Intel SSDPAMM0004G1, SSDPAMM0016G1, SSDPAMM0008G1, SSDPAEM0004G1, SSDPAEM0008G1 Product Manual

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Intel® Z-P230 PATA Solid State Drive
SSDPAMM0004G1, SSDPAMM0008G1, SSDPAMM0016G1, SSDPAEM0004G1, SSDPAEM0008G1, SSDPAEM0016G1
Product Manual
Capacities
—4 GB —8 GB — 16 GB
ONFI 1.0 compliantPATA Compatibility
— ATA-5 compatible —UDMA4 supported — PIO Mode 4 supported — MWDMA Mode 2 supported — PATA ZIF connector
Performance
— Sustained Sequential Read Bandwidth:
38 MB/s
— Sustained Sequential Write Bandwidth:
10 MB/s
Form Fact or
— ZIF Connector
• 1.8 in (W) x 0.9 in (L) x 0.13 in (H)
• Weighs approximately 11 grams (TYP)
• Suggested ZIF cable length: 3 in
— Mini PCIe Form Factor
• 1.18 in (W) x 2 in (L) x 0.15 in (H)
• Weighs approximately 8 grams (TYP)
Reliability
— Mean Time Between Failure (MTBF)
1 Million Hours
— 3 Years Useful Life
Power Supply Voltage: 3.3 V ± 10% (TYP)Power Consumption (Vcc = 3.3 V)
—Idle: <1 mW (TYP) — Active: 445 mW (TYP)
Power Loss Protection: both hardware and
firmware help prevent data corruption in the event of a power down during a WRITE cycle
Temperature
—Operating: 0 — Non-operating: 0
Shock and Vibration
o
C to 70oC
o
C to 85oC
— Shock: 600 G/2 ms — Non-operating Vibration: 3.13 G, 5-500 Hz — Operating Vibration: 1.1 G, 5-40 Hz
Compliances
— Lead free —RoHS
Order Number: 319955-003US
September 2008
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Ordering Information
S D P A M 0 4M 0 GS 0
Product Type Designator
SSD = Solid State Drive
Density
001G = 1 GB 002G = 2 GB 004G = 4 GB 008G = 8 GB 016G = 16 GB 032G = 32 GB
Product Generation
1-9 Generations
Bus Architectu re
PA = PATA SA = SATA US = Uni v e rsal Serial Bus
Form Factor
E = PCIe Module M = Full Minicard
Product Technology Type
S = Single Level Cell M = Multi-Level Cell
1
Reserved for Futu re Use
Intel Solid State Drive Product Name Decoder
Intel Z-P230 PATA SSD Ordering Information
Part Number Production MM # Device Nomenclature
SSDPAMM0004G1 898543 4 GB PATA SSD MLC ZIF Connector 100 pieces SSDPAMM0008G1 898544 8 GB PATA SSD MLC ZIF Connector 100 pieces SSDPAMM0016G1 899886 16 GB PATA SSD MLC ZIF Connector 100 pieces
SSDPAEM0004G1 899163 4 GB PATA SSD MLC PCIe Connector 100 pieces SSDPAEM0008G1 899164 8 GB PATA SSD MLC PCIe Connector 100 pieces SSDPAEM0016G1 899 165 16 GB PATA SSD MLC PCIe Connector 100 pieces
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4725 or by visiting Intel's website at http://www.intel.com. *Other names and brands may be claimed as the property of others. Copyright © 2008, Intel Corporation. All Rights Reserved.
