Intel YA810E Technical Product Specification

Intel® Desktop Board YA810E

Technical Product Specification

The Intel® Desktop Board YA810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board YA810E Specification Update.

December 1999 Order Number A00984-001

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board YA810E Technical Product Specification.

This product specification applies to only standard YA810E boards with BIOS identifier YA810E10A.86A.

Changes to this specification will be published in the Intel® Desktop Board YA810E Specification Update before being incorporated into a revision of this document.

December 1999

Information in this doc um ent is provided in connection wi t h Intel products. No license, express or implied, by estoppel or otherwise, to any intell ectual property rights is granted by this document. E x cept as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and I nt el dis claims any express or implied warranty, relating to sale and/or use of I ntel products including liability or warranties relat i ng t o f i t ness for a particular purpose, merchantability, or infringement of any patent, copyright or other int ellec t ual propert y right. Intel products are not intended for use in medical, l i f e saving, or life sustai ni ng appl i cations.

Intel may make changes t o specifications and produc t descriptions at any tim e, without notice. The YA810E board may contain des i gn def ects or errors known as errata that m ay cause the product to deviat e from

published specificat i ons. Current characterized errata are available on request. Contact your local Int el sales office or your distributor to obtain the latest specifications before pl acing your product order. Copies of documents whic h hav e an orderi ng number and are referenced in this document, or other Intel literature, may be

obtained from:

Intel Corporation P.O. Box 5937 Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

†

Third-party brands and names are the property of their respective owners.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the YA810E desktop board. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the YA810E board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on this board 2 A map of the resources of the board 3 The features supported by the BIOS Setup program 4 The contents of the BIOS Setup program’s menus and submenus

5 A description of the BIOS error messages, beep codes, and POST codes

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

✏

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions which, if not observed, can cause personal injury.

iii

Intel Desktop Board YA810E Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative

coordinates of its location on the YA810E board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in

the 5J area. KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) MB Megabyte (1,048,576 bytes) Mbit Megabit (1,048,576 bits) GB Gigabyte (1,073,741,824 bytes) xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified.

†

This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description

1.1 Overview ................................................................................................................... 12

1.1.1 Feature Summary ....................................................................................... 12

1.1.2 Manufacturing Options................................................................................ 13

1.1.3 YA810E Board Layout................................................................................. 14

1.1.4 Block Diagram............................................................................................. 15

1.2 Online Support........................................................................................................... 16

1.3 Design Specifications ................................................................................................ 16

1.4 Processor..................................................................................................................19

1.5 System Memory......................................................................................................... 20

1.6 Intel

1.7 I/O Controller............................................................................................................. 25

1.8 Graphics Subsystem ................................................................................................. 27

1.9 Audio Subsystem....................................................................................................... 28

1.10 Hardware Monitor Component................................................................................... 29

1.11 LAN Subsystem......................................................................................................... 30

1.12 Power Management Features.................................................................................... 32

810E Chipset................................................................................................... 21

1.6.1 Direct AGP.................................................................................................. 22

1.6.2 USB............................................................................................................. 22

1.6.3 IDE Support................................................................................................. 23

1.6.4 Real-Time Clock, CMOS SRAM, and Battery.............................................. 24

1.7.1 Serial Port (Optional)................................................................................... 25

1.7.2 Parallel Port (Optional)................................................................................ 26

1.7.3 PS/2 Keyboard and Mouse (Optional)......................................................... 26

1.9.1 AD1881 Analog Codec................................................................................ 28

1.9.2 Audio Connectors........................................................................................ 29

1.11.1 Intel

1.11.2 LAN Subsystem Software............................................................................ 31

1.11.3 RJ-45 LAN Connector LEDs........................................................................ 31

1.12.1 ACPI............................................................................................................ 32

1.12.2 Hardware Support....................................................................................... 34

82559 PCI LAN Controller ................................................................. 30

2 Technical Reference

2.1 Introduction................................................................................................................39

2.2 Memory Map ............................................................................................................. 39

2.3 I/O Map ..................................................................................................................... 40

2.4 DMA Channels .......................................................................................................... 42

2.5 PCI Configuration Space Map ................................................................................... 42

2.6 Interrupts...................................................................................................................43

2.7 PCI Interrupt Routing Map......................................................................................... 44

Intel Desktop Board YA810E Technical Product Specification

2.8 Connectors................................................................................................................ 45

2.8.1 Back Panel Connectors............................................................................... 46

2.8.2 Midboard Connectors.................................................................................. 50

2.8.3 Front Panel Connector................................................................................ 55

2.9 Jumper Block............................................................................................................. 58

2.10 Mechanical Considerations........................................................................................ 60

2.10.1 FlexATX Form Factor.................................................................................. 60

2.10.2 I/O Shield.................................................................................................... 61

2.11 Electrical Considerations........................................................................................... 62

2.11.1 Power Consumption.................................................................................... 62

2.11.2 Power Supply Considerations...................................................................... 63

2.11.3 Standby Current Requirements................................................................... 63

2.11.4 Fan Power Requirements............................................................................ 63

2.12 Thermal Considerations............................................................................................. 64

2.13 Reliability................................................................................................................... 65

2.14 Environmental............................................................................................................ 66

2.15 Regulatory Compliance............................................................................................. 67

