Intel SSDMCEAW120A4 User Manual

Intel® Solid-State Drive 530 Series (2.5-inch)

 Capacities:

80GB, 120GB, 180GB, 240GB, 360GB, 480GB

Components:

 Intel

20 nm NAND Flash Memory

 Multi-Level Cell (MLC)

Form Factors: 2.5-inch

Thickness: 7 mm

Weight: Up to 78 grams  SATA 6Gb/s Bandwidth Performance

(IOMeter* Queue Depth 32)

 Sustained Sequential Read: up to 540 MB/s  Sustained Sequential Write: up to 490 MB/s

 Read and Write IOPS

(IOMeter Queue Depth 32)

 Random 4 KB Reads: up to 41,000 IOPS  Random 4 KB Writes: up to 80,000 IOPS

Latency (average sequential)

 Read: 80 µs (TYP)  Write: 85 µs (TYP)

Data Compression

AES 256-bit Encryption

End-to-End Data Protection

Compatibility

 Intel

SSD Toolbox with Intel® SSD Optimizer

 Intel

Data Migration Software

 Intel

Rapid Storage Technology

 SATA Revision 3.0  ACS-2 (ATA/ATAPI Command Set 2)  SSD Enhanced SMART ATA feature set

Power Management

 5.0 V SATA Supply Rail  SATA Link Power Management (LPM)  Device Sleep (DevSleep)

Power

 Active (BAPCo MobileMark* 2007 Workload):

195 mW

 Idle

: 125 mW

 DevSleep: 5 mW

Temperature

 Operating

: 0o C to 70o C

 Non-Operating: -55

C to 95o C

Reliability

— Uncorrectable Bit Error Rate (UBER):

<1 sector per 1016 bits read

— Mean Time Between Failure (MTBF): 1,200,000

hours

— Shock (operating and non-operating): 1,500

G/0.5 msec

Vibration

— Operating: 2.17 G

RMS

(5-700 Hz)

— Non-operating: 3.13 G

RMS

(5-800 Hz)

Certifications and Declarations:

 UL*  CE*  C-Tick*  BSMI*  KCC*  Microsoft* WHCK  VCCI*  SATA-IO*

Product Ecological Compliance

 RoHS*

Intel® Solid-State Drive 530 Series (2.5-inch)

Product Specification

NOTES:

1. Performance values vary by capacity.

2. Random 4 KB writes measured using out-of-box SSD.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for

Order Number: 329212-004US

maintaining proper device operating temperatures on heavier workloads.

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel® Solid-State Drive 530 Series (2.5-inch)

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.html

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Product Specification April 2015 2 329212-004US

Intel® Solid-State Drive 530 Series (2.5-inch)

Contents

Revision History ............................................................................................................................................................................ 4

1 Introduction ................................................................................................................................................................... 5

1.1 Terminology ................................................................................................................................................................................................... 6

1.2 Reference Documents ............................................................................................................................................................................... 7

2 Product Specifications ................................................................................................................................................. 8

2.1 Capacity ........................................................................................................................................................................................................... 8

2.2 Performance .................................................................................................................................................................................................. 8

2.3 Electrical Characteristics .......................................................................................................................................................................... 9

2.4 Environmental Conditions ................................................................................................................................................................... 10

2.4.1 Temperature, Shock, Vibration .................................................................................................................................... 10

2.4.2 Altitude .................................................................................................................................................................................... 10

2.5 Product Regulatory Compliance ....................................................................................................................................................... 11

2.6 Reliability ...................................................................................................................................................................................................... 12

2.7 Hot Plug Support ...................................................................................................................................................................................... 12

3 Mechanical Information ............................................................................................................................................. 13

4 Pin and Signal Descriptions ...................................................................................................................................... 14

4.1 Pin Locations .............................................................................................................................................................................................. 14

4.2 Signal Descriptions .................................................................................................................................................................................. 14

