International Rectifier JANTXV2N6762, JANTX2N6762 Datasheet
HEXFET
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®
POWER MOSFET
Provisional Data Sheet No. PD-9.336E
JANTX2N6762
JANTXV2N6762
[REF:MIL-PRF-19500/542]
[GENERIC:IRF430]
N-CHANNEL
500 Volt, 1.5
HEXFET technology is the key to International Rectifier’s
advanced line of power MOSFET transistors. The efficient geometry achieves very low on-state resistance
combined with high transconductance.
HEXFET transistors also feature all of the well-establish advantages of MOSFETs, such as voltage control,
very fast switching, ease of paralleling and electrical
parameter temperature stability . They are well-suited
for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and
high energy pulse circuits, and virtually any application
where high reliability is required.
ΩΩ
Ω HEXFET
ΩΩ
Absolute Maximum Ratings
Parameter JANTX2N6762, JANTXV2N6762 Units
ID @ VGS = 10V , TC = 25°C Continuous Drain Current 4.5
ID @ VGS = 10V , TC = 100°C Continuous Drain Current 3.0
I
DM
PD @ TC = 25°C Max. Power Dissipation 75 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt ➂ 3.5
T
J
T
STG
Pulsed Drain Current ➀ 18
Linear Derating Factor 0.60 W/K ➄
Gate-to-Source Voltage ±2 0 V
Single Pulse Avalanche Energy ➁ 1.1 m J
Avalanche Current ➀ 4.5 A
Repetitive Avalanche Energy ➀ —mJ
Operating Junction -55 to 150
Storage T emperature Range
Lead Temperature 300
Weight 11.5 (typical) g
Product Summary
Part Number BVDSS RDS(on) ID
JANTX2N6768
JANTXV2N6768
500V
1.5Ω
Features:
■ Avalanche Energy Rating
■ Dynamic dv/dt Rating
■ Simple Drive Requirements
■ Ease of Paralleling
■ Hermetically Sealed
(0.063 in. (1.6mm) from
case for 10.5 seconds)
A
V/ns
o
C
4.5A
JANTX2N6762, JANTXV2N6762 Device
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Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min. Typ. Max. Units Test Conditions
BV
DSS
∆BV
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
DSS
Drain-to-Source Breakdown Voltage 500 — — V VGS = 0V , ID = 1.0 mA
/∆TJT emperature Coefficient of Breakdown — 0.78 — V/°C Reference to 25°C, ID = 1.0 mA
Voltage
Static Drain-to-Source — — 1.5 VGS = 10V , ID = 3.0A
On-State Resistance — — 1.80 Ω VGS = 10V , ID = 4.5A
Gate Threshold V oltage 2.0 — 4.0 V VDS = VGS, ID = 250µA
Forward Transconductance 2.7 — — S ( )VDS > 15V , IDS = 3.0A ➃
Zero Gate Voltage Drain Current — — 25 VDS = 0.8 x Max Rating,VGS = 0V
— — 250 VDS = 0.8 x Max Rating
Gate-to-Source Leakage Forward — — 100 VGS = 20V
Gate-to-Source Leakage Reverse — — -100 VGS = -20V
T otal Gate Charge 16 — 40 VGS = 10V , ID = 4.5A
Gate-to-Source Charge 2.0 — 6.0 VDS = Max. Rating x 0.5
Gate-to-Drain (“Miller”) Charge 8.0 — 20 see figures 6 and 13
Turn-On Delay T ime — — 30 VDD = 250V , ID = 4.5A,
Rise Time — — 40 RG = 7.5Ω, VGS = 10V
Turn-Off Delay T ime — — 80
Fall Time — — 30 see figure 10
Internal Drain Inductance — 5.0 —
Internal Source Inductance — 13.0 —
Input Capacitance — 61 0 — VGS = 0V , VDS = 25V
Output Capacitance — 135 — f = 1.0 MHz
Reverse Transfer Capacitance — 65 — see figure 5
Ω
µA
nA
nC
ns
Measured from the
drain lead, 6mm (0.25
in.) from package to
center of die.
nH
Measured from the
source lead, 6mm
(0.25 in.) from package
to source bonding pad.
pF
VGS = 0V, TJ = 125°C
Modified MOSFET
symbol showing the
internal inductances.
➃
Source-Drain Diode Ratings and Characteristics
Parameter Min. Typ. Max. Units Test Conditions
I
Continuous Source Current (Body Diode) — — 4.5 Modified MOSFET symbol showing the
S
I
Pulse Source Current (Body Diode) ➀ —— 18 integral reverse p-n junction rectifier.
SM
V
Diode Forward Voltage — — 1.4 V Tj = 25°C, IS = 4.5A, VGS = 0V ➃
SD
t
Reverse Recovery Time — — 90 0 ns Tj = 25°C, IF = 4.5A, di/dt ≤ 100A/µs
rr
Q
Reverse Recovery Charge — — 7.0 µCV
RR
t
Forward Turn-On T ime
on
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter Min. Typ. Max. Units Test Conditions
R
R
thJC
thJA
Junction-to-Case — — 1.67
Junction-to-Ambient — — 30 K/W Typical socket mount
A
≤ 50V ➃
DD
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