Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor, X3350 2.66 L2 1333MHz LGA775 Design Manual

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

Thermal/Mechanical Design Guide

August 2010

Order Number: 323107-002US

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING T O SALE AND/OR USE OF INTEL PRODUCT S INCLUDING LIABILITY OR WARRANTIES RELA TING T O FITNES S FOR A PARTICULAR PURPOSE, MERCHANT ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life savin g, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoev er for conflicts or incompatibilities arising from future changes to them.

The Intel may cause the product to deviate from published specifications. Current characterized errata are available on request.

Xeon® Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known as errata which

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. The code name “Picket Post" presented in this document are only for use by Intel to iden tify pr odu cts, technolo gie s, or serv ice s in

development, that have not been made commercially available to the public, i.e., announced, launched or shipped. They are not commercial names for products or services and are not intended to function as trademarks.

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 2 Order Number: 323107-002US

Contents

1Introduction..............................................................................................................8

1.1 Reference Documents......................... ......................... .. .......................... .. ..........9

1.2 Definition of Terms..............................................................................................9

2 Package Mechanical Specifications ..........................................................................11

2.1 Package Mechanical Specifications.......................................................................11

2.1.1 Package Mechanical Drawing.................. .. ........................... .....................12

2.1.2 Processor Component Keep-Out Zones..................................... ... .. .. ..........15

2.1.3 Package Loading Specifications ......................................... .. .. ...................15

2.1.4 Package Handling Guidelines.............................. .. ... .. ........................... .. ..15

2.1.5 Package Insertion Specifications...............................................................15

2.1.6 Processor Mass Specification....................................................................16

2.1.7 Processor Materials.................................................................................16

2.1.8 Processor Markings.................................................................................16

2.1.9 Processor Land Coordinates.....................................................................17

3 LGA1366 Socket ......................................................................................................18

3.1 Board Layout....................................................................................................20

3.2 Attachment to Motherboard................................................................................21

3.3 Socket Components...........................................................................................21

3.3.1 Socket Body Housing..............................................................................21

3.3.2 Solder Balls...........................................................................................21

3.3.3 Contacts ...............................................................................................22

3.3.4 Pick and Place Cover...............................................................................22

3.4 Package Installation / Removal ...........................................................................23

3.4.1 Socket Standoffs and Package Seating Plane..............................................23

3.5 Durability.........................................................................................................24

3.6 Markings..........................................................................................................24

3.7 Component Insertion Forces ...............................................................................24

3.8 Socket Size ......................................................................................................24

3.9 LGA1366 Socket NCTF Solder Joints.....................................................................24

4 Independent Loading Mechanism (ILM)...................................................................26

4.1 Design Concept.................................................................................................26

4.1.1 ILM Cover Assembly Design Overview.......................................................26

4.1.2 ILM Back Plate Design Overview...............................................................27

4.2 Assembly of ILM to a Motherboard.......................................................................28

5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 31

5.1 Component Mass...............................................................................................31

5.2 Package/Socket Stackup Height ..........................................................................31

5.3 Socket Maximum Temperature............................................................................31

5.4 Loading Specifications.................................... .. .. ................................................33

5.4.1 Board Deflection Guidance.......................................................................33

5.5 Electrical Requirements......................................................................................34

5.6 Environmental Requirements ............................................................................ ..35

6 Thermal Specifications ............................................................................................36

6.1 Package Thermal Specifications...................................................... .. ...................36

6.1.1 Thermal Specifications ............................................................................36

6.1.2 Thermal Metrology .................................................................................47

6.2 Processor Thermal Features................................................................................48

6.2.1 Processor Temperature ...........................................................................48

6.2.2 Adaptive Thermal Monitor........................................................................48

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6.2.3 THERMTRIP# Signal...................................... ..........................................51

6.3 Platform Environment Control Interface (PECI)......................................................51

6.3.1 Introduction...........................................................................................51

6.3.2 PECI Specifications .................................................................................53

7Thermal Solutions....................................................................................................54

7.1 Performance Targets....................................................................... .. .. ...............54

7.2 Heat Pipe Considerations ....................................................................................56

7.3 Assembly..........................................................................................................57

7.3.1 Thermal Interface Material (TIM) ........................................... .. .. ... ............58

7.4 Structural Considerations....................................................................................58

7.5 Thermal Design........................................................... .. .. .......................... .. .. ....59

