Datasheet HI5660IBZ Datasheet (intersil)

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HI5660
Data Sheet July 2004
8-Bit, 125/60MSPS, High Speed D/A Converter
The HI5660 is an 8-bit, 125MSPS, high speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. For an equivalent performance dual version, see the HI5628.
This device complements the HI5X60 family of high speed converters offered by Intersil, which includes 8, 10, 12, and 14-bit devices.
Ordering Information
TEMP.
PART
NUMBER
HI5660IB -40 to 85 28 Ld SOIC M28.3 125MHz
HI5660IBZ (Note) -40 to 85 28 Ld SOIC
HI5660/6IA -40 to 85 28 Ld TSSOP M28.173 60MHz
HI5660/6IA-T 28 Ld TSSOP Tape and Reel M28.173 60MHz
HI5660/6IAZ (Note) -40 to 85 28 Ld TSSOP
HI5660/6IAZ-T (Note)
HI5760EVAL1 25 Evaluation Platform 125MHz
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
RANGE
(°C)
28 Ld TSSOP Tape and Reel (Pb-free)
PACKAGE
(Pb-free)
(Pb-free)
PKG.
DWG. #
M28.3 125MHz
M28.173 60MHz
M28.173 60MHz
CLOCK SPEED
FN4521.7
Features
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . .125MSPS
• Low Power . . . . . . . . . . . . . . . 165mW at 5V, 27mW at 3V
• Power Down Mode . . . . . . . . . . 23mW at 5V, 10mW at 3V
• Integral Linearity Error . . . . . . . . . . . . . . . . . . . ±0.25 LSB
• Adjustable Full Scale Output Current. . . . . 2mA to 20mA
• SFDR to Nyquist at 10MHz Output . . . . . . . . . . . . . 60dBc
• Internal 1.2V Bandgap Voltage Reference
• Single Power Supply from +5V to +3V
• CMOS Compatible Inputs
• Excellent Spurious Free Dynamic Range
• Pb-free Available
Applications
• Medical Instrumentation
• Wireless Communications
• Direct Digital Frequency Synthesis
• Signal Reconstruction
• Test Instrumentation
• High Resolution Imaging Systems
• Arbitrary Waveform Generators
Pinout
HI5660 (SOIC, TSSOP)
TOP VIEW
D7 (MSB)
D0 (LSB)
D6
D5
D4
D3
D2
D1
DCOM
DCOM
DCOM
DCOM
DCOM
DCOM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CLK
DV
DD
DCOM
NC
AV
DD
NC
IOUTA
IOUTB
ACOM
COMP1
FSADJ
REFIO
REFLO
SLEEP
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
Typical Applications Circuit
HI5660
HI5660
10µF
50
FERRITE
BEAD
+
DCOM
10µH
D7 D6 D5 D4 D3 D2 D1
D0
0.1µF
(9-14, 25)
D7 (MSB) (1) D6 (2) D5 (3) D4 (4) D3 (5) D2 (6) D1 (7) D0 (LSB) (8)
CLK (28)
DCOM (26)
DVDD (27)
(15) SLEEP (16) REFLO
(17) REFIO
(18) FSADJ
(22) IOUTA
(21) IOUTB
(23) NC
(19) COMP1
(20) ACOM
(24) AV
DD
DCOM
ACOM
0.1µF
D/A OUT
D/A OUT
R
SET
+5V OR +3V (V
+
10µF
1.91k
DD
)
50
50
0.1µF FERRITE
BEAD
10µH
0.1µF
Functional Block Diagram
(LSB) D0
D1
D2
D3
D4
D5
D6
(MSB) D7
CLK
LATCH
UPPER
5-BIT
DECODER
IOUTA IOUTB
CASCODE CURRENT
SOURCE
34
SWITCH MATRIX
LATCH
31
INT/EXT
REFERENCE
SELECT
INT/EXT
VOLTAGE
REFERENCE
34
SEGMENTS
GENERATION
3 LSBs
+
31 MSB
COMP1
BIAS
AV
DD
ACOM DV
FSADJ
DD
DCOM
REFLO
REFIO
SLEEP
2
HI5660
Absolute Maximum Ratings Thermal Information
Digital Supply Voltage DVDD to DCOM . . . . . . . . . . . . . . . . . +5.5V