2.15.1 Safety Regulations...................................................................................... 67

2.15.2 EMC Regulations ........................................................................................ 67

2.15.3 Certification Markings .................................................................................. 68

3 Overview of BIOS Features

3.1 Introduction................................................................................................................69

3.2 BIOS Flash Memory Organization............................................................................. 70

3.3 PCI IDE Support........................................................................................................ 70

3.4 System Management BIOS (SMBIOS)...................................................................... 71

3.5 BIOS Upgrades ......................................................................................................... 72

3.5.1 Language Support....................................................................................... 72

3.5.2 Custom Splash Screen................................................................................ 72

3.6 Recovering BIOS Data.............................................................................................. 73

3.7 Boot Options.............................................................................................................. 74

3.7.1 CD-ROM and Network Boot........................................................................ 74

3.7.2 Booting Without Attached Devices.............................................................. 74

3.8 USB Legacy Support................................................................................................. 75

3.9 BIOS Security Features............................................................................................. 76

4 BIOS Setup Program

4.1 Introduction................................................................................................................77

4.2 Maintenance Menu.................................................................................................... 78

4.2.1 Extended Configuration Submenu............................................................... 79

4.3 Main Menu................................................................................................................. 80

4.4 Advanced Menu......................................................................................................... 81

4.4.1 Boot Configuration Submenu ...................................................................... 82

4.4.2 Peripheral Configuration Submenu.............................................................. 83

4.4.3 IDE Configuration Submenu........................................................................ 84

4.4.4 IDE Configuration Sub-Submenus............................................................... 85

4.4.5 Event Log Configuration Submenu.............................................................. 86

4.5 Security Menu............................................................................................................87

4.6 Power Menu.............................................................................................................. 88

4.7 Boot Menu................................................................................................................. 89

4.7.1 IDE Drive Configuration Submenu............................................................... 90

4.8 Exit Menu.................................................................................................................. 91

5 Error Messages and Beep Codes

5.1 BIOS Error Messages................................................................................................ 93

5.2 Port 80h POST Codes............................................................................................... 95

5.3 Bus Initialization Checkpoints.................................................................................... 99

5.4 Speaker................................................................................................................... 100

5.5 BIOS Beep Codes................................................................................................... 101

5.6 Enhanced Diagnostics............................................................................................. 102

Figures

1. YA810E Board Components...................................................................................... 14

2. Block Diagram........................................................................................................... 15

3. Intel 810E Chipset Block Diagram............................................................................. 21

4. Block Diagram of Audio Subsystem with AD1881 Codec........................................... 28

5. Connector Groups..................................................................................................... 45

6. Back Panel Connectors............................................................................................. 46

7. Midboard Connectors ................................................................................................ 50

8. Front Panel Connector............................................................................................... 55

9. Location of the BIOS Setup Jumper Block................................................................. 58

10. Board Dimensions..................................................................................................... 60

11. I/O Shield Dimensions............................................................................................... 61

12. High Temperature Zones........................................................................................... 64

13. Memory Map of the Flash Memory Device ................................................................ 70

14. Enhanced Diagnostic LEDs..................................................................................... 102

Contents

Tables

1. Feature Summary...................................................................................................... 12

2. Manufacturing Options............................................................................................... 13

3. Specifications ............................................................................................................ 16

4. Supported Processors............................................................................................... 19

5. System Memory Configuration................................................................................... 20

6. Supported Graphics Refresh Rates........................................................................... 27

7. LAN Connector LED States....................................................................................... 31

8. Effects of Pressing the Power Switch........................................................................ 32

9. Power States and Targeted System Power............................................................... 33

10. Wake Up Devices and Events................................................................................... 34

11. Fan Connector Descriptions...................................................................................... 35

12. System Memory Map................................................................................................. 39

13. I/O Map ..................................................................................................................... 40

14. DMA Channels .......................................................................................................... 42

15. PCI Configuration Space Map ................................................................................... 42

vii

Intel Desktop Board YA810E Technical Product Specification

16. Interrupts...................................................................................................................43

17. PCI Interrupt Routing Map......................................................................................... 44

18. PS/2 Mouse/Keyboard (Optional).............................................................................. 47

19. USB Ports 0, 1, and 2................................................................................................ 47

20. Serial Port (Optional)................................................................................................. 47

21. Parallel Port (Optional) .............................................................................................. 48

22. VGA Port................................................................................................................... 48

23. LAN........................................................................................................................... 49

24. Audio Line In.............................................................................................................. 49

25. Audio Line Out........................................................................................................... 49

26. Front Panel Audio (J2D1).......................................................................................... 51

27. Fan 2, Processor (J7J1) ............................................................................................ 51

28. Primary IDE (J7E1).................................................................................................... 51

29. Secondary IDE, Slimline, ATA-5 (J8E1)..................................................................... 52

30. ATAPI CD-ROM (J7C1)............................................................................................. 52

31. Power (J8B1)............................................................................................................. 53

32. USB Front Panel, Optional (J7A1)............................................................................. 53

33. Fan 1, Chassis (J6A1)............................................................................................... 53

34. Speaker (J2C1) ......................................................................................................... 53

35. Serial Port, Optional (J1G2)....................................................................................... 54

36. Front Panel Connector (J8C1)................................................................................... 56

37. States for a Single-Colored Power LED..................................................................... 56

38. States for a Dual-Colored Power LED....................................................................... 56

39. BIOS Setup Configuration Jumper Settings (J7A1) ................................................... 59

40. Power Usage............................................................................................................. 62

