The HI5660 is an 8-bit, 125MSPS, high speed, low power,
D/A converter which is implemented in an advanced CMOS
process. Operating from a single +3V to +5V supply, the
converter provides 20mA of full scale output current and
includes edge-triggered CMOS input data latches. Low glitch
energy and excellent frequency domain performance are
achieved using a segmented current source architecture.
For an equivalent performance dual version, see the HI5628.
This device complements the HI5X60 family of high speed
converters offered by Intersil, which includes 8, 10, 12, and
14-bit devices.
Ordering Information
TEMP.
PART
NUMBER
HI5660IB-40 to 85 28 Ld SOICM28.3125MHz
HI5660IBZ (Note) -40 to 85 28 Ld SOIC
HI5660/6IA-40 to 85 28 Ld TSSOPM28.173 60MHz
HI5660/6IA-T28 Ld TSSOP Tape and Reel M28.173 60MHz
HI5660/6IAZ (Note) -40 to 85 28 Ld TSSOP
HI5660/6IAZ-T
(Note)
HI5760EVAL125Evaluation Platform125MHz
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which is compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J Std-020B.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
= Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued)
REF
T
= -40oC TO 85oC
A
UNITSMINTYPMAX
TIMING CHARACTERISTICS
Data Setup Time, t
Data Hold Time, t
SU
HLD
Propagation Delay Time, t
CLK Pulse Width, t
PW1
, t
PD
PW2
See Figure 3 (Note 3)3--ns
See Figure 3 (Note 3)3--ns
See Figure 3-1-ns
See Figure 3 (Note 3)4--ns
POWER SUPPLY CHARACTERISTICS
AVDD Power Supply(Note 8, 9)2.75.05.5V
DVDD Power Supply(Note 8, 9)2.75.05.5V
Analog Supply Current (I
)5V or 3V, IOUTFS = 20mA-2330mA
AVD D
5V or 3V, IOUTFS = 2mA-4-mA
Digital Supply Current (I
)5V, IOUTFS = Don’t Care (Note 5)-35mA
DVDD
3V, IOUTFS = Don’t Care (Note 5)-1.5-mA
Supply Current (I
) Sleep Mode5V or 3V, IOUTFS = Don’t Care-1.63mA
AVD D
Power Dissipation5V, IOUTFS = 20mA (Note 6)-165-mW
5V, IOUTFS = 20mA (Note 10)-150-mW
5V, IOUTFS = 2mA (Note 6)-70-mW
3.3V, IOUTFS = 20mA (Note 10)-75-mW
3V, IOUTFS = 20mA (Note 6)-85-mW
3V, IOUTFS = 20mA (Note 10)-67-mW
3V, IOUTFS = 2mA (Note 6)-27-mW
Power Supply Rejection Single Supply (Note 7)-0.2-+0.2% FSR/V
NOTES:
2. Gain Error measured as the error in the ratio between the full scale output current and the current through R
ratio should be 32.
(typically 625µA). Ideally the
SET
3. Parameter guaranteed by design or characterization and not production tested.
4. Spectral measurements made with differential transformer coupled output and no external filtering.
5. Measured with the clock at 50MSPS and the output frequency at 1MHz.
6. Measured with the clock at 100MSPS and the output frequency at 40MHz.
7. See ‘Definition of Specifications’.
8. It is recommended that the output current be reduced to 12mA or less to maintain optimum performance for operation below 3V. DVDD and AVDD
do not have to be equal
.
9. For operation above 125MHz, it is recommended that the power supply be 3.3V or greater. The part is functional with the clock above 125MSPS
and the power supply below 3.3V, but performance is degraded.
10. Measured with the clock at 60MSPS and the output frequency at 10MHz.
5
Timing Diagrams
HI5660
CLK
D7-D0
I
OUT
t
SETT
t
PD
FIGURE 1. OUTPUT SETTLING TIME DIAGRAM
50%
1
/2 LSB ERROR BAND
t
PW1
t
PW2
1
V
GLITCH AREA =
HEIGHT (H)
WIDTH (W)
/2 (H x W)
t(ps)
FIGURE 2. PEAK GLITCH AREA (SINGLET) MEASUREMENT
METHOD
CLK
D7-D0
I
OUT
t
SU
t
HLD
t
t
PD
SETT
t
SU
t
HLD
t
t
PD
SETT
t
SU
t
HLD
t
t
PD
SETT
FIGURE 3. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM
50%
6
HI5660
Definition of Specifications
Integral Linearity Error, INL, is the measure of the worst
case point that deviates from a best fit straight line of data
values along the transfer curve.
Differential Linearity Error, DNL, is the measure of the
step size output deviation from code to code. Ideally the step
size should be 1 LSB. A DNL specification of 1 LSB or less
guarantees monotonicity.
