Intel SSDSCJJF180A501 User Manual

Intel® Solid-State Drive Pro 2500 Series (M.2)

Capacities: 180GB, 240GB, 360GB

Form Factors:

 80mm (single-sided) 2280-S2-B-M (180GB)

and (double-sided) 2280-D2-B-M
(240GB and 360GB)

 60mm (double-sided) 2260-D2-B-M

(180GB and 240GB)

Thickness: up to 3.58 mm

Weight: <10 grams

SATA 6Gb/s Bandwidth Performance

1

(IOMeter* Queue Depth 32)

 Sustained Sequential Read: up to 540MB/s
 Sustained Sequential Write: up to 490MB/s

Read and Write IOPS

1

(IOMeter Queue Depth 32)

 Random 4KB Reads: up to 45,000 IOPS
 Random 4KB Writes: up to 80,000 IOPS

2

Data Compression

Intel

®

Stable Image Platform Program (SIPP)

Security and Manageability Compatibility

 Intel® Core® vPro® Processor
 Intel

®

Setup and Configuration Software

(Intel

®

SCS)

 AES 256-bit Encryption
 Trusted Computing Group* (TCG*) Opal Security

Subsystem Class (SSC) Specification Version 2.0
features

 Windows eDrive*

Additional Compatibility

 Intel

®

SSD Toolbox with Intel® SSD Optimizer

 Intel

®

Data Migration Software

 Intel

®

Rapid Storage Technology

 SATA Revision 3.2
 ACS-3 (ATA/ATAPI Command Set 3)
 SSD Enhanced SMART ATA feature set
 Intel

®

Dynamic Platform Thermal Framework

(Intel® DPTF)

End-to-End Data Protection

Power Management

 3.3 V SATA Supply Rail
 SATA Link Power Management (LPM)
 Advanced Power Management (APM)
 Device Sleep (DevSleep)

Power

 Active (BAPCo MobileMark* 2007 Workload):

140 mW

 Idle

3

: 55 mW

 DevSleep: 200 µW

Temperature

 Operating

4

: 0o C to 70o C

 Non-Operating: -55

o

C to 95o C

Reliability

— Uncorrectable Bit Error Rate (UBER):

<1 sector per 1016 bits read

— Mean Time Between Failure (MTBF):

1.2 million hours

— Shock (operating and non-operating):

1,000 G/0.5 ms

Vibration

— Operating: 2.17 G

RMS

(5-700Hz)

— Non-operating: 3.13 G

RMS

(5-800Hz)

Certifications and Declarations:

 UL*
 CE*
 C-Tick*
 BSMI*
 KCC*
 Microsoft* WHCK
 VCCI*
 SATA-IO*

Product Ecological Compliance

 RoHS*

Intel® Solid-State Drive Pro 2500 Series (M.2)

NOTES:

1. Performance values vary by capacity.

2. Random 4KB writes measured using out-of-box SSD.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper

device operating temperatures on heavier workloads.

Order Number: 330902-002

Product Specification

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel® Solid-State Drive Pro 2500 Series (M.2)

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responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without
notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to d eviate from
published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800­548-4725, or go to: http://www.intel.com/design/literature.html

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purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The
replacement of halogenated flame retardants and/or PVC may not be better for the environment.

No computer system can provide absolute security under all conditions. Built-in security features available on select Intel® Solid State Drives may
require additional software, hardware, services and/or an Internet connection. Software and workloads used in performance tests may have been
optimized for performance only on Intel microprocessors. Performance tests are measured using specific computer systems, components,
software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and
performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with
other products. Consult your system manufacturer for more details.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Copyright © 2014 Intel Corporation. All rights reserved.

Product Specification October 2014
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Intel® Solid-State Drive Pro 2500 Series (M.2)

Contents

1 Introduction .................................................................................................................. 5

1.1 Revision History .............................................................................................................. 6

1.2 Terminology .................................................................................................................. 6

1.3 Reference Documents ....................................................................................................... 7

2 Product Specifications ..................................................................................................... 8

2.1 Capacity ........................................................................................................................ 8

2.2 Performance .................................................................................................................. 8

2.3 Electrical Characteristics .................................................................................................... 9

2.4 Environmental Conditions ................................................................................................. 10

2.4.1 Temperature, Shock, Vibration ......................................................................... 10

2.4.2 Altitude .......................................................................................................... 10

2.5 Product Regulatory Compliance ......................................................................................... 11

2.6 Reliability ..................................................................................................................... 12

3 Mechanical Information .................................................................................................. 13

4 Pin and Signal Descriptions ............................................................................................. 16

4.1 Pin Locations ................................................................................................................ 16

