Intel WiFi Link 5100 User Manual

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Thermal/Mechanical Desig n Guide

July 2008

Revision 003US

Order Number: 31867 6- 0 03US

Legal Lines and Disclaim er s

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TE RMS AND CON DITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, TH E INTEL PRODUCTS ARE NO T DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instruct ions mark ed “reserved” or “undefined .” Intel reserves these for futu re definitio n and shall ha ve no responsibility whatsoever for conflicts or inco mp atib ilities arising from f utu re c hanges to them. The infor mation here is subject t o change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-

4725, or by visiting Intel’s Web Site. Intel processor numbers are not a measure of perfor manc e. Pro ces so r num be r s differ entiate features within each processor family, not across different

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Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications TDG July 2008 2 Order Number: 318676-003US

5100 MCH Chipset

Intel

1.0 Introduction..............................................................................................................6

1.1 Design Flow........................................................................................................6

1.2 Definition of Terms ..............................................................................................7

1.3 Related Documents .............................................................................................8

1.4 Thermal Simulation ................................ ........................... .... .......................... ....9

2.0 Packaging T e c h nology...............................................................................................9

2.1 Package Mechanical Requirements.......................................................................11

3.0 Thermal Specifications ............................................................................................ 12

3.1 Thermal Design Power (TDP) .............................................................................. 12

3.2 Case Temperature............................................................................................. 12

4.0 Thermal Solution Requirements...............................................................................12

4.1 Characterizing the Thermal Solution Requirement.................................................. 12

5.0 Thermal M etrology .................................................................................................. 15

5.1 MCH Case Measurement............... .... .......................... ........................... .... ......... 15

5.1.1 Supporting Test Equipment....................... .......................... .... ................. 15

5.1.2 Thermal Calibration and Controls.............................................................. 16

5.1.3 IHS Groove ........................................................................................... 16

5.1.4 Thermocouple Conditioning and Preparation............................................... 18

5.1.5 Thermocouple Attachment to IHS............................................................. 18

5.1.6 Curing Process....................................................................................... 22

5.1.7 Thermocouple Wire Management.............................................................. 23

5.2 Power Simulation Software .................. ........................... .... .......................... ......24

6.0 Reference Thermal Solutio n..................................................................................... 24

6.1 AdvancedTCA* Reference Heatsink...................................................................... 25

6.1.1 Thermal Performance .... ........................... .......................... .... ................. 25

6.1.2 Mechanical Design Envelope .................................................................... 25

6.1.3 Board-level Components Keepout Dimensions ............................................ 26

6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26

6.1.5 Heatsink Orientation ............................................................................... 27

6.1.6 Extruded Heatsink Profiles ........................................... .......................... .. 27

6.1.7 Mechanical Interface Material...................................................................27

6.1.8 Thermal Interface Material . .......................... ........................... .... ............. 27

6.1.8.1 Effect of Pressure on TIM Performance......................................... 28

6.1.9 Heatsink Clip ......................................................................................... 28

6.1.10 Clip Retention Anchors............................................................................28

6.1.11 Reliability Guidelines............................................................................... 28

6.2 CompactPCI* Reference Heatsink ................. .... .......................... .... ..................... 29

6.2.1 Component Overview.............................................................................. 29

6.2.2 Thermal Solution Performance Characteristics ........ .... .......................... .... .. 30

7.0 Reliability Guidelines............................................................................................... 30

A Mechanical Drawings............................................................................................... 31

B Thermal Solution Component Suppliers ................................................................... 40

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Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel® 5100 MCH Chipset

Figures

1 Thermal Design Process ............................ .......................... .... ........................... ........ 7

2 MCH Package Dimensions (Top View)..........................................................................10

3 MCH Package Dimensions (Side View).........................................................................10

4 MCH Package Dimensions (Bottom View).....................................................................11

5 Processor Thermal Characterization Parameter Relationsh ip s ..........................................13

6 IHS Groove Dimensions.............................................................................................17

7 Orientation of Thermocouple Groove Relative to Package Pin..........................................18

8 Bending Tip of Thermocouple ......... ........................... .... .......................... ...................18