Analog Supply Voltage AVDD to ACOM. . . . . . . . . . . . . . . . . . +5.5V
Grounds, ACOM TO DCOM . -0.3V To +0.3V Digital Input Voltages
(D9-D0, CLK, SLEEP) . . . . . . . . . . . . . . . . . . . . . . . . . DV
Internal Reference Output Current. . . . . . . . . . . . . . . . . . . . . ±50µA
Reference Input Voltage Range. . . . . . . . . . . . . . . . . . AV
Analog Output Current (I
) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA
OUT
DD
DD
+ 0.3V
+ 0.3V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Thermal Resistance (Typical, Note 1) θJA(oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
Electrical Specifications AV
PARAMETER TEST CONDITIONS
SYSTEM PERFORMANCE
Resolution 8 - - Bits
Integral Linearity Error, INL “Best Fit” Straight Line (Note 7) -0.5 ±0.25 +0.5 LSB
Differential Linearity Error, DNL (Note 7) -0.5 ±0.25 +0.5 LSB
Offset Error, IOS (Note 7) -0.025 +0.025 % FSR
Offset Drift Coefficient (Note 7) - 0.1 - ppm
Full Scale Gain Error, FSE With External Reference (Notes 2, 7) -10 ±2 +10 % FSR
Full Scale Gain Drift With External Reference (Note 7) - ±50 - ppm
Full Scale Output Current, I
Output Voltage Compliance Range (Note 3) -0.3 - 1.25 V
DYNAMIC CHARACTERISTICS
Maximum Clock Rate, f
Output Settling Time, (t
Singlet Glitch Area (Peak Glitch) RL = 25(Note 7) - 5 - pV•s
Output Rise Time Full Scale Step - 1.5 - ns
Output Fall Time Full Scale Step - 1.5 - ns
Output Capacitance 10 pF
Output Noise IOUTFS = 20mA - 50 - pA/ √Hz
FS
CLK
) 0.8% (±1 LSB, equivalent to 7 Bits) (Note 7) - 5 - ns
SETT
= DVDD = +5V, V
DD
With Internal Reference (Notes 2, 7) -10 ±1 +10 % FSR
With Internal Reference (Note 7) - ±100 - ppm
(Notes 3, 9) 125 - - MHz
0.4% (±1/2 LSB, equivalent to 8 Bits) (Note 7) - 15 - ns
IOUTFS = 2mA - 30 - pA/ √Hz
= Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values
REF
TA = -40oC TO 85oC
2 - 20 mA
UNITSMIN TYP MAX
FSR/
FSR/
FSR/
o
C
o
C
o
C
3
HI5660
Electrical Specifications AV
PARAMETER TEST CONDITIONS
= DVDD = +5V, V
DD
= Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued)
REF
T
= -40oC TO 85oC
A
UNITSMIN TYP MAX
AC CHARACTERISTICS HI5660IB, HI5660IA - 125MHz
Spurious Free Dynamic Range, SFDR Within a Window
Total Harmonic Distortion (THD) to Nyquist
Spurious Free Dynamic Range, SFDR to Nyquist
f
= 125MSPS, f
CLK
f
= 100MSPS, f
CLK
f
= 100MSPS, f
CLK
f
= 125MSPS, f
CLK
f
= 125MSPS, f
CLK
f
= 100MSPS, f
CLK
f
= 100MSPS, f
CLK
f
= 100MSPS, f
CLK
f
= 100MSPS, f
CLK
= 32.9MHz, 10MHz Span (Notes 4, 7) - 70 - dBc
OUT
= 5.04MHz, 4MHz Span (Notes 4, 7) - 73 - dBc
OUT
= 2.00MHz (Notes 4, 7) - 67 - dBc
OUT
= 32.9MHz, 62.5MHz Span (Notes 4, 7) - 51 - dBc
OUT
= 10.1MHz, 62.5MHz Span (Notes 4, 7) - 61 - dBc
OUT
= 40.4MHz, 50MHz Span (Notes 4, 7) - 48 - dBc
OUT
= 20.2MHz, 50MHz Span (Notes 4, 7) - 56 - dBc
OUT
= 5.04MHz, 50MHz Span (Notes 4, 7) - 68 - dBc
OUT
= 2.51MHz, 50MHz Span (Notes 4, 7) - 68 - dBc
OUT
AC CHARACTERISTICS HI5660/6IA - 60MHz
Spurious Free Dynamic Range, SFDR Within a Window
