Intel SSDSCJJF180A501 User Manual
Intel® Solid-State Drive Pro 2500 Series (M.2)
Capacities: 180GB, 240GB, 360GB
Form Factors:
80mm (single-sided) 2280-S2-B-M (180GB)
and (double-sided) 2280-D2-B-M
(240GB and 360GB)
60mm (double-sided) 2260-D2-B-M
(180GB and 240GB)
Thickness: up to 3.58 mm
Weight: <10 grams
SATA 6Gb/s Bandwidth Performance
1
(IOMeter* Queue Depth 32)
Sustained Sequential Read: up to 540MB/s
Sustained Sequential Write: up to 490MB/s
Read and Write IOPS
1
(IOMeter Queue Depth 32)
Random 4KB Reads: up to 45,000 IOPS
Random 4KB Writes: up to 80,000 IOPS
2
Data Compression
Intel
®
Stable Image Platform Program (SIPP)
Security and Manageability Compatibility
Intel® Core® vPro® Processor
Intel
®
Setup and Configuration Software
(Intel
®
SCS)
AES 256-bit Encryption
Trusted Computing Group* (TCG*) Opal Security
Subsystem Class (SSC) Specification Version 2.0
features
Windows eDrive*
Additional Compatibility
Intel
®
SSD Toolbox with Intel® SSD Optimizer
Intel
®
Data Migration Software
Intel
®
Rapid Storage Technology
SATA Revision 3.2
ACS-3 (ATA/ATAPI Command Set 3)
SSD Enhanced SMART ATA feature set
Intel
®
Dynamic Platform Thermal Framework
(Intel® DPTF)
End-to-End Data Protection
Power Management
3.3 V SATA Supply Rail
SATA Link Power Management (LPM)
Advanced Power Management (APM)
Device Sleep (DevSleep)
Power
Active (BAPCo MobileMark* 2007 Workload):
140 mW
Idle
3
: 55 mW
DevSleep: 200 µW
Temperature
Operating
4
: 0o C to 70o C
Non-Operating: -55
o
C to 95o C
Reliability
— Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
— Mean Time Between Failure (MTBF):
1.2 million hours
— Shock (operating and non-operating):
1,000 G/0.5 ms
Vibration
— Operating: 2.17 G
RMS
(5-700Hz)
— Non-operating: 3.13 G
RMS
(5-800Hz)
Certifications and Declarations:
UL*
CE*
C-Tick*
BSMI*
KCC*
Microsoft* WHCK
VCCI*
SATA-IO*
Product Ecological Compliance
RoHS*
Intel® Solid-State Drive Pro 2500 Series (M.2)
NOTES:
1. Performance values vary by capacity.
2. Random 4KB writes measured using out-of-box SSD.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper
device operating temperatures on heavier workloads.
Order Number: 330902-002
Product Specification
Ordering Information
Contact your local Intel sales representative for ordering information.
Intel® Solid-State Drive Pro 2500 Series (M.2)
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Product Specification October 2014
2 330902-002
Intel® Solid-State Drive Pro 2500 Series (M.2)
Contents
1 Introduction .................................................................................................................. 5
1.1 Revision History .............................................................................................................. 6
1.2 Terminology .................................................................................................................. 6
1.3 Reference Documents ....................................................................................................... 7
2 Product Specifications ..................................................................................................... 8
2.1 Capacity ........................................................................................................................ 8
2.2 Performance .................................................................................................................. 8
2.3 Electrical Characteristics .................................................................................................... 9
2.4 Environmental Conditions ................................................................................................. 10
2.4.1 Temperature, Shock, Vibration ......................................................................... 10
2.4.2 Altitude .......................................................................................................... 10
2.5 Product Regulatory Compliance ......................................................................................... 11
2.6 Reliability ..................................................................................................................... 12
3 Mechanical Information .................................................................................................. 13
4 Pin and Signal Descriptions ............................................................................................. 16
4.1 Pin Locations ................................................................................................................ 16
4.2 Signal Descriptions ......................................................................................................... 17
4.3 Device Sleep Feature ....................................................................................................... 18
5 Supported Command and Feature Sets .............................................................................. 19
5.1 Supported ATA General Feature Command Set ....................................................................... 19
5.2 Advanced Power Management (APM) ................................................................................... 21
5.3 Security ....................................................................................................................... 22
5.3.1 Sanitization Methods ....................................................................................... 22
5.3.2 TCG Opal SSC Support .................................................................................... 22
5.3.3 Windows eDrive* ............................................................................................ 23
5.4 Device Statistics ............................................................................................................. 23
5.5 Software Settings Preservation ........................................................................................... 24
5.6 DevSleep ..................................................................................................................... 24
5.7 SMART Command Transport ............................................................................................. 25
5.8 SMART Attributes ........................................................................................................... 25
5.9 SMART Logs.................................................................................................................. 28