7.5.1 Thermal Characterization Parameter..........................................................59

7.5.2 NEBS Thermal Profile ..............................................................................60

7.5.3 Power Thermal Utility ..............................................................................61

7.6 Thermal Features..................... .......................... .. .. ......................... .. .. ...............61

7.6.1 Fan Speed Control ................................................ ... ......................... .. ....61

7.6.2 PECI Averaging and Catastrophic Thermal Management...............................62

7.6.3 Intel® Turbo Boost Technology............................................ .....................62

7.6.4 Absolute Processor Temperature...............................................................63

7.6.5 Custom Heat Sinks For UP ATCA...............................................................63

8 Quality and Reliability Requirements .......................................................................66

8.1 Use Conditions ..................................................................................................66

8.2 Intel Reference Component Validation ..................................................................67

8.2.1 Board Functional Test Sequence ...............................................................67

8.2.2 Post-Test Pass Criteria.............................................................................68

8.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................68

8.3 Material and Recycling Requirements....................................................................68

A Component Suppliers...............................................................................................70

B Mechanical Drawings ...............................................................................................72

C Socket Mechanical Drawings....................................................................................89

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 4 Order Number: 323107-002US

Figures

1-1 Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up .......................................8

2-1 Processor Package Assembly Sketch.........................................................................11

2-2 Processor Package Drawing (Sheet 1 of 2)............................................ .. .. ... ..............13

2-3 Processor Package Drawing (Sheet 2 of 2)............................................ .. .. ... ..............14

2-4 Processor Top-Side Markings ...................... .. ..................................................... ......16

2-5 Processor Land Coordinates and Quadrants, Bottom View................................ .. .. .. .. .. ..17

3-1 LGA1366 Socket with Pick and Place Cover Removed ..................................................18

3-2 LGA1366 Socket Contact Numbering (Top View of Socket)...........................................19

3-3 LGA1366 Socket Land Pattern (Top View of Board) .....................................................20

3-4 Attachment to Motherboard.....................................................................................21

3-5 Pick and Place Cover...............................................................................................22

3-6 Package Installation / Removal Features ...................................................................23

3-7 LGA1366 NCTF Solder Joints....................................................................................25

4-1 ILM Cover Assembly...............................................................................................27

4-2 Back Plate...................................... ......................... .. .. ......................... ... .. ............28

4-3 ILM Assembly........................................................................................................29

4-4 Pin1 and ILM Lever................................ .. .. ......................... ... ......................... ........30

5-1 Socket Temperature Measurement Location...............................................................32

5-2 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...............................35

6-1 Intel

6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile ...................................... 39

6-3 Intel

6-4 Intel® Xeon® Processor LC5518 Thermal Profile................................. .... .. .................. 42

6-5 Intel® Celeron® Processor P1053 Thermal Profile.......................................................43

6-6 Intel

6-7 Intel® Xeon® Processor LC3518 Thermal Profile................................. .... .. .................. 46

6-8 TTV Case Temperature (TCASE) Measurement Location...............................................47

6-9 Frequency and Voltage Ordering ..............................................................................49

7-1 1U Heatsink Performance Curves..............................................................................55

7-2 ATCA Heatsink Performance Curves..........................................................................56

7-3 TTV Die Size and Orientation ...................................................................................57

7-4 1U Reference Heatsink Assembly................................ .. .. .. ............................ .. .. .. ......57

7-5 Processor Thermal Characterization Parameter Relationships........................................59

7-6 NEBS Thermal Profile..............................................................................................60

7-7 UP ATCA Thermal Solution............................................... .. .......................... .. ..........64

7-8 UP ATCA System Layout....................... .. .. ......................... .. .......................... .. ........64

7-9 UP ATCA Heat Sink Drawing ....................................................................................65

B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ............................................................73

B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) ............................................................74

B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) ............................................................75

B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) ............................................................76

B-5 1U Reference Heatsink Asse mb ly (She et 1 of 2).........................................................77

B-6 1U Reference Heatsink Asse mb ly (She et 2 of 2).........................................................78

B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2).....................................................79

B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2).....................................................80

B-9 Heatsink Shoulder Screw (1U, 2U, and Tower)...........................................................81

B-10 Heatsink Compression Spring (1U, 2U, and Tower) .....................................................82

B-11 Heatsink Retaining Ring (1U, 2U, and Tower).............................................................83