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Packaging
Production
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Intel® Z-P230 PATA SSD
Contents
1.0 Overview...................................................................................................................5
1.1 Key Features ...................................................... .. .. ................................ .. ..........6
1.2 Architecture........................................................................................................6
1.3 Block Diagram ....................................................................................................7
2.0 Regulatory Compliance..............................................................................................7
3.0 Product Specifications ............................................................................................... 8
3.1 Capacity ............................................................................................................8
3.2 Performance.......................................................................................................8
3.3 Operating Conditions ............................................................ .. .............................8
3.3.1 Maximum Ratings.....................................................................................8
3.3.2 Recommended Operating Conditions.............................. .. .. .........................9
3.4 Electrical Characteristics.......................................................................................9
3.5 Environmental Conditions....................................................................... .. .. .. ........9
3.5.1 Temperature............................................................................................9
3.5.2 Altitude...................................................................................................9
3.5.3 Shock and Vibration................................................................................10
3.5.4 Acoustics ..............................................................................................10
3.5.5 Electrostatic Discharge (ESD)...................................................................10
3.6 Reliability.........................................................................................................10
4.0 Mechanical Information...........................................................................................11
5.0 Pin Assignments and Signal Descriptions.................................................................14
5.1 Pin Assignments................................................................................................14
5.2 Signal Descriptions................................... .. ... ................................. ...................15
6.0 Command Sets ........................................................................................................16
6.1 ATA General Feature Command Set..................................................................... 16
6.1.1 IDENTIFY DEVICE DATA................................ .. .. .. .................................. ..17
6.1.2 READ MULTIPLE and WRITE MULTIPLE Command Value...............................20
6.1.3 SET FEATURES Subcommands .................................................................20
6.1.4 SMART Subcommand Set ........................................................................20
6.2 Power Management Command Set.......................................................................21
7.0 References .............................................................................................................. 21
8.0 Additional Product Information ...............................................................................22
9.0 Glossary ..................................................................................................................22
10.0 Revision History ......................................................................................................23
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Intel® Z-P230 PATA SSD
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Intel® Z-P230 PATA SSD
1.0 Overview
The Intel® Z-P230 PA TA Solid-State Drive (SSD) devices are available in either a 4 GB, 8 GB or 16 GB capacities featuring either a Zero Insertion Force (ZIF) connector or Mini PCIe form factor for notebooks. The targeted application is for notebook computers which require a small capacity and durable, low-power storage.
The Intel Z-P230 PATA SSD is electronically-drop-in compatible with mechanical PATA Hard Disk Drives, but delivers faster boot—the loading and execution of applications with no moving parts—leading to faster system responsiveness and longer battery life.
Figure 1. Front View of the Intel Z-P230 PATA SSD with ZIF Connector
Figure 2. Front View of the Intel Z-P230 PATA SSD with Mini PCIe Connector
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1.1 Key Features
• 4 GB, 8 GB and 16 GB capacity
•ATA UDMA4 support
• ZIF connector or Mini PCIe form factor
•Weight — ZIF connector: approximately 11 grams — Mini PCIe form factor: approximately 8 grams
• Less than 1mW idle power (TYP)
•445 mW active power (TYP)
• Uses Intel MLC NAND Flash Memory
• Sequential read: 38 MB/s
• Sequential write: 10 MB/s
• Footprint — ZIF connector: 38 mm (L) x 54 mm (W) x 3.2 mm (H) — Mini PCIe form factor: 50.95 mm (L) x 30 mm (W) x 3.8 mm (H)
Intel® Z-P230 PATA SSD
1.2 Architecture
The Intel Z-P230 PATA Solid State Drive is a dual-channel PAT A controller driven SSD available in a ZIF connector or mini PCIe form factor.
The PA TA controller in the Intel® Z-P230 PAT A Solid State Drive uses a microcontroller­based architecture that enables two flash memory channels to service read and write operations. See Figure 3, “Functional Block Diagram of Intel Z-P230 PATA Solid State
Drive” on page 7. Capable of performing flash management functions, the SSD also
implements internal wear leveling to minimize system overhead. Intel Z-P230 PATA Solid State Drives use Intel MD516 NAND Flash Memory multi-level
cell (MLC) thin-small outline package (TSOP) devices in three capacities: 4 GB, 8 GB and 16 GB. Refer to the Intel MD516 NAND Flash Memory Datasheet for details about this component. Please see Section 8.0, “Additional Product Information” on page 22 for more information.
Intel MLC NAND uses the industry-standard ONFI NAND flash memory command set that is capable of program page cache mode, page read cache mode, two plane commands and interleaved die operations.