9 Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19

10 Thermocouple Bead Placement...................................................................................20

11 Positioning Bead on Groove .......................................................................................20

12 Using 3D Micromanipulator to Secure Bead Location................ ........................... .... .......21

13 Measuring Resistance between Thermocouple and IHS ..................................................21

14 Applying Adhesive on Thermocouple Bead....................................................................22

15 Thermocouple Wire Management in Groove..................................................................23

16 Removing Excess Adhesive from IHS............................................. .......................... ....23

17 Filling Groove with Adhesive ............................................ ........................... ............... 2 4

18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25

19 AdvancedTCA* Torsional Clip Heatsink Volumetri c Envel op e for MCH Heatsi nk ... ............... 2 6

20 Torsional Clip Heatsink Assembly................................................................................27

21 Isometric View of the CompactPCI* Reference Heatsink .... .......................... ...................29

22 CompactPCI* Reference Heatsink Thermal Performance.................................................30

23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32

24 AdvancedTCA* Heatsink Drawing................................................................................33

25 AdvancedTCA* Component Keepout Zone....................................................................34

26 CompactPCI* Heatsink Assembly Drawing .............. ........................... ... .......................35

27 CompactPCI* Heatsink Drawing .. ........................... ........................... ... .......................36

28 CompactPCI* Component Keepout Zone............................ .... ........................... ...........37

29 Torsional Clip Heatsink Clip Drawing ...........................................................................38

30 TIM2 Drawing .... ... ........................... ........................... .......................... .... ............... 3 9

Tables

1 Definition of Terms .................................................................................................... 7

2 Related Documents.................................................................................................... 8

3Intel 4 Required Heatsink Thermal Performance (Ψ

5 Thermocouple Attach Support Equipment ....................................................................16

6 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28

7 Reliability Guidelines.................................................................................................29

8 Reliability Requirements ............................................................................................30

9 Mechanical Drawing List ............................................................................................31

10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel TDG July 2008 4 Order Number: 318676-003US

5100 Memory Controller Hub Chipset Thermal Speci fi cati ons...................... .... .......12

).............................................................15

5100 MCH Chipset

Intel

Revision History

Date Revision Description

Added the CompactPCI* reference solution

July 2008 003

February 2008 002 Updated the TDP

November 2007 001 Initial release

Revision Number Descriptions

Revision Associated Life Cycle Milestone Release Information

0.0 POP L3 Closure Initial Documentation - Typically Internal Only

0.1–0.4 When Needed Project Dependent - Typically Internal Only

0.5 Design Win Phase First, Required Customer Release

0.6–0.7 When Needed Project Dependent

0.7 Simulations Complete Second, Recommended Customer Release

0.8–0.9 When Needed Project Dependent

1.0 First Silicon Samples Requi r ed Customer Relea se

1.1–1.4 When Needed Project Dependent (Recommended)

1.5 Qualification Silicon Samples Project Dependent

1.6–1.9 When Needed Project Dependent

NDA - 2.0

Public - XXXXXX-001

2.1 and up When Needed Project Dependent

Note: Rows hi gh lighted in gray are required revisions.

Added Figure 26, Figure 27, and Figure 28 Updated the supplier information

Max config

First SKU Launch Requi r ed Customer Relea se - Product Launch

value to 25.7 W in Table 3

July 2008 TDG Order Number: 318676-003US 5

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

1.0 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to :

• Outline the thermal and mechanical operating limits and specifications for the

• Describe refer ence thermal solut ions that meet the spec ificati on of th e Intel

Properly designed thermal solutions provide adequate cooling to maintain the Intel 5100 MCH Chipset die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature , ensu ring adequate local airflow, and m inimizi ng the di e to local- ambien t thermal re sistance . By main taining the Intel designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel Chipset components only . For thermal design information on other chipset components, refer to the respective component datasheet. For the ICH9R, refer to the Intel Controller Hub 9 (ICH 9) F a mily Thermal and Mechanical Design Guidelines.

