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The Intel® Z-P230 PA TA Solid-State Drive (SSD) devices are available in either a 4 GB,
8 GB or 16 GB capacities featuring either a Zero Insertion Force (ZIF) connector or Mini
PCIe form factor for notebooks. The targeted application is for notebook computers
which require a small capacity and durable, low-power storage.
The Intel Z-P230 PATA SSD iselectronically-drop-in compatible with mechanical PATA
Hard Disk Drives, but delivers faster boot—the loading and execution of applications
with no moving parts—leading to faster system responsiveness and longer battery life.
Figure 1.Front View of the Intel Z-P230 PATA SSD with ZIF Connector
Figure 2.Front View of the Intel Z-P230 PATA SSD with Mini PCIe Connector
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1.1Key Features
• 4 GB, 8 GB and 16 GB capacity
•ATA UDMA4 support
• ZIF connector or Mini PCIe form factor
•Weight
— ZIF connector: approximately 11 grams
— Mini PCIe form factor: approximately 8 grams
• Less than 1mW idle power (TYP)
•445 mW active power (TYP)
• Uses Intel MLC NAND Flash Memory
• Sequential read: 38 MB/s
• Sequential write: 10 MB/s
• Footprint
— ZIF connector: 38 mm (L) x 54 mm (W) x 3.2 mm (H)
— Mini PCIe form factor: 50.95 mm (L) x 30 mm (W) x 3.8 mm (H)
Intel® Z-P230 PATA SSD
1.2Architecture
The Intel Z-P230 PATA Solid State Drive is a dual-channel PAT A controller driven SSD
available in a ZIF connector or mini PCIe form factor.
The PA TA controller in the Intel® Z-P230 PAT A Solid State Drive uses a microcontrollerbased architecture that enables two flash memory channels to service read and write
operations. See Figure 3, “Functional Block Diagram of Intel Z-P230 PATA Solid State
Drive” on page 7. Capable of performing flash management functions, the SSD also
implements internal wear leveling to minimize system overhead.
Intel Z-P230 PATA Solid State Drives use Intel MD516 NAND Flash Memory multi-level
cell (MLC) thin-small outline package (TSOP) devices in three capacities: 4 GB, 8 GB
and 16 GB. Refer to the Intel MD516 NAND Flash Memory Datasheet for details about
this component. Please see Section 8.0, “Additional Product Information” on page 22
for more information.
Intel MLC NAND uses the industry-standard ONFI NAND flash memory command set
that is capable of program page cache mode, page read cache mode, two plane
commands and interleaved die operations.
Figure 3.Functional Block Diagram of Intel Z-P230 PATA Solid State Drive
2.0Regulatory Compliance
The Intel Z-P230 PATA SSD is compliant with the restriction of Hazardous Substances
(RoHS) directive. It also conforms with standards of CE Mark for European consumer
electronic compliance.
Since the Intel Z-P230 PATA SSD is intended to be contained solely within a personal
computer or similar enclosure (not attached as an external device), the SSD is tested in
representative end-user systems. While the Intel Z-P230 PATA SSD is EMC compliant
(Specification EN55022), computer manufacturers and system integrators should
confirm EMC compliance and provide CE marking for their products.
As a subassembly, no Federal Communications Commission verification or certification
of the device is required. Intel Corporation has tested this devicein enclosures to
ensure that the SSD does comply with the limits for a Class B computing device,
pursuant to Subpart J, Part 15 of the FCC rules.
Table 1.Device Compliance
ComplianceDescription
CE
PB FreeComponents and materials are lead free.
RoHSRestriction of Hazardous Substance Directive
Indicates conformity with the essential health and safety requirements set out in European Directives
Low Voltage Directive and EMC Directive.
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Intel® Z-P230 PATA SSD
3.0Product Specifications
3.1Capacity
Table 2.Capacity and User Addressable Sectors
UnformattedUser Addressable Sector in LBA mode
4 GB*7,880,544
8 GB*15,761,088
16 GB*31,522,176
Note: Formatting and other functions will use some of the space, thus the listed capacity will not be available entirely for data
storage.
3.2Performance
Table 3.Read and Write Performance
OperationAccess TypeMB/second
READSustained Sequential Read Bandwidth38
WRITESustained Sequential Write Bandwidth10
Notes:
1.Queue depth is set to 1.