41. Fan DC Power Requirements.................................................................................... 63

42. Thermal Considerations for Components .................................................................. 65

43. Environmental Specifications..................................................................................... 66

44. Safety Regulations .................................................................................................... 67

45. EMC Regulations....................................................................................................... 67

46. Supervisor and User Password Functions................................................................. 76

47. BIOS Setup Program Menu Functions....................................................................... 77

48. BIOS Setup Program Function Keys ......................................................................... 78

49. Maintenance Menu.................................................................................................... 78

50. Extended Configuration Submenu............................................................................. 79

51. Main Menu................................................................................................................. 80

52. Advanced Menu......................................................................................................... 81

53. Boot Configuration Submenu..................................................................................... 82

54. Peripheral Configuration Submenu............................................................................ 83

55. IDE Configuration...................................................................................................... 84

56. IDE Configuration Sub-Submenus............................................................................. 85

57. Event Log Configuration Submenu............................................................................ 86

58. Security Menu............................................................................................................87

59. Power Menu.............................................................................................................. 88

60. Boot Menu................................................................................................................. 89

61. IDE Drive Configuration Submenu............................................................................. 90

62. Exit Menu.................................................................................................................. 91

63. BIOS Error Messages................................................................................................ 93

viii

Contents

64. Uncompressed INIT Code Checkpoints..................................................................... 95

65. Boot Block Recovery Code Check Points.................................................................. 95

66. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 96

67. Bus Initialization Checkpoints.................................................................................... 99

68. Upper Nibble High Byte Functions............................................................................. 99

69. Lower Nibble High Byte Functions........................................................................... 100

70. Beep Codes............................................................................................................. 101

71. Diagnostic LED Codes............................................................................................. 103

Intel Desktop Board YA810E Technical Product Specification

1 Product Description

What This Chapter Contains

1.1 Overview ................................................................................................................... 12

1.2 Online Support........................................................................................................... 16

1.3 Design Specifications ................................................................................................ 16

1.4 Processor.................................................................................................................. 19

1.5 System Memory......................................................................................................... 20

1.6 Intel

1.7 I/O Controller............................................................................................................. 25

1.8 Graphics Subsystem ................................................................................................. 27

1.9 Audio Subsystem....................................................................................................... 28

1.10 Hardware Monitor Component................................................................................... 29

1.11 LAN Subsystem......................................................................................................... 30

1.12 Power Management Features.................................................................................... 32

810E Chipset................................................................................................... 21

Intel Desktop Board YA810E Technical Product Specification

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the YA810E board’s major features.

Table 1. Feature Summary

Form Factor Processor

Memory

Chipset

Direct AGP Video

Audio

I/O Control Peripheral Interfaces

BIOS

LAN Controller Instantly Available PC

FlexATX (9.0 inches by 7.5 inches) Support for either an:

• Intel

• Two 168-pin dual inline memory module (DIMM) sockets

• Supports up to 512 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)

• Support for serial presence detect (SPD) and non-SPD DIMMs

Intel® 810E chipset, consisting of:

• Intel

• Intel 82810E DC-133 GMCH

• VGA port connector on back panel

Audio Codec ’97 (AC’97) compatible audio subsystem, consisting of the following:

• Intel 82801AA ICH (AC link output)

• Analog Devices AD1881 analog codec

LPC47B277 Low Pin Count (LPC) I/O controller

• Three back-panel mounted universal serial bus (USB) ports

• Two IDE interfaces with Ultra DMA support

• Intel/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)

• Support for Advanced Configuration and Power Interface (ACPI), Plug and

Intel

• Support for

• Suspend-to-RAM support

• Wake from USB ports

Pentium® III processor with 512 KB L2 cache (in an FCPGA package)

Celeron™ processor with 128 KB L2 cache (in a PGA package)

82810E Graphics/Memory Controller Hub (GMCH)

82801AA I/O Controller Hub (ICH)

82802AB 4 Mbit Firmware Hub (FWH)

Play, and SMBIOS

82559 local area network (LAN) controller

PCI Local Bus Specification

, Revision 2.2

NOTE

✏

The YA810E board is designed to support only USB-aware operating systems.

For information about Refer to

The board’s compliance level with ACPI, Plug and Play, and SMBIOS Table 3, page 16

Product Description

1.1.2 Manufacturing Options

Table 2 describes the YA810E board’s manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.

Table 2. Manufacturing Options

Legacy I/O Connectors

Diagnostic LEDs USB Slimline IDE Enhanced Video Management

Level 4

• One back panel 9-pin serial port connector, or one internal serial port connector

• One back panel 25-pin parallel port connector

• PS/2 keyboard and mouse connectors

Extended diagnostics back-panel four-LED set Two internal USB ports are available for front panel access ATA-5 compliant connector 4 MB SDRAM display cache (optional) Hardware monitor

Intel Desktop Board YA810E Technical Product Specification

1.1.3 YA810E Board Layout

Figure 1 shows the location of the major components on the YA810E board.