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Intel® Z-P230 PATA SSD
PATA Interfac ePATA Interfac e
PATA
Controller
Channel 0
DATA 0 [0-7]
Channel 0
DATA 0 [0-7]
Channel 1
DATA 1 [0-7]
Channel 1
DATA 1 [0-7]
NAND
Flash
Memory
NAND
Flash
Memory
1.3 Block Diagram
Figure 3. Functional Block Diagram of Intel Z-P230 PATA Solid State Drive
2.0 Regulatory Compliance
The Intel Z-P230 PATA SSD is compliant with the restriction of Hazardous Substances (RoHS) directive. It also conforms with standards of CE Mark for European consumer electronic compliance.
Since the Intel Z-P230 PATA SSD is intended to be contained solely within a personal computer or similar enclosure (not attached as an external device), the SSD is tested in representative end-user systems. While the Intel Z-P230 PATA SSD is EMC compliant (Specification EN55022), computer manufacturers and system integrators should confirm EMC compliance and provide CE marking for their products.
As a subassembly, no Federal Communications Commission verification or certification of the device is required. Intel Corporation has tested this device in enclosures to ensure that the SSD does comply with the limits for a Class B computing device, pursuant to Subpart J, Part 15 of the FCC rules.
Table 1. Device Compliance
Compliance Description
CE
PB Free Components and materials are lead free.
RoHS Restriction of Hazardous Substance Directive
Indicates conformity with the essential health and safety requirements set out in European Directives Low Voltage Directive and EMC Directive.
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3.0 Product Specifications
3.1 Capacity
Table 2. Capacity and User Addressable Sectors
Unformatted User Addressable Sector in LBA mode
4 GB* 7,880,544 8 GB* 15,761,088
16 GB* 31,522,176
Note: Formatting and other functions will use some of the space, thus the listed capacity will not be available entirely for data
storage.
3.2 Performance
Table 3. Read and Write Performance
Operation Access Type MB/second
READ Sustained Sequential Read Bandwidth 38
WRITE Sustained Sequential Write Bandwidth 10
Notes:
1. Queue depth is set to 1.
2. Device measured using IOmeter*.
3. Sampled, not tested.
3.3 Operating Conditions
3.3.1 Maximum Ratings
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional oper ation of the device at these or any other conditions above those indicated in the operational sections of this specification is not guaranteed. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Table 4. Absolute Maximum Ratings by Device
Parameter Symbol Min Max Unit
Vcc supply voltage Vcc -0.6 +4.6 V Non-operating temperature Tstg 0 85 °C
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Intel® Z-P230 PATA SSD
3.3.2 Recommended Operating Conditions
Table 5. Operating Temperature and Voltages
Parameter Symbol Min Typ Max Unit
Operating temperature T Vcc supply voltage Vcc 3.0 3.3 3.6 V Ground supply voltage Vss 0 0 0 V
A 0-7C
3.4 Electrical Characteristics
Table 6. Power Consumption
Setting Value
Active Current 135 mA (TYP) Active Idle Current 30 mA (TYP) Idle Current 235 uA (TYP) Active Power 445 mW Idle Power <1 mW
Notes:
1. Using UDMA 4 program mode, calculation based on worst case workload condition.
2. Idle power is measured using active power management.
3. Sampled, not tested.
3.5 Environmental Conditions
3.5.1 Temperature
Table 7. Temperature Specifications
Mode Min Max Unit
Ambient Temperature
3.5.2 Altitude
Since there are no moving parts, this device is not susceptible to a lack of air molecules and will operate correctly to 50,000 feet above sea level.
Operating 0 70 Non-Operating 0 85
o
C
o
C
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3.5.3 Shock and Vibration
Table 8. Shock and Vibration Characteristics
Condition Value
Non-operating shock 600 G/2 mS Non-operating vibration 5-500 Hz; 3.13 G Operating vibration 5-40 Hz; 1.1 G
Notes:
1. Shock specifications assumes that the SSD is mounted securely with the input vibration applied to the drive mounting screws. Vibration may be applied in the X, Y or Z axis.
2. Vibration specifications assumes that the SSD is mounted securely with the input vibration applied to the drive mounting screws. Vibration may be applied in the X, Y or Z axis.
3.5.4 Acoustics
This drive has no moving or noise-emitting parts; therefore, it produces negligible sound (0dB) in all modes of operation.