Output Settling Time, is the time required for the output
voltage to settle to within a specified error band measured
from the beginning of the output transition. In the case of the
HI5660, the measurement was done by switching from code
0 to 64, or quarter scale. Termination impedance was 25
due to the parallel resistance of the output 50
oscilloscope’s 50
Ω input. This also aids the ability to resolve
Ω and the
the specified error band without overdriving the oscilloscope.
Singlet Glitch Area, is the switching transient appearing on
the output during a code transition. It is measured as the
area under the overshoot portion of the curve and is
expressed as a Volt-Time specification.
Full Scale Gain Error , is the error from an ideal ratio of 32
between the output current and the full scale adjust current
(through R
SET
).
Full Scale Gain Drift, is measured by setting the data inputs
to all ones and measuring the output voltage through a
known resistance as the temperature is varied from T
T
. It is defined as the maximum deviation from the value
MAX
measured at room temperature to the value measured at
either T
MIN
or
. The units are ppm of FSR (full scale
MAX
range) per degree C.
Total Harmonic Distortion, THD, is the ratio of the DAC output
fundamental to the RMS sum of the first five harmonics.
Spurious Free Dynamic Range, SFDR, is the amplitude
difference from the fundamental to the largest harmonically or
non-harmonically related spur within the specified window.
Output Voltage Compliance Range, is the voltage limit
imposed on the output. The output impedance load should
be chosen such that the voltage developed does not violate
the compliance range.
Offset Error, is measured by setting the data inputs to all
zeros and measuring the output voltage through a known
resistance. Offset error is defined as the maximum deviation
of the output current from a value of 0mA.
Offset Drift, is measured by setting the data inputs to all
zeros and measuring the output voltage through a known
resistance as the temperature is varied from T
MIN
is defined as the maximum deviation from the value
measured at room temperature to the value measured at
either T
MIN
or T
. The units are ppm of FSR (full scale
MAX
range) per degree C.
to
MIN
MAX
Ω
to
. It
Power Supply Rejection, is measured using a single power
supply. Its nominal +5V is varied
±10% and the change in the
DAC full scale output is noted.
Reference Input Multiplying Bandwidth, is defined as the
3dB bandwidth of the voltage reference input. It is measured
by using a sinusoidal waveform as the external reference
with the digital inputs set to all 1s. The frequency is
increased until the amplitude of the output waveform is
0.707 of its original value.
Internal Reference Voltage Drift, is defined as the
maximum deviation from the value measured at room
temperature to the value measured at either T
MIN
or T
MAX
The units are ppm per degree C.
Detailed Description
The HI5660 is an 8-bit, current out, CMOS, digital to analog
converter. Its maximum update rate is 125MSPS and can be
powered by either single or dual power supplies in the
recommended range of +3V to +5V. It consumes less than
165mW of power when using a +5V supply with the data
switching at 100MSPS. The architecture is based on a
segmented current source arrangement that reduces glitch
by reducing the amount of current switching at any one time.
The five MSBs are represented by 31 major current sources
of equivalent current. The three LSBs are comprised of
binary weighted current sources. Consider an input pattern
to the converter which ramps through all the codes from 0 to
255. The three LSB current sources would begin to count up.
When they reached the all high state (decimal value of 7)
and needed to count to the next code, they would all turn off
and the first major current source would turn on. To continue
counting upward, the 3 LSBs would count up another 7
codes, and then the next major current source would turn on
and the three LSBs would all turn off. The process of the
single, equivalent, major current source turning on and the
three LSBs turning off each time the converter reaches
another 7 codes greatly reduces the glitch at any one
switching point. In previous architectures that contained all
binary weighted current sources or a binary weighted
resistor ladder, the converter might have a substantially
larger amount of current turning on and off at certain, worstcase transition points such as midscale and quarter scale
transitions. By greatly reducing the amount of current
switching at certain ‘major’ transitions, the overall glitch of
the converter is dramatically reduced, improving settling
times and transient problems.
Digital Inputs and Termination
The HI5660 digital inputs are guaranteed to CMOS levels.
However, TTL compatibility can be achieved by lowering the
supply voltage to 3V due to the digital threshold of the input
buffer being approximately half of the supply voltage. The
internal register is updated on the rising edge of the clock. To
minimize reflections, proper termination should be
implemented. If the lines driving the clock and the digital
.
7
HI5660
inputs are 50Ω lines, then 50Ω termination resistors should
be placed as close to the converter inputs as possible
connected to the digital ground plane (if separate grounds
are used).
Ground Plane(s)
If separate digital and analog ground planes are used, then
all of the digital functions of the device and their
corresponding components should be over the digital ground
plane and terminated to the digital ground plane. The same
is true for the analog components and the analog ground
plane.
