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YA810E

Intel YA810E Technical Product Specification

Intel® Desktop Board YA810E
Technical Product Specification
The Intel® Desktop Board YA810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board YA810E Specification Update.
December 1999 Order Number A00984-001
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board YA810E Technical Product Specification.
This product specification applies to only standard YA810E boards with BIOS identifier YA810E10A.86A.
Changes to this specification will be published in the Intel® Desktop Board YA810E Specification Update before being incorporated into a revision of this document.
December 1999
Information in this doc um ent is provided in connection wi t h Intel products. No license, express or implied, by estoppel or otherwise, to any intell ectual property rights is granted by this document. E x cept as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and I nt el dis claims any express or implied warranty, relating to sale and/or use of I ntel products including liability or warranties relat i ng t o f i t ness for a particular purpose, merchantability, or infringement of any patent, copyright or other int ellec t ual propert y right. Intel products are not intended for use in medical, l i f e saving, or life sustai ni ng appl i cations.
Intel may make changes t o specifications and produc t descriptions at any tim e, without notice. The YA810E board may contain des i gn def ects or errors known as errata that m ay cause the product to deviat e from
published specificat i ons. Current characterized errata are available on request. Contact your local Int el sales office or your distributor to obtain the latest specifications before pl acing your product order. Copies of documents whic h hav e an orderi ng number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation P.O. Box 5937 Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.
†
Third-party brands and names are the property of their respective owners.
Copyright 1999, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the YA810E desktop board. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the YA810E board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on this board 2 A map of the resources of the board 3 The features supported by the BIOS Setup program 4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions which, if not observed, can cause personal injury.
iii
Intel Desktop Board YA810E Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the YA810E board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in
the 5J area. KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) MB Megabyte (1,048,576 bytes) Mbit Megabit (1,048,576 bits) GB Gigabyte (1,073,741,824 bytes) xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified.
†
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ................................................................................................................... 12
1.1.1 Feature Summary ....................................................................................... 12
1.1.2 Manufacturing Options................................................................................ 13
1.1.3 YA810E Board Layout................................................................................. 14
1.1.4 Block Diagram............................................................................................. 15
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor..................................................................................................................19
1.5 System Memory......................................................................................................... 20
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 25
1.8 Graphics Subsystem ................................................................................................. 27
1.9 Audio Subsystem....................................................................................................... 28
1.10 Hardware Monitor Component................................................................................... 29
1.11 LAN Subsystem......................................................................................................... 30
1.12 Power Management Features.................................................................................... 32
810E Chipset................................................................................................... 21
1.6.1 Direct AGP.................................................................................................. 22
1.6.2 USB............................................................................................................. 22
1.6.3 IDE Support................................................................................................. 23
1.6.4 Real-Time Clock, CMOS SRAM, and Battery.............................................. 24
1.7.1 Serial Port (Optional)................................................................................... 25
1.7.2 Parallel Port (Optional)................................................................................ 26
1.7.3 PS/2 Keyboard and Mouse (Optional)......................................................... 26
1.9.1 AD1881 Analog Codec................................................................................ 28
1.9.2 Audio Connectors........................................................................................ 29
®
1.11.1 Intel
1.11.2 LAN Subsystem Software............................................................................ 31
1.11.3 RJ-45 LAN Connector LEDs........................................................................ 31
1.12.1 ACPI............................................................................................................ 32
1.12.2 Hardware Support....................................................................................... 34
82559 PCI LAN Controller ................................................................. 30
2 Technical Reference
2.1 Introduction................................................................................................................39
2.2 Memory Map ............................................................................................................. 39
2.3 I/O Map ..................................................................................................................... 40
2.4 DMA Channels .......................................................................................................... 42
2.5 PCI Configuration Space Map ................................................................................... 42
2.6 Interrupts...................................................................................................................43
2.7 PCI Interrupt Routing Map......................................................................................... 44
v
Intel Desktop Board YA810E Technical Product Specification
2.8 Connectors................................................................................................................ 45
2.8.1 Back Panel Connectors............................................................................... 46
2.8.2 Midboard Connectors.................................................................................. 50
2.8.3 Front Panel Connector................................................................................ 55
2.9 Jumper Block............................................................................................................. 58
2.10 Mechanical Considerations........................................................................................ 60
2.10.1 FlexATX Form Factor.................................................................................. 60
2.10.2 I/O Shield.................................................................................................... 61
2.11 Electrical Considerations........................................................................................... 62
2.11.1 Power Consumption.................................................................................... 62
2.11.2 Power Supply Considerations...................................................................... 63
2.11.3 Standby Current Requirements................................................................... 63