C O N

D M

I H G F

OM08944

A Diagnostic LEDs J Battery B Back panel connectors K Speaker C Intel 82810E GMCH (Graphics/Memory Controller Hub) L Intel 82801AA ICH (I/O Controller Hub) D Processor socket M Intel 82802AB FWH (Firmware Hub) E DIMM sockets N 4 MB display cache (optional) F Primary IDE connector O SMSC LPC47B277 I/O Controller G Secondary IDE connector (Slimline) P Intel 82559 Ethernet Controller H Front panel connector Q AD1881 Audio Codec I Power connector

Figure 1. YA810E Board Components

1.1.4 Block Diagram

Figure 2 is a block diagram of the major functional areas of the YA810E board.

Product Description

Processor Connector

100 MHz

SDRAM

Bus

DIMM Banks

0 and 1

VGA

Port

66/100/133

MHz Host Bus

Display

Interface

Primary/

Secondary IDE

Interface

82810E

Graphics Memory

Controller Hub

(GMCH)

Hardware

Monitor

(Optional)

ATA33/66

810E Chipset

AHA

Bus

4 MB

Display

Cache

(Optional)

(Back Panel)

82801AA I/O Controller Hub

(ICH)

SMBus

PCI Bus

USB

USB Hub

Port 1

Port 2

LPC

Bus

LPC I/O

Controller

(Back Panel)

Port 0

(Front Panel)

Port 3

Port 4

82802AB

Firmware Hub

(FWH)

PS/2 Keyboard

(Optional)

PS/2 Mouse

(Optional)

Parallel Port

(Optional)

Serial Port A

(Optional)

10/100

Mbps

Ethernet

LAN

Subsystem

Figure 2. Block Diagram

AC Link

AD1881

Analog

Codec

Diagnostic

LEDs

(Optional)

CD-ROM

Line Out

Line In

OM09092

Intel Desktop Board YA810E Technical Product Specification

1.2 Online Support

Find information about YA810E desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites:

http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop

1.3 Design Specifications

Table 3 lists the specifications applicable to the YA810E board.

Table 3. Specifications

Reference Name

AC ‘97

ACPI

AGP

AMI BIOS

ATA-3

ATA-5

ATAPI

ATX

El Torito

Specification Title

Audio Codec ‘97

Advanced Configuration and Power Interface Specification

Accelerated Graphics Port Interface Specification

(2X only)

American Megatrends BIOS Specification

Information Technology AT Attachment-3 Interface, X3T10/2008D

Information Technology AT Attachment with Packet Interface Extensions T13/1153D

ATX Specification

Bootable CD-ROM format specification

Version, Revision Date, and Ownership

Version 2.1, May 1998, Intel Corporation.

Version 1.0b, July 1, 1998, Intel Corporation, Microsoft Corporation, and Toshiba Corporation.

Version 2.0, May 4, 1998, Intel Corporation.

AMIBIOS 99, 1999 American Megatrends, Inc.

Version 6, October 1998, ASC X3T10.

Version 18, August 19, 1998, Contact: T13 Chair, Seagate Technology.

Version 2.01, February 1997, Intel Corporation.

Version 1.0, January 25, 1995, Phoenix Technologies Ltd. and IBM Corporation.

This specification is available from:

ftp://download.intel.com/ pc-supp/platform/ac97

http://www.teleport.com/~acpi/

the Accelerated Graphics Implementers Forum at: http://www.agpforum.org/

http://www.amibios.com, or http://www.ami.com/download/ amibios99.pdf

ATA Anonymous FTP Site: ftp://www.dt.wdc.com/ata/ ata-3/

T13 Anonymous FTP Site: ftp://fission.dt.wdc.com/ x3t13/project/ d1153r18.pdf

http://developer.intel.com/ design/motherbd/atx.htm

the Phoenix Web site at: http://www.ptltd.com/ techs/specs.html

continued

Table 3. Specifications (continued)

Reference Name

LPC

FlexATX FlexATX Addendum to

MicroATX

PCI

Plug and Play

SDRAM DIMMs (64-and 72-bit)

SMBIOS

Specification Title

Low Pin Count Interface Specification

the microATX Specification, Version 1.0

microATX Motherboard Interface Specification

SFX Power Supply Design Guide

PCI Local Bus Specification

PCI Bus Power Management Interface Specification

Plug and Play BIOS Specification

PC SDRAM Unbuffered DIMM Specification

PC SDRAM DIMM Specification

PC Serial Presence Detect (SPD) Specification

System Management BIOS

Version, Revision Date and Ownership

Version 1.0, September 29, 1997, Intel Corporation.

Version 1.0 March 1999, Intel Corporation.

Version 1.0, December 1997, Intel Corporation.

Version 2.2, December 18, 1998, PCI Special Interest Group.

Version 1.1, December 18, 1998, PCI Special Interest Group.

Version 1.0a, May 5, 1994, Compaq Computer Corp., Phoenix Technologies Ltd., and Intel Corporation.

Version 1.0, February 1998, Intel Corporation.

Version 1.5, November 1997, Intel Corporation.

Version 1.2A, December 1997, Intel Corporation.

Version 2.3.1, August 12, 1998, Award Software International Inc., Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, American Megatrends Inc., SystemSoft Corporation, and Compaq Computer Corporation.