3.5.5 Electrostatic Discharge (ESD)
The Intel Z-P230 PA T A SSD can withstand an electrostatic discharge of +/- of 4 KV. ESD testing is done to demonstrate that the units can withstand discharge encountered in normal handling or operations of the equipment.
3.6 Reliability
Table 9. Reliability Specifications
Parameter Value
Mean Time Between Failure (MTBF) 1,000,000 hours
1,2
15
bits read, max
Non-recoverable read errors 1 sector per 10 Useful Life 3 years
Notes:
1. Based on 60% random workload of 1GB/day on 4GB sku, 2GB/day on 8GB sku and 4GB/day on 16GB sku.
2. 60% of MB data written is random.
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Intel® Z-P230 PATA SSD
38±0.15
54
±
0.15
1.6±0.1
1.6
1.2
2.5
±
0.05
34.9
±
0.1
4.62±0.1
27±0.05
3.5±0.05
51
±
0.05
Ø
(X2)2.5±0.1
Ø
(X2)7±0.1
Ø
(X2)7±0.1
CONTROLLER
NAND
NAND
ZIF CONN
POS.NO.1 <A2> WAS POS.NO.40
NAND
NAND
4.0 Mechanical Information
Figure 4. Intel Z-P230 PATA SSD with ZIF Connector (Top, Side and Bottom Views)
Notes:
1. All dimensions are in millimeters.
2. Card thickness to be 1.6 ± 0.1 mm, including solder plating unless otherwise specified.
3. Solder plating thickness to be 0.05 mm MAX TYP.
4. Coordinates indicate the center of this connector, or the center of the positioning pin/hole, or the location of #pin
5. Suggested ZIF cable length is 3 inches.
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Figure 5. ZIF Connector Dimensions (Top, Side and Profile Views)
Intel® Z-P230 PATA SSD
Note: All dimensions are in millimeters.
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Intel® Z-P230 PATA SSD
30
0
-0.3
24.2
±
0.1
Ø
(X2)2.6±0.1
3.2
48.05±0.1
50.95
0
-0.3
3.85
±
0.1
1.5
3.25
R (X2)0.8
1
±
0.1
1.6
1.2
MIN5.1
MIN5.1
CONTROLLERNAND
COMPONENT KEEP OUT AREA FOR CONNECTOR
NAND
COMPONENT KEEP OUT AREA FOR CONNECTOR
25.7
Figure 6. Intel Z-P230 PATA SSD with Mini PCIe Connector (Top, Side and Bottom
Views)
Notes:
1. All dimensions are in millimeters.
2. Card thickness to be 1.0 ± 0.1 mm, including solder plating unless otherwise specified.
3. Solder plating thickness to be 0.05 mm MAX TYP.
4. Coordinates indicate the center of this connector, or the center of the positioning pin/hole, or the location of #pin.
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5.0 Pin Assignments and Signal Descriptions
5.1 Pin Assignments
Table 10. Intel Z-P230 with ZIF Connector - 40 Pin Assignments
Pin
Number
1Reserved 11 DQ4 21 GND 31 DA1 2Reserved 12 DQ11 22DMARQ 32PDIAG# 3 RESET# 13 DQ3 23 GND 33 DA0 4 GND 14 DQ12 24 DIOW# 34 DA2 5 DQ7 15 DQ2 25 DIOR# 35 CS0# 6 DQ8 16 DQ13 26 GND 36 CS1# 7 DQ6 17 DQ1 27 IORDY 37 DASP# 8 DQ9 18 DQ14 28 GND 38 VCC 9DQ5 19DQ0 29DMACK# 39VCC
10 DQ10 20 DQ15 30 INTRQ 40 Reserved
Signal
Pin
Number
Signal
Pin
Number
Signal
Pin
Number
Signal
Table 11. Intel Z-P230 with Mini PCIe Form Factor - 52 Pin Assignments
Pin Number Signal Signal Pin Number
1DQ0 DQ152 3DQ1 GND4 5DQ2 DQ146 7DQ3 DQ138
9 GND DQ12 10 11 DQ4 DQ11 12 13 DQ5 DQ10 14 15 GND DQ9 16
17 DQ6 GND 18 19 DQ7 DQ8 20 21 GND RESET# 22 23 NC DIOW 24 25 NC NC 26 27 GND DIOR 28 29 GND DMACK# 30 31 NC DMARQ 32 33 NC GND 34 35 GND NC 36 37 DA0 NC 38 39 DA1 GND 40
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Mechanical Key
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Intel® Z-P230 PATA SSD
Table 11. Intel Z-P230 with Mini PCIe Form Factor - 52 Pin Assignments
Pin Number Signal Signal Pin Number
41 DA2 IORDY 42 43 NC INTRRQ 44 45 NC CS0# 46 47 VCC CS1# 48 49 VCC GND 50 51 VCC NC 52
Note: The Mini PCIe form factor does not use the DASP# or PDAIG signals.
