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Intel® Solid-State Drive 530 Series (2.5-inch)

Intel® Solid-State Drive 530 Series (2.5-inch)

 

 

 

 

 

Product Specification

Capacities: 80 GB, 120 GB, 180 GB, 240 GB,

Power Management

 

360 GB, 480 GB

 

5.0 V SATA Supply Rail

Components:

 

SATA Link Power Management (LPM)

 

Intel® 20 nm NAND Flash Memory

 

Device Sleep (DevSleep)

 

Multi-Level Cell (MLC)

Power

Form Factors: 2.5-inch

 

Active (BAPCo MobileMark* 2007

Thickness: 7 mm

 

 

Workload): 195 mW

Weight: Up to 78 grams

 

Idle3: 125 mW

 

DevSleep: 5 mW

SATA 6Gb/s Bandwidth Performance1

 

 

(Iometer* Queue Depth 32)

Temperature

 

 

Operating4: 0o C to 70o C

 

Sustained Sequential Read: up to 540 MB/s

 

 

 

Non-Operating: -55o C to 95o C

 

Sustained Sequential Write: up to 490

 

 

 

Reliability

 

 

MB/s

Read and Write IOPS1

 

Uncorrectable Bit Error Rate (UBER):

 

(Iometer Queue Depth 32)

 

 

<1 sector per 1016 bits read

 

Random 4 KB Reads: up to 41,000 IOPS

 

Mean Time Between Failure (MTBF):

 

Random 4 KB Writes: up to 80,000 IOPS2

 

 

1,200,000 hours

Latency (average sequential)

 

— Shock (operating and non-operating):

 

 

1,500 G/0.5 msec

 

Read: 80 µs (TYP)

 

 

 

Vibration

 

Write: 85 µs (TYP)

 

 

Operating: 2.17 GRMS (5-700 Hz)

Data Compression

 

 

— Non-operating: 3.13 GRMS (5-800 Hz)

AES 256-bit Encryption

 

Certifications and Declarations:

End-to-End Data Protection

 

UL*

Compatibility

 

 

CE*

 

Intel® SSD Toolbox with Intel® SSD

 

 

 

C-Tick*

 

 

Optimizer

 

 

 

 

BSMI*

 

Intel® Data Migration Software

 

 

 

KCC*

 

Intel® Rapid Storage Technology

 

 

 

Microsoft* WHCK

 

SATA Revision 3.0

 

 

 

VCCI*

 

ACS-2 (ATA/ATAPI Command Set 2)

 

 

 

SATA-IO*

 

SSD Enhanced SMART ATA feature set

 

 

Product Ecological Compliance

 

 

 

 

 

 

 

RoHS*

NOTES:

1.Performance values vary by capacity.

2.Random 4 KB writes measured using out-of-box SSD.

3.Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4.As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper device operating temperatures on heavier workloads.

October 2013

Product Specification

Order Number: 329212-003US

1

Intel® Solid-State Drive 530 Series (2.5-inch)

Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.html

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

Copyright © 2013 Intel Corporation. All rights reserved.

Product Specification

October 2013

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Order Number: 329212-003US

Intel® Solid-State Drive 530 Series (2.5-inch)

Contents

Revision History ....................................................................................................................

4

1

Introduction...............................................................................................................

5

1.1

Terminology .................................................................................................................

6

1.2

Reference Documents....................................................................................................

7

2

Product Specifications................................................................................................

8

2.1

Capacity

......................................................................................................................

8

2.2

Performance.................................................................................................................

8

2.3

Electrical ................................................................................................Characteristics

9

2.4

Environmental .............................................................................................Conditions

10

 

2.4.1 ........................................................................

Temperature, Shock, Vibration

10

 

2.4.2 .........................................................................................................

Altitude

10

2.5

Product Regulatory .....................................................................................Compliance

11

2.6

Reliability...................................................................................................................

12

2.7

Hot Plug .........................................................................................................Support

12

3

Mechanical ...........................................................................................Information

13

4

Pin and ......................................................................................Signal Descriptions

14

4.1

Pin Locations ..............................................................................................................

14

4.2

Signal Descriptions......................................................................................................

14

 

4.2.1 .......................................................................Connector Pin Signal Definitions

14

 

4.2.2 ............................................................................Power Pin Signal Definitions

15

4.3

Device Sleep ...................................................................................................Feature

15

5

Supported ........................................................................................Command Sets

16

5.1

ATA General ...............................................................................Feature Command Set

16

5.2

Power Management .....................................................................................................

17

5.3

Security ...........................................................................................Mode Feature Set

17

5.4

SMART Command ..................................................................................................Set

18

 

5.4.1 ...........................................................................................

SMART Attributes

18

 

5.4.2 ..................................................................................................

SMART Logs

21

5.5

Device Statistics .........................................................................................................