5100 Memory Controller Hub C hi ps et (Intel® 5100 MCH Chipset )

Intel

MCH Chipset

5100 MCH Chipset die temperature at or below the specified limits, a system

Intel® 5100 MCH Chipset

5100

5100 MCH

I/O

Note: Unless otherwise specified, the term “MCH” refers to the Intel® 5100 MCH Chipset.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implici t to this d ocument and the tools ap p r op r ia t e for ea ch step.

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel TDG July 2008 6 Order Number: 318676-003US

• Package Level Thermal Models

• Thermal Model User’s Guide

Step 1: Thermal Simulation

• Reference Heatsinks

• Reference Mounting Hardware

• Vendor Contacts

Step 2: Heatsink Design

and Selection

Step 3: Thermal Validation

• Thermal Testing Software

• Thermal Test Vehicle

• User Guides

5100 MCH Chipset

Intel

Figure 1. Thermal Design Process

1.2 Definition of Terms

Table 1. Definition of Terms

July 2008 TDG Order Number: 318676-003US 7

Term Definition

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where

FC-BGA

BLT

ICH9 I/O Controller Hub 9 IHS Integrated Heat Spreader

MCH

case_max

case_min

TDP

TIM Thermal Interface Material

a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note: The device arrives at the cus tomer with solder balls atta ch e d.

Bond line thickness. Final settled thickness of the thermal interface material after installation of heatsink.

Memory controller hub. The chipset component that contains the processor interface, the memory interface, the PCI Express* interface and the ESI interface.

Maximum allowed component temperature. This temperature is measured at the geometric center of the top of the package IHS.

Minimum allowed comp onent tem per ature. This temp era ture is meas ured at the geometric center of the top of the package IHS.

Thermal design power. Thermal solutions should be design e d to di ssipate this target power level. TDP is not the maximum power that the chipset can dissipate.

Case-to-ambient thermal characterization parameter. A measure of the thermal solution thermal performance including TIM using the thermal design power. Defined as (T

Case-to-sink thermal characterization parameter. A measure of the TIM thermal performance using the ther m a l desig n powe r. Defined as (T

) / TDP

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using the ther m a l desig n powe r. Defined as (T

) / TDP

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

- TLA) / TDP

CASE

1.3 Related Documents

Intel® 5100 MCH Chipset

Intel® Electronic Desi gn Kits (EDKs) provide online, real-tim e collateral updates. The following links ta ke you to the EDK server and require you to log into Intel Link (IBL).

• Quad-Core and Dual-Co r e Intel® Xeon® Process or 5000 Sequence with Intel®

5100 Memory Controll er Hub Chip set for C ommunica tions , Embedd ed, and Stor age Applications

• Intel® Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory

Controller Hub Chipset for Commun ications and Embedd ed Applications

The reader of this specification should also be familiar with material and concepts presented in the documents list ed in Table 2.

Table 2. Related Documents (Sheet 1 of 2)

Document Document Number/URL

BGA/OLGA Assembly Development Guide Note 1 Dual-Core Intel Dual-Core Intel

Update Dual-Core Intel

Mechanical Design Guidelines Dual-Core Intel Dual-Core Intel

Update Dual-Core Intel

Mechanical Design Guidelines Dual-Core Intel

Applications Thermal/Mechanical Design Guidelines

Intel

5000 Series Chipset Memory Controller Hub (MCH)

Thermal/Mechanical Design Guide

5100 Memory Controller Hub Chipset (embedded) –

Intel External Design Specification (EDS) Addendum

Intel

5100 Memory Controller Hub Chipset (embedded) –

Maximum Power Application

Intel

5100 Memory Controller Hub Chipset Datasheet http://www.intel.com/ (318378)

Intel

5100 Memory Controller Hub Chipset Specification Update http://www.intel.com/ (318385)

Intel® Core™2 Duo Processor, Intel® Core™2 Solo Processor and

Core™2 Extreme Processor on 45-nm Process Datasheet

Intel

Core™2 Duo Processor, Intel® Core™2 Solo Processor and

Intel

Core™2 Extreme Processor on 45-nm Process

Specification Update

Intel

Core™2 Duo Processo rs on 45- n m pr oc es s for Embedded

Applications Thermal Design Guide

Intel

Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory Controller Hub Chipset for Communications and Embedded Applications – Platform Design Guide