2.11.4 Fan Power Requirements............................................................................ 63
2.12 Thermal Considerations............................................................................................. 64
2.13 Reliability................................................................................................................... 65
2.14 Environmental............................................................................................................ 66
2.15 Regulatory Compliance............................................................................................. 67
2.15.1 Safety Regulations...................................................................................... 67
2.15.2 EMC Regulations ........................................................................................ 67
2.15.3 Certification Markings .................................................................................. 68
3 Overview of BIOS Features
3.1 Introduction................................................................................................................69
3.2 BIOS Flash Memory Organization............................................................................. 70
3.3 PCI IDE Support........................................................................................................ 70
3.4 System Management BIOS (SMBIOS)...................................................................... 71
3.5 BIOS Upgrades ......................................................................................................... 72
3.5.1 Language Support....................................................................................... 72
3.5.2 Custom Splash Screen................................................................................ 72
3.6 Recovering BIOS Data.............................................................................................. 73
3.7 Boot Options.............................................................................................................. 74
3.7.1 CD-ROM and Network Boot........................................................................ 74
3.7.2 Booting Without Attached Devices.............................................................. 74
3.8 USB Legacy Support................................................................................................. 75
3.9 BIOS Security Features............................................................................................. 76
4 BIOS Setup Program
4.1 Introduction................................................................................................................77
4.2 Maintenance Menu.................................................................................................... 78
4.2.1 Extended Configuration Submenu............................................................... 79
4.3 Main Menu................................................................................................................. 80
4.4 Advanced Menu......................................................................................................... 81
4.4.1 Boot Configuration Submenu ...................................................................... 82
4.4.2 Peripheral Configuration Submenu.............................................................. 83
4.4.3 IDE Configuration Submenu........................................................................ 84
4.4.4 IDE Configuration Sub-Submenus............................................................... 85
4.4.5 Event Log Configuration Submenu.............................................................. 86
vi
4.5 Security Menu............................................................................................................87
4.6 Power Menu.............................................................................................................. 88
4.7 Boot Menu................................................................................................................. 89
4.7.1 IDE Drive Configuration Submenu............................................................... 90
4.8 Exit Menu.................................................................................................................. 91
5 Error Messages and Beep Codes
5.1 BIOS Error Messages................................................................................................ 93
5.2 Port 80h POST Codes............................................................................................... 95
5.3 Bus Initialization Checkpoints.................................................................................... 99
5.4 Speaker................................................................................................................... 100
5.5 BIOS Beep Codes................................................................................................... 101
5.6 Enhanced Diagnostics............................................................................................. 102
Figures
1. YA810E Board Components...................................................................................... 14
2. Block Diagram........................................................................................................... 15
3. Intel 810E Chipset Block Diagram............................................................................. 21
4. Block Diagram of Audio Subsystem with AD1881 Codec........................................... 28
5. Connector Groups..................................................................................................... 45
6. Back Panel Connectors............................................................................................. 46
7. Midboard Connectors ................................................................................................ 50
8. Front Panel Connector............................................................................................... 55
9. Location of the BIOS Setup Jumper Block................................................................. 58
10. Board Dimensions..................................................................................................... 60
11. I/O Shield Dimensions............................................................................................... 61
12. High Temperature Zones........................................................................................... 64
13. Memory Map of the Flash Memory Device ................................................................ 70
14. Enhanced Diagnostic LEDs..................................................................................... 102
Contents
Tables
1. Feature Summary...................................................................................................... 12
2. Manufacturing Options............................................................................................... 13
3. Specifications ............................................................................................................ 16
4. Supported Processors............................................................................................... 19
5. System Memory Configuration................................................................................... 20
6. Supported Graphics Refresh Rates........................................................................... 27
7. LAN Connector LED States....................................................................................... 31
8. Effects of Pressing the Power Switch........................................................................ 32
9. Power States and Targeted System Power............................................................... 33
10. Wake Up Devices and Events................................................................................... 34
11. Fan Connector Descriptions...................................................................................... 35
12. System Memory Map................................................................................................. 39
13. I/O Map ..................................................................................................................... 40
14. DMA Channels .......................................................................................................... 42