Noise Reduction
To minimize power supply noise, 0.1µF capacitors should
be placed as close as possible to the converter’s power
supply pins, AV
and DVDD . Also, should the layout be
DD
designed using separate digital and analog ground planes,
these capacitors should be terminated to the digital ground
for DV
and to the analog ground for AVDD . Additional
DD
filtering of the power supplies on the board is
recommended.
Voltage Reference
The internal voltage reference of the device has a nominal
value of +1.2V with a ±
full temperature range of the converter. It is recommended
that a 0.1µF capacitor be placed as close as possible to the
REFIO pin, connected to the analog ground. The REFLO
pin (16) selects the reference. The internal reference can
be selected if pin 16 is tied low (ground). If an external
reference is desired, then pin 16 should be tied high (to the
analog supply voltage) and the external reference driven
into REFIO, pin 17. The full scale output current of the
converter is a function of the voltage reference used and
the value of R
SET
range, through operation below 2mA is possible, with
performance degradation.
60 ppm / oC drift coefficient over the
. I
should be within the 2mA to 20mA
OUT
Outputs
IOUTA and IOUTB are complementary current outputs. The
sum of the two currents is always equal to the full scale
output current minus one LSB. If single ended use is
desired, a load resistor can be used to convert the output
current to a voltage. It is recommended that the unused
output be either grounded or equally terminated. The voltage
developed at the output must not violate the output voltage
compliance range of -0.3V to 1.25V. R
chosen so that the desired output voltage is produced in
conjunction with the output full scale current, which is
described above in the ‘Reference’ section. If a known line
impedance is to be driven, then the output load resistor
should be chosen to match this impedance. The output
voltage equation is:
V
= I
OUT
OUT
X R
LOAD
.
These outputs can be used in a differential-to-single-ended
arrangement to achieve better harmonic rejection. The
SFDR measurements in this data sheet were performed with
a 1:1 transformer on the output of the DAC (see Figure 1).
With the center tap grounded, the output swing of pins 21
and 22 will be biased at zero volts. It is important to note
here that the negative voltage output compliance range limit
is -300mV, imposing a maximum of 600mV
with this configuration. The loading as shown in Figure 1 will
result in a 500mV signal at the output of the transformer if
the full scale output current of the DAC is set to 20mA.
50Ω
100Ω
50Ω
PIN 21
PIN 22
HI5660
IOUTB
IOUTA
LOAD
V
OUT
50Ω
should be
amplitude
P-P
= (2 x I
OUT
x REQ)V
If the internal reference is used, V
FSADJ
will equal
approximately 1.16V (pin 18). If an external reference is
used, V
calculation for I
I
(Full Scale) = (V
OUT
will equal the external reference. The
FSADJ
(full scale) is:
OUT
FSADJ/RSET
) x 32.
If the full scale output current is set to 20mA by using the
internal voltage reference (1.16V) and a 1.86kΩ R
SET
resistor, then the input coding to output current will resemble
the following:
TABLE 1. INPUT CODING vs OUTPUT CURRENT
INPUT CODE (D7-D0)IOUTA (mA)IOUTB (mA)
1111 1111200
1000 00001010
0000 0000020
8
V
OUT
= 2 x I
FIGURE 4.
x REQ, where REQ is ~12.5Ω.
OUT
HI5660
Pin Descriptions
PIN NO.PIN NAMEPIN DESCRIPTION
1-8D7 (MSB) Through
D0 (LSB)
9-14DCOMConnect to digital ground.
15SLEEPControl Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep
16REFLOConnect to analog ground to enable internal 1.2V reference or connect to AVDD to disable internal
17REFIOReference voltage input if internal reference is disabled. Reference voltage output if internal reference is
18FSADJFull Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output
19COMP1For use in reducing bandwidth/noise. Recommended: connect 0.1µF to AVDD .
20ACOMAnalog Ground.
21IOUTBThe complimentary current output of the device. Full scale output current is achieved when all input bits
22IOUTACurrent output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23NCInternally connected to ACOM via a resistor. Recommend leave disconnected. Adding a capacitor to
24AV
25NCNo Connect (for upward compatibility to 12 and 14b, pin 25 needs to be grounded to ACOM).
26DCOMDigital Ground.
27DV
28CLKInput for clock. Positive edge of clock latches data.
DD
DD
Digital Data Bit 7 (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).
pin has internal 20µA active pulldown current.
reference.
enabled. Use 0.1µF cap to ground when internal reference is enabled.
Current = 32 x V
are set to binary 0.
ACOM for upward compatibility is valid. Grounding to ACOM is valid. (For upward compatibility to 12-bit
and 14-bit devices, pin 23 needs the ability to have a 0.1µF capacitor to ACOM.)
Analog Supply (+3V to +5V).
Digital Supply (+3V to +5V).
FSADJ/RSET
.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
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