Intel SSDSC2KF120H6X1 User Manual
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Capacities: 120, 180, 240, 360, 480, 1000 GB
Form Factors: 2.5-inch
Thickness: 7 mm
Weight: Up to 65 grams
SATA 6Gb/s Bandwidth Performance
1,2
(IOMeter* Queue Depth 32)
Sequential Read: up to 560MB/s
Sequential Write: up to 480MB/s
Read and Write IOPS
1,2
(IOMeter Queue Depth 32)
Random 4KB Reads: up to 84,000 IOPS
Random 4KB Writes: up to 85,000 IOPS
Intel
®
Stable Image Platform Program (SIPP)
Security and Manageability Compatibility
Intel® Core™ vPro™ Processor
Intel
®
Setup and Configuration Software
(Intel
®
SCS)
AES 256-bit Encryption
Trusted Computing Group* (TCG*) Opal Security
Subsystem Class (SSC) Specification Version 2.0
features
Windows eDrive*
Additional Compatibility
Intel
®
SSD Toolbox with Intel® SSD Optimizer
Intel
®
Data Migration Software
Intel
®
Rapid Storage Technology
SATA Revision 3.2
ACS-3 (ATA/ATAPI Command Set 3)
SSD Enhanced SMART ATA feature set
Power Management
5.0 V SATA Supply Rail
SATA Link Power Management (LPM)
Device Sleep (DevSleep)
Advanced Power Management (APM)
Power
Active (BAPCo MobileMark* 2012 Workload):
90 mW
Idle
3
: 50mW
DevSleep: 5 mW
Temperature
Operating
4
: 0o C to 70o C
Non-Operating: -55
o
C to 95o C
Reliability
Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
Mean Time Between Failure (MTBF):
1.6 million hours
Shock (operating and non-operating):
1,500 G/0.5 ms
Vibration
Operating: 2.17 GRMS (5-700Hz)
Non-operating: 3.13 GRMS (5-800Hz)
Certifications and Declarations:
UL*
CE*
RCM*
BSMI*
KCC*
Microsoft* WHCK / WHLK
VCCI*
SATA-IO*
Product Ecological Compliance
RoHS*
Intel® Solid State Drive Pro 5400s Series
(2.5-inch)
Product Specification
NOTES:
1. IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard,
Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB)
Kingston DDR3-1555, Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
2. Performance values vary by capacity.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for
maintaining proper device operating temperatures on heavier workloads.
Order Number: 334046-001US
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Revision Number
Description
Revision Date
001
Initial release
March 2016
Ordering Information
Contact your local Intel sales representative for ordering information.
Revision History
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or con figuration will
affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.
For more complete information about performance and benchmark results, visit http://www.intel.com/performance.
IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD
Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document
for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel compo nents as well
as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular
purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document
contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2016 Intel Corporation. All rights reserved.
Product Specification March 2016
2 334046-001US
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Contents
1 Introduction ........................................................................................................................................................................................................ 5
1.1 Terminology ................................................................................................................................................................................................. 5
1.2 Reference Documents .............................................................................................................................................................................. 6
2 Product Specifications .................................................................................................................................................................................. 7
2.1 Capacity .......................................................................................................................................................................................................... 7
2.2 Performance ................................................................................................................................................................................................. 7
2.3 Electrical Characteristics ......................................................................................................................................................................... 8
2.4 Environmental Conditions ..................................................................................................................................................................... 9
2.4.1 Temperature, Shock, Vibration .............................................................................................................................................. 9
2.4.2 Altitude.............................................................................................................................................................................................. 9
2.5 Product Regulatory Compliance ....................................................................................................................................................... 10
2.6 Reliability ...................................................................................................................................................................................................... 10
2.7 Hot Plug Support ...................................................................................................................................................................................... 10
3 Mechanical Information .............................................................................................................................................................................. 11
4 Pin and Signal Descriptions ..................................................................................................................................................................... 12
4.1 Pin Locations .............................................................................................................................................................................................. 12
4.2 Signal Descriptions .................................................................................................................................................................................. 12
4.2.1 Connector Pin Signal Definitions ........................................................................................................................................ 12
4.2.2 Power Pin Signal Definitions ................................................................................................................................................. 13
5 Supported Command and Feature Sets ............................................................................................................................................. 14
5.1 Supported ATA General Feature Command Set........................................................................................................................ 14
5.2 Security Features ...................................................................................................................................................................................... 16
5.2.1 Sanitization Methods ................................................................................................................................................................ 16
5.2.2 TCG Opal SSC Support ............................................................................................................................................................ 17
5.2.3 Windows eDrive* ........................................................................................................................................................................ 17
5.3 DevSleep ...................................................................................................................................................................................................... 17
5.4 SMART Attributes ..................................................................................................................................................................................... 18
6 Certificates and Declarations ................................................................................................................................................................... 21
7 Appendix ............................................................................................................................................................................................................ 22