4.2.1 Connector Pin Signal Definitions ................................................................................................................................ 14

4.2.2 Power Pin Signal Definitions ......................................................................................................................................... 15

4.3 Device Sleep Feature .............................................................................................................................................................................. 15

5 Supported Command Sets ........................................................................................................................................ 16

5.1 ATA General Feature Command Set................................................................................................................................................ 16

5.2 Power Management ................................................................................................................................................................................ 17

5.3 Security Mode Feature Set ................................................................................................................................................................... 17

5.4 SMART Command Set ............................................................................................................................................................................ 18

5.4.1 SMART Attributes ............................................................................................................................................................... 18

5.4.2 SMART Logs .......................................................................................................................................................................... 21

5.5 Device Statistics ........................................................................................................................................................................................ 21

5.6 SMART Command Transport .............................................................................................................................................................. 22

5.7 Data Set Management Command Set ............................................................................................................................................. 22

5.8 Host Protected Area Command Set ................................................................................................................................................. 22

5.9 48-Bit Address Command Set ............................................................................................................................................................ 22

5.10 General Purpose Log Command Set ............................................................................................................................................... 22

5.11 Native Command Queuing ................................................................................................................................................................... 23

5.12 Software Settings Preservation ......................................................................................................................................................... 23

5.13 SATA Link Power Management (LPM) ............................................................................................................................................ 23

6 Certifications and Declarations ................................................................................................................................ 24

7 Appendix....................................................................................................................................................................... 25

April 2015 Product Specification 329212-004US 3

Revision History

Revision

Number

Description

Revision Date

001

Initial release

July 2013

002

Added 120GB capacity

September 2013

003

Added 80GB, 360GB, and 480GB capacities

October 2013

004

Adjusted 360GB and 480GB performance numbers

April 2015

Intel® Solid-State Drive 530 Series (2.5-inch)

Product Specification April 2015 4 329212-004US

Intel® Solid-State Drive 530 Series (2.5-inch)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD 530 Series).

The Intel SSD 530 Series delivers the next generation storage solution with new low power features designed for Ultrabook™. The next generation Intel SSD continues to provide high performance expected for Serial Advanced Technology Attachment (SATA)-based computers.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and ruggedness offered by an SSD.

The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the DevSleep pin. The drive will consume a mere 5 mW while in this state.

As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:

 High I/O and throughput performance  Low power consumption  Increased system responsiveness  High reliability  Enhanced ruggedness

The Intel SSD 530 Series also offers additional key features such as:

 Advanced Encryption Standard (AES) 256-bit Encryption AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for

encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with an ATA drive password—helps protect user data.

 End-to-End Data Protection End-to-end data protection helps protect data from being corrupted across the data path by using cyclic

redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.

 Data Compression Data compression helps improve performance and endurance by automatically compressing information sent to

the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be compressed depends on the type of data.

April 2015 Product Specification 329212-004US 5

1.1 Terminology

Term

Description

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DevSleep

Device Sleep, a new addition to the SATA specification

DIPM

Device Initiated Power Management

DMA

Direct Memory Access

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

HDD

Hard Disk Drive

HIPM

Host Initiated Power Management

I/O

Input/Output

IOPS

Input/Output Operations Per Second

Kilobyte (1,024 bytes)

LBA

Logical Block Address

LPM

Link Power Management

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

PIO

Programmed Input/Output

RDT

Reliability Demonstration Test

RMS

Root Mean Squared

SATA

Serial Advanced Technology Attachment

SMART

Self-Monitoring, Analysis and Reporting Technology

SSD

Solid-State Drive

TYP

Typical

UBER

Uncorrectable Bit Error Rate

Table 1: Terminology

Intel® Solid-State Drive 530 Series (2.5-inch)