5.2 Signal Descriptions
Table 12. Signal Symbols and Descriptions
Symbol Type Description
CS0#, CS1# Input
DA[0...2] Input
DASP# Input/Output
DIOR# Input
DIOW# Input
DMACK# Input
DMARQ Output
DNU Do Not Use. Must be left unconnected. DQ[0...15] Input/Output 16-bit bidirectional I/O interface. GND Supply Ground connection. INTRQ Output Device uses the Interrupt Request signal to interrupt the host.
IORDY Output
NC Not connected.
PDIAG# Input/Output
Reserved Reserved for Future Use. RESET# Input The host asserts this signal to reset the device. VCC Supply Power supply.
The host uses CS0# to select task file registers and CS1# to select alternate status registers and other device control register.
Device address signals used by the host to access device registers or data port.
The Device Active/Slave Present signal. Note: the Mini PCIe form factor does not use this signal.
The I/O Read Enable signal is the strobe signal asserted by the host to read device registers or the data port.
The I/O Write Enable signal is the strobe signal asserted by the host to write device registers or the data port.
The host uses the DMA Acknowledge si gnal to acknowledge the receipt of the DMA Request and that it is ready to initiate DMA transfers.
The DMA Request signal is asserted by the drive when it is ready for data transfer between it and the host. IORD and IOWR signals are used to control the direction of data transfer.
The device asserts the I/O Ready signal to tell the host to extend the host transfer cycle.
The Pass Diagnostic signal is used by the master/sla ve handsh ake p rotocol to determine if the device has passed diagnostics.
Note: the Mini PCIe form factor does not use this signal.
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6.0 Command Sets
The Intel® Z-P230 PATA SSD device supports all the mandatory ATA commands as defined in the ATA/ATAPI-5 specification.
6.1 ATA General Feature Command Set
The Intel® Z-P230 PATA SSD device supports the ATA General Feature command set (non-PACKET).
Table 13. ATA General Feature Commands
Command Name Code
EXECUTE DEVICE DIAGNOSTIC 90h IDENTIFY DEVICE ECh IDENTIFY DEVICE DMA EEh INITIALIZE DRIVE PARAMETERS 91h NOP 00h READ BUFFER E4h READ DMA C8h, C9h READ LONG 22h, 23h READ MULTIPLE C4h READ NATIVE MAX ADDRESS F8h READ SECTOR(S) 20h, 21h READ VERIFY SECTOR(S) 40h, 41h RECALIBRATE 1Xh SEEK 7Xh SET FEATURES EFh SET MULTIPLE MODE C6h SMART B0h TRANSLATE SECTOR 87h WRITE BUFFER E8h WRITE DMA CAh, CBh WRITE LONG 32h, 33h WRITE MULTIPLE C5h WRITE MULTIPLE without ERASE CDh WRITE SECTOR(S) 30h, 31h WRITE SECTOR(S) without ERASE 38h WRITE VERIFY 3Ch
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6.1.1 IDENTIFY DEVICE DATA
The following table details the data returned after issuing an IDENTIFY DEVICE (ECh) command.