Product Description

This specification is available from:

http://www.intel.com/ design/chipsets/industry/ lpc.htm

http://www.teleport.com/ ~ffsupprt/spec/ FlexATXaddn1_01.pdf

http://www.teleport.com/ ~ffsupprt/spec/

http://www.teleport.com/ ~ffsupprt/spec/microatx/ sfx11_ps.pdf

http://www.pcisig.com/

ftp://download.intel.com/ ial/wfm/bio10a.pdf

http://www.intel.com/ design/chipsets/memory/

http://developer.intel.com/ ial/wfm/design/smbios

continued

Intel Desktop Board YA810E Technical Product Specification

Table 3. Specifications (continued)

Reference Name

UHCI

USB

WfM

Specification Title

Universal Host Controller Interface Design Guide

Universal Serial Bus Specification

Wired for Management Baseline

Version, Revision Date and Ownership

Version 1.1, March 1996, Intel Corporation.

Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC.

Version 2.0, December 18, 1998, Intel Corporation.

This specification is available from:

http://www.usb.org/ developers

http://developer.intel.com/ ial/WfM/wfmspecs.htm

Product Description

1.4 Processor

CAUTION

The YA810E board supports processors that draw a maximum of 22 A. Using a processor that draws more than 22 A can damage the processor, the board, and the power supply. See the

processor’s data sheet for current usage requirements.

CAUTION

Before installing or removing the processor, make sure that AC power has been removed by unplugging the power cord from the computer. Failure to do so could damage the processor and the board.

The YA810E board supports either an Intel Pentium III processor (FCPGA package), or an Intel Celeron processor (PGA package) as shown in Table 4. The host bus speed is automatically selected.

Table 4. Supported Processors

Processor Type Processor Designation Host Bus Speed (MHz) L2 Cache Size (KB)

Pentium III processors 500E, 550E, and 600E 100 512

533B and 600B 133 512 533EB, 600EB, 667, and 733 133 256

Celeron processors 300A, 333, 366, 400, 433, 466,

500, and 533

66 128

All supported onboard memory can be cached, up to the cachability limit of the processor.

For information about Refer to

Processor support for the YA810E board http://support.intel.com/support/motherboards/desktop Processor data sheets http://www.intel.com/design/litcentr

Intel Desktop Board YA810E Technical Product Specification

1.5 System Memory

CAUTION

To be compliant with applicable Intel® SDRAM memory specifications, the YA810E board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, the BIOS will attempt to configure the memory controller for normal operation; however, the DIMMs may not function at their optimum speed.

CAUTION

Before installing or removing memory, make sure that AC power has been removed by unplugging the power cord from the computer. Failure to do so could damage the memory and the board.

CAUTION

Because the main system memory is also used as video memory, the board requires 100 MHz

SDRAM DIMMs even though the processor’s host bus speed is 66 MHz. It is highly recommended that SPD DIMMs be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted.

The YA810E board has two DIMM sockets. The minimum memory size is 16 MB and the maximum memory size is 512 MB. The BIOS automatically detects memory type, size, and speed. Memory can be installed in one or both sockets. Memory size can vary between sockets.

The YA810E board supports the following memory features:

• 3.3 V, 168-pin DIMMs with gold-plated contacts

• 100 MHz SDRAM

• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMMs)

• Non-ECC (64-bit) memory

• Unbuffered single- or double-sided DIMMs

The board is designed to support DIMMs in the configurations listed in Table 5 below.

Table 5. System Memory Configuration

DIMM Size Non-ECC Configuration

16 MB 2 Mbit x 64 32 MB 4 Mbit x 64 64 MB 8 Mbit x 64 128 MB 16 Mbit x 64 256 MB 32 Mbit x 64

For information about Refer to

The

PC Serial Presence Detect Specification

Obtaining copies of PC SDRAM specifications http://www.intel.com/design/pcisets/memory

Table 3, page 16

1.6 Intel® 810E Chipset

The Intel 810E chipset consists of the following devices:

• 82810E Graphics Memory Controller Hub (GMCH) with Accelerated Hub Architecture

(AHA) bus

• 82801AA I/O Controller Hub (ICH) with AHA bus

• 82802AB Firmware Hub (FWH)

The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.

Product Description

66/100/133 MHz

Host Bus

ATA33/66 USB

810E Chipset

100 MHz

SDRAM

Bus

Display

Interface

82810E

Graphics Memory

Controller Hub

(GMCH)

AHA

Bus

82801AA I/O Controller Hub

(ICH)

SMBus

PCI Bus

AC Link

Figure 3. Intel 810E Chipset Block Diagram

For information about Refer to The Intel 810E chipset http://www.developer.intel.com The resources used by the chipset Chapter 2 The chipset’s compliance with ACPI and AC ‘97 Table 3, page 16

82802AB

Firmware Hub

(FWH)

LPC Bus

OM09130

Intel Desktop Board YA810E Technical Product Specification

1.6.1 Direct AGP

Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphicsintensive applications, such as 3D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features:

• Pipelined memory read and write operations that hide memory access latency

• Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency

For information about Refer to

The location of the VGA port connector Figure 6, page 46 Obtaining the

Accelerated Graphics Port Interface Specification

Table 3, page 16

1.6.2 USB

The YA810E board has five USB ports; one USB peripheral can be connected to each port. For more than five USB devices, an external hub can be connected to any of the ports. Three USB ports are implemented with stacked back panel connectors. The other two ports can be routed via a cable to the front panel. The YA810E board fully supports UHCI and uses UHCI-compatible software drivers. USB features include:

• Support for self-identifying peripherals that can be connected or disconnected while the

computer is running

• Automatic mapping of function to driver and configuration

• Support for isochronous and asynchronous transfer types over the same set of wires

• Support for up to 127 physical devices

• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other

applications

• Error-handling and fault-recovery mechanisms built into the protocol

NOTE

✏

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 6, page 46 The signal names of the USB connectors on the back panel Table 19, page 47 The location of the USB connectors on the front panel Figure 7, page 50 The signal names of the USB connectors on the front panel Table 32, page 53 The USB and UHCI specifications Table 3, page 16

Product Description

1.6.3 IDE Support

The YA810E board has two independent bus-mastering IDE interfaces. These interfaces support:

• ATAPI devices (such as CD-ROM drives)

• ATA devices using the transfer modes listed in Table 56 on page 85

The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The YA810E board supports laser servo (LS-120) diskette technology through its IDE interfaces.

