International Rectifier JANTXV2N6804, JANTX2N6804 Datasheet

HEXFET
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®
POWER MOSFET
Provisional Data Sheet No. PD-9.549B
JANTX2N6804
JANTXV2N6804
[REF:MIL-PRF-19500/562]
[GENERIC:IRF9130]
P-CHANNEL
-100 V olt, 0.30
HEXFET technology is the key to International Rectifier’s advanced line of power MOSFET transistors. The effi­cient geometry achieves very low on-state resistance combined with high transconductance.
HEXFET transistors also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical param­eter temperature stability . They are well-suited for appli­cations such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits, and virtually any application where high reliability is required.
ΩΩ
HEXFET
ΩΩ
Product Summary
Part Number BV DSS RDS(on) I D
JANTX2N6804
JANTXV2N6804
Features:
Avalanche Energy Rating
Dynamic dv/dt Rating
Simple Drive Requirements
Hermetically Sealed
Absolute Maximum Ratings
Parameter JANTX2N6804, JANTXV2N6804 Units
ID @ VGS = -10V , TC = 25°C Continuous Drain Current -11
ID @ VGS = -10V , TC = 100°C Continuous Drain Current -7
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt -5.5
T
J
T
STG
Pulsed Drain Current -50
Linear Derating Factor 0.60 W/K Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy 81 mJ Avalanche Current -11 A Repetitive Avalanche Energy 7.5 mJ
Operating Junction -55 to 150 Storage Temperature Range
Lead Temperature 300
Weight 11.5 (typical) g
-100V
(0.063 in. (1.6mm) from
case for 10.5 seconds)
0.30
A
V/ns
o
C
-11A
JANTX2N6804, JANTXV2N6804 Device
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Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min. Typ. Max. Units Test Conditions
BV
DSS
BV R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
DSS
Drain-to-Source Breakdown Voltage -100 V VGS = 0V, ID = -1.0 mA
/TJTemperature Coefficient of Breakdown -0.087 — V/°C Reference to 25°C, ID = -1.0 mA
Voltage Static Drain-to-Source 0.30 VGS = -10V, ID = -7A On-State Resistance 0.35 VGS = -10V, ID = -11A Gate Threshold Voltage -2.0 -4.0 V VDS = VGS, ID = -250µA Forward Transconductance 3 S ( )VDS > -15V, IDS = -7A Zero Gate Voltage Drain Current -25 VDS = 0.8 x Max Rating,VGS = 0V
-250 VDS = 0.8 x Max Rating
Gate-to-Source Leakage Forward -100 VGS = -20V Gate-to-Source Leakage Reverse 100 VGS = 20V Total Gate Charge 1.5 29 VGS = -10V, ID = -11A Gate-to-Source Charge 1.0 7.1 VDS = Max. Rating x 0.5 Gate-to-Drain (“Miller”) Charge 2.0 21 see figures 6 and 13 Turn-On Delay Time 60 VDD = -50V, ID = -11A, Rise Time 14 0 RG = 7.5, VGS = -10V Turn-Off Delay Time 140 Fall Time 14 0 see figure 10 Internal Drain Inductance 5.0
Internal Source Inductance 13
Input Capacitance 860 VGS = 0V , VDS = -25V Output Capacitance 350 f = 1.0 MHz Reverse Transfer Capacitance 125 see figure 5
µA
nA
nC
ns
Measured from the drain lead, 6mm (0.25 in.) from package to center of die.
nH
Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad.
pF
VGS = 0V, TJ = 125°C
Modified MOSFET symbol showing the internal inductances.
Source-Drain Diode Ratings and Characteristics
Parameter Min. Typ. Max. Units Test Conditions
I
Continuous Source Current (Body Diode) -11 Modified MOSFET symbol showing the
S
I
Pulse Source Current (Body Diode) -50 integral reverse p-n junction rectifier.
SM
V
Diode Forward Voltage -4.7 V Tj = 25°C, IS = -11A, VGS = 0V
SD
t
Reverse Recovery Time 25 0 ns Tj = 25°C, IF = -11A, di/dt -100A/ µs
rr
Q
Reverse Recovery Charge 3.0 µCV
RR
t
Forward Turn-On Time
on
Intrinsic turn-on time is negligible. T urn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter Min. Typ. Max. Units Test Conditions
R R
thJC thJA
Junction-to-Case 1.67 Junction-to-Ambient 30 K/W Typical socket mount
A
-50V
DD
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