7.1 Identify Device ........................................................................................................................................................................................... 22
7.2 Models ........................................................................................................................................................................................................... 25
March 2016 Product Specification
334046-001US 3
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Tables
Table 1: Terminology ............................................................................................................................................................................ 5
Table 2: Standard References .......................................................................................................................................................... 6
Table 3: User Addressable Sectors ................................................................................................................................................ 7
Table 4: Burst Performance ............................................................................................................................................................... 7
Table 5: Sustained Performance ..................................................................................................................................................... 7
Table 6: Latency ...................................................................................................................................................................................... 8
Table 7: Operating Voltage and Power Consumption .......................................................................................................... 8
Table 8: Temperature, Shock, Vibration ...................................................................................................................................... 9
Table 9: Reliability Specifications ................................................................................................................................................. 10
Table 10: Serial ATA Connector Pin Definitions ....................................................................................................................... 12
Table 11: Serial ATA Power Pin Definitions ................................................................................................................................ 13
Table 12: Supported ATA Commands and Feature Sets ...................................................................................................... 14
Table 13: Supported Secure Erase Modes and Definitions ................................................................................................. 16
Table 14: Supported Sanitize Device Modes and Definitions ............................................................................................ 16
Table 15: ID Device Changes with Opal Activation .................................................................................................................. 17
Table 16: DevSleep Control Parameters ...................................................................................................................................... 18
Table 17: SMART Attributes ............................................................................................................................................................... 18
Table 18: SMART Attribute Status Flags ...................................................................................................................................... 20
Table 19: Device Certifications and Declarations ..................................................................................................................... 21
Table 20: Identify Device Returned Sector Data ....................................................................................................................... 22
Table 21: Available Models ................................................................................................................................................................ 25
Figures
Figure 1: Dimensions for Full Size 2.5 inch Drives ................................................................................................................. 11
Figure 2: Layout of Signal and Power Segment Pins ............................................................................................................. 12
Product Specification March 2016
4 334046-001US
Term
Description
AHCI*
Advanced Host Controller Interface
APM
Advanced Power Management
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
DPTF
Dynamic Platform Thermal Framework
eDrive
Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a
small portion of the capacity is used for NAND flash management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
Locking
SP
Locking Security Provider
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
1 Introduction
This document describes the specifications and capabilities of the Intel® Solid State Drive Pro 5400s Series (Intel®
SSD Pro 5400s Series).
1.1 Terminology
Table 1: Terminology
March 2016 Product Specification
334046-001US 5
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Term
Description
NOP
No Operation
Opal
A Trusted Computing Group (TCG)standard that defines an interface for managing a
Self-Encrypting Drive (SED).
PIO
Programmed Input/Output
PSID
Physical Security ID, public drive-unique value
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SLC
Single-level Cell
SATA
Serial Advanced Technology Attachment
SED
Self-Encrypting Drive
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid State Drive
TCG
Trusted Computing Group
TYP
Typical
UBER
Uncorrectable Bit Error Rate
Date or Rev. #
Title
Location
May 2005
SFF-8201, 2.5-inch drive form factor
http://www.sffcommittee.org/
May 2006
SFF-8223, 2.5-inch Drive w/Serial Attachment
Connector
http://www.sffcommittee.org/
Sept 2008
IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008 (Modified)
http://www.iec.ch/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
August 2010
IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods of
measurement CISPR24:2010
http://www.iec.ch/
Sept 2010
Solid State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standardsdocuments/docs/jesd218/
February 2012
TCG Opal Specification Version 2.0 rev 1.0
http://www.trustedcomputinggroup.com/
August 2013
Serial ATA Revision 3.2
http://www.sata-io.org/
October 2013
ACS-3 Specification
http://www.t13.org/
1.2 Reference Documents
Table 2: Standard References
§
Product Specification March 2016
6 334046-001US
Capacity
Unformatted Capacity (Total User Addressable Sectors in LBA mode)
120GB
234,441,648
180GB
351,651,888
240GB
468,862,128
360GB
703,282,608
480GB
937,703,088
1000GB
1,953,525,168
Capacity
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
120GB
60,000
50,000
560
400
180GB
71,000
85,000
560
475
240GB
74,000
85,000
560
480
360GB
74,000
85,000
560
480
480GB
78,000
85,000
560
480
1000GB
78,000
85,000
560
480
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
120GB
55,000
13,500
560
70
180GB
65,000
22,000
560
90
240GB
70,000
29,000
560
100
360GB
70,000
29,000
560
100
480GB
72,000
36,000
560
125
1000GB
72,000
36,000
560
125
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
2.2 Performance
Table 4: Burst Performance
Note:
1. Performance measured within the SLC cache buffer using IOMeter* with Queue Depth 32.
Table 5: Sustained Performance
Note:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on 8GB of Logical Block
Address (LBA) range on a full SSD.
March 2016 Product Specification
334046-001US 7
Intel® Solid State Drive Pro 5400s Series (2.5-inch)
Specification
Intel® SSD Pro 5400s Series (All Capacities)
Read1
50 µs (TYP)
Write1
50 µs (TYP)
Power On To Ready2
500 ms (TYP)
Max Power On To Ready
3
< 10 sec
Electrical Characteristics
Value
120GB
180GB
240GB
360GB
480GB
1000GB
Operating Voltage for 5 V
(±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1
4.75 V
5.25 V
100 ms / 0.1 ms
5 s / 1 ms
100 mV pp (10 Hz – 30 MHz)
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep4
90 mW
50 mW
5 mW
Thermal Power5
2.7
2.8 3 3
3.5
3.6
Regulator Power6
3
3.1
3.7
3.9
4.8
4.9
Table 6: Latency
Note:
1. Based on sequential 4KB using Iometer with Queue Depth 1 workload. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown.
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
NOTES:
Product Specification March 2016
8 334046-001US
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 2012 with SATA Link Power Management (LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
represents power that system power supply would have to regulate for proper device operation.
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