The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

• ARMD-FDD (ATAPI removable media device – floppy disk drive)

• ARMD-HDD (ATAPI removable media device – hard disk drive)

The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE connector has the standard IDE interface pins but also includes audio and power signals.

For information about Refer to

The location of the IDE connectors Figure 7, page 50 The signal names of the primary IDE connector Table 28, page 51 The signal names of the Slimline IDE connector Table 29, page 52

BIOS Setup program’s Boot menu Table 60, page 89

Intel Desktop Board YA810E Technical Product Specification

1.6.4 Real-Time Clock, CMOS SRAM, and Battery

The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The realtime clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

NOTE

✏

If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS SRAM at power on.

NOTE

✏

The recommended method of accessing the date in systems with Intel® desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For information about Refer to

Proper date access in systems with Intel de sktop boards http://support.intel.com/support/year2000/

1.7 I/O Controller

The LPC47B277 I/O controller provides the following features:

• Low pin count (LPC) interface

• 3.3V operation

• One serial port (optional)

• Plug and Play compatible register set

• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port

(EPP) support (optional)

• PS/2-style mouse and keyboard interfaces (optional)

• Intelligent power management, including a programmable wake up event interface

• PME (Power Management Event) interface

• Fan control:  One fan control output  One fan tachometer input

The BIOS Setup program provides configuration options for the I/O controller.

Product Description

For information about Refer to

The LPC47B277 I/O controller www.smsc.com/main/catalog/lpc47b27x.html

1.7.1 Serial Port (Optional)

The YA810E board has one serial port connector the location of which is a manufacturing option.

The serial port’s NS16C550-compatible UART supports data transfers at speeds up to

115.2 kbits/sec with BIOS support. The serial port can be assigned as COM1 (3F8h), COM2

(2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about Refer to

The location of the back panel serial port connector Figure 6, page 46 The signal names of the back panel serial port connector Table 20, page 47 The location of the optional midboard serial port connector Figure 7, page 50 The signal names of the optional midboard serial port connector Table 35, page 54

Intel Desktop Board YA810E Technical Product Specification

1.7.2 Parallel Port (Optional)

The connector for the multimode bidirectional parallel port is a 25-pin D-Sub connector located on the back panel. In the BIOS Setup program, the parallel port can be configured for the following:

†

• Output only (PC AT

-compatible mode)

• Bi-directional (PS/2 compatible)

• EPP

• ECP

For information about Refer to

The location of the parallel port connector Figure 6, page 46 The signal names of the parallel port connector Table 21, page 48

1.7.3 PS/2 Keyboard and Mouse (Optional)

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these

†

connectors are protected with a PolySwitch connection after an overcurrent condition is removed.

circuit that, like a self-healing fuse, reestablishes the

NOTE

✏

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.

The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software

reset. This key sequence resets the computer’s software by jumping to the beginning of the BIOS code and running the power-on self-test (POST).

For information about Refer to

The location of the keyboard and mouse connectors Figure 6, page 46 The signal names of the keyboard and mouse connectors Table 18, page 47

1.8 Graphics Subsystem

The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features:

• Integrated 2-D and 3-D graphics engines

• Integrated hardware motion compression engine

• Integrated 230 MHz DAC

Table 6 lists the refresh rates supported by the graphics subsystem.

Table 6. Supported Graphics Refresh Rates

Resolution Available Refresh Rates (Hz)

640 x 200 x 16 colors 70 640 x 350 x 16 colors 70 640 x 400 x 256 colors 60, 70, 75, 85 640 x 400 x 64 K colors 60, 70, 75, 85 640 x 400 x 16 M colors 70 640 x 480 x 16 colors 60, 72, 75, 85 640 x 480 x 256 colors 60, 70, 72, 75, 85 640 x 480 x 32 K colors 60, 75, 85 640 x 480 x 64 K colors 60, 70, 72, 75, 85 640 x 480 x 16 M colors 60, 70, 72, 75, 85 800 x 600 x 256 colors 60, 75, 85 800 x 600 x 32 K colors 60, 70, 72, 75, 85 800 x 600 x 64 K colors 60, 70, 72, 75, 85 800 x 600 x 16 M colors 60, 70, 72, 75, 85 1024 x 768 x 256 colors 60, 70, 75, 85 1024 x 768 x 32 K colors 60, 75, 85 1024 x 768 x 64 K colors 60, 70, 72, 75, 85 1024 x 768 x 16 M colors 60, 70, 72, 75, 85 1056 x 800 x 16 colors 70 1280 x 1024 x 256 colors 60, 70, 72, 75, 85 1280 x 1024 x 32 K colors 60, 75, 85 1280 x 1024 x 64 K colors 60, 70, 72, 75 1280 x 1024 x 16 M colors 60, 70, 72, 75, 85

Product Description

For information about Refer to

Obtaining graphics software and utilities http://support.intel.com/support/motherboards/desktop

Intel Desktop Board YA810E Technical Product Specification

1.9 Audio Subsystem

The YA810E board includes an Audio Codec ’97 (AC ’97) compatible audio subsystem consisting of these devices:

• Intel 82801AA ICH (AC link output)

• Analog Devices AD1881 analog codec

Figure 4 is a block diagram of the audio subsystem.