B-12 Heatsink Load Cup (1U, 2U, and Tower)....................................................................84

B-13 ATCA Reference Heatsink Assembly (Sheet 1 of 2)......................................................85

B-14 ATCA Reference Heatsink Assembly (Sheet 2 of 2)......................................................86

B-15 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2).................................................87

B-16 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2).................................................88

Xeon® Processor EC5549 and EC5509 Thermal Profile ....................................... 37

Xeon® Processor LC5528 Thermal Profile................................. .... .. .................. 40

Xeon® Processor LC3528 Thermal Profile................................. .... .. .................. 44

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C-1 Socket Mechanical Drawing - (Sheet 1 of 4)...............................................................90

C-2 Socket Mechanical Drawing - (Sheet 2 of 4)...............................................................91

C-3 Socket Mechanical Drawing - (Sheet 3 of 4)...............................................................92

C-4 Socket Mechanical Drawing - (Sheet 4 of 4)...............................................................93

Tables

1-1 Reference Documents ....................................................... .. .......................... .. .. ....... 9

1-2 Terms and Descriptions............................................................................................ 9

2-1 Processor Loading Specifications...............................................................................15

2-2 Package Handling Guidelines.................................... ................................................15

2-3 Processor Materials.................................................................................................16

5-1 Socket Component Mass..........................................................................................31

5-2 1366-land Package and LGA1366 Socket Stackup Height .............................................31

5-3 Socket and ILM Mechanical Specifications ..................................................................33

5-4 Electrical Requirements for LGA1366 Socket.................... .. .. .. .. .. ................................. 34

6-1 Intel 6-2 Intel

6-3 Intel® Xeon® Processor EC3539 and EC5539 Thermal Specifications ............................38

6-4 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile.......................................39

6-5 Intel

6-6 Intel® Xeon® Processor LC5528 Thermal Profile .........................................................41

6-7 Intel® Xeon® Processor LC5518 Thermal Specifications...............................................41

6-8 Intel

6-9 Intel® Celeron® Processor P1053 Thermal Specifications ................................ .............43

6-10 Intel® Celeron® Processor P1053 Thermal Profile................... .....................................43

6-11 Intel

6-12 Intel® Xeon® Processor LC3528 Thermal Profile .........................................................45

6-13 Intel® Xeon® Processor LC3518 Thermal Specifications...............................................45

6-14 Intel

6-15 GetTemp0() Error Codes..........................................................................................53

7-1 Boundary Conditions and Performance Targets ...........................................................54

7-2 Fan Speed Control, TCONTROL and DTS Relationship...................................................61

7-3 TCONTROL Guidance...............................................................................................62

8-1 Server Use Conditions Environment (System Level).....................................................66

8-2 Server Use Conditions Environment (System Level).....................................................67

A-1 Heatsinks and Thermal Interface Material ..................................................................70

A-2 LGA1366 Socket and ILM Components.......................................................................71

B-1 Mechanical Drawing List ..........................................................................................72

C-1 Mechanical Drawing List ..........................................................................................89

Xeon® Processor EC5549 and EC5509 Thermal Specifications .............................37

Xeon® Processor EC5549 and EC5509 Thermal Profile........................................38

Xeon® Processor LC5528 Thermal Specifications...............................................40

Xeon® Processor LC5518 Thermal Profile .........................................................42

Xeon® Processor LC3528 Thermal Specifications...............................................44

Xeon® Processor LC3518 Thermal Profile .........................................................46

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 6 Order Number: 323107-002US

Revision History

Revision Number Description Revision Date

002

001 First release February 2010

Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control

§ §

August 2010

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Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

Heatsink

Socket and ILM

Back Plate

Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.

Figure 1-1. Intel

Xeon® Processor C5500/C3500 Series Socket Stack-up

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The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Other processor specifications are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet.

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

1.1 Reference Documents

Material and concepts in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document Document# Notes

European Blue Angel Recycling Standards 3

Intel

Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 323103 1

Intel

Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 323317 1

Intel

Xeon® Processor 5500 Series Mechanical Model 321326 2

Intel

Xeon® Processor 5500 Series Thermal Model 321327 2

Entry-level Electronics Bay Specification 4

Notes:

1. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm

2. See http://www.intel.com/p/en_US/products/server/processor/xeon5000/tools

3. Available at http://www.blauer-engel.de

4. Available at http://ssiforum.oaktree.com/

Introduction

1.2 Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC

FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the

ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land

IMON The current monitor input to the CPU. The VRM tells the CPU how much current it is

LGA1366 socket The processor mates with the system board through this surface mount, 1366-land

PECI The Platform Environment Control Interface (PECI) is a one- wire interfac e that p rovid es

CASE

CASE_MAX

duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

activation temperature.