4.2 Signal Descriptions ......................................................................................................... 17

4.3 Device Sleep Feature ....................................................................................................... 18

5 Supported Command and Feature Sets .............................................................................. 19

5.1 Supported ATA General Feature Command Set ....................................................................... 19

5.2 Advanced Power Management (APM) ................................................................................... 21

5.3 Security ....................................................................................................................... 22

5.3.1 Sanitization Methods ....................................................................................... 22

5.3.2 TCG Opal SSC Support .................................................................................... 22

5.3.3 Windows eDrive* ............................................................................................ 23

5.4 Device Statistics ............................................................................................................. 23

5.5 Software Settings Preservation ........................................................................................... 24

5.6 DevSleep ..................................................................................................................... 24

5.7 SMART Command Transport ............................................................................................. 25

5.8 SMART Attributes ........................................................................................................... 25

5.9 SMART Logs.................................................................................................................. 28

6 Certifications and Declarations ........................................................................................ 29

7 Appendix .................................................................................................................... 30

7.1 Identify Device ............................................................................................................... 30

7.2 Models ........................................................................................................................ 34

October 2014 Product Specification
330902-002 3

Intel® Solid-State Drive Pro 2500 Series (M.2)

Tables

Table 1: Terminology ....................................................................................................................................................................................... 6

Table 2: Standard References...................................................................................................................................................................... 7

Table 3: User Addressable Sectors ........................................................................................................................................................... 8

Table 4: Compressible Performance ........................................................................................................................................................ 8

Table 5: Incompressible Performance ..................................................................................................................................................... 8

Table 6: Latency ................................................................................................................................................................................................. 9

Table 7: Operating Voltage and Power Consumption...................................................................................................................... 9

Table 8: Temperature, Shock, Vibration .............................................................................................................................................. 10

Table 9: Product Regulatory Compliance Specifications ............................................................................................................. 11

Table 10: Reliability Specifications ........................................................................................................................................................... 12

Table 11: M.2 Serial ATA Power Pin Definitions ................................................................................................................................. 17

Table 12: Supported ATA Commands and Feature Sets ................................................................................................................ 19

Table 13: APM Subcommand Codes for Power Management and Definitions .................................................................... 21

Table 14: APM Subcommand Codes for Thermal Power Management and Definitions ................................................. 22

Table 15: Supported Secure Erase Modes and Definitions ........................................................................................................... 22

Table 16: Supported Sanitize Device Modes and Definitions ...................................................................................................... 22

Table 17: ID Device Changes with Opal Activation ............................................................................................................................ 23

Table 18: Device Statistics Log ................................................................................................................................................................... 23

Table 19: Preserved Software Settings ................................................................................................................................................... 24

Table 20: DevSleep Control Parameters ................................................................................................................................................ 25

Table 21: SMART Attributes ......................................................................................................................................................................... 25

Table 22: SMART Attribute Status Flags ................................................................................................................................................ 28

Table 23: Device Certifications and Declarations ............................................................................................................................... 29

Table 24: Identify Device Returned Sector Data ................................................................................................................................. 30

Table 25: Available Models ........................................................................................................................................................................... 34

Figures

Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S2-B-M) 180GB ................................. 13

Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D2-B-M) 240GB and 360GB ..... 14

Figure 3: Dimensions for 60 mm double-sided M.2 Form Factor Drives (2260-D2-B-M) 180GB .............................. 15

Figure 4: Layout of Signal and Power Segment Pins ....................................................................................................................... 16

Product Specification October 2014
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Intel® Solid-State Drive Pro 2500 Series (M.2)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive Pro 2500 Series (Intel®
SSD Pro 2500 Series).

The Intel SSD Pro 2500 Series delivers the next generation of Professional storage solution with enhanced security
and manageability features, power-efficient performance, and lower total cost of ownership. The latest generation
of the Intel® SSD Professional Family supports Trusted Computing Group* (TCG*) Opal version 2.0 features and is
Microsoft eDrive* capable, although “off” is the eDrive factory default out-of-box setting. In addition, Intel’s proven
reliability and low power consumption provide an enhanced mobile experience.

Intel SSD Pro 2500 Series also offers the following additional key features:

 Security and Manageability Features

Intel SSD Pro 2500 Series is a hardware-based self-encrypting drive (SED) enhanced with Opal 2.0* security
features. The TCG Opal specification describes a secure boot capability (pre-boot authentication), protection for
user data, and administrative capabilities, improving security of critical data at rest. Manageability options are
expanded when the Intel SSD Pro 2500 Series is coupled with the latest Intel® Core™ vPro™ processor systems and
software such as Intel® Set-up & Configuration Service (Intel® SCS) with the Intel® SSD Pro Plug-in. Offering unique
manageability options, IT Administrators can proactively manage the Intel® Solid-State Drive Professional Family
and reduce deployment costs while keeping their PCs running smoothly.