15. PCI Configuration Space Map ................................................................................... 42
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Intel Desktop Board YA810E Technical Product Specification
16. Interrupts...................................................................................................................43
17. PCI Interrupt Routing Map......................................................................................... 44
18. PS/2 Mouse/Keyboard (Optional).............................................................................. 47
19. USB Ports 0, 1, and 2................................................................................................ 47
20. Serial Port (Optional)................................................................................................. 47
21. Parallel Port (Optional) .............................................................................................. 48
22. VGA Port................................................................................................................... 48
23. LAN........................................................................................................................... 49
24. Audio Line In.............................................................................................................. 49
25. Audio Line Out........................................................................................................... 49
26. Front Panel Audio (J2D1).......................................................................................... 51
27. Fan 2, Processor (J7J1) ............................................................................................ 51
28. Primary IDE (J7E1).................................................................................................... 51
29. Secondary IDE, Slimline, ATA-5 (J8E1)..................................................................... 52
30. ATAPI CD-ROM (J7C1)............................................................................................. 52
31. Power (J8B1)............................................................................................................. 53
32. USB Front Panel, Optional (J7A1)............................................................................. 53
33. Fan 1, Chassis (J6A1)............................................................................................... 53
34. Speaker (J2C1) ......................................................................................................... 53
35. Serial Port, Optional (J1G2)....................................................................................... 54
36. Front Panel Connector (J8C1)................................................................................... 56
37. States for a Single-Colored Power LED..................................................................... 56
38. States for a Dual-Colored Power LED....................................................................... 56
39. BIOS Setup Configuration Jumper Settings (J7A1) ................................................... 59
40. Power Usage............................................................................................................. 62
41. Fan DC Power Requirements.................................................................................... 63
42. Thermal Considerations for Components .................................................................. 65
43. Environmental Specifications..................................................................................... 66
44. Safety Regulations .................................................................................................... 67
45. EMC Regulations....................................................................................................... 67
46. Supervisor and User Password Functions................................................................. 76
47. BIOS Setup Program Menu Functions....................................................................... 77
48. BIOS Setup Program Function Keys ......................................................................... 78
49. Maintenance Menu.................................................................................................... 78
50. Extended Configuration Submenu............................................................................. 79
51. Main Menu................................................................................................................. 80
52. Advanced Menu......................................................................................................... 81
53. Boot Configuration Submenu..................................................................................... 82
54. Peripheral Configuration Submenu............................................................................ 83
55. IDE Configuration...................................................................................................... 84
56. IDE Configuration Sub-Submenus............................................................................. 85
57. Event Log Configuration Submenu............................................................................ 86
58. Security Menu............................................................................................................87
59. Power Menu.............................................................................................................. 88
60. Boot Menu................................................................................................................. 89
61. IDE Drive Configuration Submenu............................................................................. 90
62. Exit Menu.................................................................................................................. 91
63. BIOS Error Messages................................................................................................ 93
viii
Contents
64. Uncompressed INIT Code Checkpoints..................................................................... 95
65. Boot Block Recovery Code Check Points.................................................................. 95
66. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 96
67. Bus Initialization Checkpoints.................................................................................... 99
68. Upper Nibble High Byte Functions............................................................................. 99
69. Lower Nibble High Byte Functions........................................................................... 100
70. Beep Codes............................................................................................................. 101
71. Diagnostic LED Codes............................................................................................. 103
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Intel Desktop Board YA810E Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 Overview ................................................................................................................... 12
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor.................................................................................................................. 19
1.5 System Memory......................................................................................................... 20
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 25
1.8 Graphics Subsystem ................................................................................................. 27
1.9 Audio Subsystem....................................................................................................... 28
1.10 Hardware Monitor Component................................................................................... 29
1.11 LAN Subsystem......................................................................................................... 30
1.12 Power Management Features.................................................................................... 32
810E Chipset................................................................................................... 21
11
Intel Desktop Board YA810E Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the YA810E board’s major features.
