International Rectifier IR2110-2, IR2110-1, IR2110 Datasheet
Typical Connection
Features
n Floating channel designed for bootstrap operation
Fully operational to +500V
Tolerant to negative transient voltage
dV/dt immune
n Gate drive supply range from 10 to 20V
n Undervoltage lockout for both channels
n Separate logic supply range from 5 to 20V
Logic and power ground ±5V offset
n CMOS Schmitt-triggered inputs with pull-down
n Cycle by cycle edge-triggered shutdown logic
n Matched propagation delay for both channels
n Outputs in phase with inputs
Description
The IR2110 is a high voltage, high speed power
MOSFET and IGBT driver with independent high and
low side referenced output channels. Proprietary
HVIC and latch immune CMOS technologies enable
ruggedized monolithic construction. Logic inputs are
compatible with standard CMOS or LSTTL outputs.
The output drivers feature a high pulse current b uff er
stage designed for minimum driver cross-conduction. Propagation delays are matched to simplify
use in high frequency applications. The floating
channel can be used to drive an N-channel power
MOSFET or IGBT in the high side configuration
which operates up to 500 volts.
Packages
Data Sheet No. PD-6.011E
IR2110
HIGH AND LOW SIDE DRIVER
Product Summary
V
OFFSET
500V max.
IO+/- 2A / 2A
V
OUT
10 - 20V
t
on/off
(typ.) 120 & 94 ns
Delay Matching 10 ns
HIN
up to 500V
TO
LOAD
V
DD
V
B
V
S
HO
LO
COM
HIN
LIN
V
SS
SD
V
CC
LIN
V
DD
SD
V
SS
V
CC
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-25
IR2110
B-26 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Parameter V alue
Symbol Definition Min. Max. Units
V
B
High Side Floating Supply Voltage -0.3 525
V
S
High Side Floating Supply Offset V oltage VB - 25 VB + 0.3
V
HO
High Side Floating Output Voltage VS - 0.3 V
B
+ 0.3
V
CC
Low Side Fix ed Supply V oltage -0.3 25
V
LO
Low Side Output Voltage -0.3 VCC + 0.3
V
DD
Logic Supply V oltage -0.3 VSS + 25
V
SS
Logic Supply Offset Voltage VCC - 25 V
CC
+ 0.3
V
IN
Logic Input Voltage (HIN, LIN & SD) VSS - 0.3 V
DD
+ 0.3
dVs/dt Allowable Offset Supply V oltage Transient (Figure 2) — 50 V/ns
P
D
P ackage P ow er Dissipation @ TA ≤ +25° C (14 Lead DIP) — 1.6
(14 Lead DIP w/o Lead 4) — 1.5
(16 Lead DIP w/o Leads 5 & 6) — 1.6
(16 Lead SOIC) — 1.25
R
θJA
Thermal Resistance, Junction to Ambient (14 Lead DIP) — 7 5
(14 Lead DIP w/o Lead 4) — 85
(16 Lead DIP w/o Leads 5 & 6) — 75
(16 Lead SOIC) — 100
T
J
Junction T emperature — 15 0
T
S
Storage T emperature -55 150 °C
T
L
Lead Temperature (Soldering, 10 seconds) — 30 0
Par ameter V alue
Symbol Definition Min. Max. Units
V
B
High Side Floating Supply Absolute Voltage VS + 10 VS + 20
V
S
High Side Floating Supply Offset V oltage Note 1 50 0
V
HO
High Side Floating Output Voltage V
S
V
B
V
CC
Low Side Fix ed Supply V oltage 10 20
V
LO
Low Side Output Voltage 0 V
CC
V
DD
Logic Supply V oltage VSS + 5 VSS + 20
V
SS
Logic Supply Offset Voltage -5 5
V
IN
Logic Input Voltage (HIN, LIN & SD) V
SS
V
DD
T
A
Ambient T emper ature -40 1 25 °C
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits be yond which damage to the de vice may occur . All voltage parameters are
absolute voltages ref erenced to COM. The Thermal Resistance and P o wer Dissipation ratings are measured under board
mounted and still air conditions. Additional information is shown in Figures 28 through 35.
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Typical
ratings at other bias conditions are shown in Figures 36 and 37.
Note 1: Logic operational for VS of -4 to +500V. Logic state held for VS of -4V to -VBS.