 Quality and Reliability Capabilities

Quality and reliability are the cornerstones of Intel® SSD Products and the Intel SSD Pro 2500 is no different.
Limiting employee down-time is critical; the reliability of the Intel SSD Pro 2500 Series is key for Low Total Cost
of Ownership (TCO).

 Power-Efficient Performance

The new advanced low power modes enable longer battery life and greater mobility. In addition, the Intel SSD Pro
2500 Series provides higher performance throughput for the most demanding workloads.

 Stability

Intel SSD Pro 2500 Series is part of the Intel® Stable Image Platform Program (Intel® SIPP). Intel SIPP aligns key
Intel platform components, enabling a predictable transition from one technology generation to the next with
minimal compatibility issues. Enhancing software and hardware stability, Intel SIPP aligns with key Intel platform
components and drivers and is currently available for at least 15 months post platform Intel SIPP availability.

 Tools

Intel SSD Pro 2500 Series is aligned with the latest version of the Intel® SSD Toolbox for consumers and the Intel®
SSD Pro Administrator Tool for business and IT professionals. Intel tools provide key capabilities to maximize your
Intel SSD experience. (Visit www.intel.com/ssd to access the Tools panel for download.)

October 2014 Product Specification
330902-002 5

1.1 Revision History

Revision Number

Description

Revision Date

001

Initial release

July 2014

002

Corrections to Temperature and Notes following Table 8.

October 2014

Term

Description

AHCI*

Advanced Host Controller Interface

APM

Advanced Power Management

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DevSleep

Device Sleep

DIPM

Device Initiated Power Management

DMA

Direct Memory Access

DPTF

Dynamic Platform Thermal Framework

eDrive

Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards

EXT

Extended

FPDMA

First Party Direct Memory Access

GB

Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.

HDD

Hard Disk Drive

HIPM

Host Initiated Power Management

I/O

Input/Output

IOPS

Input/Output Operations Per Second

KB

Kilobyte (1,024 bytes)

LBA

Logical Block Address

Locking SP

Locking Security Provider

LPM

Link Power Management

MB

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

1.2 Terminology

Table 1: Terminology

Intel® Solid-State Drive Pro 2500 Series (M.2)

Product Specification October 2014
6 330902-002

Term

Description

Opal

A Trusted Computing Group (TCG) standard that defines an interface for managing a
Self-Encrypting Drive (SED).

PIO

Programmed Input/Output

PSID

Physical presence Security ID

RDT

Reliability Demonstration Test

RMS

Root Mean Squared

SATA

Serial Advanced Technology Attachment

SED

Self-Encrypting Drive

SMART

Self-Monitoring, Analysis and Reporting Technology

SSD

Solid-State Drive

TCG

Trusted Computing Group

TYP

Typical

UBER

Uncorrectable Bit Error Rate

Date or Rev. #

Title

Location

Sept 2008

IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008 (Modified)

http://www.iec.ch/
Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet

August 2010

IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods of
measurement CISPR24:2010

http://www.iec.ch/
Sept 2010

Solid-State Drive (SSD) Requirements and
Endurance Test Method (JESD218)

http://www.jedec.org/standards­documents/docs/jesd218/

February 2012

TCG Opal Specification Version 2.0 rev 1.0

http://www.trustedcomputinggroup.com/

August 2013

Serial ATA Revision 3.2

http://www.sata-io.org/
October 2013

ACS-3 Specification

http://www.t13.org/

Intel® Solid-State Drive Pro 2500 Series (M.2)

1.3 Reference Documents

Table 2: Standard References

October 2014 Product Specification
330902-002 7

Intel® Solid-State Drive Pro 2500 Series (M.2)

Capacity

Unformatted Capacity (Total User Addressable Sectors in LBA mode)

180GB

351,651,888

240GB

468,862,128

360GB

703,282,608

Type

Capacity

Specification

Random

4KB Read

(up to)1

Random

4KB Write

(up to)2

Random

4KB Write

(TYP)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

IOPS

IOPS

MB/s

MB/s

2280

180GB

41,000

80,000

49,000

540

490

240GB

41,000

80,000

49,000

540

490

360GB

45,000

33,000

28,500

540

490

2260

180GB

41,000

80,000

49,000

540

490

240GB

41,000

80,000

49,000

540

490

Type

Capacity

Specification

Random

4KB Read

(up to)1

Random

4KB Write

(up to)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

IOPS

MB/s

MB/s

2280

180GB

37,500

17,000

455

165

240GB

37,500

23,000

510

225

360GB

37,500

10,000

525

230

2260

180GB

37,500

17,000

540

165

240GB

37,500

23,000

510

225

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

2.2 Performance

Table 4: Compressible Performance

Note:

1. Performance measured using IOMeter * with Queue Depth 32. Measurements are performed on 8 GB of Logical

Block Address (LBA) range on a full SSD.