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

package onto the socket contacts.

drawing.

socket.

a communication channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using t otal package power. Defined as (T Package Power. Heat source should always be specified for Ψ measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package po wer. D efined as (T Package Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T

The case temperature of the processor , measured at the geometric center of the topside of the IHS.

The maximum case temperature as specified in a component specification.

– TLA) / Total

CASE

– TS) / Total

CASE

– TLA) / Total Package Power.

Xeon® Processor C5500/C3500 Series and LGA1366 Socket

Intel Thermal/Mechanical Design Guide August 2010 9 Order Number: 323107-002US

Introduction

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

CONTROL

TDP Thermal Design Power: Thermal solution must be designed to dissipate this target

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

Thermal Profile Line that defines case temperature specification of a processor at a given power level. TIM Thermal Interface Material: The thermally conductive compound between the heatsink

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U

by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

is a static value below TCC activation used as a trigger point for fan speed

control

control.

power level. TDP is not the maximum power that the processor can dissipate.

reached its maximum operating temperature.

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

The measured ambient temperature locally surrounding the proc essor. The ambient temperature should be measured just upstream of a p assive heatsink o r at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

equals 3.50 in, etc.

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Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

IHS

Substrate

LGA1366 Socket

System Board

Capacitors

TIM

IHS

Substrate

LGA

System Board

Capacitors

Die

TIM

Package Mechanical Specifications

2 Package Mechanical

Specifications

2.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that interfaces with the motherboard via an LGA1366 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. See

Section 3 and Section 4.

The package components shown in Figure 2-1 include the following:

• Integrated Heat Spreader (IHS)

• Thermal Interface Material (TIM)

• Processor core (die)

• Package substrate

• Capacitors

Figure 2-1. Processor Package Assembly Sketch

Note:

1. Socket and motherboard are included for reference and are not part of processor package.

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Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

2.1.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 2-2 and Figure 2-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keep-out dimensions

5. Reference datums

6. All drawing dimensions are in mm

Package Mechanical Specifications

Xeon® Processor C5500/C3500 Series and LGA1366 Socket

Intel Thermal/Mechanical Design Guide August 2010 12 Order Number: 323107-002US

8 7 6 5 4 3 2

8 7 6 5 4 3 2 1

4X RM

B1C

0.02

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

D76126 1 7

DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

D76126 1 7

DWG. NO SHT. REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

TITLE

EMTS DRAWING

SIZE DRAWING NUMBER REV

A1 D76126 7

SCALE: 2:1

DO NOT SCALE DRAWING

SHEET 1 OF 2

FINISHMATERIAL

DATEAPPROVED BY

DATECHECKED BY

DATEDRAWN BY

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MILLIMETERS

ALL UNTOLERANCED LINEAR

DIMENSIONS ±0

ANGLES ±0.5

THIRD ANGLE PROJECTION

SEE DETAIL B

IHS LID

SEE DETAIL B

PIN 1

SEE DETAIL C

PIN 1

BAAY AWAV AU

ARAP ANAM ALAK AJAH AGAF AEAD ACAB AAY WV UT RP NM LK JH GF ED CB A

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42

SEE DETAIL A

SECTION A-A

DETAIL A

SCALE 20:1

PACKAGE SUBSTRATE IHS SEALANT

IHS LID

DETAIL

SCALE 20:1

DETAIL B

SUBSTRATE ALIGNMENT FIDUCIAL

SCALE 35:1

SYMBOL

MILLIMETERS

COMMENTS

MIN MAX

44.93 45.07

42.43 42.57

38.9 39.1

1CE

36.4 36.6

1CD

2.2 2.3

4.377 4.757

2.498 2.896

42.672 BASIC

40.64 BASIC

21.336 BASIC

20.32 BASIC

1.016 BASIC

0.19 0.23

0.88 0.96

0.53 0.61

0.203

0.08

0.203 C

0.203 C D E

0.071 C

0.05

0.203 C

Package Mechanical Specifications

Figure 2-2. Processor Package Drawing (Sheet 1 of 2)