°C/W
W
V
V
IR2110
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-27
Parameter Value
Symbol Definition Figure Min. Typ. Max. Units Test Conditions
t
on
Turn-On Propagation Delay 7 — 120 150 VS = 0V
t
off
Turn-Off Propagation Delay 8 — 94 125 VS = 500V
t
sd
Shutdown Propagation Delay 9 — 110 140 VS = 500V
t
r
Turn-On Rise Time 10 — 25 35
t
f
Turn-Off Fall Time 11 — 17 25
MT Delay Matching, HS & LS Turn-On/Off — — — 10 Figure 5
Parameter Value
Symbol Definition Figure Min. Typ. Max. Units Test Conditions
V
IH
Logic “1” Input Voltage 12 9.5 — —
V
IL
Logic “0” Input Voltage 13 — — 6.0
V
OH
High Level Output V oltage, V
BIAS
- V
O
14 — — 1.2 IO = 0A
V
OL
Low Level Output V oltage, V
O
15 — — 0.1 IO = 0A
I
LK
Offset Supply Leakage Current 16 — — 50 VB = VS = 500V
I
QBS
Quiescent VBS Supply Current 17 — 125 230 V
IN
= 0V or V
DD
I
QCC
Quiescent VCC Supply Current 18 — 1 80 340 VIN = 0V or V
DD
I
QDD
Quiescent VDD Supply Current 19 — 15 30 VIN = 0V or V
DD
I
IN+
Logic “1” Input Bias Current 20 — 20 40 VIN = V
DD
I
IN-
Logic “0” Input Bias Current 21 — — 1.0 V
IN
= 0V
V
BSUV+
VBS Supply Undervoltage Positive Going 22 7.5 8.6 9.7
Threshold
V
BSUV-
VBS Supply Undervoltage Negative Going 23 7.0 8.2 9.4
Threshold
V
CCUV+
VCC Supply Undervoltage Positive Going 24 7.4 8.5 9.6
Threshold
V
CCUV-
VCC Supply Undervoltage Negative Going 25 7.0 8.2 9.4
Threshold
I
O+
Output High Short Circuit Pulsed Current 26 2.0 2.5 — VO = 0V, VIN = V
DD
PW ≤ 10 µ s
I
O-
Output Low Short Circuit Pulsed Current 27 2.0 2.5 — VO = 15V, VIN = 0V
PW ≤ 10 µ s
ns
Dynamic Electrical Characteristics
V
BIAS
(VCC, VBS, VDD) = 15V, CL = 1000 pF, T
A
= 25°C and VSS = COM unless otherwise specified. The dynamic
electrical character istics are measured using the test circuit shown in Figure 3.
Static Electrical Characteristics
V
BIAS
(VCC, VBS, VDD) = 15V, T
A
= 25° C and VSS = COM unless otherwise specified. The VIN, VTH and IIN parameters
are referenced to VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters are
referenced to COM and are applicable to the respective output leads: HO or LO.
V
µA
V
A
IR2110
B-28 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Lead
Symbol Description
V
DD
Logic supply
HIN Logic input for high side gate driver output (HO), in phase
SD Logic input for shutdown
LIN Logic input for low side gate driver output (LO), in phase
V
SS
Logic ground
V
B
High side floating supply
HO High side gate drive output
V
S
High side floating supply return
V
CC
Low side supply
LO Low side gate drive output
COM Low side retur n
V
B
SD
LIN
V
DD
PULSE
GEN
RSQ
V
SS
UV
DETECT
DELAY
HV
LEVEL
SHIFT
V
CC
PULSE
FILTER
UV
DETECT
VDD/V
CC
LEVEL
SHIFT
VDD/V
CC
LEVEL
SHIFT
LO
V
S
COM
RSQ
R
S
RQ
HIN
HO
Functional Block Diagram
Lead Definitions
Lead Assignments
14 Lead DIP 14 Lead DIP w/o Lead 4 16 Lead DIP w/o Leads 4 & 5 16 Lead SOIC (Wide Body)
IR2110 IR2110-1 IR2110-2 IR2110S
P art Number
IR2110
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-29
Thickness of Gate Oxide 800Å
Connections Material P oly Silicon
First Width 4 µm
La yer Spacing 6 µm
Thickness 5000Å
Material Al - Si (Si: 1.0% ±0.1%)
Second Width 6 µm
La yer Spacing 9 µm
Thickness 20,000Å
Contact Hole Dimension 8 µm X 8 µm
Insulation Layer Material PSG (SiO2)
Thickness 1.5 µm
P assivation Material PSG (SiO2)
(1) Thickness 1.5 µm
P assivation Material Proprietary*
(2) Thickness Proprietary*
Method of Saw Full Cut
Method of Die Bond Ablebond 84 - 1
Wire Bond Method Thermo Sonic
Material Au (1.0 mil / 1.3 mil)
Leadframe Material Cu
Die Area Ag
Lead Plating Pb : Sn (37 : 63)
P ackage Types 14 & 16 Lead PDIP / 16 Lead SOIC
Materials EME6300 / MP150 / MP190
Remarks: * Patent Pending
Device Information
Process & Design Rule HVDCMOS 4.0 µ m
Transistor Count 220
Die Siz e 100 X 117 X 26 (mil)
Die Outline
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