2.Device measured using IOmeter*.
3.Sampled, not tested.
3.3Operating Conditions
3.3.1Maximum Ratings
Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional oper ation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not guaranteed. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Active Current135 mA (TYP)
Active Idle Current30 mA (TYP)
Idle Current235 uA (TYP)
Active Power445 mW
Idle Power<1 mW
Notes:
1.Using UDMA 4 program mode, calculation based on worst case workload condition.
2.Idle power is measured using active power management.
3.Sampled, not tested.
3.5Environmental Conditions
3.5.1Temperature
Table 7.Temperature Specifications
ModeMinMaxUnit
Ambient Temperature
3.5.2Altitude
Since there are no moving parts, this device is not susceptible to a lack of air molecules
and will operate correctly to 50,000 feet above sea level.
Operating070
Non-Operating085
o
C
o
C
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Intel® Z-P230 PATA SSD
3.5.3Shock and Vibration
Table 8.Shock and Vibration Characteristics
ConditionValue
Non-operating shock600 G/2 mS
Non-operating vibration5-500 Hz; 3.13 G
Operating vibration5-40 Hz; 1.1 G
Notes:
1.Shock specifications assumes that the SSD is mounted securely with the input vibration applied to the drive mounting
screws. Vibration may be applied in the X, Y or Z axis.
2.Vibration specifications assumes that the SSD is mounted securely with the input vibration applied to the drive mounting
screws. Vibration may be applied in the X, Y or Z axis.
3.5.4Acoustics
This drive has no moving or noise-emitting parts; therefore, it produces negligible
sound (0dB) in all modes of operation.
3.5.5Electrostatic Discharge (ESD)
The Intel Z-P230 PA T A SSD can withstand an electrostatic discharge of +/- of 4 KV. ESD
testing is done to demonstrate that the units can withstand discharge encountered in
normal handling or operations of the equipment.
3.6Reliability
Table 9.Reliability Specifications
ParameterValue
Mean Time Between Failure (MTBF)1,000,000 hours
1,2
15
bits read, max
Non-recoverable read errors1 sector per 10
Useful Life3 years
Notes:
1.Based on 60% random workload of 1GB/day on 4GB sku, 2GB/day on 8GB sku and 4GB/day on 16GB sku.
Note: The Mini PCIe form factor does not use the DASP# or PDAIG signals.
5.2Signal Descriptions
Table 12.Signal Symbols and Descriptions
SymbolTypeDescription
CS0#, CS1#Input
DA[0...2]Input
DASP#Input/Output
DIOR#Input
DIOW#Input
DMACK#Input
DMARQOutput
DNUDo Not Use. Must be left unconnected.
DQ[0...15]Input/Output16-bit bidirectional I/O interface.
GNDSupplyGround connection.
INTRQOutputDevice uses the Interrupt Request signal to interrupt the host.
IORDYOutput
NCNot connected.
PDIAG#Input/Output
ReservedReserved for Future Use.
RESET#InputThe host asserts this signal to reset the device.
VCCSupplyPower supply.
The host uses CS0# to select task file registers and CS1# to select alternate
status registers and other device control register.
Device address signals used by the host to access device registers or data
port.
The Device Active/Slave Present signal.
Note: the Mini PCIe form factor does not use this signal.
The I/O Read Enable signal is the strobe signal asserted by the host to read
device registers or the data port.
The I/O Write Enable signal is the strobe signal asserted by the host to write
device registers or the data port.
The host uses the DMA Acknowledge si gnal to acknowledge the receipt of the
DMA Request and that it is ready to initiate DMA transfers.
The DMA Request signal is asserted by the drive when it is ready for data
transfer between it and the host. IORD and IOWR signals are used to control
the direction of data transfer.
The device asserts the I/O Ready signal to tell the host to extend the host
transfer cycle.
The Pass Diagnostic signal is used by the master/sla ve handsh ake p rotocol to
determine if the device has passed diagnostics.
Note: the Mini PCIe form factor does not use this signal.
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Intel® Z-P230 PATA SSD
6.0Command Sets
The Intel® Z-P230 PATA SSD device supports all the mandatory ATA commands as
defined in the ATA/ATAPI-5 specification.