Table 1. Feature Summary
Form Factor Processor
Memory
Chipset
Direct AGP Video
Audio
I/O Control Peripheral Interfaces
BIOS
LAN Controller Instantly Available PC
FlexATX (9.0 inches by 7.5 inches) Support for either an:
®
• Intel
• Intel
• Two 168-pin dual inline memory module (DIMM) sockets
• Supports up to 512 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)
• Support for serial presence detect (SPD) and non-SPD DIMMs
Intel® 810E chipset, consisting of:
• Intel
• Intel
• Intel
• Intel 82810E DC-133 GMCH
• VGA port connector on back panel
Audio Codec ’97 (AC’97) compatible audio subsystem, consisting of the following:
• Intel 82801AA ICH (AC link output)
• Analog Devices AD1881 analog codec
LPC47B277 Low Pin Count (LPC) I/O controller
• Three back-panel mounted universal serial bus (USB) ports
• Two IDE interfaces with Ultra DMA support
• Intel/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Intel
• Support for
• Suspend-to-RAM support
• Wake from USB ports
Pentium® III processor with 512 KB L2 cache (in an FCPGA package)
®
Celeron™ processor with 128 KB L2 cache (in a PGA package)
®
82810E Graphics/Memory Controller Hub (GMCH)
®
82801AA I/O Controller Hub (ICH)
®
82802AB 4 Mbit Firmware Hub (FWH)
Play, and SMBIOS
®
82559 local area network (LAN) controller
PCI Local Bus Specification
, Revision 2.2
NOTE
✏
The YA810E board is designed to support only USB-aware operating systems.
For information about Refer to
The board’s compliance level with ACPI, Plug and Play, and SMBIOS Table 3, page 16
12
Product Description
1.1.2 Manufacturing Options
Table 2 describes the YA810E board’s manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.
Table 2. Manufacturing Options
Legacy I/O Connectors
Diagnostic LEDs USB Slimline IDE Enhanced Video Management
Level 4
• One back panel 9-pin serial port connector, or one internal serial port connector
• One back panel 25-pin parallel port connector
• PS/2 keyboard and mouse connectors
Extended diagnostics back-panel four-LED set Two internal USB ports are available for front panel access ATA-5 compliant connector 4 MB SDRAM display cache (optional) Hardware monitor
13
Intel Desktop Board YA810E Technical Product Specification
1.1.3 YA810E Board Layout
Figure 1 shows the location of the major components on the YA810E board.
BA
Q
P
C O N
D M
L
K
E
J
I H G F
OM08944
A Diagnostic LEDs J Battery B Back panel connectors K Speaker C Intel 82810E GMCH (Graphics/Memory Controller Hub) L Intel 82801AA ICH (I/O Controller Hub) D Processor socket M Intel 82802AB FWH (Firmware Hub) E DIMM sockets N 4 MB display cache (optional) F Primary IDE connector O SMSC LPC47B277 I/O Controller G Secondary IDE connector (Slimline) P Intel 82559 Ethernet Controller H Front panel connector Q AD1881 Audio Codec I Power connector
14
Figure 1. YA810E Board Components
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the YA810E board.
Product Description
Processor Connector
100 MHz
SDRAM
Bus
DIMM Banks
0 and 1
VGA
Port
66/100/133
MHz Host Bus
Display
Interface
Primary/
Secondary IDE
Interface
82810E
Graphics Memory
Controller Hub
(GMCH)
Hardware
Monitor
(Optional)
ATA33/66
810E Chipset
AHA
Bus
4 MB
Display
Cache
(Optional)
(Back Panel)
82801AA I/O Controller Hub
(ICH)
SMBus
PCI Bus
USB
USB Hub
Port 1
Port 2
LPC
Bus
LPC I/O
Controller
(Back Panel)
Port 0
(Front Panel)
Port 3
Port 4
82802AB
Firmware Hub
(FWH)
PS/2 Keyboard
(Optional)
PS/2 Mouse
(Optional)
Parallel Port
(Optional)
Serial Port A
(Optional)
10/100
Mbps
Ethernet
LAN
Subsystem
Figure 2. Block Diagram
AC Link
AD1881
Analog
Codec
Diagnostic
LEDs
(Optional)
CD-ROM
Line Out
Line In
OM09092
15
Intel Desktop Board YA810E Technical Product Specification
1.2 Online Support
Find information about YA810E desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites:
http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop
1.3 Design Specifications
Table 3 lists the specifications applicable to the YA810E board.
Table 3. Specifications
Reference Name
AC ‘97
ACPI
AGP
AMI BIOS
ATA-3
ATA-5
ATAPI
ATX
El Torito
Specification Title
Audio Codec ‘97
Advanced Configuration and Power Interface Specification
Accelerated Graphics Port Interface Specification
(2X only)
American Megatrends BIOS Specification
Information Technology ­AT Attachment-3 Interface, X3T10/2008D
Information Technology ­AT Attachment-3 Interface, X3T10/2008D
Information Technology AT Attachment with Packet Interface Extensions T13/1153D
ATX Specification
Bootable CD-ROM format specification
Version, Revision Date, and Ownership
Version 2.1, May 1998, Intel Corporation.