6 Certifications and Declarations ........................................................................................ 29
7 Appendix .................................................................................................................... 30
7.1 Identify Device ............................................................................................................... 30
7.2 Models ........................................................................................................................ 34
October 2014 Product Specification
330902-002 3
Intel® Solid-State Drive Pro 2500 Series (M.2)
Tables
Table 1: Terminology ....................................................................................................................................................................................... 6
Table 2: Standard References...................................................................................................................................................................... 7
Table 3: User Addressable Sectors ........................................................................................................................................................... 8
Table 4: Compressible Performance ........................................................................................................................................................ 8
Table 5: Incompressible Performance ..................................................................................................................................................... 8
Table 6: Latency ................................................................................................................................................................................................. 9
Table 7: Operating Voltage and Power Consumption...................................................................................................................... 9
Table 8: Temperature, Shock, Vibration .............................................................................................................................................. 10
Table 9: Product Regulatory Compliance Specifications ............................................................................................................. 11
Table 10: Reliability Specifications ........................................................................................................................................................... 12
Table 11: M.2 Serial ATA Power Pin Definitions ................................................................................................................................. 17
Table 12: Supported ATA Commands and Feature Sets ................................................................................................................ 19
Table 13: APM Subcommand Codes for Power Management and Definitions .................................................................... 21
Table 14: APM Subcommand Codes for Thermal Power Management and Definitions ................................................. 22
Table 15: Supported Secure Erase Modes and Definitions ........................................................................................................... 22
Table 16: Supported Sanitize Device Modes and Definitions ...................................................................................................... 22
Table 17: ID Device Changes with Opal Activation ............................................................................................................................ 23
Table 18: Device Statistics Log ................................................................................................................................................................... 23
Table 19: Preserved Software Settings ................................................................................................................................................... 24
Table 20: DevSleep Control Parameters ................................................................................................................................................ 25
Table 21: SMART Attributes ......................................................................................................................................................................... 25
Table 22: SMART Attribute Status Flags ................................................................................................................................................ 28
Table 23: Device Certifications and Declarations ............................................................................................................................... 29
Table 24: Identify Device Returned Sector Data ................................................................................................................................. 30
Table 25: Available Models ........................................................................................................................................................................... 34
Figures
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S2-B-M) 180GB ................................. 13
Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D2-B-M) 240GB and 360GB ..... 14
Figure 3: Dimensions for 60 mm double-sided M.2 Form Factor Drives (2260-D2-B-M) 180GB .............................. 15
Figure 4: Layout of Signal and Power Segment Pins ....................................................................................................................... 16
Product Specification October 2014
4 330902-002
Intel® Solid-State Drive Pro 2500 Series (M.2)
1 Introduction
This document describes the specifications and capabilities of the Intel® Solid-State Drive Pro 2500 Series (Intel®
SSD Pro 2500 Series).
The Intel SSD Pro 2500 Series delivers the next generation of Professional storage solution with enhanced security
and manageability features, power-efficient performance, and lower total cost of ownership. The latest generation
of the Intel® SSD Professional Family supports Trusted Computing Group* (TCG*) Opal version 2.0 features and is
Microsoft eDrive* capable, although “off” is the eDrive factory default out-of-box setting. In addition, Intel’s proven
reliability and low power consumption provide an enhanced mobile experience.