5 W Audio Amp

Mic In

CD-ROM

Line

Out

OM09488

82801AA

I/O Controller Hub (ICH)

AC Link

AD1881

Analog

Codec

Figure 4. Block Diagram of Audio Subsystem with AD1881 Codec

Features of the audio subsystem include:

• Independent channels for PCM in, PCM out, and Mic in

• 16-bit stereo I/O up to 48 kHz

• Multiple sample rates

For information about Refer to

Obtaining audio software and utilities http://support.intel.com/support/motherboards/desktop

1.9.1 AD1881 Analog Codec

The AD1881 is a fully AC ’97 compliant codec. The codec's features include:

• 16-bit stereo full-duplex operation

• High quality CD-ROM input with ground sense

• Stereo line level output

• Power management support

• Full duplex variable sampling rate (7 kHz to 48 kHz) with 1 Hz resolution

• Phat

†

Stereo 3-D stereo enhancement

1.9.2 Audio Connectors

The audio connectors include the following:

• ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)

• Line out (front panel audio connector and back panel)

• Line in (front panel audio connector and back panel)

For information about Refer to

The location of the front panel audio connectors Figure 7, page 50 The signal names of the front panel audio connectors Table 26, page 51 The location of the ATAPI CD-ROM connector Figure 7, page 50 The signal names of the ATAPI CD-ROM connector Table 30, page 52 The back panel audio connectors Section 2.8.1, page 46 The front panel line out connector Section 2.8.3, page 55

✏ NOTE

Product Description

Some of the audio connectors are optional and are not installed on all versions of the board.

1.10 Hardware Monitor Component (Optional)

The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:

• Internal ambient temperature sensing

• Remote thermal diode sensing for direct monitoring of processor temperature

• Power supply monitoring (+12, +5, +3.3, +2.5, V

acceptable values

• SMBus interface

• The hardware monitor component enables the board to be compatible with the Wired for

Management (WfM) specification.

For information about Refer to

The board’s compatibility with the WfM specification Table 3, page 16

CCP) to detect levels above or below

Intel Desktop Board YA810E Technical Product Specification

1.11 LAN Subsystem

The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:

• 32-bit, 33 MHz direct bus mastering on the PCI bus

• 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and

activity status LEDs

• IEEE 802.3u Auto-Negotiation for the fastest available connection

• Jumperless configuration; the LAN subsystem is completely software-configurable

For information about Refer to

The WfM specification Table 3, page 16

1.11.1 Intel® 82559 PCI LAN Controller

The Intel 82559 PCI LAN controller’s features include:

• CSMA/CD Protocol Engine

• PCI bus interface

• DMA engine for movement of commands, status, and network data across the PCI bus

• Integrated physical layer interface, including:  Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces;

when in 10 Mbit/sec mode, the interface drives the cable directly

 A complete set of Media Independent Interface (MII) management registers for control

and status reporting

 802.3u Auto-Negotiation for automatically establishing the best operating mode when

connected to other 10Base-T or 100Base-TX devices, whether half- or full-duplex capable

 Integrated power management features, including support for Wake on LAN† technology

For information about Refer to

The LAN subsystem’s PCI specification compliance Table 3, page 16

Product Description

1.11.2 LAN Subsystem Software

The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers Section 1.2, page 16

1.11.3 RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. Table 7 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 7. LAN Connector LED States

LED Color LED State Condition

Green Off 10 Mbit/sec speed is selected.

On 100 Mbit/sec speed is selected.

Yellow Off LAN link is not established.

On (steady state) LAN link is established. On (brighter and pulsing) The computer is communicating with another computer on

the LAN.

Intel Desktop Board YA810E Technical Product Specification

1.12 Power Management Features

Power management is implemented at several levels, including:

• Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power connector  Fan connectors  Wake on LAN technology  Instantly Available  Wake on Ring  Resume on Ring  Wake from USB  PME# wakeup support

1.12.1 ACPI

†

technology

If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires the support of an operating system that provides full ACPI functionality. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, video displays, and hard disk drives

• Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping

state, and less than 5-watt system operation in the Suspend to RAM sleeping state

• A Soft-off feature that enables the operating system to power off the computer

• Support for multiple wake up events (see Table 10 on page 34)

• Support for a front panel power and sleep mode switch. Table 8 lists the system states based

on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 8. Effects of Pressing the Power Switch

…and the power switch is

If the system is in this state…

Off (ACPI G2/S5 state) Less than four seconds Power on On (ACPI G0 state) Less than four seconds Soft off/Suspend On (ACPI G0 state) More than four seconds Fail safe power off Sleep (ACPI G1 state) Less than four seconds Wake up Sleep (ACPI G1 state) More than four seconds Power off

pressed for …the system enters this state

For information about Refer to

The board’s compliance level with ACPI Table 3, page 16

Product Description

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 9 lists the power states supported by the YA810E board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 9. Power States and Targeted System Power

Global States Sleeping States CPU States Device States Targeted System Power*

G0 - working state S0 - working C0 - working D0 - working

state

G1 - sleeping state S1 - CPU stopped C1 - stop grant D1, D2, D3 -

device specification specific.