Version 1.0b, July 1, 1998, Intel Corporation, Microsoft Corporation, and Toshiba Corporation.
Version 2.0, May 4, 1998, Intel Corporation.
AMIBIOS 99, 1999 American Megatrends, Inc.
Version 6, October 1998, ASC X3T10.
Version 6, October 1998, ASC X3T10.
Version 18, August 19, 1998, Contact: T13 Chair, Seagate Technology.
Version 2.01, February 1997, Intel Corporation.
Version 1.0, January 25, 1995, Phoenix Technologies Ltd. and IBM Corporation.
This specification is available from:
ftp://download.intel.com/ pc-supp/platform/ac97
http://www.teleport.com/~acpi/
the Accelerated Graphics Implementers Forum at: http://www.agpforum.org/
http://www.amibios.com, or http://www.ami.com/download/ amibios99.pdf
ATA Anonymous FTP Site: ftp://www.dt.wdc.com/ata/ ata-3/
ATA Anonymous FTP Site: ftp://www.dt.wdc.com/ata/ ata-3/
T13 Anonymous FTP Site: ftp://fission.dt.wdc.com/ x3t13/project/ d1153r18.pdf
http://developer.intel.com/ design/motherbd/atx.htm
the Phoenix Web site at: http://www.ptltd.com/ techs/specs.html
continued
16
Table 3. Specifications (continued)
Reference Name
LPC
FlexATX FlexATX Addendum to
MicroATX
PCI
Plug and Play
SDRAM DIMMs (64-and 72-bit)
SMBIOS
Specification Title
Low Pin Count Interface Specification
the microATX Specification, Version 1.0
microATX Motherboard Interface Specification
SFX Power Supply Design Guide
PCI Local Bus Specification
PCI Bus Power Management Interface Specification
Plug and Play BIOS Specification
PC SDRAM Unbuffered DIMM Specification
PC SDRAM DIMM Specification
PC Serial Presence Detect (SPD) Specification
System Management BIOS
Version, Revision Date and Ownership
Version 1.0, September 29, 1997, Intel Corporation.
Version 1.0 March 1999, Intel Corporation.
Version 1.0, December 1997, Intel Corporation.
Version 1.0, December 1997, Intel Corporation.
Version 2.2, December 18, 1998, PCI Special Interest Group.
Version 1.1, December 18, 1998, PCI Special Interest Group.
Version 1.0a, May 5, 1994, Compaq Computer Corp., Phoenix Technologies Ltd., and Intel Corporation.
Version 1.0, February 1998, Intel Corporation.
Version 1.5, November 1997, Intel Corporation.
Version 1.2A, December 1997, Intel Corporation.
Version 2.3.1, August 12, 1998, Award Software International Inc., Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, American Megatrends Inc., SystemSoft Corporation, and Compaq Computer Corporation.
Product Description
This specification is available from:
http://www.intel.com/ design/chipsets/industry/ lpc.htm
http://www.teleport.com/ ~ffsupprt/spec/ FlexATXaddn1_01.pdf
http://www.teleport.com/ ~ffsupprt/spec/
http://www.teleport.com/ ~ffsupprt/spec/microatx/ sfx11_ps.pdf
http://www.pcisig.com/
http://www.pcisig.com/
ftp://download.intel.com/ ial/wfm/bio10a.pdf
http://www.intel.com/ design/chipsets/memory/
http://www.intel.com/ design/chipsets/memory/
http://www.intel.com/ design/chipsets/memory/
http://developer.intel.com/ ial/wfm/design/smbios
continued
17
Intel Desktop Board YA810E Technical Product Specification
Table 3. Specifications (continued)
Reference Name
UHCI
USB
WfM
Specification Title
Universal Host Controller Interface Design Guide
Universal Serial Bus Specification
Wired for Management Baseline
Version, Revision Date and Ownership
Version 1.1, March 1996, Intel Corporation.
Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC.
Version 2.0, December 18, 1998, Intel Corporation.
This specification is available from:
http://www.usb.org/ developers
http://www.usb.org/ developers
http://developer.intel.com/ ial/WfM/wfmspecs.htm
18
Product Description
1.4 Processor
CAUTION
The YA810E board supports processors that draw a maximum of 22 A. Using a processor that draws more than 22 A can damage the processor, the board, and the power supply. See the
processor’s data sheet for current usage requirements.