21

5.6

SMART Command .........................................................................................Transport

22

5.7

Data Set ............................................................................Management Command Set

22

5.8

Host Protected ................................................................................Area Command Set

22

5.9

48-Bit Address .......................................................................................Command Set

22

5.10

General Purpose ...............................................................................Log Command Set

22

5.11

Native Command ............................................................................................Queuing

23

5.12

Software .....................................................................................Settings Preservation

23

5.13

SATA Link .............................................................................Power Management (LPM)

23

6

Certifications ................................................................................and Declarations

24

7

Appendix..................................................................................................................

25

October 2013

Product Specification

Order Number: 329212-003US

3

Intel® Solid-State Drive 530 Series (2.5-inch)

Revision History

Document

Revision

Description

Revision Date

Number

Number

 

 

 

 

 

 

329212

001US

Initial release

July 2013

 

 

 

 

329212

002US

Added 120 GB capacity

September 2013

 

 

 

 

329212

003US

Added 80 GB, 360 GB, and 480 GB capacities

October 2013

 

 

 

 

Product Specification

October 2013

4

Order Number: 329212-003US

Intel® Solid-State Drive 530 Series (2.5-inch)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD 530 Series).

The Intel SSD 530 Series delivers the next generation storage solution with new low power features designed for Ultrabook™. The next generation Intel SSD continues to provide high performance expected for Serial Advanced Technology Attachment (SATA)-based computers.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and ruggedness offered by an SSD.

The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the DevSleep pin. The drive will consume a mere 5 mW while in this state.

As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:

High I/O and throughput performance

Low power consumption

Increased system responsiveness

High reliability

Enhanced ruggedness

The Intel SSD 530 Series also offers additional key features such as:

Advanced Encryption Standard (AES) 256-bit Encryption

AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with an ATA drive password—helps protect user data.

End-to-End Data Protection

End-to-end data protection helps protect data from being corrupted across the data path by using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.

Data Compression

Data compression helps improve performance and endurance by automatically compressing information sent to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed depends on the type of data.

October 2013

Product Specification

Order Number: 329212-003US

5

Intel® Solid-State Drive 530 Series (2.5-inch)

1.1Terminology

Table 1: Terminology

Term

Description

 

 

ATA

Advanced Technology Attachment

 

 

DAS

Device Activity Signal

 

 

DevSleep

Device Sleep, a new addition to the SATA specification

 

 

DIPM

Device Initiated Power Management

 

 

DMA

Direct Memory Access

 

 

EXT

Extended

 

 

FPDMA

First Party Direct Memory Access

 

 

 

Gigabyte (1,000,000,000 bytes)

GB

Note: The total usable capacity of the SSD may be less than the total physical

capacity because a small portion of the capacity is used for NAND flash

 

 

management and maintenance purposes.

 

 

HDD

Hard Disk Drive

 

 

HIPM

Host Initiated Power Management

 

 

I/O

Input/Output

 

 

IOPS

Input/Output Operations Per Second

 

 

KB

Kilobyte (1,024 bytes)

 

 

LBA

Logical Block Address

 

 

LPM

Link Power Management

 

 

MB

Megabyte (1,000,000 bytes)

 

 

MLC

Multi-level Cell

 

 

MTBF

Mean Time Between Failures

 

 

NCQ

Native Command Queuing

 

 

NOP

No Operation

 

 

PIO

Programmed Input/Output

 

 

RDT

Reliability Demonstration Test

 

 

RMS

Root Mean Squared

 

 

SATA

Serial Advanced Technology Attachment

 

 

SMART

Self-Monitoring, Analysis and Reporting Technology

 

 

SSD

Solid-State Drive

 

 

TYP

Typical

 

 

UBER

Uncorrectable Bit Error Rate

 

 

Product Specification

October 2013

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Order Number: 329212-003US

Intel® Solid-State Drive 530 Series (2.5-inch)

1.2Reference Documents

Table 2: Standard References

Date or Rev. #

Title

Location

 

 

 

May 2005

SFF-8201, 2.5-inch drive form factor

http://www.sffcommittee.org/

 

 

 

May 2006

SFF-8223, 2.5-inch Drive w/Serial Attachment

http://www.sffcommittee.org/

 

Connector

 

 

IEC 55022 Information Technology Equipment —

 

Sept 2008

Radio disturbance Characteristics— Limits and

http://www.iec.ch/

methods of measurement CISPR22:2008

 

 

 

(Modified)

 

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

 

 

http://qdms.intel.com/

June 2009

RoHS

Click Search MDDS Database and search

 

 

for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

 

 

 

August 2009

ACS-2 Specification

http://www.t13.org/

 

 

 

 

IEC 55024 Information Technology Equipment —

 

August 2010

Immunity characteristics— Limits and methods

http://www.iec.ch/

 

of measurement CISPR24:2010

 

Sept 2010

Solid-State Drive (SSD) Requirements and

http://www.jedec.org/standards-

Endurance Test Method (JESD218)

documents/docs/jesd218/

 

October 2013

Product Specification

Order Number: 329212-003US

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