Intel Xeon LV User Manual

Dual-Core Intel® Xeon® Processor LV and Intel

3100 Chipset

Development Kit

User’s Manual

January 2007

Order Number: 315 879-002

Lega l Li nes and Discl a imers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHAT SOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELA T ING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the

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Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details.

The Intel® Pentium® M Processor and Intel® 3100 Chipset Development Kit may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling

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Contents

1.0 Product Description...................................................................................................7

1.1 Overview ..........................................................................................................7

1.1.1 Feature Summary ...................................................................................7

1.1.2 Board Layout ..........................................................................................9

1.2 Processors........................................................................................................ 11

1.3 System Memory................................................................................................11

1.3.1 DDR2-400 DIMM Slot Populations.............................................................11

1.3.2 DDR2 DIMM Ordering Overview................................................................13

1.4 Intel

1.5 Supported Operating Systems.............................................................................21

1.6 Supported BIOS Features...................................................................................22

1.7 Power Supply....................................................................................................23

1.8 Thermal and Mechanical Components...................................................................23

1.9 Physical and Mechanical Board Specifications ........................................................26

1.10 Debug Ports .....................................................................................................26

1.11 Real Time Clock (RTC), CMOS SRAM, and Battery..................................................26

2.0 Platform Setu p ........................................................................................................27

2.1 Connecting the Wires.........................................................................................27

2.2 Connecting Other Peripherals..............................................................................31

2.3 Connect Power..................................................................................................34

2.4 Turning On and Resetting the Board ....................................................................37

3.0 Technical Reference ................................................................................................38