CAUTION
Before installing or removing the processor, make sure that AC power has been removed by unplugging the power cord from the computer. Failure to do so could damage the processor and the board.
The YA810E board supports either an Intel Pentium III processor (FCPGA package), or an Intel Celeron processor (PGA package) as shown in Table 4. The host bus speed is automatically selected.
Table 4. Supported Processors
Processor Type Processor Designation Host Bus Speed (MHz) L2 Cache Size (KB)
Pentium III processors 500E, 550E, and 600E 100 512
533B and 600B 133 512 533EB, 600EB, 667, and 733 133 256
Celeron processors 300A, 333, 366, 400, 433, 466,
500, and 533
66 128
All supported onboard memory can be cached, up to the cachability limit of the processor.
For information about Refer to
Processor support for the YA810E board http://support.intel.com/support/motherboards/desktop Processor data sheets http://www.intel.com/design/litcentr
19
Intel Desktop Board YA810E Technical Product Specification
1.5 System Memory
CAUTION
To be compliant with applicable Intel® SDRAM memory specifications, the YA810E board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, the BIOS will attempt to configure the memory controller for normal operation; however, the DIMMs may not function at their optimum speed.
CAUTION
Before installing or removing memory, make sure that AC power has been removed by unplugging the power cord from the computer. Failure to do so could damage the memory and the board.
CAUTION
Because the main system memory is also used as video memory, the board requires 100 MHz
SDRAM DIMMs even though the processor’s host bus speed is 66 MHz. It is highly recommended that SPD DIMMs be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted.
The YA810E board has two DIMM sockets. The minimum memory size is 16 MB and the maximum memory size is 512 MB. The BIOS automatically detects memory type, size, and speed. Memory can be installed in one or both sockets. Memory size can vary between sockets.
The YA810E board supports the following memory features:
• 3.3 V, 168-pin DIMMs with gold-plated contacts
• 100 MHz SDRAM
• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMMs)
• Non-ECC (64-bit) memory
• Unbuffered single- or double-sided DIMMs
The board is designed to support DIMMs in the configurations listed in Table 5 below.
Table 5. System Memory Configuration
DIMM Size Non-ECC Configuration
16 MB 2 Mbit x 64 32 MB 4 Mbit x 64 64 MB 8 Mbit x 64 128 MB 16 Mbit x 64 256 MB 32 Mbit x 64
For information about Refer to
The
PC Serial Presence Detect Specification
Obtaining copies of PC SDRAM specifications http://www.intel.com/design/pcisets/memory
20
Table 3, page 16
1.6 Intel® 810E Chipset
The Intel 810E chipset consists of the following devices:
• 82810E Graphics Memory Controller Hub (GMCH) with Accelerated Hub Architecture
(AHA) bus
• 82801AA I/O Controller Hub (ICH) with AHA bus
• 82802AB Firmware Hub (FWH)
The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.
Product Description
66/100/133 MHz
Host Bus
ATA33/66 USB
810E Chipset
100 MHz
SDRAM
Bus
Display
Interface
82810E
Graphics Memory
Controller Hub
(GMCH)
AHA
Bus
82801AA I/O Controller Hub
(ICH)
SMBus
PCI Bus
AC Link
Figure 3. Intel 810E Chipset Block Diagram
For information about Refer to The Intel 810E chipset http://www.developer.intel.com The resources used by the chipset Chapter 2 The chipset’s compliance with ACPI and AC ‘97 Table 3, page 16
82802AB
Firmware Hub
(FWH)
LPC Bus
OM09130
21
Intel Desktop Board YA810E Technical Product Specification
1.6.1 Direct AGP
Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics­intensive applications, such as 3D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency
For information about Refer to
The location of the VGA port connector Figure 6, page 46 Obtaining the
Accelerated Graphics Port Interface Specification
Table 3, page 16
1.6.2 USB
The YA810E board has five USB ports; one USB peripheral can be connected to each port. For more than five USB devices, an external hub can be connected to any of the ports. Three USB ports are implemented with stacked back panel connectors. The other two ports can be routed via a cable to the front panel. The YA810E board fully supports UHCI and uses UHCI-compatible software drivers. USB features include:
• Support for self-identifying peripherals that can be connected or disconnected while the
computer is running
• Automatic mapping of function to driver and configuration
• Support for isochronous and asynchronous transfer types over the same set of wires
• Support for up to 127 physical devices
• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other
applications
• Error-handling and fault-recovery mechanisms built into the protocol
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 6, page 46 The signal names of the USB connectors on the back panel Table 19, page 47 The location of the USB connectors on the front panel Figure 7, page 50 The signal names of the USB connectors on the front panel Table 32, page 53 The USB and UHCI specifications Table 3, page 16
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Product Description
1.6.3 IDE Support
The YA810E board has two independent bus-mastering IDE interfaces. These interfaces support:
• ATAPI devices (such as CD-ROM drives)
• ATA devices using the transfer modes listed in Table 56 on page 85
The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The YA810E board supports laser servo (LS-120) diskette technology through its IDE interfaces.