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Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

Figure 2-3. Processor Package Drawing (Sheet 2 of 2)

8 7 6 5 4 3 2

8 7 6 5 4 3 2 1

9.455

7.2

1.06 MAX

COMPONENT HEIGHT

2X 36.5

2X 39

14.4

18.91

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

D76126 2 7

DWG. NO SHT. REV

DEPARTMENT

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

SIZE DRAWING NUMBER REV

A1 D76126 7

SCALE: 2:1

DO NOT SCALE DRAWING

SHEET 2 OF 2

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42

SEE DETAIL D

SEE DETAIL E

BAAY AWAV AU

ARAP ANAM ALAK AJAH AGAF AEAD ACAB AAY WV UT RP NM LK JH GF ED CB A

DETAIL D

SCALE 15:1

0.23 C H E M N

DETAIL

SCALE 15:1

0.23 C H G J K

SURFACE

TEST PAD AREA

SYMBOL

MILLIMETERS

COMMENTS

MIN MAX

R1.09 --

0.2 --

11.7 --

0.2 --

11.7 --

Package Mechanical Specifications

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Intel Thermal/Mechanical Design Guide August 2010 14 Order Number: 323107-002US

Package Mechanical Specifications

2.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Do not contact the Test Pad Area with conductive material. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 2-2 and Figure 2-3 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in.

2.1.3 Package Loading Specifications

Table 2-1 provides load specifications for the processor package. These maximum

limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The processor substrate should not be used as a mechanical reference or load-

Table 2-1. Processor Loading Specifications

bearing surface for thermal solutions.

Parameter Maximum Notes

Static Compressive Load 890 N [200 lbf] 1, 2, 3 Dynamic Compressive Load 1779 N [400 lbf] [max static

compressive + dynamic load]

1, 3, 4

Notes:

1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism (ILM).

3. These specifications are based on limited testing for design characterization. Loading limits are for the package constrained by the limits of the processor socket.

4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.

2.1.4 Package Handling Guidelines

Table 2-2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter Maximum Recommended

Shear 70 lbs Tensile 25 lbs Torque 35 in.lbs

2.1.5 Package Insertion Specifications

The processor can be inserted into and removed from a LGA1366 socket 15 times. The socket should meet the LGA1366 requirements detailed in Section 5.

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Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

2.1.6 Processor Mass Specification

GRP1LINE1 GRP1LINE2

G2L1 G2L2

G3L1 G3L2

Legend: Mark Text (Engineering Mark): GRP1LINE1: INTEL{M}{C}’YY GRP1LINE2: INTEL CONFIDENTIAL GRP1LINE3: QDF ES XXXXX GRP1LINE4: FORECAST-NAME GRP1LINE5: {FPO} {e4}

Legend: Mark Text (Production Mark): GRP1LINE1: INTEL{M}{C}’YY PROC# GRP1LINE2: SUB-BRAND GRP1LINE3: SSPEC XXXXX GRP1LINE4: SPEED/CACHE/INTC GRP1LINE5: {FPO} {e4}

The typical mass of the processor is 35 grams. This mass [weight] includes all the components that are included in the package.

2.1.7 Processor Materials

Package Mechanical Specifications

Table 2-3 lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper

2.1.8 Processor Markings

Figure 2-4 shows the topside markings on the processor. This diagram is to aid in the

identification of the processor.

Figure 2-4. Processor Top-Side Markings

Xeon® Processor C5500/C3500 Series and LGA1366 Socket

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Package Mechanical Specifications

2.1.9 Processor Land Coordinates

Figure 2-5 shows the bottom view of the processor land coordinates. The coordinates

Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View

are referred to throughout the document to identify processor lands.

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socket

cavity

package socket

cavity

package

LGA1366 Socket

3 LGA1366 Socket

This section describes a surface mount, LGA (Land Grid Array) socket intended for the Intel® Xeon® processor C5500/C3500 series in the Picket Post platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43 x 41 grid array with 21 x 17 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in

Section 5.

Figure 3-1. LGA1366 Socket with Pick and Place Cover Removed

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Figure 3-2. LGA1366 Socket Contact Numbering (Top View of Socket)

LGA1366 Socket

Xeon® Processor C5500/C3500 Series and LGA1366 Socket

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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB

7 5

15 13

23 21

31 29

7 5

15 13

23 21

31 29

15 13

23 21

31 29

39 37

LGA1366 Socket

3.1 Board Layout

The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) because these values are equivalent.