6.1ATA General Feature Command Set
The Intel® Z-P230 PATA SSD device supports the ATA General Feature command set
(non-PACKET).
Multiple command
1 = for a single-channel card
2 = two-channel card
2Number of current logical cylinders. Obsolete.
4Current capacity in sectors. Obsolete
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Intel® Z-P230 PATA SSD
Table 14.Returned Sector Data (Continued)
WordDefault ValueBytesDescription
4 GB: 3F60h, 0078h
60-61
620000h2Obsolete
630007h2Multi-word DMA transfer mode - 2, 1, 0
640003h2Advanced PIO Modes - 4, 3, 2, 1, 0
650078h 2Minimum multi word DMA cycle time per word
660078h 2Recommended multi word DMA cycle time
670078h2Minimum PIO cycle time without flow control
680078h2Minimum PIO cycle time IORDY with flow control
69-790000h22Reserved
800030h2Major version number, ATA-4 and ATA-5 support
810000h2Minor version number, not reported
82700Bh2
835004h2Command set: FLUSH CACHE, CFA feature set
844000h2Command set/feature supported extension
857009h2
861004h2Command set enabled: FLUSH CACHE, CFA feature set
874000h2Command set/feature default.
88203Fh2UDMA mode 4 and below are supported.
89001Eh2Time required for security erase unit completion
90001Eh2Time required for enhanced security erase unit completion
910000h2Current advanced power management value
92FFFEh2Master Password Revision Code
930000h2Hardware reset result
94-1270000h68Reserved
1280029h2Security status
1290003h2Vendor specific
130-1590000h60Reserved
1601000h2CFA Power mode 1 (Disabled)
161-2550000h190Reserved
8 GB: 7EC0h, 00F0h
16 GB: 01E0h, FD80h
4Total number of sectors addressable in LBA mode
Command set: READ BUFFER, WRITE BUFFER, power management feature
set, NOP, SMART, Removable Media feature set
Command set enabled: READ BUFFER, WRITE BUFFER, NOP, power
management feature set, SMART feature set
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6.1.2READ MULTIPLE and WRITE MULTIPLE Command Value
Set the following value when executing READ MULTIPLE (C4h) and WRITE MULTIPLE
(C5h) commands.
Table 15.Set Multiple Commands Parameter
FeatureSector Count Register Value
Set sectors per block to use on all subsequent READ MULTIPLE (C4h) and WRITE
MULTIPLE (C5h) commands.
01h
6.1.3SET FEATURES Subcommands
The following table identifies the subcommands for the SET FEATURES (EFh) command.
Table 16.Subcommands for the SET FEATURES Command
Subcommand NameFeature Register Value
Enable 8-bit data transfer01h
Set transfer mode based on value in 03h
Disable Read Look Ahead55h
Disable Power on Reset (POR) establishment66h
NOP - Accepted69h
Disable 8-bit data transfer81h
NOP - Accepted96h
Accepted for backward compatibility97h
Set host current source capability9Ah
4 bytes of data applied on READ/WRITEBBh
Enable Power on Reset (POR) establishmentCCh
6.1.4SMART Subcommand Set
The SMART RETURN STATUS (DAh) command returns a pass/fail value based on the
current status of the Z-P230 PA TA SSD. The BIOS or system software that interfaces to
SMART should issue this command at boot up and upon resume from a standby or
hibernate c o ndition. If the status returned is PASS, the boot up or resume sequence
should continue as normal. If however the status returned is FAIL, the BIOS or system
software should issue a warning to the end us er that their SSD is approaching it’ s drive
wear-out condition and recommend that the end user back up their SSD.
The following table details the register value for each of the subcommands available
when using the SMART (B0h) command:
This document also references standards and specifications defined by a variety of
organizations. Please use the following information to identify the location of an
organization’s standards information.
Table 19.Standards References
Date or
Revision Number
February 2000ATA-5
January 2007
December 2004
December 2006Open NAND Flash Interface (ONFI) Specification 1.0http://www.onfi.org/docs/ONFI_1_0_Gold.pdf
September 2008Product Manual
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JEDEC Standard: Electrostatic Discharge (ESD)
Sensitivity Testing Human Body Model (HBM)
JEDEC Standard JESD22-C101C: Field-Induced
Charged-Device Model Test Method for ElectrostaticDischarge-Withstand Thresholds of Microelectronic
Components
Note: Customers who request access to Advanced datasheets must have a a non-disclosure agreement (NDA) with Intel. We
release Advanced datasheets prior to Preliminary datasheets, which are released around the time a product is sampled.