Table 14. Returned Sector Data
Word Default Value Bytes Description
0 044Ah 2 General configuration bit-significant information
4 GB: 1E8Ah
1
2 0000h 2 Reserved 3 0010h 2 Default number of Logical heads 4 7E00h 2 Retired 5 0200h 2 Retired 6 003Fh 2 Default number of logical sectors per logical track
7-8 XXXX 4 Reserved for assignment by the CompactFlash* Association
9 0000h 2 Reserved
10-19 XXXX 20 Serial number (20 ASCII characters)
20 0002h 2 Retired/obsolete 21 0002h 2 Retired/ Obsolete 22 0004h 2 Retired/ Obsolete
23-26 XXXX 8 Firmware revision (8 ASCII characters)
8 GB: 3D14h
16 GB: 3FFFh
2 Default number of Logical cylinders
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Table 14. Returned Sector Data (Continued)
Word Default Value Bytes Description
4 GB: 5353h, 4450h
414Dh, 4D30h 3030h, 3447h 3120h, 2020h 2020h, 2020h 2020h, 2020h
27-46
2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h
8 GB: 5353h, 4450h
414Dh, 4D30h 3030h, 3847h 3120h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h
16 GB: 5353h, 4450h
414Dh, 4D30h 3031h, 3647h 3145h, 5320h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h 2020h, 2020h
40
Model number (40 ASCII characters) Default Value column shows the hex values for ZIF connector based sku:
4 GB: SSDPAMM0004G1 8 GB: SSDPAMM0008G1
16 GB: SSDPAMM0016G1
Other hex values include:
Production SSD with Mini PCIe connector:
4 GB: SSDPAEM0004G1 5353h, 4450h, 4145h, 4D30h, 3030h, 3447h, 3120h, 2020h, 2020h,
2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h
8 GB: SSDPAEM0008G1 5353h, 4450h, 4145h, 4D30h, 3030h, 3847h, 3145h, 5320h, 2020h,
2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h
16 GB: SSDPAEM0016G1
5353h, 4450h, 4145h, 4D30h, 3031h, 3647h, 3145h, 5320h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h, 2020h
Intel® Z-P230 PATA SSD
Maximum number of sectors transferred per interrupt on Read/Write
47 8001h 1
48 0000h 2 Reserved 49 2B00 2 Capabilities: DMA, LBA, IORDY, and standby timer functions supported 50 4000h 2 Capabilities 51 0200h 2 Obsolete 52 0000h 2 Obsolete 53 0007h 2 Data fields 54 to 58, 64 to 70 and 88 are valid
4 GB: 1E8Ah
54
55 0010h 2 Number of current logical heads. Obsolete. 56 003Fh 2 Number of current logical sectors per logical track. Obsolete.
57-58
59 0101h 2 Multiple sector setting is valid
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8 GB: 3D14h
16 GB: 3FFFh
4 GB: 3F60h, 0078h 8 GB: 7EC0h, 00F0h
16 GB: 00FBh, FC10h
Multiple command 1 = for a single-channel card 2 = two-channel card
2 Number of current logical cylinders. Obsolete.
4 Current capacity in sectors. Obsolete
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Intel® Z-P230 PATA SSD
Table 14. Returned Sector Data (Continued)
Word Default Value Bytes Description
4 GB: 3F60h, 0078h
60-61
62 0000h 2 Obsolete 63 0007h 2 Multi-word DMA transfer mode - 2, 1, 0 64 0003h 2 Advanced PIO Modes - 4, 3, 2, 1, 0 65 0078h 2 Minimum multi word DMA cycle time per word 66 0078h 2 Recommended multi word DMA cycle time 67 0078h 2 Minimum PIO cycle time without flow control 68 0078h 2 Minimum PIO cycle time IORDY with flow control
69-79 0000h 22 Reserved
80 0030h 2 Major version number, ATA-4 and ATA-5 support 81 0000h 2 Minor version number, not reported
82 700Bh 2
83 5004h 2 Command set: FLUSH CACHE, CFA feature set 84 4000h 2 Command set/feature supported extension
85 7009h 2
86 1004h 2 Command set enabled: FLUSH CACHE, CFA feature set 87 4000h 2 Command set/feature default. 88 203Fh 2 UDMA mode 4 and below are supported. 89 001Eh 2 Time required for security erase unit completion 90 001Eh 2 Time required for enhanced security erase unit completion 91 0000h 2 Current advanced power management value 92 FFFEh 2 Master Password Revision Code 93 0000h 2 Hardware reset result
94-127 0000h 68 Reserved
128 0029h 2 Security status 129 0003h 2 Vendor specific
130-159 0000h 60 Reserved
160 1000h 2 CFA Power mode 1 (Disabled)
161-255 0000h 190 Reserved
8 GB: 7EC0h, 00F0h
16 GB: 01E0h, FD80h
4 Total number of sectors addressable in LBA mode
Command set: READ BUFFER, WRITE BUFFER, power management feature set, NOP, SMART, Removable Media feature set
Command set enabled: READ BUFFER, WRITE BUFFER, NOP, power management feature set, SMART feature set
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6.1.2 READ MULTIPLE and WRITE MULTIPLE Command Value
Set the following value when executing READ MULTIPLE (C4h) and WRITE MULTIPLE (C5h) commands.