G1 - sleeping state S3 - Suspend-to-

RAM. Context saved to RAM.

G2/S5 S5 - Soft off.

Context not saved. Cold boot

is required. G3 - mechanical off. (AC power is

disconnected from the computer.)

* Total system power is dependent on the system configuration, including peripherals powered by the system chassis’

power supply.

** Dependent on the standby power consumpt i on of wake-up devices used in the system.

No power to the

system.

No power D3 - no power

except for wake up logic.

No power D3 - no power

except for wake up logic.

No power D3 - no power

for wake up logic, except when provided by battery or external source.

Full power > 30 W

5 W < power < 30 W

Power < 5 W **

No power to th e system so that service can be performed.

Intel Desktop Board YA810E Technical Product Specification

1.12.1.2 Wake-Up Devices and Events

Table 10 lists the devices or specific events that can wake the computer from specific states.

Table 10. Wake Up Devices and Events

These devices/events can wake-up the computer… …from this state

Power switch S1, S3, S5 RTC alarm S1, S3, S5 LAN S1, S3 PME# S1, S3 USB S1, S3

1.12.1.3 Plug and Play

In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure devices that do not have other hardware standards for enumeration and configuration. PCI devices on a desktop board, for example, are not enumerated by ACPI.

1.12.2 Hardware Support

CAUTION

If Wake on LAN and Instantly Available technology features are used, the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.2 on page 63 for additional information.

The board provides several hardware features that support power management, including:

• Power connector

• Fan connectors

• Wake on LAN technology

• Instantly Available technology

• Wake on Ring

• Resume on Ring

• Wake from USB

• PME# wakeup support

Wake on LAN technology and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.

Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (ACPI).

Product Description

NOTE

✏

The use of Wake on Ring, Resume on Ring, and Wake from USB technologies from an ACPI state require the support of an operating system that provides full ACPI functionality.

1.12.2.1 Power Connector

When used with an ATX-compliant power supply that supports remote power on/off, the YA810E board can turn off the system power through software control.

With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off).

For information about Refer to

The location of the power connector Figure 7, page 50 The signal names of the power connector Table 31, page 53 The ATX specification Table 3, page 16

1.12.2.2 Fan Connectors

The board has two fan connectors, one of which is a manufacturing option. The functions of these connectors are described in Table 11.

Table 11. Fan Connector Descriptions

Connector Function

Processor fan Provides +12 V DC for a processor fan or active fan heatsink. Chassis fan (optional) Provides +12 V DC for a system or chassis fan. The fan voltage can be switched

on or off, depending on the power management state of the computer.

For information about Refer to

The location of the fan connectors Figure 7, page 50 The signal names of the processor fan connector Table 27, page 51 The signal names of the chassis fan connector Table 33, page 53

Intel Desktop Board YA810E Technical Product Specification

1.12.2.3 Wake on LAN Technology CAUTION

For Wake on LAN technology, the 5-V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on LAN technology can damage the power supply. Refer to Section 2.11.2 on page 63 for additional information.

Wake on LAN technology enables remote wakeup of the computer through a network. The LAN subsystem, monitors network traffic at the Media Independent Interface. Upon detecting a Magic

†

Packet YA810E board supports Wake on LAN technology through the PCI bus PME# signal.

frame, the LAN subsystem asserts a wakeup signal that powers up the computer. The

1.12.2.4 Instantly Available Technology CAUTION

For Instantly Available technology, the 5-V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when using this feature can damage the power supply. Refer to Section 2.11.2 on page 63 for additional information.

Instantly Available technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleepstate. While in the S3 sleep-state, the computer will appear to be off. The power supply appears to be off, the fans are off, and the front panel power LED will be yellow (unless a single color LED is installed, in which case, it will be off.) See Table 37 and Table 38 for additional front panel LED information. When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 10 on page 34 lists the devices and events that can wake the computer from the S3 state.

The YA810E board supports the PCI Bus Power Management Interface Specification. For information on the versions of this specification, see Section 1.3.

1.12.2.5 Wake on Ring NOTE

✏

Wake on Ring requires the use of a modem (external USB, or modem connected to serial port A) that supports the Wake on Ring feature.

The operation of Wake on Ring can be summarized as follows:

• Powers up the computer from the ACPI S5 state

• Requires two calls to access the computer:

 First call restores the computer.  Second call enables access (when the appropriate software is loaded).

• Detects incoming calls for external USB modems. The USB bus is monitored for the

RING_DETECT signal.

Product Description

1.12.2.6 Resume on Ring

The operation of Resume on Ring can be summarized as follows:

• Resumes operation from the ACPI S1 state

• Requires only one call to access the computer

• Detects incoming call similarly for external and internal modems

1.12.2.7 Wake from USB

USB bus activity wakes the computer from an ACPI S1 or S3 state.

NOTE

✏

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.8 PME# Wakeup Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1 or S3 state.

Intel Desktop Board YA810E Technical Product Specification