The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE connector has the standard IDE interface pins but also includes audio and power signals.
For information about Refer to
The location of the IDE connectors Figure 7, page 50 The signal names of the primary IDE connector Table 28, page 51 The signal names of the Slimline IDE connector Table 29, page 52
BIOS Setup program’s Boot menu Table 60, page 89
23
Intel Desktop Board YA810E Technical Product Specification
1.6.4 Real-Time Clock, CMOS SRAM, and Battery
The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The real­time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.
A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.
NOTE
✏
If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS SRAM at power on.
NOTE
✏
The recommended method of accessing the date in systems with Intel® desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.
For information about Refer to
Proper date access in systems with Intel de sktop boards http://support.intel.com/support/year2000/
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1.7 I/O Controller
The LPC47B277 I/O controller provides the following features:
• Low pin count (LPC) interface
• 3.3V operation
• One serial port (optional)
• Plug and Play compatible register set
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support (optional)
• PS/2-style mouse and keyboard interfaces (optional)
• Intelligent power management, including a programmable wake up event interface
• PME (Power Management Event) interface
• Fan control:One fan control outputOne fan tachometer input
The BIOS Setup program provides configuration options for the I/O controller.
Product Description
For information about Refer to
The LPC47B277 I/O controller www.smsc.com/main/catalog/lpc47b27x.html
1.7.1 Serial Port (Optional)
The YA810E board has one serial port connector the location of which is a manufacturing option.
The serial port’s NS16C550-compatible UART supports data transfers at speeds up to
115.2 kbits/sec with BIOS support. The serial port can be assigned as COM1 (3F8h), COM2
(2F8h), COM3 (3E8h), or COM4 (2E8h).
For information about Refer to
The location of the back panel serial port connector Figure 6, page 46 The signal names of the back panel serial port connector Table 20, page 47 The location of the optional midboard serial port connector Figure 7, page 50 The signal names of the optional midboard serial port connector Table 35, page 54
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Intel Desktop Board YA810E Technical Product Specification
1.7.2 Parallel Port (Optional)
The connector for the multimode bidirectional parallel port is a 25-pin D-Sub connector located on the back panel. In the BIOS Setup program, the parallel port can be configured for the following:
†
• Output only (PC AT
-compatible mode)
• Bi-directional (PS/2 compatible)
• EPP
• ECP
For information about Refer to
The location of the parallel port connector Figure 6, page 46 The signal names of the parallel port connector Table 21, page 48
1.7.3 PS/2 Keyboard and Mouse (Optional)
PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these
†
connectors are protected with a PolySwitch connection after an overcurrent condition is removed.
circuit that, like a self-healing fuse, reestablishes the
NOTE
✏
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.
The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.
The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software
reset. This key sequence resets the computer’s software by jumping to the beginning of the BIOS code and running the power-on self-test (POST).
For information about Refer to
The location of the keyboard and mouse connectors Figure 6, page 46 The signal names of the keyboard and mouse connectors Table 18, page 47
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1.8 Graphics Subsystem
The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features:
• Integrated 2-D and 3-D graphics engines
• Integrated hardware motion compression engine
• Integrated 230 MHz DAC
Table 6 lists the refresh rates supported by the graphics subsystem.