Total Harmonic Distortion (THD) to Nyquist
Spurious Free Dynamic Range, SFDR to Nyquist
f
= 60MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 60MSPS, f
CLK
f
= 60MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 50MSPS, f
CLK
f
= 25MSPS, f
CLK
= 10.1MHz, 10MHz Span (Notes 4, 7) - 62 - dBc
OUT
= 5.02MHz, 2MHz Span (Notes 4, 7) - 73 - dBc
OUT
= 1.00MHz, 2MHz Span (Notes 4, 7) - 74 - dBc
OUT
= 2.00MHz (Notes 4, 7) - 67 - dBc
OUT
= 1.00MHz (Notes 4, 7) - 68 - dBc
OUT
= 20.2MHz, 30MHz Span (Notes 4, 7) - 54 - dBc
OUT
= 10.1MHz, 30MHz Span (Notes 4, 7) - 60 - dBc
OUT
= 20.2MHz, 25MHz Span (Notes 4, 7) - 53 - dBc
OUT
= 5.02MHz, 25MHz Span (Notes 4, 7) - 67 - dBc
OUT
= 2.51MHz, 25MHz Span (Notes 4, 7) - 68 - dBc
OUT
= 1.00MHz, 25MHz Span (Notes 4, 7) - 68 - dBc
OUT
= 5.02MHz, 25MHz Span (Notes 4, 7) - 71 - dBc
OUT
VOLTAGE REFERENCE
Internal Reference Voltage, V
FSADJ
Voltage at Pin 18 with Internal Reference 1.04 1.16 1.28 V
Internal Reference Voltage Drift - ±60 - ppm/oC
Internal Reference Output Current
- 0.1 - µA
Sink/Source Capability
Reference Input Impedance - 1 - M
Reference Input Multiplying Bandwidth (Note 7) - 1.4 - MHz
DIGITAL INPUTS D7-D0, CLK
Input Logic High Voltage with 5V Supply, V
IH
Input Logic High Voltage with 3V Supply, V
IH
Input Logic Low Voltage with 5V Supply, V
IL
Input Logic Low Voltage with 3V Supply, V
Input Logic Current, I
Input Logic Current, I
IL
IH
IL
Digital Input Capacitance, C
IN
(Note 3) 3.5 5 - V
(Note 3) 2.1 3 - V
(Note 3) - 0 1.3 V
(Note 3) - 0 0.9 V
-10 - +10 µA
-10 - +10 µA
- 5 - pF
4
HI5660
Electrical Specifications AV
PARAMETER TEST CONDITIONS
= DVDD = +5V, V
DD
= Internal 1.2V, IOUTFS = 20mA, TA = 25oC for All Typical Values (Continued)
REF
T
= -40oC TO 85oC
A
UNITSMIN TYP MAX
TIMING CHARACTERISTICS
Data Setup Time, t
Data Hold Time, t
SU
HLD
Propagation Delay Time, t
CLK Pulse Width, t
PW1
, t
PD
PW2
See Figure 3 (Note 3) 3 - - ns
See Figure 3 (Note 3) 3 - - ns
See Figure 3 - 1 - ns
See Figure 3 (Note 3) 4 - - ns
POWER SUPPLY CHARACTERISTICS
AVDD Power Supply (Note 8, 9) 2.7 5.0 5.5 V
DVDD Power Supply (Note 8, 9) 2.7 5.0 5.5 V
Analog Supply Current (I
) 5V or 3V, IOUTFS = 20mA - 23 30 mA
AVD D
5V or 3V, IOUTFS = 2mA - 4 - mA
Digital Supply Current (I
) 5V, IOUTFS = Don’t Care (Note 5) - 3 5 mA
DVDD
3V, IOUTFS = Don’t Care (Note 5) - 1.5 - mA
Supply Current (I
) Sleep Mode 5V or 3V, IOUTFS = Don’t Care - 1.6 3 mA
AVD D
Power Dissipation 5V, IOUTFS = 20mA (Note 6) - 165 - mW
5V, IOUTFS = 20mA (Note 10) - 150 - mW
5V, IOUTFS = 2mA (Note 6) - 70 - mW
3.3V, IOUTFS = 20mA (Note 10) - 75 - mW
3V, IOUTFS = 20mA (Note 6) - 85 - mW
3V, IOUTFS = 20mA (Note 10) - 67 - mW
3V, IOUTFS = 2mA (Note 6) - 27 - mW
Power Supply Rejection Single Supply (Note 7) -0.2 - +0.2 % FSR/V
NOTES:
2. Gain Error measured as the error in the ratio between the full scale output current and the current through R ratio should be 32.