3.1 Memory Resources ............................................................................................38

3.2 DMA Channels ..................................................................................................38

3.3 Fixed I/O Map ...................................................................................................38

3.4 Interrupts .......................................................................................................38

3.5 PCI Conventional Interrupt Routing Map...............................................................39

3.6 Connectors.......................................................................................................40

3.7 Jumper Block.................................................................................................... 44

3.8 Mechanical Considerations..................................................................................47

3100 Chipset........................................ ...................................................15

1.4.1 On-Board Peripherals..............................................................................15

1.4.2 On-Board I/O.........................................................................................16

1.4.3 I/O Slots for Expansion Capabilities ..........................................................18

1.4.4 Rear Panel I/O Connectors.......................................................................19

1.4.5 Hardware Server Management Features ....................................................20

1.6.1 ACPI.....................................................................................................22

1.8.1 Heatsinks..............................................................................................24

1.9.1 Mounting Holes......................................................................................26

2.1.1 Connect SATA cables .............................................................................. 28

2.1.2 Plugging In Memory............................... .................................................28

2.1.3 Connecting the Processor ........................................................................29

2.1.4 Connecting Heatsinks and Fans................................................................29

2.2.1 Add-in Connectors..................................................................................31

2.2.2 Rear Panel Connectors............................................................................32

2.2.3 Connecting a Floppy Drive.......................................................................33

2.2.4 Changing and/or Updating the BIOS Chip ..................................................33

2.2.5 Changing the CMOS Battery and Clearing CMOS......................................... 34

3.6.1 Back Panel Connectors............................................................................40

3.6.2 Component Side Connectors ................................................................... 40

3.8.1 Form Factor...........................................................................................47

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Contents

3.9 Electrical Considerations.....................................................................................48

3.9.1 DC Loading............................................................................................48

3.9.2 Add-in Board Considerations ...................................................................49

3.9.3 Fan Connector Curr ent Capability..............................................................49

3.9.4 Power Supply Considerations ...................................................................49

3.10 Thermal Considerations .....................................................................................49

4.0 Overview of BIOS Features......................................................................................51

4.1 Introduction......................................................................................................51

4.2 Resource Configuration.......................................................................................52

4.2.1 PCI Auto Configuration............................................................................52

4.3 System Management BIOS (SMBIOS) ..................................................................52

4.4 Legacy USB Support...........................................................................................52

4.5 BIOS Updates ...................................................................................................53

4.5.1 Language Support .................................................................................53

4.6 Boot Options ....................................................................................................53

4.6.1 CD-ROM Boot ........................................................................................53

4.6.2 Network Boot.........................................................................................53

4.6.3 USB Boot...............................................................................................54

4.6.4 Booting without Attached Devices ..... .......................................................54

4.6.5 Changing the Boot Device........................................................................54

4.7 BIOS Security Features ......................................................................................54

5.0 Error Message s an d Bee p Co de s...............................................................................55

5.1 Speakers..........................................................................................................55

5.2 BIOS Beep Codes ..............................................................................................55

5.3 BIOS Error Messages .........................................................................................55

5.4 Port 80h POST Codes ........................................................................................55

Figures

1 Board Components.................................................................................................... 9

2 Four-DIMM Implementation .......................................................................................13

3 Example of Single-Rank DIMM Population ........................ ............................................14

4 Example of Singl e-Rank and Dual-Rank DIMM Mixing Population.....................................14

5 Example of Dual-Rank DIMM Population ......................................................................14

6Intel

7 PCI On-Board Video Chip...........................................................................................16

8 Floppy Drive Connector .............................................................................................16

9 Front Panel Header...................................................................................................17

10 XDP Connector.........................................................................................................17

11 Rear Panel I/O Connectors.........................................................................................19

12 Intel

13 Processor Active Heatsink..........................................................................................25

14 Intel

15 SATA Ports ..............................................................................................................28

16 DIMM Sockets..........................................................................................................29

17 Processor Socket......................................................................................................29

18 Processor Fan Mounting Bracket.................................................................................30

19 Screwing the Processor Fan into the Mounting Bracket...................................................30

20 Fan Power Connectors...............................................................................................31

21 PCI Express* Connectors...........................................................................................32

22 Floppy Drive Connector .............................................................................................33

23 Firmware Hub ..........................................................................................................33

24 CMOS Battery..........................................................................................................34

3100 Chipset Block Diagram.............................................................................15

3100 Chipset Active Heatsink ...........................................................................24

3100 Chipset Passive Heatsink Design ...............................................................26

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Contents

25 CMOS Clear Jumper..................................................................................................34

26 Power Connector......................................................................................................35

27 ATX Power Connector...............................................................................................35

28 Power Connector Cables............................................................................................ 36

29 Power and Reset Buttons ..........................................................................................37

30 Back Panel Connectors...................................................... ........................................40

31 ATX Power Connector...............................................................................................41

32 SATA Power Connector .............................................................................................41

33 Front Panel Connector .............................................................................................42

34 Jumper Block Locations and Pin Connectors.................................................................44

35 Form Factor ............................................................................................................48

36 Menu Bar ................................................................................................................51

Tables

1 Feature Summary ......................................................................................................7

2 Development Kit Contents ...........................................................................................8

3 Component Layout Description ....................................................................................9

4 Supported Microprocessors........................................................................................ 11

5 Supported DDR2-400 DIMM Populations......................................................................11

6 Supported BIOS Features..........................................................................................22

7 Effects of Pressing the Power Switch...........................................................................22

8 Thermal and Mechanical Components .........................................................................23

9 DMA Channels.........................................................................................................38

10 I/O x APIC Interrupts ............................................................................................... 39

11 PCI Interrupt Routing Map PCI Interrupt Source...........................................................40

12 Front Chassis Fan and Rear Chassis Fan Connectors .....................................................40

13 Main Power Connector Pin.........................................................................................41

14 SATA Power Connector .............................................................................................42

15 Auxiliary Front Panel Power and Reset Connector Pin .................................................... 42

16 Front Panel Connector ..............................................................................................42

17 Jumper Block Locations.............................................................................................45

18 DC Loading Characteristics Mode................................................................................49

19 Fan Connector Current Capability...............................................................................49

20 BIOS Setup Program Menu Bar ..................................................................................51

21 BIOS Setup Program Function Keys............................................................................51

22 Beep Code Types.....................................................................................................55

23 BIOS Error Messages................................................................................................55

24 Port 80h POST Code Ranges......................................................................................56

25 Typical Port 80h POST Sequence................................................................................56

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chipset Development Kit

Revision History

Date Revision Description

January 2007 002 Changed order of steps in Chapter 2.0, “Platform Set up ”.

December 2006 001 Initial public release.

Revision History

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Product Description

1.0 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the Customer Reference Board (CRB).