Table 6. Supported Graphics Refresh Rates
Resolution Available Refresh Rates (Hz)
640 x 200 x 16 colors 70 640 x 350 x 16 colors 70 640 x 400 x 256 colors 60, 70, 75, 85 640 x 400 x 64 K colors 60, 70, 75, 85 640 x 400 x 16 M colors 70 640 x 480 x 16 colors 60, 72, 75, 85 640 x 480 x 256 colors 60, 70, 72, 75, 85 640 x 480 x 32 K colors 60, 75, 85 640 x 480 x 64 K colors 60, 70, 72, 75, 85 640 x 480 x 16 M colors 60, 70, 72, 75, 85 800 x 600 x 256 colors 60, 75, 85 800 x 600 x 32 K colors 60, 70, 72, 75, 85 800 x 600 x 64 K colors 60, 70, 72, 75, 85 800 x 600 x 16 M colors 60, 70, 72, 75, 85 1024 x 768 x 256 colors 60, 70, 75, 85 1024 x 768 x 32 K colors 60, 75, 85 1024 x 768 x 64 K colors 60, 70, 72, 75, 85 1024 x 768 x 16 M colors 60, 70, 72, 75, 85 1056 x 800 x 16 colors 70 1280 x 1024 x 256 colors 60, 70, 72, 75, 85 1280 x 1024 x 32 K colors 60, 75, 85 1280 x 1024 x 64 K colors 60, 70, 72, 75 1280 x 1024 x 16 M colors 60, 70, 72, 75, 85
Product Description
For information about Refer to
Obtaining graphics software and utilities http://support.intel.com/support/motherboards/desktop
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Intel Desktop Board YA810E Technical Product Specification
1.9 Audio Subsystem
The YA810E board includes an Audio Codec ’97 (AC ’97) compatible audio subsystem consisting of these devices:
• Intel 82801AA ICH (AC link output)
• Analog Devices AD1881 analog codec
Figure 4 is a block diagram of the audio subsystem.
5 W Audio Amp
Mic In
CD-ROM
Line
Out
OM09488
82801AA
I/O Controller Hub (ICH)
AC Link
AD1881
Analog
Codec
Figure 4. Block Diagram of Audio Subsystem with AD1881 Codec
Features of the audio subsystem include:
• Independent channels for PCM in, PCM out, and Mic in
• 16-bit stereo I/O up to 48 kHz
• Multiple sample rates
For information about Refer to
Obtaining audio software and utilities http://support.intel.com/support/motherboards/desktop
1.9.1 AD1881 Analog Codec
The AD1881 is a fully AC ’97 compliant codec. The codec's features include:
• 16-bit stereo full-duplex operation
• High quality CD-ROM input with ground sense
• Stereo line level output
• Power management support
• Full duplex variable sampling rate (7 kHz to 48 kHz) with 1 Hz resolution
• Phat
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†
Stereo 3-D stereo enhancement
1.9.2 Audio Connectors
The audio connectors include the following:
• ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)
• Line out (front panel audio connector and back panel)
• Line in (front panel audio connector and back panel)
For information about Refer to
The location of the front panel audio connectors Figure 7, page 50 The signal names of the front panel audio connectors Table 26, page 51 The location of the ATAPI CD-ROM connector Figure 7, page 50 The signal names of the ATAPI CD-ROM connector Table 30, page 52 The back panel audio connectors Section 2.8.1, page 46 The front panel line out connector Section 2.8.3, page 55
✏ NOTE
Product Description
Some of the audio connectors are optional and are not installed on all versions of the board.
1.10 Hardware Monitor Component (Optional)
The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:
• Internal ambient temperature sensing
• Remote thermal diode sensing for direct monitoring of processor temperature
• Power supply monitoring (+12, +5, +3.3, +2.5, V
acceptable values
• SMBus interface
• The hardware monitor component enables the board to be compatible with the Wired for
Management (WfM) specification.
For information about Refer to
The board’s compatibility with the WfM specification Table 3, page 16
CCP) to detect levels above or below
29
Intel Desktop Board YA810E Technical Product Specification
1.11 LAN Subsystem
The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:
• 32-bit, 33 MHz direct bus mastering on the PCI bus
• 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and
activity status LEDs
• IEEE 802.3u Auto-Negotiation for the fastest available connection
• Jumperless configuration; the LAN subsystem is completely software-configurable
For information about Refer to
The WfM specification Table 3, page 16
1.11.1 Intel® 82559 PCI LAN Controller
The Intel 82559 PCI LAN controller’s features include:
• CSMA/CD Protocol Engine
• PCI bus interface
• DMA engine for movement of commands, status, and network data across the PCI bus
• Integrated physical layer interface, including:Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces;
when in 10 Mbit/sec mode, the interface drives the cable directly
A complete set of Media Independent Interface (MII) management registers for control
and status reporting
802.3u Auto-Negotiation for automatically establishing the best operating mode when
connected to other 10Base-T or 100Base-TX devices, whether half- or full-duplex capable
Integrated power management features, including support for Wake on LAN† technology
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For information about Refer to
The LAN subsystem’s PCI specification compliance Table 3, page 16
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