(typically 625µA). Ideally the
SET
3. Parameter guaranteed by design or characterization and not production tested.
4. Spectral measurements made with differential transformer coupled output and no external filtering.
5. Measured with the clock at 50MSPS and the output frequency at 1MHz.
6. Measured with the clock at 100MSPS and the output frequency at 40MHz.
7. See ‘Definition of Specifications’.
8. It is recommended that the output current be reduced to 12mA or less to maintain optimum performance for operation below 3V. DVDD and AVDD do not have to be equal
.
9. For operation above 125MHz, it is recommended that the power supply be 3.3V or greater. The part is functional with the clock above 125MSPS and the power supply below 3.3V, but performance is degraded.
10. Measured with the clock at 60MSPS and the output frequency at 10MHz.
5
Timing Diagrams
HI5660
CLK
D7-D0
I
OUT
t
SETT
t
PD
FIGURE 1. OUTPUT SETTLING TIME DIAGRAM
50%
1
/2 LSB ERROR BAND
t
PW1
t
PW2
1
V
GLITCH AREA =
HEIGHT (H)
WIDTH (W)
/2 (H x W)
t(ps)
FIGURE 2. PEAK GLITCH AREA (SINGLET) MEASUREMENT
METHOD
CLK
D7-D0
I
OUT
t
SU
t
HLD
t
t
PD
SETT
t
SU
t
HLD
t
t
PD
SETT
t
SU
t
HLD
t
t
PD
SETT
FIGURE 3. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM
50%
6
HI5660
Definition of Specifications
Integral Linearity Error, INL, is the measure of the worst case point that deviates from a best fit straight line of data values along the transfer curve.
Differential Linearity Error, DNL, is the measure of the step size output deviation from code to code. Ideally the step size should be 1 LSB. A DNL specification of 1 LSB or less guarantees monotonicity.
Output Settling Time, is the time required for the output voltage to settle to within a specified error band measured from the beginning of the output transition. In the case of the HI5660, the measurement was done by switching from code 0 to 64, or quarter scale. Termination impedance was 25 due to the parallel resistance of the output 50 oscilloscope’s 50
input. This also aids the ability to resolve
and the
the specified error band without overdriving the oscilloscope.
Singlet Glitch Area, is the switching transient appearing on the output during a code transition. It is measured as the area under the overshoot portion of the curve and is expressed as a Volt-Time specification.
Full Scale Gain Error , is the error from an ideal ratio of 32 between the output current and the full scale adjust current (through R
SET
).
Full Scale Gain Drift, is measured by setting the data inputs to all ones and measuring the output voltage through a known resistance as the temperature is varied from T T
. It is defined as the maximum deviation from the value
MAX
measured at room temperature to the value measured at either T
MIN
or
. The units are ppm of FSR (full scale
MAX
range) per degree C.
Total Harmonic Distortion, THD, is the ratio of the DAC output fundamental to the RMS sum of the first five harmonics.