In general, metal defined (MD) pads perform better than solder mask defined (SMD) pads under thermal cycling, and SMD pads perform better than MD pads under dynamic stress. Recommendations for pad definition on a per pad basis do not exist for the LGA1366 socket.

The 40 mil spacing results in a reduced drill keepout as compared to previous platforms. Drill keepout is explained in section 3.2.1 of the Intel Design Guide (PDG). Select PCB suppliers are capable of producing 40 mil spacing.

Figure 3-3. LGA1366 Socket Land Pattern (Top View of Board)

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Xeon® 5500 Platform

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket

3.2 Attachment to Motherboard

The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (i.e. screw, extra solder, adhesive, etc.) to attach the socket. As indicated in Figure 3-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 3-4. Attachment to Motherboard

LGA1366 Socket

3.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. See Appendix C for detailed drawings.

3.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V -0 flame rating capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Section 8.

The color of the housing will be dark as compared to the solder balls. This provides the contrast needed for pick and place vision systems.

3.3.2 Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.

The socket has the following solder ball material:

• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217°C. The alloy must be compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste.

The co-planarity (profile) and true position requirements are defined in Appendix C.

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LGA1366 Socket

3.3.3 Contacts

Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm

[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

3.3.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260° C for 40 seconds (typical reflow/rework profile) and the conditions listed in Section 6 without degrading.

As indicated in Figure 3-5, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling.

The covers are designed to be interchangeable between socket suppliers. As indicated in Figure 3-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

Figure 3-5. Pick and Place Cover

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3.4 Package Installation / Removal

alignment walls

orientation notch

orientation post

access

Pin1 triangle

Pin1 chamfer

alignment walls

orientation notch

orientation post

access

Pin1 triangle

Pin1 chamfer

As indicated in Figure 3-6, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the

Figure 3-6. Package Installation / Removal Features

package.

LGA1366 Socket

3.4.1 Socket Standoffs and Package Seating Plane

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Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

Xeon® Processor C5500/C3500 Series and LGA1366 Socket

LGA1366 Socket

3.5 Durability

The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 5-4 must be met when mated in the 1st and 30th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6 Markings

There are three markings on the socket:

• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

All markings must withstand 260° C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example T able

R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

3.8 Socket Size

Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the reference motherboard keep-

out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

3.9 LGA1366 Socket NCTF Solder Joints

Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 3-7 identifies the NCTF solder joints.

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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB

7 5

15 13

23 21

31 29

7 5

15 13

23 21

31 29

39 37

Figure 3-7. LGA1366 NCTF Solder Joints

LGA1366 Socket

Note: For platforms supporting the DP processor land C3 is CTF.

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Independent Loading Mechanism (ILM)

4 Independent Loading

Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance.

Note: The ILM has two critical functions: deliver the force to seat the processor onto the

socket contacts and distribute the resulting load evenly through the socket solder joints.

Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1366

socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

4.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate.

4.1.1 ILM Cover Assembly Design Overview

The ILM cover assembly consists of four major pieces: load lever, load plate, frame and the captive fasteners.

The load lever and load plate are stainless steel. The frame and fasteners are high carbon steel with appropriate plating. The fasteners are fabricated from a high carbon steel. The frame provides the hinge locations for the load lever and load plate.

The cover assembly design ensures that once assembled to the back plate and the load lever is closed, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm when the load plate is closed on the empty socket or when closed on the processor package.

When closed the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

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Figure 4-1. ILM Cover Assembly

Independent Loading Mechanism (ILM)

4.1.2 ILM Back Plate Design Overview

The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is preapplied.

Back plates for processors in 1-socket workstation platforms are covered in the Intel

Processor 3500 Series Thermal/Mechanical Design Guide.

Xeon

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Threaded studs

Threaded nuts

Clearance hole

Threaded studs

Threaded nuts

Clearance hole

Threaded studs

Clearance hole

Threaded nuts

Independent Loading Mechanism (ILM)

Figure 4-2. Back Plate

4.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. In step 1 (see Figure 4-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover assembly to the back plate with the four captive fasteners. Torque to 8 inch-pounds. The length of the threaded studs accommodate board thicknesses from 0.062” -

0.100”.

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