Product Specification April 2015 6 329212-004US

Date or Rev. #

Title

Location

May 2005

SFF-8201, 2.5-inch drive form factor

http://www.sffcommittee.org/

May 2006

SFF-8223, 2.5-inch Drive w/Serial Attachment Connector

http://www.sffcommittee.org/

Sept 2008

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of measurement CISPR22:2008 (Modified)

http://www.iec.ch/ Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/ Click Search MDDS Database and search for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

August 2009

ACS-2 Specification

http://www.t13.org/

August 2010

IEC 55024 Information Technology Equipment — Immunity characteristics— Limits and methods of measurement CISPR24:2010

http://www.iec.ch/ Sept 2010

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

Intel® Solid-State Drive 530 Series (2.5-inch)

1.2 Reference Documents

Table 2: Standard References

April 2015 Product Specification 329212-004US 7

Intel® Solid-State Drive 530 Series (2.5-inch)

Capacity

Unformatted Capacity (Total User Addressable Sectors in LBA mode)

80GB

156,301,488

120GB

234,441,648

180GB

351,651,888

240GB

468,862,128

360GB

703,282,608

480GB

937,703,088

Capacity

Specification

Random

4 KB Read

(up to)1

Random

4 KB Write

(up to)2

Random

4 KB Write

(TYP)1

Sequential

128 KB Read1

Sequential

128 KB Write1

IOPS

MB/s

80GB

24,000

80,000

33,000

540

480

120GB

24,000

80,000

37,500

540

480

180GB

41,000

80,000

49,000

540

490

240GB

41,000

80,000

49,000

540

490

360GB

45,000

33,000

29,500

540

490

480GB

48,000

37,000

31,000

540

490

Capacity

Specification

Random

4 KB Read

(up to)1

Random

4 KB Write

(up to)1

Sequential

128 KB Read1

Sequential

128 KB Write1

IOPS

MB/s

80GB

20,500

13,000

430

100

120GB

18,000

15,000

450

130

180GB

37,500

17,000

470

170

240GB

37,500

23,000

510

230

360GB

37,500

10,000

525

240

480GB

37,500

13,000

540

300

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

2.2 Performance

Table 4: Compressible Performance

NOTES:

1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on 8 GB of Logical

Block Address (LBA) range on a full SSD

2. Random 4 KB writes measured using out-of-box SSD.

Table 5: Incompressible Performance

Note:

Performance measured by Intel using IOMeter* with Queue Depth 32

Product Specification April 2015 8 329212-004US

Specification

Intel® SSD 530 Series

80GB

120GB

180GB

240GB

360GB

480GB

80 µs (TYP) 85 µs (TYP)

1 s (TYP)

Write1

Power On To Ready2

Electrical Characteristics

Value

80GB

120GB

180GB

240GB

360GB

480GB

Operating Voltage for 5 V (±5%) Min Max Rise Time (Max/Min) Fall Time (Max/Min) Noise Tolerance Min Off Time1

4.75 V

5.25 V

100 ms / 0.1 ms

5 s / 1 ms

100 mV pp (10 Hz – 30 MHz)

1 s

Power Consumption (TYP) Active2 Idle3 DevSleep4

195 mW 125 mW

5 mW

Thermal Power5

2.8 W

3.1 W

3.7 W

4.5 W

Regulator Power6

3.4 W

4.0 W

4.9 W

5.0 W

Intel® Solid-State Drive 530 Series (2.5-inch)

Table 6: Latency

NOTES:

1. Based on sequential 4 KB using IOMeter with Queue Depth 1 workload with compressible (non-random) data

pattern. Write Cache enabled.

2. Power On To Ready time assumes proper shutdown

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

NOTES:

1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

1. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

2. Power consumption during DevSleep state.

3. Power measured during 128 KB sequential writes with Queue Depth 32 workload using 100 ms sample period. This

4. Power measured during 128 KB sequential writes with Queue Depth 32 workload using 500 µs sample period. This

April 2015 Product Specification 329212-004US 9

represents power that would be thermal load on system during heavy workloads.

represents power that system power supply would have to regulate for proper device operation.

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