Intel SSD Pro 2500 Series also offers the following additional key features:
Security and Manageability Features
Intel SSD Pro 2500 Series is a hardware-based self-encrypting drive (SED) enhanced with Opal 2.0* security
features. The TCG Opal specification describes a secure boot capability (pre-boot authentication), protection for
user data, and administrative capabilities, improving security of critical data at rest. Manageability options are
expanded when the Intel SSD Pro 2500 Series is coupled with the latest Intel® Core™ vPro™ processor systems and
software such as Intel® Set-up & Configuration Service (Intel® SCS) with the Intel® SSD Pro Plug-in. Offering unique
manageability options, IT Administrators can proactively manage the Intel® Solid-State Drive Professional Family
and reduce deployment costs while keeping their PCs running smoothly.
Quality and Reliability Capabilities
Quality and reliability are the cornerstones of Intel® SSD Products and the Intel SSD Pro 2500 is no different.
Limiting employee down-time is critical; the reliability of the Intel SSD Pro 2500 Series is key for Low Total Cost
of Ownership (TCO).
Power-Efficient Performance
The new advanced low power modes enable longer battery life and greater mobility. In addition, the Intel SSD Pro
2500 Series provides higher performance throughput for the most demanding workloads.
Stability
Intel SSD Pro 2500 Series is part of the Intel® Stable Image Platform Program (Intel® SIPP). Intel SIPP aligns key
Intel platform components, enabling a predictable transition from one technology generation to the next with
minimal compatibility issues. Enhancing software and hardware stability, Intel SIPP aligns with key Intel platform
components and drivers and is currently available for at least 15 months post platform Intel SIPP availability.
Tools
Intel SSD Pro 2500 Series is aligned with the latest version of the Intel® SSD Toolbox for consumers and the Intel®
SSD Pro Administrator Tool for business and IT professionals. Intel tools provide key capabilities to maximize your
Intel SSD experience. (Visit www.intel.com/ssd to access the Tools panel for download.)
October 2014 Product Specification
330902-002 5
1.1 Revision History
Revision Number
Description
Revision Date
001
Initial release
July 2014
002
Corrections to Temperature and Notes following Table 8.
October 2014
Term
Description
AHCI*
Advanced Host Controller Interface
APM
Advanced Power Management
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
DPTF
Dynamic Platform Thermal Framework
eDrive
Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
Locking SP
Locking Security Provider
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
1.2 Terminology
Table 1: Terminology
Intel® Solid-State Drive Pro 2500 Series (M.2)
Product Specification October 2014
6 330902-002
Term
Description
Opal
A Trusted Computing Group (TCG) standard that defines an interface for managing a
Self-Encrypting Drive (SED).
PIO
Programmed Input/Output
PSID
Physical presence Security ID
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SATA
Serial Advanced Technology Attachment
SED
Self-Encrypting Drive
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid-State Drive
TCG
Trusted Computing Group
TYP
Typical
UBER
Uncorrectable Bit Error Rate
Date or Rev. #
Title
Location
Sept 2008
IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008 (Modified)
http://www.iec.ch/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
August 2010
IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods of
measurement CISPR24:2010
http://www.iec.ch/
Sept 2010
Solid-State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standardsdocuments/docs/jesd218/
February 2012
TCG Opal Specification Version 2.0 rev 1.0
http://www.trustedcomputinggroup.com/
August 2013
Serial ATA Revision 3.2
http://www.sata-io.org/
October 2013
ACS-3 Specification
http://www.t13.org/
Intel® Solid-State Drive Pro 2500 Series (M.2)
1.3 Reference Documents
Table 2: Standard References
October 2014 Product Specification
330902-002 7
Intel® Solid-State Drive Pro 2500 Series (M.2)
Capacity
Unformatted Capacity (Total User Addressable Sectors in LBA mode)
180GB
351,651,888
240GB
468,862,128
360GB
703,282,608
Type
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)2
Random
4KB Write
(TYP)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
IOPS
MB/s
MB/s
2280
180GB
41,000
80,000
49,000
540
490
240GB
41,000
80,000
49,000
540
490
360GB
45,000
33,000
28,500
540
490
2260
180GB
41,000
80,000
49,000
540
490
240GB
41,000
80,000
49,000
540
490
Type
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
2280
180GB
37,500
17,000
455
165
240GB
37,500
23,000
510
225
360GB
37,500
10,000
525
230
2260
180GB
37,500
17,000
540
165
240GB
37,500
23,000
510
225
2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
2.2 Performance
Table 4: Compressible Performance
Note:
1. Performance measured using IOMeter * with Queue Depth 32. Measurements are performed on 8 GB of Logical
Block Address (LBA) range on a full SSD.