Spurious Free Dynamic Range, SFDR, is the amplitude difference from the fundamental to the largest harmonically or non-harmonically related spur within the specified window.
Output Voltage Compliance Range, is the voltage limit imposed on the output. The output impedance load should be chosen such that the voltage developed does not violate the compliance range.
Offset Error, is measured by setting the data inputs to all zeros and measuring the output voltage through a known resistance. Offset error is defined as the maximum deviation of the output current from a value of 0mA.
Offset Drift, is measured by setting the data inputs to all zeros and measuring the output voltage through a known resistance as the temperature is varied from T
MIN
is defined as the maximum deviation from the value measured at room temperature to the value measured at either T
MIN
or T
. The units are ppm of FSR (full scale
MAX
range) per degree C.
to
MIN
MAX
to
. It
Power Supply Rejection, is measured using a single power supply. Its nominal +5V is varied
±10% and the change in the
DAC full scale output is noted.
Reference Input Multiplying Bandwidth, is defined as the 3dB bandwidth of the voltage reference input. It is measured by using a sinusoidal waveform as the external reference with the digital inputs set to all 1s. The frequency is increased until the amplitude of the output waveform is
0.707 of its original value.
Internal Reference Voltage Drift, is defined as the maximum deviation from the value measured at room temperature to the value measured at either T
MIN
or T
MAX
The units are ppm per degree C.
Detailed Description
The HI5660 is an 8-bit, current out, CMOS, digital to analog converter. Its maximum update rate is 125MSPS and can be powered by either single or dual power supplies in the recommended range of +3V to +5V. It consumes less than 165mW of power when using a +5V supply with the data switching at 100MSPS. The architecture is based on a segmented current source arrangement that reduces glitch by reducing the amount of current switching at any one time. The five MSBs are represented by 31 major current sources of equivalent current. The three LSBs are comprised of binary weighted current sources. Consider an input pattern to the converter which ramps through all the codes from 0 to
255. The three LSB current sources would begin to count up. When they reached the all high state (decimal value of 7) and needed to count to the next code, they would all turn off and the first major current source would turn on. To continue counting upward, the 3 LSBs would count up another 7 codes, and then the next major current source would turn on and the three LSBs would all turn off. The process of the single, equivalent, major current source turning on and the three LSBs turning off each time the converter reaches another 7 codes greatly reduces the glitch at any one switching point. In previous architectures that contained all binary weighted current sources or a binary weighted resistor ladder, the converter might have a substantially larger amount of current turning on and off at certain, worst­case transition points such as midscale and quarter scale transitions. By greatly reducing the amount of current switching at certain ‘major’ transitions, the overall glitch of the converter is dramatically reduced, improving settling times and transient problems.
Digital Inputs and Termination
The HI5660 digital inputs are guaranteed to CMOS levels. However, TTL compatibility can be achieved by lowering the supply voltage to 3V due to the digital threshold of the input buffer being approximately half of the supply voltage. The internal register is updated on the rising edge of the clock. To minimize reflections, proper termination should be implemented. If the lines driving the clock and the digital
.
7
HI5660
inputs are 50 lines, then 50 termination resistors should be placed as close to the converter inputs as possible connected to the digital ground plane (if separate grounds are used).
Ground Plane(s)
If separate digital and analog ground planes are used, then all of the digital functions of the device and their corresponding components should be over the digital ground plane and terminated to the digital ground plane. The same is true for the analog components and the analog ground plane.
Noise Reduction
To minimize power supply noise, 0.1µF capacitors should be placed as close as possible to the converter’s power supply pins, AV
and DVDD . Also, should the layout be
DD
designed using separate digital and analog ground planes, these capacitors should be terminated to the digital ground for DV
and to the analog ground for AVDD . Additional
DD
filtering of the power supplies on the board is recommended.