Production datasheets become available when the part is mass produced. To obtain a copy of these documents, please
contact your Intel field sales representative.
9.0Glossary
This document incorporates many industry- and device-specific words. Use the
following list to define a variety of terms and acronyms.
Table 21.Glossary of Terms and Acronyms
TermDefinition
ATAAdvanced Technology Attachment
CE
CFACompactFlash Association
CPRMContent Protection for Recordable Media
CRCCyclic Redundancy Check
DDPDual Die Package
DMADirect Memory Access
ECCError Correction Code
EMCElectroMagnetic Compatibility
ESDElectrostatic Discharge
FCCFederal Communications Commission
GB
HDDHard Disk Drive
IDEIntegrated Device Electronics
LBALogical Block Addressing
MB
Mini PCIeMini Peripheral Component Interconnect Express (PCIe)
MLCMulti-Level Cell
MTBFMean Time Between Failure
MWDMAMulti-Word DMA
NOPNo Operation
ODMOriginal Design Manufacturer
The CE conformity marking applies to products regulated by certain European health,
safety and environmental protection legislation.
Giga-byte. Defined as 1x10
formatting and other functions, and therefore, is not available for data storage.
Mega-byte. Defined as 1x10
formatting and other functions, and therefore, is not available for data storage.
9
bytes. Please note that some of the listed cap acity is used for
6
bytes. Please note that some of the listed capacity is used for
Table 21.Glossary of Terms and Acronyms (Continued)
TermDefinition
OEMOriginal Equipment Manufacturer
ONFIOpen NAND Flash Interface
PATAParallel ATA
PIOProgrammable Input / Output
QDPQuad Die Package
SDPSingle Die Package
SSDSolid state drive
UDMAUltra DMA, also know Ultra ATA
ZIFZero Insertion Force
10.0Revision History
DateRevision Description
“Intel Z-P230 PATA SSD Ordering Information” on
“Intel Z-P230 PATA SSD Ordering Information” on
.
September
2008
July 2008002
June 2008001
003
Updated the Decoder and
page 2
Updated
Added footnote to Table 9, “Reliability Specifications” on page 10
Updated mechanical drawing of ZIF module Figure 4, “Intel Z-P230 PATA SSD with ZIF
Connector (Top, Side and Bottom Views)” on page 11
Modified values and content in the following tables:
Updated values and added Mini PCIe data on the front page.
Updated the Decoder and
page 2
Modified
page 6
Added the following sections:
Modified Figure 3, “Functional Block Diagram of Intel Z-P230 PATA Solid State
Drive” on page 7
Added the following tables:
.
Section 6.1.4, “SMART Subcommand Set” on page 20
Table 6, “Power Consumption” on page 9
•
• Table 14, “Returned Sector Data” on page 17
.
Section 1.0, “Overview” on page 5 and Section 1.1, “Key Features” on
.
Section 1.2, “Architecture” on page 6
•
• Section 8.0, “Additional Product Information” on page 22
Table 7, “Temperature Specifications” on page 9
•
• T able 11, “Intel Z-P230 with Mini PCIe Form Factor - 52 Pin Assignments”
on page 14
Added the following figures:
Figure 2, “Front View of the Intel Z-P230 PATA SSD with Mini PCIe
•
Connector” on page 5
• Figure 6, “Intel Z-P230 PATA SSD with Mini PCIe Connector (Top, Side
and Bottom Views)” on page 13
Modified values and content in the following tables:
Table 2, “Capacity and User Addressable S ectors” on page 8
•
• Table 3, “Read and Write Performance” on page 8
• Table 13, “ATA General Feature Commands” on page 16
• Table 14, “Returned Sector Data” on page 17
• Table 21, “Glossary of Terms and Acronyms” on page 22
Initial Release. Earlier information released as Castle Point P A TA Modular Solid State Drive Advance
Datasheet - 319546-002US.
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