can employ the HPl for power
control while continuing to use the SMI for access to all but
the power control registers.
In addition to the basic power control features of the ISL6112
accessible by the HPI, the SMI also gives the host access to
the following information from the part:
• Fault conditions occurring on each supply. These faults
include Overcurrent, Over-Temperature and undervoltage
• GPI pin status when using the System
When using the System Management Interface for power
control, do not use the Hot-Plug Interface. Conversely, when
using the Hot-Plug Interface for power control, do not execute
power control commands over the System Management
Interface bus (all other register accesses via the SMI bus
remain permissible while in the HPI control mode). When
utilizing the SMI exclusively, the HPI input pins (ON, AUXEN,
and FORCE_ON
(disabling HPI when SMI control is used). This configuration
safeguards the power slots in the event that the SMBus
communication link is disconnected for any reason.
Additionally, when utilizing the HPI exclusively, the SMBus
(or SMI) will be inactive if the input pins (SDA, SCL, A0, A1,
and A2) are configured as shown in Figure 1.
]; the SMI I/O consists of SDA, SCL, and INT,
) should be configured, as shown in Figure 1
10
FN6456.0
September 28, 2007
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