2. Random 4 KB writes measured using out-of-box SSD.
Table 5: Incompressible Performance
Note:
1. Performance measured using IOMeter * with Queue Depth 32
Product Specification October 2014
8 330902-002
Specification
Intel® SSD Pro 2500 Series Type 2280
Type 2260
180GB
240GB
360GB
180GB
240GB
Read1
80 µs (TYP)
85 µs (TYP)
500 ms (TYP)
<10 s
Write1
Power On To Ready2
Max Power On To Ready3
Electrical Characteristics
Intel® SSD Pro 2500 Series Type 2280
Type 2260
180GB
240GB
360GB
180GB
240GB
Operating Voltage for 3.3 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1
3.14 V
3.47 V
100 ms / 0.1 ms
5 s / 1 ms
70 mV pp (10 Hz – 30 MHz)
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep4
140 mW
55 mW
200 µW
Thermal Power5
3.8 W
4.5 W
4.5 W
3.8 W
4.5 W
Regulator Power6
4.1 W
4.9 W
5.5 W
4.1 W
4.9 W
Intel® Solid-State Drive Pro 2500 Series (M.2)
Table 6: Latency
Note:
1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload with compressible (non-random) data
pattern. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
Note:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
October 2014 Product Specification
330902-002 9
represents power that would be thermal load on system during heavy workloads.
represents power that system power supply would have to regulate for proper device operation.
2.4 Environmental Conditions
Electrical Characteristics
Range
Module Temperature
Operating1
Non-operating2
0° C – 70° C
-55° C – 95° C
Temperature Gradient3
Operating
Non-operating
30 (TYP)° C/hr
30 (TYP)° C/hr
Humidity
Operating
Non-operating
5 – 95 %
5 – 95 %
Shock and Vibration
Range
Shock4
Operating
Non-operating
1,000 G (Max) at 0.5 msec
1,000 G (Max) at 0.5 msec
Vibration5
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
2.4.1 Temperature, Shock, Vibration
Table 8: Temperature, Shock, Vibration
Intel® Solid-State Drive Pro 2500 Series (M.2)
Note:
1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for
maintaining proper device operating temperature on heavier workloads.
2. Please contact your Intel representative for details on the non-operating temperature range.
3. Temperature gradient measured without condensation.
4. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and
pulse width value.
5. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean
Squared (GRMS) value.
2.13.1 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under
non-operational conditions to pressures representative of -1 K and +40 K feet.
Product Specification October 2014
10 330902-002
Title
Description
Region For Which
Conformity Declared
TITLE 47-Telecommunications CHAPTER 1—
FEDERAL COMMUNMICATIONS COMMISSION
PART 15 — RADIO FREQUENCY DEVICES
ICES-003, Issue 4 Interference-Causing
Equipment
Standard Digital Apparatus
FCC Part 15B Class B
CAN/CSA – CEI/IEC CISPR 22-10 (Ref. CISPR
22:2008)
USA
Canada
IEC 55024 Information Technology Equipment
— Immunity characteristics— Limits and
methods of measurement CISPR24:2010
EN-55024: 2010 and its amendments
European Union
IEC 55022 Information Technology Equipment
— Radio disturbance Characteristics— Limits
and methods of measurement CISPR22:2008
(Modified)
EN-55022: 2010 and its amendments
European Union
EN-60950-1 2nd Edition
Information Technology Equipment — Safety —
Part 1: General Requirements
USA/Canada
UL/CSA EN-60950-1 2nd Edition
Information Technology Equipment — Safety —
Part 1: General Requirements
USA/Canada
Intel® Solid-State Drive Pro 2500 Series (M.2)
2.14 Product Regulatory Compliance
The Intel SSD Pro 2500 Series meets or exceeds the regulatory or certification requirements in the table below.
Table 9: Product Regulatory Compliance Specifications
October 2014 Product Specification
330902-002 11
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