Table 15. Set Multiple Commands Parameter
Feature Sector Count Register Value
Set sectors per block to use on all subsequent READ MULTIPLE (C4h) and WRITE MULTIPLE (C5h) commands.
01h
6.1.3 SET FEATURES Subcommands
The following table identifies the subcommands for the SET FEATURES (EFh) command.
Table 16. Subcommands for the SET FEATURES Command
Subcommand Name Feature Register Value
Enable 8-bit data transfer 01h Set transfer mode based on value in 03h Disable Read Look Ahead 55h Disable Power on Reset (POR) establishment 66h NOP - Accepted 69h Disable 8-bit data transfer 81h NOP - Accepted 96h Accepted for backward compatibility 97h Set host current source capability 9Ah 4 bytes of data applied on READ/WRITE BBh Enable Power on Reset (POR) establishment CCh
6.1.4 SMART Subcommand Set
The SMART RETURN STATUS (DAh) command returns a pass/fail value based on the current status of the Z-P230 PA TA SSD. The BIOS or system software that interfaces to SMART should issue this command at boot up and upon resume from a standby or hibernate c o ndition. If the status returned is PASS, the boot up or resume sequence should continue as normal. If however the status returned is FAIL, the BIOS or system software should issue a warning to the end us er that their SSD is approaching it’ s drive wear-out condition and recommend that the end user back up their SSD.
The following table details the register value for each of the subcommands available when using the SMART (B0h) command:
Table 17. SMART Subcommands
Subcommand Name Feature Register Value
SMART READ ATTRIBUTE D0h SMART READ ATTRIBUTE THRESHOLDS D1h SMART ENABLE ATTRIBUTE AUTOSAVE D2h*
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Table 17. SMART Subcommands (Continued)
Subcommand Name Feature Register Value
SMART DISABLE ATTRIBUTE AUTOSAVE D2h* SMART ENABLE OPERATION D8h SMART DISABLE OPERATIONS D9h SMART RETURN STATUS DAh
Note: The Sector Count Register v alue de termines whethe r to implement SMAR T ENABLE ATTRIBUTE AUTOSAVE (F1h) or SMAR T
DISABLE ATTRIBUTE AUTOSAVE (00h).
6.2 Power Management Command Set
The Intel® Z-P230 PATA SSD devices support the Power Management command set.
Table 18. Power Management Commands
Command Name Code
CHECK POWER MODE E5h, 98h IDLE E3h, 97h IDLE IMMEDIATE E1h, 95h SLEEP E6h, 99h STANDBY E2h, 96h STANDBY IMMEDIATE E0h, 94h
7.0 References
This document also references standards and specifications defined by a variety of organizations. Please use the following information to identify the location of an organization’s standards information.
Table 19. Standards References
Date or
Revision Number
February 2000 ATA-5
January 2007
December 2004
December 2006 Open NAND Flash Interface (ONFI) Specification 1.0 http://www.onfi.org/docs/ONFI_1_0_Gold.pdf
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JEDEC Standard: Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
JEDEC Standard JESD22-C101C: Field-Induced Charged-Device Model Test Method for Electrostatic­Discharge-Withstand Thresholds of Microelectronic Components
Title Location
http://www.t13.org/Documents/ UploadedDocuments/project/d1321r3-ATA­ATAPI-5.pdf
http://www.jedec.org/download/search/ default2.cfm
http://www.jedec.org/download/search/ default2.cfm
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8.0 Additional Product Information
For detailed information about a product mentioned in this document, please refer to the corresponding datasheet or application note.