Voltage Reference
The internal voltage reference of the device has a nominal value of +1.2V with a ± full temperature range of the converter. It is recommended that a 0.1µF capacitor be placed as close as possible to the REFIO pin, connected to the analog ground. The REFLO pin (16) selects the reference. The internal reference can be selected if pin 16 is tied low (ground). If an external reference is desired, then pin 16 should be tied high (to the analog supply voltage) and the external reference driven into REFIO, pin 17. The full scale output current of the converter is a function of the voltage reference used and the value of R
SET
range, through operation below 2mA is possible, with performance degradation.
60 ppm / oC drift coefficient over the
. I
should be within the 2mA to 20mA
OUT
Outputs
IOUTA and IOUTB are complementary current outputs. The sum of the two currents is always equal to the full scale output current minus one LSB. If single ended use is desired, a load resistor can be used to convert the output current to a voltage. It is recommended that the unused output be either grounded or equally terminated. The voltage developed at the output must not violate the output voltage compliance range of -0.3V to 1.25V. R chosen so that the desired output voltage is produced in conjunction with the output full scale current, which is described above in the ‘Reference’ section. If a known line impedance is to be driven, then the output load resistor should be chosen to match this impedance. The output voltage equation is:
V
= I
OUT
OUT
X R
LOAD
.
These outputs can be used in a differential-to-single-ended arrangement to achieve better harmonic rejection. The SFDR measurements in this data sheet were performed with a 1:1 transformer on the output of the DAC (see Figure 1). With the center tap grounded, the output swing of pins 21 and 22 will be biased at zero volts. It is important to note here that the negative voltage output compliance range limit is -300mV, imposing a maximum of 600mV with this configuration. The loading as shown in Figure 1 will result in a 500mV signal at the output of the transformer if the full scale output current of the DAC is set to 20mA.
50
100
50
PIN 21 PIN 22
HI5660
IOUTB
IOUTA
LOAD
V
OUT
50
should be
amplitude
P-P
= (2 x I
OUT
x REQ)V
If the internal reference is used, V
FSADJ
will equal approximately 1.16V (pin 18). If an external reference is used, V calculation for I
I
(Full Scale) = (V
OUT
will equal the external reference. The
FSADJ
(full scale) is:
OUT
FSADJ/RSET
) x 32.
If the full scale output current is set to 20mA by using the internal voltage reference (1.16V) and a 1.86kΩ R
SET
resistor, then the input coding to output current will resemble the following:
TABLE 1. INPUT CODING vs OUTPUT CURRENT
INPUT CODE (D7-D0) IOUTA (mA) IOUTB (mA)
1111 1111 20 0
1000 0000 10 10
0000 0000 0 20
8
V
OUT
= 2 x I
FIGURE 4.
x REQ, where REQ is ~12.5Ω.
OUT
HI5660
Pin Descriptions
PIN NO. PIN NAME PIN DESCRIPTION
1-8 D7 (MSB) Through
D0 (LSB)
9-14 DCOM Connect to digital ground.
15 SLEEP Control Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep
16 REFLO Connect to analog ground to enable internal 1.2V reference or connect to AVDD to disable internal
17 REFIO Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is
18 FSADJ Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output
19 COMP1 For use in reducing bandwidth/noise. Recommended: connect 0.1µF to AVDD .
20 ACOM Analog Ground.
21 IOUTB The complimentary current output of the device. Full scale output current is achieved when all input bits
22 IOUTA Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23 NC Internally connected to ACOM via a resistor. Recommend leave disconnected. Adding a capacitor to
24 AV
25 NC No Connect (for upward compatibility to 12 and 14b, pin 25 needs to be grounded to ACOM).
26 DCOM Digital Ground.
27 DV
28 CLK Input for clock. Positive edge of clock latches data.
DD
DD
Digital Data Bit 7 (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).
pin has internal 20µA active pulldown current.
reference.
enabled. Use 0.1µF cap to ground when internal reference is enabled.
Current = 32 x V
are set to binary 0.
ACOM for upward compatibility is valid. Grounding to ACOM is valid. (For upward compatibility to 12-bit and 14-bit devices, pin 23 needs the ability to have a 0.1µF capacitor to ACOM.)
Analog Supply (+3V to +5V).
Digital Supply (+3V to +5V).
FSADJ/RSET
.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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