I/O Controller Hub 9 (ICH9) Family Datasheet http://www.intel.com/ (316972)

Intel

I/O Controller Hub 9 (ICH9) Family Specification Update http://www.intel.com/ (316973)

Notes:

1. Contact your Intel sales representative. Some documents may not be available at this time.

Xeon® Processor 5100 Series Datasheet http://www.intel.com/ (313355)

Xeon® Processor 5100 Series Specification

Xeon® Processor 5100 Series Thermal/

Xeon® Processor 5200 Series Datasheet http://www.intel.com/ (318590)

Xeon® Processor 5200 Series Specification

Xeon® Processor 5200 Series Thermal/

Xeon® Processor LV 5138 in Embedded

Business

http://www.intel.com/ (313356)

http://www.intel.com/ (313357)

http://www.intel.com/ (318586)

http://www.intel.com/ (318675)

http://www.intel.com/ (315225)

http://www.intel.com/ (313067)

Note 1

http://www.intel.com/ (320120)

http://www.intel.com/ (320121)

http://www.intel.com/ (320028)

Note 1

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel TDG July 2008 8 Order Number: 318676-003US

5100 MCH Chipset

Intel

Table 2. Related Documents (Sheet 2 of 2)

Document Document Number/URL

Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines

Quad-Core and Dual-Core Intel Sequence with Intel Communications, Embedded, and Storage Applications – Platform Design Guide

Quad-Core Intel Quad-Core Intel

Update Quad-Core Intel

Mechanical Design Guidelines Quad-Core Intel Quad-Core Intel® Xeon® Processor 5400 Series Specification

Update Quad-Core Intel

Mechanical Design Guidelines Quad-Core Intel

Applications Thermal and Mechanical Design Guidelines Various system thermal design suggestions http://www.formfactors.org

Notes:

1. Contact your Intel sales representative. Some documents may not be available at this time.

5100 Memory Controller Hub Chipset for

Xeon® Processor 5300 Series Datasheet http://www.intel.com/ (315569)

Xeon® Processor 5300 Series Specification

Xeon® Processor 5300 Series Thermal/

Xeon® Processor 5400 Series Datasheet http://www.intel.com/ (318589)

Xeon® Processor 5400 Series Thermal/

Xeon® Processor L5318 in Embedded

Xeon® Processor 5000

http://www.intel.com/ (316974)

Note 1

http://www.intel.com/ (315338)

http://www.intel.com/ (315794)

http://www.intel.com/ (318585)

http://www.intel.com/ (318611)

http://www.intel.com/ (318474)

1.4 The rmal Simulation

Intel provides thermal simulation model s of t he Intel® 5100 MCH Chipset and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their th ermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analys is tool s Flomeri cs* FLO THE RM* (ve rsion 5.1 or higher) an d Fluent* Icepak* (v ersion 4.3. 10 or higher). Co ntact your In tel field sa les representat ive to order the thermal models and us er’s guides.

2.0 Packaging Technology

Intel® 5100 MCH Chipset-based plat forms consist of two individual comp onents: the

5100 MCH Chipset and the ICH9R. The Int e l® 5100 MCH Chipset uses a 42.5

Intel mm, 10-layer fl ip chip ball grid array (FC-BGA) pa ckage (see Figure 2, Figure 3, and

Figure 4). For information on the ICH9R package, refer to the Intel

9 (ICH9) Family Thermal and Mechanical Design Guidelines.

I/O Controller Hub

July 2008 TDG Order Number: 318676-003US 9

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Figure 2. MCH Package Dime nsions (Top View)

MCH

IHS

Handling

Exclusion

Area

42.5 mm.