Table 20. Addition Product Information
Order Number Title Type*
316339-003US Intel® MD516 NAND Flash Memory Datasheet Production
Note: Customers who request access to Advanced datasheets must have a a non-disclosure agreement (NDA) with Intel. We
release Advanced datasheets prior to Preliminary datasheets, which are released around the time a product is sampled. Production datasheets become available when the part is mass produced. To obtain a copy of these documents, please contact your Intel field sales representative.
9.0 Glossary
This document incorporates many industry- and device-specific words. Use the following list to define a variety of terms and acronyms.
Table 21. Glossary of Terms and Acronyms
Term Definition
ATA Advanced Technology Attachment
CE
CFA CompactFlash Association CPRM Content Protection for Recordable Media CRC Cyclic Redundancy Check DDP Dual Die Package DMA Direct Memory Access ECC Error Correction Code EMC ElectroMagnetic Compatibility ESD Electrostatic Discharge FCC Federal Communications Commission
GB
HDD Hard Disk Drive IDE Integrated Device Electronics LBA Logical Block Addressing
MB
Mini PCIe Mini Peripheral Component Interconnect Express (PCIe) MLC Multi-Level Cell MTBF Mean Time Between Failure MWDMA Multi-Word DMA NOP No Operation ODM Original Design Manufacturer
The CE conformity marking applies to products regulated by certain European health, safety and environmental protection legislation.
Giga-byte. Defined as 1x10 formatting and other functions, and therefore, is not available for data storage.
Mega-byte. Defined as 1x10 formatting and other functions, and therefore, is not available for data storage.
9
bytes. Please note that some of the listed cap acity is used for
6
bytes. Please note that some of the listed capacity is used for
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Table 21. Glossary of Terms and Acronyms (Continued)
Term Definition
OEM Original Equipment Manufacturer ONFI Open NAND Flash Interface PATA Parallel ATA PIO Programmable Input / Output QDP Quad Die Package SDP Single Die Package SSD Solid state drive UDMA Ultra DMA, also know Ultra ATA ZIF Zero Insertion Force
10.0 Revision History
Date Revision Description
“Intel Z-P230 PATA SSD Ordering Information” on
“Intel Z-P230 PATA SSD Ordering Information” on
.
September
2008
July 2008 002
June 2008 001
003
Updated the Decoder and
page 2
Updated Added footnote to Table 9, “Reliability Specifications” on page 10 Updated mechanical drawing of ZIF module Figure 4, “Intel Z-P230 PATA SSD with ZIF
Connector (Top, Side and Bottom Views)” on page 11
Modified values and content in the following tables:
Updated values and added Mini PCIe data on the front page. Updated the Decoder and
page 2
Modified
page 6
Added the following sections:
Modified Figure 3, “Functional Block Diagram of Intel Z-P230 PATA Solid State
Drive” on page 7
Added the following tables:
.
Section 6.1.4, “SMART Subcommand Set” on page 20
Table 6, “Power Consumption” on page 9
Table 14, “Returned Sector Data” on page 17
.
Section 1.0, “Overview” on page 5 and Section 1.1, “Key Features” on
.
Section 1.2, “Architecture” on page 6
Section 8.0, “Additional Product Information” on page 22
Table 7, “Temperature Specifications” on page 9
T able 11, “Intel Z-P230 with Mini PCIe Form Factor - 52 Pin Assignments”
on page 14
Added the following figures:
Figure 2, “Front View of the Intel Z-P230 PATA SSD with Mini PCIe
Connector” on page 5
Figure 6, “Intel Z-P230 PATA SSD with Mini PCIe Connector (Top, Side
and Bottom Views)” on page 13
Modified values and content in the following tables:
Table 2, “Capacity and User Addressable S ectors” on page 8
Table 3, “Read and Write Performance” on page 8
Table 13, “ATA General Feature Commands” on page 16
Table 14, “Returned Sector Data” on page 17
Table 21, “Glossary of Terms and Acronyms” on page 22
Initial Release. Earlier information released as Castle Point P A TA Modular Solid State Drive Advance Datasheet - 319546-002US.
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