Table 1. Feature Summar y

Feature Description

Form Factor ATX (12.00 inches by 10.75 inches)

Processors

Memory

Chipset Intel Video On-board PCI ATI Rage* Mobility Video Chip I/O Control Low Pin Count (LPC) Bus I/O Controller

USB

Per ipheral Interfaces

BIOS

LAN Support Supports Dual Port PCI Express* Gigabit NIC

Expansion Capabilities

Hardware Mo ni t or Sub sys t em

Dual-Core Intel (Additional processor support can be found in Figure 4, “Supported

Microprocessors” on page 11 .)

Support for 400 MHz DDR2 Registered ECC Support for up to 16 GB of system memory Support for registered ECC only

3100 Chip se t

Support for USB 1.1 and 2.0 devices T otal of four USB ports UHCI or EHCI configurations

Two serial ports One parallel port Total of six SATA Ports (two available modes):

• Enhanced IDE mode- Utilizes four SATA ports

• AHCI mode- Utilizes Six SATA ports One floppy drive interface PS/2* keyboard and mouse ports

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, SMBIOS, and Intel® Active Management Technology (Intel® AMT )

Three PCI Express* x4 bus add-in card connectors One PCI 32/33 bus add in card connector compliant with Specification 2.2

Hardware monitoring and fan control ASI Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values Four fan connectors Four fan sense inputs use to monitor fan activity Fan speed control

Xeon® Processor LV

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

Table 2 describes what is included in the Development Kit.

Table 2. Development Kit Contents

Feature Description

PCB CRB, Dual- Core Intel® Xeon® Processor LV and Intel Processor Dual-Core Intel Memory Two 1 GB DDR2 DIMMs Chipset Intel® 3100 Chipset Processor Heatsink Coolermaster* Active Heatsink Network Card Intel PC I Express* Gigabit N IC Firmwa re Hub Socketed Fir mw are Hub (BIOS) Software Driver CD

Additional Peripherals

Xeon® Proces sor LV

Standoffs (with installation hardware) for Benchtop use

Warning:

Placing the board on an unknown surface without standoffs may short the CRB and result in damage. If CRB is not mounted in a chassis, Intel recommends using provided Standoffs to prevent risk of the bottom of the CRB sh orting on a conduc tive surface.

Product Description

3100 Chipset

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3100 Chip se t

Product Description

1.1.2 Board Lay out

Figure 1 shows the location of the major components.

Figure 1. Board Components

21 3568

39 37

38 36

11 12 13 14 15 16

2526272829

17 18

19 20

21 22

B5793-01

Table 3 lists the components shown in Figure 1.

Table 3. Component Layout Description (Sheet 1 of 2)

Callout Description

132-bit/33 MHz PCI connector 2 Port B x4 on l y PC I E xp r e ss* using x8 c o nn e c to r 3 Port A x4 only PCI Express* using x8 connector (A1)

5 Port A x4 only PCI Express* using x8 connector (A0) 6CMOS battery 7 Power button 8Reset button

9 On-board speaker 10 Back panel 15 Pin VGA connector 11 USB ports (2) 2 top / 3 bottom

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On-board PCI ATI Rage* Mobility Video Chip if available (if not on-board a PCI add-in Card is supplied)

Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

Table 3. Component Layout Description (Sheet 2 of 2)

Callout Description

12 USB ports (2) 0 top / 1 bottom 13 Serial com port 2 14 Parallel port 15 Serial com port 1 16 PS/2* top = mouse / bottom = keyboard 17 DIMM0 18 DIMM1 19 DIMM2 20 DIMM3 (closest to edge of board) 21 AUX FAN 1 22 XDP connector 23 JTAG connector 24 AUX FAN 0 25 Intel 26 Processor with active fan plugged into processor FAN 27 ATX 12 V for SATA power 28 ATX power connector 29 Floppy drive connector 30 Port 80 seven segment display s 31 Port 80 chip 32 Firmw ar e hub (BI OS ) 33 Plug For validation only 34 SATA port 0 35 SATA port 1 36 SATA port 2 37 SATA port 3 38 SATA port 4 39 SATA port 5

3100 Chipset with active fan Connected to FAN1

Product Description

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Product Description

1.2 Processors

The CRB is designed to support the following processors with a 667MHz FSB speed. Use only the processors listed below in Table 4. Use of unsupported processors can

damage the CRB, the process or, and the power supp ly.

Note: In this document Processor refers to all processor SKUs listed in Table 4.