2. Random 4 KB writes measured using out-of-box SSD.

Table 5: Incompressible Performance

Note:

1. Performance measured using IOMeter * with Queue Depth 32

Product Specification October 2014
8 330902-002

Specification

Intel® SSD Pro 2500 Series Type 2280

Type 2260

180GB

240GB

360GB

180GB

240GB

Read1

80 µs (TYP)

85 µs (TYP)

500 ms (TYP)

<10 s

Write1

Power On To Ready2

Max Power On To Ready3

Electrical Characteristics

Intel® SSD Pro 2500 Series Type 2280

Type 2260

180GB

240GB

360GB

180GB

240GB

Operating Voltage for 3.3 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1

3.14 V

3.47 V

100 ms / 0.1 ms

5 s / 1 ms

70 mV pp (10 Hz – 30 MHz)

1 s

Power Consumption (TYP)
Active2
Idle3
DevSleep4

140 mW

55 mW

200 µW

Thermal Power5

3.8 W

4.5 W

4.5 W

3.8 W

4.5 W

Regulator Power6

4.1 W

4.9 W

5.5 W

4.1 W

4.9 W

Intel® Solid-State Drive Pro 2500 Series (M.2)

Table 6: Latency

Note:

1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload with compressible (non-random) data

pattern. Write Cache enabled.

2. Power On To Ready time assumes safe shutdown

3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of

service.

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

Note:

1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. Power consumption during DevSleep state.

5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This

6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This

October 2014 Product Specification
330902-002 9

represents power that would be thermal load on system during heavy workloads.

represents power that system power supply would have to regulate for proper device operation.

2.4 Environmental Conditions

Electrical Characteristics

Range

Module Temperature
Operating1
Non-operating2

0° C – 70° C

-55° C – 95° C

Temperature Gradient3
Operating
Non-operating

30 (TYP)° C/hr
30 (TYP)° C/hr

Humidity
Operating
Non-operating

5 – 95 %
5 – 95 %

Shock and Vibration

Range

Shock4
Operating
Non-operating

1,000 G (Max) at 0.5 msec
1,000 G (Max) at 0.5 msec

Vibration5
Operating
Non-operating

2.17 GRMS (5-700 Hz) Max

2.4.1 Temperature, Shock, Vibration

Table 8: Temperature, Shock, Vibration

Intel® Solid-State Drive Pro 2500 Series (M.2)

Note:

1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for

maintaining proper device operating temperature on heavier workloads.

2. Please contact your Intel representative for details on the non-operating temperature range.

3. Temperature gradient measured without condensation.

4. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting

screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and
pulse width value.

5. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting

screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean
Squared (GRMS) value.

2.13.1 Altitude

The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under
non-operational conditions to pressures representative of -1 K and +40 K feet.

Product Specification October 2014
10 330902-002

Title

Description

Region For Which

Conformity Declared

TITLE 47-Telecommunications CHAPTER 1—
FEDERAL COMMUNMICATIONS COMMISSION
PART 15 — RADIO FREQUENCY DEVICES

ICES-003, Issue 4 Interference-Causing
Equipment
Standard Digital Apparatus

FCC Part 15B Class B

CAN/CSA – CEI/IEC CISPR 22-10 (Ref. CISPR
22:2008)

USA

Canada

IEC 55024 Information Technology Equipment
— Immunity characteristics— Limits and
methods of measurement CISPR24:2010

EN-55024: 2010 and its amendments

European Union

IEC 55022 Information Technology Equipment
— Radio disturbance Characteristics— Limits
and methods of measurement CISPR22:2008
(Modified)

EN-55022: 2010 and its amendments

European Union
EN-60950-1 2nd Edition

Information Technology Equipment — Safety —
Part 1: General Requirements

USA/Canada

UL/CSA EN-60950-1 2nd Edition

Information Technology Equipment — Safety —
Part 1: General Requirements

USA/Canada

Intel® Solid-State Drive Pro 2500 Series (M.2)

2.14 Product Regulatory Compliance

The Intel SSD Pro 2500 Series meets or exceeds the regulatory or certification requirements in the table below.

Table 9: Product Regulatory Compliance Specifications

October 2014 Product Specification
330902-002 11