42.5 mm.38.5 mm.

38.5 mm,

0.20

–C–

IHS

Substrate

0.435 ± 0.025 mm See note 3

Seating Plane

2.44 ± 0.071 mm

See note 1.

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

0.20

See note 4.

3.79 ± 0.144 mm

4.23 ± 0.146 mm

Intel® 5100 MCH Chipset

Figure 3. MCH Package Dim ensions (Side Vi ew)

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel TDG July 2008 10 Order Number: 318676-003US

42.5 + 0.05

11 252321191715139753127293733 3531

2822 26242018161412108642 36343230 38

AE AC AA

U R

V T

M K

42.5 + 0.05 C A0.2

- A -

37X 1.092

20.202

37X 1.092

5100 MCH Chipset

Intel

Figure 4. MCH Package Dimensions (Bottom View)

Notes:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1 Package Mechanical Requirements

Note: The heatsink attach solutions must not include continuous stress to the chipset

July 2008 TDG Order Number: 318676-003US 11

The Intel® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

package with the exc eption of a uniform lo a d to maintain the heatsink-to-pac kage thermal interfac e.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel® 5100 MCH Chipset

Note: These spe c i fic a tions apply to unifor m co mp r e s s ive loa d ing in a direction perpe nd icular

to the IHS top surface.

Note: These specifications are based on limited testing for design characterization. Loading

limits are for the package only.

3.0 Thermal Specifications

3.1 Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, i n order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level to which th e thermal solutions should be designed. TDP is not the maximum power that the chipset can dissipate.

FC-BGA packages have a poor heat transfer capability into the board and have a minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel

3.2 Case Temperature

To ensure proper operation and reliability of the Intel® 5100 MCH Chipset, the case temperatures must be at or between the maximum/mini mum operating temperature ranges as specified in Table 3. System and/or component level thermal solutions are required to mainta in these temperatur e specifications. Refer to Section 5.0, “Thermal

Metrology” on page 15 for guidelines on accurately measuring package case

temperatures.

5100 MCH Chipset.

Table 3. Intel

5100 Memory Controller Hub Chipset Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

Max config

TDP

Typical ATCA config

TDP

Typical UP config

105 °C

5 °C

25.7 W DP FSB 1333, 2 channel DDR2 667, 3 x8 PCI Express*

23.0 W DP FSB 1067, 2 channel DDR2 533, 3 x8 PCI Express*

19.5 W UP FSB 1067, 1 channel DDR2 533, 1 x8 PCI Express*

4.0 Thermal Solution Requirements

4.1 Characterizing the Thermal Solution Requirement

The idea of a “thermal characterization parameter” Ψ (the Greek letter Ps i) is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (in other words, heating source, local ambient conditions, and so forth). The thermal characterization parameter is calculated using total package power; whereas, actual thermal resistance, θ (theta), is calculated using actua l po wer dissipated be tween two points. Mea s uring actual power dissipated into the heatsi nk is difficult, beca use some of the power is dissipated through a heat transfer into the package and board.

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Intel TDG July 2008 12 Order Number: 318676-003US

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Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

Legal Lines and Disclaim er s

Contents

Figures

Tables

Revision History

Revision Number Descriptions

1.0 Introduction

1.1 Design Flow

Figure 1. Thermal Design Process

1.2 Definition of Terms

Table 1. Definition of Terms

1.3 Related Documents

Table 2. Related Documents (Sheet 1 of 2)

1.4 The rmal Simulation

2.0 Packaging Technology

Figure 2. MCH Package Dime nsions (Top View)

Figure 3. MCH Package Dim ensions (Side Vi ew)

Figure 4. MCH Package Dimensions (Bottom View)

2.1 Package Mechanical Requirements

3.0 Thermal Specifications

3.1 Thermal Design Power (TDP)

3.2 Case Temperature

4.0 Thermal Solution Requirements

4.1 Characterizing the Thermal Solution Requirement