Table 4. Supported Microprocessors

Intel® Pentium® M Processor 745 (1.8 GHz) Intel® Pentium® M Processor LV 738 (1.4 GHz) Intel® Celeron® M Processor ULV 373 (1.0 GHz) 400 MHz No Intel® Celeron® M Processor 370 (1.5 GHz) 400 MHz No Intel® Celeron® Processor (1.66 GHz) Dual-Core Int el® Xeon® Processor LV ( 2.16 GHz, 2.0 GHz, 1.66 GHz) 667 MHz Yes Dual-Core Intel® Xeon® Processor ULV (1.66 GHz) 667 MHz Yes

1.3 System Memory

The CRB has four DIMM sockets and supports the following memory features:

• DDR2-400 MHz registered ECC

•SEC/DED

• Up to four ranks of memory

• Minimum total s ystem memory: 512 MB, maximum of 16 GB

• ECC DIMMs, 8 bits ECC

• Single ch ann el op erati on on ly

• Supports x4 and x8 DDR2- 512 Mb and DDR2 -1 Gb t echno l ogies a nd x4 DDR 2-2 Gb technologies

Microprocessor

FSB

Speed

400 MHz No 400 MHz No

667 MHz Yes

Parity

1.3.1 DDR2-400 DIMM Slot Populations

Table 5 shows the supported DDR2-400 DIMM populations.

Table 5. Supported DDR2-400 DIMM Populations

DIMM Configuration DIMM0 DIMM1 DIMM2 DIMM3

1 Single-rank Empty Emp t y Empty Single-rank 1 Dual-rank Empty Empty Empty Dual-rank 2 Single-rank Empty Empty Single-rank Single-rank 1 Dual-rank, 1 Single-rank Empty Empty Single-rank Dual- rank 2 Dual-rank Empty Empty Dual-rank Dual-rank

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

Table 5. Supported DDR2-400 DIMM Populations

DIMM Configuration DIMM0 DIMM1 DIMM2 DIMM3

3 Single-rank Empty Single-rank Single-rank Single-rank 1 Dual-rank, 2 Single-rank Empty Single-rank Single-rank Dual-rank 4 Single-rank Single-rank Single-rank Single-rank Sing le-rank

Product Description

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3100 Chip se t

Product Description

1.3.2 DDR2 DIMM Ordering Overview

Figure 2 shows the DIMM ordering and location.

Figure 2. Four-DIMM Implementation

Single-Rank DIMMs utilize all 4 DIMMs

Fill Fourth Fill Thi rd Fill Se cond Fill First

Dual-Rank DIMMs

Intel® 3100

Chipset

I M M

Note: Figure 2, “Four-DIMM Implementation” on page 13 * signifies that the chipselect is also

routed to these DIMMS.

The platform requires DDR2-400 DIMMs to be populated in order, starting with the DIMM furthest from Intel

page 13). In addition, dual-rank DIMMs must be populated farthest from Intel

Chipset when a combination of single-rank and dual-rank DIMMs are used. This recommendation is based on the chip select and on-die termination signals routing requirements of the DDR2-400 interface. Intel recommends that you check for correct DIMM placement during BIOS initialization and that all designs follow the DIMM ordering, clock enable routing, command clock routing, and chip select routing shown in Figure 2 on page 13. This addressing must be maintained to be compliant with the BIOS code.

3100 Chipset in a “fill-farthest” approach (see Figure 2 on

I M M

3100

The two DIMMs that are provided with the development kit are 1Gb sing le-ran k DIMMs. If other memory is used follow the illustrations in Figure 3, Figure 4, and Figure 5.

Figure 3 shows how to populate four single-rank DIMMs. Figure 4 shows how to

populate one dual-rank and two single-rank DIMMs. Figure 5 shows how to populate two dual-rank DIMMs.

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

Figure 3. Example of Single-Rank DIMM Population

Product Description

Single Rank DIMM 2

Intel® 3100

Chipset

Single Rank DIMM 0

Single Rank DIMM 1

Figure 4. Example of Single-Rank and Dual-Rank DIMM Mixing Population

Single Rank DIMM 1

Empty 0

Intel® 3100

Chipset

Single Rank DIMM 2

Figure 5. Example of Dual-Rank DIMM Population

Single Rank DIMM 3

Dual Rank DIMM 3

Dual Rank DIMM 2

Empty 0

Intel® 3100

Chipset

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Empty 1

Dual Rank DIMM 3

Product Description

1.4 Intel® 3100 Chi pse t

Figure 6. Intel

3100 Chipset Block Diagram

Processor

WDT

Serial ATA

6 Drives

SM Bus x2

PCI 32/33

2 UART

4 USB-2 .0

38 GPIOs

LPC

Intel®3100 Chipset

IICH IMCH

Port B

PCI Express*

1x4 or 4x1

* Other names and brands may be claimed as the property of others.

FSB

Single-Me m ory

Channel

EDMA

Port A

PCI Exp ress*

1x8 configurable as 2x4 or 2x1

Registered ECC

DDR2 400

B5990-01

1.4.1 On-Bo ar d Peripheral s

Super I/O and PCI Video are included as on-board peripherals.

1.4.1.1 Super I/O

Super I/O includes a Low Pin Count (LPC) driven Super I/O device that can be disabled by removing a resistor.

1.4.1.2 PCI Video

An ATI Rage* Mobility-M integrated video controller is located on the 32-bit, 33 MHz PCI bus. Figure 7, “PCI On-Board Video Chip” on page 16 is a picture of the on board chip.

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

Figure 7. PCI On-Board Video Chip

1.4.2 On-Board I/O

The following sections include all of the on-board I/O.

1.4.2.1 Serial ATA (SATA)

The CRB provides a total of six SATA interface connectors.

• Four usable SATA connectors in a SATA mode (BIOS setting) (SATA 0-3)

• Six SATA ports available in an AHCI mode (BIOS setting) (SATA 0-5)

• There are no RAID Capabilities on the chipset. Of course SW RAID is always and option.

Product Description

1.4.2.2 Serial Connector

The CRB has one 10-pin, dual-row header.

• Provides the COM3 port from the Super I/O

1.4.2.3 Floppy Drive

The CRB supplies a 34-pin, dual-row header.

• Floppy drive support comes from Super I/O

• The BIOS setup program configures the floppy drive interface

Figure 8. Floppy Drive Connect or

1.4.2.4 LPC Debug Port

The CRB includes one 60-pin card edge connector for LPC.

• Aligned with PCI connector (used for Intel Validation Only)

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Product Description

1.4.2.5 Front Panel Control Pins

The CRB includes a 10-pin, dual-row header.

• Provides Power Switch pins

• Provides Reset Switch pins

•Provides LED Power-On pins

• Provides LED HD Status pins

Figure 9. Front Pa ne l He a d e r

Front Panel Heade r

1.4.2.6 XDP Connector

The CRB includes one 60-pin XDP connector. XDP stands for Extended Debug Port and can be used for debugging and testing components of the board.

Figure 10. XDP Connect or

B5786- 0

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Dual-Core Intel® Xeon® Processor LV and Intel® 3100 Chip se t

1.4.2.7 USB

The CRB has a 10-pin, dual-row header to route two USB Ports to an external USB connector.

• Allows two USB 1.1 or 2.0 ports to be routed to the dual-stack rear I/O or optionally to the 10-pin header from the internal I/O. These USB ports are Port 2 and Port 3. Rear panel ports 2 and 3 are not simultaneously functional.

• By default, routing for USB is to the dual-stack header on the rear panel I/ O.

• In conjunction with the rear panel USB Ports there are only a total of four USB ports.

More information is available in Section 1.4.4.3, “USB Ports” on page 19.

1.4.3 I/O Slots for Expansion Capabilities

1.4.3.1 PCI Express*

The CRB provides a total of 3 x4 PCI Express* ports.

• Port A provides two x4 connections through two x8 connectors

• Port B provides one x4 connection through one x8 connector

• 32-bit ECRC (Port A only) stays with packet ensuring correct data at destination

• 256 opportunistic combining for read completions to improve performance

• ONLY Port A provides posted writes between each x4 port

• ONLY Port A provides memory-to-I/O DMA

Product Description

Note: The PCI Express* Ports are x8 connectors, but ONLY have the functionality of a x4

connector. This enables you to use a x8 card on the CRB but it has the bandwidth and functionality of the x4.

Warning: Hot-Plug is NOT supported on this platform.

1.4.3.2 PCI

The CRB provides one PCI slot. It has the following characteristics:

• Specification 2.2 compliant

•32-bit

•33 MHz

• 120 MB/s throughput

• 64-bit addressing through the DAC protocol

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3100 Chip se t

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Intel Xeon LV User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual